Artículos de revistas sobre el tema "Flash Interface"
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Myramuru, Shanmukha Sai Nikhil, Dr S. Chandra Mohan Reddy y Dr Gannera Mamatha. "Design and Integration of NAND Flash Memory Controller for Open Power-based Fabless SoC". International Journal of Engineering and Advanced Technology 12, n.º 2 (30 de diciembre de 2022): 137–44. http://dx.doi.org/10.35940/ijeat.d3470.1212222.
Texto completoLiu, Hai Ke, Shun Wang, Xin Gna Kang y Jin Liang Wang. "Realization of NAND FLASH Control Glueless Interface Circuit". Advanced Materials Research 1008-1009 (agosto de 2014): 659–62. http://dx.doi.org/10.4028/www.scientific.net/amr.1008-1009.659.
Texto completoVonBergen, Wade y Madhu Basude. "A High Temp standalone 4MByte Flash memory with SPI Interface for 210C applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, HITEC (1 de enero de 2012): 000066–71. http://dx.doi.org/10.4071/hitec-2012-tp11.
Texto completoQiu, Yan Zhang, Liang Guo y Sheng Hui Liu. "The Design of Embedded Multi-Channel Data Acquisition System". Applied Mechanics and Materials 182-183 (junio de 2012): 660–64. http://dx.doi.org/10.4028/www.scientific.net/amm.182-183.660.
Texto completoLiu, Gen Xian y Dong Sheng Wang. "Low Cost Wear Leveling for High-Density SPI NAND Flash in Memory Constrained Embedded System". Applied Mechanics and Materials 427-429 (septiembre de 2013): 1277–80. http://dx.doi.org/10.4028/www.scientific.net/amm.427-429.1277.
Texto completoZhao, Yixuan, Tongshun Liu, Qingjie Ji, Haifeng Yang y Hongyun Zhao. "Study on the Microstructure and Properties of Flash-Butt Welding Joints of High Nitrogen Steel". Metals 13, n.º 7 (28 de junio de 2023): 1200. http://dx.doi.org/10.3390/met13071200.
Texto completoShen, Lin, Gang Du, Ya Hui Hou y Na Na Zhang. "Study on the Storage of Chinese Character Font Library and Graphics Library on SPI Flash Chip". Applied Mechanics and Materials 423-426 (septiembre de 2013): 2763–66. http://dx.doi.org/10.4028/www.scientific.net/amm.423-426.2763.
Texto completoPark, Jong-Hyeok, Soyee Choi, Gihwan Oh y Sang-Won Lee. "Gather Interface for Freezing Pages in Flash Storage". IEEE Access 9 (2021): 102542–48. http://dx.doi.org/10.1109/access.2021.3097386.
Texto completoPark, Jonghyeok, Soyee Choi, Gihwan Oh, Soojun Im, Moon-Wook Oh y Sang-Won Lee. "FlashAlloc: Dedicating Flash Blocks by Objects". Proceedings of the VLDB Endowment 16, n.º 11 (julio de 2023): 3266–78. http://dx.doi.org/10.14778/3611479.3611524.
Texto completoHung, Ji Jun, Kai Bu, Zhao Lin Sun, Jie Tao Diao y Jian Bin Liu. "PCI Express-Based NVMe Solid State Disk". Applied Mechanics and Materials 464 (noviembre de 2013): 365–68. http://dx.doi.org/10.4028/www.scientific.net/amm.464.365.
Texto completoZhang, Zhi Xian y Yuan Yao. "Platform Flash XCFP PROMs Updating Using JTAG Boundary-Scan". Advanced Materials Research 433-440 (enero de 2012): 4423–27. http://dx.doi.org/10.4028/www.scientific.net/amr.433-440.4423.
Texto completoZHANG, D. H., S. W. LOH, C. Y. LI, P. D. FOO y JOSEPH XIE. "SURFACE AND STRUCTURAL PROPERTIES OF COPPER FILMS DEPOSITED BY METAL ORGANIC CHEMICAL VAPOR DEPOSITION FOR Si TECHNOLOGY". Surface Review and Letters 08, n.º 05 (octubre de 2001): 533–36. http://dx.doi.org/10.1142/s0218625x01001269.
Texto completoLeo, H.-L. y G. B. Sinclair. "Flash Temperature Distributions at the Head-Disk Interface in Hard Disk Drives". Journal of Tribology 120, n.º 3 (1 de julio de 1998): 536–41. http://dx.doi.org/10.1115/1.2834583.
Texto completoSuzuki, S. y F. E. Kennedy. "The Detection of Flash Temperatures in a Sliding Contact by the Method of Tribo-Induced Thermoluminescence". Journal of Tribology 113, n.º 1 (1 de enero de 1991): 120–27. http://dx.doi.org/10.1115/1.2920576.
Texto completoYang, Seung Dong, Ho Jin Yun, Kwang Seok Jeong, Yu Mi Kim, Sang Youl Lee, Jae Sub Oh, Hi Deok Lee y Ga Won Lee. "The analysis of 3-Level Charge Pumping in SOHOS Flash Memory". Advanced Materials Research 658 (enero de 2013): 658–61. http://dx.doi.org/10.4028/www.scientific.net/amr.658.658.
Texto completoPoudel, Prawar, Biswajit Ray y Aleksandar Milenkovic. "Microcontroller Fingerprinting Using Partially Erased NOR Flash Memory Cells". ACM Transactions on Embedded Computing Systems 20, n.º 3 (abril de 2021): 1–23. http://dx.doi.org/10.1145/3448271.
Texto completoBu, Wen De y Jin He Liu. "The Coupled Thermal Mechanical Modeling of the Inertia Friction Welding Process for Inconel718". Materials Science Forum 704-705 (diciembre de 2011): 710–16. http://dx.doi.org/10.4028/www.scientific.net/msf.704-705.710.
Texto completoTong, Shi Hua. "Design and Realization of Wireless Smart Home Indoor Terminal". Advanced Materials Research 482-484 (febrero de 2012): 970–74. http://dx.doi.org/10.4028/www.scientific.net/amr.482-484.970.
Texto completoMartinaitis, Steven M., Jonathan J. Gourley, Zachary L. Flamig, Elizabeth M. Argyle, Robert A. Clark, Ami Arthur, Brandon R. Smith, Jessica M. Erlingis, Sarah Perfater y Benjamin Albright. "The HMT Multi-Radar Multi-Sensor Hydro Experiment". Bulletin of the American Meteorological Society 98, n.º 2 (1 de febrero de 2017): 347–59. http://dx.doi.org/10.1175/bams-d-15-00283.1.
Texto completoRahaman, Mohammad Lutfar y Liangchi Zhang. "Interface temperature during contact sliding of two solids: Relationship between predicted flash temperature and the experimentally measured". Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 231, n.º 1 (5 de agosto de 2016): 3–13. http://dx.doi.org/10.1177/1350650116644353.
Texto completoAn, Mijin, Soojun Im, Dawoon Jung y Sang-Won Lee. "Your read is our priority in flash storage". Proceedings of the VLDB Endowment 15, n.º 9 (mayo de 2022): 1911–23. http://dx.doi.org/10.14778/3538598.3538612.
Texto completoOkazaki, Takahiro, Zensaku Kawara, Takehiko Yokomine y Tomoaki Kunugi. "Enhancement of MSF Using Microbubbles". International Journal of Chemical Reactor Engineering 13, n.º 4 (1 de diciembre de 2015): 469–75. http://dx.doi.org/10.1515/ijcre-2014-0169.
Texto completoMilroy, J., S. Hinduja y K. Davey. "Modelling the pressure die casting process with the boundary element method: Die deformation model for flash prevention". Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 212, n.º 3 (1 de marzo de 1998): 197–215. http://dx.doi.org/10.1243/0954406981521150.
Texto completoGraewingholt, Megan D. "American Underworld: The Flash Press". Charleston Advisor 21, n.º 3 (1 de enero de 2020): 11–14. http://dx.doi.org/10.5260/chara.21.3.11.
Texto completoLintern, Gavan. "An Interactive Planning Prototype for Task Force Air Defense". Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, n.º 6 (octubre de 2007): 499–500. http://dx.doi.org/10.1177/154193120705100602.
Texto completoMa, Jian Hui, Zhi Xue Wang, Gang Wang, Yuan Yang Liu y Yan Qiang Li. "A Research and Implement of Data Storage and Management Method Based on the Embedded MCU Data Flash". Advanced Materials Research 756-759 (septiembre de 2013): 1984–88. http://dx.doi.org/10.4028/www.scientific.net/amr.756-759.1984.
Texto completoPanknin, D., J. Stoemenos, M. Eickhoff, V. Heera, N. Vouroutzis, G. Krötz y Wolfgang Skorupa. "Improvement of the 3C-SiC/Si Interface by Flash Lamp Annealing". Materials Science Forum 353-356 (enero de 2001): 151–54. http://dx.doi.org/10.4028/www.scientific.net/msf.353-356.151.
Texto completoMatsushima, A., N. Kobayashi, Y. Mochizuki, M. Ishii, S. Kawaguchi, T. A. Endo, R. Umetsu, Y. Makita y T. Toyoda. "OmicBrowse: a Flash-based high-performance graphics interface for genomic resources". Nucleic Acids Research 37, Web Server (15 de junio de 2009): W57—W62. http://dx.doi.org/10.1093/nar/gkp404.
Texto completoLi, Jiebo, Zhen Chi, Ruzhan Qin, Li Yan, Xubo Lin, Mingjun Hu, Guangcun Shan, Hailong Chen y Yu-Xiang Weng. "Hydrogen Bond Interaction Promotes Flash Energy Transport at MXene-Solvent Interface". Journal of Physical Chemistry C 124, n.º 19 (21 de abril de 2020): 10306–14. http://dx.doi.org/10.1021/acs.jpcc.0c01039.
Texto completoRomo-Hernandez, Aarón, Nicolas Hudon, B. Erik Ydstie y Denis Dochain. "A non-equilibrium approach to model flash dynamics with interface transport". Journal of Process Control 80 (agosto de 2019): 211–22. http://dx.doi.org/10.1016/j.jprocont.2019.04.012.
Texto completoLee, Po-Lei, Jen-Chuen Hsieh, Chi-Hsun Wu, Kuo-Kai Shyu y Yu-Te Wu. "Brain computer interface using flash onset and offset visual evoked potentials". Clinical Neurophysiology 119, n.º 3 (marzo de 2008): 605–16. http://dx.doi.org/10.1016/j.clinph.2007.11.013.
Texto completoRomo-Hernandez, Aarón, Denis Dochain, B. Erik Ydstie y Nicolas Hudon. "A Non-equilibrium Approach to Model Flash Dynamics with Interface Transport". IFAC-PapersOnLine 51, n.º 18 (2018): 874–79. http://dx.doi.org/10.1016/j.ifacol.2018.09.239.
Texto completoR, Selvaraj, Bhuvaneshwari S, Devadharshini M, Divyapriya K y Jaya Santhiya J. "Information Flash Board using IoT". March 2023 5, n.º 1 (marzo de 2023): 53–61. http://dx.doi.org/10.36548/jitdw.2023.1.004.
Texto completoHou, Zhen-Bing y R. Komanduri. "Magnetic Field Assisted Finishing of Ceramics—Part II: On the Thermal Aspects of Magnetic Float Polishing (MFP) of Ceramic Balls". Journal of Tribology 120, n.º 4 (1 de octubre de 1998): 652–59. http://dx.doi.org/10.1115/1.2833762.
Texto completoTian, Xuefeng y Francis E. Kennedy. "Maximum and Average Flash Temperatures in Sliding Contacts". Journal of Tribology 116, n.º 1 (1 de enero de 1994): 167–74. http://dx.doi.org/10.1115/1.2927035.
Texto completoThai, Hong-Hai, Cong-Kha Pham y Duc-Hung Le. "Design of a Low-Power and Low-Area 8-Bit Flash ADC Using a Double-Tail Comparator on 180 nm CMOS Process". Sensors 23, n.º 1 (21 de diciembre de 2022): 76. http://dx.doi.org/10.3390/s23010076.
Texto completoStowers, Kimberly, Nicholas Kasdaglis, Olivia Newton, Shan Lakhmani, Ryan Wohleber y Jessie Chen. "Intelligent Agent Transparency". Proceedings of the Human Factors and Ergonomics Society Annual Meeting 60, n.º 1 (septiembre de 2016): 1706–10. http://dx.doi.org/10.1177/1541931213601392.
Texto completoWang, Hong Liang, Hai Rui Wang y Hai Fei Ding. "Design of Data Acquisition and Storage System for Digital and Analog Signal Based on FPGA". Advanced Materials Research 605-607 (diciembre de 2012): 955–59. http://dx.doi.org/10.4028/www.scientific.net/amr.605-607.955.
Texto completoYan, Chin-Rung, Jone F. Chen, Ya-Jui Lee, Yu-Jie Liao, Chung-Yi Lin, Chih-Yuan Chen, Yin-Chia Lin y Huei-Haurng Chen. "Extraction and Analysis of Interface States in 50-nm nand Flash Devices". IEEE Transactions on Electron Devices 60, n.º 3 (marzo de 2013): 992–97. http://dx.doi.org/10.1109/ted.2013.2240458.
Texto completoLi, Jiebo, Qi Zhang, Li Yan, Guorong Wu, Mingjun Hu, Xubo Lin, Kaijun Yuan y Xueming Yang. "Ultrafast Flash Energy Conductance at MXene‐Surfactant Interface and Its Molecular Origins". Advanced Materials Interfaces 6, n.º 23 (14 de octubre de 2019): 1901461. http://dx.doi.org/10.1002/admi.201901461.
Texto completoKim, Geukchan, Hyejin Kim y Sunghoon Chun. "A New Package for High Speed and High Density eStorage Using the Frequency Boosting Chip". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000220–24. http://dx.doi.org/10.4071/isom-2015-wa22.
Texto completoWeng, Yu-Xiang, Hong Xiao, Kwok-Chu Chan y Chi-Ming Che. "Direct Observation of Mass Transfer at Solid−Liquid Interface by Laser Flash Photolysis of the Interface Probe Molecules". Journal of Physical Chemistry B 104, n.º 32 (agosto de 2000): 7713–24. http://dx.doi.org/10.1021/jp001071n.
Texto completoBhushan, B. "Magnetic Head-Media Interface Temperatures: Part 1—Analysis". Journal of Tribology 109, n.º 2 (1 de abril de 1987): 243–51. http://dx.doi.org/10.1115/1.3261346.
Texto completoKim, Julia, Georgios Kanavakis, Matthew D. Finkelman y Moonyoung Lee. "Microleakage under ceramic flash-free orthodontic brackets after thermal cycling". Angle Orthodontist 86, n.º 6 (16 de mayo de 2016): 905–8. http://dx.doi.org/10.2319/021016-115.1.
Texto completoFerro, Gabriel, D. Panknin, Efstathios K. Polychroniadis, Yves Monteil, Wolfgang Skorupa y J. Stoemenos. "Microstructural Characterization of 3C-SiC Thin Films Grown by Flash Lamp Induced Liquid Phase Epitaxy". Materials Science Forum 483-485 (mayo de 2005): 295–98. http://dx.doi.org/10.4028/www.scientific.net/msf.483-485.295.
Texto completoKuroda, Toshio, Kenji Ikeuchi, Masahiro Shimada, Akihisa Inoue y Hisamichi Kimura. "Micro Flash Welding of Super Duplex Stainless Steel with Zr Metallic Glass Insert". Materials Science Forum 580-582 (junio de 2008): 53–56. http://dx.doi.org/10.4028/www.scientific.net/msf.580-582.53.
Texto completoMissimer, Katherine, Manos Athanassoulis y Richard West. "Telomere: Real-Time NAND Flash Storage". ACM Transactions on Embedded Computing Systems 21, n.º 1 (31 de enero de 2022): 1–24. http://dx.doi.org/10.1145/3479157.
Texto completoGiraud, Thierry, Fabien Dobias, José Gabadinho, Vicente Rey-Bakaikoa, Didier Nurizzo, Gordon A. Leonard y Christoph Mueller-Dieckmann. "An inexpensive automatically operated device for the flash annealing of crystals of macromolecules". Journal of Applied Crystallography 42, n.º 1 (13 de diciembre de 2008): 125–28. http://dx.doi.org/10.1107/s0021889808040958.
Texto completoPakam, Subraelu, Alaa Ahmed, Abdel Azim Ebraheem, Mohsen Sherif, Shaher Bano Mirza, Fouad Lamghari Ridouane y Ahmed Sefelnasr. "Risk Assessment and Mapping of Flash Flood Vulnerable Zones in Arid Region, Fujairah City, UAE-Using Remote Sensing and GIS-Based Analysis". Water 15, n.º 15 (2 de agosto de 2023): 2802. http://dx.doi.org/10.3390/w15152802.
Texto completoStegmüller, Michael JR, Richard J. Grant y Paul Schindele. "Improvements in the process efficiency and bond strength when friction surfacing stainless steel onto aluminium substrates". Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 233, n.º 4 (21 de abril de 2017): 687–98. http://dx.doi.org/10.1177/1464420717701494.
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