Artículos de revistas sobre el tema "Etching"
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Çakır, Orhan. "Study of Etch Rate and Surface Roughness in Chemical Etching of Stainless Steel". Key Engineering Materials 364-366 (diciembre de 2007): 837–42. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.837.
Chabanon, Angélique, Alexandre Michau, Michel Léon Schlegel, Deniz C. Gündüz, Beatriz Puga, Frédéric Miserque, Frédéric Schuster et al. "Surface Modification of 304L Stainless Steel and Interface Engineering by HiPIMS Pre-Treatment". Coatings 12, n.º 6 (25 de mayo de 2022): 727. http://dx.doi.org/10.3390/coatings12060727.
Hvozdiyevskyi, Ye Ye, R. O. Denysyuk, V. M. Tomashyk, G. P. Malanych, Z. F. Tomashyk Tomashyk y A. A. Korchovyi. "Chemical-mechanical polishing of CdTe and based on its solid solutions single crystals using HNO3 + НІ + ethylene glycol iodine-emerging solutions". Chernivtsi University Scientific Herald. Chemistry, n.º 819 (2019): 45–49. http://dx.doi.org/10.31861/chem-2019-819-07.
Li, Hao, Yong You Geng y Yi Qun Wu. "Selective Wet Etching Characteristics of Aginsbte Phase Change Film with Ammonium Sulfide Solution". Advanced Materials Research 529 (junio de 2012): 388–93. http://dx.doi.org/10.4028/www.scientific.net/amr.529.388.
Pashchenko, G. A., M. J. Kravetsky y O. V. Fomin. "Singularities of Polishing Substrates GaAs by Chemo-Dynamical and Non-Contact Chemo-Mechanical Methods". Фізика і хімія твердого тіла 16, n.º 3 (15 de septiembre de 2015): 560–64. http://dx.doi.org/10.15330/pcss.16.3.560-564.
Alias, Ezzah Azimah, Muhammad Esmed Alif Samsudin, Steven DenBaars, James Speck, Shuji Nakamura y Norzaini Zainal. "N-face GaN substrate roughening for improved performance GaN-on-GaN LED". Microelectronics International 38, n.º 3 (23 de agosto de 2021): 93–98. http://dx.doi.org/10.1108/mi-02-2021-0011.
Misal, Nitin D. y Mudigonda Sadaiah. "Investigation on Surface Roughness of Inconel 718 in Photochemical Machining". Advances in Materials Science and Engineering 2017 (2017): 1–9. http://dx.doi.org/10.1155/2017/3247873.
Zunic, Zora, Predrag Ujic, Igor Celikovic y Kenzo Fujimoto. "ECE laboratory in the Vinca institute: Its basic characteristics and fundamentals of electrochemic etching on polycarbonate". Nuclear Technology and Radiation Protection 18, n.º 2 (2003): 57–60. http://dx.doi.org/10.2298/ntrp0302057z.
Tellier, C. R., T. G. Leblois y A. Charbonnieras. "Chemical Etching of {hk0} Silicon Plates in EDP Part I: Experiments and Comparison with TMAH". Active and Passive Electronic Components 23, n.º 1 (2000): 37–51. http://dx.doi.org/10.1155/apec.23.37.
Park, Tae Gun, Jong Won Han y Sang Woo Lim. "Selective Si<sub>3</sub>N<sub>4</sub> Etching for 3D NAND Integration by Using Low Concentration of H<sub>3</sub>PO<sub>4</sub>". Solid State Phenomena 346 (14 de agosto de 2023): 137–42. http://dx.doi.org/10.4028/p-0pjfvo.
Wang, Qi, Kehong Zhou, Shuai Zhao, Wen Yang, Hongsheng Zhang, Wensheng Yan, Yi Huang y Guodong Yuan. "Metal-Assisted Chemical Etching for Anisotropic Deep Trenching of GaN Array". Nanomaterials 11, n.º 12 (24 de noviembre de 2021): 3179. http://dx.doi.org/10.3390/nano11123179.
Liu, Zhuang, Lin Zhu, Jing Lin y Zhi Hui Sun. "Study of Super Hydrophobic Films on Pre-Sensitized Plate Aluminium Substrate". Applied Mechanics and Materials 200 (octubre de 2012): 427–29. http://dx.doi.org/10.4028/www.scientific.net/amm.200.427.
Ambrož, O., J. Čermák, P. Jozefovič y Š. Mikmeková. "Automated color etching of aluminum alloys". Practical Metallography 59, n.º 8-9 (1 de agosto de 2022): 459–74. http://dx.doi.org/10.1515/pm-2022-1014.
Ambrož, O., J. Čermák, P. Jozefovič y Š. Mikmeková. "Effects of etchant stirring on the surface quality of the metallography sample". Journal of Physics: Conference Series 2572, n.º 1 (1 de agosto de 2023): 012011. http://dx.doi.org/10.1088/1742-6596/2572/1/012011.
Kim, Dong Hyeon, Chanwoo Lee, Byeong Geun Jeong, Sung Hyuk Kim y Mun Seok Jeong. "Fabrication of highly uniform nanoprobe via the automated process for tip-enhanced Raman spectroscopy". Nanophotonics 9, n.º 9 (17 de junio de 2020): 2989–96. http://dx.doi.org/10.1515/nanoph-2020-0210.
Ting, Huey Tze, Khaled A. Abou-El-Hossein y Han Bing Chua. "Etch Rate and Dimensional Accuracy of Machinable Glass Ceramics in Chemical Etching". Advances in Science and Technology 65 (octubre de 2010): 251–56. http://dx.doi.org/10.4028/www.scientific.net/ast.65.251.
Hao, Yuhua y Xia Wang. "Effects of the Photoelectrochemical Etching in Hydrogen Fluride (HF) on the Optoelectrical Properties of Ga2O3". Journal of Physics: Conference Series 2112, n.º 1 (1 de noviembre de 2021): 012006. http://dx.doi.org/10.1088/1742-6596/2112/1/012006.
Yusoh, Siti Noorhaniah y Khatijah Aisha Yaacob. "Effect of tetramethylammonium hydroxide/isopropyl alcohol wet etching on geometry and surface roughness of silicon nanowires fabricated by AFM lithography". Beilstein Journal of Nanotechnology 7 (17 de octubre de 2016): 1461–70. http://dx.doi.org/10.3762/bjnano.7.138.
Yao, Yong Zhao, Yukari Ishikawa, Yoshihiro Sugawara, Hiroaki Saitoh, Katsunori Danno, Hiroshi Suzuki, Yoichiro Kawai y Noriyoshi Shibata. "Dislocation Revelation in Highly Doped N-Type 4H-SiC by Molten KOH Etching with Na2O2 Additive". Materials Science Forum 679-680 (marzo de 2011): 290–93. http://dx.doi.org/10.4028/www.scientific.net/msf.679-680.290.
Son, Chang Jin, Taeh Yeon Kim, Tae Gun Park y Sang Woo Lim. "Is Highly Selective Si3N4/SiO2 Etching Feasible without Phosphoric Acid?" Solid State Phenomena 282 (agosto de 2018): 147–51. http://dx.doi.org/10.4028/www.scientific.net/ssp.282.147.
Ueda, Dai, Yousuke Hanawa, Hiroaki Kitagawa, Naozumi Fujiwara, Masayuki Otsuji, Hiroaki Takahashi y Kazuhiro Fukami. "Effect of Hydrophobicity and Surface Potential of Silicon on SiO2 Etching in Nanometer-Sized Narrow Spaces". Solid State Phenomena 314 (febrero de 2021): 155–60. http://dx.doi.org/10.4028/www.scientific.net/ssp.314.155.
Fang, Jinyang, Qingke Zhang, Xinli Zhang, Feng Liu, Chaofeng Li, Lijing Yang, Cheng Xu y Zhenlun Song. "Influence of Etchants on Etched Surfaces of High-Strength and High-Conductivity Cu Alloy of Different Processing States". Materials 17, n.º 9 (24 de abril de 2024): 1966. http://dx.doi.org/10.3390/ma17091966.
Amirabadi, Hossein y M. Rakhshkhorshid. "An Analytical Model for Chemical Etching in One Dimensional Space". Advanced Materials Research 445 (enero de 2012): 167–70. http://dx.doi.org/10.4028/www.scientific.net/amr.445.167.
Li, Liyi, Colin M. Holmes, Jinho Hah, Owen J. Hildreth y Ching P. Wong. "Uniform Metal-assisted Chemical Etching and the Stability of Catalysts". MRS Proceedings 1801 (2015): 1–8. http://dx.doi.org/10.1557/opl.2015.574.
Rahim, Rosminazuin A., Badariah Bais y Majlis Burhanuddin Yeop. "Simple Microcantilever Release Process of Silicon Piezoresistive Microcantilever Sensor Using Wet Etching". Applied Mechanics and Materials 660 (octubre de 2014): 894–98. http://dx.doi.org/10.4028/www.scientific.net/amm.660.894.
Tu, Wei-Hsiang, Wen-Chang Chu, Chih-Kung Lee, Pei-Zen Chang y Yuh-Chung Hu. "Effects of etching holes on complementary metal oxide semiconductor–microelectromechanical systems capacitive structure". Journal of Intelligent Material Systems and Structures 24, n.º 3 (11 de junio de 2012): 310–17. http://dx.doi.org/10.1177/1045389x12449917.
Kikkawa, Yuki, Yuzan Suzuki, Kohei Saito, Hiroto Yarimizu, Satoko Kanamori, Tomoaki Sato y Toru Nagashima. "Alkali Wet Chemicals for Ru with Advanced Semiconductor Technology Nodes". Solid State Phenomena 346 (14 de agosto de 2023): 325–30. http://dx.doi.org/10.4028/p-08chsp.
Wu, Bing-Rui, Sin-Liang Ou, Shih-Yung Lo, Hsin-Yuan Mao, Jhen-Yu Yang y Dong-Sing Wuu. "Texture-Etched SnO2Glasses Applied to Silicon Thin-Film Solar Cells". Journal of Nanomaterials 2014 (2014): 1–9. http://dx.doi.org/10.1155/2014/907610.
Lamichhane, Shobha Kanta. "Experimental investigation on anisotropic surface properties of crystalline silicon". BIBECHANA 8 (15 de enero de 2012): 59–66. http://dx.doi.org/10.3126/bibechana.v8i0.4828.
Kumar Katta, Prashanth. "Etching in Dentistry". Indian Journal of Dental Education 13, n.º 1 (2020): 17–20. http://dx.doi.org/10.21088/ijde.0974.6099.13120.2.
Shimozono, Naoki, Mikinori Nagano, Takaaki Tabata y Kazuya Yamamura. "Study on In Situ Etching Rate Monitoring in Numerically Controlled Local Wet Etching". Key Engineering Materials 523-524 (noviembre de 2012): 34–39. http://dx.doi.org/10.4028/www.scientific.net/kem.523-524.34.
Ding, Jingxiu, Ruipeng Zhang, Yuchun Li, David Wei Zhang y Hongliang Lu. "Investigation of a Macromolecular Additive on the Decrease of the Aluminum Horizontal Etching Rate in the Wet Etching Process". Metals 12, n.º 5 (8 de mayo de 2022): 813. http://dx.doi.org/10.3390/met12050813.
Гармаш, В. И., В. Е. Земляков, В. И. Егоркин, А. В. Ковальчук y С. Ю. Шаповал. "Исследование влияния атомарного состава на скорость плазмохимического травления нитрида кремния в силовых транзисторах на основе AlGaN/GaN-гетероперехода". Физика и техника полупроводников 54, n.º 8 (2020): 748. http://dx.doi.org/10.21883/ftp.2020.08.49646.9398.
Rath, P., J. C. Chai, Y. C. Lam, V. M. Murukeshan y H. Zheng. "A Total Concentration Fixed-Grid Method for Two-Dimensional Wet Chemical Etching". Journal of Heat Transfer 129, n.º 4 (21 de octubre de 2006): 509–16. http://dx.doi.org/10.1115/1.2709654.
Wu, Ping, Xue Ping Xu, Ilya Zwieback y John Hostetler. "Study of Etching Processes for SiC Defect Analysis". Materials Science Forum 897 (mayo de 2017): 363–66. http://dx.doi.org/10.4028/www.scientific.net/msf.897.363.
Wilson, Sara M., Wen Lien, David P. Lee y William J. Dunn. "Confocal microscope analysis of depth of etch between self-limiting and traditional etchant systems". Angle Orthodontist 87, n.º 5 (10 de mayo de 2017): 766–73. http://dx.doi.org/10.2319/120816-880.1.
Kim, Jonghyeok, Byungjoo Kim, Jiyeon Choi y Sanghoon Ahn. "The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching". Micromachines 15, n.º 3 (25 de febrero de 2024): 320. http://dx.doi.org/10.3390/mi15030320.
Yao, Yong Zhao, Yukari Ishikawa, Yoshihiro Sugawara y Koji Sato. "Removal of Mechanical-Polishing-Induced Surface Damages on 4H-SiC Wafers by Using Chemical Etching with Molten KCl+KOH". Materials Science Forum 778-780 (febrero de 2014): 746–49. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.746.
Philipsen, Harold, Sander Teck, Nils Mouwen, Wouter Monnens y Quoc Toan Le. "Wet-Chemical Etching of Ruthenium in Acidic Ce4+ Solution". Solid State Phenomena 282 (agosto de 2018): 284–87. http://dx.doi.org/10.4028/www.scientific.net/ssp.282.284.
Cansizoglu, Mehmet F., Mesut Yurukcu y Tansel Karabacak. "Ripple Formation during Oblique Angle Etching". Coatings 9, n.º 4 (22 de abril de 2019): 272. http://dx.doi.org/10.3390/coatings9040272.
Deprédurand, Valérie, Tobias Bertram, Maxime Thévenin, Nathalie Valle, Jean-Nicolas Audinot y Susanne Siebentritt. "Alternative Etching for Improved Cu-rich CuInSe2 Solar Cells". MRS Proceedings 1771 (2015): 163–68. http://dx.doi.org/10.1557/opl.2015.447.
Choi, Woong, Sanghyun Moon y Jihyun Kim. "Photo-Enhanced Inverse Metal-Assisted Chemical Etching of α-Ga2O3 grown on Al2O3". ECS Meeting Abstracts MA2023-01, n.º 32 (28 de agosto de 2023): 1833. http://dx.doi.org/10.1149/ma2023-01321833mtgabs.
Çakır, Orhan. "Review of Etchants for Copper and its Alloys in Wet Etching Processes". Key Engineering Materials 364-366 (diciembre de 2007): 460–65. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.460.
Choi, Yongjoon, Choonghee Cho, Dongmin Yoon, Joosung Kang, Jihye Kim, So Young Kim, Dong Chan Suh y Dae-Hong Ko. "Selective Etching of Si versus Si1−xGex in Tetramethyl Ammonium Hydroxide Solutions with Surfactant". Materials 15, n.º 19 (5 de octubre de 2022): 6918. http://dx.doi.org/10.3390/ma15196918.
Ki, Bugeun, Keorock Choi, Kyunghwan Kim y Jungwoo Oh. "Electrochemical local etching of silicon in etchant vapor". Nanoscale 12, n.º 11 (2020): 6411–19. http://dx.doi.org/10.1039/c9nr10420h.
Bonyár, Attila y Péter J. Szabó. "A Method for the Determination of Ferrite Grains with a Surface Normal close to the (111) Orientation in Cold Rolled Steel Samples with Color Etching and Optical Microscopy". Materials Science Forum 812 (febrero de 2015): 297–302. http://dx.doi.org/10.4028/www.scientific.net/msf.812.297.
Kim, Tae Hyeon, Yu Seok Lee, Jong Won Han y Sang Woo Lim. "Investigation of Oxide Regrowth in the Selective Si<sub>3</sub>N<sub>4</sub> Etching Process for 3D NAND Fabrication by Using Finite Element Modeling Simulation". Solid State Phenomena 346 (14 de agosto de 2023): 143–48. http://dx.doi.org/10.4028/p-e7rksr.
Radjenovic, Branislav y Marija Radmilovic-Radjenovic. "Level set simulations of the anisotropic wet etching process for device fabrication in nanotechnologies". Chemical Industry 64, n.º 2 (2010): 93–97. http://dx.doi.org/10.2298/hemind100205008r.
Sampson, W. J., C. W. Wookey y J. Rouse. "Fluorine depth profiles in human enamel after different acid etching times". Australasian Orthodontic Journal 10, n.º 1 (1 de marzo de 1987): 25–31. http://dx.doi.org/10.2478/aoj-1987-0005.
NAM, SANG-HUN, MYOUNG-HWA KIM, DONG GEUN YOO, SEONG HUN JEONG, DOO YONG KIM, NAE-EUNG LEE y J. H. BOO. "METAL-DOPED ZnO THIN FILMS: SYNTHESIS, ETCHING CHARACTERISTIC, AND APPLICATION TEST FOR ORGANIC LIGHT EMITTING DIODE (OLED) DEVICES". Surface Review and Letters 17, n.º 01 (febrero de 2010): 121–27. http://dx.doi.org/10.1142/s0218625x10014065.