Artículos de revistas sobre el tema "Epoxy Mold Compound"
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Kumari, Pinki, Kuldeep Singh y Anuj Singal. "Reducing the Hygroscopic Swelling in MEMS Sensor using Different Mold Materials". International Journal of Electrical and Computer Engineering (IJECE) 10, n.º 1 (1 de febrero de 2020): 494. http://dx.doi.org/10.11591/ijece.v10i1.pp494-499.
Texto completoLakhera, Nishant, Sandeep Shantaram y AR Nazmus Sakib. "Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses". International Symposium on Microelectronics 2017, n.º 1 (1 de octubre de 2017): 000304–11. http://dx.doi.org/10.4071/isom-2017-wa53_009.
Texto completoDeringer, Tim y Dietmar Drummer. "The influence of mold temperature on thermoset in-mold forming". Journal of Polymer Engineering 40, n.º 3 (25 de febrero de 2020): 256–66. http://dx.doi.org/10.1515/polyeng-2019-0322.
Texto completoSulong, Abu Bakar, Gan Tek Keong y Jaafar Sahari. "Effects of Molding Parameters and Addition of Fillers on Gate Chip Off Formation during the Degating Process in Transfer Molding". Key Engineering Materials 447-448 (septiembre de 2010): 790–94. http://dx.doi.org/10.4028/www.scientific.net/kem.447-448.790.
Texto completoChen, Hwe-Zhong, Wen-Hung Lee, Huei-Huang Lee, Durn-Yuan Huang, Shyang-Jye Chang y Sheng-Jye Hwang. "Effects of defrosting period on mold adhesion force of epoxy molding compound". Asia-Pacific Journal of Chemical Engineering 4, n.º 2 (marzo de 2009): 161–68. http://dx.doi.org/10.1002/apj.186.
Texto completoBrueckner, Julia, Michael Schwander, Moritz Jurgschat y Ramon Tuason. "Effective Inspection Methods for Advanced Packaging Technologies". International Symposium on Microelectronics 2017, n.º 1 (1 de octubre de 2017): 000563–68. http://dx.doi.org/10.4071/isom-2017-tha32_055.
Texto completoHsu, Hsiang-Chen, Shih-Jeh Wu, Wen-Fei Lin y Boen Houng. "Reliability Design and Optimization Process on through Mold via using Ultrafast Laser". Polymers and Polymer Composites 26, n.º 1 (enero de 2018): 1–8. http://dx.doi.org/10.1177/096739111802600101.
Texto completoLakhera, Nishant, Tom Battle, Sheila Chopin, Sandeep Shantaram y Akhilesh K. Singh. "Technique to predict reliability failure in side-gate transfer molded packages". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000696–701. http://dx.doi.org/10.4071/isom-2015-tha61.
Texto completoMurali, Sarangapani, Bayaras Abito Danila y Zhang Xi. "Reliability of Coated and Alloyed Copper/Silver Ball Bonds". International Symposium on Microelectronics 2017, n.º 1 (1 de octubre de 2017): 000318–24. http://dx.doi.org/10.4071/isom-2017-wa55_128.
Texto completoXu, Wen Jiao y Shu Yu Lu. "Recycling of Thermosetting Epoxy Molding Compound Waste into PVC Composites: Effect of Silane Coupling Agent on Morphology and Physical Properties". Advanced Materials Research 311-313 (agosto de 2011): 1496–500. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1496.
Texto completoYoo, Do-Jae, Jong-In Ryu, Gyu-Hwan Oh, Yong-Choon Park, Ki-Ju Lee, Jin-Su Kim, Jong-Woo Choi et al. "PMV (Plating Mold Via) interconnection development in molded SiP modules". International Symposium on Microelectronics 2014, n.º 1 (1 de octubre de 2014): 000777–82. http://dx.doi.org/10.4071/isom-thp11.
Texto completoJha, Vibhash y Torsten Hauck. "Moldflow simulation of an exposed pad leaded package". International Symposium on Microelectronics 2015, n.º 1 (1 de octubre de 2015): 000179–84. http://dx.doi.org/10.4071/isom-2015-tp65.
Texto completoVogelwaid, Julian, Martin Bayer, Michael Walz, Felix Hampel, Larysa Kutuzova, Günter Lorenz, Andreas Kandelbauer y Timo Jacob. "Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability". Polymers 16, n.º 11 (30 de mayo de 2024): 1540. http://dx.doi.org/10.3390/polym16111540.
Texto completoMorais, Pedro, Alireza Akhavan-Safar, Ricardo J. C. Carbas, Eduardo A. S. Marques, Bala Karunamurthy y Lucas F. M. da Silva. "Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components". Polymers 16, n.º 4 (7 de febrero de 2024): 463. http://dx.doi.org/10.3390/polym16040463.
Texto completoHan, S., K. K. Wang y D. L. Crouthamel. "Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation". Journal of Electronic Packaging 119, n.º 4 (1 de diciembre de 1997): 247–54. http://dx.doi.org/10.1115/1.2792245.
Texto completoHu, S. Y., Y. P. Chang, W. R. Jong y S. C. Chen. "Effect of mold heat transfer on the curing reaction of epoxy molding compound during transfer molding". International Communications in Heat and Mass Transfer 23, n.º 6 (octubre de 1996): 779–88. http://dx.doi.org/10.1016/0735-1933(96)00061-9.
Texto completoJeong, Haksan, Kwang-Ho Jung, Choong-Jae Lee, Kyung Deuk Min, Woo-Ram Myung y Seung-Boo Jung. "Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package". Journal of Materials Science: Materials in Electronics 31, n.º 9 (26 de marzo de 2020): 6835–42. http://dx.doi.org/10.1007/s10854-020-03243-8.
Texto completoPeanpunga, Udom, Kessararat Ugsornrat, Panakamol Thorlor y Chalermsak Sumithpibul. "The Effect of Epoxy Molding Compound Floor Life to Reliability Performance and mold ability for QFN Package". Journal of Physics: Conference Series 901 (septiembre de 2017): 012088. http://dx.doi.org/10.1088/1742-6596/901/1/012088.
Texto completoHan, S. y K. K. Wang. "Flow Analysis in a Chip Cavity During Semiconductor Encapsulation". Journal of Electronic Packaging 122, n.º 2 (11 de enero de 1999): 160–67. http://dx.doi.org/10.1115/1.483149.
Texto completoPei, Chien-Chang y Sheng-Jye Hwang. "Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect". Journal of Electronic Packaging 127, n.º 3 (3 de noviembre de 2004): 335–39. http://dx.doi.org/10.1115/1.1939028.
Texto completoYoo, Do-Jae, Ki-Chan Kim, Young-Hoon Kwak, Min-Seok Jang, Job Ha, Jae-Cheon Doh, Chang-Bae Lee y Young-Do Kweon. "Molded Underfill (MUF) Technology Development for SiP Module with Fine Flip Chip". International Symposium on Microelectronics 2010, n.º 1 (1 de enero de 2010): 000204–11. http://dx.doi.org/10.4071/isom-2010-tp2-paper2.
Texto completoWong, Fu Mauh, Chee Keong Chong y K. N. Seetharamu. "Transient Thermal Analysis of Wave Soldering Process for an Optical Encoder Module". Journal of Microelectronics and Electronic Packaging 1, n.º 3 (1 de julio de 2004): 145–56. http://dx.doi.org/10.4071/1551-4897-1.3.145.
Texto completoKhalilullah, Ibrahim, Talukder Reza, Liangbiao Chen, Mark Placette, A. K. M. Monayem H. Mazumder, Jiang Zhou, Jiajie Fan, Cheng Qian, Guoqi Zhang y Xuejun Fan. "In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging". Microelectronics Reliability 84 (mayo de 2018): 208–14. http://dx.doi.org/10.1016/j.microrel.2018.03.025.
Texto completoTsvetkov, Yuriy, Evgeniy Gorbachenko y Roman Larin. "Friction Impact on the Accuracy of the Dependence of Micro-Hardness on Plastic Deformation in Testing Metals under Uniaxial Compression". Key Engineering Materials 909 (4 de febrero de 2022): 132–38. http://dx.doi.org/10.4028/p-rc91j5.
Texto completoShih, Meng-Kai, Tai-Kuang Lee y Jin-Gyao Chang. "Warpage modeling and characterization of intelligent power modules (IPMs)". Journal of Mechanics 37 (2021): 543–50. http://dx.doi.org/10.1093/jom/ufab025.
Texto completoLee, Chu-Chung, TuAnh Tran, Varughese Mathew, Rusli Ibrahim y Poh-Leng Eu. "Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive Application". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (1 de enero de 2019): 000519–30. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_013.
Texto completoChopin, Sheila F. y Varughese Mathew. "Controlling Extrinsic Chloride Ions Effect on Copper Wirebond Reliability". International Symposium on Microelectronics 2019, n.º 1 (1 de octubre de 2019): 000095–99. http://dx.doi.org/10.4071/2380-4505-2019.1.000095.
Texto completoLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs)". International Symposium on Microelectronics 2017, n.º 1 (1 de octubre de 2017): 000576–83. http://dx.doi.org/10.4071/isom-2017-tha35_056.
Texto completoLau, John, Ming Li, Nelson Fan, Eric Kuah, Zhang Li, Kim Hwee Tan, Tony Chen et al. "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)". Journal of Microelectronics and Electronic Packaging 14, n.º 4 (1 de octubre de 2017): 123–31. http://dx.doi.org/10.4071/imaps.522798.
Texto completoFowler, Michelle, John P. Massey, Matthew Koch, Kevin Edwards, Tanja Braun, Steve Voges, Robert Gernhardt y Markus Wohrmann. "Advances in Temporary Bonding and Debonding Technologies for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer-Level Packaging (FOWLP) Processes". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000051–56. http://dx.doi.org/10.4071/2380-4505-2018.1.000051.
Texto completoCoudrain, Perceval, Arnaud Garnier, Laetitia Castagné, Aurélia Plihon, Rémi Vélard, Rémi Franiatte, Jean-Charles Souriau, Jeanne Pignol, Célia Darrambide y Emmanuel Ollier. "(Invited) Fan-out Wafer-Level Packaging: Opportunities and Challenges Towards Heterogeneous Systems". ECS Meeting Abstracts MA2022-02, n.º 17 (9 de octubre de 2022): 849. http://dx.doi.org/10.1149/ma2022-0217849mtgabs.
Texto completoTeixeira, Jorge, Mário Ribeiro y Nélson Pinho. "Advanced warpage characterization for FOWLP". International Symposium on Microelectronics 2013, n.º 1 (1 de enero de 2013): 000641–46. http://dx.doi.org/10.4071/isom-2013-wp21.
Texto completoKitaoka, Satoshi, Naoki Kawashima, Masato Yoshiya, Shigeru Miyagawa, Yoshinori Noguchi y Kazuhiro Ikemura. "Improving Releasability of Mold Materials for IC Encapsulation Using Epoxy Compounds". Materials Science Forum 706-709 (enero de 2012): 2529–34. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.2529.
Texto completoKitaoka, Satoshi, Naoki Kawashima, Keiji Maeda, Takaki Kuno y Yoshinori Noguchi. "Design of Mold Materials for Encapsulating Semiconductors Using Epoxy Molding Compounds". Materials Science Forum 561-565 (octubre de 2007): 539–42. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.539.
Texto completoBest, Keith, Steve Gardner y Casey Donaher. "PHOTOLITHOGRAPHY ALIGNMENT MARK TRANSFER SYSTEM FOR LOW COST ADVANCED PACKAGING AND BONDED WAFER APPLICATIONS". International Symposium on Microelectronics 2016, n.º 1 (1 de octubre de 2016): 000315–20. http://dx.doi.org/10.4071/isom-2016-wp34.
Texto completoSwarbrick, Tom, Keith Best, Casey Donaher y Steve Gardner. "Photolithography Alignment Mark Transfer System for Low Cost, Advanced Packaging, and Bonded Wafer Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, DPC (1 de enero de 2016): 001302–27. http://dx.doi.org/10.4071/2016dpc-wp16.
Texto completoScopa Kelso, Rebecca, Brannon I. Hulsey y Kathryn R. D. Driscoll. "Dental molding compounds and casts". Dental Anthropology Journal 33, n.º 1 (7 de enero de 2020): 17–22. http://dx.doi.org/10.26575/daj.v33i1.290.
Texto completoPlacette, Mark D., Xuejun Fan, Jie-Hua Zhao y Darvin Edwards. "Dual stage modeling of moisture absorption and desorption in epoxy mold compounds". Microelectronics Reliability 52, n.º 7 (julio de 2012): 1401–8. http://dx.doi.org/10.1016/j.microrel.2012.03.008.
Texto completoZhang, Yong Di, Bin Zhang, Yan Fang Yue y Guang Yang. "Manufacturing Process of EP Matrix Composite Rapid Injection Mold and Application Case". Advanced Materials Research 1061-1062 (diciembre de 2014): 460–64. http://dx.doi.org/10.4028/www.scientific.net/amr.1061-1062.460.
Texto completoBelton, D. "The Effect of Post-Mold Curling Upon the Microstructure of Epoxy Molding Compounds". IEEE Transactions on Components, Hybrids, and Manufacturing Technology 10, n.º 3 (septiembre de 1987): 358–63. http://dx.doi.org/10.1109/tchmt.1987.1134754.
Texto completoMurniati, Murniati, Erin Ryantin Gunawan, Dedy Suhendra, Dina Asnawati y Pujana Qurba. "Sintesis Senyawa-Senyawa Epoksi dari Asam Lemak Minyak Nyamplung (Calophyllum inophyllum L.)". Jurnal Riset Kimia 13, n.º 1 (13 de marzo de 2022): 89–99. http://dx.doi.org/10.25077/jrk.v13i1.447.
Texto completoAhmad Temizi, Muhammad Afhnan, Meor Iqram Meor Ahmad, Nor Kamaliana Khamis y Muhammad Yunus Ahmad Samsudin. "Study of Mechanical and Thermal Properties for Epoxy Grouts Subjected to Seawater Conditioning at Elevated Temperature: Tensile Test and Compressive Test". Jurnal Kejuruteraan 34, n.º 6 (30 de noviembre de 2022): 1017–25. http://dx.doi.org/10.17576/jkukm-2022-34(6)-03.
Texto completoZhang, Kun Liang, Bin Hong, Li Peng Zhang, Ya Ji, Zhen Dong Gao y Jian Ye Gao. "The Pouring Process Optimization for the Conductive Slip-Rin". Materials Science Forum 943 (enero de 2019): 48–52. http://dx.doi.org/10.4028/www.scientific.net/msf.943.48.
Texto completoAbdulRazaq, Jaafar Sh, Abdul Kareem F. Hassan y Nuha H. Jasim. "Characterization of the mechanical properties and thermal conductivity of epoxy-silica functionally graded materials". AIMS Materials Science 10, n.º 1 (2023): 182–99. http://dx.doi.org/10.3934/matersci.2023010.
Texto completoDecker, John A. "Graphite-Epoxy Acoustic Guitar Technology". MRS Bulletin 20, n.º 3 (marzo de 1995): 37–39. http://dx.doi.org/10.1557/s0883769400044390.
Texto completoIshikawa, Yuki, Tomoya Takao y Takeyasu Saito. "Obtaining thermal resistance of mold compounds using a package structure model with a heat-generating test element group: Comparison of the thermal conductivity and glass transition temperature of epoxy mold compounds". Microelectronics Reliability 151 (diciembre de 2023): 115233. http://dx.doi.org/10.1016/j.microrel.2023.115233.
Texto completoChiu, S. M., S. J. Hwang, C. W. Chu y Dershin Gan. "The influence of Cr-based coating on the adhesion force between epoxy molding compounds and IC encapsulation mold". Thin Solid Films 515, n.º 1 (septiembre de 2006): 285–92. http://dx.doi.org/10.1016/j.tsf.2005.12.141.
Texto completoAbdullah, Shahrum, Mohd Faridz Mod Yunoh, Azman Jalar y Mohamad Faizal Abdullah. "Hardness Test on an Epoxy Mold Compounds of a Quad Flat No Lead Package Using the Depth Sensing Nanoindentation". Advanced Materials Research 146-147 (octubre de 2010): 1000–1003. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.1000.
Texto completoAhn, Woojin, Muhammad Ashraful Alam, Davide Cornigli, Susanna Reggiani, Dhanoop Varghese y Srikanth Krishnan. "Space Charge Redistribution in Epoxy Mold Compounds of High-Voltage ICs at Dry and Wet Conditions: Theory and Experiment". IEEE Transactions on Dielectrics and Electrical Insulation 28, n.º 6 (diciembre de 2021): 2043–51. http://dx.doi.org/10.1109/tdei.2021.009817.
Texto completoKliegel, Wolfgang, Jörg Metge, Steven J. Rettig y James Trotter. "Novel boron chelate complexes from the reaction of salicylaldehydes, tertiary amines, and diphenylborinic or phenylboronic acid. Crystal and molecular structures of two new types of chelated organoborate salts". Canadian Journal of Chemistry 75, n.º 9 (1 de septiembre de 1997): 1203–14. http://dx.doi.org/10.1139/v97-145.
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