Artículos de revistas sobre el tema "Electronic board design"
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Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko y Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine". Computer Design Systems. Theory and Practice 4, n.º 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Texto completoLiu, Yang, Yun Feng Zhang y Ya Kui Xing. "The Optimized Design of the Electronic Bus Stop Board". Applied Mechanics and Materials 97-98 (septiembre de 2011): 1195–200. http://dx.doi.org/10.4028/www.scientific.net/amm.97-98.1195.
Texto completoAkash R., Maya Srinivas, Venugopal Rao S, Sanjan Kashyap, Adithya T.G., Pavithra G., Sindhu Sree M. y T.C.Manjunath. "Wireless notice board design using bluetooth technologies". international journal of engineering technology and management sciences 6, n.º 6 (28 de noviembre de 2022): 230–33. http://dx.doi.org/10.46647/ijetms.2022.v06i06.035.
Texto completoGOROSHKO, Andrii, Igor KOVTUN y Maryna ZEMBYTSKA. "IMPROVING THE ACCURACY OF THE VIBRATION ANALYSIS OF ON-BOARD ELECTRONICS PRINTED BOARDS". Herald of Khmelnytskyi National University. Technical sciences 313, n.º 5 (27 de octubre de 2022): 301–6. http://dx.doi.org/10.31891/2307-5732-2022-313-5-301-306.
Texto completoYang, Yan Fei, Jian Wang, Xue Jian Liu, Xiao Juan Yang y Ya Hu. "Design of Electronic Seal Terminal for Tank Vehicles". Applied Mechanics and Materials 620 (agosto de 2014): 133–36. http://dx.doi.org/10.4028/www.scientific.net/amm.620.133.
Texto completoSuriano, Domenico. "Design and Development of an Electronic Board for Supporting the Operation of Electrochemical Gas Sensors". Hardware 2, n.º 2 (14 de junio de 2024): 173–89. http://dx.doi.org/10.3390/hardware2020009.
Texto completoUSLU-OZKUCUK, Gonca. "TRIAC Based Isolated AC Load Drive Equivalent Circuit Design of Solid-State Relay". Eurasia Proceedings of Science Technology Engineering and Mathematics 26 (30 de diciembre de 2023): 183–89. http://dx.doi.org/10.55549/epstem.1409469.
Texto completoPandey y Vora. "Open Electronics for Medical Devices: State-of-Art and Unique Advantages". Electronics 8, n.º 11 (1 de noviembre de 2019): 1256. http://dx.doi.org/10.3390/electronics8111256.
Texto completoZhang, Cai Rong, Guo Liang Liu y Bin Wei. "Design and Implementation of Electronic Bus Stop Boards System Based on Wireless Communication Module". Applied Mechanics and Materials 651-653 (septiembre de 2014): 2441–44. http://dx.doi.org/10.4028/www.scientific.net/amm.651-653.2441.
Texto completoBucolo, Maide, Arturo Buscarino, Luigi Fortuna, Carlo Famoso, Mattia Frasca, Antonino Cucuccio, Gaetano Rasconà y Giovanni Vinci. "A Comparative Analysis of Computer-Aided Design Tools for Complex Power Electronics Systems". Energies 14, n.º 22 (18 de noviembre de 2021): 7729. http://dx.doi.org/10.3390/en14227729.
Texto completoLiao, Wei. "Electronic Circuit Board Design and Production Project Design and Teaching Innovation". Creativity and Innovation 6, n.º 3 (2022): 226–30. http://dx.doi.org/10.47297/wspciwsp2516-252745.20220603.
Texto completoSimon, Erik P., Moritz Fröhlich, Ch Kallmayer y K. D. Lang. "Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications". Advances in Science and Technology 80 (septiembre de 2012): 96–101. http://dx.doi.org/10.4028/www.scientific.net/ast.80.96.
Texto completoKhan, Noor Mohmmed, Shubhangi Patil, Tushar Diggewadi y Anand Gudnavar. "Cinch and Sterling Analog Circuits for Laboratory". International Journal of Advanced Research in Electrical, Electronics and Instrumentation Engineering 6, n.º 01 (25 de junio de 2017): 51–58. http://dx.doi.org/10.15662/ijareeie.2017.0601007.
Texto completoNazirkulov, N. y N. Burambaeva. "A systematic approach to in-circuit diagnostics and design of printed circuit boards for locomotives". BULLETIN of the L.N. Gumilyov Eurasian National University. PHYSICS. ASTRONOMY Series 141, n.º 4 (30 de diciembre de 2022): 29–40. http://dx.doi.org/10.32523/2616-6836-2022-141-4-29-40.
Texto completoCole, Reena, Tara Dalton, Jeff Punch, Mark R. Davies y Ronan Grimes. "Forced Convection Board Level Thermal Design Methodology for Electronic Systems". Journal of Electronic Packaging 123, n.º 2 (21 de julio de 2000): 120–26. http://dx.doi.org/10.1115/1.1339822.
Texto completoKim, Ernest M. y Thomas F. Schubert. "A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice". International Journal of Electrical Engineering & Education 54, n.º 3 (3 de noviembre de 2016): 208–22. http://dx.doi.org/10.1177/0020720916673650.
Texto completoOberloier, Shane y Joshua Pearce. "Belt-Driven Open Source Circuit Mill Using Low-Cost 3-D Printer Components". Inventions 3, n.º 3 (5 de septiembre de 2018): 64. http://dx.doi.org/10.3390/inventions3030064.
Texto completoHan, Ye, Xiang Dong You, Xu Zhang, Hui Yang Wang y Cong Deng. "A Novel Design of the CNG Dispenser Electronic Control System". Applied Mechanics and Materials 448-453 (octubre de 2013): 3119–22. http://dx.doi.org/10.4028/www.scientific.net/amm.448-453.3119.
Texto completoYang, Jun y Jing Liu. "Direct printing and assembly of FM radio at the user end via liquid metal printer". Circuit World 40, n.º 4 (28 de octubre de 2014): 134–40. http://dx.doi.org/10.1108/cw-07-2014-0029.
Texto completoLi, Hong y Si Qing Zhang. "Design for Robot Control Board Based on AVR Single Chip Microcomputer". Applied Mechanics and Materials 484-485 (enero de 2014): 570–73. http://dx.doi.org/10.4028/www.scientific.net/amm.484-485.570.
Texto completoShonhe, Liah y Balulwami Grand. "Implementation of electronic records management systems". Records Management Journal 30, n.º 1 (11 de septiembre de 2019): 43–62. http://dx.doi.org/10.1108/rmj-03-2019-0013.
Texto completoTaylor, Christine, Budy Notohardjono, Suraush Khambati y Shawn Canfield. "Designing Electronic Card Packages Against Shipping Shock". Journal of the IEST 64, n.º 1 (1 de diciembre de 2021): 42–49. http://dx.doi.org/10.17764/1557-2196-64.1.42.
Texto completoRojas-Molina, Adriana, Gilberto Herrera-Ruiz, Rodrigo Castañeda-Miranda, Antonio Terrazas-Lara, Javier Hissarlik Flores-Chaparro, Benjamín Barón-Rodríguez y Ricardo Chaparro-Sánchez. "Diseño de tarjeta electrónica genérica para el control de motores trifásicos". Ingeniería, investigación y tecnología 13, n.º 1 (1 de enero de 2012): 21–31. http://dx.doi.org/10.22201/fi.25940732e.2012.13n1.003.
Texto completoKannan Megalingam, Rajesh, Shree Rajesh Raagul Vadivel, Sreekumar S, Swathi Sekhar, Thejus R Nair y Midhun RR. "Design and Implementation of CNC Milling Bot for Milled Circuit Board Fabrication". International Journal of Engineering & Technology 7, n.º 3.12 (20 de julio de 2018): 1205. http://dx.doi.org/10.14419/ijet.v7i3.12.17838.
Texto completoYunardi, Riky Tri, Moh Zakky Zulfiar, Rr Wanda Auruma Putri y Deny Arifianto. "Design and Implementation of Solder Paste Dispenser Based on Linear Drive System". JEEE-U (Journal of Electrical and Electronic Engineering-UMSIDA) 3, n.º 2 (13 de noviembre de 2019): 338. http://dx.doi.org/10.21070/jeee-u.v3i2.2637.
Texto completoCole, Reena, Mark Davies y Jeff Punch. "A Board Level Study of an Array of Ball Grid Components—Aerodynamic and Thermal Measurements". Journal of Electronic Packaging 125, n.º 4 (1 de diciembre de 2003): 480–89. http://dx.doi.org/10.1115/1.1604811.
Texto completoStęplewski, Wojciech, Mateusz Mroczkowski, Radoslav Darakchiev, Konrad Futera y Grażyna Kozioł. "New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules". Circuit World 41, n.º 3 (3 de agosto de 2015): 121–24. http://dx.doi.org/10.1108/cw-03-2015-0008.
Texto completoRodgers, Peter, Vale´rie Eveloy y M. S. J. Hashmi. "An Investigation Into the Potential of Low-Reynolds Number Eddy Viscosity Turbulent Flow Models to Predict Electronic Component Operational Temperature". Journal of Electronic Packaging 127, n.º 1 (1 de marzo de 2005): 67–75. http://dx.doi.org/10.1115/1.1849234.
Texto completoMao, Weiwei, Teng Pang, Xiaoyu Jin, Yang Li y Hongbao Bai. "Overall Scheme Design of Fault Diagnosis for Complex Electronic Systems". Journal of Physics: Conference Series 2731, n.º 1 (1 de marzo de 2024): 012031. http://dx.doi.org/10.1088/1742-6596/2731/1/012031.
Texto completoPennathur, Priyadarshini R., Ann M. Bisantz, Rollin J. Fairbanks, Shawna J. Perry, Frank Zwemer y Robert L. Wears. "Assessing the Impact of Computerization on Work Practice: Information Technology in Emergency Departments". Proceedings of the Human Factors and Ergonomics Society Annual Meeting 51, n.º 4 (octubre de 2007): 377–81. http://dx.doi.org/10.1177/154193120705100448.
Texto completoFomin, D. G., N. V. Dudarev, S. N. Darovskikh, M. G. Vakhitov y D. S. Klygach. "Specific Features of Volume-modular Technology Application in the Design of Microwave Electronic Devices". Ural Radio Engineering Journal 5, n.º 2 (2021): 91–103. http://dx.doi.org/10.15826/urej.2021.5.2.001.
Texto completoChong, Peng Lean, Silvia Ganesan, Poh Kiat Ng y Feng Yuan Kong. "A TRIZ-Adopted Development of a Compact Experimental Board for the Teaching and Learning of Operational Amplifier with Multiple Circuit Configurations". Sustainability 14, n.º 21 (29 de octubre de 2022): 14115. http://dx.doi.org/10.3390/su142114115.
Texto completoPang, Teng, Weiwei Mao, Hongliang Liu, Yuan Li y Chao Hou. "Design of Fault Diagnosis Method Based on Circuit Frequency Domain Characteristics Fault Dictionary Method". Journal of Physics: Conference Series 2731, n.º 1 (1 de marzo de 2024): 012009. http://dx.doi.org/10.1088/1742-6596/2731/1/012009.
Texto completoEt al., Andy Wahyu H. "Developing Learning Media Based Project Board in Electronic Materials to Improve the Analysis Capability and Skills for the Cadets of PIP Semarang". Turkish Journal of Computer and Mathematics Education (TURCOMAT) 12, n.º 6 (5 de abril de 2021): 2686–94. http://dx.doi.org/10.17762/turcomat.v12i6.5769.
Texto completoEvdulov, O. V. y A. M. Khaibulaev. "Experimental studies of the electronic board cooling system". Herald of Dagestan State Technical University. Technical Sciences 49, n.º 1 (19 de mayo de 2022): 6–13. http://dx.doi.org/10.21822/2073-6185-2022-49-1-6-13.
Texto completoChung, B. T. F. y H. H. Li. "Forced Convective Cooling Enhancement Through a Double Layer Design". Journal of Electronic Packaging 117, n.º 1 (1 de marzo de 1995): 69–74. http://dx.doi.org/10.1115/1.2792069.
Texto completoOzerkin, D. V. y V. O. Bondarenko. "Using Microthermostatting to Increase Thermal Stability of On-Board Electronics". Herald of the Bauman Moscow State Technical University. Series Instrument Engineering, n.º 3 (132) (septiembre de 2020): 18–36. http://dx.doi.org/10.18698/0236-3933-2020-3-18-36.
Texto completoMonier-Vinard, Eric, Najib Laraqi, Cheikh Dia, Minh-Nhat Nguyen y Valentin Bissuel. "Analytical modeling of multi-layered printed circuit board using multi-stacked via clusters as component heat spreader". Thermal Science 20, n.º 5 (2016): 1633–47. http://dx.doi.org/10.2298/tsci140403143m.
Texto completoZhang, Xiaoyan, Bo Lan, Yadongyang Zhu y Lugang Zhang. "Application of EDA Technology in Electronic Engineering Design". Learning & Education 10, n.º 7 (7 de junio de 2022): 175. http://dx.doi.org/10.18282/l-e.v10i7.2998.
Texto completoZhou, Shuyu. "Design of Novel Optical Fiber Communication Electronic System and Big Data Prediction Method of Its Loss". Journal of Nanoelectronics and Optoelectronics 16, n.º 8 (1 de agosto de 2021): 1308–16. http://dx.doi.org/10.1166/jno.2021.3082.
Texto completoSandera, Josef. "Connection of electronic and microelectronic modules". Microelectronics International 31, n.º 2 (29 de abril de 2014): 86–89. http://dx.doi.org/10.1108/mi-10-2013-0053.
Texto completoR., Prabhu y Divija T. "Design of Temperature Based Automatic Fan Speed Controller Using Arudino". International Journal of Innovative Research in Advanced Engineering 10, n.º 07 (31 de julio de 2023): 537–42. http://dx.doi.org/10.26562/ijirae.2023.v1007.17.
Texto completoLei, Lei, Jia Jing Zhuo, He Chen, Xian Feng Luo y Wei Peng. "Design and Realization of One Circuit Board General Test System Based on USB". Applied Mechanics and Materials 121-126 (octubre de 2011): 1977–81. http://dx.doi.org/10.4028/www.scientific.net/amm.121-126.1977.
Texto completoHasegawa, Kiyohisa, Yasuki Torigoshi y Daisuke Oshima. "Board Design Environments and Simulation Technologies". Journal of The Japan Institute of Electronics Packaging 25, n.º 5 (1 de agosto de 2022): 488–98. http://dx.doi.org/10.5104/jiep.25.488.
Texto completoKUBODERA, Tadashi. "Printed Circuit Board Design for EMC". Journal of Japan Institute of Electronics Packaging 5, n.º 4 (2002): 405–11. http://dx.doi.org/10.5104/jiep.5.405.
Texto completoSinotin, A. M., O. M. Tsymbal, T. A. Kolesnikova y S. V. Sotnik. "Algorithm for multi-board radio-electronic devices synthesis on maximal accepted overheat". Radiotekhnika, n.º 190 (16 de octubre de 2017): 89–96. http://dx.doi.org/10.30837/rt.2017.3.190.13.
Texto completoZwal, Yahaya Ibrahim, Madiu Ismail Opeyemi y Ibrahim Muhammad Warji. "Design and Construction of a Modified SMS-Based Electronic Notice Board". Path of Science 9, n.º 4 (30 de abril de 2023): 2001–6. http://dx.doi.org/10.22178/pos.91-7.
Texto completoPape, Alioune Dia y Ndiaye Ababacar. "Design of a low-cost electronic board for monitoring photovoltaic systems". International Journal of Physical Sciences 18, n.º 1 (31 de enero de 2023): 1–11. http://dx.doi.org/10.5897/ijps2022.4999.
Texto completoBURDUCEA, Sorin y Miron ZAPCIU. "SIMULATION TECHNOLOGIES USED IN HIGH-SPEED PRINTED CIRCUIT BOARD DESIGN". ANNALS OF THE ACADEMY OF ROMANIAN SCIENTISTS Series on ENGINEERING SCIENCES 13, n.º 2 (2021): 46–62. http://dx.doi.org/10.56082/annalsarscieng.2021.2.46.
Texto completoACITO, Bill. "“A Cross-Domain, System Planning Methodology”". International Symposium on Microelectronics 2018, n.º 1 (1 de octubre de 2018): 000005–12. http://dx.doi.org/10.4071/2380-4505-2018.1.000005.
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