Artículos de revistas sobre el tema "Electromigration-thermomigration"
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Yang, D., Y. C. Chan, B. Y. Wu y M. Pecht. "Electromigration and thermomigration behavior of flip chip solder joints in high current density packages". Journal of Materials Research 23, n.º 9 (septiembre de 2008): 2333–39. http://dx.doi.org/10.1557/jmr.2008.0305.
Texto completoAbdulhamid, Mohd F., Cemal Basaran y Yi-Shao Lai. "Thermomigration Versus Electromigration in Microelectronics Solder Joints". IEEE Transactions on Advanced Packaging 32, n.º 3 (agosto de 2009): 627–35. http://dx.doi.org/10.1109/tadvp.2009.2018293.
Texto completoShidong Li, Mohd F. Abdulhamid y Cemal Basaran. "Simulating Damage Mechanics of Electromigration and Thermomigration". SIMULATION 84, n.º 8-9 (agosto de 2008): 391–401. http://dx.doi.org/10.1177/0037549708094856.
Texto completoYao, Wei y Cemal Basaran. "Computational damage mechanics of electromigration and thermomigration". Journal of Applied Physics 114, n.º 10 (14 de septiembre de 2013): 103708. http://dx.doi.org/10.1063/1.4821015.
Texto completoGu, Xin y Y. C. Chan. "Thermomigration and electromigration in Sn58Bi solder joints". Journal of Applied Physics 105, n.º 9 (mayo de 2009): 093537. http://dx.doi.org/10.1063/1.3125458.
Texto completoGu, X., K. C. Yung, Y. C. Chan y D. Yang. "Thermomigration and electromigration in Sn8Zn3Bi solder joints". Journal of Materials Science: Materials in Electronics 22, n.º 3 (18 de abril de 2010): 217–22. http://dx.doi.org/10.1007/s10854-010-0116-9.
Texto completoDohle, Rainer, Stefan Härter, Andreas Wirth, Jörg Goßler, Marek Gorywoda, Andreas Reinhardt y Jörg Franke. "Electromigration Performance of Flip-Chips with Lead-Free Solder Bumps between 30 μm and 60 μm Diameter". International Symposium on Microelectronics 2012, n.º 1 (1 de enero de 2012): 000891–905. http://dx.doi.org/10.4071/isom-2012-wp41.
Texto completoShidong Li, M. F. Abdulhamid y C. Basaran. "Damage Mechanics of Low Temperature Electromigration and Thermomigration". IEEE Transactions on Advanced Packaging 32, n.º 2 (mayo de 2009): 478–85. http://dx.doi.org/10.1109/tadvp.2008.2005840.
Texto completoLin, Y. H., C. M. Tsai, Y. C. Hu, Y. L. Lin, J. Y. Tsai y C. R. Kao. "Electromigration Induced Metal Dissolution in Flip-Chip Solder Joints". Materials Science Forum 475-479 (enero de 2005): 2655–58. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.2655.
Texto completoSomaiah, Nalla y Praveen Kumar. "Tuning electromigration-thermomigration coupling in Cu/W Blech structures". Journal of Applied Physics 124, n.º 18 (14 de noviembre de 2018): 185102. http://dx.doi.org/10.1063/1.5045086.
Texto completoChen, Chih, H. M. Tong y K. N. Tu. "Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints". Annual Review of Materials Research 40, n.º 1 (junio de 2010): 531–55. http://dx.doi.org/10.1146/annurev.matsci.38.060407.130253.
Texto completoBasaran, Cemal y Mohd F. Abdulhamid. "Low temperature electromigration and thermomigration in lead-free solder joints". Mechanics of Materials 41, n.º 11 (noviembre de 2009): 1223–41. http://dx.doi.org/10.1016/j.mechmat.2009.07.004.
Texto completoGu, X., K. C. Yung y Y. C. Chan. "Thermomigration and electromigration in Sn58Bi ball grid array solder joints". Journal of Materials Science: Materials in Electronics 21, n.º 10 (13 de octubre de 2009): 1090–98. http://dx.doi.org/10.1007/s10854-009-9992-2.
Texto completoBasaran, C., H. Ye, D. C. Hopkins, D. Frear y J. K. Lin. "Failure Modes of Flip Chip Solder Joints Under High Electric Current Density". Journal of Electronic Packaging 127, n.º 2 (15 de septiembre de 2004): 157–63. http://dx.doi.org/10.1115/1.1898338.
Texto completoTu, K. N. y A. N. Gusak. "Mean-Time-To-Failure Equations for Electromigration, Thermomigration, and Stress Migration". IEEE Transactions on Components, Packaging and Manufacturing Technology 10, n.º 9 (septiembre de 2020): 1427–31. http://dx.doi.org/10.1109/tcpmt.2020.3003003.
Texto completoIchinokawa, T., C. Haginoya, D. Inoue y H. Itoh. "Electromigration and thermomigration of metallic islands on the Si(100) surface". Journal of Physics: Condensed Matter 5, n.º 33A (16 de agosto de 1993): A405—A406. http://dx.doi.org/10.1088/0953-8984/5/33a/152.
Texto completoChiu, Tsung-Chieh y Kwang-Lung Lin. "Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination". Journal of Materials Research 23, n.º 1 (enero de 2008): 264–73. http://dx.doi.org/10.1557/jmr.2008.0036.
Texto completoSomaiah, Nalla y Praveen Kumar. "Effect of Thermomigration–Electromigration Coupling on Mass Transport in Cu Thin Films". Journal of Electronic Materials 49, n.º 1 (23 de septiembre de 2019): 96–108. http://dx.doi.org/10.1007/s11664-019-07634-4.
Texto completoFeng, Dandan, Fengjiang Wang, Dongyang Li, Bin Wu y Luting Liu. "Atomic migration on Cu in Sn-58Bi solder from the interaction between electromigration and thermomigration". Materials Research Express 6, n.º 4 (7 de enero de 2019): 046301. http://dx.doi.org/10.1088/2053-1591/aaf91c.
Texto completoZhang, Peng, Songbai Xue y Jianhao Wang. "New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints". Materials & Design 192 (julio de 2020): 108726. http://dx.doi.org/10.1016/j.matdes.2020.108726.
Texto completoShen, Yu-An y John A. Wu. "Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints". Materials 15, n.º 14 (21 de julio de 2022): 5086. http://dx.doi.org/10.3390/ma15145086.
Texto completoBecker, H., D. Heger, A. Leineweber y David Rafaja. "Modification of the Diffusion Process in the Iron-Aluminum System via Spark Plasma Sintering/Field Assisted Sintering Technology". Defect and Diffusion Forum 367 (abril de 2016): 1–9. http://dx.doi.org/10.4028/www.scientific.net/ddf.367.1.
Texto completoBaek, Sung-Min, Yujin Park, Cheolmin Oh, Eun-Joon Chun y Namhyun Kang. "Modeling and Experimental Verification of Intermetallic Compounds Grown by Electromigration and Thermomigration for Sn-0.7Cu Solders". Journal of Electronic Materials 48, n.º 1 (26 de noviembre de 2018): 142–51. http://dx.doi.org/10.1007/s11664-018-6786-4.
Texto completoYao, Wei y Cemal Basaran. "Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study". International Journal of Damage Mechanics 23, n.º 2 (6 de mayo de 2013): 203–21. http://dx.doi.org/10.1177/1056789513488396.
Texto completoKim, Seung-Hyun, Gyu-Tae Park, Jong-Jin Park y Young-Bae Park. "Effects of Annealing, Thermomigration, and Electromigration on the Intermetallic Compounds Growth Kinetics of Cu/Sn-2.5Ag Microbump". Journal of Nanoscience and Nanotechnology 15, n.º 11 (1 de noviembre de 2015): 8593–600. http://dx.doi.org/10.1166/jnn.2015.11502.
Texto completoChen, Hsiao-Yun y Chih Chen. "Thermomigration of Cu–Sn and Ni–Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints". Journal of Materials Research 26, n.º 8 (30 de marzo de 2011): 983–91. http://dx.doi.org/10.1557/jmr.2011.25.
Texto completoGuo, Fu, Qian Liu, Limin Ma y Yong Zuo. "Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration". Journal of Materials Research 31, n.º 12 (15 de abril de 2016): 1793–800. http://dx.doi.org/10.1557/jmr.2016.145.
Texto completoKimura, Yasuhiro y Yang Ju. "Equilibrium current density balancing two atomic flows in coupled problems of electromigration and thermomigration in unpassivated gold film". AIP Advances 10, n.º 8 (1 de agosto de 2020): 085125. http://dx.doi.org/10.1063/5.0011417.
Texto completoTu, K. N. y A. M. Gusak. "A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production". Journal of Applied Physics 126, n.º 7 (21 de agosto de 2019): 075109. http://dx.doi.org/10.1063/1.5111159.
Texto completoHuang, Annie T., K. N. Tu y Yi-Shao Lai. "Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints". Journal of Applied Physics 100, n.º 3 (agosto de 2006): 033512. http://dx.doi.org/10.1063/1.2227621.
Texto completoSung, Po-Hsien y Tei-Chen Chen. "Material Properties of Zr–Cu–Ni–Al Thin Films as Diffusion Barrier Layer". Crystals 10, n.º 6 (24 de junio de 2020): 540. http://dx.doi.org/10.3390/cryst10060540.
Texto completoLi, Feng, Andrew W. Owens y Qianyi Li. "Microbump Processing for 3D IC Integration". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (1 de enero de 2019): 001028–49. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_wp2_049.
Texto completoDomenicucci, A. G., B. Cunningham y P. Tsang. "Characterization of Electrically Pulsed Chromium Disilicide Fusible Links". MRS Proceedings 523 (1998). http://dx.doi.org/10.1557/proc-523-103.
Texto completoCui, Zhen, Xuejun Fan, Yaqian Zhang, Sten Vollebregt, Jiajie Fan y Guoqi Zhang. "Coupling Model of Electromigration and Experimental Verification – Part II: Impact of Thermomigration". Journal of the Mechanics and Physics of Solids, marzo de 2023, 105256. http://dx.doi.org/10.1016/j.jmps.2023.105256.
Texto completoChen, Liang, Sheldon X. D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang y Junfa Mao. "A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multi-Segment Interconnects". IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2020, 1. http://dx.doi.org/10.1109/tcad.2020.2994271.
Texto completo"Abstracts: General References: Diffusion Processes, Electromigration, Thermomigration, Point Defects, Linear Defects, Planar Defects, Irradiation Effects, Ionic Conduction". Defect and Diffusion Forum 51-52 (enero de 1987): 275–310. http://dx.doi.org/10.4028/www.scientific.net/ddf.51-52.275.
Texto completo"General References, Diffusion Processes, Electromigration, Thermomigration, Point Deffects, Linear Defects, Planar Defects, Irradiation Effects and Ionic Conduction". Defect and Diffusion Forum 61 (enero de 1988): 189–232. http://dx.doi.org/10.4028/www.scientific.net/ddf.61.189.
Texto completo"General References, Diffusion Processes, Electromigration, Thermomigration, Point Defects, Linear Effects, Planar Defects, Irradiation Effects and Ionic Conduction". Defect and Diffusion Forum 64-65 (enero de 1989): 321–58. http://dx.doi.org/10.4028/www.scientific.net/ddf.64-65.321.
Texto completo"General References, Diffusion Processes, Electromigration, Thermomigration, Point Defects, Linear Defects, Planar Defects, Irradiation Effects and Ionic Conduction". Defect and Diffusion Forum 72-73 (enero de 1990): 265–88. http://dx.doi.org/10.4028/www.scientific.net/ddf.72-73.265.
Texto completoSemenov, A. S., J. Trapp, M. Nöthe, B. Kieback y T. Wallmersperger. "Multi‐physics simulation and experimental investigation of the densification of metals by spark plasma sintering". Advanced Engineering Materials, 9 de agosto de 2023. http://dx.doi.org/10.1002/adem.202300764.
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