Tesis sobre el tema "Diélectriques à Haut k"
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Alemany, y. Palmer Mathias. "Caractérisation de lacunes d’oxygène dans les diélectriques à haute permittivité à destination des transistors « High-k Metal Gate »". Thesis, Orléans, 2017. http://www.theses.fr/2017ORLE2049/document.
Texto completoThe presence of oxygen vacancies in high-k oxides is fore seen to have detrimental effects in high-kmetal gate MOS transistors. To validate this hypothesis, we investigate the possibility of using electron energy loss spectroscopy in an electron transmission microscope (EELS) and the cathodoluminescence(CL) calibrated by the positron annihilation spectroscopy (PAS) to analyze these defects in thin HfO2 layers.To develop this methodology, HfO2 films have been deposited both by ALD and PVD on silicon substrates. To make the samples adapted to the PAS depth resolution, the layers thicknesses (10 to100 nm) are higher than those used in microelectronics. According to XRD, RBS/NRA, MEB, TEM results, these layers present a complex structure and a large excess of oxygen.PAS results depend both on the deposition technique and on the heat treatment. They evidence the presence of electric fields in the oxide layer or at the interface with the substrate. Electrical measurements in the thinnest layers, confirm the presence of charges in the oxide layer as already mentioned in the literature. The sign of these charges changes with heat treatment and is in agreement with the PAS results.EELS improved data acquisition has been developed. The EELS and CL spectra have been analyzed using a systematic methodology allowing to extracting characteristic parameters. They depend on the deposition technique and the heat treatment. However, due to the poor quality of the layers, it has not been possible to isolate the effects of the stoichiometry. This work opens many perspectives to improve knowledge on phenomena occurring in devices
Garcia, Ramirez Emmanuel Armando. "Etude et optimisation de matériaux diélectriques et électrodes déposés par ALD pour structures nano-poreuses". Electronic Thesis or Diss., Normandie, 2024. http://www.theses.fr/2024NORMC226.
Texto completoThis research investigates the use of hafnium oxide (HfO2)-based thin films in nanocapacitors, focusing on both their linear and non-linear electrical properties to meet the growing demands of high-performance and miniaturized electronic devices. Starting with the fundamental physics of energy storage capacitors, the investigation highlights the essential characteristics of effective dielectric materials, such as a high dielectric constant and a substantial band gap. Hafnium-based materials are particularly promising due to their compatibility with Atomic Layer Deposition (ALD), which allows for precise and uniform thin-film deposition—crucial for ensuring reliable performance in electronic devices.To understand the potential of these materials, various fabrication and characterization techniques were employed. This includes specific deposition processes to create the thin films and morphological tests to study the physical structure of the capacitors. Electrical testing plays a key role in evaluating critical parameters like dielectric constant, breakdown voltage, and overall energy storage capacity. By analyzing these factors, a comprehensive view of how both linear and non-linear hafnium-based dielectrics perform is provided.When exploring linear, amorphous hafnium-based dielectrics, HfO2 is combined with aluminum oxide and silicon dioxide to enhance dielectric properties. Different configurations, such as nanolaminates and solid solutions, are tested to find the optimal balance. The goal is to achieve materials that maintain a high dielectric constant and resist voltage breakdown, thereby improving their ability to store energy efficiently. On the other hand, a detailed look into non-linear, crystalline dielectrics examines the effects of doping hafnium oxide with elements like zirconia and silicon. Different deposition and annealing temperatures are assessed for their impact on crystalline structure and polarization behavior, revealing complex ferroelectric and antiferroelectric behaviors that could offer high energy density and stability.The findings suggest that while ferroelectric materials might not be suitable for applications requiring linear capacitance due to their sensitivity to voltage variations, antiferroelectric materials show promise. However, they still face challenges related to electrical efficiency and thermal management. Finding materials that can effectively stabilize voltage variations is crucial, as capacitors are increasingly used to manage these fluctuations in modern electronics.A significant challenge identified is the variability in the dielectric constant, which can limit the use of these materials in applications demanding stable capacitance, such as signal filtering. To address this issue, solid solutions and laminated materials, which provide consistent linear capacitance, are prioritized. Although these materials are effective up to a certain permittivity threshold, exploring non-linear phases opens the door to potentially higher performance under specific conditions.In summary, understanding of HfO2-based thin films and their role in nanocapacitors is advanced by this research. By examining both linear and non-linear dielectric materials, insights into how to optimize fabrication techniques and material compositions to improve dielectric properties are provided. Ongoing research into issues like material endurance, electrical efficiency, and thermal management is essential for developing reliable and high-performing capacitors that meet the evolving demands of modern electronic technologies
Charbonnier, Matthieu. "Etude du travail de sortie pour les empilements nanométriques diélectrique haute permittivité / grille métallique". Grenoble INPG, 2010. http://www.theses.fr/2010INPG0016.
Texto completoIn this PhD report, we study the variations of the effective metal work function in High-k metal gate devices. To perform this analyse, we have firstly studied and developed electrical characterisation techniques and especially the analyse of the capacitive response of MOS structure and the measurement of the internal photo-emission current. These methods have allowed us isolating the different components influencing the effective metal gate work function. Using these methods, we have demonstrated that these variation mostly originate from a dipole at the High-k / SiO2 interface. Moreover, we have evidenced a reduction of effective work function for P type metal gates. This phenomenon also originate from a dipole at the same interface. Finally, we have studied the influence of fabrication processes on this dipole and, more genarally, on the effective metal gate work function
Fuinel, Cécile. "Étude des potentialités de la transduction diélectrique de haute permittivité pour les résonateurs NEMS et MEMS". Thesis, Toulouse 3, 2018. http://www.theses.fr/2018TOU30302/document.
Texto completoSince two decades now, microscopic electronic devices including moving parts, called MicroElectroMechanical Systems (MEMS) have had a growing impact on industry and daily lives. Their range of application is already wide: from actuators (inkjet print heads, digital cinema projectors, etc.) to mechanical sensors (microphones, accelerometers, etc.). There is a growing research effort in the biosensing field as well. One of the main challenges for this application is to integrate a miniaturized and robust element to a vibrating beam-like structure, in order to achieve electromechanical actuation and detection, i.e. to convert an electrical signal into vibration and vice versa. In this work, we studied the integration of three dielectric materials on silicon microcantilevers, and successfully demonstrated the feasibility of simultaneous flexural actuation and detection of the structures by mean of dielectric transduction. Those results are one step forward the elaboration of mature detection systems
Baudot, Sylvain. "Elaboration et caractérisation des grilles métalliques pour les technologiesCMOS 32 / 28 nm à base de diélectrique haute permittivité". Thesis, Grenoble, 2012. http://www.theses.fr/2012GRENT122/document.
Texto completoThis thesis is about the manufacturing and the characterization of TiN, aluminum and lanthanum metal gate for high-k based 32/28nm CMOS technologies. The effect of metal gate layer thickness and composition has been characterized on 32/28nm technology parameters. These results have been related to a change in the TiN vacuum work function, to Al- and La- induced dipoles at the HfSiON/SiON interface or their lowering on thin SiON (roll-off). We have shown that metallic aluminum introduced in the TiN metal gate causes a work function lowering, opposed to the weak Al-induced dipole. We have evaluated the roll-off influence for theses different metals. For the first time we report the strong roll-off dependence with the deposited lanthanum thickness. Newly developed TiN, Al, La deposition processes have brought benefits for the CMOS 32/28nm technology
Ihara, Kou. "Οptimizing οf metal-insulatοr-metal capacitοrs perfοrmances by atοmic layer depοsitiοn : advancing prοductiοn efficiency and thrοughput". Electronic Thesis or Diss., Normandie, 2024. http://www.theses.fr/2024NORMC218.
Texto completoAs semiconductor technology progresses, the need to overcome the limitations of shrinking device sizes is considered paramount. While Moore’s law has guided this evolution over the past five decades, the constraints of the active components are now obvious as manufacturing processes approach the atomic scale. More Than Moore's approach has emerged to address this, emphasizing the integration and miniaturization of heterogeneous chips to enable the stacking of diverse system functionalities. However, integrating passive components poses significant challenges due to their production via disparate processes. Addressing this challenge, Murata Integrated Passive Solutions invented the Passive Integrated Connecting Substrate (PICS) technology, facilitating the integration of silicon-based passive components into 3D structures. The latest iteration, PICS5, leverages an anodic aluminum oxide template and Metal-Insulator-Metal stack deposition via atomic layer deposition. This thesis contributed to the ongoing refinement of PICS5 technology by enhancing the properties of 3D capacitors and exploring the potential of high-k dielectric materials (Nb2O5). This research aimed to optimize component performance and anticipate future challenges in semiconductor innovation by clarifying the nuances of thin film deposition processes and ALD equipment conditions
Bêche, Elodie. "Etude des collages directs hydrophiles mettant en jeu des couches diélectriques". Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAY064/document.
Texto completoDirect wafer bonding refers to the spontaneous establishment of attractive forces between two surfaces at ambient temperature without any additional polymer material. Available at ambient pressure or under vacuum, this technology is attractive for monocrystal-amorphous stacks, perfectly illustrated by SOI (Silicon On Insulator) substrate elaboration widely used nowadays in microelectronics or microtechnologies. Electronic device performance and multidisciplinarity needs require this technology on many different materials. In this context, a precis understanding of bonding mechanism is paramount. The aim of this work is to study the hydrophilic bonding mechanisms for alumina, nitride silicon and ultra-low k thin films.In this study, hydrophilic bonding of deposited dielectric films prepared by chemical treatment were analyzed as function of post-bonding annealing temperature. Chemical and mechanical bonding interface closure has been analyzed from mechanical and chemical point of view via several characterization techniques: anhydrous bonding energy measurement, acoustic microscopy, X-Ray reflectivity and infrared spectroscopy. Each material demonstrates interesting behaviors embedded at the bonding interface compared to the deposited film free surfaces. Throughout the studies, correlations between bonding and free surface evolution have led to their bonding mecanisms and some recommendations for efficient and high quality bonding elaboration
Chery, Emmanuel. "Fiabilité des diélectriques low-k SiOCH poreux dans les interconnexions CMOS avancées". Phd thesis, Université de Grenoble, 2014. http://tel.archives-ouvertes.fr/tel-01063862.
Texto completoFavennec, Laurent. "Développement de matériaux diélectriques pour les interconnexions des circuits intégrés a-SiOC:H poreux "Ultra Low K" et a-SiC:H "Low K"". Montpellier 2, 2005. http://www.theses.fr/2005MON20160.
Texto completoGarnell, Emil. "Dielectric elastomer loudspeakers : models, experiments and optimization". Thesis, Institut polytechnique de Paris, 2020. http://www.theses.fr/2020IPPAE007.
Texto completoDielectric elastomers are soft active materials capable of large deformations when activated by a high voltage. They consist of a thin elastomer membrane (generally made of silicone or acrylic), sandwiched between compliant electrodes. The thickness of the assembly is about 100 microns. When a high voltage is applied between the electrodes, the membrane is squeezed between the electrodes, and increases in area by up to 100%.This electromechanical conversion principle can be used to build loudspeakers. Prototypes have been developed and tested by several research groups, and models have been proposed to estimate their performance.An intrinsic characteristic of dielectric elastomer loudspeakers is their multi-physic nature. Indeed, the actuation mechanism is itself a coupling between electrostatics and mechanics; the membrane is very thin and light, and couples therefore strongly with the surrounding air which is comparatively heavy; and finally the electrode electrical resistivity induces a coupling between electrodynamics and mechanics.The models proposed so far did not consider all of these couplings together, which limited their use to qualitative estimations. In this thesis, a multi-physic model of dielectric elastomer loudspeakers is set-up, in order to optimize their acoustic performances, in terms of frequency response, radiated level, and directivity. The strong couplings between electrostatics, membrane dynamics, acoustics and electrodynamics are studied with a finite element model in FreeFEM. This model is validated by dynamical and acoustical measurements, and then used to improve the performances of the prototype, by working on several levels: optimisation of the excitation, filtering, damping and control
Lépinay, Matthieu J. "Impact des chimies de nettoyage et des traitements plasma sur les matériaux diélectriques à basse permittivité". Thesis, Montpellier 2, 2014. http://www.theses.fr/2014MON20097/document.
Texto completoWe report in this work the impact of the manufacturing process of an integrated circuit (28 nm technology node) on the porous dielectric material used to isolate the interconnections of the transistors. Our study focuses in particular on the diffusion of species (cleaning chemistries, water/moisture, gas molecules) in the porous network. To decorrelate "chemical" effects of affinity between the molecules and the surface and "physical" effects due to pore size, several complementary techniques are used for further characterization. Chemical changes are first characterized at the surface by XPS and drop contact angle. FTIR is then used to probe the whole thickness of the layer and the ToF-SIMS to obtain a depth profiled characterization. A microstructure analysis by solid-state NMR enables to highlight the changes in cross-linking of the silicon skeleton. A porosimetric study by EP, PALS and GISAXS reveals inconsistencies between these techniques based on the adsorption of gases on the one hand, and X-ray scattering and positron annihilation of the other. Numerical modeling of gas adsorption isotherms enables us to consider interactions probe surface and reconcile the results. Thus we measured an increase of the pore size by plasma etching, and a decrease in pore size after HF cleaning, which correspond to the characterized chemical changes in terms of size of the functional groups. Finally, these characterization techniques show that silylation treatments can effectively restore the dielectric and physico-chemical properties of low-k materials
Verriere, Virginie. "Analyse électrique de diélectriques SiOCH poreux pour évaluer la fiabilité des interconnexions avancées". Phd thesis, Université de Grenoble, 2011. http://tel.archives-ouvertes.fr/tel-00593515.
Texto completoBuckley, Julien. "Etude de mémoires flash intégrant des diélectriques high-k en tant qu'oxyde tunnel ou couche de stockage". Grenoble INPG, 2006. http://www.theses.fr/2006INPG0173.
Texto completoFlash memory is today indispensable in order to pursue the development of portable electronics, which is facing an unpreceded success (cell phones, digital photos, PDA, USB sticks. 00)' ln order to maintain it for the years to come, it is necessary to continue improving this technology. It is within this context that the work of this PhD was carried out. The following two fields of investigation were developped : the study of high-k as Flash memory tunnel dielectric and the evaluation of Hf-based materials as charge storage layers. According to our results, the first solution would need an improvement of mate rial conduction and trapping properties, by lowering their defects, through future process optimizations. We have nonetheless established criteria allowing to choose among several different candidates, the ones for which it seems worthwhile to conduct further research. The second solution allowed us to evidence the very good properties of Hf 02 as a storage layer. This materialleeds to very good retention properties with a low temperature activation and seems highly promising for NROM-type applications. Shockley Read Hall modeling was also used in order to explain some of the results
Chatenet, Christophe. "Etude de dispositifs rayonnants millimétriques à lentilles diélectriques alimentées par des antennes imprimées : Application à la réalisation de systèmes de télécommunication haut débit". Limoges, 1999. http://www.theses.fr/1999LIMO0013.
Texto completoLontsi, Fomena Mireille. "Etude théorique de la diffusion de l’oxygène dans des oxydes diélectriques". Thesis, Bordeaux 1, 2008. http://www.theses.fr/2008BOR13703/document.
Texto completoThe miniaturization of CMOS (Complementary Metal Oxide Semiconductor) components requires the use of high dielectric permittivity materials as gate oxide. LaAlO3 and SrTiO3 are among the best candidates, but the oxygen diffusion in these materials leads to the degradation of both the electrical properties and the interface with silicon. In this context, the aim of this theoretical work is to study the factors governing the oxygen ion diffusion at the chemical bonding scale. This approach is based on Density Functional Theory (DFT), coupled with electron density analysis methods, and the pioneering development of energy density cards. The regions of the electron density contributing to the diffusion barrier have been identified allowing new routes of optimization of these materials across the chemical bonding
Gravil, Jean-Louis. "Contribution à l'étude des propriétés basse température des composés à base de K Ta O3 par mesures thermiques et diélectriques". Grenoble 1, 1991. http://www.theses.fr/1991GRE10079.
Texto completoMonnier, Denis. "Étude des dépôts par plasma ALD de diélectriques à forte permittivité diélectrique (dits "High-k") pour les applications capacités MIM". Grenoble INPG, 2010. http://www.theses.fr/2010INPG0036.
Texto completoThe continuous decreasing size of integrated circuits in the field of microelectronics is now applied to passive components such as MIM (Metal/Insulator/Metal) capacitors. To increase the capacitance density of MIM capacitors, new materials with high permittivity are required to replace silica (Si02, E = 3. 9). Zr02 permittivity is around 47 for the tetragonal phase. Zr02 is deposited by PEALD. We studied the Zr02 deposition method with TEMAZ and ZyALD precursors. Thermodynamic properties of TEMAZ have been analyzed by Knudsen cell mass spectrometry. PEALD process parameters and post-treatments influence on the tetragonal zirconia synthesis have been investigated. Various characterisation methods (XRD, Raman spectroscopy, TEM, SIMS, XPS, electrical characterisation) were employed to establish an optimum between Zr02 films properties and deposition process performance
LAPERGUE, THIERRY. "Conception de circuits hyperfrequences en technologie monolithique (mmic) pour chaines de modulation haut debit en bande k". Toulouse 3, 1999. http://www.theses.fr/1999TOU30160.
Texto completoBrunet, Laurent. "Caractérisation électrique et fiabilité des transistors intégrant des diélectriques High-k et des grilles métalliques pour les technologies FDSOI sub-32nm". Phd thesis, Aix-Marseille Université, 2012. http://tel.archives-ouvertes.fr/tel-00847881.
Texto completoCoulon, Pierre-Eugène. "Films minces d'oxydes à grande permittivité pour la nanoélectronique : organisation structurale et chimique et propriétés diélectriques". Toulouse 3, 2009. http://thesesups.ups-tlse.fr/514/.
Texto completoDespite the considerable research work devoted since ten years to the study of new high permittivity (kappa) thin films for replacing silica in microelectronics, the relationships that exist between the structural/chemical and electrical properties of the films are not widely studied today. Thin Zr- and La-based oxide films, prepared by atomic layer deposition on silicon and/or germanium, are considered in this work. Quantitative parameters in relation with the organization at the nanometre level in the films and at the interfaces, determined by high resolution transmission electron microscopy (HRTEM) and electron energy-loss spectroscopy (EELS) operated on a modern electron microscope, are directly connected to electrical parameters such as kappa and Dit (interface state density). After annealing under vacuum, the La2O3 sesquioxide can be obtained with its high permittivity hexagonal phase (kappa ~ 27) but is not stable. It is hygroscopic and forms with the silicon substrate an extended amorphous interfacial layer silicate in composition. The LaxZr1-xO2-delta (x = 0. 2) ternary oxide is not hygroscopic. On a silicon substrate and with x ~ 0. 2, it is stabilized in the cubic structure (kappa ~ 30) with annealing and forms a silica-rich interfacial layer with a spatial extension limited to 1-2 nanometres. On a germanium substrate and with x ~ 0. 05, the ternary is stabilized with the high permittivity tetragonal structure (kappa ~ 40) due to germanium diffusion within the film and develops in direct contact with the substrate. Lanthanum is essentially present near the interface and forms a germanate that lowers the Dit. This work has been developed in line with the European program REALISE
Ceballos, Sanchez Oscar. "Stabilité thermique de structures de type TiN/ZrO2/InGaAs". Thesis, Université Grenoble Alpes (ComUE), 2015. http://www.theses.fr/2015GREAY027/document.
Texto completoIII-V compound semiconductors, in particular InGaAs, are considered attractivealternative channel materials to replace Si in complementary metal-oxidesemiconductor(MOS) devices. Its high mobility and tunable band gap, requirementsfor high performance device design, have placed InGaAs as a promising candidate.However, the interfacial thermal stability and chemistry of high-k dielectrics on InGaAsis far more complex than those on Si. While most studies are focused on variouspassivation methods, such as the growth of interfacial passivation layers (Si, Ge, andSi/Ge) and/or chemical treatments to improve the quality of high-k/InGaAs interface,phenomena such as the out-diffusion of atomic species from the substrate as aconsequence of the thermal treatments have not been carefully studied. The thermaltreatments, which are related with integration processes of source and drain (S/D),lead to structural changes that degrade the electrical performance of the MOS device.A proper characterization of the structural alterations associated with the out-diffusionof elements from the substrate is important for understanding failure mechanisms. Inthis work it is presented an analysis of the structure and thermal stability ofTiN/ZrO2/InGaAs stacks by angle-resolved x-ray photoelectron spectroscopy (ARXPS).Through a non-destructive analysis method, it was possible to observe subtle effectssuch as the diffusion of substrate atomic species through the dielectric layer as aconsequence of thermal annealing. The knowledge of the film structure allowed forassessing the In and Ga depth profiles by means of the scenarios-method. For the asdeposited sample, In-O and Ga-O are located at the oxide-semiconductor interface. Byassuming different scenarios for their distribution, it was quantitatively shown thatannealing causes the diffusion of In and Ga up to the TiO2 layer. For the sampleannealed at 500 °C, only the diffusion of indium was clearly observed, while for thesample annealed at 700 °C the diffusion of both In and Ga to the TiO2 layer wasevident. The quantitative analysis showed smaller diffusion of gallium (~ 0.12 ML) thanof indium (~ 0.26 ML) at 700 °C/10 s. Since the quantification was done at differenttemperatures, it was possible to obtain an approximate value of the activation energyfor the diffusion of indium through zirconia. The value resulted to be very similar topreviously reported values for indium diffusion through alumina and through hafnia.~ vi ~Complementary techniques as high resolution transmission electron microscopy (HRTEM),energy dispersive x-ray spectroscopy (EDX) and time of flight secondary ion massspectrometry (TOF-SIMS) were used to complement the results obtained with ARXPS.Specially, TOF-SIMS highlighted the phenomenon of diffusion of the substrate atomicspecies to the surface
Compuestos semiconductores III-V, en particular InxGa1-xAs, son consideradosmateriales atractivos para reemplazar el silicio en estructuras metal-oxidosemiconductor(MOS). Su alta movilidad y flexible ancho de banda, requisitos para eldiseño de dispositivos de alto rendimiento, han colocado al InxGa1-xAs como uncandidato prometedor. Sin embargo, la estabilidad térmica en la interfazdieléctrico/InxGa1-xAs es mucho más compleja que aquella formada en la estructuraSiO2/Si. Mientras que la mayoría de los estudios se centran en diversos métodos depasivación tales como el crecimiento de las capas intermedias (Si, Ge y Si/Ge) y/otratamientos químicos para mejorar la calidad de la interfaz, fenómenos como ladifusión de las especies atómicas del sustrato como consecuencia del recocido no hansido cuidadosamente estudiados. Los tratamientos térmicos, los cuales estánrelacionados con los procesos de integración de la fuente y el drenador (S/D) en undispositivo MOSFET, conducen a cambios estructurales que degradan el rendimientoeléctrico de un dispositivo MOS. Una caracterización apropiada de las alteracionesestructurales asociadas con la difusión de los elementos del substrato hacia las capassuperiores es importante para entender cuáles son los mecanismos de falla en undispositivo MOS. En este trabajo se presenta un análisis de la estructura y laestabilidad térmica de la estructura TiN/ZrO2/InGaAs por la espectroscopía defotoelectrones por rayos X con resolución angular (ARXPS). A través de un método deanálisis no destructivo, fue posible observar efectos sutiles tales como la difusión delas especies atómicas del sustrato a través del dieléctrico como consecuencia delrecocido. El conocimiento detallado de la estructura permitió evaluar los perfiles deprofundidad para las componentes de In-O y Ga-O por medio del método deescenarios. Para la muestra en estado como se depositó, las componentes de In-O yGa-O fueron localizadas en la interfaz óxido-semiconductor. Después del recocido, semuestra cuantitativamente que éste causa la difusión de átomos de In y Ga hacia a lascapas superiores. Asumiendo diferentes escenarios para su distribución, se muestraque el recocido provoca la difusión de In y Ga hasta la capa de TiO2. Para la muestrarecocida a 500 °C, se observó claramente la difusión de indio, mientras que para lamuestra recocida a 700 °C tanto In y Ga difunden a la capa de TiO2. El análisis~ iv ~cuantitativo mostró que existe menor difusión de átomos de galio (0.12 ML) que deindio (0.26 ML) a 700 °C/10 s. Puesto que el análisis sobre la cantidad de materialdifundido se realizó a diferentes temperaturas, fue posible obtener un valoraproximado para la energía de activación del indio a través del ZrO2. El valor resultóser muy similar a los valores reportados previamente para la difusión de indio a travésde Al2O3 y a través de HfO2. Con el fin de correlacionar los resultados obtenidos porARXPS, se emplearon técnicas complementarias como la microscopía electrónica detransmisión (TEM), la espectroscopía de energía dispersiva (EDX) y la espectrometríade masas de iones secundarios por tiempo de vuelo (SIMS-TOF). Particularmente, TOFSIMSdestacó el fenómeno de difusión de las especies atómicas sustrato hacia lasuperficie
Devesa, Canicoba Noelia. "Development and characterization of perovskite based devices : field effect transistors and solar cells". Thesis, Rennes 1, 2018. http://www.theses.fr/2018REN1S117.
Texto completoThe objective of this thesis was the study of electronic devices based on hybrid perovskites. In this context we have developed and produce field effect transistors (FETs) and solar cells based on hybrid perovskite material. In the case of transistors, using thin layers of highly crystallized hybrid perovskites we have made ambipolar transistors operating at room temperature and having low hysteresis, high transconductance (for this type of material) and a ratio of Ion / Ioff > 104. In the context of this thesis, the use of several dielectrics allowed us to obtain a high modulation of the channel conductance with relatively low gate voltages (4-6V). Hafnium oxide with relative permittivity er = 23.5 showed very good performances and a very good compatibility for the hybrid perovskite growth. After several polarization steps the devices exhibited stabilized operation and were measured in consecutive cycles for 14 hours with small change in their performance. We have shown that the increase of the electric field allowed the formation of a hole channel at the interface. The successive polarization of HfO2 / perovskite-based devices led to the creation of a second electron current and demonstrated a final ambipolar device. All the devices presented a hysteresis with amplitude sometimes not negligible. This demonstrated the presence of mobile ion charges at the interfaces that influence the output currents of the device. In the last part of the thesis we focused our work in hybrid perovskite growth for the production of solar cells. We have studied two growth conditions: conditions under normal air (relative humidity> 60%) and nitrogen atmosphere in glove boxes (relative humidity <0.1 ppm). By these two paths we obtained photovoltaic conversion efficiencies of 5% and 8% respectively
Pradas, Fernández David. "Conception et méthodologie cross-layer pour les réseaux satellite à haut débit". Toulouse, ISAE, 2011. http://www.theses.fr/2011ESAE0013.
Texto completoBertaud, Thomas. "Élaboration et caractérisation large bande de matériaux « high-K » en structure « MIM »". Phd thesis, Grenoble INPG, 2010. http://www.theses.fr/2010INPG0099.
Texto completoTo improve the electrical performances of integrated circuits (integration density, speed and reliability), high permittivity materials are introduced in passive components, including "Metal-Insulator-Metal" (MIM) capacitors. Many dielectrics, with a permittivity ranging from mean (SixNy, Ta2O5, HfO2, ZrO2) to very high (perovskites SrTiO3 and BaTiO3) through the alloy of several elements (HfTiO, TiTaO or Pb(ZrxTi1-x)O3) are widely studied as promising candidates. These components and materials are designed to operate at frequencies higher and higher, up to several gigahertz. The dielectric complex permittivity Er (real permittivity E'r and losses E''r) may vary with frequency: relaxation and resonances phenomena may occur. The characterization of these materials and the performances evaluation of components integrating these dielectrics become necessary over a wide frequency band. This thesis aims to obtain the electrical characteristics of dielectrics over a wide frequency band, from DC to several tens of gigahertz, in an in-situ configuration, i. E. In thin films and with the same processes of integration of the final MIM component. For this, a generic tool, from the development of the technology necessary to realize test structures to the high frequency extraction procedures of the material properties, has been developed, validated through SixNy and then applied to some dielectrics: AlN [1], TiTaO [2], HfO2 and ZrO2 [3,4]. [1] T. Bertaud et al. , Microelectron. Eng. 88, 564 (2011). [2] T. Bertaud et al. , J. Appl. Phys. 110, 044110 (2011). [3] T. Bertaud et al. , IEEE Electr. Device L. 31 (2), 114 (2010). [4] T. Bertaud et al. , IEEE T. Compon. Pack. 2 (3), 502 (2012)
Vo, Thu Trang. "Caractérisation hyperfréquence et in-situ de diélectriques à permittivité élevée en vue de leur intégration dans des composants passifs en microélectronique avancée". Chambéry, 2009. http://www.theses.fr/2009CHAMS007.
Texto completoDielectrics play an important role in the operation of microelectronic devices. They are omnipresent as dielectric barriers, inter metal insulator between interconnects, dielectric gate for MOS transistors or insulator for passive devices and especially MIM capacitors. The integration of passive devices in microchips is a developed trend because it extends the race to miniaturization and cost reduction. However, this tendency must ensure that the performance of the electrical devices is always better especially at higher frequencies. To meet these requirements, it exists a trend of replacing the ordinary low-k dielectric by the novel medium-k (εr between 5 and 40) or high-k (εr>40). Nevertheless, the thin dielectric films are expected to exhibit different properties, due to the fabrication processes. As a result, it is crucial to characterize them in their real working configurations and for a large frequency bandwidth of the aimed application. This work presents an in-situ and high frequency characterization method to extract the complex permittivity of the medium-k and high-k dielectrics. It is valid for a large frequency bandwidth, from several megahertz to several gigahertzes. Many configurations of test structures are studied in order to optimize the accuracy of this large bandwidth extraction. They are classified in two families : structures using propagation phenomenon and capacitive lumped structures. Each one is then divided in many categories that fit for different dielectric fabrication processes. Many materials are studied : from medium-k such as HfO2 and ZrO2 to high-k such as SrTiO3 and PbZrTiO3. Their thicknesses vary in a wide range from tens to hundreds of nanometres. High frequency calibration and optimization techniques are proposed for an accurate extraction of dielectric losses. An important part of this work is the high frequency characterization of the permittivity as a function of temperature and applied DC electrical field which could help to reveal and explain many observed physical phenomena. Regarding to the application aspect, this study is promising especially for tunable components
Gourhant, Olivier. "Elaboration et caractérisation de matériaux à très faible constante diélectrique de type a-SiOCH élaborés par PECVD : application aux interconnexions des circuits intégrés". Grenoble 1, 2008. http://www.theses.fr/2008GRE10275.
Texto completoThe enhancement of integrated circuits performances needs the development of new materials, like ultra low permittivity dielectrics, called Ultra Low-K (K<=2,5). This study focus on porous SiOCH thin films elaborated by PECVD via a "porogen" approach. This approach consists in the deposition of a SiOCH matrix containing organics inclusions which are removed afterwards, via a post-treatment, to create porosity. The first part of this study shows that the porogen approach extension has led to materials having a dielectric constant of 2. 25 by using an industrial process with a UV assisted thermal curing as post-treatment. Some of these materials have been integrated in demonstrators. In the second part of this study, elaboration process impact on chemical structure has been analysed to better understand mechanical behaviour of these materials. Finally, a characterization method has been set up to measure the different contributions to the dielectric constant (electronic, ionic and dipolar). Then, the evolution of these contributions as a function of the elaboration parameters has been studied
Blaurock, Joachim [Verfasser], K. L. [Gutachter] Resch, M. [Gutachter] Pohl y R. [Gutachter] Brenke. "Durchblutungsänderungen von Haut und Nasenschleimhaut durch Konditionierung mittels verschiedener gewohnheitsmäßiger hydrotherapeutischer Maßnahmen / Joachim Blaurock ; Gutachter: K.-L. Resch, M. Pohl, R. Brenke". Berlin : Humboldt-Universität zu Berlin, 2006. http://d-nb.info/1208079778/34.
Texto completoEl, Hajjam Khalil. "Ingénierie de jonctions tunnel pour améliorer les performances du transistor mono-électronique métallique". Thèse, Université de Sherbrooke, 2016. http://hdl.handle.net/11143/8508.
Texto completoAbstract: Today, several technological barriers and physical limitations arise against the miniaturization of the CMOS: leakage current, short channel effects, hot carrier effect and the reliability of the gate oxide. The single electron transistor (SET) is one of the emerging components most capable of replacing CMOS technology or provide it with complementary technology. The work of this thesis deals with the improvement of the electrical characteristics of the single electron transistor by optimizing its tunnel junctions. This optimization initially starts with a study of conduction modes through the tunnel junction. It concludes with the development of an optimized tunnel junction based on a stack of dielectric materials (mainly Al[subscript 2]O[subscript 3], H[florin]O[subscript 2] and TiO[subscript 2]), having different properties in terms of barrier heights and relative permittivities. This document, therefore, presents the theoretical formulation of the SET’s requirements and of its tunnel junctions, the development of appropriate simulation tools - based on the transmission matrix model- for the simulation of the SET tunnel junctions current, the identification of tunnel junctions optimization strategies from the simulations results and finally the experimental study and technological integration of the optimized tunnel junctions into the metallic SET fabrication process using the atomic layer deposition (ALD) technique. This work allowed to démonstrate the significance of SET tunnel junctions engineering in order to increase its operating current while reducing leakage and improving its operation at higher temperatures.
Hajjam, Khalil El. "Ingénierie de jonctions tunnel pour améliorer les performances du transistor mono-électronique métallique". Thesis, Lyon, INSA, 2015. http://www.theses.fr/2015ISAL0111/document.
Texto completoToday, several technological barriers and physical limitations arise against the miniaturization of the CMOS: leakage current, short channel effects, hot carrier effect and the reliability of the gate oxide. The single electron transistor (SET) is one of the emerging components most capable of replacing CMOS technology or provide it with complementary technology. The work of this thesis deals with the improvement of the electrical characteristics of the single electron transistor by optimizing its tunnel junctions. This optimization initially starts with a study of conduction modes through the tunnel junction. It concludes with the development of an optimized tunnel junction based on a stack of dielectric materials (mainly Al2O3, HfO2 and TiO2), having different properties in terms of barrier heights and relative permittivities. This document, therefore, presents the theoretical formulation of the SET’s requirements and of its tunnel junctions, the development of appropriate simulation tools - based on the transmission matrix model- for the simulation of the SET tunnel junctions current, the identification of tunnel junctions optimization strategies from the simulations results and finally the experimental study and technological integration of the optimized tunnel junctions into the metallic SET fabrication process using the atomic layer deposition (ALD) technique. This work allowed to demonstrate the significance of SET tunnel junctions engineering in order to increase its operating current while reducing leakage and improving its operation at higher temperatures
Fontaine, Charly. "Analyse par XPS d'empilements High-K Metal Gate de transistors CMOS et corrélation des décalages d'énergie de liaison aux tensions de seuil". Thesis, Université Grenoble Alpes (ComUE), 2019. http://www.theses.fr/2019GREAT011/document.
Texto completoThe last microelectronic technologies includes transistors with materials of high dielectric constant (high-k ) associated to metal gate (we use the abbreviation HKMG for high-k - bad metal). If this pile allows to keep a sufficient quantity of charges in the channel, it is more difficult to check the threshold voltage of transistors because of the presence of charge and of dipole in these layers or in the interfaces. Two preliminary studies established that there is a correlation between the binding energies measured by XPS of a pile HKMG and the threshold voltage of a transistor using the same pile. Charges are present in the insulating layers of piles HKMG, leading to a difference of the electrostatic potential within these layers. A modification of the effective workfunction of the metallic electrode of the transistor in s then observed, and in XPS these charges lead t oa variation of the kinetic energy of electrons extracted from the layer. The purpose of this thesis is simulate in a quantitative way the electrostatic impact of this charges and dipôles and to compare this impact with the observation made by XPS as well as with the electric measures of the threshold voltage of transistors. This will then allow to estimate the variation of the threshold voltage of transistors well further in the manufacturing process
Guiraud, Alexandre. "Intégration de matériaux à forte permittivité diélectrique dans les mémoires non volatile avancées". Thesis, Aix-Marseille, 2012. http://www.theses.fr/2012AIXM4763/document.
Texto completoThe work of this thesis is on integration of high dielectric constant materials (High-k) as dielectric interpoly in Flash non volatile memories. The objective is to determine which High-k materials are suitable as interpoly dielectric in place of the ONO stack currently used. A range of High-k materials have been studied by electrical characterizations (I-V, C-V, breakdown statistics…) and physical characterizations (TEM, EDX, XPS…) in order to select those with the best properties for an interpoly dielectric. The difficulties in integration of High-k materials in a Flash memory process flow have been taken in account and solutions have been proposed
Bordas, Chloé. "Optimisation technologique de commutateurs MEMS RF à tenue en puissance améliorée : application à l'élaboration d'un synthétiseur d'impédance MEMS en bande K". Toulouse 3, 2008. http://thesesups.ups-tlse.fr/238/.
Texto completoCapacitive RF MicroElectroMechanical System switches present well-known interests in microwave field for a lot of applications (spatial, mobile phone). They may bring tunability to high frequency modules without all the drawbacks of active devices. However numerous problems remain unsolved like dielectric reliability, power handling and fabrication yield which slow down the industrialisation of such components. Efforts have already been done on the design, the dielectric reliability and the technological process. This last-one is not enough improved to obtain functional structures with enhanced performances and reproducibility. The purpose of this thesis work deals with the optimization of the fabrication process of capacitive RF switches with enhanced power handling and their integration in an impedance tuner for K band applications. The first section shows the fabrication process and its principal improvements. Studies on sacrificial layer and releasing method permitted to increase the RF performances and the technological yield. Moreover, new dielectrics have been investigated in order to get better switch life time. The relation between the applied power and the generated temperature is described in the second chapter. Thermal characterizations have been performed to understand the mechanical behaviours under stress. Thanks to infra-red camera, the overheating due to power has been determined. Solutions have been found and studied to absorb or prevent deformations under thermal stress. Finally, all these improvements and studies have been applied to a circuit: an impedance tuner. Its design, fabrication and characterization constitute the final chapter of this manuscript
Bouyssou, Régis. "Traitements plasmas post gravure pour l'intégration des matériaux SiOCH poreux dans les interconnexions en microélectronique". Phd thesis, Grenoble 1, 2009. http://www.theses.fr/2009GRE10277.
Texto completoThe decrease of the integrated circuits size lets to increase the performances and reduce the manufacture costs. However, this shrink causes the preponderance of interconnect delay compared to the transistor commutation time. Despite a high sensibility to plasma exposure, a porous SiOCH dielectric material with a lower k-value is implemented. This work focuses on the development of in situ plasma treatments performed after the etching of the imprint of metallic line into the dielectric material. These treatments, based on reductive, oxidizing and hydrocarbon chemistries, aim to 1) limit the residues formation in the case of a metallic hard mask which can cause yield losses and 2) limit the diffusion of the metallic barrier into the dielectric material. However, these treatments (NH}, O2, CH4, H2) have been optimized so as to not increase the modification induced by the etching step. The characterization of the dielectric material modification, induced by the treatments, at the bottom and the sidewalls of the trenches has been performed using new or optimized te<. . 1miques. Thus, with ail the plasma treatments, a modified layer is observed on both bottom and sidewalls of the trenches with different characteristics (thickness, permeation, surface composition. . . ). The methane based plasma treatment limits the growth of metallic residues without increasing the modification induced by the etching step. This treatment has been implemented in production at STMicroelectronics
Bouyssou, Régis. "Traitements plasmas Post Gravure pour l'intégration des matériaux SiOCH poreux dans les interconnexions en microélectronique". Phd thesis, Université de Grenoble, 2009. http://tel.archives-ouvertes.fr/tel-00679654.
Texto completoRasoloniaina, Alphonse. "Études expérimentales de dispositifs intégrés à base de micro-résonateurs à mode de galerie en verres actifs". Phd thesis, Université Rennes 1, 2014. http://tel.archives-ouvertes.fr/tel-01009345.
Texto completoBenhadjala, Warda. "Fiabilité et miniaturisation des condensateurs pour l'aéronautique : de l'évaluation de composants céramique de puissance à l'étude de nanoparticules hybrides céramique / polymère pour technologies enterrées". Thesis, Bordeaux 1, 2013. http://www.theses.fr/2013BOR15271/document.
Texto completoThe improvement of electronic systems for the deployment of all-electric aircrafts depends on the ability of passive components, such as capacitors, to reduce their volume, weight and cost, and to increase their performance and reliability, particularly in the aeronautical environment. In this context, the objective of this thesis was to study and develop novel capacitor technologies for avionics. In the first part of this work, the evaluation of power ceramic capacitors has been discussed. Indeed, the ceramic technology appeared to be one of the few mature solutions meeting the requirements of OEMs. The characterization, the failure mode, effects and criticality analysis (FMECA) and reliability and robustness assessment of commercial components using original architectures (multi-chip capacitors) have been performed. These results have been completed by a more advanced study on the characterization of new ceramics sintered by spark plasma sintering (SPS). The colossal permittivity of these materials could allow to increase reliability and miniaturization of capacitors while maintaining high values of capacitance and voltage rating. The second part, more fundamental, is devoted to the development of core-shell ceramic/polymer nanoparticles for embedded capacitors operating at radiofrequencies. The synthesis and the physicochemical characterization of the nanocomposites as well as the manufacturing processes of the thick film capacitors are first described. A new broadband electrical characterization methodology has been developed to analyze the dielectric properties and the conduction mechanisms of the nanoparticles. The effects of the temperature and the manufacturing process on the device performance have been investigated. In addition, the durability was evaluated
Monnier, D. "Etude des dépôts par plasma ALD de diélectriques à forte permittivité diélectrique (dits « High-K ») pour les applications capacités MIM". Phd thesis, 2010. http://tel.archives-ouvertes.fr/tel-00520511.
Texto completoBertaud, Thomas. "Élaboration et caractérisation large bande de matériaux "high-k" en structure "MIM"". Phd thesis, 2010. http://tel.archives-ouvertes.fr/tel-00555345.
Texto completoBusani, Tito. "ELABORATION ET CARACTERISATION DE QUELQUES DIELECTRIQUES AFORTE PERMITTIVITE AVEC APPLICATION EN MICROELECTRONIQUE :INFLUENCE DE LA STRUCTURE DU RESEAU SUR LEs PROPRIETESELECTRIQUES". Phd thesis, 2006. http://tel.archives-ouvertes.fr/tel-00173693.
Texto completoLeonard, Jean Marie. "Les filons à micas et tourmalines du Haut Himalaya au Népal central.Témoins des transferts magmatiques entre les migmatites du Haut Himalaya et les granites de type Manaslu". Phd thesis, 1997. http://tel.archives-ouvertes.fr/tel-00642000.
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