Artículos de revistas sobre el tema "Cu-Sn Alloy"
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Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa y Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy". Key Engineering Materials 462-463 (enero de 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.
Texto completoKaneko, Daisuke, Mahoto Takeda, Takanari Nakajima y Naokuni Muramatsu. "The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy". Materials Science Forum 941 (diciembre de 2018): 1282–87. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1282.
Texto completoYamauchi, Akira, Kenta Ida, Masahito Fukuda y Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys". Solid State Phenomena 273 (abril de 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.
Texto completoKong, Zhi Gang y Feng Min Shi. "Effect of Ag on the Sn-Cu Lead-Free Material". Applied Mechanics and Materials 687-691 (noviembre de 2014): 4291–94. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.4291.
Texto completoSomidin, Flora, Stuart D. McDonald y Kazuhiro Nogita. "Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding". Solid State Phenomena 273 (abril de 2018): 14–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.14.
Texto completoAlam, S. N., N. Jindal y N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy". Materials Science-Poland 37, n.º 2 (1 de junio de 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.
Texto completoChen, Yan, Hong Hua Su, Yu Can Fu y Z. C. Guo. "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy". Key Engineering Materials 487 (julio de 2011): 199–203. http://dx.doi.org/10.4028/www.scientific.net/kem.487.199.
Texto completoPi, Zhao Hui, Guang Qiang Li, Yan Ping Xiao, Zhan Zhang, Zhuo Zhao y Yong Xiang Yang. "An Experimental Investigation on the Solubility of Zr in Cu-Sn Alloys". Advanced Materials Research 887-888 (febrero de 2014): 324–28. http://dx.doi.org/10.4028/www.scientific.net/amr.887-888.324.
Texto completoYavuzer, B., D. Özyürek y T. Tunçay. "Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys". Materials Science-Poland 38, n.º 1 (1 de marzo de 2020): 34–40. http://dx.doi.org/10.2478/msp-2020-0025.
Texto completoHan, Duy Le, Yu-An Shen, Fupeng Huo y Hiroshi Nishikawa. "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints". Metals 12, n.º 1 (24 de diciembre de 2021): 33. http://dx.doi.org/10.3390/met12010033.
Texto completoHirunyagird, Jirutthitikalpongsri, Gobboon Lothongkum y Ekasit Nisaratanaporn. "An Improvement in Tarnish and Corrosion Resistance of 94Ag-4Zn-Cu Alloys with Sn Addition". Advanced Materials Research 894 (febrero de 2014): 138–42. http://dx.doi.org/10.4028/www.scientific.net/amr.894.138.
Texto completoYe, Bora y Sunjung Kim. "Formation of Nanocrystalline Surface of Cu–Sn Alloy Foam Electrochemically Produced for Li-Ion Battery Electrode". Journal of Nanoscience and Nanotechnology 15, n.º 10 (1 de octubre de 2015): 8217–21. http://dx.doi.org/10.1166/jnn.2015.11434.
Texto completoQiu, Jialong, Yanzhi Peng, Peng Gao y Caiju Li. "Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model". Materials 14, n.º 9 (30 de abril de 2021): 2335. http://dx.doi.org/10.3390/ma14092335.
Texto completoHaga, Toshio. "Casting of Clad Strip Consisting of Al-Sn Alloy and Pure Aluminum". Materials Science Forum 1007 (agosto de 2020): 23–28. http://dx.doi.org/10.4028/www.scientific.net/msf.1007.23.
Texto completoZhang, Guodong, Junsheng Zhao, Pengfei Wang, Xiaoyu Li, Yudong Liu y Xinyue Fu. "Molecular Dynamics Study on Mechanical Properties of Nanopolycrystalline Cu–Sn Alloy". Materials 14, n.º 24 (16 de diciembre de 2021): 7782. http://dx.doi.org/10.3390/ma14247782.
Texto completoVentura, Tina, Young Hee Cho y Arne K. Dahle. "Solidification Mechanisms in the Sn-Cu-Ni Lead-Free Solder System". Materials Science Forum 654-656 (junio de 2010): 1381–84. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1381.
Texto completoTsurusaki, Tatsuya y Takeshi Ohgai. "Mechanical Properties of Solder-Jointed Copper Rods with Electrodeposited Sn-Zn Alloy Films". Materials 13, n.º 6 (14 de marzo de 2020): 1330. http://dx.doi.org/10.3390/ma13061330.
Texto completoChen, Guohai, Ju Sheng Ma y Zhi Ting Geng. "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy". Materials Science Forum 475-479 (enero de 2005): 1747–50. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.1747.
Texto completoMa, Li, Qiang Hu y Yan Bin Sun. "Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy". Advanced Materials Research 1095 (marzo de 2015): 95–98. http://dx.doi.org/10.4028/www.scientific.net/amr.1095.95.
Texto completoLima, Thiago, Guilherme de Gouveia, Rudimylla da Silva Septimio, Clarissa da Cruz, Bismarck Silva, Crystopher Brito, José Spinelli y Noé Cheung. "Sn-0.5Cu(-x)Al Solder Alloys: Microstructure-Related Aspects and Tensile Properties Responses". Metals 9, n.º 2 (17 de febrero de 2019): 241. http://dx.doi.org/10.3390/met9020241.
Texto completoNakamura, Toshihiro, Tomio Nagayama, Takayo Yamamoto, Yasushi Mizutani y Hidemi Nawafune. "Electrodeposition of CuSn Alloy from Noncyanide Sulfosuccinate Bath". Materials Science Forum 654-656 (junio de 2010): 1912–15. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1912.
Texto completoChen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan y Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature". Materials Science Forum 610-613 (enero de 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.
Texto completoHatta, Takeshi, Atsushi Ishikawa, Takuma Katase y Akihiro Masuda. "Development of Lead Free Plating Chemical for Various Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (1 de enero de 2012): 000944–67. http://dx.doi.org/10.4071/2012dpc-tp22.
Texto completoNishikawa, Hiroshi, Yuki Hirata, Chih-han Yang y Shih-kang Lin. "Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging". JOM 74, n.º 4 (1 de febrero de 2022): 1751–59. http://dx.doi.org/10.1007/s11837-021-05146-3.
Texto completoMelcioiu, Georgiana, Viorel Aurel Şerban, Mark Ashworth, Cosmin Codrean, Marin Liţă y Geoffrey D. Wilcox. "An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry". Solid State Phenomena 216 (agosto de 2014): 91–96. http://dx.doi.org/10.4028/www.scientific.net/ssp.216.91.
Texto completoNassef, Ahmed y Medhat El-Hadek. "Microstructure and Mechanical Behavior of Hot Pressed Cu-Sn Powder Alloys". Advances in Materials Science and Engineering 2016 (2016): 1–10. http://dx.doi.org/10.1155/2016/9796169.
Texto completoXu, Gaolei, Yunqing Zhu, Lijun Peng, Haofeng Xie, Zengde Li, Shuhui Huang, Zhen Yang, Wenjing Zhang y Xujun Mi. "Effect of Sn Addition on Microstructure, Aging Properties and Softening Resistance of Cu-Cr Alloy". Materials 15, n.º 23 (27 de noviembre de 2022): 8441. http://dx.doi.org/10.3390/ma15238441.
Texto completoMadeni, J. C. y S. Liu. "Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds". Soldagem & Inspeção 16, n.º 1 (marzo de 2011): 86–95. http://dx.doi.org/10.1590/s0104-92242011000100011.
Texto completoLee, Dae Hoon, Tae Suk Jang, J. H. Jung, S. S. Hong, E. S. Park, J. W. Lee y B. K. Hahn. "Feasibility of Copper-Base Leadframe Preplated with a Cu-Sn Alloy instead of Ni". Solid State Phenomena 124-126 (junio de 2007): 227–30. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.227.
Texto completoS, Jayesh, Jacob Elias y Manoj Guru. "Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni". International Journal for Simulation and Multidisciplinary Design Optimization 11 (2020): 18. http://dx.doi.org/10.1051/smdo/2020013.
Texto completoIssa, Tarik T., Sadeer M. Majeed y Duha S. Ahmed. "Crystal Structure and Colorimetric Behavior of Low Melting Point Ternary Alloy". Materials Science Forum 1002 (julio de 2020): 12–20. http://dx.doi.org/10.4028/www.scientific.net/msf.1002.12.
Texto completoErvina, Efzan M. N. y S. Y. Tan. "Wettability of Molten Sn-Zn-Bi Solder on Cu Substrate Ervina Efzan". Applied Mechanics and Materials 315 (abril de 2013): 675–80. http://dx.doi.org/10.4028/www.scientific.net/amm.315.675.
Texto completoQu, Xinghong, Hongxue Zeng y Dong Xu. "Preparation and Microstructure Analysis of Continuous Unidirectional Solidification Cu–P–Sn Alloy". Journal of Nanoelectronics and Optoelectronics 16, n.º 11 (1 de noviembre de 2021): 1815–19. http://dx.doi.org/10.1166/jno.2021.3153.
Texto completoSatyanarayan y K. N. Prabhu. "Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses". Materials Science Forum 830-831 (septiembre de 2015): 265–69. http://dx.doi.org/10.4028/www.scientific.net/msf.830-831.265.
Texto completoSoares, D., C. Vilarinho, J. Barbosa, F. Samuel, L. Trigo y P. Bré. "Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates". Journal of Mining and Metallurgy, Section B: Metallurgy 43, n.º 2 (2007): 131–39. http://dx.doi.org/10.2298/jmmb0702131s.
Texto completoSungkhaphaitoon, Phairote y Thawatchai Plookphol. "Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy". Key Engineering Materials 675-676 (enero de 2016): 513–16. http://dx.doi.org/10.4028/www.scientific.net/kem.675-676.513.
Texto completoPapadopoulou, Olga y Panayota Vassiliou. "The Influence of Archaeometallurgical Copper Alloy Castings Microstructure towards Corrosion Evolution in Various Corrosive Media". Corrosion and Materials Degradation 2, n.º 2 (19 de mayo de 2021): 227–47. http://dx.doi.org/10.3390/cmd2020013.
Texto completoNovakovic, R. M., S. Delsante y G. Borzone. "Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems". Journal of Mining and Metallurgy, Section B: Metallurgy 54, n.º 2 (2018): 251–60. http://dx.doi.org/10.2298/jmmb180124013n.
Texto completoAlam, S. N., Prerna Mishra y Rajnish Kumar. "Effect of Ag on Sn–Cu and Sn–Zn lead free solders". Materials Science-Poland 33, n.º 2 (1 de junio de 2015): 317–30. http://dx.doi.org/10.1515/msp-2015-0048.
Texto completoErer, Ahmet Mustafa y Serkan Oguz. "Wetting characteristic of Sn-(3-x)Ag-0.5Cu-xBi quaternary solder alloy systems". Soldering & Surface Mount Technology 32, n.º 1 (8 de agosto de 2019): 19–23. http://dx.doi.org/10.1108/ssmt-08-2018-0028.
Texto completoLuo, Ji Hui, Xue Feng Liu, Lai Xin Shi y Chang Fei Cheng. "Experimental and Numerical Simulation of Surface Segregation in Two-Phase Zone Continuous Casting Cu–Sn Alloy". Materials Science Forum 850 (marzo de 2016): 610–17. http://dx.doi.org/10.4028/www.scientific.net/msf.850.610.
Texto completoHonma, Tomoyuki, David W. Saxey y Simon P. Ringer. "Effect of Trace Addition of Sn in Al-Cu Alloy". Materials Science Forum 519-521 (julio de 2006): 203–8. http://dx.doi.org/10.4028/www.scientific.net/msf.519-521.203.
Texto completoLee, Liu Mei y Ahmad Azmin Mohamad. "Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review". Advances in Materials Science and Engineering 2013 (2013): 1–11. http://dx.doi.org/10.1155/2013/123697.
Texto completoRosley, Rozainita, Suzi Salwah Jikan, Nur Azam Badarulzaman, Fahmiruddin Esa, Siti Noraiza Ab Razak, Muhammad Sufi Roslan y Munira Khalid. "Effect of Complexing Agent on The Morphology and Corrosion Effect of Cu-Sn-Zn Ternary Alloy via Electroplating". Key Engineering Materials 908 (28 de enero de 2022): 598–604. http://dx.doi.org/10.4028/p-7f1iu5.
Texto completoYang, Bin, Bai Xiong Liu, Bao Jun Han, Li Na Zhang y Ying Hui Zhang. "Investigation on Microstructure Evolution of Hot Deformed Free-Cutting Cu-Zn-Se-Bi-Sn Alloy". Advanced Materials Research 146-147 (octubre de 2010): 682–86. http://dx.doi.org/10.4028/www.scientific.net/amr.146-147.682.
Texto completoYan, A., L. Chen, H. S. Liu, F. F. Xiao y X. Q. Li. "Study on strength and fracture toughness of Al-Zn-Mg-Cu-Ti(-Sn) alloys". Journal of Mining and Metallurgy, Section B: Metallurgy 51, n.º 1 (2015): 73–79. http://dx.doi.org/10.2298/jmmb130122003y.
Texto completoErer, Ahmet Mustafa y Mukaddes Ökten Turacı. "Numerical computation of wetting angles of Sn–(3−x)Ag–0.5Cu−x(Bi,In) quaternary Pb-free solder alloy systems on Cu substrate". International Journal of Modern Physics C 31, n.º 09 (20 de julio de 2020): 2050119. http://dx.doi.org/10.1142/s0129183120501193.
Texto completoKim, Yong-Ho, Hyo-Sang Yoo y Hyeon-Taek Son. "Effects of Trace Elements on Thermal and Mechanical Properties of Al–Zn–Cu Based Alloys Using Extrusion". Journal of Nanoscience and Nanotechnology 20, n.º 7 (1 de julio de 2020): 4216–20. http://dx.doi.org/10.1166/jnn.2020.17543.
Texto completoWatanabe, Masato, Takashi Shirai, Akihiko Ishibashi y Hiromi Miura. "Dynamic Recrystallization Behaviour in Cu-Sn-P Alloy for High Strength Copper Tube". Materials Science Forum 654-656 (junio de 2010): 1271–74. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1271.
Texto completoYen, Yee-Wen, Chien-Chung Jao y Chiapyng Lee. "Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag". Journal of Materials Research 21, n.º 12 (diciembre de 2006): 2986–90. http://dx.doi.org/10.1557/jmr.2006.0369.
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