Literatura académica sobre el tema "Cu-Sn Alloy"
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Artículos de revistas sobre el tema "Cu-Sn Alloy"
Watanabe, Hirohiko, Marie Nagai, Tsutomu Osawa y Ikuo Shohji. "Effect of Ni Content on Dissolution Properties of Cu in Molten Sn-Ag-Cu-Ni-Ge Alloy". Key Engineering Materials 462-463 (enero de 2011): 70–75. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.70.
Texto completoKaneko, Daisuke, Mahoto Takeda, Takanari Nakajima y Naokuni Muramatsu. "The Influence of Alloy Composition and Heat-Treatments on the Shape Memory Properties in a Cu-Sn-X Alloy". Materials Science Forum 941 (diciembre de 2018): 1282–87. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1282.
Texto completoYamauchi, Akira, Kenta Ida, Masahito Fukuda y Takuma Yamaguchi. "Tensile Properties of Sn-Bi Lead-Free Solder Alloys". Solid State Phenomena 273 (abril de 2018): 72–76. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.72.
Texto completoKong, Zhi Gang y Feng Min Shi. "Effect of Ag on the Sn-Cu Lead-Free Material". Applied Mechanics and Materials 687-691 (noviembre de 2014): 4291–94. http://dx.doi.org/10.4028/www.scientific.net/amm.687-691.4291.
Texto completoSomidin, Flora, Stuart D. McDonald y Kazuhiro Nogita. "Formation of Cu6Sn5/(Cu, Ni)6Sn5 Intermetallic Compounds between Cu3Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding". Solid State Phenomena 273 (abril de 2018): 14–19. http://dx.doi.org/10.4028/www.scientific.net/ssp.273.14.
Texto completoAlam, S. N., N. Jindal y N. Naithani. "Effect of addition of Cu on the properties of eutectic Sn-Bi solder alloy". Materials Science-Poland 37, n.º 2 (1 de junio de 2019): 212–24. http://dx.doi.org/10.2478/msp-2019-0032.
Texto completoChen, Yan, Hong Hua Su, Yu Can Fu y Z. C. Guo. "Investigation of Interface Microstructure of Diamond and Ti Coated Diamond Brazed with Cu-Sn-Ti Alloy". Key Engineering Materials 487 (julio de 2011): 199–203. http://dx.doi.org/10.4028/www.scientific.net/kem.487.199.
Texto completoPi, Zhao Hui, Guang Qiang Li, Yan Ping Xiao, Zhan Zhang, Zhuo Zhao y Yong Xiang Yang. "An Experimental Investigation on the Solubility of Zr in Cu-Sn Alloys". Advanced Materials Research 887-888 (febrero de 2014): 324–28. http://dx.doi.org/10.4028/www.scientific.net/amr.887-888.324.
Texto completoYavuzer, B., D. Özyürek y T. Tunçay. "Microstructure and mechanical properties of Sn-9Zn-xAl and Sn-9Zn-xCu lead-free solder alloys". Materials Science-Poland 38, n.º 1 (1 de marzo de 2020): 34–40. http://dx.doi.org/10.2478/msp-2020-0025.
Texto completoHan, Duy Le, Yu-An Shen, Fupeng Huo y Hiroshi Nishikawa. "Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints". Metals 12, n.º 1 (24 de diciembre de 2021): 33. http://dx.doi.org/10.3390/met12010033.
Texto completoTesis sobre el tema "Cu-Sn Alloy"
Ghosh, Swatilekha. "Electrodeposition of Cu, Sn and Cu-Sn alloy from choline chloride ionic liquid". Thesis, University of Newcastle upon Tyne, 2013. http://hdl.handle.net/10443/2279.
Texto completoCaris, Joshua. "Heat Treatment Effects on Mechanical Behavior of Cu-15Ni-8Sn Produced via Powder Metallurgy". Case Western Reserve University School of Graduate Studies / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=case1184360740.
Texto completoCooper, Shellene. "Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu". Thesis, Open University, 2002. http://oro.open.ac.uk/54417/.
Texto completoHorsley, Robert Michael. "Microstructural characterisation of solder joints using the Sn-Ag-Cu eutectic alloy in a no-clean surface mount technology (SMT) assembly process". Thesis, University of Salford, 2002. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.272696.
Texto completoBenedict, Michael Scott. "Heterogeneous nucleation of Sn in Sn-Ag-Cu solder joints". Diss., Online access via UMI:, 2007.
Buscar texto completoYassin, Amal M. "Creep microstructure relationships in Sn-Sb and Sn-Sb-Cu alloys". Thesis, Heriot-Watt University, 1999. http://hdl.handle.net/10399/1182.
Texto completoPewnim, Naray. "Electrodeposition of Cu-Sn alloys from methanesulfonate electrolytes". Thesis, University of Newcastle Upon Tyne, 2012. http://hdl.handle.net/10443/1790.
Texto completoKent, Damon. "Age hardening of sintered Al-Cu-Mg-Si-Sn alloys /". St. Lucia, Qld, 2004. http://www.library.uq.edu.au/pdfserve.php?image=thesisabs/absthe17893.pdf.
Texto completoISHII, HENRIQUE A. "Elaboracao de ligas Ag-Sn-Cu para amalgama dentario por moagem de alta energia". reponame:Repositório Institucional do IPEN, 2003. http://repositorio.ipen.br:8080/xmlui/handle/123456789/11101.
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Tese (Doutoramento)
IPEN/T
Instituto de Pesquisas Energeticas e Nucleares - IPEN/CNEN-SP
Picincu, Lucica. "The electrodeposition of Cu-Zn-Sn alloys from alkaline cyanide solutions". Thesis, University of Southampton, 2000. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.310845.
Texto completoLibros sobre el tema "Cu-Sn Alloy"
(Editor), G. Petzow y G. Effenberg (Editor), eds. Ternary Alloys: A Comprehensive Compendium of Evaluated Constitutional Data and Phase Diagrams, Vol. 5, Al-Cu-S to Al-Gd-Sn. Wiley-VCH, 1991.
Buscar texto completoCapítulos de libros sobre el tema "Cu-Sn Alloy"
Honma, Tomoyuki, David W. Saxey y Simon P. Ringer. "Effect of Trace Addition of Sn in Al-Cu Alloy". En Materials Science Forum, 203–8. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-408-1.203.
Texto completoZhang, L., Zhong Guang Wang y J. K. Shang. "Creep Rupture of Sn-Ag-Cu Pb-Free Solder Alloy". En The Mechanical Behavior of Materials X, 585–88. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-440-5.585.
Texto completoFujiwara, Hiroshi, Takashi Nishimoto, Hiroyuki Miyamoto y Kei Ameyama. "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure". En PRICM, 2455–60. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118792148.ch304.
Texto completoFujiwara, Hiroshi, Takashi Nishimoto, Hiroyuki Miyamoto y Kei Ameyama. "Microstructure and Mechanical Properties of Cu-Sn Alloy with Harmonic Structure". En Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing, 2455–60. Cham: Springer International Publishing, 2013. http://dx.doi.org/10.1007/978-3-319-48764-9_304.
Texto completoKawazoe, Yoshiyuki, Ursula Carow-Watamura y Dmitri V. Louzguine. "Structural, thermal and mechanical properties of Cu-Ni-Sn-Ti alloy". En Phase Diagrams and Physical Properties of Nonequilibrium Alloys, 205–11. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-57920-6_43.
Texto completoKawazoe, Yoshiyuki, Ursula Carow-Watamura y Dmitri V. Louzguine. "Structural, thermal and mechanical properties of Cu-Sn-Ti-Zr alloy". En Phase Diagrams and Physical Properties of Nonequilibrium Alloys, 278–82. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-57920-6_49.
Texto completoChen, Guohai, Ju Sheng Ma y Zhi Ting Geng. "Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy". En Materials Science Forum, 1747–50. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-960-1.1747.
Texto completoLuo, Ji Hui, Xin Xin Deng, Li Zhang, Su Liang Wang, Zhong Fang Xie y Xian Yue Ren. "Microstructure Evolution and Chemical Composition in Continuous Directional Solidification Cu–P–Sn Alloy". En TMS 2020 149th Annual Meeting & Exhibition Supplemental Proceedings, 1215–21. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-36296-6_112.
Texto completoLuo, Ji Hui, Qin Li, Yan Hui Chen, Shu Liu, Qiu Yue Wen y Hui Min Ding. "Effect of Heat Treatment on Microstructure of Continuous Unidirectional Solidified Cu–Ni–Sn Alloy". En Materials Processing Fundamentals 2019, 163–68. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05728-2_15.
Texto completoZhao, Tao, Shuhui Yuy, Zhijun Zhang, Rong Sun y Ruxu Du. "Preparation and Tribological Properties of Monodispersed Metallic Cu-Sn Alloy Nanoclusters with Modified Surface". En Advanced Tribology, 892–93. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-642-03653-8_304.
Texto completoActas de conferencias sobre el tema "Cu-Sn Alloy"
Liu, Libin, Cristina Andersson, Johan Liu y Y. C. Chan. "Thermodynamic Assessment of Sn-Co-Cu Lead-Free Solder Alloy". En ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35126.
Texto completoDadras, Massoud. "Microstructure of 3d printed supersaturated Cu-Sn alloy". En European Microscopy Congress 2020. Royal Microscopical Society, 2021. http://dx.doi.org/10.22443/rms.emc2020.1161.
Texto completoBelyakov, Sergey A. "Ultrasonic modification of Sn-Ag-Cu alloy microstructure". En 2008 9th International Workshop and Tutorials on Electron Devices and Materials. IEEE, 2008. http://dx.doi.org/10.1109/sibedm.2008.4585865.
Texto completoHidaka, Noboru, Megumi Nagano, Masayoshi Shimoda, Hirohiko Watanabe y Masahiro Ono. "Creep Properties and Microstructure of the Sn-Ag-Cu-Ni-Ge Lead-Free Solder Alloy". En ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73148.
Texto completoQin, Yi, Abdul Wassay, Changqing Liu, G. D. Wilcox, Kun Zhao y Changhai Wang. "Electrodeposition of Sn-Cu solder alloy for electronics interconnection". En High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270643.
Texto completoKariya, Yoshiharu, Tomokazu Niimi, Tadatomo Suga y Masahisa Otsuka. "Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen". En ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73165.
Texto completoPop, Petru A., Petru Ungur, Juan Lopez Martinez y Gheorghe Bejinaru-Mihoc. "Theoretical and Practical Estimations Regarding of Borderline Conditions Imposed for Qualitative Achievement of Sliding Bimetallic Bearings From Steel-Bronze". En ASME 2009 International Manufacturing Science and Engineering Conference. ASMEDC, 2009. http://dx.doi.org/10.1115/msec2009-84193.
Texto completoQin, Yi, Changqing Liu, G. D. Wilcox, Kun Zhao y Changhai Wang. "Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection". En 2009 11th Electronics Packaging Technology Conference (EPTC). IEEE, 2009. http://dx.doi.org/10.1109/eptc.2009.5416536.
Texto completoYunus, Mohammad, Muthiah Venkateswaran y Peter Borgesen. "Flip Chip Process Development and Relaibility Evaluation With Lead-Free Solder Alloy". En ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39253.
Texto completoTokarieva, Iryna y Antonina Maizelis. "Nucleation in the Process of Cu-Sn Alloy Nanoscale Films Electrodeposition". En 2020 IEEE 40th International Conference on Electronics and Nanotechnology (ELNANO). IEEE, 2020. http://dx.doi.org/10.1109/elnano50318.2020.9088835.
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