Artículos de revistas sobre el tema "Cu-Si systems"
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Cao Bo, Bao Liang-Man, Li Gong-Ping y He Shan-Hu. "Diffusion and interface reaction of Cu and Si in Cu/SiO2/Si (111) systems". Acta Physica Sinica 55, n.º 12 (2006): 6550. http://dx.doi.org/10.7498/aps.55.6550.
Texto completoLaurila, T., K. Zeng, J. Molarius, T. Riekkinen, I. Suni y J. K. Kivilahti. "Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems". Microelectronic Engineering 64, n.º 1-4 (octubre de 2002): 279–87. http://dx.doi.org/10.1016/s0167-9317(02)00800-6.
Texto completoSoldi, Luca, Annabelle Laplace, Mathieu Roskosz y Stéphane Gossé. "Phase diagram and thermodynamic model for the Cu-Si and the Cu-Fe-Si systems". Journal of Alloys and Compounds 803 (septiembre de 2019): 61–70. http://dx.doi.org/10.1016/j.jallcom.2019.06.236.
Texto completoARSLAN, Hüseyin. "Viscosity Values of Ternary Au-Ag-Cu, Al-Cu-Si and Quaternary Al-Cu-Mg-Si Alloy Systems". Afyon Kocatepe University Journal of Sciences and Engineering 23, n.º 4 (29 de agosto de 2023): 865–73. http://dx.doi.org/10.35414/akufemubid.1198907.
Texto completoUmemoto, M., M. Udaka, K. Kawasaki y X. D. Liu. "Formation of ultrafine powders of binary alloy systems by plasma jet". Journal of Materials Research 13, n.º 6 (junio de 1998): 1511–16. http://dx.doi.org/10.1557/jmr.1998.0210.
Texto completoZhao, Jing Rui, Yong Du, Li Jun Zhang, Shu Hong Liu, Jin Huan Xia y Jin Wei Wang. "Thermodynamic Calculation of the Liquidus Projections of the Al-Cu-Fe-Mg, Al-Cu-Mg-Si, and Al-Fe-Mg-Si Quaternary Systems on Al-Rich Corner". Materials Science Forum 993 (mayo de 2020): 1031–42. http://dx.doi.org/10.4028/www.scientific.net/msf.993.1031.
Texto completoJacobs, MHG y PJ Spencer. "Thermodynamic evaluation of the systems Cu-Si, Mg-Ni, Si-Sn and Si-Zn". Journal de Chimie Physique 90 (1993): 167–73. http://dx.doi.org/10.1051/jcp/1993900167.
Texto completoWang, Aijun, Liangcai Zhou, Yi Kong, Yong Du, Zi-Kui Liu, Shun-Li Shang, Yifang Ouyang, Jiong Wang, Lijun Zhang y Jianchuan Wang. "First-principles study of binary special quasirandom structures for the Al–Cu, Al–Si, Cu–Si, and Mg–Si systems". Calphad 33, n.º 4 (diciembre de 2009): 769–73. http://dx.doi.org/10.1016/j.calphad.2009.10.007.
Texto completoGao, Xing Xin, Yan Hui Jia, Gong Ping Li, Jun Ping Ma y Yun Bo Wang. "The Diffusion and Interfacial Reaction of Cu/Si(100) Systems". Advanced Materials Research 287-290 (julio de 2011): 2302–7. http://dx.doi.org/10.4028/www.scientific.net/amr.287-290.2302.
Texto completoZhao, Jing Rui, Yong Du, Li Jun Zhang, Shu Hong Liu, Jin Huan Xia y Jin Wei Wang. "Thermodynamic Calculation of the Liquidus Projections of the Al-Cu-Fe-Si and Al-Cu-Fe-Mg-Si Multicomponent Systems on Al-Rich Side". Materials Science Forum 993 (mayo de 2020): 984–95. http://dx.doi.org/10.4028/www.scientific.net/msf.993.984.
Texto completoBenazzouz, C., N. Benouattas y A. Bouabellou. "Competitive diffusion of gold and copper atoms in Cu/Au/Si and Au/Cu/Si annealed systems". Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 230, n.º 1-4 (abril de 2005): 571–76. http://dx.doi.org/10.1016/j.nimb.2004.12.103.
Texto completoEryomina, Marina y Svetlana Lomayeva. "Wet Ball Milling Applied to Production of Composites and Coatings Based on Ti, W, and Nb Carbides". Powders 2, n.º 2 (15 de junio de 2023): 499–514. http://dx.doi.org/10.3390/powders2020031.
Texto completoHong, Stella Q., Q. Z. Hong, Jian Li y J. W. Mayer. "Interdiffusion and reaction in Cu/PtSi/Si(100) systems". Journal of Applied Physics 75, n.º 8 (15 de abril de 1994): 3959–63. http://dx.doi.org/10.1063/1.356016.
Texto completoParditka, B., Mariana Verezhak y Mohammed Ibrahim. "Phase Growth in Amorphous Si-Cu and Si-Co Systems: Combination of SNMS, XPS, XRD, and APT Techniques". Defect and Diffusion Forum 353 (mayo de 2014): 269–74. http://dx.doi.org/10.4028/www.scientific.net/ddf.353.269.
Texto completoSantra, Sangeeta, Hongqun Dong, Tomi Laurila y Aloke Paul. "Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions". Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 470, n.º 2161 (8 de enero de 2014): 20130464. http://dx.doi.org/10.1098/rspa.2013.0464.
Texto completoBo, Cao, Li Gong-Ping, Chen Xi-Meng, Cho Seong-Jin y Kim Hee. "Atomic Diffusion in Cu/Si (111) and Cu/SiO 2 /Si (111) Systems by Neutral Cluster Beam Deposition". Chinese Physics Letters 25, n.º 4 (abril de 2008): 1400–1402. http://dx.doi.org/10.1088/0256-307x/25/4/064.
Texto completoLiu, D., H. V. Atkinson y H. Jones. "Thermodynamic prediction of thixoformability in alloys based on the Al–Si–Cu and Al–Si–Cu–Mg systems". Acta Materialia 53, n.º 14 (agosto de 2005): 3807–19. http://dx.doi.org/10.1016/j.actamat.2005.04.028.
Texto completoShao, Wenbo, Yunkai Sun y Giovanni Zangari. "Electrodeposition of Cu-Ag Alloy Films at n-Si(001) and Polycrystalline Ru Substrates". Coatings 11, n.º 12 (20 de diciembre de 2021): 1563. http://dx.doi.org/10.3390/coatings11121563.
Texto completoPetrović, Suzana, Nevena Božinović, Vladimir Rajić, Danijela Stanisavljević Ninković, Danilo Kisić, Milena J. Stevanović y Emmanuel Stratakis. "Cell Response on Laser-Patterned Ti/Zr/Ti and Ti/Cu/Ti Multilayer Systems". Coatings 13, n.º 6 (16 de junio de 2023): 1107. http://dx.doi.org/10.3390/coatings13061107.
Texto completoBenouattas, N., A. Mosser, D. Raiser, J. Faerber y A. Bouabellou. "Behaviour of copper atoms in annealed Cu/SiOx/Si systems". Applied Surface Science 153, n.º 2-3 (enero de 2000): 79–84. http://dx.doi.org/10.1016/s0169-4332(99)00366-9.
Texto completoShakhnazarov, Karen Yu. "INTERMEDIATE PHASE MARKERS IN Al-Si, Fe-C AND Cu-Al SYSTEMS". Vestnik of Nosov Magnitogorsk State Technical University 14, n.º 3 (2016): 71–77. http://dx.doi.org/10.18503/1995-2732-2016-14-3-71-77.
Texto completoOvsyannikov, Boris V. y Viktor M. Zamyatin. "Behavior of Scandium in Aluminum Alloys of Different Alloying Systems". Materials Science Forum 794-796 (junio de 2014): 1002–7. http://dx.doi.org/10.4028/www.scientific.net/msf.794-796.1002.
Texto completoFrantz, Jonathan M., Sushant Khandekar y Scott Leisner. "Silicon Differentially Influences Copper Toxicity Response in Silicon-accumulator and Non-accumulator Species". Journal of the American Society for Horticultural Science 136, n.º 5 (septiembre de 2011): 329–38. http://dx.doi.org/10.21273/jashs.136.5.329.
Texto completoCurle, Ulyate Andries, Heinrich Möller y Gonasagren Govender. "R-HPDC in South Africa". Solid State Phenomena 192-193 (octubre de 2012): 3–15. http://dx.doi.org/10.4028/www.scientific.net/ssp.192-193.3.
Texto completoCao, Bo, Tong Rui Yang y Gong Ping Li. "Surface Morphology and Interface Reaction of Cu/SiO2/Si (111) Systems Prepared by Radio Frequency Magnetron Sputtering". Advanced Materials Research 487 (marzo de 2012): 697–700. http://dx.doi.org/10.4028/www.scientific.net/amr.487.697.
Texto completoWang, Shi-Qing. "Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide". MRS Bulletin 19, n.º 8 (agosto de 1994): 30–40. http://dx.doi.org/10.1557/s0883769400047710.
Texto completoRajaram, G., S. Kumaran y T. Srinivas Rao. "Tensile Behaviour of Al-Si Alloy and Al-Si/Graphite Composites at Elevated Temperatures". Materials Science Forum 710 (enero de 2012): 457–62. http://dx.doi.org/10.4028/www.scientific.net/msf.710.457.
Texto completoYu, Shimeng, Fang Cheng, Lian He, Weigang Tang, Yongsheng Wang, Rong Chen, Chenglu Hu, Xiao Ma y Hangyan Shen. "Enhancing Wettability of Cu3P/Cu Systems through Doping with Si, Sn, and Zr Elements: Insights from First Principles Analysis". Materials 16, n.º 6 (21 de marzo de 2023): 2492. http://dx.doi.org/10.3390/ma16062492.
Texto completoLiu, Tie, Yin Liu, Qiang Wang, Yan Wang, Kai Wang y Ji Cheng He. "Effects of a High Magnetic Field on the Solidification Behavior of Binary Al-Si and Ag-Cu Systems". Advanced Materials Research 421 (diciembre de 2011): 792–95. http://dx.doi.org/10.4028/www.scientific.net/amr.421.792.
Texto completoMiettinen, J. y G. Vassilev. "Thermodynamic re-optimization of the Cu-Mg-Sn system at the Cu-Mg side". Journal of Mining and Metallurgy, Section B: Metallurgy 48, n.º 1 (2012): 53–62. http://dx.doi.org/10.2298/jmmb110731008m.
Texto completoTakeyama, Mayumi, Shinya Kagomi, Atsushi Noya, Kouichirou Sakanishi y Katsutaka Sasaki. "Application of amorphous Cu–Zr binary alloy as a diffusion barrier in Cu/Si contact systems". Journal of Applied Physics 80, n.º 1 (julio de 1996): 569–73. http://dx.doi.org/10.1063/1.362763.
Texto completoHübner, R., R. Reiche, M. Hecker, N. Mattern, V. Hoffmann, K. Wetzig, H. Heuer, Ch Wenzel, H. J. Engelmann y E. Zschech. "Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems". Crystal Research and Technology 40, n.º 1-2 (27 de diciembre de 2004): 135–42. http://dx.doi.org/10.1002/crat.200410316.
Texto completoAkopyan, T. K., N. A. Belov, A. G. Padalko, N. V. Letyagin y N. N. Avksent’yeva. "Analysis of the Effect of Hydrostatic Pressure on the Nonvariant Eutectic Transformation in Al–Si, Al–Cu, and Al–Cu–Si Systems". Physics of Metals and Metallography 120, n.º 6 (junio de 2019): 593–99. http://dx.doi.org/10.1134/s0031918x19060024.
Texto completoTakeyama, Mayumi B., Atsushi Noya y Kouichirou Sakanishi. "Diffusion barrier properties of ZrN films in the Cu/Si contact systems". Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 18, n.º 3 (2000): 1333. http://dx.doi.org/10.1116/1.591382.
Texto completoHao, D., M. Bu, Y. Wang, Y. Tang, Q. Gao, M. Wang, B. Hu y Y. Du. "Thermodynamic modeling of the Na-X (X = Si, Ag, Cu, Cr) systems". Journal of Mining and Metallurgy, Section B: Metallurgy 48, n.º 2 (2012): 273–82. http://dx.doi.org/10.2298/jmmb120113024h.
Texto completoTakeyama, Mayumi y Atsushi Noya. "Preparation ofWNxFilms and Their Diffusion Barrier Properties in Cu/Si Contact Systems". Japanese Journal of Applied Physics 36, Part 1, No. 4A (15 de abril de 1997): 2261–66. http://dx.doi.org/10.1143/jjap.36.2261.
Texto completoJacobs, M. H. G. y P. J. Spencer. "Thermodynamic evaluations of the systems AlSiZn and CuMgNi". Journal of Alloys and Compounds 220, n.º 1-2 (abril de 1995): 15–18. http://dx.doi.org/10.1016/0925-8388(94)06017-7.
Texto completoPOLITANO, ANTONIO y GENNARO CHIARELLO. "COLLECTIVE ELECTRONIC EXCITATIONS IN SYSTEMS EXHIBITING QUANTUM WELL STATES". Surface Review and Letters 16, n.º 02 (abril de 2009): 171–90. http://dx.doi.org/10.1142/s0218625x09012482.
Texto completoAkopyan, T. K., V. S. Zolotorevskii y A. V. Khvan. "Calculation of phase diagrams of systems Al-Cu-Zn-Mg and Al-Cu-Zn-Mg-Fe-Si". Russian Journal of Non-Ferrous Metals 54, n.º 4 (julio de 2013): 307–13. http://dx.doi.org/10.3103/s1067821213040020.
Texto completoSalamakha, P. y O. Zaplatynsky. "X-ray investigation of the ternary NdCuSi and NdCuPb systems at 870 K". Journal of Alloys and Compounds 260, n.º 1-2 (septiembre de 1997): 127–30. http://dx.doi.org/10.1016/s0925-8388(97)00164-3.
Texto completoMartucci, Alessandra, Emilio Bassini y Mariangela Lombardi. "Effect of Cu Content on the PBF-LB/M Processing of the Promising Al-Si-Cu-Mg Composition". Metals 13, n.º 7 (23 de julio de 2023): 1315. http://dx.doi.org/10.3390/met13071315.
Texto completoEhrlich, Lisa, Robert Gericke, Erica Brendler y Jörg Wagler. "(2-Pyridyloxy)silanes as Ligands in Transition Metal Coordination Chemistry". Inorganics 6, n.º 4 (31 de octubre de 2018): 119. http://dx.doi.org/10.3390/inorganics6040119.
Texto completoEl-Beltagi, Hossam S., Mahmoud R. Sofy, Mohammed I. Aldaej y Heba I. Mohamed. "Silicon Alleviates Copper Toxicity in Flax Plants by Up-Regulating Antioxidant Defense and Secondary Metabolites and Decreasing Oxidative Damage". Sustainability 12, n.º 11 (10 de junio de 2020): 4732. http://dx.doi.org/10.3390/su12114732.
Texto completoRao, Peddada S., I. M. Robertson y H. K. Birnbaum. "Effects of thermal cycling in a reducing atmosphere on metal/polyimide interfaces". Journal of Materials Research 9, n.º 2 (febrero de 1994): 504–14. http://dx.doi.org/10.1557/jmr.1994.0504.
Texto completoWang, Xiupeng, Ayako Oyane, Tomoya Inose y Maki Nakamura. "In Situ Synthesis of a Tumor-Microenvironment-Responsive Chemotherapy Drug". Pharmaceutics 15, n.º 4 (21 de abril de 2023): 1316. http://dx.doi.org/10.3390/pharmaceutics15041316.
Texto completoHorng, Ray-Hua, Hsiao-Yun Yeh y Niall Tumilty. "Thermal Performance of Cu Electroplated GaN/AlGaN High-Electron-Mobility Transistors with Various-Thickness Si Substrates". Electronics 12, n.º 9 (27 de abril de 2023): 2033. http://dx.doi.org/10.3390/electronics12092033.
Texto completoTakeyama, Mayumi, Atsushi Noya y Tomoyuki Fukuda. "Thermal stability of Cu/W/Si contact systems using layers of Cu(111) and W(110) preferred orientations". Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 15, n.º 2 (marzo de 1997): 415–20. http://dx.doi.org/10.1116/1.580500.
Texto completoReid, J. S., E. Kolawa y M.-A. Nicolet. "Thermodynamics of (Cr, Mo, Nb, Ta, V, or W)–Si–Cu ternary systems". Journal of Materials Research 7, n.º 9 (septiembre de 1992): 2424–28. http://dx.doi.org/10.1557/jmr.1992.2424.
Texto completoLeroux, V., J. C. Labbe, T. T. Nguyen y M. E. R. Shanahan. "Wettability of non-reactive Cu/Si–Al–O–N systems I. Experimental results". Journal of the European Ceramic Society 21, n.º 6 (junio de 2001): 825–31. http://dx.doi.org/10.1016/s0955-2219(00)00203-x.
Texto completoTakeyama, Mayumi B., Takaomi Itoi, Eiji Aoyagi y Atsushi Noya. "Diffusion barrier properties of nano-crystalline TiZrN films in Cu/Si contact systems". Applied Surface Science 216, n.º 1-4 (junio de 2003): 181–86. http://dx.doi.org/10.1016/s0169-4332(03)00447-1.
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