Literatura académica sobre el tema "Cu-Si systems"
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Artículos de revistas sobre el tema "Cu-Si systems"
Cao Bo, Bao Liang-Man, Li Gong-Ping y He Shan-Hu. "Diffusion and interface reaction of Cu and Si in Cu/SiO2/Si (111) systems". Acta Physica Sinica 55, n.º 12 (2006): 6550. http://dx.doi.org/10.7498/aps.55.6550.
Texto completoLaurila, T., K. Zeng, J. Molarius, T. Riekkinen, I. Suni y J. K. Kivilahti. "Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems". Microelectronic Engineering 64, n.º 1-4 (octubre de 2002): 279–87. http://dx.doi.org/10.1016/s0167-9317(02)00800-6.
Texto completoSoldi, Luca, Annabelle Laplace, Mathieu Roskosz y Stéphane Gossé. "Phase diagram and thermodynamic model for the Cu-Si and the Cu-Fe-Si systems". Journal of Alloys and Compounds 803 (septiembre de 2019): 61–70. http://dx.doi.org/10.1016/j.jallcom.2019.06.236.
Texto completoARSLAN, Hüseyin. "Viscosity Values of Ternary Au-Ag-Cu, Al-Cu-Si and Quaternary Al-Cu-Mg-Si Alloy Systems". Afyon Kocatepe University Journal of Sciences and Engineering 23, n.º 4 (29 de agosto de 2023): 865–73. http://dx.doi.org/10.35414/akufemubid.1198907.
Texto completoUmemoto, M., M. Udaka, K. Kawasaki y X. D. Liu. "Formation of ultrafine powders of binary alloy systems by plasma jet". Journal of Materials Research 13, n.º 6 (junio de 1998): 1511–16. http://dx.doi.org/10.1557/jmr.1998.0210.
Texto completoZhao, Jing Rui, Yong Du, Li Jun Zhang, Shu Hong Liu, Jin Huan Xia y Jin Wei Wang. "Thermodynamic Calculation of the Liquidus Projections of the Al-Cu-Fe-Mg, Al-Cu-Mg-Si, and Al-Fe-Mg-Si Quaternary Systems on Al-Rich Corner". Materials Science Forum 993 (mayo de 2020): 1031–42. http://dx.doi.org/10.4028/www.scientific.net/msf.993.1031.
Texto completoJacobs, MHG y PJ Spencer. "Thermodynamic evaluation of the systems Cu-Si, Mg-Ni, Si-Sn and Si-Zn". Journal de Chimie Physique 90 (1993): 167–73. http://dx.doi.org/10.1051/jcp/1993900167.
Texto completoWang, Aijun, Liangcai Zhou, Yi Kong, Yong Du, Zi-Kui Liu, Shun-Li Shang, Yifang Ouyang, Jiong Wang, Lijun Zhang y Jianchuan Wang. "First-principles study of binary special quasirandom structures for the Al–Cu, Al–Si, Cu–Si, and Mg–Si systems". Calphad 33, n.º 4 (diciembre de 2009): 769–73. http://dx.doi.org/10.1016/j.calphad.2009.10.007.
Texto completoGao, Xing Xin, Yan Hui Jia, Gong Ping Li, Jun Ping Ma y Yun Bo Wang. "The Diffusion and Interfacial Reaction of Cu/Si(100) Systems". Advanced Materials Research 287-290 (julio de 2011): 2302–7. http://dx.doi.org/10.4028/www.scientific.net/amr.287-290.2302.
Texto completoZhao, Jing Rui, Yong Du, Li Jun Zhang, Shu Hong Liu, Jin Huan Xia y Jin Wei Wang. "Thermodynamic Calculation of the Liquidus Projections of the Al-Cu-Fe-Si and Al-Cu-Fe-Mg-Si Multicomponent Systems on Al-Rich Side". Materials Science Forum 993 (mayo de 2020): 984–95. http://dx.doi.org/10.4028/www.scientific.net/msf.993.984.
Texto completoTesis sobre el tema "Cu-Si systems"
Zhang, Duyao. "Thermodynamic characterisation of semi-solid processability in alloys based on Al-Si, Al-Cu and Al-Mg binary systems". Thesis, University of Leicester, 2015. http://hdl.handle.net/2381/32538.
Texto completoBayerl, Dominik Verfasser], Rainer [Gutachter] [Schmid-Fetzer y Babette [Gutachter] Tonn. "Beitrag zur Etablierung der Kinetik-Simulation zur Legierungs- und Prozessoptimierung ausscheidungshärtender Werkstoffe am Beispiel des Cu-Co-Ni-Si Systems / Dominik Bayerl ; Gutachter: Rainer Schmid-Fetzer, Babette Tonn". Clausthal-Zellerfeld : Technische Universität Clausthal, 2018. http://d-nb.info/1231363959/34.
Texto completoReshöft, Klaus. "Zeitaufgelöste STM-Untersuchungen zur Silizid- und Metall-Epitaxie der Systeme Fe-, Cu-, Pt-Si(111) und Cu-W(110)". [S.l. : s.n.], 2001. http://e-diss.uni-kiel.de/diss>=/d525.pdf.
Texto completoBanda, Wezi. "High temperature phase equilibria in the Fe-Co-Cu-Si system pertinent to slag cleaning". Thesis, Link to the online version, 2006. http://hdl.handle.net/10019.1/1351.
Texto completoKovarik, Libor. "Microstructural study and modeling of metastable phases and their effect on strenghthening [sic] in Al-Mg-Cu-Si alloying system". The Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=osu1149006665.
Texto completoYen, I.-Shan y 顏意珊. "Interfacial reactions of Au/Cu/Si and Ta/Cu/Si systems". Thesis, 1994. http://ndltd.ncl.edu.tw/handle/79442262924381827660.
Texto completoLiu, Lian. "μSR Study of B20 Magnetic Systems: MnSi, Mn₀.₉Fe₀.₁Si and Cu₂OSeO₃". Thesis, 2016. https://doi.org/10.7916/D82F7ND1.
Texto completoSomaiah, Nalla. "Mass Transport in Cu-Interlayer-Si Systems under Various Thermo-Electro-Mechanical Excursions". Thesis, 2018. https://etd.iisc.ac.in/handle/2005/4946.
Texto completoWang, Hong-I. y 王弘毅. "Reliability of Cu/SiO2/Si system". Thesis, 1995. http://ndltd.ncl.edu.tw/handle/63741354802081463183.
Texto completo國立交通大學
電子研究所
83
Thermal stability of the Cu/SiO2/Si system was investigated with respect to the dielectric degradation and Cu ion migration in the Cu-gate MOS capacitor. We used the rapid thermal annealing (RTA) and the technique of bias-temperature stress in conjunction with the dielectric breakdown field (Ebd) and SiO2/ Si interface state density (Dit) measurements to characterize the thermal stability of the Cu/SiO2/Si system. We found that the Ebd degradation started to occur after Cu/SiO2/Si structure was annealed with 60 sec RTA at a temperature as low as 300℃; and the dielectric strength deteriorated progressively with the increase of annealing temperature. The dielectric degradation is presumably due to Cu dissolution in SiO2 layer in the form of positive ion. The mobility of Cu ion in the SiO2 layer was evaluated using the data obtained from the bias- temperature stress. The Cu ion concentration in the SiO2 layer of Cu-gate MOS capacitor resulting from RTA anneal was also evaluated using a simple extractation scheme. It is also concluded that Cu is a fast diffusion specises in SiO2 and may diffuse into Si substrate once it arrives at the SiO2/Si interface.
Mitrasinovic, Aleksandar. "Characterization of the Cu-Si System and Utilization of Metallurgical Techniques in Silicon Refining for Solar Cell Applications". Thesis, 2010. http://hdl.handle.net/1807/26210.
Texto completoLibros sobre el tema "Cu-Si systems"
μSR Study of B20 Magnetic Systems: MnSi, Mn₀.₉Fe₀.₁Si and Cu₂OSeO₃. [New York, N.Y.?]: [publisher not identified], 2016.
Buscar texto completoOurdjini, A. Growth kinetics, microstructure and mechanical properties in directionally solidified Al-Si and Al-Cu eutectic systems. Manchester: UMIST, 1993.
Buscar texto completoMaterials Science International Services Staff. Selected Systems from Co-Fe-Si to Cu-Fe-Pt. Springer, 2008.
Buscar texto completoIron Systems, Part 4: Selected Systems from Cu-Fe-Si to Fe-N-U. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008.
Buscar texto completoCapítulos de libros sobre el tema "Cu-Si systems"
Carow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Au-Cu-Si". En Physical Properties of Ternary Amorphous Alloys. Part 1: Systems from Ag-Al-Ca to Au-Pd-Si, 366–67. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-03481-7_115.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Pd-Si (248)". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 141–68. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_37.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Si-Zr (249)". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 169. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_38.
Texto completoFroumin, N., M. Aizenshtein, N. Frage y M. P. Dariel. "Interface Phenomena and Wettability in the B4C/(Me-Si) Systems (Me =Cu, Au, Sn)". En Ceramic Transactions Series, 93–101. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118406038.ch12.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Ga-Zr". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 69–70. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_15.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Gd-Mg". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 71–72. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_16.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Hf-Ti". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 79–82. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_20.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Mg-Tb". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 87–89. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_24.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-Mo-Zr". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 111. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_26.
Texto completoCarow-Watamura, U., D. V. Louzguine y A. Takeuchi. "Cu-P-Pt". En Physical Properties of Ternary Amorphous Alloys. Part 3: Systems from Cr-Fe-P to Si-W-Zr, 137–38. Berlin, Heidelberg: Springer Berlin Heidelberg, 2011. http://dx.doi.org/10.1007/978-3-642-14133-1_34.
Texto completoActas de conferencias sobre el tema "Cu-Si systems"
Zolanvari, A. y H. Sadeghi. "Characterization of Annealed Ni/Cu Multilayers on Si(100)". En 2009 Fifth International Conference on MEMS NANO, and Smart Systems. IEEE, 2009. http://dx.doi.org/10.1109/icmens.2009.59.
Texto completoTeh, W. H., C. Deeb, J. Burggraf, D. Arazi, R. Young, C. Senowitz y A. Buxbaum. "Post-bond sub-500 nm alignment in 300 mm integrated face-to-face wafer-to-wafer Cu-Cu thermocompression, Si-Si fusion and oxideoxide fusion bonding". En 2010 IEEE International 3D Systems Integration Conference (3DIC). IEEE, 2010. http://dx.doi.org/10.1109/3dic.2010.5751447.
Texto completoTakeyama, Mayumi B., Masaru Sato y Mitsunobu Yasuda. "Barrier properties of thin TaWN films in Cu(111)/TaWN/Si systems". En 2020 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2020. http://dx.doi.org/10.7567/ssdm.2020.c-1-04.
Texto completoHasan, M. M., R. J. Highmore y R. E. Somekh. "Effects of Sputtering Pressure on Roughness and Resputtering of Multilayers". En Physics of X-Ray Multilayer Structures. Washington, D.C.: Optica Publishing Group, 1992. http://dx.doi.org/10.1364/pxrayms.1992.mb2.
Texto completoGokon, Nobuyuki, Tomoya Yamaguchi, Hyun-seok Cho, Selvan Bellan, Tsuyoshi Hatamachi y Tatsuya Kodama. "Thermal storage/discharge performances of Cu-Si alloy for solar thermochemical process". En SOLARPACES 2016: International Conference on Concentrating Solar Power and Chemical Energy Systems. Author(s), 2017. http://dx.doi.org/10.1063/1.4984465.
Texto completoPascucci, Jacopo, Fosca Conti, Sri Krishna Bhogaraju, Raffaella Signorini, E. Liu, Danilo Pedron y Gordon Elger. "Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates". En Integrated Optics: Design, Devices, Systems and Applications VI, editado por Pavel Cheben, Jiří Čtyroký y Iñigo Molina-Fernández. SPIE, 2021. http://dx.doi.org/10.1117/12.2576414.
Texto completoTakeyama, Mayumi B., Kazumi Satoh, Takaomi Itoi, Masakazu Sakagami y Atsushi Noya. "Application of Thin Nano-Crystalline VN Barrier in Cu/VN/SiO2/Si Systems". En 2002 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2002. http://dx.doi.org/10.7567/ssdm.2002.p4-13.
Texto completoWatanabe, Naoya, Masahiro Aoyagi, Daisuke Katagawa, Tsubasa Bandoh, Takahiko Mitsui y Eiichi Yamamoto. "Small-diameter TSV reveal process using direct Si/Cu grinding and metal contamination removal". En 2014 International 3D Systems Integration Conference (3DIC). IEEE, 2014. http://dx.doi.org/10.1109/3dic.2014.7152144.
Texto completoOttaviani, M., F. Rondino, M. Moreno, L. Della Seta, P. Gislon, V. Orsetti, A. Rufoloni, A. Santoni, P. P. Prosini y M. Pasquali. "Cu-catalyzed Si-NWs grown on “carbon paper” as anodes for Li-ion cells". En 15th International Conference on Concentrator Photovoltaic Systems (CPV-15). AIP Publishing, 2019. http://dx.doi.org/10.1063/1.5123571.
Texto completoMa, Jun, Cody Gonzalez, Christopher Rahn, Mary Frecker y Donghai Wang. "Experimental Study of Multifunctional NCM-Si Batteries With Self-Actuation". En ASME 2018 Conference on Smart Materials, Adaptive Structures and Intelligent Systems. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/smasis2018-8004.
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