Artículos de revistas sobre el tema "Cu-based Intermetallics"
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Hanim, M. A. Azmah, A. Ourdjini, I. Siti Rabiatul Aisha y O. Saliza Azlina. "Effect of Isothermal Aging 2000 Hours on Intermetallics Formed between Ni-Pd-Au with Sn-4Ag-0.5Cu Solders". Advanced Materials Research 650 (enero de 2013): 194–99. http://dx.doi.org/10.4028/www.scientific.net/amr.650.194.
Texto completoMayappan, Ramani, Nur Nadiah Zainal Abidin, Noor Asikin Ab Ghani, Iziana Yahya y Norlin Shuhaime. "Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder". Materials Science Forum 857 (mayo de 2016): 3–7. http://dx.doi.org/10.4028/www.scientific.net/msf.857.3.
Texto completoAlba-Galvín, Juan, Leandro González-Rovira, Manuel Bethencourt, Francisco Botana y José Sánchez-Amaya. "Influence of Aerospace Standard Surface Pretreatment on the Intermetallic Phases and CeCC of 2024-T3 Al-Cu Alloy". Metals 9, n.º 3 (12 de marzo de 2019): 320. http://dx.doi.org/10.3390/met9030320.
Texto completoLee, Dong Suk, Taek Kyun Jung, Mok Soon Kim y Won Yong Kim. "Effect of Cu and Mg on Forging Property and Mechanical Behavior of Powder Forged Al-Si-Fe Based Alloy". Materials Science Forum 534-536 (enero de 2007): 389–92. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.389.
Texto completoMa, Y., T. Arnesen, J. Gj⊘nnes y J. Taft⊘. "Laser processed Al3Ti-based intermetallics: Al5±XTi2±Y(Fe, Ni, or Cu)1±z". Journal of Materials Research 7, n.º 7 (julio de 1992): 1722–34. http://dx.doi.org/10.1557/jmr.1992.1722.
Texto completoThirunavukarasu, Gopinath, Sukumar Kundu, Tapas Laha, Deb Roy y Subrata Chatterjee. "Exhibition of veiled features in diffusion bonding of titanium alloy and stainless steel via copper". Metallurgical Research & Technology 115, n.º 1 (27 de noviembre de 2017): 115. http://dx.doi.org/10.1051/metal/2017080.
Texto completoMayappan, Ramani y Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn lntermetallics Study in the Sn-40Pb/Cu System during Long-term Aging". Scientific Research Journal 7, n.º 2 (31 de diciembre de 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.9416.
Texto completoMayappan, Ramani y Zainal Arifin Ahmad. "Cu6Sn5 and Cu3Sn Intermetallics Study in the Sn-40Pb/Cu System during Long-term Aging". Scientific Research Journal 7, n.º 2 (31 de diciembre de 2010): 1. http://dx.doi.org/10.24191/srj.v7i2.5016.
Texto completoLiu, Wen, Chi Zhang, Chunge Wang, Xiang Yan, Xiaoxiong Hu, Pingjun Xu, Xinyu Ye, Zhongzhu Zhuang, Pengfei Liu y Shuyu Lei. "Theoretical investigations on correlations between elastic behavior of Al-based alloys and their electronic structures". International Journal of Materials Research 112, n.º 8 (1 de agosto de 2021): 636–41. http://dx.doi.org/10.1515/ijmr-2021-8235.
Texto completoMayappan, Ramani, Amirah Salleh, Nurul Atiqah Tokiran y N. A. Awang. "Activation energy for Cu-Sn intermetallic in CNT-reinforced Sn-1.0Ag-0.5Cu solder". Soldering & Surface Mount Technology 32, n.º 2 (1 de noviembre de 2019): 65–72. http://dx.doi.org/10.1108/ssmt-07-2019-0025.
Texto completoSainis, Salil y Caterina Zanella. "A Study of the Localized Ceria Coating Deposition on Fe-Rich Intermetallics in an AlSiFe Cast Alloy". Materials 14, n.º 11 (3 de junio de 2021): 3058. http://dx.doi.org/10.3390/ma14113058.
Texto completoKim, Yong Keun, Pyung Woo Shin y Sun Ig Hong. "Effect of Heat Treatment on the Mechanical Properties and Interface Structure of 3-ply Ti/Cu/Ti Clad Composite". Advanced Materials Research 1102 (mayo de 2015): 51–54. http://dx.doi.org/10.4028/www.scientific.net/amr.1102.51.
Texto completoZhang, Jie y Yan Ming He. "Effect of Ti Content on Microstructure and Mechanical Properties of Si3N4/Si3N4 Joints Brazed with Ag-Cu-Ti+Mo Composite Filler". Materials Science Forum 654-656 (junio de 2010): 2018–21. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2018.
Texto completoYahya, Iziana, Noor Asikin Ab Ghani, Nur Nadiah Zainal Abiddin, Hamidi Abd Hamid y Ramani Mayappan. "Intermetallic Evolution of Sn-3.5Ag-1.0Cu-0.1Zn/Cu Interface under Thermal Aging". Advanced Materials Research 620 (diciembre de 2012): 142–46. http://dx.doi.org/10.4028/www.scientific.net/amr.620.142.
Texto completoMoffat, Thomas P., Yihua Liu, Dincer Gokcen, Liang Yueh Ou Yang, Sun Mi Hwang, Carlos M. Hangarter, Stephen Ambrozik, Nikolay Dimitrov y Ugo Bertocci. "(Invited) Investigations into the Role of Adsorption Processes in Alloy Deposition". ECS Meeting Abstracts MA2022-01, n.º 22 (7 de julio de 2022): 1108. http://dx.doi.org/10.1149/ma2022-01221108mtgabs.
Texto completoLee, Min Ku, Jung G. Lee, Jong Keuk Lee, Jin Ju Park, Young Rang Uhm y Chang Kyu Rhee. "The Effect of Ag Diffusion Barrier on the Microstructure of a Titanium Dissimilar Joining". Solid State Phenomena 135 (febrero de 2008): 135–38. http://dx.doi.org/10.4028/www.scientific.net/ssp.135.135.
Texto completoAb Ghani, Noor Asikin, Iziana Yahya, Mohd Arif Anuar Mohd Salleh, Shamsuddin Saidatulakmar, Zainal Arifin Ahmad y Ramani Mayappan. "Microstructure Evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu System Lead Free Solder under Long Term Thermal Aging". Advanced Materials Research 620 (diciembre de 2012): 263–67. http://dx.doi.org/10.4028/www.scientific.net/amr.620.263.
Texto completoTsukamoto, Hideaki, Zhi Gang Dong, Han Huang, Tetsura Nishimura y Kazuhiro Nogita. "Nanoindentation Characterization of Intermetallics Formed at the Lead-Free Solder/Cu Substrate Interface". Materials Science Forum 654-656 (junio de 2010): 2446–49. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.2446.
Texto completoBoyarchenko, O. D., S. G. Vadchenko, N. V. Sachkova y A. E. Sytschev. "SHS Joining Via Combustion of Ti-Containing Systems". Eurasian Chemico-Technological Journal 15, n.º 2 (20 de febrero de 2013): 95. http://dx.doi.org/10.18321/ectj145.
Texto completoZhu, Yandan, Mufu Yan y Quanli Zhang. "Microstructure Formation and Mechanical Properties of Multi-Phase Coating by Thermos Plasma Nitriding of Gradient Cu-Ti Films on C61900 Cu Alloy". Applied Sciences 11, n.º 22 (17 de noviembre de 2021): 10843. http://dx.doi.org/10.3390/app112210843.
Texto completoOsório, Wislei R., Celia M. Freire, Rubens Caram y Amauri Garcia. "The role of Cu-based intermetallics on the pitting corrosion behavior of Sn–Cu, Ti–Cu and Al–Cu alloys". Electrochimica Acta 77 (agosto de 2012): 189–97. http://dx.doi.org/10.1016/j.electacta.2012.05.106.
Texto completoHernandez-Sandoval, J., A. M. Samuel, S. Valtierra y F. H. Samuel. "Ni- and Zr-Based Intermetallics in Al–Si–Cu–Mg Cast Alloys". Metallography, Microstructure, and Analysis 3, n.º 5 (octubre de 2014): 408–20. http://dx.doi.org/10.1007/s13632-014-0164-2.
Texto completoMartin, S., A. Winkelmann y A. Leineweber. "Revisiting the phase transformations involving Cu6Sn5 intermetallic: resolving local domain structures induced by ordering". IOP Conference Series: Materials Science and Engineering 1249, n.º 1 (1 de julio de 2022): 012014. http://dx.doi.org/10.1088/1757-899x/1249/1/012014.
Texto completoSimões, Sónia, Carlos Tavares y Aníbal Guedes. "Joining of γ-TiAl Alloy to Ni-Based Superalloy Using Ag-Cu Sputtered Coated Ti Brazing Filler Foil". Metals 8, n.º 9 (14 de septiembre de 2018): 723. http://dx.doi.org/10.3390/met8090723.
Texto completoPandya, Shailesh N. y Jyoti Menghani. "A preliminary investigation on microstructure and mechanical properties of dissimilar Al to Cu friction stir welds prepared using silver interlayer". Metallurgical and Materials Engineering 24, n.º 1 (2 de abril de 2018): 45–57. http://dx.doi.org/10.30544/294.
Texto completoNascimento, Maurício Silva, Givanildo Alves dos Santos, Rogério Teram, Vinícius Torres dos Santos, Márcio Rodrigues da Silva y Antonio Augusto Couto. "Effects of Thermal Variables of Solidification on the Microstructure, Hardness, and Microhardness of Cu-Al-Ni-Fe Alloys". Materials 12, n.º 8 (18 de abril de 2019): 1267. http://dx.doi.org/10.3390/ma12081267.
Texto completoKaiser, Samiul y Mohammad Salim Kaiser. "IMPACT OF COLD PLASTIC DEFORMATION AND THERMAL POST-TREATMENT ON THE PHYSICAL PROPERTIES OF COPPER BASED ALLOYS Al-BRONZE AND α-BRASS". Acta Metallurgica Slovaca 27, n.º 3 (13 de septiembre de 2021): 114–21. http://dx.doi.org/10.36547/ams.27.3.951.
Texto completoLee, Unhae y Jae Wung Bae. "Microstructural Changes and Mechanical Properties of Precipitation-Strengthened Medium-Entropy Fe71.25(CoCrMnNi)23.75Cu3Al2 Maraging Alloy". Materials 16, n.º 9 (7 de mayo de 2023): 3589. http://dx.doi.org/10.3390/ma16093589.
Texto completoBelin-Ferré, Esther y Jean Marie Dubois. "Wetting of aluminium-based complex metallic alloys". International Journal of Materials Research 97, n.º 7 (1 de julio de 2006): 985–95. http://dx.doi.org/10.1515/ijmr-2006-0156.
Texto completoMali, Vjacheslav I., Iuliia N. Maliutina y K. A. Skorokhod. "Microstructure and Strength of Explosively Welded Titanium/Ni-Based Alloy Composite with Cu/Ta as Interlayer". Applied Mechanics and Materials 682 (octubre de 2014): 21–24. http://dx.doi.org/10.4028/www.scientific.net/amm.682.21.
Texto completoSINGH, R. P., R. K. SINGH, SHALU y M. RAJAGOPALAN. "FIRST-PRINCIPLE STUDY ON STRUCTURAL, ELASTIC AND ELECTRONIC PROPERTIES OF BINARY RARE EARTH INTERMETALLIC COMPOUNDS: GdCu AND GdZn". International Journal of Computational Materials Science and Engineering 01, n.º 01 (marzo de 2012): 1250005. http://dx.doi.org/10.1142/s2047684112500054.
Texto completoVuksanovic, D., V. Asanovic, J. Scepanovic y D. Radonjic. "Effect of chemical composition and T6 heat treatment on the mechanical properties and fracture behaviour of Al-Si alloys for IC engine components". Journal of Mining and Metallurgy, Section B: Metallurgy 57, n.º 2 (2021): 195–207. http://dx.doi.org/10.2298/jmmb190510014v.
Texto completoZhu, Yandan, Zecheng Li, Hongchao Bi, Qilong Shi, Yujun Han y Quanli Zhang. "Cross-Sectional Profile Evolution of Cu-Ti Gradient Films on C17200 Cu by Vacuum Thermal Diffusion". Materials 15, n.º 22 (12 de noviembre de 2022): 8002. http://dx.doi.org/10.3390/ma15228002.
Texto completoXu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li y Ju Xu. "Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (1 de julio de 2019): 000075–84. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000075.
Texto completoMohamed, Adel M. A., Ehab Samuel, Yasser Zedan, Agnes M. Samuel, Herbert W. Doty y Fawzy H. Samuel. "Intermetallics Formation during Solidification of Al-Si-Cu-Mg Cast Alloys". Materials 15, n.º 4 (11 de febrero de 2022): 1335. http://dx.doi.org/10.3390/ma15041335.
Texto completoChu, Qiaoling, Min Zhang, Jihong Li, Qingyang Fan, Weiwei Xie y Zongyue Bi. "Intermetallics in CP-Ti/X65 bimetallic sheets filled with Cu-based flux-cored wires". Materials & Design 90 (enero de 2016): 299–306. http://dx.doi.org/10.1016/j.matdes.2015.10.136.
Texto completoLiu, Qianli, Hao Zhang, Peng Jiang y Yifan Lv. "The Alloying Strategy to Tailor the Mechanical Properties of θ-Al13Fe4 Phase in Al-Mg-Fe Alloy by First-Principles Calculations". Metals 12, n.º 12 (22 de noviembre de 2022): 1999. http://dx.doi.org/10.3390/met12121999.
Texto completoSamuel, A. M., E. M. Elgallad, M. G. Mahmoud, H. W. Doty, S. Valtierra y F. H. Samuel. "Rare Earth Metal-Based Intermetallics Formation in Al–Cu–Mg and Al–Si–Cu–Mg Alloys: A Metallographic Study". Advances in Materials Science and Engineering 2018 (2018): 1–15. http://dx.doi.org/10.1155/2018/7607465.
Texto completoShcheretskyi, O. A., A. M. Verkhovliuk y D. S. Kanibolotsky. "Thermodynamic analysis of aluminium-based sacrificial anode alloys phase composition". Metaloznavstvo ta obrobka metalìv 101, n.º 1 (30 de marzo de 2022): 3–14. http://dx.doi.org/10.15407/mom2022.01.003.
Texto completoGao, Feng, Hiroshi Nishikawa y Tadashi Takemoto. "Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish". Journal of Electronic Materials 36, n.º 12 (19 de septiembre de 2007): 1630–34. http://dx.doi.org/10.1007/s11664-007-0243-0.
Texto completoYang, Li y Na Zhang. "Effect of Metal Particles on Spreading Properties of Sn0.7Cu Based Composite Solder". Advanced Materials Research 152-153 (octubre de 2010): 1759–62. http://dx.doi.org/10.4028/www.scientific.net/amr.152-153.1759.
Texto completoMorozov, A., A. B. Freidin, V. A. Klinkov, A. V. Semencha, W. H. Müller y T. Hauck. "Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects". Journal of Electronic Materials 49, n.º 12 (18 de septiembre de 2020): 7194–210. http://dx.doi.org/10.1007/s11664-020-08433-y.
Texto completoTupaj, Mirosław, Antoni Władysław Orłowicz, Marek Mróz, Andrzej Trytek, Anna Janina Dolata y Andrzej Dziedzic. "A Study on Material Properties of Intermetallic Phases in a Multicomponent Hypereutectic Al-Si Alloy with the Use of Nanoindentation Testing". Materials 13, n.º 24 (9 de diciembre de 2020): 5612. http://dx.doi.org/10.3390/ma13245612.
Texto completoLee, Han-Young. "The Effect of Ball-milling Energy on Combustion Synthesis Coating of Cu-Al-Ni Based Intermetallics". Journal of the Korean Society of Tribologists and Lubrication Engineers 27, n.º 1 (28 de febrero de 2011): 1–6. http://dx.doi.org/10.9725/kstle.2011.27.1.001.
Texto completoAl-Shammary, A. F. Y., I. T. Caga, A. Y. Tata, J. M. Winterbottom y I. R. Harris. "Zirconium-based intermetallics as heterogeneous catalysts for the fischer-tropsch reaction: II. Zr-Ni-Cu catalysts". Journal of Chemical Technology & Biotechnology 55, n.º 4 (24 de abril de 2007): 369–74. http://dx.doi.org/10.1002/jctb.280550411.
Texto completoLi, Xiaoqiang, Li Li, Ke Hu y Shengguan Qu. "Vacuum brazing of TiAl-based intermetallics with Ti–Zr–Cu–Ni–Co amorphous alloy as filler metal". Intermetallics 57 (febrero de 2015): 7–16. http://dx.doi.org/10.1016/j.intermet.2014.09.010.
Texto completoWu, Z. Y., T. Y. Yeh y R. K. Shiue. "Infrared Heating Applied in Titanium Brazing". Advanced Materials Research 79-82 (agosto de 2009): 1379–82. http://dx.doi.org/10.4028/www.scientific.net/amr.79-82.1379.
Texto completoPaul, H., M. M. Miszczyk, M. Prażmowski, R. Chulist, P. Petrzak, N. Schell y M. Fatemi. "Effect of impact loading on structural properties of multi-layered Ta/Cu, Nb/Cu and Fe/Cu plates fabricated by single-shot explosive welding". IOP Conference Series: Materials Science and Engineering 1270, n.º 1 (1 de diciembre de 2022): 012068. http://dx.doi.org/10.1088/1757-899x/1270/1/012068.
Texto completoMokhtari, Omid y Hiroshi Nishikawa. "Effects of minor alloying additive on the shear strength of Sn-58Bi solder joint". International Symposium on Microelectronics 2013, n.º 1 (1 de enero de 2013): 000100–000103. http://dx.doi.org/10.4071/isom-2013-ta41.
Texto completoZhang, Ruihong, Fu Guo, Jianping Liu, Hao Shen y Feng Tai. "Morphology and Growth of Intermetallics at the Interface of Sn-based Solders and Cu with Different Surface Finishes". Journal of Electronic Materials 38, n.º 2 (30 de octubre de 2008): 241–51. http://dx.doi.org/10.1007/s11664-008-0582-5.
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