Artículos de revistas sobre el tema "Cu-Al Thin Film"
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Hung, Fei Shuo, Fei Yi Hung, Che Ming Chiang y Truan Sheng Lui. "Innovation and Annealed Effect of Sn-Al and Sn-Cu Composite Thin Films on the Electromagnetic Interference Shielding for the Green Materials". Advanced Materials Research 347-353 (octubre de 2011): 547–54. http://dx.doi.org/10.4028/www.scientific.net/amr.347-353.547.
Texto completoYue, An Na, Kun Peng, Ling Ping Zhou, Jia Jun Zhu y De Yi Li. "Influence of Ti Layer on the Structure and Properties of Al/Cu Thin Film". Advanced Materials Research 750-752 (agosto de 2013): 1879–82. http://dx.doi.org/10.4028/www.scientific.net/amr.750-752.1879.
Texto completoRose, J. H., J. R. Lloyd, A. Shepela y N. Riel. "Microstructure of Al-Cu thin-film interconnect". Proceedings, annual meeting, Electron Microscopy Society of America 49 (agosto de 1991): 820–21. http://dx.doi.org/10.1017/s0424820100088415.
Texto completoAfifah, Faras, Arif Tjahjono, Aga Ridhova, Pramitha Yuniar Diah Maulida, Alfian Noviyanto y Didik Aryanto. "Influence of Al and Cu Doping on the Structure, Morphology, and Optical Properties of ZnO Thin Film". Indonesian Journal of Chemistry 23, n.º 1 (19 de enero de 2023): 44. http://dx.doi.org/10.22146/ijc.73234.
Texto completoLucadamo, G., K. Barmak y K. P. Rodbell. "Texture in Ti/Al and Nb/Al multilayer thin films: Role of Cu". Journal of Materials Research 16, n.º 5 (mayo de 2001): 1449–59. http://dx.doi.org/10.1557/jmr.2001.0202.
Texto completoSato, Yuichi, Toshifumi Suzuki, Hiroyuki Mogami, Fumito Otake, Hirotoshi Hatori y Suguru Igarashi. "Solid Phase Growth of some Metal and Metal Oxide Thin Films on Sapphire and Quartz Glass Substrates". Materials Science Forum 753 (marzo de 2013): 505–9. http://dx.doi.org/10.4028/www.scientific.net/msf.753.505.
Texto completoRyabtsev, S. I., O. V. Sukhova y V. A. Polonskyy. "Structure and corrosion in NaCl solution of quasicrystalline Al–Cu–Fe cast alloys and thin films". Journal of Physics and Electronics 27, n.º 1 (17 de octubre de 2019): 27–30. http://dx.doi.org/10.15421/331904.
Texto completoPalmstro/m, C. J., J. W. Mayer, B. Cunningham, D. R. Campbell y P. A. Totta. "Thin film interactions of Al and Al(Cu) on TiW". Journal of Applied Physics 58, n.º 9 (noviembre de 1985): 3444–48. http://dx.doi.org/10.1063/1.335765.
Texto completoEriksson, Fredrik, Simon Olsson, Magnus Garbrecht, Jens Birch y Lars Hultman. "Phase Evolution of Al/Cu/Co Thin Films into Decagonal Quasicrystalline Phases". Acta Crystallographica Section A Foundations and Advances 70, a1 (5 de agosto de 2014): C82. http://dx.doi.org/10.1107/s2053273314099173.
Texto completoWANG, YUE, HAO GONG y LING LIU. "CRYSTAL STRUCTURE AND PROPERTIES OF CU-AL-O THIN FILMS". International Journal of Modern Physics B 16, n.º 01n02 (20 de enero de 2002): 308–13. http://dx.doi.org/10.1142/s0217979202009809.
Texto completoBilican, Doga, Samer Kurdi, Yi Zhu, Pau Solsona, Eva Pellicer, Zoe H. Barber, Alan Lindsay Greer, Jordi Sort y Jordina Fornell. "Epitaxial Versus Polycrystalline Shape Memory Cu-Al-Ni Thin Films". Coatings 9, n.º 5 (8 de mayo de 2019): 308. http://dx.doi.org/10.3390/coatings9050308.
Texto completoColgan, E. G. y B. Blanpain. "The effect of Cu on morphological instabilities in thin Al/Pt films". Journal of Materials Research 7, n.º 5 (mayo de 1992): 1093–95. http://dx.doi.org/10.1557/jmr.1992.1093.
Texto completoMingard, K. P. y B. Cantor. "Microstructural characterization of reactions in Al–Zr thin film couples". Journal of Materials Research 8, n.º 2 (febrero de 1993): 274–85. http://dx.doi.org/10.1557/jmr.1993.0274.
Texto completoZhang, Yongjian, Zhengtang Liu, Duyang Zang, Liping Feng, Xingsen Che y Yanyan Li. "Optical and Electrical Properties of Magnetron Sputtering Deposited Cu–Al–O Thin Films". International Journal of Antennas and Propagation 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/823089.
Texto completoDing, Su-Ying, Si-Qi Yu, Xiao-Xia Wang, Zi-Hua Wu, Wen-Qin Li, Wei Jia y Hua-Qing Xie. "Fabrication of Buffer-Window Layer System for Cu(In, Ga)Se2 Thin Film Devices by Chemical Bath Deposition and Sol–Gel Methods". Journal of Nanoelectronics and Optoelectronics 16, n.º 12 (1 de diciembre de 2021): 1913–22. http://dx.doi.org/10.1166/jno.2021.3145.
Texto completoDavid Theodore, N., Renu Sharma y Juan Carrejo. "TEM/AFM correlative studies of thin-film metallization". Proceedings, annual meeting, Electron Microscopy Society of America 50, n.º 2 (agosto de 1992): 1414–15. http://dx.doi.org/10.1017/s042482010013170x.
Texto completoLIM, WEI QIANG, SUBRAMANI SHANMUGAN y MUTHARASU DEVARAJAN. "EVALUATION ON THE THERMAL AND STRUCTURAL PROPERTIES OF COPPER ALUMINUM OXIDE (Cu-Al2O3) THIN FILM ON AL SUBSTRATE: EFFECT OF ANNEALING TEMPERATURE". Surface Review and Letters 25, n.º 07 (octubre de 2018): 1950017. http://dx.doi.org/10.1142/s0218625x19500173.
Texto completoMozetič, M., A. Zalar y M. Drobnič. "Self-controlled diffusion of Al in Cu thin film". Vacuum 50, n.º 1-2 (mayo de 1998): 1–3. http://dx.doi.org/10.1016/s0042-207x(98)00016-5.
Texto completoWei, Xianshun, Chengxi Ying, Jing Wu, Haoran Jiang, Biao Yan y Jun Shen. "Fabrication, Corrosion, and Mechanical Properties of Magnetron Sputtered Cu–Zr–Al Metallic Glass Thin Film". Materials 12, n.º 24 (11 de diciembre de 2019): 4147. http://dx.doi.org/10.3390/ma12244147.
Texto completoPark, M., S. J. Krause y S. R. Wilson. "Growth kinetics of Al2Cu in an Al-1.5Cu thin film by in Situ TEM". Proceedings, annual meeting, Electron Microscopy Society of America 51 (1 de agosto de 1993): 1172–73. http://dx.doi.org/10.1017/s0424820100151696.
Texto completoJeon, I., Yong Bum Park, Hisahiro Inoue y Kikuo Kishimoto. "Thermo-Mechanical Stress in Passivated Al-0.5%Cu Thin Films". Key Engineering Materials 261-263 (abril de 2004): 507–12. http://dx.doi.org/10.4028/www.scientific.net/kem.261-263.507.
Texto completoLallouche, S. y M. Y. Debili. "Electrical Resistivity Improvement by Precipitation and Strain in Al-Cu Thin Films". Defect and Diffusion Forum 305-306 (octubre de 2010): 33–37. http://dx.doi.org/10.4028/www.scientific.net/ddf.305-306.33.
Texto completoSrivastava, C., G. Thompson, D. Reinhard, J. Sebastian, T. Prosa, D. Larson, Z. Reddy, S. Gupta, W. Butler y M. Weaver. "Atom Probe Tomography of Al-Cu Precipitation in an Al-5 at.%Cu Thin Film". Microscopy and Microanalysis 12, S02 (31 de julio de 2006): 1752–53. http://dx.doi.org/10.1017/s1431927606066207.
Texto completoXia, Yanqiu, Yanan Cao, Xin Feng y Haris M_ P_. "A comparative study on the electrical and tribological characteristic of magnetron sputtered Ag, Cu and Al films under current-carrying friction". Industrial Lubrication and Tribology 73, n.º 10 (19 de mayo de 2021): 1219–25. http://dx.doi.org/10.1108/ilt-07-2020-0267.
Texto completoPark, M., S. J. Krause y S. R. Wilson. "The effects of deposition and annealing condition on the microstractural evolution of Al-Cu and Al-Cu-Si thin films". Proceedings, annual meeting, Electron Microscopy Society of America 49 (agosto de 1991): 822–23. http://dx.doi.org/10.1017/s0424820100088427.
Texto completoRomig, A. D., D. R. Frear y T. J. Headley. "High-spatial-resolution x-ray microanalysis of Al-2wt.% Cu aluminum thin films". Proceedings, annual meeting, Electron Microscopy Society of America 47 (6 de agosto de 1989): 216–17. http://dx.doi.org/10.1017/s0424820100153051.
Texto completoSaoula, Imene, Chahinez Siad, Khedidja Djedidi, Nassiba Allag y Abdelouahad Chala. "Effect of (Al, Zn, Cu, and Sr) doping on structural, optical and electrical properties of sprayed SnO2 thin films". Acta Metallurgica Slovaca 29, n.º 2 (20 de junio de 2023): 59–62. http://dx.doi.org/10.36547/ams.29.2.1730.
Texto completoWENG Wei-xiang, 翁卫祥, 于光龙 YU Guang-long, 贾贞 JIA Zhen, 李昱 LI Yu y 郭太良 GUO Tai-liang. "Oxidation-Resistant of Cr/Cu/Al/Cr Thin Film Electrodes". Chinese Journal of Liquid Crystals and Displays 26, n.º 2 (2011): 183–87. http://dx.doi.org/10.3788/yjyxs20112602.0183.
Texto completoShute, C. J. y J. B. Cohen. "Determination of yielding and debonding in Al–Cu thin films from residual stress measurements via diffraction". Journal of Materials Research 6, n.º 5 (mayo de 1991): 950–56. http://dx.doi.org/10.1557/jmr.1991.0950.
Texto completoKandel, Hom, Milko Iliev, Nathan Arndt y Tar-Pin Chen. "Investigation of Phonon Vibrational Modes in Ga, Al, Fe, Co, Ni, and Zn Doped (110)-Oriented PBCO Thin Films". Advances in Materials Science and Engineering 2020 (28 de junio de 2020): 1–8. http://dx.doi.org/10.1155/2020/5937494.
Texto completoArora, Swati, Y. C. Sharma y Y. K. Vijay. "Resonant Tunnelling Diode Using Al-Se-Cu Thin Film Structure". Oxford Journal of Intelligent Decision and Data Science 2019 (2019): 1–7. http://dx.doi.org/10.5899/2019/ojids-00042.
Texto completoKumaresh, K. J., P. Deepak Raj y M. Sridharan. "Al and Cu Thin Film Capacitors for Void Fraction Measurement". Asian Journal of Applied Sciences 7, n.º 8 (1 de noviembre de 2014): 809–13. http://dx.doi.org/10.3923/ajaps.2014.809.813.
Texto completoChen, H. y S. M. Heald. "Glancing angle EXAFS studies of Cu-Al thin film interfaces". Physica B: Condensed Matter 158, n.º 1-3 (junio de 1989): 658–59. http://dx.doi.org/10.1016/0921-4526(89)90427-4.
Texto completoHaidara, Fanta, Marie-Christine Record, Benjamin Duployer y Dominique Mangelinck. "Solid state reactions in Al–Cu–Fe thin film systems". Intermetallics 21, n.º 1 (febrero de 2012): 62–66. http://dx.doi.org/10.1016/j.intermet.2011.09.010.
Texto completoSon, K. A., N. Missert, J. C. Barbour, J. J. Hren, R. G. Copeland y K. G. Minor. "Growth and Oxidation of Thin Film Al[sub 2]Cu". Journal of The Electrochemical Society 148, n.º 7 (2001): B260. http://dx.doi.org/10.1149/1.1376635.
Texto completoHafner, Martina, Andrei Ionut Mardare y Achim Walter Hassel. "Vapour phase co-deposition of Al-Cu thin film alloys". physica status solidi (a) 210, n.º 5 (mayo de 2013): 1006–12. http://dx.doi.org/10.1002/pssa.201200781.
Texto completoGrünwald, Eva, Robert Nuster, Günther Paltauf, Thomas Maier, Robert Wimmer-Teubenbacher, Ruth Konetschnik, Daniel Kiener, Verena Leitgeb, Anton Köck y Roland Brunner. "Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks". Materials Today: Proceedings 4, n.º 7 (2017): 7122–27. http://dx.doi.org/10.1016/j.matpr.2017.08.006.
Texto completoYang, Ying Xiang, Qing Nan Shi y Hong Lin Tan. "Effect of Annealing Temperature on Structural and Optical Properties of (Cu, Al):ZnO Thin Film by Sol-Gel Method". Advanced Materials Research 852 (enero de 2014): 314–18. http://dx.doi.org/10.4028/www.scientific.net/amr.852.314.
Texto completoAbd El-Fattah, Hanan A., Iman El-Mahallawi, Mostafa H. Shazly y Waleed A. Khalifa. "Microstructure Evolution of NiTi Magnetron Sputtered Thin Film on Different Substrates". Key Engineering Materials 835 (marzo de 2020): 68–74. http://dx.doi.org/10.4028/www.scientific.net/kem.835.68.
Texto completoXu, Jia Xiong. "Growth of Mo Thin Films on Flexible Polymer and Metal Foil Substrates for Solar Cell Application". Applied Mechanics and Materials 670-671 (octubre de 2014): 117–20. http://dx.doi.org/10.4028/www.scientific.net/amm.670-671.117.
Texto completoYang, Ying Xiang, Hong Lin Tan, Cheng Lin Ni y Chao Xiang. "The Structural and Optical Properties of(Cu, Al):ZnO Films". Advanced Materials Research 641-642 (enero de 2013): 547–50. http://dx.doi.org/10.4028/www.scientific.net/amr.641-642.547.
Texto completoPark, M., S. J. Krause y S. R. Wilson. "Processing and microstructure correlations of aluminum alloys for thin-film metallizations". Proceedings, annual meeting, Electron Microscopy Society of America 48, n.º 4 (agosto de 1990): 972–73. http://dx.doi.org/10.1017/s0424820100177994.
Texto completoMeng-Burany, X. y A. E. Curzon. "The effect of specimen tilt on back-scattered electron image contrast in scanning electron microscopy". Proceedings, annual meeting, Electron Microscopy Society of America 49 (agosto de 1991): 506–7. http://dx.doi.org/10.1017/s0424820100086830.
Texto completoCHEN, TAR-PIN, KE WU, S. Z. WANG, QI LI, BENJAMIN CHEN, UDOM TIPPARAACH y CHI-JEN CHEN. "FINITE SIZE EFFECT ON YBCO/PBCAO AND YBCO/PBCGO NANOMETER MULTILAYERS". International Journal of Modern Physics B 27, n.º 15 (4 de junio de 2013): 1362009. http://dx.doi.org/10.1142/s0217979213620099.
Texto completoLu, Ye Bo y Masumi Saka. "Effect of Surface Film on the Al Whisker Fabrication by Utilizing Stress Migration". Advanced Materials Research 630 (diciembre de 2012): 110–13. http://dx.doi.org/10.4028/www.scientific.net/amr.630.110.
Texto completoMuhunthan, N., Om Pal Singh, M. K. Thakur, P. Karthikeyan, Dinesh Singh, M. Saravanan y V. N. Singh. "Interfacial Properties of CZTS Thin Film Solar Cell". Journal of Solar Energy 2014 (26 de noviembre de 2014): 1–8. http://dx.doi.org/10.1155/2014/476123.
Texto completoLim, Wei Qiang, Mutharasu Devarajan y Shanmugan Subramani. "Performance of Cu-Al2O3 thin film as thermal interface material in LED package: thermal transient and optical output analysis". Microelectronics International 35, n.º 1 (2 de enero de 2018): 33–44. http://dx.doi.org/10.1108/mi-07-2016-0053.
Texto completoChen, Hsien-Wei, Kai-Chieh Hsu, Yu-Chen Chan, Jenq-Gong Duh, Jyh-Wei Lee, Jason Shian-Ching Jang y Guo-Ju Chen. "Antimicrobial properties of Zr–Cu–Al–Ag thin film metallic glass". Thin Solid Films 561 (junio de 2014): 98–101. http://dx.doi.org/10.1016/j.tsf.2013.08.028.
Texto completoShih, W. C. y A. L. Greer. "A new precipitate phase in Al-4wt. % Cu thin-film interconnects". Journal of Electronic Materials 23, n.º 12 (diciembre de 1994): 1315–23. http://dx.doi.org/10.1007/bf02649897.
Texto completoVenkatraman, Ramnath y John C. Bravman. "Separation of film thickness and grain boundary strengthening effects in Al thin films on Si". Journal of Materials Research 7, n.º 8 (agosto de 1992): 2040–48. http://dx.doi.org/10.1557/jmr.1992.2040.
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