Literatura académica sobre el tema "Copper"
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Artículos de revistas sobre el tema "Copper"
Honkanen, Mari, Minnamari Vippola y Toivo Lepistö. "Oxidation of copper alloys studied by analytical transmission electron microscopy cross-sectional specimens". Journal of Materials Research 23, n.º 5 (mayo de 2008): 1350–57. http://dx.doi.org/10.1557/jmr.2008.0160.
Texto completoXu, Xiaowei, Jing Hua, Houhu Zhang, Zehua Zhao, Yi Wang, Dapeng Zhang, Jun Zhang y Xiaoxi Chen. "Environmental Risk Assessment of Recycled Products of Spent Coppery Etchant in Jiangsu Province, China". International Journal of Environmental Research and Public Health 18, n.º 15 (26 de julio de 2021): 7881. http://dx.doi.org/10.3390/ijerph18157881.
Texto completoLalancette, N. y K. A. McFarland. "Phytotoxicity of Copper-Based Bactericides to Peach and Nectarine". Plant Disease 91, n.º 9 (septiembre de 2007): 1122–30. http://dx.doi.org/10.1094/pdis-91-9-1122.
Texto completoCarrillo, F., J. Martínez, R. Barrios y A. Roselló. "Kinetics of the conversion of copper sulfide to blister copper". Revista de Metalurgia 38, n.º 5 (30 de octubre de 2002): 334–38. http://dx.doi.org/10.3989/revmetalm.2002.v38.i5.416.
Texto completoThiele, D. J. y D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene". Molecular and Cellular Biology 6, n.º 4 (abril de 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158-1163.1986.
Texto completoThiele, D. J. y D. H. Hamer. "Tandemly duplicated upstream control sequences mediate copper-induced transcription of the Saccharomyces cerevisiae copper-metallothionein gene." Molecular and Cellular Biology 6, n.º 4 (abril de 1986): 1158–63. http://dx.doi.org/10.1128/mcb.6.4.1158.
Texto completoCooper, H. Kory, Garett Hunt, Nicholas Waber y Carey Gray. "Precontact Native Copper Innovation in British Columbia". Canadian Journal of Archaeology 44, n.º 2 (2020): 185–22. http://dx.doi.org/10.51270/44.2.185.
Texto completoCusick, Kathleen, Ane Iturbide, Pratima Gautam, Amelia Price, Shawn Polson, Madolyn MacDonald y Ivan Erill. "Enhanced copper-resistance gene repertoire in Alteromonas macleodii strains isolated from copper-treated marine coatings". PLOS ONE 16, n.º 9 (28 de septiembre de 2021): e0257800. http://dx.doi.org/10.1371/journal.pone.0257800.
Texto completoZhang, Jing, Jie Wang, Yong Gao, Yaocheng Hu, Yupeng Xie, Zhiming You y Sheng Wang. "Influence of Film Coating Thickness on Secondary Electron Emission Characteristics of Non-Evaporable Getter Ti-Hf-V-Zr Coated Open-Cell Copper Foam Substrates". Materials 15, n.º 6 (16 de marzo de 2022): 2185. http://dx.doi.org/10.3390/ma15062185.
Texto completoChang, Chao Cheng y Teng Chiao Wang. "Effects of Grain Size on Micro Backward Extrusion of Copper". Advanced Materials Research 83-86 (diciembre de 2009): 1092–98. http://dx.doi.org/10.4028/www.scientific.net/amr.83-86.1092.
Texto completoTesis sobre el tema "Copper"
Clark, Susan Ferguson. "Copper status in multiple trauma patients : measurement of copper balance, serum copper and ceruloplasmin /". This resource online, 1990. http://scholar.lib.vt.edu/theses/available/etd-09162005-115033/.
Texto completoGraca, D. S. "Effects of copper depletion on subcellular hepatic copper and biliary copper excretion in cattle". Thesis, University of Aberdeen, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.370105.
Texto completoClark, Susan F. "Copper status in multiple trauma patients: measurement of copper balance, serum copper and ceruloplasmin". Diss., Virginia Tech, 1990. http://hdl.handle.net/10919/39376.
Texto completoChanges in copper metabolism have been reported in both thermal injury and skeletal trauma; data regarding copper status in multiple trauma patients (MTP) are nonexistent. Hypercatabolism following multiple trauma may increase copper utilization, deplete copper stores and compromise cuproenzyme synthesis and function. The purpose of this study was to provide information on copper status in MTP and determine whether age, injury severity, clinical outcome or nutritional intake influenced copper status. Twenty-four hour copper losses, serum copper and ceruloplasmin were measured in 11 MTP with Injury Severity Scores (ISS) >12 at 24-48 hours post admission. Collections of biological fluids (urine, nasogastric, chest tube, drains, stools) were analyzed for copper using atomic absorption spectrophotometry (AAS) and quantified over 5 days. Serial serum copper and ceruloplasmin were determined on days 1,3,5,10,15 and patient discharge by ASS and rate nephelometry inmunoprecipition, respectively. Eight patients received parenteral nutrition (PN). Three received intravenous glucose/electrolyte infusions (IV). urine (n=11) and nasogastric losses (n=8) were statistically greater than normal (p<.001). The mean ± SEM cumulative copper losses of urine, chest tube drainage, nasogastric secretions and other drains were 790 ± 116 (n=11), 833 ± 130 (n=7), 261 ± 46 (n+8), and 150 ± 58 μg/5 d (n=8), respectively. Urinary losses represented 10 to 12 times the normal copper excretion. Serum copper on day 1 and ceruloplasmin day 3 were significantly higher than normal (p<.025). Cumulative copper balance in the IV group was - 2266 μg and -440 μg in the PN group. No relationship was found between copper loss and ISS. Patients in their twenties demonstrated the greatest urinary copper loss. The physiological and biochemical effects of extensive copper loss in the MTP require further evaluation. These patients may have a predisposition to copper deficiency due to excessive copper losses and may require increased copper supplementation.
Ph. D.
Reed, Stewart T. "Copper adsorption/desorption characteristics on copper amended soils". Diss., This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-06062008-171512/.
Texto completoMao, Zhong. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes : structural and photophysical studies /". View the Table of Contents & Abstract, 2003. http://sunzi.lib.hku.hk/hkuto/record/B26450859.
Texto completoMao, Zhong y 毛中. "Effects of copper-ligand and copper-copper interactions on excited state properties of luminescent copper (I) complexes: structural and photophysical studies". Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2003. http://hub.hku.hk/bib/B45015582.
Texto completoGremillion, Eric J. "Copper Kingdom". ScholarWorks@UNO, 2015. http://scholarworks.uno.edu/td/1973.
Texto completoTörndahl, Tobias. "Atomic Layer Deposition of Copper, Copper(I) Oxide and Copper(I) Nitride on Oxide Substrates". Doctoral thesis, Uppsala University, Department of Materials Chemistry, 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.
Texto completoThin films play an important role in science and technology today. By combining different materials, properties for specific applications can be optimised. In this thesis growth of copper, copper(I) oxide and copper(I) nitride on two different substrates, amorphous SiO2 and single crystalline α-Al2O3 by the so called Atomic Layer Deposition (ALD) techniques has been studied. This technique allows precise control of the growth process at monolayer level on solid substrates. Other characteristic features of ALD are that it produces films with excellent step coverage and good uniformity even as extremely thin films on complicated shaped substrates.
Alternative deposition schemes were developed for the materials of interest. It was demonstrated that use of intermediate water pulses affected the deposition pathways considerably. By adding water, the films are thought to grow via formation of an oxide over-layer instead of through a direct reaction between the precursors as in the case without water.
For growth of copper(I) nitride from Cu(hfac)2 and ammonia no film growth occurred without adding water to the growth process. The Cu3N films could be transformed into conducting copper films by post annealing. In copper growth from CuCl and H2 the water affected film growth on the alumina substrates considerably more than on the fused silica substrates. The existence of surface -OH and/or -NHx groups was often found to play an important role, according to both theoretical calculations and experimental results.
Törndahl, Tobias. "Atomic layer deposition of copper, copper(I) oxide and copper(I) nitride on oxide substrates /". Uppsala : Acta Universitatis Upsaliensis : Univ.-bibl. [distributör], 2004. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-4651.
Texto completoFitzsimons, Nuala Patricia. "Copper hydride as a precursor for supported copper catalysts". Thesis, University of Cambridge, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.281998.
Texto completoLibros sobre el tema "Copper"
R, Davis J. y ASM International. Handbook Committee., eds. Copper and copper alloys. Materials Park, OH: ASM International, 2001.
Buscar texto completoAtkinson, R. L. Copper and copper mining. Princes Risborough: Shire, 1987.
Buscar texto completoJohanson, Paula. Copper. New York: The Rosen Pub. Group, 2007.
Buscar texto completoC, Dameron, Howe Paul, National Research Centre for Environmental Toxicology (Australia), WHO Task Group on Environmental Health Criteria for Copper., United Nations Environment Programme, International Labour Organisation, World Health Organization, Inter-Organization Programme for the Sound Management of Chemicals. y International Program on Chemical Safety., eds. Copper. Geneva: World Health Organization, 1998.
Buscar texto completoUnited States. Agency for Toxic Substances and Disease Registry. Division of Toxicology. Copper. Atlanta, GA: Dept. of Health and Human Services, Public Health Service, Agency for Toxic Substances and Disease Registry, Division of Toxicology, 2004.
Buscar texto completoButler, L. J. Copper Empire. London: Palgrave Macmillan UK, 2007. http://dx.doi.org/10.1057/9780230589766.
Texto completoHohl, Joan. California copper. London: Silhouette Books, 1987.
Buscar texto completoHohl, Joan. California copper. Don Mills, Ont: Mira Books, 1995.
Buscar texto completoDraper, Sharon M. Copper sun. New York, N.Y: Simon Pulse, 2008.
Buscar texto completoCopper & copper alloys. Potters Bar: Copper Development Association, 1991.
Buscar texto completoCapítulos de libros sobre el tema "Copper"
Sequeira, C. A. C. "Copper and Copper Alloys". En Uhlig's Corrosion Handbook, 757–85. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470872864.ch56.
Texto completoFreudenberger, Jens y Hans Warlimont. "Copper and Copper Alloys". En Springer Handbook of Materials Data, 297–305. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-69743-7_12.
Texto completoKundig, Konrad J. A. y John G. Cowie. "Copper and Copper Alloys". En Mechanical Engineers' Handbook, 117–220. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2006. http://dx.doi.org/10.1002/0471777447.ch4.
Texto completoCastroviejo, Ricardo. "Copper(Cu/Native Copper)". En A Practical Guide to Ore Microscopy—Volume 1, 227–32. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-12654-3_37.
Texto completoBährle-Rapp, Marina. "copper". En Springer Lexikon Kosmetik und Körperpflege, 128. Berlin, Heidelberg: Springer Berlin Heidelberg, 2007. http://dx.doi.org/10.1007/978-3-540-71095-0_2406.
Texto completoKurtz, Wolfgang y Hans Vanecek. "Copper". En W Tungsten, 200–234. Berlin, Heidelberg: Springer Berlin Heidelberg, 1987. http://dx.doi.org/10.1007/978-3-662-08690-2_26.
Texto completoCrowson, Philip. "Copper". En Mining in the Asia-Pacific, 217–36. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-61395-6_13.
Texto completoLiu, Xingcheng y Xiaolin Xiong. "Copper". En Encyclopedia of Earth Sciences Series, 1–3. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-39193-9_216-1.
Texto completoLiu, Xingcheng y Xiaolin Xiong. "Copper". En Encyclopedia of Earth Sciences Series, 303–5. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-39312-4_216.
Texto completoCrowson, Phillip. "Copper". En Minerals Handbook 1992–93, 76–83. London: Palgrave Macmillan UK, 1992. http://dx.doi.org/10.1007/978-1-349-12564-7_12.
Texto completoActas de conferencias sobre el tema "Copper"
Okamoto, S., K. Hashimoto, T. Sato y K. Niwa. "Laser welding copper and copper alloys". En ICALEO® ‘89: Proceedings of the Materials Processing Conference. Laser Institute of America, 1989. http://dx.doi.org/10.2351/1.5058338.
Texto completoAng, X. F., A. T. Lin, J. Wei, Z. Chen y C. C. Wong. "Low Temperature Copper-Copper Thermocompression Bonding". En 2008 10th Electronics Packaging Technology Conference (EPTC). IEEE, 2008. http://dx.doi.org/10.1109/eptc.2008.4763467.
Texto completoRyding, David G., Douglas Allen y Richard H. Lee. "Brazing copper to dispersion-strengthened copper". En SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, editado por Ali M. Khounsary. SPIE, 1996. http://dx.doi.org/10.1117/12.259829.
Texto completoKishida, S., Y. Takada, Z. Yinan, J. M. Song y K. Yasuda. "Copper-Copper Ultrasonic Bonding by Using Blue Laser-Sintered Copper Nanoparticles". En 2022 International Conference on Electronics Packaging (ICEP). IEEE, 2022. http://dx.doi.org/10.23919/icep55381.2022.9795481.
Texto completoKim, Wooyoung, Seung Ho Han, Yongin Lee, Donggap Shin, Wonyoung Choi, Jiwon Moon, Kyeongbin Lim, BumKi Moon y Minwoo Daniel Rhee. "Copper contamination control in Hybrid Copper Bonding". En 2023 International Conference on Electronics Packaging (ICEP). IEEE, 2023. http://dx.doi.org/10.23919/icep58572.2023.10129740.
Texto completoZeng, Xian, Yu Zhang, Chengqiang Cui, Kai Zhang, Xun Chen, Xin Chen, Jian Gao, Yunbo He y Hui Tang. "Synthesis of copper nanoparticles using copper hydroxide". En 2018 19th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2018. http://dx.doi.org/10.1109/icept.2018.8480621.
Texto completoHu, Liangxing, Simon Chun Kiat Goh, Shaoteng Wu y Chuan Seng Tan. "Sputtered Copper Nitride-Copper Nitride Direct Bonding". En 2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2021. http://dx.doi.org/10.1109/ltb-3d53950.2021.9598450.
Texto completoDell'Erba, M., P. Sforza, G. Chita y L. Cento. "New Problems Emerging From CO 2 Laser Material Processing: Copper To Copper And Copper To Non-Copper Welding". En 1986 Int'l European Conf on Optics, Optical Systems, and Applications, editado por Stefano Sottini y Silvana Trigari. SPIE, 1987. http://dx.doi.org/10.1117/12.937099.
Texto completoSakamoto, Hirokatsu, Tadashi Teranishi, Rumi Nagai, Ryo Itaya y Akihiko Happoya. "Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C". En 2024 International Conference on Electronics Packaging (ICEP). IEEE, 2024. http://dx.doi.org/10.23919/icep61562.2024.10535679.
Texto completoGondcharton, P., B. Imbert, L. Benaissa y M. Verdier. "Copper-copper direct bonding: Impact of grain size". En 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM). IEEE, 2015. http://dx.doi.org/10.1109/iitc-mam.2015.7325657.
Texto completoInformes sobre el tema "Copper"
Kirkham, R. V. y W. D. Sinclair. Vein copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208010.
Texto completoDawson, K. M. y R. V. Kirkham. Skarn copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208018.
Texto completoSimon, N. J., E. S. Drexler y R. P. Reed. Properties of copper and copper alloys at cryogenic temperatures. Gaithersburg, MD: National Institute of Standards and Technology, 1992. http://dx.doi.org/10.6028/nist.mono.177.
Texto completoKirkham, R. V. Volcanic redbed copper. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/207986.
Texto completoEckstrand, O. R. Nickel-copper sulphide. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/208042.
Texto completoBlais, A. Copper Rand Mine. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132280.
Texto completoPalmer, D. A., J. M. Simonson y D. B. Joyce. Volatility of copper. Office of Scientific and Technical Information (OSTI), agosto de 1996. http://dx.doi.org/10.2172/285269.
Texto completoZhao, L., P. E. Phelan, R. C. Niemann y B. R. Weber. Thermal resistance across a copper/Kapton/copper interface at cryogenic temperatures. Office of Scientific and Technical Information (OSTI), septiembre de 1997. http://dx.doi.org/10.2172/554889.
Texto completoDelaney, G. D. Investigations of sediment-hosted copper and copper-uranium mineralization, Wollaston Domain. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1995. http://dx.doi.org/10.4095/205407.
Texto completoKidwell, David A. Measuring Copper in Seawater - An Automated Detection of Copper Binding Capacity. Fort Belvoir, VA: Defense Technical Information Center, diciembre de 2003. http://dx.doi.org/10.21236/ada419453.
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