Artículos de revistas sobre el tema "Ceramic multilayer system"
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Partsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen y D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems". Journal of Microelectronics and Electronic Packaging 8, n.º 3 (1 de julio de 2011): 95–101. http://dx.doi.org/10.4071/imaps.292.
Texto completoPartsch, Uwe, Adrian Goldberg, Martin Ihle, Gunter Hagen y D. Arndt. "Novel Technology Options for Multilayer-Based Ceramic Microsystems". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (1 de septiembre de 2011): 000166–71. http://dx.doi.org/10.4071/cicmt-2011-wa13.
Texto completoZiesche, Steffen, Adrian Goldberg, Uwe Partsch, Holger Kappert, Heidrun Kind, Mirko Aden y Falk Naumann. "On-turbine multisensors based on Hybrid Ceramic Manufacturing Technology". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (1 de julio de 2019): 000107–11. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000107.
Texto completoCegła, Marcin. "SPECIAL CERAMICS IN MULTILAYER BALLISTIC PROTECTION SYSTEMS". PROBLEMY TECHNIKI UZBROJENIA 147, n.º 3/2018 (4 de enero de 2019): 63–74. http://dx.doi.org/10.5604/01.3001.0012.8312.
Texto completoGurauskis, Jonas, Antonio Javier Sanchez-Herencia y Carmen Baudín. "Laminated Ceramic Structures within Alumina / YTZP System Obtained by Low Pressure Joining". Key Engineering Materials 333 (marzo de 2007): 219–22. http://dx.doi.org/10.4028/www.scientific.net/kem.333.219.
Texto completoQian, Zheng Hua, Feng Jin, Zi Kun Wang y Kikuo Kishimoto. "The Horizontally Polarized Shear Waves in Multilayered Piezo-Composites with 2-2 Connectivity". Key Engineering Materials 261-263 (abril de 2004): 465–70. http://dx.doi.org/10.4028/www.scientific.net/kem.261-263.465.
Texto completoGu, Yan, Yilong Feng, Junfeng Yang, Zhifu Liu, Tong Zhuang y Yongxiang Li. "Wire-bondable multilayer ceramic capacitors". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (1 de mayo de 2016): 000183–88. http://dx.doi.org/10.4071/2016cicmt-tha14.
Texto completoWang, Yunda, Ziyang Zhang, Tomoyasu Usui, Michael Benedict, Sakyo Hirose, Joseph Lee, Jamie Kalb y David Schwartz. "A high-performance solid-state electrocaloric cooling system". Science 370, n.º 6512 (1 de octubre de 2020): 129–33. http://dx.doi.org/10.1126/science.aba2648.
Texto completoMujiyono, Mujiyono, Didik Nurhadiyanto, Alaya Fadllu Hadi Mukhammad, Tri Widodo Besar Riyadi, Kristanto Wahyudi, Nur Kholis, Asri Peni Wulandari y Shukur bin Abu Hassan. "Damage formations of ramie fiber composites multilayer armour system under high-velocity impacts". Eastern-European Journal of Enterprise Technologies 1, n.º 12 (121) (24 de febrero de 2023): 16–25. http://dx.doi.org/10.15587/1729-4061.2023.273788.
Texto completoHuang, Cheng-Liang, Jsung-Ta Tsai y Han-Shui Hsueh. "Simplified multilayer ceramic planar filter for wireless communication system". Microwave and Optical Technology Letters 25, n.º 4 (20 de mayo de 2000): 233–35. http://dx.doi.org/10.1002/(sici)1098-2760(20000520)25:4<233::aid-mop2>3.0.co;2-s.
Texto completoKot, Marcin, Kinga Chronowska-Przywara, Łukasz Major y Juergen Lackner. "Adhesion of Cr/CrN Multilayers to Steel Substrates". Applied Mechanics and Materials 759 (mayo de 2015): 27–35. http://dx.doi.org/10.4028/www.scientific.net/amm.759.27.
Texto completoCapraro, Beate, Manuel Heidenreich y Jörg Töpfer. "Large Thermal Expansion LTCC System for Cofiring with Integrated Functional Ceramics Layers". Materials 15, n.º 2 (12 de enero de 2022): 564. http://dx.doi.org/10.3390/ma15020564.
Texto completoDericioglu, Arcan F., Y. F. Liu y Yutaka Kagawa. "Extensive deformation behavior of an all-oxide Al2O3-TiO2 nanostructured multilayer ceramic at room temperature". Journal of Materials Research 24, n.º 11 (noviembre de 2009): 3387–96. http://dx.doi.org/10.1557/jmr.2009.0418.
Texto completoGu, Xiao Wei, Xiao An Bao, Cheng Hai Yu, Xiong Wei Li y Li Cao. "Design of Embedded and Miniaturized Multilayer LTCC Hairpin Bandpass Filters". Advanced Materials Research 542-543 (junio de 2012): 846–49. http://dx.doi.org/10.4028/www.scientific.net/amr.542-543.846.
Texto completoZhang, Wenli, Yipeng Su y Fred C. Lee. "Multilayer Ferrite Inductor Substrate for Ceramic-Based High Current Point-of-Load (POL) Converter". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, CICMT (1 de mayo de 2016): 000039–46. http://dx.doi.org/10.4071/2016cicmt-tp2a2.
Texto completoNgah, N. A., Amiza Rasmi, Azmi Ibrahim, Zulkifli Ambak, Mohd Zulfadli Mohamed Yusoff y Rosidah Alias. "Thermal Management Study of LTCC PIN Photodiode Module". Materials Science Forum 934 (octubre de 2018): 13–17. http://dx.doi.org/10.4028/www.scientific.net/msf.934.13.
Texto completoQuy, Le Minh y Tran Ich Thinh. "Plastic damage evolution in multilayer coatings/ductile substrate system under spherical indentation: Influence of a metallic interlayer". Vietnam Journal of Mechanics 27, n.º 2 (28 de junio de 2005): 86–95. http://dx.doi.org/10.15625/0866-7136/27/2/5718.
Texto completoZhu, Ji Jun, Ju Long Yuan y Simon S. Ang. "Study on the Polishing Mechanism of Low Temperature Co-Fired Ceramic for Microsystem Application". Key Engineering Materials 375-376 (marzo de 2008): 47–51. http://dx.doi.org/10.4028/www.scientific.net/kem.375-376.47.
Texto completoFerraro, Peter, Sugianto Hanggodo, Ian Burn, Amanda Baker y Weiguo Qu. "Use of Polyalkylene Carbonate Binders for Improved Performance in Multilayer Ceramic Capacitors". International Symposium on Microelectronics 2011, n.º 1 (1 de enero de 2011): 000785–88. http://dx.doi.org/10.4071/isom-2011-wp4-paper2.
Texto completoAliouat, M., B. Itaalit, N. Amaouz y Ahcène Chaouchi. "Low Temperature Sintering and Characterization of MgTiO3". Applied Mechanics and Materials 61 (junio de 2011): 95–99. http://dx.doi.org/10.4028/www.scientific.net/amm.61.95.
Texto completoTang, G. y Y. L. Shen. "Numerical Assessment of Compressive Deformation in Metal-Ceramic Multilayer Micro-Pillars". Journal of Mechanics 35, n.º 02 (30 de octubre de 2017): 199–207. http://dx.doi.org/10.1017/jmech.2017.96.
Texto completoEngel, Guenter F. "Material Requirements for Power and High Temperature Multilayer Ceramic Capacitors (MLCC)". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (1 de septiembre de 2015): 000021–28. http://dx.doi.org/10.4071/cicmt-ta12.
Texto completoAkhmedov, Abduraxman, Galina Sauchuk, Natallia Yurkevich, Sardorbek Khudoyberganov, Mahammatyakub Bazarov y Karimberdi Karshiev. "The influence of production conditions on the electrophysical parameters of piezoceramics for different applications". E3S Web of Conferences 264 (2021): 04020. http://dx.doi.org/10.1051/e3sconf/202126404020.
Texto completoZhu, Xiao Li, Zhong Hua Wang y Paula M. Vilarinho. "Cu3TeO6 Dielectric Thick Films: Processing by Electrophoretic Deposition and Electrical Characterization". Key Engineering Materials 654 (julio de 2015): 114–21. http://dx.doi.org/10.4028/www.scientific.net/kem.654.114.
Texto completoHarun, Zawati, Tze Ching Ong y Rosli Ahmad. "Estimation of Water Desorption in Drying of Membrane Structure System". Advanced Materials Research 1004-1005 (agosto de 2014): 405–8. http://dx.doi.org/10.4028/www.scientific.net/amr.1004-1005.405.
Texto completoHuh, Yong Hak, Dong Iel Kim, Dong Jin Kim, Kyung Ho Lee y Dong Jin Kim. "Measurement of Adhesion Strength for Patterned Single Layer Ceramic Capacitor Sheet". Key Engineering Materials 345-346 (agosto de 2007): 1181–84. http://dx.doi.org/10.4028/www.scientific.net/kem.345-346.1181.
Texto completoMarkowski, Piotr M. "Multilayer thick-film thermoelectric microgenerator based on LTCC technology". Microelectronics International 33, n.º 3 (1 de agosto de 2016): 155–61. http://dx.doi.org/10.1108/mi-05-2016-0038.
Texto completoHenry, Jim, Orville Brown, Ed Graddy, Ed Stadnicar y Bob Gardner. "New Ferro L8 LTCC System Ready for High Reliability Electronic Packaging Applications". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (1 de septiembre de 2011): 000119–26. http://dx.doi.org/10.4071/cicmt-2011-tp31.
Texto completoBaba, Ryosuke, Tomoaki Karaki y Tadashi Fujii. "Vertical morphotropic phase boundary in lead-free piezoelectric ceramics (K,Na,Li)NbO3–BaZrO3–(La,Na)TiO3 system". Journal of Advanced Dielectrics 06, n.º 02 (junio de 2016): 1650008. http://dx.doi.org/10.1142/s2010135x16500089.
Texto completoChen, Z. y J. J. Mecholsky. "Control of strength and toughness of ceramic/metal laminates using interface design". Journal of Materials Research 8, n.º 9 (septiembre de 1993): 2362–69. http://dx.doi.org/10.1557/jmr.1993.2362.
Texto completoWang, Xiuwu, Kai Wei, Yong Tao, Xujing Yang, Hao Zhou, Rujie He y Daining Fang. "Thermal protection system integrating graded insulation materials and multilayer ceramic matrix composite cellular sandwich panels". Composite Structures 209 (febrero de 2019): 523–34. http://dx.doi.org/10.1016/j.compstruct.2018.11.004.
Texto completoAlonso-Olazabal, Ainhoa, Luis Angel Ortega, Maria Cruz Zuluaga, Graciela Ponce-Antón, Javier Jiménez Echevarría y Carmen Alonso Fernández. "Compositional Characterization and Chronology of Roman Mortars from the Archaeological Site of Arroyo De La Dehesa De Velasco (Burgo De Osma- Ciudad De Osma, Soria, Spain)". Minerals 10, n.º 5 (28 de abril de 2020): 393. http://dx.doi.org/10.3390/min10050393.
Texto completoLi, Chuanhao, Mingdong Yi, Gaofeng Wei y Chonghai Xu. "Synthesis and Mechanical Characterization of a Ti(C,N)/Mo–Co–Ni/CaF2@Al2O3 Self-Lubricating Cermet". Materials 12, n.º 23 (30 de noviembre de 2019): 3981. http://dx.doi.org/10.3390/ma12233981.
Texto completoShi, J. Z., X. M. Xie, F. Stubhan y J. Freytag. "A Novel High Performance Die Attach for Ceramic Packages". Journal of Electronic Packaging 122, n.º 2 (15 de marzo de 1999): 168–71. http://dx.doi.org/10.1115/1.483150.
Texto completoDai, Kun, Ruina Ma, Xing Wang, Zhaoyang Zheng, Yongzhe Fan, Xue Zhao, An Du y Xiaoming Cao. "Quantifying the Improvement in Dielectric Properties of BaSrTiO3-Based Ceramics by Adding MgO". Materials 15, n.º 8 (14 de abril de 2022): 2875. http://dx.doi.org/10.3390/ma15082875.
Texto completoWisniewski, Pawel, Ryszard Sitek, Aleksandra Towarek, Emilia Choinska, Dorota Moszczynska y Jaroslaw Mizera. "Molding Binder Influence on the Porosity and Gas Permeability of Ceramic Casting Molds". Materials 13, n.º 12 (16 de junio de 2020): 2735. http://dx.doi.org/10.3390/ma13122735.
Texto completoGajdardziska-Josifovska, M., M. R. McCartney, W. J. de Ruijter, C. M. Scanlan y C. R. Aita. "HREM study of tetragonal zirconia in Al2O3/ZrO2 multilayers". Proceedings, annual meeting, Electron Microscopy Society of America 52 (1994): 754–55. http://dx.doi.org/10.1017/s042482010017150x.
Texto completoEstournès, Claude, Djar Oquab, Serge Selezneff, Mathieu Boidot, Daniel Monceau, D. Grossin, Christophe Drouet et al. "Shaping of Nanostructured Materials or Coatings through Spark Plasma Sintering". Materials Science Forum 706-709 (enero de 2012): 24–30. http://dx.doi.org/10.4028/www.scientific.net/msf.706-709.24.
Texto completoHarun, Zawati, Nazri Mohd Nawi, Mohd Faizal Batcha y David Gethin. "Modeling of Layering Ceramic Shell Mould". Applied Mechanics and Materials 232 (noviembre de 2012): 548–52. http://dx.doi.org/10.4028/www.scientific.net/amm.232.548.
Texto completoSchulz, Alexander, Tilo Welker, Nam Gutzeit, Dirk Stoepel, Frank Wollenschlaeger y Jens Mueller. "Optimized cavities for microwave applications using the new low loss LTCC material Du Pont 9k7". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (1 de septiembre de 2012): 000258–62. http://dx.doi.org/10.4071/cicmt-2012-tp65.
Texto completoPEPIN, JOHN G. "Subsolidus Phase Relations in the System Pd-Ag-O and Application to Multilayer Ceramic Capacitor Electrodes". Advanced Ceramic Materials 3, n.º 5 (septiembre de 1988): 517–19. http://dx.doi.org/10.1111/j.1551-2916.1988.tb00269.x.
Texto completoBartnitzek, Thomas, Torsten Thelemann, Stefan Apel y Karl-Heinz Suphan. "Advantages and limitations of ceramic packaging technologies in harsh applications". International Symposium on Microelectronics 2016, n.º 1 (1 de octubre de 2016): 000581–85. http://dx.doi.org/10.4071/isom-2016-thp23.
Texto completoZaraska, Krzysztof, Janina Gaudyn, Adam Bieńkowski, Marek Dohnalik, Andrzej Czerwiński, Mariusz Płuska y Monika Machnik. "X-Ray Inspection of LTCC Devices". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, CICMT (1 de septiembre de 2011): 000215–23. http://dx.doi.org/10.4071/cicmt-2011-wp13.
Texto completoZhong, Jie, Dongling Yang, Shuangquan Guo, Xiaofeng Zhang, Xinghua Liang y Xi Wu. "Rear Earth Oxide Multilayer Deposited by Plasma Spray-Physical Vapor Deposition for Envisaged Application as Thermal/Environmental Barrier Coating". Coatings 11, n.º 8 (26 de julio de 2021): 889. http://dx.doi.org/10.3390/coatings11080889.
Texto completoDai, Steve y Lung-Hwa Hsieh. "Miniature Lowpass Filters in Low Loss 9k7 LTCC". Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (1 de septiembre de 2015): 000054–57. http://dx.doi.org/10.4071/cicmt-tp11.
Texto completoOdinokov, V. I., A. I. Evstigneev, E. A. Dmitriev, D. V. Chernyshova y A. A. Evstigneeva. "Morphological structure of shell mould in investment casting". Izvestiya. Ferrous Metallurgy 65, n.º 10 (30 de octubre de 2022): 740–47. http://dx.doi.org/10.17073/0368-0797-2022-10-740-747.
Texto completoVereshchaka, A. S., A. A. Vereshchaka y A. K. Kirillov. "Ecologically Friendly Dry Machining by Cutting Tool from Layered Composition Ceramic with Nano-Scale Multilayered Coatings". Key Engineering Materials 496 (diciembre de 2011): 67–74. http://dx.doi.org/10.4028/www.scientific.net/kem.496.67.
Texto completoKIM, Bok-Hee, Woo-Jin LEE y Jong-Hee KIM. "Fabrication of Temperature-Stable Multilayer Ceramic Capacitor in the (1 -x-y)PMN-xPT-yPNW Ternary System." Journal of the Ceramic Society of Japan 111, n.º 1291 (2003): 212–16. http://dx.doi.org/10.2109/jcersj.111.212.
Texto completoTick, T. y H. Jantunen. "An X-Ray Imaging-Based Layer Alignment and Tape Deformation Inspection System for Multilayer Ceramic Circuit Boards". IEEE Transactions on Electronics Packaging Manufacturing 31, n.º 2 (abril de 2008): 168–73. http://dx.doi.org/10.1109/tepm.2008.919330.
Texto completoChun, Doo-Man, Chung-Soo Kim, Jung-Oh Choi, Gil-Yong Lee, Caroline Sunyong Lee y Sung-Hoon Ahn. "Multilayer deposition of ceramic and metal at room temperature using nanoparticle deposition system (NPDS) and planarization process". International Journal of Advanced Manufacturing Technology 72, n.º 1-4 (5 de octubre de 2013): 41–46. http://dx.doi.org/10.1007/s00170-013-5327-9.
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