Literatura académica sobre el tema "BONDPAD"
Crea una cita precisa en los estilos APA, MLA, Chicago, Harvard y otros
Consulte las listas temáticas de artículos, libros, tesis, actas de conferencias y otras fuentes académicas sobre el tema "BONDPAD".
Junto a cada fuente en la lista de referencias hay un botón "Agregar a la bibliografía". Pulsa este botón, y generaremos automáticamente la referencia bibliográfica para la obra elegida en el estilo de cita que necesites: APA, MLA, Harvard, Vancouver, Chicago, etc.
También puede descargar el texto completo de la publicación académica en formato pdf y leer en línea su resumen siempre que esté disponible en los metadatos.
Artículos de revistas sobre el tema "BONDPAD"
CHEN, H. Y., Z. Q. MO, L. H. AN y Y. N. HUA. "APPLICATION OF AUGER ELECTRON SPECTROSCOPY AND X-RAY PHOTOELECTRON SPECTROSCOPY ANALYSIS IN FAILURE ANALYSIS OF WAFER FABRICATION". Surface Review and Letters 08, n.º 05 (octubre de 2001): 435–39. http://dx.doi.org/10.1142/s0218625x01001191.
Texto completoRetnasamy, Vithyacharan, Zaliman Sauli, Nabilah Fathiah Abd Ghani, Hussin Kamarudin, Norhawati Ahmad, Aaron Koay Terr Yeow y Wan Mokhdzani Wan Norhaimi. "Thermal Stress Comparison on Copper and Gold Wire Bonded on Aluminium Bondpad". Advanced Materials Research 1082 (diciembre de 2014): 323–26. http://dx.doi.org/10.4028/www.scientific.net/amr.1082.323.
Texto completoCher Ming Tan y Zhenghao Gan. "Failure mechanisms of aluminum bondpad peeling during thermosonic bonding". IEEE Transactions on Device and Materials Reliability 3, n.º 2 (junio de 2003): 44–50. http://dx.doi.org/10.1109/tdmr.2003.814408.
Texto completoGaridel, Sophie, Jean-Pierre Vilcot, Mohammed Zaknoune y Pascal Tilmant. "Versatile bondpad report process for non-planar compound semiconductor devices". Microelectronic Engineering 71, n.º 3-4 (mayo de 2004): 358–62. http://dx.doi.org/10.1016/j.mee.2004.03.082.
Texto completoBaggerman, A. F. J. y F. J. H. Kessels. "Cracking Behaviour during Au‐Au TAB Inner Lead Bonding". Microelectronics International 10, n.º 2 (1 de febrero de 1993): 15–19. http://dx.doi.org/10.1108/eb044496.
Texto completoUlliac, Gwenn, Sophie Garidel, Jean-Pierre Vilcot y Pascal Tilmant. "Air-bridge interconnection and bondpad process for non-planar compound semiconductor devices". Microelectronic Engineering 81, n.º 1 (julio de 2005): 53–58. http://dx.doi.org/10.1016/j.mee.2005.02.006.
Texto completoRetnasamy, Vithyacharan, Zaliman Sauli, Moganraj Palianysamy, Steven Taniselass, Phaklen Ehkan y Fairul Afzal Ahmad Fuad. "Wettability Study Using O2 and Ar RIE Gas Treatment on Aluminium Surface". Advanced Materials Research 896 (febrero de 2014): 233–36. http://dx.doi.org/10.4028/www.scientific.net/amr.896.233.
Texto completoGan, C. L., E. K. Ng, B. L. Chan, U. Hashim y F. C. Classe. "Technical Barriers and Development of Cu Wirebonding in Nanoelectronics Device Packaging". Journal of Nanomaterials 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/173025.
Texto completoZegaoui, M., N. Choueib, P. Tilmant, M. François, C. Legrand, J. Chazelas y D. Decoster. "A Novel Bondpad report process for III–V semiconductor devices using full HSQ properties". Microelectronic Engineering 86, n.º 1 (enero de 2009): 68–71. http://dx.doi.org/10.1016/j.mee.2008.09.043.
Texto completoColvin, J. T., S. S. Bhatia y K. K. O. "Effects of substrate resistances on LNA performance and a bondpad structure for reducing the effects in a silicon bipolar technology". IEEE Journal of Solid-State Circuits 34, n.º 9 (1999): 1339–44. http://dx.doi.org/10.1109/4.782095.
Texto completoTesis sobre el tema "BONDPAD"
Chandrasekaran, Arvind. "Effect of encapsulant on high-temperature reliability of the gold wirebond-aluminum bondpad interface". College Park, Md. : University of Maryland, 2003. http://hdl.handle.net/1903/281.
Texto completoThesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
Mohd-Shariff, M. H. B. "Analysis of finite deformation of bonded and non-bonded rubber mountings". Thesis, University of Newcastle Upon Tyne, 1985. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.355075.
Texto completoBaggerman, Jacob. "Photoactive hydrogen-bonded rotaxanes". [S.l. : Amsterdam : s.n.] ; Universiteit van Amsterdam [Host], 2006. http://dare.uva.nl/document/23505.
Texto completoWillis, Kimberly. "Hydrogen-bonded liquid crystals". Thesis, University of Sheffield, 1997. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.266002.
Texto completoMARTÍNEZ, OLGUÍN GEMA JURIE. "Análisis comparativo de los rendimientos sectoriales de la BMV y de BIVA a través de las técnicas Logit y VaR, 2018". Tesis de Licenciatura, UNIVERSIDAD AUTONOMA DEL ESTADO DE MEXICO, 2020. http://hdl.handle.net/20.500.11799/109149.
Texto completoSarmiento, Eljadue Nataly. "¿Bondad o estrategia? tejiendo responsibilidad social en el mundo del carbón /". Bogotá, D.C., Colombia : Universidad de los Andes, Facultad de Ciencias Sociales-Ceso, Departamento de Ciencia Política, 2008. http://catalog.hathitrust.org/api/volumes/oclc/390710419.html.
Texto completoBressani, Luiz Antonio. "Experimental properties of bonded soils". Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/7538.
Texto completoAl-Jazairy, Yousra H. "Microleakage of bonded amalgam restorations". Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1996. http://www.collectionscanada.ca/obj/s4/f2/dsk3/ftp04/mq23196.pdf.
Texto completoMiller, Tad W. "Modified intermetallic-bonded diamond composites /". Available to subscribers only, 2006. http://proquest.umi.com/pqdweb?did=1136092311&sid=16&Fmt=2&clientId=1509&RQT=309&VName=PQD.
Texto completo"Department of Mechanical Engineering and Energy Processes." Includes bibliographical references (leaves 99-102). Also available online.
Piermattei, Alessio. "Liquid crystalline hydrogen-bonded rosettes". Enschede : University of Twente [Host], 2007. http://doc.utwente.nl/57859.
Texto completoLibros sobre el tema "BONDPAD"
Āracci, Sujīva Prasanna. Bonda mīdun =: Bondha meedum. Nugēgoḍa: Sujīva Prasanna Āracci, 2001.
Buscar texto completoMedina, Sarah. Bondad. Chicago, Ill: Heinemann Library, 2007.
Buscar texto completoCuánta bondad! Buenos Aires: Ediciones de la Flor, 1999.
Buscar texto completoWilliams, Sam. La bondad. Vero Beach, FL: Rourke Educational Media, 2014.
Buscar texto completoGuache, Angel y Ángel Guache. Media hora de bondad. Valencia: Pre-Textos, 1995.
Buscar texto completoLim, Catherine. The bondmaid. Woodstock, N.Y: Overlook Press, 1997.
Buscar texto completoLim, Catherine. The bondmaid. Singapore: Catherine Lim Pub., 1995.
Buscar texto completoThe bondmaid. Singapore: Marshall Cavendish Editions, 2011.
Buscar texto completoLim, Catherine. The bondmaid. London: BCA, 1997.
Buscar texto completoBicknell, Les. Bonded. [U.K.]: [Les Bicknell], 1996.
Buscar texto completoCapítulos de libros sobre el tema "BONDPAD"
Takekuro, Makiko. "Chapter 4. Bonded but un-bonded". En Bonding through Context, 85–103. Amsterdam: John Benjamins Publishing Company, 2020. http://dx.doi.org/10.1075/pbns.314.04tak.
Texto completoMegliani, Mauro. "Bonded Debt". En Sovereign Debt, 351–86. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-08464-0_12.
Texto completoMegliani, Mauro. "Bonded Debt". En Sovereign Debt, 523–60. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-08464-0_17.
Texto completoMegliani, Mauro. "Bonded Debt". En Sovereign Debt, 205–36. Cham: Springer International Publishing, 2014. http://dx.doi.org/10.1007/978-3-319-08464-0_7.
Texto completoZimmer, William F. "Bonded Abrasives". En Handbook of Adhesives, 664–70. Boston, MA: Springer US, 1990. http://dx.doi.org/10.1007/978-1-4613-0671-9_39.
Texto completoBennett, Tony y Janet Woollacott. "Bonded Ideologies". En Bond and Beyond, 93–142. London: Macmillan Education UK, 1987. http://dx.doi.org/10.1007/978-1-349-18610-5_5.
Texto completoEnhuber, Tamara. "Bonded Labor". En Humiliation, Degradation, Dehumanization, 191–212. Dordrecht: Springer Netherlands, 2010. http://dx.doi.org/10.1007/978-90-481-9661-6_14.
Texto completoGooch, Jan W. "Bonded Adhesive". En Encyclopedic Dictionary of Polymers, 89. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_1484.
Texto completoGooch, Jan W. "Bonded Fabric". En Encyclopedic Dictionary of Polymers, 89. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_1485.
Texto completoSamonova, Elena. "Bonded labour". En Modern Slavery and Bonded Labour in South Asia, 58–97. Abingdon, Oxon ; New York, NY : Routledge, 2019. | Series: Routledge research on Asian development ; 5: Routledge, 2019. http://dx.doi.org/10.4324/9780429054952-4.
Texto completoActas de conferencias sobre el tema "BONDPAD"
Hua, Younan N. "Failure Analysis of Discolored Bondpads in Wafer Fabrication". En ISTFA 1999. ASM International, 1999. http://dx.doi.org/10.31399/asm.cp.istfa1999p0149.
Texto completoYounan, Hua, Mo Zhiqiang, Zhao Siping y Gong Hao. "Studies of Galvanic Corrosion (Al-Ti Cell) on Microchip Al Bondpads and Elimination Solutions". En ISTFA 2007. ASM International, 2007. http://dx.doi.org/10.31399/asm.cp.istfa2007p0193.
Texto completoHua, Younan, Nistala Ramesh Rao, Yanjing Yang, Siping Zhao y Redkar Shailesh. "Simulation Studies on Fluorine Spec Limit for Process Monitoring of Microchip Al Bondpads in Wafer Fabrication". En ISTFA 2013. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.istfa2013p0134.
Texto completoYounan, Hua. "Studies on a Failure Analysis Flow of Surface Contamination, Corrosion, and Underetch on Microchip Al Bondpads in Wafer Fabrication". En ISTFA 2005. ASM International, 2005. http://dx.doi.org/10.31399/asm.cp.istfa2005p0274.
Texto completoYounan, Hua. "Studies and Application of Auger Monitoring System for Quality Control and Assurance of Al Bondpads". En ISTFA 2016. ASM International, 2016. http://dx.doi.org/10.31399/asm.cp.istfa2016p0287.
Texto completoWilliams, Brett, Robert Davis, Justin Yerger, Derryl Allman, Bruce Greenwood y Troy Ruud. "Bondpad Design Structural vs. Electrical Tradeoffs". En 2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC). IEEE, 2020. http://dx.doi.org/10.1109/asmc49169.2020.9185255.
Texto completoYounan, Hua, Nistala Ramesh Rao, Ng Adrian y Tsai Tony. "Studies on a Qualification Method (OSAT) of Microchip Al Bondpads in Wafer Fabrication". En ISTFA 2009. ASM International, 2009. http://dx.doi.org/10.31399/asm.cp.istfa2009p0289.
Texto completoHua, Y. N., S. Redkar, C. K. Lau y Z. Q. Mo. "A Study on Non-Stick Aluminium Bondpads Due to Fluorine Contamination Using SEM, EDX, TEM, IC, AUGER, XPS and TOF-SIMS Techniques". En ISTFA 2002. ASM International, 2002. http://dx.doi.org/10.31399/asm.cp.istfa2002p0495.
Texto completoJacob, Peter y Giovanni Nicoletti. "New FIB-Supported Approach for Wire-Bondpad Characterization". En ISTFA 2000. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.istfa2000p0035.
Texto completoBorremans, J., P. Wambacq, G. van der Plas, Y. Rolian y M. Kuijk. "A Bondpad-Size Narrowband LNA for Digital CMOS". En 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. IEEE, 2007. http://dx.doi.org/10.1109/rfic.2007.380973.
Texto completoInformes sobre el tema "BONDPAD"
Gabler, Jason. Better Bonded Ethernet Load Balancing. Office of Scientific and Technical Information (OSTI), septiembre de 2006. http://dx.doi.org/10.2172/883778.
Texto completoAytug, Tolga. Atomically Bonded Transparent Superhydrophobic Coatings. Office of Scientific and Technical Information (OSTI), agosto de 2015. http://dx.doi.org/10.2172/1209210.
Texto completoBanks, H. T., Gabriella A. Pinter y O. H. Yeoh. Analysis of Bonded Elastic Blocks. Fort Belvoir, VA: Defense Technical Information Center, enero de 2001. http://dx.doi.org/10.21236/ada454440.
Texto completoPlucknett, K. P., T. N. Tiegs, K. B. Alexander, P. F. Becher, J. H. Schneibel, S. B. Waters y P. A. Menchhofer. Intermetallic bonded ceramic matrix composites. Office of Scientific and Technical Information (OSTI), julio de 1995. http://dx.doi.org/10.2172/102180.
Texto completoVerhoeven, Stephan. Bonded Repair of Corrosion Grind-Outs. Fort Belvoir, VA: Defense Technical Information Center, abril de 2005. http://dx.doi.org/10.21236/ada437177.
Texto completoTsai, Hsi C., James Alper y David Barrett. Failure Analysis of Composite Bonded Joints. Fort Belvoir, VA: Defense Technical Information Center, marzo de 1999. http://dx.doi.org/10.21236/ada375743.
Texto completoKurfurst, P. J. y J. G. Bisson. Dynamic Properties of Ice - Bonded Sediments. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1991. http://dx.doi.org/10.4095/132232.
Texto completoTan, Seng C. Analysis of Bolted and Bonded Composite. Fort Belvoir, VA: Defense Technical Information Center, septiembre de 1992. http://dx.doi.org/10.21236/ada267792.
Texto completoPlucknett, K. P., T. N. Tiegs y K. B. Alexander. Metallic and intermetallic-bonded ceramic composites. Office of Scientific and Technical Information (OSTI), mayo de 1995. http://dx.doi.org/10.2172/105123.
Texto completoBeili, E. ATM-Based xDSL Bonded Interfaces MIB. RFC Editor, febrero de 2013. http://dx.doi.org/10.17487/rfc6768.
Texto completo