Libros sobre el tema "Bonding wire"
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Chauhan, Preeti S., Anupam Choubey, ZhaoWei Zhong y Michael G. Pecht. Copper Wire Bonding. New York, NY: Springer New York, 2014. http://dx.doi.org/10.1007/978-1-4614-5761-9.
Texto completoHarman, George G. Wire bonding in microelectronics: Materials, processes, reliability, and yield. 2a ed. New York: McGraw-Hill, 1997.
Buscar texto completoSchwizer, Jürg. Force sensors for microelectronic packaging applications. Berlin: Springer, 2004.
Buscar texto completoPrasad, Shankara K. Advanced wirebond interconnection technology. Boston: Kluwer Academic Publishers, 2004.
Buscar texto completoHager, Christian. Lifetime estimation of aluminum wire bonds based on computational plasticity. Konstanz: Hartung-Gorre, 2000.
Buscar texto completoInternational Society for Hybrid Microelectronics., ed. Reliability and yield problems of wire bonding in microelectronics: The application of materials and interface science. Reston, Va: International Society for Hybrid Microelectronics, 1989.
Buscar texto completoM, Mayer y Brand Oliver 1964-, eds. Force sensors for microelectronic packaging applications. Berlin: Springer, 2005.
Buscar texto completoCenter for Women's Resources (Philippines) y International Consultation on Micro-Chips Technology (1986 Manila, Philippines). From bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Quezon City: Center for Women's Resources, 1988.
Buscar texto completoCopper Wire Bonding. Springer-Verlag New York Inc., 2013.
Buscar texto completoPecht, Michael G., ZhaoWei Zhong, Preeti S. Chauhan y Anupam Choubey. Copper Wire Bonding. Springer London, Limited, 2013.
Buscar texto completoCopper Wire Bonding. Springer New York, 2016.
Buscar texto completoWire Bonding In Microelectronics. McGraw-Hill Professional Publishing, 2010.
Buscar texto completoGallaugher, Matthew. Surface characterization of gold bonding wire for high density interconnect applications. 2007.
Buscar texto completoThe 2006-2011 World Outlook for Saws and Scribing-Fracturing, Die Bonding, and Wire Bonding Semiconductor Assembly Dicing Machines. Icon Group International, Inc., 2005.
Buscar texto completoParker, Philip M. The 2007-2012 World Outlook for Saws and Scribing-Fracturing, Die Bonding, and Wire Bonding Semiconductor Assembly Dicing Machines. ICON Group International, Inc., 2006.
Buscar texto completoPrasad, Shankara K. Advanced Wirebond Interconnection Technology. Springer, 2004.
Buscar texto completosr, swamy. Strong Bonding of Wife and Husband: S-Formula India. Independently Published, 2017.
Buscar texto completoFrom bonding wires to banding women: Proceedings of the International Consultation on Micro-Chips Technology, Manila, Philippines, 1986. Center for Women's Resources, 1988.
Buscar texto completoTossell, John A. y David J. Vaughan. Theoretical Geochemistry. Oxford University Press, 1992. http://dx.doi.org/10.1093/oso/9780195044034.001.0001.
Texto completoKrishnan, Kannan M. Principles of Materials Characterization and Metrology. Oxford University Press, 2021. http://dx.doi.org/10.1093/oso/9780198830252.001.0001.
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