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Libros sobre el tema "3D device"

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Autor: Grafiati
Publicado: 6 de septiembre de 2023

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1

(Firm), Fred'k Leadbeater, ed. Leadbeater's improved furnace or air-feeding device: Patented in U.S. July 17th, 1888, in Canada October 3d, 1888 ... [S.l: s.n., 1986.

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2

Lyang, Viktor. CAD programming: Spatial modeling of the air cooling device in the Autodesk Inventor environment. ru: INFRA-M Academic Publishing LLC., 2022. http://dx.doi.org/10.12737/991757.

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The tutorial discusses in detail the creation of an external subsystem for Autodesk Inventor in a high-level C# Microsoft Visual Studio language of a low-flow air cooling device. Such issues as working in the Microsoft Visual Studio 2010 programming environment, connecting the library of Autodesk Inventor API functions to an external user subsystem, spatial solid-state modeling of elements of the air cooling apparatus, saving constructed objects, assembling the apparatus from stored modules using the interface of basic coordinate planes are considered. Meets the requirements of the federal state educational standards of higher education of the latest generation. For students studying in the field of Computer Science and Computer Engineering, in preparation for laboratory work and exam. It can be used by students of other specialties when studying the courses "Fundamentals of Computer Science", "High-level programming language" and "3D modeling of machines and apparatuses". It is useful for programmers who are engaged in spatial modeling of objects.
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3

Zatt, Bruno, Muhammad Shafique, Sergio Bampi y Jörg Henkel. 3D Video Coding for Embedded Devices. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4614-6759-5.

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4

Franke, Jörg, ed. Three-Dimensional Molded Interconnect Devices (3D-MID). München: Carl Hanser Verlag GmbH & Co. KG, 2014. http://dx.doi.org/10.3139/9781569905524.

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5

Wu, Yung-Chun y Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Singapore: Springer Singapore, 2018. http://dx.doi.org/10.1007/978-981-10-3066-6.

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6

Li, Simon y Yue Fu. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-0481-1.

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7

author, Samuel Kumudini, Suriya Women's Development Centre (Batticaloa, Sri Lanka) y International Centre for Ethnic Studies, eds. 3D things: Devices, technologies, and women's organising in Sri Lanka. Batticaloa, Sri Lanka: Suriya Women's Development Centre & International Centre for Ethnic Studies, 2015.

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8

Zatt, Bruno. 3D Video Coding for Embedded Devices: Energy Efficient Algorithms and Architectures. New York, NY: Springer New York, 2013.

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9

Electrical modeling and design for 3D integration: 3D integrated circuits and packaging signal integrity, power integrity, and EMC. Hoboken, N.J: Wiley-IEEE Press, 2011.

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10

Susanna, Orlic, Meerholz Klaus y SPIE (Society), eds. Organic 3D photonics materials and devices: 28 August, 2007, San Diego, California, USA. Bellingham, Wash: SPIE, 2007.

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11

Orlic, Susanna. Organic 3D photonics materials and devices II: 12 August 2008, San Diego, California, USA. Editado por SPIE (Society). Bellingham, Wash: SPIE, 2008.

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12

Andrew, Odewahn y Jepson Brian 1967-, eds. Making things see: 3D vision with Kinect, Processing, Arduino, and MakerBot. Sebastopol, CA: O'Reilly, 2012.

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13

Avram, Nicolae M. Optical Properties of 3d-Ions in Crystals: Spectroscopy and Crystal Field Analysis. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013.

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14

Three-dimensional molded interconnect devices (3D-MID): Materials, manufacturing, assembly, and applications for injection molded circuit carriers. Munich: Hanser Publishers, 2014.

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15

Browning, Dan. Cube: Detailed Design Spec for a 3D Volumetric Solid State Display Device. Clockwork Press/Vesta Imprints, 2021.

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16

Lindlein, Norbert, Karlheinz Bock, Jörg Franke, Ludger Overmeyer y Stefan Kaierle. Optical Polymer Waveguides: From the Design to the Final 3D-Opto Mechatronic Integrated Device. Springer International Publishing AG, 2022.

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17

Garreton, Gilda. A hybrid approach to 2D and 3D mesh generation for semiconductor device simulation (Series in Microelectronics). Hartung-Gorre Verlag, 1999.

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18

3D Printed Microfluidic Devices. MDPI, 2018. http://dx.doi.org/10.3390/books978-3-03897-468-0.

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19

Xiao, Hong. 3D IC Devices, Technologies, and Manufacturing. SPIE, 2016. http://dx.doi.org/10.1117/3.2234473.

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20

Xiao, Hong. 3D IC Devices, Technologies, and Manufacturing. SPIE, 2016.

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21

Wu, Yung-Chun y Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Springer, 2017.

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22

Wu, Yung-Chun y Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Springer, 2018.

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23

Wu, Yung-Chun y Yi-Ruei Jhan. 3D TCAD Simulation for CMOS Nanoeletronic Devices. Springer Singapore Pte. Limited, 2017.

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24

Narayan, Roger J., ed. Additive Manufacturing in Biomedical Applications. ASM International, 2022. http://dx.doi.org/10.31399/asm.hb.v23a.9781627083928.

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Volume 23A provides a comprehensive review of established and emerging 3D printing and bioprinting approaches for biomedical applications, and expansive coverage of various feedstock materials for 3D printing. The Volume includes articles on 3D printing and bioprinting of surgical models, surgical implants, and other medical devices. The introductory section considers developments and trends in additively manufactured medical devices and material aspects of additively manufactured medical devices. The polymer section considers vat polymerization and powder-bed fusion of polymers. The ceramics section contains articles on binder jet additive manufacturing and selective laser sintering of ceramics for medical applications. The metals section includes articles on additive manufacturing of stainless steel, titanium alloy, and cobalt-chromium alloy biomedical devices. The bioprinting section considers laser-induced forward transfer, piezoelectric jetting, microvalve jetting, plotting, pneumatic extrusion, and electrospinning of biomaterials. Finally, the applications section includes articles on additive manufacturing of personalized surgical instruments, orthotics, dentures, crowns and bridges, implantable energy harvesting devices, and pharmaceuticals. For information on the print version of Volume 23A, ISBN: 978-1-62708-390-4, follow this link.
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25

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley & Sons, Incorporated, John, 2012.

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26

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley & Sons, Incorporated, John, 2012.

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27

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC. Wiley & Sons, Incorporated, John, 2012.

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28

Li, Er-Ping. Electrical Modeling and Design for 3D System Integration. Wiley & Sons, Incorporated, John, 2012.

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29

3D Printing of Pharmaceuticals and Drug Delivery Devices. MDPI, 2020. http://dx.doi.org/10.3390/books978-3-03936-424-4.

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30

Vertical 3D Memory Technologies. John Wiley & Sons Inc, 2014.

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31

Prince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Incorporated, John, 2014.

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32

Prince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Incorporated, John, 2014.

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33

Prince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Incorporated, John, 2014.

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34

Prince, Betty. Vertical 3D Memory Technologies. Wiley & Sons, Limited, John, 2014.

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35

GOEL. 3D Printed Smart Sensors Energy Harveshb: 3D Printed Smart Sensors and Energy Harvesting Devices. Institute of Physics Publishing, 2024.

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36

Glukhova, Olga E. 2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Jenny Stanford Publishing, 2019.

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37

Li, Simon y Suihua Li. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. Springer, 2011.

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38

Glukhova, Olga E. 2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Jenny Stanford Publishing, 2019.

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39

Li, Simon y Suihua Li. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. Springer, 2016.

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40

Glukhova, Olga E. 2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Taylor & Francis Group, 2019.

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41

2D and 3D Graphene Nanocomposites: Fundamentals, Design, and Devices. Jenny Stanford Publishing, 2019.

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42

Li, Simon y Yue Fu. 3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics. Springer, 2011.

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43

3d Tcad Simulation For Semiconductor Processes Devices And Optoelectronics. Springer, 2011.

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44

Kong, X. Y., Y. C. Wang, X. F. Fan, G. F. Guo y L. M. Tong. Free-standing grid-like nanostructures assembled into 3D open architectures for photovoltaic devices. Editado por A. V. Narlikar y Y. Y. Fu. Oxford University Press, 2017. http://dx.doi.org/10.1093/oxfordhb/9780199533060.013.22.

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This article describes three-dimensional open architectures with free-standing grid-like nanostructure arrays as photocatalytic electrodes for a new type of dye-sensitized solar cell. It introduces a novel technique for fabricating a series of semiconducting oxides with grid-like nanostructures replicated from the biotemplates. These semiconducting oxides, including n-type titanium dioxide or p-type nickel oxide nanogrids, were sensitized with the dye molecules, then assembled into 3D stacked-grid arrays on a flexible substrate by means of the Langmuir–Blodgett method or the ink-jet printing technique for the photocatalytic electrodes. The article first considers the fabrication of photoelectrodes with 2D grid-like nanostructures by means of the biotemplating approach before discussing the assembly and photophysicsof grid-like nanostructures into 3D open architectures for the photocatalytic electrodes.
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45

Shafique, Muhammad, Bruno Zatt, Jörg Henkel y Sergio Bampi. 3D Video Coding for Embedded Devices: Energy Efficient Algorithms and Architectures. Springer, 2016.

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46

3d Video Coding For Embedded Devices Energy Efficient Algorithms And Architectures. Springer-Verlag New York Inc., 2013.

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47

Chen, Michael *. A system for direct manipulation of 3D objects using 2D input devices. 1988.

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48

Lamprou, Dimitrios A., Sheng Qi y Dennis Douroumis. 3D Printing of Pharmaceutical and Drug Delivery Devices: Progress from Bench to Bedside. Wiley & Sons, Incorporated, John, 2023.

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49

Lamprou, Dimitrios A., Sheng Qi y Dennis Douroumis. 3D Printing of Pharmaceutical and Drug Delivery Devices: Progress from Bench to Bedside. Wiley & Sons, Incorporated, John, 2023.

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50

Barthès, Julien Georges Didier, Christophe A. Marquette y Luciano Vidal, eds. 3D Printing for Implantable Medical Devices: From Surgical Reconstruction to Tissue/Organ Regeneration. Frontiers Media SA, 2021. http://dx.doi.org/10.3389/978-2-88966-509-9.

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