Academic literature on the topic 'Zn and Sn based promoters'
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Journal articles on the topic "Zn and Sn based promoters"
Yang, Chenjun, Mengwei Chen, Jiaqi Wang, and Haifei Lu. "Zn-Doped SnO2 Compact Layer for Enhancing Performance of Perovskite Solar Cells." International Journal of Photoenergy 2021 (June 22, 2021): 1–10. http://dx.doi.org/10.1155/2021/9920442.
Full textAli, Arshid M., Abdulrahim A. Zahrani, Muhammad A. Daous, Seetharamulu Podila, Majid Khalid Alshehri, Sami-ullah Rather, and Usman Saeed. "Sequential and/or Simultaneous Wet-Impregnation Impact on the Mesoporous Pt/Sn/Zn/γ-Al2O3 Catalysts for the Direct Ethane Dehydrogenation." Journal of Nanomaterials 2022 (February 23, 2022): 1–17. http://dx.doi.org/10.1155/2022/8739993.
Full textShi, Qi, Yongjun Ji, Wenxin Chen, Yongxia Zhu, Jing Li, Hezhi Liu, Zhi Li, et al. "Single-atom Sn-Zn pairs in CuO catalyst promote dimethyldichlorosilane synthesis." National Science Review 7, no. 3 (November 28, 2019): 600–608. http://dx.doi.org/10.1093/nsr/nwz196.
Full textGong, Nengfeng, Gaolei Qin, Pengfei Li, Xiangjie Zhang, Yan Chen, Yong Yang, and Peng He. "Enhanced Stability and Selectivity in Pt@MFI Catalysts for n-Butane Dehydrogenation: The Crucial Role of Sn Promoter." Catalysts 14, no. 11 (October 29, 2024): 760. http://dx.doi.org/10.3390/catal14110760.
Full textMusa, Sayyidah Amnah, Mohd Arif Anuar Mohd Salleh, and Saud Norainiza. "Zn-Sn Based High Temperature Solder - A Short Review." Advanced Materials Research 795 (September 2013): 518–21. http://dx.doi.org/10.4028/www.scientific.net/amr.795.518.
Full textZheng, Xiali, Wei Luo, Yun Yu, Zebin Xue, Yifan Zheng, and Zongjian Liu. "Metal Emulsion-Based Synthesis, Characterization, and Properties of Sn-Based Microsphere Phase Change Materials." Molecules 26, no. 24 (December 9, 2021): 7449. http://dx.doi.org/10.3390/molecules26247449.
Full textChen, Kang I., Shou Chang Cheng, and Chin Hsiang Cheng. "The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders." Advanced Materials Research 800 (September 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.
Full textYang, S. C., C. E. Ho, C. W. Chang, and C. R. Kao. "Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu." Journal of Materials Research 21, no. 10 (October 2006): 2436–39. http://dx.doi.org/10.1557/jmr.2006.0320.
Full textYang, Ling Mei, Peng Mei Lv, Zhen Hong Yuan, Wen Luo, Zhong Ming Wang, and Hui Wen Li. "Promoting Effect of Metal Promoters on Fe(II)-Zn-Based Double Metal Cyanide Complex Catalysts for Biodiesel Synthesis." Advanced Materials Research 236-238 (May 2011): 3041–45. http://dx.doi.org/10.4028/www.scientific.net/amr.236-238.3041.
Full textYamauchi, Akira, and Masashi Kurose. "Effect of Sb and Zn Addition on the Microstructures and Tensile Properties of Sn–Bi-Based Alloys." Materials 15, no. 3 (January 24, 2022): 884. http://dx.doi.org/10.3390/ma15030884.
Full textDissertations / Theses on the topic "Zn and Sn based promoters"
Riviere, Lucie. "Methyl chloride cracking and formation of coke during the methylchlorosilanes synthesis." Electronic Thesis or Diss., Lyon 1, 2024. http://www.theses.fr/2024LYO10189.
Full textDuring the Müller-Rochow synthesis, Si and CH3Cl reacts to form methylchlorosilanes (MCS) in presence of a copper precursor, Zn and Sn promoters. CH3Cl can suffer from cracking reactions which results in the formation of carbonaceous compounds (coke) that disturbs the operation of industrial reactors, leading to a production loss. The purpose of this thesis was to study the CH3Cl cracking and the formation of coke during the activation step of the MCS synthesis and to find industrial solutions to prevent coke formation. Copper chloride which is generally used as precursor can either form Cu3Si, active for the MCS synthesis or be reduced into Cu(0) that was found to be inactive for the MCS synthesis but active for the CH3Cl cracking. In this work, this side reaction is correlated with Cu(0) formation which occurs from the beginning of the MCS synthesis and is enhanced by Zn and Sn promoters. However, Cu(0) formation kinetic was shown to be faster than Cu3Si even in the absence of promoters. Therefore, it is impossible to avoid Cu(0) formation which could contribute to CH3Cl cracking. An approach to reduce coke formation was to lower the acidity by adding alkali metals: KCl and CsCl. This provided favorable outcomes: it was possible to lower the coke production rate due to the reduction of the amount of Cu(0) crystalline phase formation. Some explanations were proposed
Guo, Yanzhi. "Synthesis, characterization and catalytic application of Ru/Sn-and Cu/Zn-based nanocomposites." [S.l.] : [s.n.], 2006. http://deposit.d-nb.de/cgi-bin/dokserv?idn=98188833X.
Full textDuren, Stephan van [Verfasser], Aleksander [Akademischer Betreuer] Gurlo, Aleksander [Gutachter] Gurlo, Walter [Gutachter] Reimers, and Thomas [Gutachter] Unold. "Development of in situ methods for process monitoring and control and characterization of Cu-Zn-Sn-S based thin films / Stephan van Duren ; Gutachter: Aleksander Gurlo, Walter Reimers, Thomas Unold ; Betreuer: Aleksander Gurlo." Berlin : Universitätsverlag der TU Berlin, 2019. http://d-nb.info/1187949019/34.
Full textHuang, Chia-Wei, and 黃家緯. "Evaluation of Lead-free Sn-Zn Based Solders (Sn-Zn-Al-Ag Solder)." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/13319573590244426749.
Full text國立成功大學
材料科學及工程學系碩博士班
93
Abstract The development of lead-free solders has become an important issue in the electronics packaging industry because of environmental and health concerns. Recently, Sn-Zn based solders have been considered to be a potential candidate for lead-free solder because its melting temperature is relatively close to that of eutectic Sn-Pb solder. Sn-Zn solders also have lower cost than other lead-free solders. However, Sn-Zn solders exhibit unsatisfactory oxidation resistance and poor wettability on commonly used substrates. The purpose of this research is to investigate the incorporation of Al and Ag in Sn-Zn solder in order to enhance its wettability and oxidation resistance. The microstructure, mechanical property, wettability, oxidation behavior, interfacial reaction and reliability of the Sn-8.55Zn-0.45Al-(0~3wt%)Ag solders were investigated in this study. The microstructure of Sn-Zn based solders shows that the AgZn3 and Ag5Zn8 compounds are formed at the addition of (0.5wt%~3wt%)Ag to Sn-8.55Zn-0.45Al solders. The formation of Ag-Zn compounds (AgZn3 and Ag5Zn8) results in the variation of matrix from eutectic to hypoeutectic structure. The results of DSC (Differential Scanning Calorimetry) reveal that the Sn-8.55Zn-0.45Al solder has eutectic temperature at 197°C, but Ag-Zn compounds (AgZn3 and Ag5Zn8) melt above 300°C as Ag is added to the Sn-8.55Zn-0.45Al solder. An increase in Ag content results in little change in UTS (Ultimate Tensile Stress) and microhardness, but the elongation is prominently decreased. The elongation of the solders drops from 47.1% to 20% when Ag content increases from 0 to 3%. The results of TGA (Thermal Gravimetric Analysis) show that the weight gains at 250°C under O2 atmosphere descend in the order of Sn-9Zn>Sn-8.55Zn-0.45Al-(0.5wt%~3wt%)Ag>Sn-8.55Zn-0.45Al. This means that the incorporation of 0.45wt%Al enhances the oxidation resistance of Sn-Zn solder, while the weight gains of the Sn-8.55Zn-0.45Al-XAg solders increase as Ag was added into the Sn-8.55Zn-0.45Al solder. Auger depth profile shows that Zn and Al form an oxide film on the surface of Sn-9Zn and the Al-containing solders. The wetting results indicate that the wettability of Sn-8.55Zn-0.45Al-XAg solders decreases with increasing Ag content of solders. The Sn-Zn-Al-XAg solders containing low Ag content (0.5wt%) exhibit better wettability than the eutectic Sn-9Zn solder. Furthermore, it was also found that the wettability of Sn-Zn based solders on Cu substrate is better than that on Cu/Ni-P/Au substrate. The results of interfacial reaction indicate that Cu substrate forms Cu5Zn8 and CuZn5 with Sn-9Zn solder, and Al4.2Cu3.2Zn0.7 compound with Al-containing solders. However, it was detected that Cu6Sn5 forms at the Sn-9Zn/Cu interface and Cu5Zn8 forms at the Al-containing solders/Cu interface after aging for 1000 hours. In contacting with the Cu/Ni-P/Au substrate, Sn-9Zn solder forms AuZn3 compound, and the Al-containing solders forms Al2(Au,Zn) compound at the interface. After long time aging, the intermetallic compounds existing between solders and the Cu/Ni-P/Au metallization layers almost do not grow. It was found that the inter-diffusion between solders and Cu/Ni-P/Au is slower than that with Cu under aging. Furthermore, the additions of Ag to Sn-8.55Zn-0.45Al solder result in the formation of AgZn3 particles at the interface. This present work also investigated the reliability of the Sn-8.55Zn- 0.45Al-XAg solders under multiple reflow and thermal aging test. The results show that Sn-Zn based solder balls on Cu and Cu/Ni-P/Au substrates retain the shear strength under multiple reflow. Under thermal aging test, it was found that the shear strength of Sn-Zn based solder balls on Cu substrate decreases with increasing of aging time. However, the shear strength of Sn-Zn based solder balls on Cu/Ni-P/Au almost dose not change under thermal aging test. Thus, it was known that the Sn-Zn based solder balls on Cu/Ni-P/Au substrate exhibit better reliability than that on Cu substrate.
Wan-YiLin and 林宛儀. "Development and properties of Zn-Sn based Pb-free solder alloys(Zn-Sn-Ga-Al)for high temperature application." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/35590247550966214167.
Full textMishra, Manas Kumar. "A Study of Intermetallics in Cu-Sn system and Development of Sn-Zn Based Lead Free Solders." Thesis, 2013. http://ethesis.nitrkl.ac.in/4630/1/211MM1201.pdf.
Full textLima, Diogo Luís Araújo de. "Sputtered Zn-Sn-O based thin-film transistors: Optimization and circuit simulation." Master's thesis, 2016. http://hdl.handle.net/10362/74922.
Full textGuo, Siao-wei, and 郭筱薇. "Developement of High-temperature Lead-free solders: Zn-Sn-Al-Cu Based Alloy." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/d63szw.
Full text國立臺灣科技大學
材料科學與工程系
99
Despite numerous studies on the research and development for high-temperature lead free solders, high-lead solder are still in used because high-temperature lead free solders also has been facing several serious problems during these years. Establishing high-temperature lead-free solder is an urgent priority. This study investigates the development of high-temperature lead-free solders and their properties by improve its wettability and oxidation resitivity after addition of Ni and Ge in Zn-Sn-Al-Cu based alloy. The solders are examined for microstructure, thermal properties, mechanical properties and investigate the interfacial reaction between Zn-Sn-Al-Cu based alloy with Cu and Ni/Cu at 300 and 350oC for 1, 2 and 4 hours. The experimental results indicate that the liquilidus temperature of Zn-Sn-Al-Cu based alloys is between 275oC to 375oC with Zn content. As Zn contents increase the (Zn) and CuZn5 increase, therefore resulting in the increase of micro-hardness and ultimate tensile strength and the addition of Al improve mechanical properties. Three or four intermetallic compounds (IMCs) are formed at the interface in the Cu/alloy diffusion couple. The reaction phases are identified as CuZn5, Al4Cu3Zn, ??nphase and CuZn is formed facing to the Cu substrate. The ??nphase is formed or not that is related to Al/Zn ratio. The IMCs are indentified as CuZn5, Al4Cu3Zn, (Zn), (Al) and?n??Sn phase in the alloys near the Ni/Cu substrate after reflow.
Hung, Hui-Tzu, and 洪慧慈. "Adhesive Behavior and Interfacial Reaction between Sn-Zn Based Solders and Metallized Cu Substrates." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/66259602083583707244.
Full text國立成功大學
材料科學及工程學系碩博士班
92
This research is investigated the interfacial reaction and adhesive behavior between Sn-Zn based solders and metallized Cu substrates. The microstructure and thermal property of Sn-Zn based solders were also studied. The wettability between Sn-Zn based solders and different substrates were investigated with the wetting balance. The adhesive strength between Pb-free solder balls and BGA substrate after reflow process was measured by shear test. The interfacial reaction behavior after dipping and reflow process was investigated by SEM and EPMA. The microstructure of Sn-9Zn alloy consists of ß-Sn matrix and Zn-rich phase. As for Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga alloy, besides the coexistence of ß-Sn matrix and Zn-rich phase, Ag-Zn compound precipitates within the solder matrix. The melting point of Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga alloy was found to be 196.4 ℃. The result of solderability test reveals that the deposition of Sn-Zn based solder on metallized Cu substrate was rough and dull in luster. Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder exhibits adequate wettability with the Cu/Ni-P/Au specimen above 250℃. The wetting time is more than 1 sec. Accordingly, the solderability between Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and Au deposited layer needs to be further improved. AuZn3 and Al2Au intermetallic compound(IMC) formed at the interface of Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and Cu/Ni-P/Au after dipping process. After thermal aging, the AuZnx, Al2Au and (Ag.Au)Zn3 formed at the interface. The Ni-P layer does notreact with other element to form IMC. According to the interfacial analysis on the interface between Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and Cu/Au substrate, Al-Au-Zn IMC layer and Cu5Zn8 compound formed at the interface. The shear test data reveals that the adhesive strength of Sn-9Zn solder is higher than that of Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder after reflow and longtime thermal aging. The shear strength decreased with increasing aging time. The fracture occurred within the solder balls. In the reflow process, Ag-Zn and Au-Zn compound formed at the interface between Sn-8.55Zn-0.5Ag-0.1Al-0.5Ga solder and BGA substrate. After aged at 150℃ for 1000 hours, Ag-Al-Au and Au-Zn compound formed within solder matrix while Au-Zn and Ni-Zn formed at the substrate side. Al does not react with other element to form IMC.
Guo, Yanzhi [Verfasser]. "Synthesis, characterization and catalytic application of Ru/Sn-and Cu/Zn-based nanocomposites / vorgelegt von Yanzhi Guo." 2006. http://d-nb.info/98188833X/34.
Full textBook chapters on the topic "Zn and Sn based promoters"
Murashov, Vladimir, Boris Straumal, and Pavel Protsenko. "Grain Boundary Wetting in Zn Bicrystals by a Sn-Based Melt." In Defect and Diffusion Forum, 235–38. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/3-908451-17-5.235.
Full textOkumura, Taiga, Noriko Yamaguchi, and Toshihiro Kogure. "Structure, Composition, and Physicochemical Properties of Radiocesium-Bearing Microparticles Emitted by the Fukushima Daiichi Nuclear Power Plant Accident." In Agricultural Implications of Fukushima Nuclear Accident (IV), 63–78. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-19-9361-9_8.
Full textKang, Sung. "Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties." In Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. CRC Press, 2004. http://dx.doi.org/10.1201/9780203021484.ch9.
Full text"Bi-Sn, Sn-Sb, Sn-Cu, Sn-Zn, and Sn-In Solder-Based Systems and Their Properties." In Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, 298–317. CRC Press, 2004. http://dx.doi.org/10.1201/9780203021484-14.
Full textManilevich, F., Yu Pirskyy, A. Kutsyi, V. Berezovets, and V. Yartys. "Activated aluminum for hydrogen generation from water." In HYDROGEN BASED ENERGY STORAGE: STATUS AND RECENT DEVELOPMENTS, 81–93. Institute for Problems in Materials Science, 2021. http://dx.doi.org/10.15407/materials2021.081.
Full textChang, Zhaoshan, Qihai Shu, and Lawrence D. Meinert. "Chapter 6 Skarn Deposits of China." In Mineral Deposits of China, 189–234. Society of Economic Geologists, 2019. http://dx.doi.org/10.5382/sp.22.06.
Full textBiborski, Marcin, Mateusz Biborski, and Janusz Stępiński. "Badania technologiczno-chemiczne oraz metaloznawcze wybranych zabytków metalowych / Technological, chemical, and metallurgical examination of selected metal artefacts." In Castrum Lubenov. Tragiczne dzieje średniowiecznej wieży w Lubrzy / Castrum Lubenov. The tragic history of the medieval tower in Lubrza, 253–84. Wydawnictwo Profil-Archeo; Muzeum Archeologiczne Środkowego Nadodrza, 2022. http://dx.doi.org/10.33547/lubenov2022.13.
Full textForbes, Ian, and Laurence M. Peter. "Materials for Photovoltaics." In Materials for a Sustainable Future, 558–91. The Royal Society of Chemistry, 2012. http://dx.doi.org/10.1039/bk9781849734073-00558.
Full textDeng, Jun, Yusheng Zhai, Xuanxue Mo, and Qingfei Wang. "Chapter 4 Temporal-Spatial Distribution of Metallic Ore Deposits in China and Their Geodynamic Settings." In Mineral Deposits of China, 103–32. Society of Economic Geologists, 2019. http://dx.doi.org/10.5382/sp.22.04.
Full textConference papers on the topic "Zn and Sn based promoters"
Liu, Jian-Chun, Long Xiao, Zhi-Jun Yue, and Gong Zhang. "Atomic diffusion of Zn in Sn-Zn based solder joints subjected to high temperature aging." In 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS). IEEE, 2017. http://dx.doi.org/10.1109/edaps.2017.8277008.
Full textSun, Peng, Cristina Andersson, Zhaonian Cheng, Zonghe Lai, Dongkai Shangguan, and Johan Liu. "Coffin-Manson Equation determination for Sn-Zn Based Lead-Free Solder Joints." In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, 2005. http://dx.doi.org/10.1109/hdp.2005.251421.
Full textYu, Qiang, Doseop Kim, Jaechul Jin, Yasuhiro Takahashi, and Masaki Shiratori. "Fatigue Strength Evaluation for Sn-Zn-Bi Lead-Free Solder Joints." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39686.
Full textMaltsev, Dmitry S., Vladimir A. Volkovich, Leonid F. Yamshchikov, and Andrey V. Chukin. "Thermodynamic properties of gadolinium in Ga–Sn and Ga–Zn eutectic based alloys." In PHYSICS, TECHNOLOGIES AND INNOVATION (PTI-2016): Proceedings of the III International Young Researchers’ Conference. Author(s), 2016. http://dx.doi.org/10.1063/1.4962596.
Full textYang-Shun Fan, Wei-Liang Chan, Chih-Hsiang Chang, Guang-Ting Zheng, Che-Chia Chang, and Po-Tsun Liu. "Performance and reliability of non-linear Al-Zn-Sn-O based resistive random access memory." In 2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE, 2015. http://dx.doi.org/10.1109/ipfa.2015.7224421.
Full textSun, Peng, Cristina Andersson, Xicheng Wei, Zhaonian Cheng, Dongkai Shangguan, and Johan Liu. "Microstructural evolution of Sn-Zn based lead free solders after temperature and humid atmosphere exposure." In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. IEEE, 2005. http://dx.doi.org/10.1109/hdp.2005.251397.
Full textKang, Ning, Mingliang Huang, Qiang Zhou, and Haitao Ma. "Mechanical properties and electrochemical corrosion behavior of Al-Cu solder joint with Sn-Zn based solder." In High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6066846.
Full textHuang, Jia-Qiang, Min-Bo Zhou, Chang-Zheng Li, Xiao Ma, and Xin-Ping Zhang. "Processing performance and microstructure of Sn-Zn based solders modified by Bi and mixed rare earth elements." In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474632.
Full textChe, Hanqing, Stephen Yue, Phuong Vo, Amir Nobari, and Ana Da Silva Marques. "Metallization of Polymers by Cold Spraying with Low Melting Point Powders." In ITSC2019, edited by F. Azarmi, K. Balani, H. Koivuluoto, Y. Lau, H. Li, K. Shinoda, F. Toma, J. Veilleux, and C. Widener. ASM International, 2019. http://dx.doi.org/10.31399/asm.cp.itsc2019p0586.
Full textZhang, T., E. Padyyodi, R. N. Raoelison, and J. C. Sagot. "Sublayer-Assisted Cold Spray Metallization of Carbon Fiber Reinforced Composites." In ITSC2022. DVS Media GmbH, 2022. http://dx.doi.org/10.31399/asm.cp.itsc2022p0314.
Full textReports on the topic "Zn and Sn based promoters"
Leybourne, M. I., J. M. Peter, M A Schmidt, D. Layton-Matthews, A. Voinot, and L. Mathieu. Geochemical evidence for a magmatic contribution to the metal budget of the Windy Craggy Cu-Co(±Zn) volcanogenic massive-sulfide deposit, northwestern British Columbia. Natural Resources Canada/CMSS/Information Management, 2022. http://dx.doi.org/10.4095/328018.
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