Dissertations / Theses on the topic 'Wire-temperature'
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Sitter, Nicholas James. "Two-wire, low component count soil temperature sensor." Thesis, University of Iowa, 2011. https://ir.uiowa.edu/etd/1081.
Full textSuman, Shivesh K. "Characterization of temperature variation during the wire bonding process." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17560.
Full textMedrano, Téllez Alexis G. "Fibre laser metal deposition with wire : parameters study and temperature control." Thesis, University of Nottingham, 2010. http://eprints.nottingham.ac.uk/12812/.
Full textChan, Yu Hin. "Optimization of metallization and process variables in low temperature wire bonding technology /." View Abstract or Full-Text, 2003. http://library.ust.hk/cgi/db/thesis.pl?MECH%202003%20CHAN.
Full textIncludes bibliographical references (leaves 129-132). Also available in electronic version. Access restricted to campus users.
D'AMICO, ANTONIO. "INNOVATIVE ANALOG AND MIXED-SIGNAL SOLUTIONS FOR PRECISE MEASUREMENT OF ELECTRICAL QUANTITIES IN POWER TRANSISTORS." Doctoral thesis, Università degli Studi di Milano-Bicocca, 2018. http://hdl.handle.net/10281/198966.
Full textThis thesis presents the development of a mixed-signal multi-functional system for automotive applications and, in particular, for high-side current measurements, open-load detection and thermo-electrical stress protection. The system is composed of a tracking ADC featuring a triple-ranged resolution (coarse, fine and finest) in order to adapt to the system requirements and optimize the design in terms of area. The coarse range, designed for the full-scale input values [0A:100A], has a 5 b resolution and it is used for the stress detection feature. The fine and the finest ranges are used for lowest input current values [0A:14A] where more accuracy is required. Moreover, the system implements two protections functionalities: it is capable to detect a possible load detachment by processing the current measurements and it is able to estimate the wire temperature by digitally processing the ADC output and to signal if the cables heat up dangerously. The current monitoring and the protection feature are extremely important as a reliable and embedded system enables the car manufactures to design the vehicles harness more efficiently, by reducing the copper cables diameter, and therefore to save costs
Malizia, Fabio. "A numerical study of temperature effects on hot wire measurements inside turbulent channel flows." Master's thesis, Alma Mater Studiorum - Università di Bologna, 2013. http://amslaurea.unibo.it/5221/.
Full textKoujili, Mohamed. "Design and construction of a new actuator for the LHC wire scanner." Thesis, Belfort-Montbéliard, 2013. http://www.theses.fr/2013BELF0196/document.
Full textThe LHC collides two protons beams with an energy of 7 TeV each resultingin a aimed total particle rate of about 109 Hz. The particle rateis determined by the production cross section, a natural constant and theluminosity accelerator dependent parameter describing the particle beams.The luminosity depends on the number of particles in each beam linearlyand on the transverse dimensions of the particle beam inversely. It increaseswith the particle beam density and therefore the probability of interactions.To optimize the transverse beams sizes, pro_le monitors are used to measureparameter depending changes. Within the LHC, three di_erent typesof pro_le monitors are installed: Wire scanner (WS), Synchrotron lightmonitor and Rest Gas Pro_le Monitor. The WS monitor is considered tobe the most accurate of these monitors and serves as a calibration devicefor the two others. The WS is an electro-mechanical device which measuresthe transverse beam density pro_le in an intermittent way. As the wirepasses through the beam, the particle-matter interaction generates a cascadeof secondary particles. These are intercepted by a scintillator, which isattached to a photomultiplier in order to measure the intensity of the lightthereby produced. The light signal amplitude is proportional to the densityof the intercepted beam portion. The acquisitions of the wire position andthe intensity signal are synchronized with the particle revolution frequencyand are combined to construct the transverse beam density pro_le. TheWS is installed and operated in all circular accelerators of CERN on a dailybasis
Vičar, Pavel. "Měření teploty ve fotovoltaických systémech." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2010. http://www.nusl.cz/ntk/nusl-218702.
Full textKnott, Ryan Christopher. "High temperature durability of metals for use in a particle heating receiver for concentrated solar power." Thesis, Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/53117.
Full textBosworth, Kyle Judson. "Health Monitoring of the Veterans' Glass City Skyway: Vibrating Wire Strain Gage Testing, Study of Temperature Gradients and a Baseline Truck Test." Connect to Online Resource-OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=toledo1197693985.
Full textTypescript. "Submitted as partial fulfillment of the requirements for the Master of Science in Civil Engineering." "A thesis entitled"--at head of title. Bibliography: leaves 86-87.
Loh, Wei Sun. "Studies of Avalanche Breakdown Characteristics in 4H-SiC and reliability of pure aluminium wire bonds for high power and high temperature applications." Thesis, University of Sheffield, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.500188.
Full textKandil, Mohamed E. "The development of a vibrating wire viscometer and a microwave cavity resonator for the measurement of viscosity, dew points, density, and liquid volume fraction at high temperature and pressure." Thesis, University of Canterbury. Chemical and Process Engineering, 2005. http://hdl.handle.net/10092/1070.
Full textOliphant, Clive Justin. "Filament carburization during the hot-wire chemical vapour deposition of carbon nanotubes." Thesis, University of the Western Cape, 2008. http://etd.uwc.ac.za/index.php?module=etd&action=viewtitle&id=gen8Srv25Nme4_7060_1263948958.
Full textZhou, En. "The use of FLUENT for heat flow studies of the hot-wire chemical vapor deposition system to determine the temperatures reached at the growing layer surface." Thesis, University of the Western Cape, 2009. http://hdl.handle.net/11394/1705.
Full textThe overall aim of this project is to study the heat transfer inside the reaction chamber of the Hot-Wire Chemical Vapor Deposition (HWCVD) system with a commercial software package FLUENT6.3; it is one of the most popular Computational Fluid Dynamics solvers for complex flows ranging from incompressible to mildly compressible to even highly compressible flows. The wealth of physical models in FLUENT allows us to accurately predict laminar and turbulent flows, various modes of heat transfer, chemical reactions, multiphase flows and other phenomena with complete mesh flexibility and solution-based mesh adaptation. In this study the 3-D HWCVD geometry was measured and created in GAMBIT which then generates a mesh model of the reaction chamber for the calculation in FLUENT. The gas flow in this study was characterized as the steady and incompressible fluid flow due to the small Mach number and assumptions made to simplify the complexity of the physical geometry. This thesis illustrates the setups and solutions of the 3-D geometry and the chemically reacting laminar and turbulent gas flow, wall surface reaction and heat transfer in the HWCVD deposition chamber.
South Africa
Husain, Muhammad Dawood. "Development of temperature sensing fabric." Thesis, University of Manchester, 2012. https://www.research.manchester.ac.uk/portal/en/theses/development-of-temperature-sensing-fabric(0e5e8367-c3b2-4cff-bcc9-f32fac97b50f).html.
Full textMartínek, Jaroslav. "Modul pro monitorování teploty." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217539.
Full textCozonac, Dorin. "Conception d'une machine asynchrone haute température." Thesis, Artois, 2015. http://www.theses.fr/2015ARTO0209/document.
Full textThe windings that are currently used in electrical machines are mostly insulated based on organic insulation. The temperature limit of these windings is up to 240°C. Increasing the working temperature of electrical motors means, indirectly the increasing of current density on the main conductors. Therefore these new motors may provide a higher mass and volume power as classical machines. Furthermore, the magnetic materials can work up to 800 °C. Indeed, in reality technical limit today is the wire insulation. The objective of thesis is to define a theoretical approach combined with experimental validations for identify the appropriate electrical materials used on high-temperature electrical machines. Design is fixed around the winding, that will implemented by calculating a high-temperature asynchronous machine (400°C of windings). The windings are placed as the base of machine design and will determine the geometrical shape and properties of magnetic core
Chen, Zheng. "Electrical Integration of SiC Power Devices for High-Power-Density Applications." Diss., Virginia Tech, 2013. http://hdl.handle.net/10919/23923.
Full textPh. D.
Silva, Gleison Elias da. "Desenvolvimento de transdutor em fibra óptica com estrutura híbrida LPG-FBG para medição de propriedades térmicas de materiais." Universidade de São Paulo, 2017. http://www.teses.usp.br/teses/disponiveis/3/3143/tde-27022018-102025/.
Full textThis work presents the study, implementation, and characterization of transducers composed of a structure formed by Fiber Bragg Gratings (FBG) and Long Period Gratings (LPG) in optical fiber with self-heating coverage for measurement of thermal conductivity and thermal diffusivity of materials based on the Hot-Wire Method (HWM). The self-heating fiber optic device developed in this work is caused by the light of infrared spectrum injected by a pumping laser, which is spread by an LPG and absorbed by a thin metallic film deposited on the surface of the fiber. The transducers are compact, simple, robust and immune to electromagnetic interference. The experimental arrangement using the optical fiber sensor based on LPG-FBG hybrid structure was able to measure the thermal conductivity of atmospheric air and water with accuracies of 27% and 14%, respectively. Several factors were identified that affect the precision and the accuracy of the measures carried out, whereby various forms of corrections are being proposed to improve overall performance. The viability of the original application of the experimental arrangement using the LPG-FBG hybrid device in self-heating optical fiber for the measurement of thermal properties of fluids (air and water) has been successfully demonstrated.
Kirner, Stefan [Verfasser], Jochen [Akademischer Betreuer] Schein, Jochen [Gutachter] Schein, and Thomas [Gutachter] Klassen. "Tomographic Two-Color-Pyrometry of the Wire Arc Spray Process regarding Particle Temperature and in-flight Particle Oxidation / Stefan Kirner ; Gutachter: Jochen Schein, Thomas Klassen ; Akademischer Betreuer: Jochen Schein ; Universität der Bundeswehr München, Fakultät für Elektrotechnik und Informationstechnik." Neubiberg : Universitätsbibliothek der Universität der Bundeswehr München, 2018. http://d-nb.info/1175916986/34.
Full textKirner, Stefan Verfasser], Jochen [Akademischer Betreuer] [Schein, Jochen Gutachter] Schein, and Thomas [Gutachter] [Klassen. "Tomographic Two-Color-Pyrometry of the Wire Arc Spray Process regarding Particle Temperature and in-flight Particle Oxidation / Stefan Kirner ; Gutachter: Jochen Schein, Thomas Klassen ; Akademischer Betreuer: Jochen Schein ; Universität der Bundeswehr München, Fakultät für Elektrotechnik und Informationstechnik." Neubiberg : Universitätsbibliothek der Universität der Bundeswehr München, 2018. http://d-nb.info/1175916986/34.
Full textYang, Yuan. "Influence of Chemical Doping on Microstructures and Superconducting Properties of MgB2 Wires and Bulk Samples." The Ohio State University, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=osu1469187563.
Full textTříska, Vít. "Univerzální řídicí jednotka solárních kolektorů." Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2010. http://www.nusl.cz/ntk/nusl-237100.
Full textSaez, Manuel. "Contribution à l'étude expérimentale de la convection mixte." Université Joseph Fourier (Grenoble), 1998. http://www.theses.fr/1998GRE10197.
Full textSordes, Delphine. "Imagerie, manipulation et contact électronique atome par atome sur la surface Si(100) : H avec le microscope à effet tunnel basse température à 4 pointes." Thesis, Toulouse 3, 2017. http://www.theses.fr/2017TOU30048/document.
Full textThe construction of electronic circuits of atomic section is one of the great challenges of the ultimate nanoelectronics. To build an atomic electronic circuit, it is necessary first to develop the dedicated instrument to build up and then to choose the support surface stabilizing this circuit. On the Au(111) surface prepared in ultra-vacuum, we implemented and stabilized the very first LT-UHV-4 STM. This STM 4-probes microscopes scanning at the same time and independently the same surface was built for the CEMES by the ScientaOmicron company. On Au(111), we reproduced all the experimental results obtained on the best LT-UHV-STM with one probe such as the precision in roughness of 2 pm, the IV characteristics recording without any average on a single atom for several tens of minutes and the atomic manipulation following the pulling, sliding and pushing modes of a single gold atom on the surface. Once this optimization was carried out, we applied our LT-UHV-4 STM to the surface of Si(100):H, probable support of the future electronic atomic circuits. The choice of this medium is discussed in detail before recording and analysis of the STM images. The samples used come either from the semi-industrial full-wafer silicon process developed at CEA-LETI or from their in-situ preparation, which takes place directly in the preparation chamber of the LT-UHV-4 STM. We have taken care to interpret the STM images of the surface Si(100):H in order to locate the position of each hydrogen atom. The atomic lithography by STM has been exploited, by using one tip from our LT-UHV-4 STM, by atom-per-atom vertical mode and faster scanning mode. The last makes atomic writing less accurate. We have constructed our own atomic wires and then atomic contact pads, small squares of Si(100)H defeated by a few nm sides. The leakage currents with 2 probes at the atomic scale have thus been able to be measured on the surface of Si(100):H between two of these pads. To prepare the atomic contacts at least 2 probes on an atomic wire or on nanometric contact pads, we studied in detail the different types of contact points STM-single dangling bond showing the difficulty of reaching a quantum of conductance at contact, due to a possible bands bending. It is therefore difficult without a complementary force measurement to determine, starting from the tunnel contact, the different steps of the mechanical, electronic contact at the chemical contact. Our results open the way to the characterization of electronic circuits constructed atom-by-atom and at atomic scale on the surface of a semiconductor
Moc, Filip. "Vestavěný systém pro automatizaci chovné stanice akvarijních ryb." Master's thesis, Vysoké učení technické v Brně. Fakulta informačních technologií, 2018. http://www.nusl.cz/ntk/nusl-385996.
Full textMüller, Wolfhart. "Temperaturverhältnisse und Reaktionskinetik beim Ziehen und Wärmebehandeln von Draht." Doctoral thesis, Technische Universitaet Bergakademie Freiberg Universitaetsbibliothek "Georgius Agricola", 2014. http://nbn-resolving.de/urn:nbn:de:bsz:105-qucosa-127084.
Full textMulpuri, Vamsi. "Failure Analysis and High Temperature Characterization of Silicon Carbide Power MOSFETs." University of Akron / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=akron151076214366849.
Full textJullien, Jean-Baptiste. "Etude de fiabilité et définition de modèles théoriques de vieillissement en très haute température pour des systèmes électronique et microélectronique." Thesis, Bordeaux 1, 2012. http://www.theses.fr/2012BOR14604/document.
Full textThis work is performed in analysis and prediction areas of Multi-Chip Module package reliability. It presents a reliability study on wire bonding in high temperature environment from aging tests and experimental analyzes. Results permit to identify degradation mechanisms and evaluate temperature limits of these interconnections. It develops a study of the thermomechanical behavior of adhesive joints from mechanical characterization tests, accelerated aging tests and finite element simulations. These methods are used to assess the criticality of packages from the design phase
Zapoticla, Frank. "The Effects of Applied Strain and Heat Treatment on the Properties of NiTi Wire During Shape Setting." DigitalCommons@CalPoly, 2010. https://digitalcommons.calpoly.edu/theses/378.
Full textMontagnac, Gilles. "Spectroscopie Raman résonnante UV in situ à haute température ou à haute pression." Thesis, Lyon, École normale supérieure, 2012. http://www.theses.fr/2012ENSL0784/document.
Full textI applied UV resonant Raman spectroscopy (UVRRS) to an ‘in situ’ study of carbon materials at very hight temperature (> 2000 K) or at high pressure (< 1 GPa).The advantages of UVRRS are presented in the first part of this PHD thesis, and used to investigate details of the composition and structure of disordered carbon materials such as: (1) n-type nanocrystalline films, (2) carbonaceous matter in chondrites and (3) tholins, HCN synthetic samples of Titan 's atmosphere.‘In situ’ Raman studies are limited to 2000 K by the visible black-body emission. I designed a high temperature cell to perform UVRRS above this limit. The second part of the manuscript presents Raman spectra of pyrolitic graphite and HOPG up to 2700 K. This data are consistent with anharmonic models up to 900 K, and show the coupling effects of electron-phonon and phonon-phonon. The last one dominates the anharmonicity above 1000 K. The Raman spectra was calibrated as a function of temperature and became a “thermometer” up to 2700 K.For high pressure measurements in the third part, I modified an anvil cell to study by UVRRS, the vibrational changes induced by pressure on very luminescent molecular organic crystals. I present an analysis at 244 nm of resonant Raman modes of perylene crystal under hydrostatic pressure up to 0.8 GPa. Some of them have a non linear feature under pressure, revealing structural and planar modifications of the molecules
Netáhlo, Tomáš. "Palubní multifunkční jednotka pro motocykly." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2012. http://www.nusl.cz/ntk/nusl-219822.
Full textKhedekar, Mayur. "Temperature Based Estimation of the Time-Resolved Massflux of ICE Exhaust Gas Flow." Thesis, KTH, Skolan för industriell teknik och management (ITM), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-300050.
Full textSyftet med studien var att tillhandahålla information och erfarenhet från fina trådtermoelement (TC) eller motståndstrådstermometrar (RWT) temperatursignaler för att uppskatta den tidsupplösta värmeöverföringskoefficienten. Metoden med konstant flöde antogs i studien och mediet som användes i denna studie var luft. Här har värmebalansekvationen beskrivits, olika Nu-korrelationer och diskuterat ytterligare potentiella hinder och svårigheter man kan stöta på vid beräkning av värmeöverföringskoefficienten. Som en lösning föreslogs användning av en lämplig värmebalansekvation och lågpassfilter eftersom detta ger en mer exaktpassform. Undersökningen genomfördes för Reynoldsnummer (Re) 103 till 107 och Prandlt nummer (Pr) 0,734. Effekten av Re och Pr på Nusselts-numret (Nu) runt en cylinder representerades och alla resultat jämfördes med GT-POWER-motorns simuleringsprogram.
Müller, Jan. "Kondenzační technika a odvody spalin." Master's thesis, Vysoké učení technické v Brně. Fakulta stavební, 2014. http://www.nusl.cz/ntk/nusl-226844.
Full textHuang, Chen-may, and 黃岑媺. "Temperature and bias ffect on wire-bond reliability for F1 & S2 type new wire evaluatione." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/20379477546579426092.
Full textLue, Min-Hsien, and 呂旻憲. "Temperature, Bias Effect and Chloride Ion on Wire-Bond Reliability." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/34071780021125266554.
Full textHUANG, CHIN-CHUN, and 黃誌君. "Study on the Plastic Behavior of Fastener Wire at High Temperature." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/zzk74x.
Full text高苑科技大學
機械與自動化工程研究所
106
The isothermal hot compression test for the 1022 and SCM435 steel rod in the range of 800oC~900oC at strain rate of 1*10-3s-1~1*10-1s-1 was done. And analysis for the deformation behavior of the steel at high temperature by measuring the flow stress and constructing the thermal processing map using dynamic materials model has also been carried out. The results show that the maximum flow stress decreases significantly with increasing deformation temperature in strain rate range from 1*10-3s-1 to 1*10-1s-1. The steel exhibits higher strain rate sensitivity and power dissipation efficiency at lower deformation temperature and lower strain rate, and it is more sensitive to temperature at higher strain rate. The steel shows a flow instability in deformation temperature range from 800oC to 860oC and strain rate range from 1*10-3s-1 to 1*10-1s-1, and it also clarifies flow instability around 900oC at 1*10-1s-1. The result presents a better workability of the steel in deformation temperature range from 860oC to 900oC and strain rate range from 1*10-3s-1 to 1*10-2s-1, and at 900oC/1*10-3s-1 is the best one, that is at the highest deformation temperature and the lowest strain rate.
Rezaey, Reza. "High Temperature Gas to Liquid Metal Foam and Wire Mesh Heat Exchangers." Thesis, 2012. http://hdl.handle.net/1807/33500.
Full textHuang, Po-Chun, and 黃柏鈞. "High-Performance Low-Temperature Polysilicon Thin-Film Transistors with Nano-wire Structure." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/46348x.
Full text國立中山大學
物理學系研究所
95
In this thesis, we study the electrical characteristics of a series of polysilicon thin-film transistors (poly-Si TFTs) with different numbers of multiple channels of various widths, with lightly-doped drain (LDD) structures. Among all investigated TFTs, the nano-scale TFT with ten 67 nm-wide split channels (M10) has superior and more uniform electrical characteristics than other TFTs, such as a higher ON/OFF current ratio (>109), a steeper subthreshold slope (SS) of 137 mV/decade, an absence of drain-induced barrier lowering (DIBL) and a suppressed kink-effect. These results originate from the fact that the active channels of M10 TFT has best gate control due to its nano-wire channels were surrounded by tri-gate electrodes. Additionally, experimental results reveal that the electrical performance of proposed TFTs enhances with the number of channels from one to ten strips of multiple channels sequentially, yielding a profile from a single gate to tri-gate structure. In addition, we have also studied the multi-gate combining the pattern-dependent nickel (Ni) metal-induced lateral crystallization (Ni-MILC) polysilicon thin-film transistors (poly-Si TFTs) with ten nanowire channels. Experimental results reveal that applying ten nanowire channels improves the performance of Ni-MILC poly-Si TFT, which thus has a higher ON current, a lower leakage current and a lower threshold voltage (Vth) than single-channel TFTs. Furthermore, the experimental results reveal that combining the multi-gate structure and ten nanowire channels further enhances the entire performance of Ni-MILC TFTs, which thus have a low leakage current, a high ON/OFF ratio, a low Vth, a steep subthreshold swing (SS) and kink-free output characteristics. The multi-gate with ten nanowire channels NI-MILC TFTs has few poly-Si grain boundary defects, a low lateral electrical field and a gate channel shortening effect, all of which are associated with such high-performance characteristics. The PDMILC TFTs process is compatible with CMOS technology, and involves no extra mask. Such high performance PDMILC TFTs are thus promising for use in future high-performance poly-Si TFT applications, especially in AMLCD and 3D MOSFET stacked circuits. Otherwise, we have investigated the mechanism of the leakage currents in polysilicon TFT with different temperature and applied biases. Moreover, we have simulated the electric fields in different structure polysilicon TFT to explain the mechanism of the leakage currents. By comparing the leakage currents in different channel structures, the leakage current in nanowire channel structure is higher than that in non-nanowire channel structure. Moreover, the leakage current in multiple gate structure is lower than that in single gate structure. Therefore, these two experimental results are caused by high electric field in the drain-to-gate overlap and drain-to-body depletion region respectively.
蕭宇辰. "Development of a Digital Hot-wire Type Flow-meter with Temperature Compensation." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/47953936450778862942.
Full textLI, YI-TA, and 李宜達. "Study on the Plastic Behavior of Boron Steel Wire at High Temperature." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/75qevc.
Full text高苑科技大學
機械與自動化工程研究所
106
The isothermal hot compression test for the 10B21 and 10B33 boron steel rods in the range of 800oC~900oC at strain rate of 1*10-3s-1~1*10-1s-1 was done. And analysis for the deformation behavior of the steel at high temperature by measuring the flow stress and constructing the thermal processing map utilizing dynamic materials model has also been carried out. The results show that dynamic recrystallization is the main reason for softening flow at lower temperature and lower strain rate, on the contrary, it results from dynamic recovery at higher temperature and higher strain rate. For both of the steels strain rate sensitivity increases with decreasing strain rate at strin of 0.3 and at 800oC. Thus, the steel is sensitive to strain rate at the temperatures. Besides, it is more sensitive to temperature at lower strain rate. The 10B21 steel exhibits a better workability in deformation temperature range from 820oC to 880oC and strain rate range from 1*10-3s-1 to 1*10-1s-1, and at 850oC/1*10-3s-1 is the best one, it also has the highest power dissipation efficiency as well. But 10B33 steel, the best deforming condition is 850℃/1*10-1s-1. In the other hand, the 10B21 steel occurred significant inhomogeneous grain boundary distortion when deformation in the range of 800oC~810oC at strain rate of 1*10-3s-1~1*10-2s-1 and 880oC~900oC at strain rate of 1*10-2s-1~1*10-1s-1, this is responsible for the flow instability. However, the 10B33 steel occurred flow instability at differet strain rates.
Chang, Chung-Cheng, and 張忠誠. "A Sampled-Data Formulation for Boundary Temperature Control of A Threadlike Metal Wire." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/66963577613660398952.
Full text國立中興大學
電機工程學系
93
This thesis presents an analytic solution to the boundary temperature control problem for a threadlike metal wire. With boundary conditions satisfying the regular form of Strum-Liouville problem, the infinite-dimensional linear heat-conduction equation can be formulated into an infinite sequence of discrete-time control problems. The finite-dimensional approximation of the discrete-time system is obtained by the minimum square error theorem of Fourier series. The controllability- observability conditions are related to the associated eigenvalues. As a verification to the proposed analytic solution, numerical simulations are conducted using both a Matlab partial differential equation solver, pdepe.m , and the proposed finite dimensional ordinary differential equation approximation.
Lai, Po-Ying, and 賴柏穎. "Effect of Palladium Distribution on High Temperature Storage Reliability of Palladium Coated Copper Wire." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/8k3yr7.
Full text國立交通大學
機械工程系所
106
With the progress of science and technology, electronic chips are developed in the trend of light, thin, short and small. Wire bonding within the chip plays an important role in connecting an integrated circuit to a substrate for transmitting signals and power. The connecting wires are also as a heat sink during the operation of the chip. In bonding process, palladium-copper wire will be changed and melted to form a free air ball (FAB). And the quality of the FAB will affect the shape forming and palladium distribution of the bonding ball. The incomplete coating of the palladium on the surface of the bonding ball. Since that it is easy to be corrosion during to the moisture and halogen ions in the epoxy molding compound (EMC), win result to the change of the bonding reliability. The EFO during the bonding process is an important factor that affects the distribution and cladding of palladium on the bonding balls. In this study, the electronic flame off (EFO) is the main topic in studying the affect of palladium distribution of palladium coated copper wire on high temperature storage reliability. Three EFO current parameters are selected for evaluating the result of the affect on palladium distribution. In the process of experimental analysis, high-magnification microscope and electron microscope were used to observe the dimensions and material at distribution of both the FAB and bonding ball. The distribution of palladium in the FAB and the bonding ball was observed by electron microprobe. In order to evaluate the effect of EFO current on the distribution of palladium on the surface of FABs and the bonding strength of bonding wire, the bonding strength and high temperature reliability test were performed before and after the specimen package. The first mechanical strength test was carried out before the package was unpackaged to evaluate whether the distribution of palladium on the surface of the bond ball would affect the bond strength of the bond ball without high temperature corrosion. After the sample is packaged, it is planned to place the sample at high temperature reliability test. The experiment is planned to evaluate the corrosion effect of the bonding ball as compared by using three EFO currents parameters. Finally, the second mechanical strength test was conducted again to evaluate the joint reliability of the bonding balls after being subjected to high temperature corrosion. The results of the present study show that the three kinds of EFO current parameters will cause different coverage of palladium on the surface of the FAB. However, the complete coverage of palladium on the FAB directly affects the distribution of palladium on the bonding sphere surface and the bonding interface. After high temperature reliability test of the sample, the results indicated that the bonding strength of the bonding balls tended to decrease. In addition, the FABs formed with the three kinds of EFO current conduct to the bonding balls with different surface conditions of potholes and cracks. From the high temperature reliability test results show that palladium can be used as a protective layer of the bonding balls, mitigation from the encapsulation of the halide ions and water vapor attack, the bonding ball of palladium coated incomplete or palladium into the alloy. Less coverage of the palladium on FAB and bonding ball, the corrosion area of the bonding ball is increased and expanded. The results of this research show that the optimum EFO current is obtained. This research result can provide a reference for the planning or improvement of the package process.
Jen-BangLo and 羅任邦. "Three-dimensional orthodontic force measurement system to evaluate the temperature effect on NiTi wire." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/u4v2uh.
Full text國立成功大學
口腔醫學研究所
105
The movement of teeth during orthodontic treatment should be controlled in all three planes of space, including the crown and root position. Force and movement should be accurately known in order to move a tooth into the ideal position and avoid undesirable side effects such as additional visits, overloading, tissue necrosis or even root resorption. Nickel-titanium (NiTi) wires are widely used in orthodontics as they combine the shape memory and superelasticity resulting from phase transformation induced by stress or temperature. In this study, a 3D force measuring system was developed using cone-beam computerized tomography (CBCT) images and software (Mimics 10.01, Geometric studio 12 and Solidworks). The models were fabricated using a 3D printer (Up plus 2). A multi-axis force transducer, called Nano17 (ATI, USA), was used for the 3D orthodontic force and moment measurements. Four different types of NiTi wire (Nitinol, Sentalloy, 27°C CuNiTi, 40°C CuNiTi) with the same size (.016 x .022 inches) were used. Self-ligating brackets (H4, Orthoclassic, USA) were bonded on simulated teeth. The change in orthodontic force and moment can be observed inside temperature controlled box. The results revealed that there was a strong relation between temperature and orthodontic force for most brands of wires, except Nitinol (correlation coefficient: Sentalloy=0.964, 27°C CuNiTi=0.918, 40°C CuNiTi=0.946). Comparison of forces under different temperature among different NiTi wires also reached statistically significant difference. However, the moment and temperature did not show a very strong correlation. Nitinol expressed highest and 40°C CuNiTi expressed lowest moment among four groups. The 3D force measurement system can provide practical information for clinical use.
Sterner, Boström Måns. "Developing a measurement system of fluid velocities in rotating bed reactors." Thesis, 2016. http://urn.kb.se/resolve?urn=urn:nbn:se:umu:diva-123227.
Full textHao-WenHsueh and 薛皓文. "Effect of Annealing Temperature on Recrystallization and Tensile Properties of Wire Bonding 23μm Silver Wires." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/20558853373144805511.
Full text國立成功大學
材料科學及工程學系碩博士班
98
Silver is a novel wire material of wire bonding process because its excellent electrical and thermal properties, it’s more expensive than copper but cheaper than gold, and it’s lower hardness and hard to oxidative compared to copper. In this study, the effects of the microstrctures and tensile properties after annealing, EFO, wire bonding and electrical current test of the 23μm silver wire are studied. After the silver wires are annealed at 250℃ for 30minutes, the microhardness decreases to Hv 53±2 which is similar to gold and the tensile properties are steady because of recrystallization,. After the EFO process, there are 3~4 columnar grains in the FAB and HAZ in the wire whether the sample is annealed or not. According to the results of the microstructure and the microhardness, the lengths of HAZ in the as-drawn wire and annealed wire are 420μm and 220μm respectively. Due to the fact of forming HAZ, the strength is the lowest and strain concentration in this area, leading to the change of the tensile properties. In this study, I use two different Al subtrates, Al-bulk and Al-500nm thin film, as experiment’s bonding pads. Before the current test, the fracture of silver wire mainly occurs in the HAZ during the pull tests. After the current test, the fracture positions has shifted to the middle of new HAZ which is formed by the current test. Among the two substrates, Al-500nm thin film is more likely to fracture at the contact interface.
CHUANG, CHENG-YAO, and 莊承堯. "Texturization of diamond-wire-sawn single-crystalline Si using high temperature copper based acid solutions." Thesis, 2019. http://ndltd.ncl.edu.tw/handle/xx2z46.
Full text國立雲林科技大學
材料科技研究所
107
This work study surface texturization of diamond wire sawn (DWS) single-crystalline silicon wafer by metal assisted chemical etching (MACE). An unetched single-crystalline silicon wafer was used. A non-etched single crystal was etched in a Cu(NO3)2/HF/H2O2 solution at above 56 °C. The residual metal ions are removed by using HNO3 solution, and the oxide is removed by the HF solution. The surface morphology of the textured wafer was analyzed using a field emission scanning electron microscopy (SEM). UV/visible spectrophotometer was adopted to measure the reflectivity of the wafer. SEM analysis showed that {111} planes and inverted pyramid structures were successfully produced on the surface of a DWS wafer by using copper assisted chemical etching. Among them, the solution concentration, the etching temperature, and the etching time were found to greatly affect the surface structures. Reflectance measurements were made at an angle of 5 ° from the normal of the wafer. The average reflectivity of the unetched DWS wafer, an industry DWS wafer by using alkaline etching and the DWS wafer by using MACE at visible wavelength range (380 nm-750 nm) is about 3.4%, 0.2% and 0.08%, respectively. The reflectivity of all DWS wafers by using MACE is lower than the DWS wafers by using the industry alkaline etching. Therefore, the reflectivity of sunlight can effectively decline. SEM analysis shows that the parallel saw marks on the surface of a DWS wafer can be effectively removed by etching of wafers in Cu(NO3)2/HF/H2O2 solution. The inverted pyramid structures were successfully produced on the surface of a DWS wafer by using metal catalyst of copper through MACE. Keywords: texturization, diamond wire sawn wafer, copper nitrate
Powell, Benjamin Robert. "Constant temperature hot wire anemometry applied to the characterisation of a nozzle molecular beam source." Master's thesis, 2008. http://hdl.handle.net/1885/146501.
Full textRichardson, Christine Esber. "Low-temperature hot-wire chemical vapor deposition of epitaxial films for large-grained polycrystalline photovoltaic devices." Thesis, 2007. https://thesis.library.caltech.edu/2812/1/CERthesis.pdf.
Full textKo, Yung-Long, and 柯雲龍. "Thin-film Thermocouple Fabricated by Sputtering Deposition in Application to Contacted Temperature Measurement during Ultrasonic Wire Bounding." Thesis, 2000. http://ndltd.ncl.edu.tw/handle/88009959160687123622.
Full text國立中正大學
機械系
88
Wire bonding, mainly responsible for electricity and signal delivery among devices, is a critical process in electronic package. Depending on the materials to be connected, the three often-used boding techniques are the thermocompression, ultrasonic, and thermosonic wire bondings. Although these techniques have been used for years, the detailed bonding mechanism is still unclear. Some researchers believed that the boding is due to re-solidification of melting that is induced by heat generation from friction caused by the fast relative motion between wire and metal surface. Others, however, thought the metallic bonding was formed due to free electrons exchanged during fast friction process and no melting occurred. So far no direct experimental evidence is obtainable for the bonding mechanism. The time history of contact temperature is a good indicator for this understanding. During the bonding process, if the contact temperature was higher than the melting temperature, the melting and re-solidification should be a reasonable mechanism. Otherwise, the mechanism could be the latter. From the literature, the available experimental study showed that the contact surface temperature was about 80oC. This low temperature might be due to using an oversized and insensible temperature sensor. In the present study a thin-film, K-type thermocouple, 80m in width, fabricated by sputtering deposition is used to measure the transient temperature during the bonding process. Result shows that the contact temperature was up to 170oC. Thus it is reasonable to conjecture that contact temperature can be even higher if a more smaller temperature sensor is used.