Journal articles on the topic 'Vapor plating'
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Zhuk, Yuri. "Chemical Vapor Deposition Coatings Extend Aerospace Component Life." AM&P Technical Articles 175, no. 6 (September 1, 2017): 23–26. http://dx.doi.org/10.31399/asm.amp.2017-06.p023.
Full textThomas, Richard R., and Jae M. Park. "Vapor Phase Deposition of Palladium for Electroless Copper Plating." Journal of The Electrochemical Society 136, no. 6 (June 1, 1989): 1661–66. http://dx.doi.org/10.1149/1.2096989.
Full textXu, Xian Feng, Yan Yan Hu, and Peng Xiao. "The Morphologies of Nano Carbon Growing In Situ by Catalytic Chemical Vapor Deposition." Advanced Materials Research 430-432 (January 2012): 1269–72. http://dx.doi.org/10.4028/www.scientific.net/amr.430-432.1269.
Full textWhon, Tae Woong, Yong-Hwan Lee, Dong-Shan An, Hyun Kyu Song, and Song-Gun Kim. "A simple technique to convert sitting-drop vapor diffusion into hanging-drop vapor diffusion by solidifying the reservoir solution with agarose." Journal of Applied Crystallography 42, no. 5 (September 8, 2009): 975–76. http://dx.doi.org/10.1107/s0021889809028805.
Full textTanaka, Kazuto, and Shuhei Kyoyama. "The Effect of Pulse Current on Electrolytically Plating Nickel as a Catalyst for Grafting Carbon Nanotubes onto Carbon Fibers via the Chemical Vapor Deposition Method." Journal of Composites Science 7, no. 2 (February 19, 2023): 88. http://dx.doi.org/10.3390/jcs7020088.
Full textYang, Li Jun, Ze Hui Zhang, Xin An Dang, and Lin Li. "Properties of TiAl/TiAlN/TiAlCN Films Deposited by Arc Ion Plating on GCr15 Rings." Materials Science Forum 789 (April 2014): 449–54. http://dx.doi.org/10.4028/www.scientific.net/msf.789.449.
Full textYu, D. H., Cheng Yong Wang, X. L. Cheng, and Yue Xian Song. "TiAlSiN Coatings Prepared by Hybrid PVD Technology for High Speed Milling of Hardened Steel." Advanced Materials Research 69-70 (May 2009): 423–27. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.423.
Full textBraun, Silvia, Maik Wiemer, and Stefan E. Schulz. "Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level." Micromachines 15, no. 6 (June 1, 2024): 746. http://dx.doi.org/10.3390/mi15060746.
Full textWhite, J. R. "Summary Abstract: A physical vapor deposition technique for plating gun tubes." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 4, no. 6 (November 1986): 2855–56. http://dx.doi.org/10.1116/1.573690.
Full textShin, Eun Gu, Atteq ur Rehman, Sang Hee Lee, and Soo Hong Lee. "Nickel Electroless Plating: Adhesion Analysis for Mono-Type Crystalline Silicon Solar Cells." Journal of Nanoscience and Nanotechnology 15, no. 10 (October 1, 2015): 7823–27. http://dx.doi.org/10.1166/jnn.2015.11184.
Full textLin, Yuli, and Li-Jang Hwang. "Ni-Coated Optical Fibers by Electroless Plating." Microscopy and Microanalysis 6, S2 (August 2000): 456–57. http://dx.doi.org/10.1017/s1431927600034772.
Full textXie, Peng Cheng, Gang Gou, Zhen Xing Wen, Yu Mei Ding, and Wei Min Yang. "Research on the Key Technology of Precision Injection Molding Equipment for Light Guide Plate." Advanced Materials Research 87-88 (December 2009): 306–10. http://dx.doi.org/10.4028/www.scientific.net/amr.87-88.306.
Full textMITA, Mamoru. "Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources." Journal of the Surface Finishing Society of Japan 48, no. 5 (1997): 539–43. http://dx.doi.org/10.4139/sfj.48.539.
Full textQian, X. Y., M. H. Kiang, N. W. Cheung, I. G. Brown, X. Godechot, J. E. Galvin, R. A. MacGill, and K. M. Yu. "Metal vapor vacuum arc ion implantation for seeding of electroless Cu plating." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 55, no. 1-4 (April 1991): 893–97. http://dx.doi.org/10.1016/0168-583x(91)96302-2.
Full textKostylev, A., Y. Pokrovsky, A. Lumpov, and Boris Bryskin. "Advanced Chromium Carbide Coatings on Piston Rings by CVD: A Highly Adaptable New Method with Relatively Low Cost." AM&P Technical Articles 170, no. 7 (July 1, 2012): 22–26. http://dx.doi.org/10.31399/asm.amp.2012-07.p022.
Full textMason, Maribeth, Genghmun Eng, Martin Leung, Gary Stupian, and Terence Yeoh. "Tin Whisker Risk Assessment for Space Systems." EDFA Technical Articles 14, no. 1 (February 1, 2012): 14–20. http://dx.doi.org/10.31399/asm.edfa.2012-1.p014.
Full textRathnam, G. Santhosha. "The Effect of Different Surface Treatments to Reduce Surface Roughness Before PVD Coatings." International Journal for Research in Applied Science and Engineering Technology 10, no. 9 (September 30, 2022): 779–88. http://dx.doi.org/10.22214/ijraset.2022.46575.
Full textZhang, Hui Chong, Zhan Chang Pan, Guang Hui Hu, Zhi Gang Wei, Chu Min Xiao, Shi Rong Chen, Zhu Liang Li, and Jian Feng Deng. "Surface Modification of PET Films by Vapor-Phase Photografting Acrylic Acid and its Application to Electroless Copper Plating." Advanced Materials Research 311-313 (August 2011): 1802–5. http://dx.doi.org/10.4028/www.scientific.net/amr.311-313.1802.
Full textDaming, Zhuang, Liu Jiajun, Zhu Baoliang, Zhou Zhong-Rong, Leo Vincent, and Philippe Kapsa. "Effect of Stress State of Different Tin Films on Their Tribological Behavior." Journal of Tribology 120, no. 4 (October 1, 1998): 820–28. http://dx.doi.org/10.1115/1.2833785.
Full textIslam, Md Saiful, Md Jahid Hasan, Promita Poroma, and Sraboni Akter. "A review on the environment friendly electroplating of Cr (III) & Cr (VI)." Journal of Science and Engineering Papers 01, no. 01 (January 18, 2024): 31–39. http://dx.doi.org/10.62275/josep.24.1000006.
Full textZhan, Jian Chao. "The Preparation of Ni-Co-Fe/PU Magnetic Composite Membrane." Advanced Materials Research 239-242 (May 2011): 2937–41. http://dx.doi.org/10.4028/www.scientific.net/amr.239-242.2937.
Full textJEHN, Hermann A. "Vapor deposition and electrochemical plating: Competition, alternative or combination-or: Which serves best?" Journal of Advanced Science 13, no. 4 (2001): 549–60. http://dx.doi.org/10.2978/jsas.13.549.
Full textkamal, Hagar, Mohammed Mohammed, and Salwa Abdel-Naby. "Physical Vapor Deposition as an Economical Alternative to Gold Plating in Imitation Jewelry." Journal of Design Sciences and Applied Arts 2, no. 2 (June 1, 2021): 245–49. http://dx.doi.org/10.21608/jdsaa.2021.50381.1085.
Full textWu, Liying, Lianchang Qiu, Yong Du, Fangfang Zeng, Qiang Lu, Zhuopeng Tan, Lei Yin, Liyong Chen, and Jifei Zhu. "Structure and Mechanical Properties of PVD and CVD TiAlSiN Coatings Deposited on Cemented Carbide." Crystals 11, no. 6 (May 25, 2021): 598. http://dx.doi.org/10.3390/cryst11060598.
Full textArdashev, Dmitrii, Nizami Yusubov, Leonid Shipulin, and Anastasiya Degtyareva-Kashutina. "Development of environmental protection system for installation of chrome plating of the internal surfaces of hydraulic drives with hydrostatic guideways." E3S Web of Conferences 193 (2020): 02015. http://dx.doi.org/10.1051/e3sconf/202019302015.
Full textKupchenko, Leonid, Rauno Tali, Eron Adoberg, Valdek Mikli, and Vitali Podgursky. "Evolution of TiN Coating Surface Roughness during Physical Vapor Deposition on High Speed Steel Substrate." Key Engineering Materials 604 (March 2014): 67–70. http://dx.doi.org/10.4028/www.scientific.net/kem.604.67.
Full textMorikawa, Yasuhiro, Takahide Murayama, Toshiyuki Sakuishi, and Koukou Suu. "2.5 / 3D PACKAGING TECHNOLOGY SOLUTION FOR HIGH FREQUENCY DEVICE." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000013–16. http://dx.doi.org/10.4071/isom-2013-ta14.
Full textAu, Yeung, Qing Min Wang, Huazhi Li, Jean-Sebastien M. Lehn, Deo V. Shenai, and Roy G. Gordon. "Vapor Deposition of Highly Conformal Copper Seed Layers for Plating Through-Silicon Vias (TSVs)." Journal of The Electrochemical Society 159, no. 6 (2012): D382—D385. http://dx.doi.org/10.1149/2.097206jes.
Full textMiyoshi, Kazuhisa, Talivaldis Spalvins, and Donald H. Buckley. "Tribological characteristics of gold films deposited on metals by ion plating and vapor deposition." Wear 108, no. 2 (March 1986): 169–84. http://dx.doi.org/10.1016/0043-1648(86)90095-5.
Full textYang, Zhongyi, Ning Zhang, Hongtao Li, Bo Chen, and Bo Yang. "Comparison to Micro Wear Mechanism of PVD Chromium Coatings and Electroplated Hard Chromium." Materials 16, no. 7 (March 28, 2023): 2695. http://dx.doi.org/10.3390/ma16072695.
Full textBădănac, Ana, Ramona Popa Scurtu, Gheorghe Bosoancă, Valerică Hușanu, and Sorin Popa. "Researches Concerning the Improving of the Cutting Inserts Durability Using Titanium Deposition." Advanced Materials Research 1036 (October 2014): 252–58. http://dx.doi.org/10.4028/www.scientific.net/amr.1036.252.
Full textJeong, Woon-Jo. "Development of Near Gold-Colored TixZr1-xN Nano Thin Films by Arc Ion Plating." Journal of Nanoscience and Nanotechnology 21, no. 9 (September 1, 2021): 4818–23. http://dx.doi.org/10.1166/jnn.2021.19261.
Full textKim, Dong-Kyu, Woong Han, Kwan-Woo Kim, and Byung-Joo Kim. "Electromagnetic Interference Shielding Effectiveness of Direct-Grown-Carbon Nanotubes/Carbon and Glass Fiber-Reinforced Epoxy Matrix Composites." Materials 16, no. 7 (March 24, 2023): 2604. http://dx.doi.org/10.3390/ma16072604.
Full textBharadishettar, Naveen, Udaya Bhat K, and Devadas Bhat Panemangalore. "Coating Technologies for Copper Based Antimicrobial Active Surfaces: A Perspective Review." Metals 11, no. 5 (April 26, 2021): 711. http://dx.doi.org/10.3390/met11050711.
Full textLiu, Ouyang. "Advances in Preparation Technology of Tool Coatings." Academic Journal of Science and Technology 4, no. 3 (February 8, 2023): 146–48. http://dx.doi.org/10.54097/ajst.v4i3.5047.
Full textMITA, Mamoru. "Chemical Etching and Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources." Journal of the Surface Finishing Society of Japan 48, no. 5 (1997): 533–38. http://dx.doi.org/10.4139/sfj.48.533.
Full textNitskaya, Svetlana G., K. R. Smolyakova, and Irina V. Shmidt. "Optimizing the Performance of Electroplating Gas-Cleaning Equipment." Solid State Phenomena 299 (January 2020): 792–97. http://dx.doi.org/10.4028/www.scientific.net/ssp.299.792.
Full textNeumann, Anica N., Olivia D. Schneble, and Emily L. Warren. "Communication—Electrodeposition of Indium Directly on Silicon." Journal of The Electrochemical Society 169, no. 1 (January 1, 2022): 012503. http://dx.doi.org/10.1149/1945-7111/ac48c7.
Full textLiu, J., S. H. Lin, and B. J. Feldman. "Characterization of boron nitride thin films synthesized by plasma-assisted chemical vapor deposition technique." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 638–39. http://dx.doi.org/10.1017/s0424820100165653.
Full textXie, Dong Bai, Sheng Long Zhu, Wen Jun Dai, and Fu Hui Wang. "Influence of NiCoCrAlY and Diffusion Aluminide Coating on Oxidation and Hot Corrosion of a Ni-Based Superalloy." Materials Science Forum 546-549 (May 2007): 1739–46. http://dx.doi.org/10.4028/www.scientific.net/msf.546-549.1739.
Full textWang, Dan, Shi Hu, Dana Kremenakova, and Jiri Militky. "The electromagnetic shielding effectiveness of the copper plated nonwoven fabric and its’ related comfort properties." Journal of Engineered Fibers and Fabrics 17 (January 2022): 155892502211334. http://dx.doi.org/10.1177/15589250221133462.
Full textSerbinovskiy, Mikhail Yu, Natal'ya A. Vasil'yeva, and Olga V. Popova. "ON COMPLEXATION IN PROCESS OF CHEMICAL COPPER PLATING FROM SOLUTIONS CONTAINING POLYVINYLPYRROLIDONE." IZVESTIYA VYSSHIKH UCHEBNYKH ZAVEDENIY KHIMIYA KHIMICHESKAYA TEKHNOLOGIYA 60, no. 2 (April 7, 2017): 26. http://dx.doi.org/10.6060/tcct.2017602.5478.
Full textKim, Young-Gu, and Do Kyung Kim. "In situ Observation of Fracture Sequence of Physical Vapor Deposited TiN Film on (1120) Sapphire." Journal of Materials Research 20, no. 6 (June 1, 2005): 1389–95. http://dx.doi.org/10.1557/jmr.2005.0201.
Full textMinegishi, Tsutomu, Daiki Komori, Hiroji Ebe, Hiromu Kumagai, and Masakazu Sugiyama. "(Invited) Electrocatalytic Reduction of Carbon Dioxide over Aluminum-Added Coppor Oxide Gas Diffusion Electrode." ECS Meeting Abstracts MA2023-02, no. 47 (December 22, 2023): 2364. http://dx.doi.org/10.1149/ma2023-02472364mtgabs.
Full textTSURU, Yutaka, Kouji MOCHINAGA, Michiyuki KUME, and Yashichi OOYAGI. "Application of Vapor-plated Zinc as a Substitute for Palladium Catalyst in the Nickel-Phosphorus Electroless Plating." Journal of the Surface Finishing Society of Japan 53, no. 1 (2002): 78–80. http://dx.doi.org/10.4139/sfj.53.78.
Full textLupescu, Octavian, Ana Bădănac, Mădălina Popa, and Cristian Ulianov. "Researches upon Thin Layers Deposition on Cutting Inserts." Applied Mechanics and Materials 809-810 (November 2015): 339–44. http://dx.doi.org/10.4028/www.scientific.net/amm.809-810.339.
Full textQi, Hua, O. J. Glembocki, and S. M. Prokes. "Plasmonic Properties of Vertically Aligned Nanowire Arrays." Journal of Nanomaterials 2012 (2012): 1–7. http://dx.doi.org/10.1155/2012/843402.
Full textLiu, Zheng, Zaoyu Shen, and Guanxi Liu. "Protocol for LaSmZrO/YSZ/NiCoCrAlYHf thermal barrier coatings using arc ion-plating and electron-beam physical vapor deposition." STAR Protocols 3, no. 3 (September 2022): 101627. http://dx.doi.org/10.1016/j.xpro.2022.101627.
Full textIjiri, Masataka, Fumihiro Kato, Daisaku Maeda, Daichi Shimonishi, and Toshihiko Yoshimura. "Effect of Compressive Residual Stress on Film Formed by Mechanochemical Multifunction Cavitation Processing." Materials Science Forum 1016 (January 2021): 574–79. http://dx.doi.org/10.4028/www.scientific.net/msf.1016.574.
Full textDeng, Bin, Jun Fei Pei, and Ye Tao. "Microstructure, Mechanical and Tribological Properties of the Tialn Coatings after Nb and C Dual Ion Implantation." Materials Science Forum 789 (April 2014): 455–60. http://dx.doi.org/10.4028/www.scientific.net/msf.789.455.
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