Relevant bibliographies by topics / Vapor plating

Academic literature on the topic 'Vapor plating'

Author: Grafiati
Published: 4 June 2021
Last updated: 30 July 2024

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Journal articles on the topic "Vapor plating"

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Zhuk, Yuri. "Chemical Vapor Deposition Coatings Extend Aerospace Component Life." AM&P Technical Articles 175, no. 6 (September 1, 2017): 23–26. http://dx.doi.org/10.31399/asm.amp.2017-06.p023.

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Abstract Nanostructured tungsten-tungsten carbide chemical vapor deposition (CVD) coatings provide a practical, technical, and commercially viable alternative to hard chrome plating for aircraft components.
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Thomas, Richard R., and Jae M. Park. "Vapor Phase Deposition of Palladium for Electroless Copper Plating." Journal of The Electrochemical Society 136, no. 6 (June 1, 1989): 1661–66. http://dx.doi.org/10.1149/1.2096989.

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Xu, Xian Feng, Yan Yan Hu, and Peng Xiao. "The Morphologies of Nano Carbon Growing In Situ by Catalytic Chemical Vapor Deposition." Advanced Materials Research 430-432 (January 2012): 1269–72. http://dx.doi.org/10.4028/www.scientific.net/amr.430-432.1269.

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In order to improve surface characteristics of carbon fibers, using nickel granules as catalysts, nano carbon with different morphologies was deposited in-situ on the surface of carbon fibers by the method of Chemical Vapor Deposition (CVD). The observations by Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM) indicated that keeping the excellent performance of plating nickels catalyst and a suitable deposition rate of Pyrogenation Carbon (PyC) are the key factors for getting Carbon Nanotube and Carbon Nanofiber (CNT/CNF). In this experiment, the optimum operation conditions are: plating time at 5min, deposition temperature at 1173K, deposition time at 2 hours, flow of C3H6, H2 and N2 at 30, 200 and 400ml/min respectively, deposition pressure at 700-1000Pa. Evolution rules of nano carbon are explained in growth mechanism of Catalytic Chemical Vapor Deposition (CCVD).
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Whon, Tae Woong, Yong-Hwan Lee, Dong-Shan An, Hyun Kyu Song, and Song-Gun Kim. "A simple technique to convert sitting-drop vapor diffusion into hanging-drop vapor diffusion by solidifying the reservoir solution with agarose." Journal of Applied Crystallography 42, no. 5 (September 8, 2009): 975–76. http://dx.doi.org/10.1107/s0021889809028805.

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A simple protocol to convert sitting-drop vapor-diffusion plating into a hanging-drop vapor-diffusion experiment in protein crystallization is reported. After making a sitting-drop plate, agarose solution was added to solidify the reservoir solution, and the plates were incubated upside down. Crystallization experiments with hen egg white lysozyme, thaumatin and glucose isomerase showed that the `upside-down sitting-drop' method could produce single crystals with all the benefits of the hanging-drop crystallization method.
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Tanaka, Kazuto, and Shuhei Kyoyama. "The Effect of Pulse Current on Electrolytically Plating Nickel as a Catalyst for Grafting Carbon Nanotubes onto Carbon Fibers via the Chemical Vapor Deposition Method." Journal of Composites Science 7, no. 2 (February 19, 2023): 88. http://dx.doi.org/10.3390/jcs7020088.

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Carbon nanotubes (CNTs) can be directly grafted onto the surface of carbon fibers using the chemical vapor deposition method, in which nanometer-order nickel (Ni) particles, serving as catalysts, are plated onto the surface of carbon fibers via electrolytic plating. In our previous studies, in which a direct current (DC) was used to electrolytically plate Ni onto carbon fibers as a catalyst, the site densities and diameters of Ni particles increased simultaneously with the plating time, making it difficult to independently control the site densities and diameters of the particles. On the other hand, pulse current (PC) plating is attracting attention as a plating technique that can control the deposition morphology of nuclei. In this study, we clarify the effect of the parameters of the PC on the particle number per unit area (site density) and the particle diameters of Ni particles plated onto the surface of carbon fibers, using the PC to electrolytically plate Ni. Electrolytically plating Ni onto carbon fibers (via PC) after the removal of the sizing agent enable Ni particles with sparser site densities and larger diameters to be plated than those plated via DC. Using Ni particles with sparse site densities, it is shown that CNTs with sparse site densities can be grafted.
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Yang, Li Jun, Ze Hui Zhang, Xin An Dang, and Lin Li. "Properties of TiAl/TiAlN/TiAlCN Films Deposited by Arc Ion Plating on GCr15 Rings." Materials Science Forum 789 (April 2014): 449–54. http://dx.doi.org/10.4028/www.scientific.net/msf.789.449.

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Ring is one of the major textile spinning machine consumable part, it has an important influence on yarn quality and cost. Ring of domestic cotton spinning enterprises generally has poor hardness, bad accuracy, not durable and difficult to guarantee the quality of the yarn, foreign ring has excellent performance, but it is too expensive, so it is difficult to widely used in China[1]. Vacuum arc ion plating technology has a wide range of applications in the aerospace, automobile, mold, tool, electronics and other fields [2-3]. TiN film which is prepared by arc ion plating technology has been widely used because of the TiN film has poor oxidation resistance and wear resistance at high temperatures, so the ternary films are developed on TiN film, such as TiAlN [4], TiCN etc. Traveller circle in the ring on the slide to produce large amounts of heat, it makes the ring surface temperature reach 400°C. When higher than 400°C, the TiCN film failure, therefore, ring should not be plated on the TiCN films. While TiAlN film oxidation temperature reaches 800°C. In HSS twist drill, depositing of TiAlN film can improve the service life more than four times [5]. Studies [6-8] have found that using pulsed laser deposition and chemical vapor deposition technique to prepare TiAlCN film, its wear resistance, high temperature stability is better. Pulsed laser deposition is mainly used in laboratory research. It is difficult to deposit a large area uniform film. Chemical vapor deposition of deposition rate is less than the arc ion plating, and produces lots of waste gas, leading to the environment is polluted. Arc ion plating technology can deposit the uniform films of large area with high deposition rate and deposition with no environmental pollution, therefore, this study, by means of vacuum arc ion plating technology to prepare high-precision, long-life and low-cost domestic cotton spinning ring. In order to obtain the best film process parameters, the performance of film is investigated at different bias and arc current.
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Yu, D. H., Cheng Yong Wang, X. L. Cheng, and Yue Xian Song. "TiAlSiN Coatings Prepared by Hybrid PVD Technology for High Speed Milling of Hardened Steel." Advanced Materials Research 69-70 (May 2009): 423–27. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.423.

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TiAlSiN coatings with different Al content were prepared by hollow cathode discharge ion plating (HCDIP) and medium frequency magnetron sputtering ion plating (MFMSIP) hybrid physical vapor deposition (PVD) coating system. The composition, microstructure, mechanical properties of these coatings were systematically investigated by means of EDX, XRD, SEM, nanoindentation, scratch and tribological tests. It was found that the coatings had (111) or (200) preferred orientation with addition of Al. Proper content of Al led to increase of microhardness and adhesion. The flank wear of carbide end mill coated with TiAlSiN had the least wear than those coated with TiAlN and TiSiN coatings under the high speed milling of hardened steel experiments.
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Braun, Silvia, Maik Wiemer, and Stefan E. Schulz. "Process Development of Aluminum Electroplating from an Ionic Liquid on 150 mm Wafer Level." Micromachines 15, no. 6 (June 1, 2024): 746. http://dx.doi.org/10.3390/mi15060746.

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This paper focuses on the development of electroplating on 150 mm wafer level for microsystem technology applications from 1-Ethyl-3-methylimidazolium chloride (EMImCl) with Aluminumtrichloride (AlCl3). The deposition was carried out on 150 mm wafers with Au or Al seed layers deposited by physical vapor deposition (PVD). The electrodeposition was carried out using pattern plating. On the Au seed layer, bipolar pulse plating was applied. Compared to the Au seed layer, the electrodeposition on the Al seed layer was favorable, with lower current densities and pulsing frequencies. Utilizing the recurrent galvanic pulses and avoiding ionic liquid convection, inhomogeneities lower than 15% were achieved with a laboratory plating cell. One major aspect of this study was the removal of the native Al oxide prior to deposition. It was investigated on the chip and wafer levels using either current- or potential-controlled removal pulses. This process step was affected by the plasma treatment of the wafer, thus the surface free energy, prior to plating. It turned out that a higher surface free energy hindered proper oxide removal at a potential of 3 V. The theory of oxide breakdown based on electrostriction force via the electrical field was applied to discuss the findings and to derive conclusions for future plating experiments.
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White, J. R. "Summary Abstract: A physical vapor deposition technique for plating gun tubes." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 4, no. 6 (November 1986): 2855–56. http://dx.doi.org/10.1116/1.573690.

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Shin, Eun Gu, Atteq ur Rehman, Sang Hee Lee, and Soo Hong Lee. "Nickel Electroless Plating: Adhesion Analysis for Mono-Type Crystalline Silicon Solar Cells." Journal of Nanoscience and Nanotechnology 15, no. 10 (October 1, 2015): 7823–27. http://dx.doi.org/10.1166/jnn.2015.11184.

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The adhesion of the front electrodes to silicon substrate is the most important parameters to be optimized. Nickel silicide which is formed by sintering process using a silicon substrate improves the mechanical and electrical properties as well as act as diffusion barrier for copper. In this experiment p-type mono-crystalline czochralski (CZ) silicon wafers having resistivity of 1.5 Ω·cm were used to study one step and two step nickel electroless plating process. POCl3 diffusion process was performed to form the emitter with the sheet resistance of 70 ohm/sq. The SiNx layer was set down as an antireflection coating (ARC) layer at emitter surface by plasma enhanced chemical vapor deposition (PECVD) process. Laser ablation process was used to open SiNx passivation layer locally for the formation of the front electrodes. Nickel was deposited by electroless plating process by one step and two step nickel electroless deposition process. The two step nickel plating was performed by applying a second nickel deposition step subsequent to the first sintering process. Furthermore, the adhesion analysis for both one step and two steps process was conducted using peel force tester (universal testing machine, H5KT) after depositing Cu contact by light induced plating (LIP).
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Dissertations / Theses on the topic "Vapor plating"

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Mount, Mason B. "Chemical vapor deposition on a filament in a cylinder." Ohio : Ohio University, 1989. http://www.ohiolink.edu/etd/view.cgi?ohiou1182459287.

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Hunt, Andrew J. "Combustion chemical vapor deposition from liquid organic solutions." Diss., Georgia Institute of Technology, 1993. http://hdl.handle.net/1853/16836.

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Si, Jie. "Metalorganic chemical vapor deposition of metal oxides." Thesis, This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-12302008-063204/.

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Book, Gregory W. "Aerosol size effects in combustion chemical vapor deposition." Diss., Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/20501.

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Shapiro, Michael Jay. "Chemical vapor deposition of silver films for superconducting wire applications." Diss., Georgia Institute of Technology, 1991. http://hdl.handle.net/1853/19168.

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O'Brien, David F. "Annealing study of YBa2Cu3Ox thin films deposited by chemical vapor deposition on ceramic fiber tows." Thesis, Georgia Institute of Technology, 1991. http://hdl.handle.net/1853/8650.

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Richards, Regina Hardin. "The chemical vapor deposition of hexagonal aluminates as a fiber-matrix interface coating for oxide-oxide composites." Thesis, Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/18958.

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Moss, Thomas Strong III. "The chemical vapor deposition of dispersed phase composites in the B-Si-C-H-Cl-Ar system." Diss., Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/19040.

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Ellzey, Karen Elizabeth. "Feasibility study of the chemical vapor infiltration of rhenium." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17534.

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Krishnan, Vidya. "Electroless deposition of copper for microelectronic applications." Thesis, Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/11752.

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Books on the topic "Vapor plating"

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Rosner, Daniel E. Research on chemical vapor deposition processes for advanced ceramic coatings. New Haven, CT: Yale University, Dept. of Chemical Engineering, High Temperature Chemical Reaction Engineering Laboratory, 1993.

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Krämer, Gernot. Arc-PVD-Beschichtung von Hartmetallen für den unterbrochenen Schnitt. Düsseldorf: VDI Verlag, 1993.

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George C. Marshall Space Flight Center., ed. Vacuum vapor deposition: A spinoff of space welding development. [Marshall Space Flight Center, Ala.]: National Aeronautics and Space Administration, George C. Marshall Space Flight Center, 1991.

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Kostrzhit͡skiĭ, A. I. Mnogokomponentnye vakuumnye pokrytii͡a. Moskva: "Mashinostroenie", 1987.

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Rosner, Daniel E. Research on chemical vapor deposition processes for advanced ceramic coatings. New Haven, CT: Yale University, Dept. of Chemical Engineering, High Temperature Chemical Reaction Engineering Laboratory, 1993.

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Symposium C on Ion Beam, Plasma, Laser, and Thermally-Stimulated Deposition Processes (1993 Strasbourg, France). Stimulated deposition processes and materials aspects of ion beam synthesis: Proceedings of Symposium C on Ion Beam, Plasma, Laser, and Thermally-Stimulated Deposition Processes and Symposium G on Materials Aspects of Ion Beam Synthesis: Phase Formation and Modification of the 1993 E-MRS Spring Conference, Strasbourg, France, May 4-7, 1993. Amsterdam: North-Holland, 1994.

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Gesheva, K. A. Chemical vapor deposition (CVD) technology. Hauppauge, N.Y: Nova Science Publishers, 2008.

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European, Conference on Chemical Vapour Deposition (13th 2001 Glyfada Athens Greece). Late news: Thirteenth European Conference on Chemical Vapour Deposition : proceedings : EUROCVD Thirteen : Glyfada, Athens, Greece, August 26-31, 2001. Les Ulis, France: EDP Sciences, 2002.

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International, Conference on Chemical Vapor Deposition (15th 2000 Toronto Ont ). CVD XV: Proceedings of the Fifteenth International Symposium on Chemical Vapor Deposition. Pennington, NJ: Electrochemical Society, 2000.

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Coaters, Society of Vacuum, ed. Society of Vacuum Coaters: 50th Annual Technical Conference proceedings, April 28-May 3, 2007, Louisville, KY USA. Albuquerque, NM: Society of Vacuum Coaters, 2007.

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Book chapters on the topic "Vapor plating"

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Moll, E. "Physical Vapor Deposition Techniques II: Ion Plating, Arc Deposition and Ion Beam Deposition." In Eurocourses: Mechanical and Materials Science, 181–97. Dordrecht: Springer Netherlands, 1992. http://dx.doi.org/10.1007/978-94-017-0631-5_8.

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Kato, Masako. "Vapochromic Soft Crystals Constructed with Metal Complexes." In The Materials Research Society Series, 39–52. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-0260-6_4.

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AbstractVapochromism, a phenomenon in which the color or luminescence color of a substance changes in response to gaseous molecules, has potential for developing sensor materials to detect harmful substances in the environment. In addition, vapochromism is scientifically interesting for the direct visualization of interactions between gases and solids. The crystals of metal complexes involve diverse and flexible electronic interactions, such as metal–metal and metal–ligand interactions. It is expected that slight structural changes in such crystals will lead to distinct color or emission color changes, thus achieving highly sensitive and selective vapochromic responses. Consequently, highly ordered and flexible response systems (i.e., soft crystals) can be constructed. This chapter introduces the interesting and attractive features of vapor-responsive soft crystals by discussing platinum complexes that show color and luminescence changes in dilute vapor atmospheres while maintaining an ordered structure, nickel(II) complexes that change magnetic properties in conjunction with a color change, and copper(I) complexes that change luminescence color in response to N-heteroaromatic vapors.
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Mathez, E. A., V. J. Dietrich, J. R. Holloway, and A. E. Boudreau. "Chemical Evolution of Vapor during Crystallization of the Stillwater Complex." In Geo-Platinum 87, 253–54. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1353-0_26.

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Taninouchi, Yu-ki, and Toru H. Okabe. "Vapor Treatment for Alloying and Magnetizing Platinum Group Metals." In Rare Metal Technology 2017, 119–27. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-51085-9_12.

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Braichotte, D., and H. Bergh. "Time Resolved Measurements in the Thermally Assisted Photolytic Laser Chemical Vapor Deposition Of Platinum." In Emerging Technologies for In Situ Processing, 83–91. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1409-4_9.

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Wang, Fuzhen, and Junwei Wu. "Plasma-enhanced chemical vapor deposition." In Modern Ion Plating Technology, 247–85. Elsevier, 2023. http://dx.doi.org/10.1016/b978-0-323-90833-7.00010-3.

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Mattox, Donald M. "Ion Plating and Ion Beam Assisted Deposition." In Handbook of Physical Vapor Deposition (PVD) Processing, 426–71. Elsevier, 1998. http://dx.doi.org/10.1016/b978-081551422-0.50009-7.

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Mattox, Donald M. "Ion Plating and Ion Beam-Assisted Deposition." In Handbook of Physical Vapor Deposition (PVD) Processing, 301–31. Elsevier, 2010. http://dx.doi.org/10.1016/b978-0-8155-2037-5.00009-5.

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"Thin Film Deposition Techniques—An Overview." In Introduction to Thin Film Deposition Techniques: Key Topics in Materials Science and Engineering, 1–11. ASM International, 2023. http://dx.doi.org/10.31399/asm.tb.itfdtktmse.t56060001.

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Abstract This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.
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Lunzer, Sandra, and Reinhard Kramer. "Effect of water vapour on the catalytic activity of supported platinum catalysts." In Studies in Surface Science and Catalysis, 2303–8. Elsevier, 2000. http://dx.doi.org/10.1016/s0167-2991(00)80812-5.

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Conference papers on the topic "Vapor plating"

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Pulker, H. K., M. Buhler, R. Hora, and K. H. Guenther. "Reactive ion plating deposition for sui generis optical coatings." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1987. http://dx.doi.org/10.1364/oam.1987.ths2.

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Edge filter double-halfwave narrowband transmission filters and broadband antireflection coatings have been deposited employing a reactive ion plating process. Reactive ion plating is distinctly different from other ion-assisted deposition techniques in that a high-current low-voltage plasma arc burns into the vapor source rather than a low-current medium-to-high energy ion beam irradiating the substrate and growing film surface. The vapor sources are melts of metals or suboxides produced by a modified standard electron-beam gun. The optical substrates when coated by reactive ion plating are in contact with the plasma and attain a self-bias potential of –5 to –60 V, which accelerates the vapor atoms/molecules ionized by the plasma arc toward the substrate surface. The resulting coatings have a very dense microstructure as apparent from high-resolution transmission electron micrographs, obtained by direct sectioning of the coatings perpendicular to their surface with a microtome, and by replicating fractured edges with a platinum/carbon preshadowed carbon film.
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Long, Lee Tsung, Liao Meng-Chieh, Huang Te-Chun, and Luo Tzeng-Cherng. "Plating coated component creep corrosion test at sulfur vapor atmosphere." In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2014. http://dx.doi.org/10.1109/impact.2014.7048394.

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Tetsman, Ina, Vladas Vekteris, Vadim Moksin, Vytautas Turla, and Eugenijus Jurkonis. "Investigation of the Influence of Acoustic Field on Vapor Precipitation over Plating Bath." In 2020 Mechatronics Systems and Materials (MSM). IEEE, 2020. http://dx.doi.org/10.1109/msm49833.2020.9202319.

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Guenther, Karl H., and Ronald Willey. "Front surface metal coatings with protective layers by reactive ion plating deposition." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1988. http://dx.doi.org/10.1364/oam.1988.thcc4.

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Front surface metal mirrors made by vapor deposition of aluminum or silver onto glass substrates are widely used in optical systems. Because of their inherent mechanical and environmental weakness, they need to be protected with hard dense dielectric layers. While much research has been done in the past to optimize these protective coatings, conventionally protected aluminum and silver mirrors are still less than optimal in their environmental durability. This is due to the packing density of less than unity of the protective coatings, which allows water vapor and other adverse agents to penetrate the coatings and attack the metal film. Substantial improvements of protective layers have been reported for ion assisted deposition, which, however, may have remained in the laboratory scale. Low-voltage reactive ion plating deposition of oxides has been shown to produce very dense homogeneous films, which we applied as protective layers for aluminum and silver thin films. The technique is being used in a 32-in. standard high vacuum box coater, which makes it potentially useful for coating of large mirrors of up to 30-in in diameter.
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Tapphorn, R., H. Gabel, K. Hashimoto, and T. Crowe. "Kinetic Metallization Repair of Ion Vapor Deposited Aluminum Coatings." In ITSC 2012, edited by R. S. Lima, A. Agarwal, M. M. Hyland, Y. C. Lau, C. J. Li, A. McDonald, and F. L. Toma. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.itsc2012p0504.

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Abstract The repair of damaged Ion Vapor Deposition Aluminum coatings on high strength steel aircraft components has generally required the use of brush plating with hazardous materials including cadmium. Inovati has developed a unique Al-Trans (aluminum-transition metal) coating using the Kinetic Metallization process that permits repairs of IVD-Al coatings on high strength steels. Originally the Al-Trans coating formulation was developed for commercial application on telecommunication equipment steel racks as an electrically conductive grounding strip with excellent corrosion resistance. Recent research was completed with NAVAIR to further develop this coating formulation and the Kinetic Metallization process for repair of IVD-Al coatings on aircraft components. This presentation will describe the KM repair process and the tests completed to qualify the repaired coatings. Inovati has recently developed a KM-Mobile Coating System with a handheld Spray Gun for the field repair of corrosion damaged magnesium and aluminum alloy aircraft components.
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Tapphorn, R., J. Henness, and H. Gabel. "Kinetic Metallization – A Repair Process for Damaged IVD-Al Coatings, Mg, and Al Alloy Components." In ITSC2009, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima, and G. Montavon. ASM International, 2009. http://dx.doi.org/10.31399/asm.cp.itsc2009p0261.

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Abstract Repair of damaged ion vapor deposition aluminum (IVD-Al) on aircraft components generally requires the use of brush plating with hazardous materials including cadmium. This paper describes a cold spray process that uses aluminum transition metals to make such repairs. The aluminum layers are applied with a handheld cold spray gun and tested according to JTP-2003 requirements for corrosion resistant coatings on steel components.
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K. R., Harish, Edwin Sahayaraj M., and Stanly Jones Retnam B. "Review on Spray Coating Techniques." In The International Conference on scientific innovations in Science, Technology, and Management. International Journal of Advanced Trends in Engineering and Management, 2023. http://dx.doi.org/10.59544/lurb3625/ngcesi23p64.

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A vast array of plating processes, the substances through which different plating can be applied with the natural intention of saving the component, shape and the outer layer that are left unprotected to any kind of physical, chemical and also mechanical adversities. Thus, Spray pyrolysis is very efficient, cost effective, and utilizes simple equipment. Spray pyrolysis is an important technique in which a thin film is deposited on the dielectric matrix by spraying a precursor solution on a heated surface. Spray pyrolysis has been applied to deposit a wide variety of thin films. These films were used in various devices such as solar cells, carbon solar cells, sensors, and solid oxide fuel cells, etc. It is observed that often the properties of deposited thin films depend on the preparation conditions. An extensive investigation of the effects of spray parameters on film quality is given to demonstrate the importance of the process of optimization. However, spray pyrolysis seems not useful due to poor quality of thin film, thermal decomposition, and vapor convection. The vapors are generated due to temperature difference, which restricts the source from binding with the substrate. In this paper, briefly study the spray pyrolysis techniques and using the same for metal coating done over polymers. Also, this study highlighted many research obstacles and presented future direction for research in developing new methodology using the inadequacies of the existing approaches.
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Kimble, Thomas C., Marc D. Himel, and Karl H. Guenther. "Optical waveguide characterization of thick dielectric films deposited by reactive low voltage ion plating." In Optical Interference Coatings. Washington, D.C.: Optica Publishing Group, 1992. http://dx.doi.org/10.1364/oic.1992.othd11.

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Titanium dioxide (TiO2) is a material often used for thin films in optical interference coatings because of its high index of refraction. However, conventional physical vapor deposition (PVD) results commonly in thin films with pronounced columnar microstructure. This causes light scattering to an extent that PVD thin films of a thickness suitable to guide one or more modes become too lossy to guide lightwaves at all. Reactive low voltage ion plating (RLVIP) produces very dense, amorphous (i.e. vitreous) thin films1 with surfaces significantly smoother than those of conventional PVD thin films.2 Thus, RLVIP thin films appear to be potentially useful as high-index optical waveguides, similar to those produced from organometallic solutions (sol-gel coatings).3 Vice versa, we show that waveguide characterization of the refractive index and optical losses is a useful aid for optimizing the RLVIP process toward low-loss optical coatings, for example for laser applications.4 In addition, the waveguide measurements of a few select samples were compared to variable angle spectroscopic ellipsometer (VASE)5 measurements.
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9

Zarrabian, S., A. Grogan, X. Q. Hu, C. Lee, and K. H. Guenther. "A Method for Reducing the Optical Absorption of Reactive Ion-Plated Metal-Oxide Thin Films." In Optical Interference Coatings. Washington, D.C.: Optica Publishing Group, 1992. http://dx.doi.org/10.1364/oic.1992.otha4.

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For most films produced by condensation from the vapor phase (physical vapor deposition, PVD) their physical and chemical structure and hence their optical properties deviate from those of the bulk material of nominally the same composition.1 The extent of this deviation depends upon the particular deposition process.2 Reactive Low Voltage Ion Plating (RLVIP) produces high density thin films that exhibit long term stability.3 However, because of the deposition conditions, optical absorption can be a significant problem.4 For many demanding optical applications, such as in laser systems, it is necessary to minimize the absorption of the deposited thin films. In this paper, RLVIP and conditions leading to thin films with some undesirable residual optical absorption are summarized. We will also describe experiments where the addition of small amounts of nitrogen gas to the plasma process environment reduced the optical absorption of tantala films made by RLVIP.
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10

Warnes, Bruce Michael. "Improved Pt Aluminide Coatings Using CVD and Novel Platinum Electroplating." In ASME 1998 International Gas Turbine and Aeroengine Congress and Exhibition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/98-gt-391.

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Chemical vapor deposition (CVD) is an old coating technology, but it was not successfully utilized to aluminize gas turbine hardware until recently (1989). In CVD aluminizing, the use of multiple, independently controlled, low temperature, external, metal halide generators combined with computer control of all process variables gives flexibility and consistent quality that is not possible with any other aluminizing process. It has been shown that harmful coating impurities (such as sulfur and boron etc.) can be transported to a coating from a high temperature aluminum source in the coating chamber during aluminizing. Representative processes include: pack cementation, above the pack, SNECMA, and high activity CVD. In contrast, it has also been demonstrated that CVD low activity aluminizing removes harmful impurities (S, P, B & W etc.) from the coating during deposition. Furthermore, clean, low activity coatings (simple aluminide MDC-210 or platinum modified MDC-150L) have been shown to exhibit superior oxidation resistance compared to similar coatings made by other aluminizing processes. A second significant source of impurities in platinum modified aluminide diffusion coatings is electroplating, that is, plating bath components (S, P, CI, K, Ca etc.) are codeposited with the platinum, and these impurities can have either a beneficial (K&Ca) or a detrimental (S,P&Cl) influence upon the oxidation resistance of the product coating. The results of investigations on the transport of impurities during aluminizing and electroplating, plus the influence of these impurities on oxidation resistance of the product coatings will be presented and discussed.
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Reports on the topic "Vapor plating"

1

Brugmann, G. E., and A. J. Naldrett. Vapour - Induced Partial Melting in the Gabbroic Part of the Lac Des Iles Complex, Ontario and the Genesis of Platinum Group Element Mineralization. Natural Resources Canada/ESS/Scientific and Technical Publishing Services, 1990. http://dx.doi.org/10.4095/131266.

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