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Journal articles on the topic 'Transient thermal management'

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Author: Grafiati

Published: 10 December 2022

Last updated: 29 January 2023

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1

Ghebru, Daniel. "Thermal Simulation of the Complete Vehicle — Evaluation of Transient Thermal Management." ATZ worldwide 116, no. 7-8 (July 2014): 50–55. http://dx.doi.org/10.1007/s38311-014-0207-y.

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2

Shen, Weijan, and Fock-Lai Tan. "Thermal management of mobile devices." Thermal Science 14, no. 1 (2010): 115–24. http://dx.doi.org/10.2298/tsci1001115s.

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This paper presents the experimental study of using phase change material in the cooling of the mobile devices. It investigates the thermal performance of transient charging and discharging of mobile devices in three different situations; making phone calls frequently, making long duration calls, and making occasional calls. The results show that mobile devices are heated up fastest during the long duration usage. Experiments are also conducted to determine the effect of fins and effect of orientation of the mobile device on its thermal performance.

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3

Zhang, TieJun. "TRANSIENT CHARACTERISTICS AND CONTROL OF ACTIVE THERMAL MANAGEMENT SYSTEMS." Annual Review of Heat Transfer 18 (2015): 245–328. http://dx.doi.org/10.1615/annualrevheattransfer.2015012305.

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4

Zao Liu, Sheldon X.-D. Tan, Xin Huang, and Hai Wang. "Task Migrations for Distributed Thermal Management Considering Transient Effects." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23, no. 2 (February 2015): 397–401. http://dx.doi.org/10.1109/tvlsi.2014.2309331.

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5

Cagnon, Hugo, Thierry Vidal, Alain Sellier, and Jean Michel Torrenti. "Transient Thermal Creep at Moderate Temperature." Key Engineering Materials 711 (September 2016): 885–91. http://dx.doi.org/10.4028/www.scientific.net/kem.711.885.

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The Cigéo project initiated by Andra (the French national agency for nuclear wastes management) concerns a deep geological disposal situated in an impermeable layer of clay approximately 500 m under ground. The High Performance Concrete (HPC) galleries will allow Intermediate Level Long-Life Nuclear Wastes to be stored. These exothermic radioactive wastes will induce a temperature rise which may reach 70°C. The very few studies that have investigated the effect of temperatures below 100°C on concrete behaviour have shown that temperature amplifies long-term deformations more than instantaneous ones. The present paper deals with the dimensional variations of HPC when subjected to temperature changes in sealed conditions. The aim is to provide accurate data to understand the causes of transient thermal creep. These experimental data may allow Thermo-Hydro-Mechanical models to be improved and thus provide accurate prediction of concrete long term behavior in such in situ conditions.

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6

Ding, Li, Lamei Che, Yumin Zhang, Hailin Cao, Xiaohong Hao, and Weihua Xie. "The transient temperature field simulation of the micro-grid inverter." Thermal Science 22, Suppl. 2 (2018): 391–99. http://dx.doi.org/10.2298/tsci170930251d.

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For the power electronics devices with the insulated gate bipolar transistors, the thermal management is very important and necessary for the devices reliability. In this paper, power losses of the inverter were evaluated based on its electro-thermal model and control logic. Accordingly, its thermal management system using forced air cooling is designed and simulated. The transient temperature filed simulation results showed that the thermal management system is feasible and can guarantee the working temperature of the inverter. Experimental results were also obtained to verify the simulation results in this paper.

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7

Chang, Norman. "(Invited, Digital Presentation) ML-Based Fast on-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 847. http://dx.doi.org/10.1149/ma2022-0217847mtgabs.

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Large 3DIC designs with multiple chips require several iterations of transient thermal analysis particularly for fine-grain on-chip dynamic thermal management. This requires a fast thermal analysis technology as opposed to traditional CFD/FEA based methods which have severe runtime/capacity limitations for large chips (e.g., 2cmx2cm) in 3DIC while generating fine grained (e.g., 10umx10um) transient thermal response. The fast transient thermal analysis is based on the idea of combining the global, intermediate, and local transient response curves generated from an ML-predictor. The local, intermediate, and global transient response curves are scaled based on the far-field and near-field transient decay surface components respectively, computed using the trained ML decay surface predictor, followed by linear superposition of the curves for each power value in the transient power profile to generate the effective transient response curve. The runtime for generating thermal results for a large chip is in the order of minutes, compared to several hours/days while using CFD/FEA based tools with good accuracy correlation. The fast transient thermal solver is implemented on distributed ML computing platform for parallel computation of transient thermal inference model.

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8

Li, S., J. Y. Wu, R. Z. Wang, and Y. Huangfu. "Investigation of transient behavior of a novel thermal management controller." Applied Thermal Engineering 28, no. 8-9 (June 2008): 824–34. http://dx.doi.org/10.1016/j.applthermaleng.2007.07.014.

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9

Azzam, H. "Mathematical networks for thermal transient and non-transient progressive fatigue of engine components." Proceedings of the Institution of Mechanical Engineers, Part G: Journal of Aerospace Engineering 212, no. 2 (February 1, 1998): 125–36. http://dx.doi.org/10.1243/0954410981532199.

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Engine components can experience varying centrifugal loads, gas loads, oxidation, micro- structure transformation at high temperatures and stresses induced by temperature gradients. The life consumption of hot engine components depends not only on these factors but also on the time spent at constant-amplitude loads. The damage mechanism of engine components is therefore complex and requires formidable models. These models are not suitable for fatigue management or on-board systems because of their high computational costs. There is a need for efficient simulations that can accurately portray this complex damage mechanism and, at the same time, can be embedded in fatigue management and on-board systems. Mathematical networks were developed to fulfil this need and successfully synthesized the fatigue damage of aircraft structural components from flight parameters. In this paper, the feasibility of training the mathematical networks to synthesize fatigue of engine components is demonstrated. The mathematical attributes of the networks were based on information supplied by Rolls-Royce. The networks’ training mechanism was targeted at the minimization of errors in synthesized accumulative damage values. The mathematical networks synthesized the accumulative fatigue damage of three engine components successfully. One component was subject to non-thermal transient stresses and two components were subject to thermal transient stresses.

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10

Hodes, Marc, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, and Calvin Chen. "Transient Thermal Management of a Handset Using Phase Change Material (PCM)." Journal of Electronic Packaging 124, no. 4 (December 1, 2002): 419–26. http://dx.doi.org/10.1115/1.1523061.

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The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.

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11

Chuttar, Aditya, and Debjyoti Banerjee. "Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)." Electronics 10, no. 22 (November 13, 2021): 2785. http://dx.doi.org/10.3390/electronics10222785.

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Miniaturization of electronics devices is often limited by the concomitant high heat fluxes (cooling load) and maldistribution of temperature profiles (hot spots). Thermal energy storage (TES) platforms providing supplemental cooling can be a cost-effective solution, that often leverages phase change materials (PCM). Although salt hydrates provide higher storage capacities and power ratings (as compared to that of the organic PCMs), they suffer from reliability issues (e.g., supercooling). “Cold Finger Technique (CFT)” can obviate supercooling by maintaining a small mass fraction of the PCM in a solid state for enabling spontaneous nucleation. Optimization of CFT necessitates real-time forecasting of the transient values of the melt-fraction. In this study, the artificial neural network (ANN) is explored for real-time prediction of the time remaining to reach a target value of melt-fraction based on the prior history of the spatial distribution of the surface temperature transients. Two different approaches were explored for training the ANN model, using: (1) transient PCM-temperature data; or (2) transient surface-temperature data. When deployed in a heat sink that leverages PCM-based passive thermal management systems for cooling electronic chips and packages, this maverick approach (using the second method) affords cheaper costs, better sustainability, higher reliability, and resilience. The error in prediction varies during the melting process. During the final stages of the melting cycle, the errors in the predicted values are ~5% of the total time-scale of the PCM melting experiments.

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12

Patil, Jeet P., Vilas Nandedkar, Sushil Mishra, and Sandip K. Saha. "Transient thermal analysis of close pressure thermoforming process." Journal of Manufacturing Processes 62 (February 2021): 513–22. http://dx.doi.org/10.1016/j.jmapro.2020.12.057.

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13

Hartsfield, Carl R., Travis E. Shelton, Brian O. Palmer, and Ryan O’Hara. "All-Metallic Phase Change Thermal Management Systems for Transient Spacecraft Loads." Journal of Aerospace Engineering 33, no. 4 (July 2020): 04020039. http://dx.doi.org/10.1061/(asce)as.1943-5525.0001150.

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14

Ding, Shuiting, Ziyao Wang, Guo Li, Chuankai Liu, and Liu Yang. "Transient stress control of aeroengine disks based on active thermal management." Applied Thermal Engineering 103 (June 2016): 16–27. http://dx.doi.org/10.1016/j.applthermaleng.2016.03.121.

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15

Hegab, Hisham E., Eric B. Zimmerman, and Gene T. Colwell. "Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers." Journal of Electronic Packaging 124, no. 1 (March 1, 2002): 7–11. http://dx.doi.org/10.1115/1.1392320.

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Telephone companies utilize densely packed electronics in outdoor metal cabinets for routing calls between customers. As a result of the increasing power densities of electronics, companies are looking for innovative methods of providing system level cooling such as using soil heat exchangers. Numerical simulation using a system of lumped thermal capacitances coupled to a soil finite element model is used to predict the transient thermal behavior of a cabinet. The cabinet model has been verified in previous studies by comparison with experimental measurements on a commercial telecommunications cabinet and is shown to predict temperature trends well. The effects of transient heat load, soil properties, and heat exchanger geometry are examined. Results reveal soil heat exchangers have the capability to provide the necessary cooling for relatively low power outdoor cabinets. However, the temperature of the soil surrounding the heat exchanger may increase daily if the number and spacing of pipes is not adequate to handle the desired heat dissipation load.

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16

Liu, Yiqun, Y. Gene Liao, and Ming-Chia Lai. "Transient Temperature Distributions on Lithium-Ion Polymer SLI Battery." Vehicles 1, no. 1 (July 25, 2019): 127–37. http://dx.doi.org/10.3390/vehicles1010008.

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Lithium-ion polymer batteries currently are the most popular vehicle onboard electric energy storage systems ranging from the 12 V/24 V starting, lighting, and ignition (SLI) battery to the high-voltage traction battery pack in hybrid and electric vehicles. The operating temperature has a significant impact on the performance, safety, and cycle lifetime of lithium-ion batteries. It is essential to quantify the heat generation and temperature distribution of a battery cell, module, and pack during different operating conditions. In this paper, the transient temperature distributions across a battery module consisting of four series-connected lithium-ion polymer battery cells are measured under various charging and discharging currents. A battery thermal model, correlated with the experimental data, is built in the module-level in the ANSYS/Fluent platform. This validated module thermal model is then extended to a pack thermal model which contains four parallel-connected modules. The temperature distributions on the battery pack model are simulated under 40 A, 60 A, and 80 A constant discharge currents. An air-cool thermal management system is integrated with the battery pack model to ensure the operating temperature and temperature gradient within the optimal range. This paper could provide thermal management design guideline for the lithium-ion polymer battery pack.

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17

Yee, Cheang Soon, G. A. Quadir, Z. A. Zainal, and K. N. Seetharamu. "Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 2." Journal of Microelectronics and Electronic Packaging 2, no. 2 (April 1, 2005): 98–109. http://dx.doi.org/10.4071/1551-4897-2.2.98.

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In Part 2 of this paper, transient thermal management in portable telecommunication product using phase change material (PCM) was numerically investigated. The thermal time-dependent simulation methodology using non-linear transient finite element analysis (FEA) on a solid conduction cellular phone model cooled by natural convection and radiation was verified experimentally. For the phase change problem itself, a pure conduction PCM model with enthalpy changes was utilized. The effect of convection heat transfer in liquid phase is enhanced thermal conductivity. The numerical methodology used by Hodes et al. [3] and Lamberg et al. [13] was verified with both package and system level experimental results. With the confidence gained from the verification work using this simulation methodology, further parametric study was carried out. In this paper, the effect of PCM volume, aspect ratio of the container and amount of heat dissipated are examined. The advantages gained from its recovery period and introduction of thermal conductivity enhancement are also discussed.

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18

Thenmozhi, R., C. Sharmeela, P. Natarajan, and R. Velraj. "Transient thermal management comparison of a microprocessor using PCMs in various configurations." Journal of Thermal Science 20, no. 6 (November 6, 2011): 516–20. http://dx.doi.org/10.1007/s11630-011-0504-3.

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19

Yee, Cheang Soon, K. N. Seetharamu, G. A. Quadir, and Z. A. Zainal. "Investigation of Steady State and Transient Thermal Management in Portable Telecommunication Product – Part 1." Journal of Microelectronics and Electronic Packaging 2, no. 1 (January 1, 2005): 40–54. http://dx.doi.org/10.4071/1551-4897-2.1.40.

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Steady state and transient thermal management in a portable telecommunication product was investigated. The steady state analysis portion will be discussed in details in Part 1. The investigation was conducted using finite element analysis (FEA) simulation on a cellular phone model. The three-dimensional simulation is based on a solid conduction cellular phone model cooled by natural convection and radiation. The FEA simulation method was verified with experimental results. In this paper, simulation study was carried out to examine various thermal solution options to improve on the heat transfer from the package to the surrounding. As conduction is the predominant heat transfer within the cellular phone, the thermal resistance can be reduced by creating a solid conduction path between the heat dissipating packages with the housing wall and improving the housing wall conduction material.

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20

Guo, Huaixin, Tangsheng Chen, and Shang Shi. "Transient Simulation for the Thermal Design Optimization of Pulse Operated AlGaN/GaN HEMTs." Micromachines 11, no. 1 (January 9, 2020): 76. http://dx.doi.org/10.3390/mi11010076.

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The thermal management and channel temperature evaluation of GaN power amplifiers are indispensable issues in engineering field. The transient thermal characteristics of pulse operated AlGaN/GaN high electron mobility transistors (HEMT) used in high power amplifiers are systematically investigated by using three-dimensional simulation with the finite element method. To improve the calculation accuracy, the nonlinear thermal conductivities and near-junction region of GaN chip are considered and treated appropriately in our numerical analysis. The periodic transient pulses temperature and temperature distribution are analyzed to estimate thermal response when GaN amplifiers are operating in pulsed mode with kilowatt-level power, and the relationships between channel temperatures and pulse width, gate structures, and power density of GaN device are analyzed. Results indicate that the maximal channel temperature and thermal impedance of device are considerably influenced by pulse width and power density effects, but the changes of gate fingers and gate width have no effect on channel temperature when the total gate width and active area are kept constant. Finally, the transient thermal response of GaN amplifier is measured using IR thermal photogrammetry, and the correctness and validation of the simulation model is verified. The study of transient simulation is demonstrated necessary for optimal designs of pulse-operated AlGaN/GaN HEMTs.

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21

Wang, Tae Joong, Duk Sang Kim, and Tae Shik Ahn. "Simulation study on improving the selective catalytic reduction efficiency by using the temperature rise in a non-road transient cycle." Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering 231, no. 6 (August 29, 2016): 810–27. http://dx.doi.org/10.1177/0954407016664620.

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In this study, the transient nitrogen oxide reduction performance of a urea selective catalytic reduction system installed on a non-road diesel engine was tested on an engine dynamometer bench over a scheduled non-road transient cycle mode. Based on the measurement results, the characteristics of the transient selective catalytic reduction behaviours of nitrogen oxide reduction were evaluated. Also, in this study, the effects of several thermal management strategies for improving the selective catalytic reduction efficiency was investigated by transient selective catalytic reduction simulations. The kinetic parameters of the current simulation code for selective catalytic reduction were calibrated and validated by comparison with the measurement data. As a result of this study, it was found that a thermal management strategy utilizing a partial temperature rise in the transient time domain can be an efficient approach for improving the transient selective catalytic reduction efficiency, in comparison with the temperature rise over the entire cycle period. Furthermore, this study can provide some guideline data for the magnitude and the duration of the temperature rise required to obtain the target selective catalytic reduction efficiency over the non-road transient cycle mode. In the last part of this study, the impact of the variation in the space velocity on the transient selective catalytic reduction efficiency was assessed using transient selective catalytic reduction simulations.

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22

Shi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.

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Abstract As thermal protection substrates for wearable electronics, functional soft composites made of polymer materials embedded with phase change materials and metal layers demonstrate unique capabilities for the thermal protection of human skin. Here, we develop an analytical transient phase change heat transfer model to investigate the thermal performance of a wearable electronic device with a thermal protection substrate. The model is validated by experiments and the finite element analysis (FEA). The effects of the substrate structure size and heat source power input on the temperature management efficiency are investigated systematically and comprehensively. The results show that the objective of thermal management for wearable electronics is achieved by the following thermal protection mechanism. The metal thin film helps to dissipate heat along the in-plane direction by reconfiguring the direction of heat flow, while the phase change material assimilates excessive heat. These results will not only promote the fundamental understanding of the thermal properties of wearable electronics incorporating thermal protection substrates, but also facilitate the rational design of thermal protection substrates for wearable electronics.

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23

Krishnan, Shankar, and Suresh V. Garimella. "Thermal Management of Transient Power Spikes in Electronics—Phase Change Energy Storage or Copper Heat Sinks?" Journal of Electronic Packaging 126, no. 3 (September 1, 2004): 308–16. http://dx.doi.org/10.1115/1.1772411.

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A transient thermal analysis is performed to investigate thermal control of power semiconductors using phase change materials, and to compare the performance of this approach to that of copper heat sinks. Both the melting of the phase change material under a transient power spike input, as well as the resolidification process, are considered. Phase change materials of different kinds (paraffin waxes and metallic alloys) are considered, with and without the use of thermal conductivity enhancers. Simple expressions for the melt depth, melting time and temperature distribution are presented in terms of the dimensions of the heat sink and the thermophysical properties of the phase change material, to aid in the design of passive thermal control systems. The simplified analytical expressions are verified against numerical simulations, and are shown to be excellent tools for design calculations. The suppression of junction temperatures achieved by the use of phase change materials when compared to the performance with copper heat sinks is illustrated. Merits of employing phase change materials for pulsed power electronics cooling applications are discussed.

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24

Volle, Fabien, Suresh V. Garimella, and Mark A. Juds. "Thermal Management of a Soft Starter: Transient Thermal Impedance Model and Performance Enhancements Using Phase Change Materials." IEEE Transactions on Power Electronics 25, no. 6 (June 2010): 1395–405. http://dx.doi.org/10.1109/tpel.2010.2040632.

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25

Zhu, Yue, Yidong Fang, Lin Su, and Fei Ye. "Experimental investigation of start‐up and transient thermal performance of pumped two‐phase battery thermal management system." International Journal of Energy Research 44, no. 14 (August 19, 2020): 11372–84. http://dx.doi.org/10.1002/er.5757.

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26

Liu, Xianfei, Zirui Zhang, Fang Wang, Hui Zhang, Zhiqiang Li, Caixia Zhu, Doudou Zhao, Yuhang Liu, and Hao Jiang. "Transient thermal analysis of the thermal management of high-power fast charging module using phase change material." Energy Reports 9 (December 2023): 1333–41. http://dx.doi.org/10.1016/j.egyr.2022.12.055.

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27

Hadia, Fofana Gaoussou, and You Tong Zhang. "Thermal Management Simulation of Lithium Ion Batteries for EV/HEV." Applied Mechanics and Materials 457-458 (October 2013): 350–53. http://dx.doi.org/10.4028/www.scientific.net/amm.457-458.350.

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In this paper, we propose a three-dimensional analytical model based on Greens Function to investigate the Impact of temperature rising on simple lithium-ion batteries and control the heat generation during charge/discharge of battery operation. The modeling is based on heat-transform mechanism analysis method that gives a closed-form solution for the fundamental problem of heat conduction in battery cores with orthotropic thermal conductivities. The method uses a simple lithium-ion battery examined, considered the ambient temperature and initial temperature as 25°C, subjected to transient heat generation in various convective cooling boundary conditions at its surfaces.

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28

Avila, R., J. Cervantes, and C. Estrada-Gasca. "Transient thermal response in nuclear waste repositories." Nuclear Engineering and Design 198, no. 3 (June 2000): 307–16. http://dx.doi.org/10.1016/s0029-5493(99)00311-8.

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29

Castellazzi, A., and M. Ciappa. "Novel simulation approach for transient analysis and reliable thermal management of power devices." Microelectronics Reliability 48, no. 8-9 (August 2008): 1500–1504. http://dx.doi.org/10.1016/j.microrel.2008.07.041.

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30

Narayanan, Shankar. "A dynamically controllable evaporative cooling system for thermal management of transient heat loads." International Journal of Heat and Mass Transfer 148 (February 2020): 119098. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2019.119098.

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31

Ben Salah, Sana, and Mohamed Bechir Ben Hamida. "Alternate PCM with air cavities in LED heat sink for transient thermal management." International Journal of Numerical Methods for Heat & Fluid Flow 29, no. 11 (November 4, 2019): 4377–93. http://dx.doi.org/10.1108/hff-02-2019-0099.

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Purpose The purpose of this paper is to optimize the configuration of a heat sink with phase change material for improving the cooling performance of light emitting diodes (LED). Design/methodology/approach A numerical three-dimensional time-dependent model is developed with COMSOL Multiphysics to simulate the phase change material melting process during both the charging and discharging period. Findings The model is validated with previously published works. It found a good agreement. The difference between filled cavities with phase change materials (PCM) and alternate cavities air-PCM is discussed. The last-mentioned showed a good ability for reducing the junction temperature during the melting time. Three cases of this configuration having the same total volume of PCM but a different number of cavities are compared. The case of ten fins with five PCM cavities is preferred because it permit a reduction of 21 per cent of the junction temperature with an enhancement ratio of 2:4. The performance of this case under different power input is verified. Originality/value The use of alternate air-PCM cavities of the heat sink. The use of PCM in LED to delay the peak temperature in the case of thermal shock (for example, damage of fan) An amount of energy is stored in the LED and it is evacuated to the ambient of the accommodation by the cycle of charging and discharging established (1,765 Joule stored and released each 13 min with 1 LED chip of 5 W).

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32

Vesligaj, M. J., and C. H. Amon. "Transient thermal management of temperature fluctuations during time varying workloads on portable electronics." IEEE Transactions on Components and Packaging Technologies 22, no. 4 (1999): 541–50. http://dx.doi.org/10.1109/6144.814970.

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33

Shi, Zhaochun, Guohua Wang, Chunli Liu, Qiang Lv, Baoli Gong, Yingchao Zhang, and Yuying Yan. "Optimizing the Transient Performance of Thermoelectric Generator with PCM by Taguchi Method." Energies 16, no. 2 (January 10, 2023): 805. http://dx.doi.org/10.3390/en16020805.

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Phase change material (PCM) is an effective thermal management method to improve the thermoelectric conversion performance of a system. PCM can not only absorb excessive thermal energy at high temperature to protect the thermoelectric module (TEM) and increase the maximum available temperature range, but also compensate for intermittent energy to extend the working time of the TEM. In the paper, the transient performance is improved by adding PCM to a traditional thermoelectric generator (TEG) system. Due to the low thermal conductivity of PCM, metal fins are used to improve the thermal conductivity of PCM. To achieve maximum efficiency of the TEG system, the Taguchi method is employed. Four factors are heat source thermal power, PCM type, height of the PCM box, and filling ratio of the PCM, respectively. The results show that heat source thermal power has the greatest effect, and PCM has the least effect on the conversion efficiency of the TEG system. Conversion efficiency from thermal to electricity is about 1.472% during 2300 s of the heating and cooling stages.

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34

Askar, Serena, Shahram Fotowat, Mahdi Momeni, and Amir Fartaj. "Transient experimental study of a latent heat thermal energy storage in a heat exchanger for effective thermal management." Journal of Energy Storage 55 (November 2022): 105680. http://dx.doi.org/10.1016/j.est.2022.105680.

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35

Zhao, H., J. A. Souza, and J. C. Ordonez. "THERMAL MODEL FOR ELECTROMAGNETIC LAUNCHERS." Revista de Engenharia Térmica 7, no. 2 (December 31, 2008): 60. http://dx.doi.org/10.5380/reterm.v7i2.61779.

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This paper presents a 3D model for the determination of the temperature field in an electromagnetic launcher. The large amounts of energy that are dissipated into the structure of an electromagnetic launcher during short periods of time lead to a complicated thermal management situation. Effective thermal management strategies are necessary in order to maintain temperatures under acceptable limits. This paper constitutes an attempt to determine the temperature response of the launcher. A complete three-dimensional model has been developed. It combines rigid body movement, electromagnetic effects and heat diffusion together. The launcher consists of two parallel rectangular rails and an armature moving between them. Preliminary results show the current distribution on the rail cross-section, the localized resistive heating, and the rail transient temperature response. The simulation results are compared to prior work presented for a 2D geometry by Powell and Zielinski (2008).

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36

Baddour, R. E. "Computer simulation of ice control with thermal-bubble plumes — line source configuration." Canadian Journal of Civil Engineering 17, no. 4 (August 1, 1990): 509–13. http://dx.doi.org/10.1139/l90-058.

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Thermal-bubble plumes in a freshwater environment are studied to determine their ice control capabilities. A computer model is developed to optimize the operation of thermal-bubble installations when designed to control ice. Steady-state and transient simulations of ice control are presented. It is conceivable to fully computerize the operation of thermal-bubble installations by combining data acquisition, data analysis, computer simulation, and control automation. Key words: ice control, ice management, thermal-bubble plume, computer simulation.

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37

Majumdar, Rudrodip, Sandip K. Saha, and Suneet Singh. "Evaluation of transient characteristics of medium temperature solar thermal systems utilizing thermal stratification." Applied Energy 224 (August 2018): 69–85. http://dx.doi.org/10.1016/j.apenergy.2018.04.083.

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38

Németh, Márton, and András Poppe. "Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment." Periodica Polytechnica Electrical Engineering and Computer Science 62, no. 1 (February 15, 2018): 1–15. http://dx.doi.org/10.3311/ppee.11058.

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In this paper we present a new, direct computational method for calculating thermal transfer impedances between two separate locations of a given physical structure, aimed at the implementation into a field-solver based on the SUNRED (SUccessive Node REDuction) algorithm. We tested the method symbolically with a simple 2D example with multiple combinations of Dirichlet and Neumann type boundary conditions. Also, for time domain transient analysis different types of thermal loads such as prescribed unit-step change in dissipation or temperature were assumed. A model of a typical MCPCB assembled LED was also created. With that model we studied the inverse problem of predicting the thermal conditions at the junction (the "driving point") from the transient signal measured at the thermal test point on the MCPCB (the "monitoring point") which is a typical task in simple LED thermal management designs. Results obtained by the proposed new calculation method and results obtained by conventional numerical simulations differ less than the uncertainty of the traditional solution method itself. The drawback of the accuracy is the high computational cost. This increased computational need can be mitigated by introducing the combination of the balanced model reduction and the SUNRED algorithms

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39

Shamberger, Patrick J., and Nickolaus M. Bruno. "Review of metallic phase change materials for high heat flux transient thermal management applications." Applied Energy 258 (January 2020): 113955. http://dx.doi.org/10.1016/j.apenergy.2019.113955.

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Lipeng Cao, J. P. Krusius, M. A. Korhonen, and T. S. Fisher. "Transient thermal management of portable electronics using heat storage and dynamic power dissipation control." IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A 21, no. 1 (March 1998): 113–23. http://dx.doi.org/10.1109/95.679040.

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Huang, Yuqi, Shun Wang, Yiji Lu, Rui Huang, and Xiaoli Yu. "Study on a liquid cooled battery thermal management system pertaining to the transient regime." Applied Thermal Engineering 180 (November 2020): 115793. http://dx.doi.org/10.1016/j.applthermaleng.2020.115793.

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Fulpagare, Yogesh, Yogendra Joshi, and Atul Bhargav. "Rack level transient CFD modeling of data center." International Journal of Numerical Methods for Heat & Fluid Flow 28, no. 2 (February 5, 2018): 381–94. http://dx.doi.org/10.1108/hff-10-2016-0426.

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Purpose The paper aims to capture the rack-level thermal dynamics in data center. It proposes the rack-level response experiments as well as transient Computational Fluid Dynamics (CFD) analysis to characterize the local thermal environment of the system. Design/methodology/approach A single sever simulator rack and its two neighboring racks with its cold and hot aisle containment have been modeled with known cold air supply temperature and flow rate for transient CFD analysis. The heat load was kept constant initially and varied case-to-case basis, which includes capturing the rack-level response with respect to changes in input. However, the response experiments on simulator rack were performed for 14 h by variation of server heat loads as step and ramp input. Findings The paper provides the detailed transient CFD analysis of data center racks. The local cold air flow rates and temperature at the vicinity of the racks showed significant effect due to changes in input. It was concluded that the rack-level dynamics impacts the thermal environment of data center and hence cannot be ignored. Research limitations/implications The high computing devices and faster internet demands have led to major thermal management concerns for data center operators. To tackle this issue, capturing the system thermal dynamics is imperative. However, the system-level CFD analysis is computationally expensive. Therefore, this paper deals with the rack-level transient CFD study using commercial tool STAR CCM+. Practical implications This paper includes the modeling of the servers as a porous media as well as the multigrid method to enhance the computational speed. The successful implementation of this approach validated through experiments. This would help to establish a base for research in any type of data center. Originality/value This paper provides the porous media approach to model servers and multigrid method to enhance the computational speed. At the same time, the thought of characterizing the local dynamics at the vicinity of data center racks is unique.

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43

Iqbal, Saqib, Jianwei Tang, Gulfam Raza, Izzat Iqbal Cheema, Mohsin Ali Kazmi, Zirui Li, Baoming Wang, and Yong Liu. "Experimental and Numerical Analyses of Thermal Storage Tile-Bricks for Efficient Thermal Management of Buildings." Buildings 11, no. 8 (August 17, 2021): 357. http://dx.doi.org/10.3390/buildings11080357.

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Due to the tremendous increase in the population and emerging energy crisis, the surging demand for the thermal management of buildings has become essential. Thermal management of buildings is of high importance for maintaining optimum thermal comfort and controlling the drastic environmental impacts. To avoid high energy consumption strategies and continuous operation such as active air heaters and air conditioners, passive strategies driven by phase change material-based thermal storage are expected to leverage the energy challenges. This work attempts to present the form-stabilized thermal storage tile-bricks (TSTBs) that are fabricated by a combination of octadecane, phosphogypsum, kaolin clay and cement. The optimal percent contents of each entity were found with respect to the design criterion of form-stability and effective temperature control capacity. Two TSTBs with a thickness of 10 mm and 15 mm were constructed, which are then applied on ordinary clay bricks to build a prototype wall. The optimal TSTBs are experimentally and numerically evaluated by subjecting them to transient thermal performance analysis, providing longer temperature retardation (~3000 s) compared with ordinary clay bricks (~400 s). It is thus implied that TSTBs can provide a viable solution against energy mismanagement by inhibiting the heating in summer and reserving the cold in winter.

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Raypah, Muna E., Dheepan M.K., Mutharasu Devarajan, Shanmugan Subramani, and Fauziah Sulaiman. "Variation of thermal resistance with input current and ambient temperature in low-power SMD LED." Microelectronics International 35, no. 1 (January 2, 2018): 1–11. http://dx.doi.org/10.1108/mi-08-2016-0055.

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Purpose Thermal behavior of light-emitting diode (LED) device under different operating conditions must be known to enhance its reliability and efficiency in various applications. The purpose of this study is to report the influence of input current and ambient temperature on thermal resistance of InGaAlP low-power surface-mount device (SMD) LED. Design/methodology/approach Thermal parameters of the LED were measured using thermal transient measurement via Thermal Transient Tester (T3Ster). The experimental results were validated using computational fluid dynamics (CFD) software. Findings As input current increases from 50 to 90 mA at 25°C, the relative increase in LED package (ΔRthJS) and total thermal resistance (ΔRthJA) is about 10 and 4 per cent, respectively. In addition, at 50 mA and ambient temperature from 25 to 65°C, the ΔRthJS and ΔRthJA are roughly 28 and 22 per cent, respectively. A good agreement between simulation and experiment results of junction temperature. Originality/value Most of previous studies have focused on thermal management of high-power LEDs. There were no studies on thermal analysis of low-power SMD LED so far. This work will help in predicting the thermal performance of low-power LEDs in solid-state lighting applications.

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Cao, Shubo, Shiyu Zhou, Jiying Liu, Xiaoping Liu, and Yucheng Zhou. "Wood classification study based on thermal physical parameters with intelligent method of artificial neural networks." BioResources 17, no. 1 (January 5, 2022): 1187–204. http://dx.doi.org/10.15376/biores.17.1.1187-1204.

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In this study, 65 kinds of wood samples were classified by using artificial neural networks based on the measured value of wood thermal physical parameters. First, the thermal conductivities and the thermal diffusion coefficients of the wood samples were measured. The transient temperature rise curve of wood samples during the test process was recorded, and the characteristic values of the transient temperature rise curve were extracted by logarithmic curve fitting. The emissivity spectrum representing the thermal physical properties of wood surface was measured, and the characteristic spectral data were selected according to the principal component analysis. An artificial neural network model was established based on the extracted feature values and characteristic spectral data to classify the wood species. The experimental results showed that the comprehensive correct classification rate of the proposed wood classification method was 99.85%. In addition, the proposed wood classification method was compared with a wood classification method based on laser induced breakdown spectrum and near infrared spectrum, which indicates the feasibility of wood classification based on the values of wood thermal physical properties.

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Maity, Srijeeta, Anirban Ghose, Soumyajit Dey, and Swarnendu Biswas. "Thermal-aware Adaptive Platform Management for Heterogeneous Embedded Systems." ACM Transactions on Embedded Computing Systems 20, no. 5s (October 31, 2021): 1–28. http://dx.doi.org/10.1145/3477028.

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Recent trends in real-time applications have raised the demand for high-throughput embedded platforms with integrated CPU-GPU based Systems-On-Chip (SoCs). The enhanced performance of such SoCs, however, comes at the cost of increased power consumption, resulting in significant heat dissipation and high on-chip temperatures. The prolonged occurrences of high on-chip temperature can cause accelerated in-circuit ageing, which severely degrades the long-term performance and reliability of the chip. Violation of thermal constraints leads to on-board dynamic thermal management kicking-in, which may result in timing unpredictability for real-time tasks due to transient performance degradation. Recent work in adaptive software design have explored this issue from a control theoretic stand-point, striving for smooth thermal envelopes by tuning the core frequency. Existing techniques do not handle thermal violations for periodic real-time task sets in the presence of dynamic events like change of task periodicity, more so in the context of heterogeneous SoCs with integrated CPU-GPUs. This work presents an OpenCL runtime extension for thermal-aware scheduling of periodic, real-time tasks on heterogeneous multi-core platforms. Our framework mitigates dynamic thermal violations by adaptively tuning task mapping parameters, with the eventual control objective of satisfying both platform-level thermal constraints and task-level deadline constraints. We consider multiple platform-level control actions like task migration, frequency tuning and idle slot insertion as the task mapping parameters. To the best of our knowledge, this is the first work that considers such a variety of task mapping control actions in the context of heterogeneous embedded platforms. We evaluate the proposed framework on an Odroid-XU4 board using OpenCL benchmarks and demonstrate its effectiveness in reducing thermal violations.

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Ortega Guerrero, Marcos Adrián. "Numerical Analysis of the Groundwater Flow System and Heat Transport for Sustainable Water Management in a Regional Semi-Arid Basin in Central Mexico." Water 14, no. 9 (April 24, 2022): 1377. http://dx.doi.org/10.3390/w14091377.

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The Independence Basin is located in a semi-arid region of Mexico, delimited predominantly by volcanic mountains. Around 30 m3/s of water are extracted from regional aquifers mainly for agro-export activities, causing declines in the water table of up to 10 m/a, increased temperature and dissolved elements that are harmful to health and the environment. Regional groundwater coupled flow and heat transport under current conditions were studied on a basin-wide scale (7000 km2) using a three-dimensional finite-element model under steady-state conditions to provide support for water management decisions and transient modeling. Isothermal, forced and free thermal convection under existing hydrological conditions prior to pumping are analyzed. The results show that the interaction of topography-driven groundwater flow and buoyancy-driven free thermal convection are consistent with historical hydrological records, the characteristics of the water table, and thermal anomalies observed in the basin. The simulated groundwater recharge is near 7 ± 0.25 m3/s, a balance broken since the 1980s by extensive pumping. The results show the importance of considering the groundwater temperature, its transient response in the evolution of groundwater extraction, and the upward migration of a thermal front through the fractured aquifer that has increased risks for health and sustainability.

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48

Ortega Guerrero, Marcos Adrián. "Numerical Analysis of the Groundwater Flow System and Heat Transport for Sustainable Water Management in a Regional Semi-Arid Basin in Central Mexico." Water 14, no. 9 (April 24, 2022): 1377. http://dx.doi.org/10.3390/w14091377.

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The Independence Basin is located in a semi-arid region of Mexico, delimited predominantly by volcanic mountains. Around 30 m3/s of water are extracted from regional aquifers mainly for agro-export activities, causing declines in the water table of up to 10 m/a, increased temperature and dissolved elements that are harmful to health and the environment. Regional groundwater coupled flow and heat transport under current conditions were studied on a basin-wide scale (7000 km2) using a three-dimensional finite-element model under steady-state conditions to provide support for water management decisions and transient modeling. Isothermal, forced and free thermal convection under existing hydrological conditions prior to pumping are analyzed. The results show that the interaction of topography-driven groundwater flow and buoyancy-driven free thermal convection are consistent with historical hydrological records, the characteristics of the water table, and thermal anomalies observed in the basin. The simulated groundwater recharge is near 7 ± 0.25 m3/s, a balance broken since the 1980s by extensive pumping. The results show the importance of considering the groundwater temperature, its transient response in the evolution of groundwater extraction, and the upward migration of a thermal front through the fractured aquifer that has increased risks for health and sustainability.

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49

Krishnan, S., S. V. Garimella, and S. S. Kang. "A novel hybrid heat sink using phase change materials for transient thermal management of electronics." IEEE Transactions on Components and Packaging Technologies 28, no. 2 (June 2005): 281–89. http://dx.doi.org/10.1109/tcapt.2005.848534.

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Rahmani, Mohamed Ali, Rebei Bel Fdhila, Asa Gronqvist, Magnus Tysell, Torbjorn L. Persson, Miroslaw Benendo, and Zacharias Uvgard. "Thermal Management and Design Optimization of Heatsink for Cooling Performance Improvement During Transient Heat Generation." Energy Procedia 61 (2014): 1665–68. http://dx.doi.org/10.1016/j.egypro.2014.12.187.

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