Relevant bibliographies by topics / Transient thermal management

Academic literature on the topic 'Transient thermal management'

Author: Grafiati
Published: 10 December 2022
Last updated: 29 January 2023

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Journal articles on the topic "Transient thermal management"

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Ghebru, Daniel. "Thermal Simulation of the Complete Vehicle — Evaluation of Transient Thermal Management." ATZ worldwide 116, no. 7-8 (July 2014): 50–55. http://dx.doi.org/10.1007/s38311-014-0207-y.

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Shen, Weijan, and Fock-Lai Tan. "Thermal management of mobile devices." Thermal Science 14, no. 1 (2010): 115–24. http://dx.doi.org/10.2298/tsci1001115s.

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This paper presents the experimental study of using phase change material in the cooling of the mobile devices. It investigates the thermal performance of transient charging and discharging of mobile devices in three different situations; making phone calls frequently, making long duration calls, and making occasional calls. The results show that mobile devices are heated up fastest during the long duration usage. Experiments are also conducted to determine the effect of fins and effect of orientation of the mobile device on its thermal performance.
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Zhang, TieJun. "TRANSIENT CHARACTERISTICS AND CONTROL OF ACTIVE THERMAL MANAGEMENT SYSTEMS." Annual Review of Heat Transfer 18 (2015): 245–328. http://dx.doi.org/10.1615/annualrevheattransfer.2015012305.

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Zao Liu, Sheldon X.-D. Tan, Xin Huang, and Hai Wang. "Task Migrations for Distributed Thermal Management Considering Transient Effects." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 23, no. 2 (February 2015): 397–401. http://dx.doi.org/10.1109/tvlsi.2014.2309331.

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Cagnon, Hugo, Thierry Vidal, Alain Sellier, and Jean Michel Torrenti. "Transient Thermal Creep at Moderate Temperature." Key Engineering Materials 711 (September 2016): 885–91. http://dx.doi.org/10.4028/www.scientific.net/kem.711.885.

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The Cigéo project initiated by Andra (the French national agency for nuclear wastes management) concerns a deep geological disposal situated in an impermeable layer of clay approximately 500 m under ground. The High Performance Concrete (HPC) galleries will allow Intermediate Level Long-Life Nuclear Wastes to be stored. These exothermic radioactive wastes will induce a temperature rise which may reach 70°C. The very few studies that have investigated the effect of temperatures below 100°C on concrete behaviour have shown that temperature amplifies long-term deformations more than instantaneous ones. The present paper deals with the dimensional variations of HPC when subjected to temperature changes in sealed conditions. The aim is to provide accurate data to understand the causes of transient thermal creep. These experimental data may allow Thermo-Hydro-Mechanical models to be improved and thus provide accurate prediction of concrete long term behavior in such in situ conditions.
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Ding, Li, Lamei Che, Yumin Zhang, Hailin Cao, Xiaohong Hao, and Weihua Xie. "The transient temperature field simulation of the micro-grid inverter." Thermal Science 22, Suppl. 2 (2018): 391–99. http://dx.doi.org/10.2298/tsci170930251d.

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For the power electronics devices with the insulated gate bipolar transistors, the thermal management is very important and necessary for the devices reliability. In this paper, power losses of the inverter were evaluated based on its electro-thermal model and control logic. Accordingly, its thermal management system using forced air cooling is designed and simulated. The transient temperature filed simulation results showed that the thermal management system is feasible and can guarantee the working temperature of the inverter. Experimental results were also obtained to verify the simulation results in this paper.
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Chang, Norman. "(Invited, Digital Presentation) ML-Based Fast on-Chip Transient Thermal Simulation for Heterogeneous 2.5D/3D IC Designs." ECS Meeting Abstracts MA2022-02, no. 17 (October 9, 2022): 847. http://dx.doi.org/10.1149/ma2022-0217847mtgabs.

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Large 3DIC designs with multiple chips require several iterations of transient thermal analysis particularly for fine-grain on-chip dynamic thermal management. This requires a fast thermal analysis technology as opposed to traditional CFD/FEA based methods which have severe runtime/capacity limitations for large chips (e.g., 2cmx2cm) in 3DIC while generating fine grained (e.g., 10umx10um) transient thermal response. The fast transient thermal analysis is based on the idea of combining the global, intermediate, and local transient response curves generated from an ML-predictor. The local, intermediate, and global transient response curves are scaled based on the far-field and near-field transient decay surface components respectively, computed using the trained ML decay surface predictor, followed by linear superposition of the curves for each power value in the transient power profile to generate the effective transient response curve. The runtime for generating thermal results for a large chip is in the order of minutes, compared to several hours/days while using CFD/FEA based tools with good accuracy correlation. The fast transient thermal solver is implemented on distributed ML computing platform for parallel computation of transient thermal inference model.
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Li, S., J. Y. Wu, R. Z. Wang, and Y. Huangfu. "Investigation of transient behavior of a novel thermal management controller." Applied Thermal Engineering 28, no. 8-9 (June 2008): 824–34. http://dx.doi.org/10.1016/j.applthermaleng.2007.07.014.

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Azzam, H. "Mathematical networks for thermal transient and non-transient progressive fatigue of engine components." Proceedings of the Institution of Mechanical Engineers, Part G: Journal of Aerospace Engineering 212, no. 2 (February 1, 1998): 125–36. http://dx.doi.org/10.1243/0954410981532199.

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Engine components can experience varying centrifugal loads, gas loads, oxidation, micro- structure transformation at high temperatures and stresses induced by temperature gradients. The life consumption of hot engine components depends not only on these factors but also on the time spent at constant-amplitude loads. The damage mechanism of engine components is therefore complex and requires formidable models. These models are not suitable for fatigue management or on-board systems because of their high computational costs. There is a need for efficient simulations that can accurately portray this complex damage mechanism and, at the same time, can be embedded in fatigue management and on-board systems. Mathematical networks were developed to fulfil this need and successfully synthesized the fatigue damage of aircraft structural components from flight parameters. In this paper, the feasibility of training the mathematical networks to synthesize fatigue of engine components is demonstrated. The mathematical attributes of the networks were based on information supplied by Rolls-Royce. The networks’ training mechanism was targeted at the minimization of errors in synthesized accumulative damage values. The mathematical networks synthesized the accumulative fatigue damage of three engine components successfully. One component was subject to non-thermal transient stresses and two components were subject to thermal transient stresses.
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Hodes, Marc, Randy D. Weinstein, Stephen J. Pence, Jason M. Piccini, Lou Manzione, and Calvin Chen. "Transient Thermal Management of a Handset Using Phase Change Material (PCM)." Journal of Electronic Packaging 124, no. 4 (December 1, 2002): 419–26. http://dx.doi.org/10.1115/1.1523061.

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The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.
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Dissertations / Theses on the topic "Transient thermal management"

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Green, Craig Elkton. "Composite thermal capacitors for transient thermal management of multicore microprocessors." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44772.

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While 3D stacked multi-processor technology offers the potential for significant computing advantages, these architectures also face the significant challenge of small, localized hotspots with very large heat fluxes due to the placement of asymmetric cores, heterogeneous devices and performance driven layouts. In this thesis, a new thermal management solution is introduced that seeks to maximize the performance of microprocessors with dynamically managed power profiles. To mitigate the non-uniformities in chip temperature profiles resulting from the dynamic power maps, solid-liquid phase change materials (PCMs) with an embedded heat spreader network are strategically positioned near localized hotspots, resulting in a large increase in the local thermal capacitance in these problematic areas. Theoretical analysis shows that the increase in local thermal capacitance results in an almost twenty-fold increase in the time that a thermally constrained core can operate before a power gating or core migration event is required. Coupled to the PCMs are solid state coolers (SSCs) that serve as a means for fast regeneration of the PCMs during the cool down periods associated with throttling events. Using this combined PCM/SSC approach allows for devices that operate with the desirable combination of low throttling frequency and large overall core duty cycles, thus maximizing computational throughput. The impact of the thermophysical properties of the PCM on the device operating characteristics has been investigated from first principles in order to better inform the PCM selection or design process. Complementary to the theoretical characterization of the proposed thermal solution, a prototype device called a "Composite Thermal Capacitor (CTC)" that monolithically integrates micro heaters, PCMs and a spreader matrix into a Si test chip was fabricated and tested to validate the efficacy of the concept. A prototype CTC was shown to increase allowable device operating times by over 7X and address heat fluxes of up to ~395 W/cm2. Various methods for regenerating the CTC have been investigated, including air, liquid, and solid state cooling, and operational duty cycles of over 60% have been demonstrated.
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Donovan, Adam. "Vehicle Level Transient Aircraft Thermal Management Modeling and Simulation." Wright State University / OhioLINK, 2016. http://rave.ohiolink.edu/etdc/view?acc_num=wright1472236965.

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Svantesson, Einar. "Transient thermal management simulations of complete heavy-duty vehicles." Thesis, KTH, Mekanik, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-266464.

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Transient vehicle thermal management simulations have the potential to be an important tool to ensure long component lifetimes in heavy-duty vehicles, as well as save development costs by reducing development time. Time-resolved computational fluid dynamics simulations of complete vehicles are however typically very computationally expensive, and approximation methods must be employed to keep computational costs and turn-around times at a reasonable level. In this thesis, two transient methods are used to simulate two important time-dependent scenarios for complete vehicles; hot shutdowns and long dynamic drive cycles. An approach using a time scaling between fluid solver and thermal solver is evaluated for a short drive cycle and heat soak. A quasi-transient method, utilizing limited steady-state computational fluid dynamics data repeatedly, is used for a long drive cycle. The simulation results are validated and compared with measurements from a climatic wind tunnel. The results indicate that the time-scaling approach is appropriate when boundary conditions are not changing rapidly. Heat-soak simulations show reasonable agreement between three cases with different thermal scale factors. The quasi-transient simulations suggest that complete vehicle simulations for durations of more than one hour are feasible. The quasi-transient results partly agree with measurements, although more component temperature measurements are required to fully validate the method.
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Mustaffar, Ahmad Fadhlan Bin. "Irregular aluminium foam and phase change material composite in transient thermal management." Thesis, University of Newcastle upon Tyne, 2016. http://hdl.handle.net/10443/3338.

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Traction systems generate high loads of waste heat, which need to be removed for efficient operations. A new transient heat sink is proposed, which is based on salt hydrate phase change material (PCM). The heat sink would absorb heat during the short stationary phase i.e. at stations in which the PCM melts, a process accelerated by aluminium foam as it increases the rate of heat transfer within the PCM. When the train moves, the PCM is solidified via a forced convection stack. This creates a passive and efficient thermal solution, especially once heat pipe is employed as heat conduit. At the outset, the characteristics of the foam needed to be accurately determined. The foam was uncommon as its pore morphology was irregular, therefore it was scanned in a medical computed tomography (CT) scanner, which allowed for the construction of a three dimensional (3D) model. The model accuracy was enhanced by software, resulting in an extremely useful analytical tool. The model enabled important structural parameters to be measured e.g. porosity and specific surface area, which were crucial for the subsequent thermal and fluid flow analyses. A defect dense region was also detected, the effect of which was further investigated. Interestingly in the volume devoid of this defect, the porosity and specific surface area were uniform. A test rig was constructed that mimicked liquid cooling (or in the planned application, heat pipe cooling) in power electronics. At the core was a heat sink of salt hydrate PCM, impregnated within the foam. The sink with its current specifications (with liquid cooling) was able to absorb a thermal load consistent from a group of 4-5 IGBTs, which dissipated a low power of 20W per module during stops. The heating period of 1600-3500s per cycle meant the sink could be fitted to intercity locomotives. The foam increased the effective thermal conductivity by a factor of 24, from 0.45 to 10.83 W/m.K. 3D volume averaged numerical simulation was validated by experiment, which could be used to facilitate scale up or redesign for further optimization. As well as a support structure for the storage component of the system, the foam could replace conventional fins in forced convection, adding value to the potential manufacturer of the system. Heat transfer coefficient calculation incorporated the actual surface area that was derived from the 3D model, a first for metal foam studies. Results have shown a good Nu/Re correlation, comparable with other metal foam works.
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Park, Je-Hyoung. "East chip-level static and transient thermal analysis method for thermal management of VLSI ICs in packages /." Diss., Digital Dissertations Database. Restricted to UC campuses, 2009. http://uclibs.org/PID/11984.

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Madrid, Lozano Francesc. "Thermal Conductivity and Specific Heat Measurements for Power Electronics Packaging Materials. Effective Thermal Conductivity Steady State and Transient Thermal Parameter Identification Methods." Doctoral thesis, Universitat Autònoma de Barcelona, 2005. http://hdl.handle.net/10803/5348.

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Butt, Nathaniel J. "Development and Thermal Management of a Dynamically Efficient, Transient High Energy Pulse System Model." Wright State University / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=wright1527602141695356.

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Ahmed, Saad Verfasser], Hermann [Gutachter] [Rottengruber, and Dominique [Gutachter] Thévenin. "Modular methodology for transient vehicle thermal management simulations / Saad Ahmed ; Gutachter: Hermann Rottengruber, Dominique Thévenin." Magdeburg : Universitätsbibliothek Otto-von-Guericke-Universität, 2021. http://d-nb.info/1238779964/34.

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Rao, P. Sharath Chandra. "Analysis of fluid circulation in a spherical cryogenic storage tank and conjugate heat transfer in a circular microtube." [Tampa, Fla.] : University of South Florida, 2004. http://purl.fcla.edu/fcla/etd/SFE0000461.

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Hsu, Tien-Liang, and 許天亮. "Study of static and transient thermal management for green power electronics device." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/gw6937.

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碩士
國立交通大學
機械工程系所
104
AlGaN/GaN power transistors, compared to conventional silicon-based transistors, have characteristics of high electron mobility, high breakdown voltage, suitable for operating at high power and high frequency conductions. Temperature has significant influence on both performance and reliability of semiconductor devices. However, the thermal conductivity of GaN (130W/m-K) is lower than silicon carbide(490W/m-K).The increasing of the active region temperature will reduce crucial device parameters. Thus, the packaging design of the component must have good thermal management. In this research, the Transient Dual Interface Measurement Procedure to calculate steady state thermal resistance through simulation is proposed. We also present the short time thermal transient measurement method and the structure function to analyze packed GaN transistor. Finally, T3ster measurement experiment and the result of simulation are compared to verify the correctness of proposed thermal simulation procedure for power device packaging design.
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Books on the topic "Transient thermal management"

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Nagy, Istvan. VR1 in inflammatory thermal hyperalgesia. Edited by Paul Farquhar-Smith, Pierre Beaulieu, and Sian Jagger. Oxford University Press, 2018. http://dx.doi.org/10.1093/med/9780198834359.003.0028.

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The landmark paper discussed in this chapter, published by Davis et al. in 2000, describes the role of the capsaicin receptor, which is called transient receptor potential cation channel subfamily vanilloid member 1 (TRPV1), in inflammatory thermal hyperalgesia. Capsaicin, the pungent agent found in hot peppers, has been linked to pain for centuries because it induces a burning pain sensation which, after prolonged application of the agent, turns into analgesia. Because of this, capsaicin has been used to relieve pain, most likely since prehistoric times. The elucidation of the role of TRPV1 in nociceptive processing was heralded as the starting point for the development of agents which would revolutionize pain management. Unfortunately, that promise is yet to be realized and apparently we need a more detailed understanding of the role of TRPV1 in physiological and pathological processes in order to fulfil the analgesic potential of drugs acting on this receptor.
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Book chapters on the topic "Transient thermal management"

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Liu, Daguang, John Barrett, and Séan Cian Ó. Mathúna. "Investigation of Die Attach Integrity Using Transient Thermal Analysis Techniques." In Thermal Management of Electronic Systems, 297–306. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_27.

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Klemm, David, Wolfgang Rößner, Nils Widdecke, and Jochen Wiedemann. "Approach for the Transient Thermal Modeling of a Vehicle Cabin." In Energy and Thermal Management, Air-Conditioning, and Waste Heat Utilization, 101–18. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-00819-2_8.

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Pagani, Santiago, Jian-Jia Chen, Muhammad Shafique, and Jörg Henkel. "Transient and Peak Temperature Computation Based on Matrix Exponentials (MatEx)." In Advanced Techniques for Power, Energy, and Thermal Management for Clustered Manycores, 93–109. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-77479-4_6.

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Raad, Peter E., Pavel L. Komarov, and Travis L. Sandy. "The transient thermoreflectance approach for high-resolution temperature mapping of GaN devices." In Thermal Management of Gallium Nitride Electronics, 231–50. Elsevier, 2022. http://dx.doi.org/10.1016/b978-0-12-821084-0.00007-x.

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"Cooling system simulation for an off-road machine under transient conditions." In Vehicle Thermal Management Systems Conference Proceedings (VTMS11), 165–82. Elsevier, 2013. http://dx.doi.org/10.1533/9780857094735.4.165.

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Wang, Z., J. Han, A. Alajbegovic, T. Kuthada, T. Stoll, C. Makens, and T. Schwenn. "Long term transient cabin heating simulation with multiple fluid node approach." In Vehicle Thermal Management Systems Conference Proceedings (VTMS11), 319–33. Elsevier, 2013. http://dx.doi.org/10.1533/9780857094735.7.319.

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Lury, S. "Factors affecting transient cooling system performance for arduous drive cycles." In Vehicle Thermal Management Systems Conference and Exhibition (VTMS10), 537–47. Elsevier, 2011. http://dx.doi.org/10.1533/9780857095053.7.537.

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Gullberg, P., R. Sengupta, and K. Horrigan. "Transient fan modelling and effects of blade deformation in a truck cooling fan installation." In Vehicle Thermal Management Systems Conference Proceedings (VTMS11), 219–27. Elsevier, 2013. http://dx.doi.org/10.1533/9780857094735.5.219.

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Wen, John T., Daniel T. Pollock, and Zehao Yang. "Hierarchical Systems Level Thermal Management for Multiple High Transient Heat Loads." In Encyclopedia of Two-Phase Heat Transfer and Flow III, 39–90. WORLD SCIENTIFIC, 2018. http://dx.doi.org/10.1142/9789813229464_0003.

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Iyengar, Madhusudan, Karl J. L. Geisler, Bahgat Sammakia, and Avram Bar-Cohen. "An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges." In Encyclopedia of Thermal Packaging, 197–209. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814327664_0009.

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Conference papers on the topic "Transient thermal management"

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Nelson, Cameron, Jesse Galloway, and Phillip Fosnot. "Extracting TIM properties with localized transient pulses." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892218.

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Rozenfeld, T., R. Hayat, Y. Kozak, and G. Ziskind. "Enhanced Melting for Transient Thermal Management." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48369.

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The present study deals with transient thermal management using phase change materials (PCMs). These materials can absorb large amounts of heat without significant rise of their temperature during the melting process. This effect is attractive for passive thermal management, particularly where the device is intended to operate in a periodic regime, or where the relatively short stages of high power dissipation are followed by long stand-by periods without a considerable power release. Heat transfer in PCMs, which have low thermal conductivity, can be enhanced by fins that enlarge the heat transfer area. However, when the PCM melts, a layer of liquid is growing at the fins creating an increasing thermal resistance that impedes the process. The present work aims to demonstrate that performance of a latent-heat thermal management unit may be considerably affected by achieving a so-called close-contact melting (CCM), which occurs when the solid phase is approaching a heated surface, and only a thin liquid layer is separating between the two. Although CCM was extensively studied in the past, its possible role in finned systems has been revealed only recently by our group. In particular, it depends heavily on the specific configuration of the fins. In the present work, close-contact melting is modeled analytically for a geometry which includes two symmetrically inclined fins. A quasi-steady approach is used for calculating the rate of melting based on the force and energy balances. The results are expressed in terms of the time-dependent melt fraction and Nusselt number, showing their explicit dependence on the Stefan and Fourier numbers. Moreover, the approach used in the present study may be applied to other geometries in which the heated surface is not horizontal or where there are a number of heated surfaces or fins.
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Parrino, Maurizio, Alberto Mannoni, Elvio Bonisoli, and Massimo Sorli. "Block-oriented Models for Transient HVAC Simulations." In Vehicle Thermal Management Systems Conference & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2005. http://dx.doi.org/10.4271/2005-01-2002.

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Pawar, Rajesh Chhotulal, Preetam Ghodake, and Ravindra Tupake. "Transient Hot Shut Down, CFD Simulation Technique for Underhood Thermal Management." In Thermal Management Systems Conference 2020. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2020. http://dx.doi.org/10.4271/2020-28-0032.

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Van Zwieten, Andrew T., Gokcin Cinar, Elena Garcia, Jonathan C. Gladin, and Dimitri N. Mavris. "Transient Surrogate Modeling for Thermal Management Systems." In AIAA Scitech 2020 Forum. Reston, Virginia: American Institute of Aeronautics and Astronautics, 2020. http://dx.doi.org/10.2514/6.2020-1616.

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Maize, K., J, Christofferson, and A. Shakouri. "Transient Thermal Imaging Using Thermoreflectance." In 2008 Twenty-fourth Annual IEEE Semionductor Thermal Measurement and Management Symposium. IEEE, 2008. http://dx.doi.org/10.1109/stherm.2008.4509366.

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Srinivasan, Karthik, Stephen Pan, Zhigang Feng, Norman Chang, and Tim Pawlak. "An efficient transient thermal simulation methodology for Power Management IC designs." In 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2017. http://dx.doi.org/10.1109/semi-therm.2017.7896909.

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Cipollone, Roberto, and Carlo Villante. "A Fully Transient Model For Advanced Engine Thermal Management." In Vehicle Thermal Management Systems Conference & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2005. http://dx.doi.org/10.4271/2005-01-2059.

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Hu, Xiao, Sivasubramani Krishnaswamy, Saeed Asgari, and Scott Stanton. "An efficient transient thermal model for electronics thermal management based on singular value decomposition." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100173.

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Burzo, Mihai G., and Ming Li. "Investigation of pressure dependence of interface thermal resistance in thermal greases by transient thermoreflectance." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357373.

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