Relevant bibliographies by topics / Titanium nitride

Academic literature on the topic 'Titanium nitride'

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Published: 4 June 2021
Last updated: 6 September 2023

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Journal articles on the topic "Titanium nitride"

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Deniz, G., Şaduman Şen, and Uğur Şen. "Structural Characterization of Titanium Nitride Coatings on AISI M2 Steel." Materials Science Forum 554 (August 2007): 219–24. http://dx.doi.org/10.4028/www.scientific.net/msf.554.219.

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In this work, some surface properties of AISI M2 steel were improved by a thermoreactive deposition process. Gas nitriding was realized on AISI M2 steel at 550°C for 2 h in an ammoniac atmosphere and then, titanizing treatment performed on pre-nitrided steel in the powder mixture consisting of ferro-titanium, ammonium chloride and alumina at 1000°C for 1-4 h. Structural characterization of titanium nitride layer formed on the surface of AISI M2 steel was carried out by using optical microscopy, scanning electron microscopy, electron microprobe and Xray diffraction (XRD) analysis. The hardness measurements of titanium nitride layer were conducted under 10 g loads by using Vickers microhardness indenter. Structural analysis studies showed that titanium nitride layers formed on the AISI M2 steel samples were smooth, compact and homogeneous. XRD analysis show that the coating layer formed on the steel samples includes TiN, Fe6Mo7N2, C0.7N0.3Ti, C0.3N0.7Ti and V2N phases. The hardness of titanium nitride layers formed on the steel samples is between 2040±186 and 2418±291 HV0.01. The thickness of titanium nitride layer formed on the steel samples ranged from 3.86±0.43 9m to 6.13±0.47 9m, depending on treatment time.
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Lisiecki, Aleksander. "Mechanism of Laser Surface Modification of the Ti-6Al-4V Alloy in Nitrogen Atmosphere Using a High Power Diode Laser." Advanced Materials Research 1036 (October 2014): 411–16. http://dx.doi.org/10.4028/www.scientific.net/amr.1036.411.

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The influence of the nitrogen content in argon/nitrogen gas mixture on mechanism of titanium nitrides formation during laser surface processing of titanium alloy Ti6Al4V with high power diode laser was investigated. The phase composition and microhardness on cross-section of surface layers were analyzed and described. It was found that the nucleation of TiN dendrites in nitrogen rich atmosphere (at least 75 % of N2) takes place on the liquid/gas boundary as a result of the reaction between molten titanium and gaseous nitrogen. The subsequent growth of titanium nitride dendrites (crystallization) proceeds into the liquid metal (weld pool), perpendicularly to the top surface. High length of the titanium nitride dendrites up to 180÷250 μm in the surface layer produced in pure nitrogen atmosphere indicates also very rapid rate of dendrites growth in the molten titanium. The tendency to form titanium nitrides during laser surface processing of the investigated titanium alloy falls dawn with the decrease of nitrogen content in the gas mixture.
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Luther, B. P., S. E. Mohney, and T. N. Jackson. "Titanium and titanium nitride contacts to n-type gallium nitride." Semiconductor Science and Technology 13, no. 11 (November 1, 1998): 1322–27. http://dx.doi.org/10.1088/0268-1242/13/11/017.

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Mizukami, Hideo, Tomoyuki Kitaura, and Yoshihisa Shirai. "Dissolution Behavior of a Titanium Nitride Sponge in Titanium Alloy Melt." MATEC Web of Conferences 321 (2020): 10005. http://dx.doi.org/10.1051/matecconf/202032110005.

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The dissolution behaviors of titanium nitride titanium sponges in titanium alloy melt were examined. A titanium nitride sponge was produced using nitrogen gas. The titanium nitride sponge featured a porous structure. Porous structures at both the surface layer and inside were formed at intervals of about 5.0 × 10-5 m. When the titanium nitride sponge was immersed into a titanium alloy melt, the melt permeated into the pores. The dissolution rate of the titanium nitride sponge in the titanium alloy melt depends on the temperature of the melt. Higher melt temperatures corresponded to higher dissolution rates. However, the concentration of nitrogen in the titanium nitride sponge had no influence on the dissolution rate. Dissolution model of the titanium nitride sponge into the titanium alloy melt were proposed. These models considered the structure of the sponge; thus, the behavior of the dissolution sponges was predicted and confirmed.
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Liu, An Min, Yu Fan, Pei Zhi Li, Kun Chen, Ke Pu, and Chong Hao Zhang. "A Comparison of Gas Nitriding and Laser Nitriding on Industrial Pure Iron and Ti-Induced Iron." Materials Science Forum 934 (October 2018): 79–88. http://dx.doi.org/10.4028/www.scientific.net/msf.934.79.

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Overview of Gas nitriding on the surface of industrial pure iron and laser gas nitriding, research under different nitriding process, the phase, organization and mechanical properties of the nitride layer that is the difference. Plasma sprayed titanium on industrial pure iron surface, the laser nitriding experiments were carried out on the titanium surface. The formation of iron and nitrogen compounds is induced by the combination of titanium nitride. The difference between gas nitriding and laser nitriding is analyzed. The results show that: (1) after gas nitriding, the nitrides formed on the surface of pure iron are mainly ε-Fe2-3N and γ′-Fe4N, the surface hardness is 158 HV, and the increase is 32%. (2) in the 500 W laser power, laser nitriding formed on the surface of Titanium metal layer of pure iron, but not the formation of iron and nitrogen compound, the surface hardness of 168 HV, increased by 46%. (3) under the condition of 500 W laser power, the industrial pure iron was nitrided by laser, without the formation of iron and nitrogen compounds, but the surface hardness of the sample was increased by 20%.
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Lelątko, Józef, Marlena Freitag, Jan Rak, Tadeusz Wierzchoń, and Tomasz Goryczka. "Structure of Nitride and Nitride/Oxide Layers Formed on NiTi Alloy." Solid State Phenomena 186 (March 2012): 259–62. http://dx.doi.org/10.4028/www.scientific.net/ssp.186.259.

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The present work summarises the results, which were obtained from studies carried out on the structure of the nitride and nitride-oxide surface layers with use of the electron transmission microscopy. The layers were formed using glow discharge technique at relatively low temperature (300°C). It has been shown that low temperature nitriding or nitriding/oxiding process produced a thin layer ~30 nm thick. They were formed from titanium nitride as well as titanium oxides. The structure revealed that nanoparticles were surrounded by high amount of amorphous phase. Especially, electron microscopy was useful method for studying the phase boundary between the layer and the NiTi matrix. During deposition process, which was carried out at temperature above 300°C, the intermediate layer of Ni3Ti intermetallic phase appeared between titanium oxides and/or nitrides. Lowering deposition temperature down to 300°C or below resulted in absence of such sublayer. Moreover, thickness, structure of layers, absence of sublayer formed during glow discharge process, can significantly influence deformation during inducing of the shape memory or superelasticity effect.
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Perillo, P. M. "Corrosion Behavior of Coatings of Titanium Nitride and Titanium-Titanium Nitride on Steel Substrates." CORROSION 62, no. 2 (February 2006): 182–85. http://dx.doi.org/10.5006/1.3278263.

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Petrova, Larisa, Vladimir Alexandrov, Viktor Vdovin, and Pyotr Demin. "Hardening of a quick-speed steel tool through nitration process with nitrogen controlled potential." Science intensive technologies in mechanical engineering 2022, no. 1 (January 28, 2022): 3–10. http://dx.doi.org/10.30987/2223-4608-2022-1-3-10.

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The study of the gas nitriding method, which allows obtaining high-quality diffuse layers in high-speed steel P6M5 on the basis of an internal nitrogen hardening zone with no brittle nitride zone, has been viewed. Research results of phase composition of nitrided steel with a change in the nitrogen potential of the atmosphere during dilution of ammonia are presented. Nitrided tool increased resistance during drilling constructional steel and titanium alloy, which is due to precipitation hardening treatment of the internal nitrogenization zone using tungsten nitrides, is given.
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Narula, Chaitanya K., Brian G. Demczyk, Paul Czubarow, and Dietmar Seyferth. "Preparation of Silicon Nitride-Titanium Nitride and Titanium-Titanium Nitride Composites from (CH3)3SiNHTiCl3-Coated Si3N4 and Ti Particles." Journal of the American Ceramic Society 78, no. 5 (May 1995): 1247–51. http://dx.doi.org/10.1111/j.1151-2916.1995.tb08477.x.

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Gogotsi, Yu G., and G. Grathwohl. "Creep of silicon nitride-titanium nitride composites." Journal of Materials Science 28, no. 16 (1993): 4279–87. http://dx.doi.org/10.1007/bf01154933.

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Dissertations / Theses on the topic "Titanium nitride"

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Li, Wenyu. "The fabrication of silicon nitride-titanium nitride composite materials." Thesis, University of Leeds, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.305875.

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Taylor, Matthew Bruce, and matthew taylor@rmit edu au. "A Study of Aluminium Nitride and Titanium Vanadium Nitride Thin Films." RMIT University. Applied Science, 2007. http://adt.lib.rmit.edu.au/adt/public/adt-VIT20080529.151820.

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Thin film coatings are used to improve the properties of components and products in such diverse areas as tool coatings, wear resistant biological coatings, miniature integrated electronics, micro-mechanical systems and coatings for optical devices. This thesis focuses on understanding the development of intrinsic stress and microstructure in coatings of the technologically important materials of aluminium nitride (AlN) and titanium vanadium nitride (TiVN) deposited by filtered cathodic arc deposition. Thin films of AlN are fabricated under a variety of substrate bias regimes and at different deposition rates. Constant substrate bias was found to have a significant effect on the stress and microstructure of AlN thin films. At low bias voltages, films form with low stress and no preferred orientation. At a bias voltage of -200 V, the films exhibited the highest compressive stress and contained crystals preferentially oriented with their c axis in the plane of the film. At the highest bias of -350 V, the film forms with low stress yet continue to contain crystallites with their c axis constrained to lie in the plane of the film. These microstructure changes with bias are explained in terms of an energy minimisation model. The application of a pulsed high voltage bias to a substrate was found to have a strong effect on the reduction of intrinsic stress within AlN thin films. A model has been formulated that predicts the stress in terms of the applied voltage and pulsing rate, in terms of treated volumes known as thermal spikes. The greater the bias voltage and the higher the pulse rate, the greater the reduction in intrinsic stress. At high pulsing and bias rates, a strong preference for the c axis to align perpendicular to the substrate is seen. This observation is explained by dynamical effects of the incident ions on the growing film, encouraging channelling and preferential sputtering. For the first time, the effect of the rate of growth on AlN films deposited with high voltage pulsed bias was investigated and found to significantly change the stress and microstructure. The formation of films with highly tensile stress, highly compressive stress and nano-composites of AlN films containing Al clusters were seen. These observations are explained in terms of four distinct growth regions. At low rates, surface diffusion and shadowing causes highly porous structures with tensile stress; increased rates produced Al rich films of low stress; increasing the growth rate further led to a dense AlN film under compressive stress and the highest rates produce dense, low stress, AlN due to increased levels of thermal annealing. Finally this thesis analyses the feasibility of forming ternary alloys of high quality TiVN thin films using a dual cathode filtered cathodic arc. The synthesised films show exceptional hardness (greater than either titanium nitride or vanadium nitride), excellent mixing of the three elements and interesting optical properties. An optimum concentration of 23% V content was found to give the highest stress and hardness.
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Bin, Shafiee Saiful Arifin. "Fabrication and characterisation of solid titanium nitride and molybdenum nitride microelectrodes." Thesis, University of Southampton, 2017. https://eprints.soton.ac.uk/419530/.

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Metal nitrides have gained interest due to their high melting point, mechanical resistance, thermal and electrical conductivity. To the best of our knowledge, titanium nitride (TiN) and molybdenum nitride (MoN) electrodes have always been prepared as thin films. However, thin film electrodes tend to delaminate or crack during preparation or usage which exposes the underlying substrate and increases their surface area. In addition, the vapour deposition techniques employed to prepare thin films can introduce contaminants to the samples. In this work we prepared solid metal nitride samples, characterised them with a range of physical methods and investigated their electrochemical properties. Our work demonstrates the feasibility of obtaining TiN and MoN from Ti and Mo foils and microwires via nitridation in a NH3 atmosphere. The process was confirmed using energy dispersive X-ray spectroscopy and X-ray diffraction (XRD). The XRD spectra also showed that hexagonal MoN and cubic Mo2N were obtained. This work also demonstrates the viability of fabricating solid TiN and MoN microelectrodes, microdisks and microbands, from the nitrided Ti and Mo samples. Hence a major objective of the project was to assess whether TiN and MoN could be used as alternatives to conventional microelectrode materials such as Pt, Au, and C. To the extent of our knowledge, MoN and TiN wires have never been used to construct microelectrodes. The electrochemical behaviour of the solid TiN and MoN microelectrodes is assessed using different redox mediators to cover a range of redox potentials. The cyclic voltammograms recorded with the untreated TiN microband electrodes showed that the redox processes at positive potentials were not electrochemically reversible. Yet, the electrochemical response was improved after etching the TiN surface with hydrofluoric acid vapour. In contrast, MoN microelectrodes exhibited sigmoidal shape cyclic voltammograms with a plateau region for all redox mediators even without surface treatment. The TiN and MoN microelectrodes exhibited good activity towards the oxygen reduction reaction recorded in pH 1, 7, 10, and 14. The TiN and MoN microelectrodes were also employed to assess their properties towards the reduction of peroxodisulfate, a very strong oxidising agent with a very complex reduction process. This study also employed bare Au, bare Pt, nanostructured Pt, and bismuth-adsorbed Pt microdisk electrodes to search for the electrode that produces a stable and preferably a diffusion-controlled current for the reduction of peroxodisulfate. Cyclic voltammograms with a plateau region were obtained with the nanostructured Pt, bismuth-modified Pt, HF-etched TiN, and MoN microelectrodes but not with the bare Au and bare Pt microelectrodes. However, only MoN microdisks demonstrated a stable steady-state current for the reduction of peroxodisulfate. To our knowledge, no group has observed cyclic voltammograms with a plateau region when employing bare electrodes for the reduction of peroxodisulfate. A linear relationship between the current and concentration was obtained with the MoN microdisk electrodes for concentrations above 0.1 mM. Similarly, the MoN microdisk electrode produced a diffusion-controlled current for scan rates between 5 and 50 V s-1. Overall, the MoN microelectrodes produced more reliable amperometric results than the TiN microelectrode. Thus, the MoN microelectrodes could be exploited as an alternative to the conventional Pt, Au, and C microelectrodes.
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Lemus-Ruiz, Jose. "Diffusion bonding of silicon nitride to titanium." Thesis, McGill University, 2000. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=37760.

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The use of ceramic has gradually increased over the past few years. Si3N4 is one of the most important ceramics used as structural material for high temperature applications. The practical use of advanced ceramics depends on the reliability of ceramic/metal joining techniques and the properties of the resulting interfaces. This work focuses on various aspects of diffusion bonding of Si3N4 to Ti as well as on the use of Ti-foil interlayer during the self-joining of Si3N4. Si3N4/Ti and Si3N 4/Ti-foil/Si3N4 combinations were diffusion joined by hot-uniaxial pressing and the microstructural characterization of the resulting interfaces was carried out by SEM, EPMA, and X-ray diffraction.
Diffusion bonding was carried out at temperatures ranging from 1200 to 1500ºC using different holding times, pressures, and surface roughness of the joining materials. The results showed that Si3N4 could not be bonded to Ti at temperatures lower than 1400ºC, however successful joining at higher temperatures. Joining occurred by the formation of a reactive interface on the Ti side of the joint. At temperatures greater than 1330ºC, liquid formation occurred by the interaction of Ti with Si promoting bonding, as well as the high affinity of Ti for Si resulted in rapid interface formation of silicides, initially Ti5Si3. EPMA and X-ray diffraction confirmed the presence of Ti5Si3, TiSi, and TiN at the interface. The surface roughness of the joining materials plays an important role since thicker interfaces were obtained for polished samples compared to as-ground samples. The interfaces grew in a parabolic fashion with the formation of various Ti-silicides (Ti5Si3 and TiSi) as well as Ti-nitride (TiN) at the interface.
Evaluation of joint strengths as a function of the experimental parameters such as, joining temperature and time was obtained by four-point bending test performed on Si3N4/Ti/Si3N4 joints. Strong joints were produced at joining temperatures greater than 1450ºC with average bend strength of more than 100 MPa. The maximum joint strength was obtained in samples hot-pressed at 1500ºC and 120 minutes reaching a value of 147 MPa.
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Mahmoud, El-Amin A. "Machining with titanium nitride-coated metal tools." Thesis, Aston University, 1988. http://publications.aston.ac.uk/11912/.

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Munktell, von Fieandt Sara. "Controlled interlayer between titanium carbon-nitride and aluminiumoxide." Thesis, Uppsala universitet, Institutionen för materialkemi, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-161088.

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In the industry of metal cutting tools the conditions are extreme; the temperature can vary thousand degrees rapidly and the pressure can be tremendously high. To survive this kind of stress the cutting tool must be both hard and tough. In order to obtain these properties different coatings are used on a base of cemented carbide, WC-Co. Common coatings are hard ceramics like titanium nitride and titanium carbon-nitride with an outer layer of aluminium oxide. In this thesis the possibility of using titanium dioxide as an interlayer between titanium carbon-nitride and aluminium oxide to control the morphology and phase of aluminium oxide is investigated. Of the different aluminium oxide phases only the alpha-Al2O3 is stable. The titanium carbon-nitride coatings are made by CVD (chemical vapour deposition); also the alumina is deposited by CVD. The titanium dioxide was deposited by atomic layer deposition (ALD) which is a sequential CVD technique that allows a lower deposition temperature and better control of the film growth than CVD. The obtained thin films were analyzed using XRD, Raman spectroscopy, ESCA and SEM. To test the adhesion of the coatings the samples were sand blasted. A thin interlayer of titanium dioxide causes the aluminium oxide to grow as alpha-Al2O3, thinner TiO2 gave better adhesion.
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黃大偉 and Tai-wai Wong. "Laser spectroscopy of sulphur monoxide and titanium nitride." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 1992. http://hub.hku.hk/bib/B31210612.

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Wong, Tai-wai. "Laser spectroscopy of sulphur monoxide and titanium nitride /." [Hong Kong] : University of Hong Kong, 1992. http://sunzi.lib.hku.hk/hkuto/record.jsp?B13205043.

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Johnson, Saccha Ellen. "Atmospheric pressure chemical vapour deposition of titanium nitride from titanium tetrachloride and ammonia." Thesis, University of Southampton, 1996. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.242208.

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Zgrabik, Christine Michelle. "Wide Tunability of Magnetron Sputtered Titanium Nitride and Titanium Oxynitride for Plasmonic Applications." Thesis, Harvard University, 2016. http://nrs.harvard.edu/urn-3:HUL.InstRepos:33493259.

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Transition metal nitrides have recently garnered much interest as alternative materials for robust plasmonic device architecture including potential applications in solar absorbers, photothermal medical therapy, and heat-assisted magnetic recording. Titanium nitride (TiN) is one such potential candidate. One advantage of the transition metal nitrides is that their optical properties are tunable according to the deposition conditions. The controlled achievement of tunability, however, is also a challenge. Although the formation of TiN has been the subject of numerous previous studies, a thorough analysis of the deposition parameters necessary to form metallic TiN films optimized for plasmonic applications had not been demonstrated. Similarly, such TiN films had not been subjected to detailed optical measurements which could be used in FDTD device simulations to optimize plasmonic device designs. To be able to design, simulate and build robust and optimal device structures, in this work a systematic and thorough examination of the effect of varied substrates, temperatures, and reactive gas compositions on magnetron sputtered TiN was conducted. In addition, the effects of application of an additional substrate bias were studied. The resulting optical properties at visible to near-infrared frequencies were the focus of this thesis. The optical properties of each film were measured via spectroscopic ellipsometry with more "metallic” films demonstrating a larger negative value of the real part of the permittivity. These optical measurements were correlated with both the films’ deposition conditions and microstructural measurements including x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), and transmission electron microscopy (TEM) measurements; the different deposition conditions resulted in TiN and TiOxNy films with widely tunable optical responses. By sputtering under different conditions, the value of the real part of the permittivity was tuned from small positive values, through small and moderate negative values, and finally all of the way to large negative values which are comparable to those measured in gold. It was determined that both the chemical composition as well as the film crystallinity had a significant effect on the resulting properties with the most metallic films in general exhibiting a Ti:N ratio close to 1:1, low oxygen incorporation, more N bound as TiN rather than in oxynitride form, and better crystallinity. Increased substrate temperature in general increased the metallic character while application of a substrate bias reduced crystalline order, however also reduced oxygen incorporation and allowed for deposition of metallic TiN at room temperature. The close lattice match of TiN and MgO allowed for heteroepitaxial growth on this substrate under carefully controlled conditions. Finally, to demonstrate the viability of the optimized TiN thin films for plasmonic applications, three benchmark plasmonic structures were simulated using the measured, optimized optical properties including a plasmonic grating coupler, infrared nanoantennas, and a nanopyramidal array. The devices were successfully fabricated and preliminary measurements show promise for plasmonic applications for example in solar conversion and photothermal medical therapy.
Engineering and Applied Sciences - Applied Physics
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Books on the topic "Titanium nitride"

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Liles, K. J. Mechanical and physical properties of particulate composites in the system titanium nitride-alumina-aluminum nitride. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1989.

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Liles, K. J. Mechanical and physical properties of particulate composites in the system titanium nitride-alumina-aluminum nitride. Washington, DC: Dept. of the Interior, 1989.

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Marinković, S. Titanium nitride coatings: Preparations, characteristics, and applications. 2nd ed. Jülich: Forschungszentrum Jülich, 1991.

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Mahmoud, El-Amin Abdel-Galil. Machining with titanium nitride-coated metal tools. Birmingham: Aston University. Department of Mechanical and Production Engineering, 1988.

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Slavens, G. J. Vapor-phase reactions to prepare titanium nitride powder. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1992.

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Slavens, G. J. Vapor-phase reactions to prepare titanium nitride powder. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1992.

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Slavens, G. J. Vapor-phase reactions to prepare titanium nitride powder. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1992.

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Slavens, G. J. Vapor-phase reactions to prepare titanium nitride powder. Washington, D.C: U.S. Dept. of the Interior, Bureau of Mines, 1992.

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Prange, Robert. Abscheidung metastabiler Ti₁₋xAlxN-Schichten nach dem plasmagestützten CVD-Verfahren. Düsseldorf: VDI Verlag, 2000.

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Ahmad, Z. Sintering and densification of nitride using a titanium monoxide binder. Manchester: UMIST, 1993.

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Book chapters on the topic "Titanium nitride"

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Aardahl, C. L., and J. W. Rogers. "Titanium Nitride." In Inorganic Reactions and Methods, 97–98. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2007. http://dx.doi.org/10.1002/9780470145333.ch60.

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Molarius, J. M., and M. Orpana. "Titanium Nitride Process Development." In Crucial Issues in Semiconductor Materials and Processing Technologies, 331–35. Dordrecht: Springer Netherlands, 1992. http://dx.doi.org/10.1007/978-94-011-2714-1_33.

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Andrievski, R. A. "Particulate Nanostructured Silicon Nitride and Titanium Nitride." In ACS Symposium Series, 294–301. Washington, DC: American Chemical Society, 1996. http://dx.doi.org/10.1021/bk-1996-0622.ch020.

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Hamerton, R. G., D. M. Jaeger, and A. R. Jones. "Titanium Nitride and Nitrogen Strengthened Stainless Steels." In Materials for Advanced Power Engineering 1994, 477–84. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1048-8_39.

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Guha, Spandan, Asish Bandyopadhyay, Santanu Das, and Bibhu Prasad Swain. "Investigation of Titanium Silicon Nitride: A Review." In Lecture Notes in Electrical Engineering, 169–79. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-4765-7_18.

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Yang, Dong Ju, Sung Jin Song, Hak Joon Kim, Wen Wu Wang, and Sung Duk Kwon. "Nondestructive Evaluation of Titanium-Nitride Ceramic Coatings." In Experimental Mechanics in Nano and Biotechnology, 465–68. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-415-4.465.

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Eslamloo-Grami, M., and Z. A. Munir. "The synthesis of titanium nitride and titanium carbonitride by self-propagating combustion." In The Chemistry of Transition Metal Carbides and Nitrides, 215–32. Dordrecht: Springer Netherlands, 1996. http://dx.doi.org/10.1007/978-94-009-1565-7_11.

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Zgalat-Lozynskyy, O. B., A. V. Ragulya, and M. Herrmann. "Rate-Controlled Sintering of Nanostructured Titanium Nitride Powders." In Functional Gradient Materials and Surface Layers Prepared by Fine Particles Technology, 161–67. Dordrecht: Springer Netherlands, 2001. http://dx.doi.org/10.1007/978-94-010-0702-3_17.

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Das, Soham, and Bibhu Prasad Swain. "Investigation of Titanium Aluminium Nitride (TiAlN): A Review." In Lecture Notes in Electrical Engineering, 147–58. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-4765-7_16.

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Predel, F. "Crystal structure of Ti-N (titanium-nitride) system." In Phase Equilibria, Crystallographic and Thermodynamic Data of Binary Alloys, 90. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-24977-8_46.

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Conference papers on the topic "Titanium nitride"

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Ishii, Satoshi, Ramu Pasupathi Sugavaneshwar, Kai Chen, Thang Duy Dao, and Tadaaki Nagao. "Sunlight absorbing titanium nitride nanoparticles." In 2015 17th International Conference on Transparent Optical Networks (ICTON). IEEE, 2015. http://dx.doi.org/10.1109/icton.2015.7193490.

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Manoharan, Mohan Prasad, Amit Desai, and Amanul Haque. "Fracture Toughness of Titanium - Titanium Nitride Multi-Layer Thin Film." In ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2008. http://dx.doi.org/10.1115/detc2008-49821.

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Thin film specimens of titanium - titanium nitride multilayer erosion resistant coating were prepared using liftout technique in Focused Ion Beam - Scanning Electron Microscope (SEM). The fracture toughness of the thin film specimen was measured in situ using a cantilever bending experiment in SEM to be 11.33 MPa/m0.5, twice as much as conventional TiN coatings. Ti–TiN multi-layer coatings are part of a new class of advanced erosion resistant coatings and this paper discusses an experimental technique to measure the fracture toughness of these coatings.
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Doiron, Brock, Nicholas A. Güsken, Alberto Lauri, Yi Li, Andrei Mihai, Takayuki Matsui, Ryan Bower, et al. "Hot carrier optoelectronics with titanium nitride." In CLEO: Science and Innovations. Washington, D.C.: OSA, 2020. http://dx.doi.org/10.1364/cleo_si.2020.sth4f.1.

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Shacham-Diamand, Yosef Y., C. Koutras, F. Goodwin, J. L. Keddie, and Emmanuel P. Giannelis. "Characterization of spin-on titanium nitride." In Microelectronic Processing '92, edited by Thomas Kwok, Takamaro Kikkawa, and Krishna Shenai. SPIE, 1993. http://dx.doi.org/10.1117/12.145453.

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Ishii, Satoshi, Satish L. Shinde, Ramu P. Sugavaneshwar, Manpreet Kaur, and Tadaaki Nagao. "Harvesting Sunlight with Titanium Nitride Nanostructures." In 2018 Progress in Electromagnetics Research Symposium (PIERS-Toyama). IEEE, 2018. http://dx.doi.org/10.23919/piers.2018.8598236.

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Guler, Urcan, Justus C. Ndukaife, Gururaj V. Naik, A. G. Agwu Nnanna, Alexander V. Kildishev, Vladimir M. Shalaev, and Alexandra Boltasseva. "Local heating with titanium nitride nanoparticles." In CLEO: QELS_Fundamental Science. Washington, D.C.: OSA, 2013. http://dx.doi.org/10.1364/cleo_qels.2013.qtu1a.2.

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Guler, Urcan, Alexander Kildishev, Alexandra Boltasseva, and Vladimir Shalaev. "Titanium nitride nanoparticles for therapeutic applications." In CLEO: QELS_Fundamental Science. Washington, D.C.: OSA, 2014. http://dx.doi.org/10.1364/cleo_qels.2014.fm1k.4.

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D'Anna, Emilia, Gilberto Leggieri, Armando Luches, Maurizio Martino, Alessio Perrone, Guiseppe Majni, Paolo Mengucci, and Ion N. Mihailescu. "Laser reactive ablation deposition of titanium nitride and titanium carbide films." In Optics for Productivity in Manufacturing, edited by Rolf-Juergen Ahlers, Peter Hoffmann, Hermann Lindl, and Ruediger Rothe. SPIE, 1994. http://dx.doi.org/10.1117/12.193108.

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Dang, Kim. "Plasma etching of aluminum copper tungsten on titanium nitride and titanium." In Microelectronic Manufacturing, edited by Anthony J. Toprac and Kim Dang. SPIE, 1998. http://dx.doi.org/10.1117/12.324334.

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D'Anna, Emilia, M. L. De Giorgi, Armando Luches, Maurizio Martino, Valentin Craciun, Ion N. Mihailescu, and Paolo Mengucci. "Titanium nitride: titanium silicide structures obtained by multipulse excimer laser irradiation." In LAMILADIS '91: International Workshop--Laser Microtechnology and Laser Diagnostics of Surfaces, edited by Nikolai I. Koroteev and Vladislav Y. Panchenko. SPIE, 1992. http://dx.doi.org/10.1117/12.58628.

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Reports on the topic "Titanium nitride"

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Hanrahan, R. J. Jr, Y. C. Lu, H. Kung, and D. P. Butt. A study of nitride formation during the oxidation of titanium-tantalum alloys. Office of Scientific and Technical Information (OSTI), December 1996. http://dx.doi.org/10.2172/418500.

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Gozin, Michael. Development of Modified Titanium Nitride Nanoparticles as Potential Contrast Material for Photoacoustic Imaging. Fort Belvoir, VA: Defense Technical Information Center, May 2014. http://dx.doi.org/10.21236/ada611661.

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Allendorf, M. D., A. Arsenlis, and R. Bastasz. Development of a process simulation capability for the formation of titanium nitride diffusion barriers. Office of Scientific and Technical Information (OSTI), February 1997. http://dx.doi.org/10.2172/481558.

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Nandwana, P., R. Banerjee, J. Y. Hwang, M. Y. Koo, S. H. Hong, and J. Tiley. Formation of Equiaxed Alpha and Titanium Nitride Precipitates in Spark Plasma Sintered TiB/Ti-6Al-4V Composites (Preprint). Fort Belvoir, VA: Defense Technical Information Center, August 2012. http://dx.doi.org/10.21236/ada565665.

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Backfish, Michael. Electron Cloud in Steel Beam Pipe vs Titanium Nitride Coated and Amorphous Carbon Coated Beam Pipes in Fermilab's Main Injector. Office of Scientific and Technical Information (OSTI), April 2013. http://dx.doi.org/10.2172/1151749.

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Snow, G. Characterization of dc magnetron sputtering systems for the deposition of tantalum nitride, titanium, and palladium thin films for HMC (hybrid microcircuit) applications. Office of Scientific and Technical Information (OSTI), July 1989. http://dx.doi.org/10.2172/5884585.

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Jervis, T. R., T. G. Zocco, J. R. Tesmer, and J. P. Hirvonen. Tribology and surface mechanical properties of excimer laser nitrided titanium. Office of Scientific and Technical Information (OSTI), November 1994. http://dx.doi.org/10.2172/10194306.

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Graham, M. E., P. Chang, and W. D. Sproul. Tribological properties of reactively sputtered nitrides and carbides of titanium, zirconium and hafnium. Final report. Office of Scientific and Technical Information (OSTI), June 1994. http://dx.doi.org/10.2172/10163628.

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