Journal articles: 'Tin-lead alloy'

1

Jordan, Manfred. "Lead-free Tin Alloys as Substitutes for Tin-lead Alloy Plating." Transactions of the IMF 75, no. 4 (January 1997): 149–53. http://dx.doi.org/10.1080/00202967.1997.11871162.

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2

Roelandts, Iwan. "Lead and tin alloy reference materials." Spectrochimica Acta Part B: Atomic Spectroscopy 49, no. 11 (September 1994): 1103–9. http://dx.doi.org/10.1016/0584-8547(94)80095-2.

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3

Wang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.

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Abstract Tin-lead alloys have historically been popular in the electronics industry for use in solder-attach applications. Despite recent restrictions related to lead content, some industries continue to use lead based alloys in solder applications. Tin-lead based alloys, in particular, have proven to have excellent solderability to tin, nickel, copper, gold, and silver metallization surfaces. They have also performed better in reliability than most of the lead free solders. As a result of this, they are still widely used in the aerospace and military electronics industry. Hybrid microelectronics built for space applications use both Tin-Lead-Silver Alloy Sn62 and Lead Free Soldering Alloy Sn96; these solders are used both for wire and component attach as well as substrate to header attach. This article discusses the differences of these two solders, using both literature and experimental study. Experimental testing involving pull tests further supports this conclusion.

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4

Ho, C. T. "Carbon fiber-reinforced tin-lead alloy composites." Journal of Materials Research 9, no. 8 (August 1994): 2144–47. http://dx.doi.org/10.1557/jmr.1994.2144.

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Brominated, anodically oxidized, and pristine p-100 carbon fiber reinforced tin-lead alloy composites were fabricated by squeeze casting. The fibers were brominated by bromine vapor for 48 h and then desorbed at 200 °C in air for 12 h. The anodic oxidation treatment of fibers involved electrochemical etching in a dilute sodium hydroxide electrolyte for 3 min, or immersing in nitric acid for 72 h. The composites containing surface-treated carbon fibers had higher tensile and interlaminar shear strength than the ones containing pristine carbon fibers. The composite containing brominated carbon fibers had better tensile strength than the other two surface treatments.

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5

Burashnikova, M. M., I. V. Zotova, and I. A. Kazarinov. "Anodic passivation mechanism of lead-tin alloys in sulfuric acid solution." Electrochemical Energetics 13, no. 4 (2013): 205–12. http://dx.doi.org/10.18500/1608-4039-2013-13-4-205-212.

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The process of formation of a passivating sulphatic film on electrodes made of lead-tin alloys was studied by voltammetry. This process was established to proceed under diffusive control and to be limited to mass transfer in the anode film. At anodic dissolution of lead-tin alloys, there proceeds active dissolution of tin which collects inside the anode film and passes to solution. Owing to the formation of a more porous sulphatic film on the surface of a tin-containing alloy, the constant of diffusive process increases.

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6

Aamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (October 14, 2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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7

Takateru, Umeda. "Development Of Lead Free Copper Alloy Casting; Mechanical Properties, Castability and Machinability." Metal Indonesia 26 (January 31, 2018): 34. http://dx.doi.org/10.32423/jmi.2004.v26.34-40.

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The regulation for the lead discharge in the environment was strengthened, in Japan, the standards 0.01 mg/I or less has been in force from April 2003. In order to meet the new standard, two technologies for reduction of lead dissolution into the drinking water have been developed in Japan; substitution of lead free copper alloys for lead bearing bronze (JIS-CAC406) and introduction of surface treatment technology. This technological trend was shortly reviewed. For development of lead free copper alloy casting, mechanical properties, castability and machinability of various lead free alloy castings were examined. Trial alloys used were commercially available ones such as the lead free bronze containing Bi, the lead free bronze containing Bi-Se, the lead free bronze containing Bi-Sb and the lead free brass containing Si. Mechanical properties of alloys were dependent on the pouring temperature and castings thickness and were generally less than those of tin bronze castings (JIS-CAC406, Cu-5 wt% Sn-5 wt% Zn-5 wt% Pb). The machinability of the lead free bronze containing Bi and Se was better than that of the lead free bronze castings containing Bi and Bi-Sb. But was still 10 to 15 % less than that of JIS-CAC406. In a lead free alloy substituted by Bi, adjustment of tin, zinc and bismuth contents was attempted and in the Bi-Se system, the adequate adjustment, for bismuth and selenium contents and also for tin, zinc and bismuth contents, was attempted. New alloy in which the mechanical properties sufficiently satisfy the standard for JIS-CAC406 is developed.

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8

Czerwiński, Andrzej, Agata Skwarek, Mariusz Płuska, Jacek Ratajczak, and Krzysztof Witek. "Tin Pest and Tin Oxidation on Tin-Rich Lead-Free Alloys Investigated by Electron Microscopy Methods." Solid State Phenomena 186 (March 2012): 275–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.186.275.

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Soldering of joints in electronic circuits is performed in all branches of electronic industry. At temperatures below 13.2°C, an allotropic transformation of white β-tin into gray α-tin called tin pest may occur, leading to the degradation of mechanical properties or even a total disintegration of the alloy. Presence of some chemical elements in the alloy can inhibit the transformation, while other can promote it, e.g. a significant Pb addition prevents the transformation. However, the Restriction of Hazardous Substances Directive adopted by the European Union since 2006, limits Pb amount to 0.1 wt.%, leading to tin pest phenomenon in tin rich materials. The energy dispersive X-ray spectroscopy (EDXS) in scanning electron microscope was performed on samples of tin-rich lead-free alloys subjected to accelerated low temperature stress and after months of storage at -18 °C showed the tin pest occurrence. Much higher oxygen content in EDXS spectrum was revealed at old regions of transformed α-tin than at new α-tin and non-transformed β-tin regions. The tin pest oxidation is much accelerated in comparison to β-tin and can finally lead to the consuming of the whole tin in deteriorated places by the tin oxide.

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9

SONODA, Tsukasa, Mamoru SUGIMOTO, Masayoshi NISHIRA, Hidemi NAWAFUNE, and Shozo MIZUMOTO. "Bright tin-lead alloy plating from pyrophosphate baths." Journal of the Surface Finishing Society of Japan 40, no. 6 (1989): 771–76. http://dx.doi.org/10.4139/sfj.40.771.

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10

SONODA, Tsukasa, Mamoru SUGIMOTO, Masayoshi NISHIRA, Hidemi NAWAFUNE, and Shozo MIZUMOTO. "Bright tin-lead alloy plating from gluconate baths." Journal of the Surface Finishing Society of Japan 41, no. 9 (1990): 922–26. http://dx.doi.org/10.4139/sfj.41.922.

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11

Wang, L., V. Laxmanan, and J. F. Wallace. "Gravitational macrosegregation in unidirectionally solidified Lead-tin alloy." Metallurgical Transactions A 19, no. 11 (November 1988): 2687–94. http://dx.doi.org/10.1007/bf02645803.

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12

Kruglikov, S. S., D. Yu Turaev, and A. A. Borodulin. "Environmentally Safe Plating of Tin-Lead Alloy Coatings." Protection of Metals 41, no. 6 (November 2005): 589–91. http://dx.doi.org/10.1007/s11124-005-0085-1.

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13

Sutliff, John A. "A TEM investigation of a hyper-eutectic lead-tin alloy." Proceedings, annual meeting, Electron Microscopy Society of America 46 (1988): 562–63. http://dx.doi.org/10.1017/s042482010010487x.

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Near-eutectic Pb-Sn alloys are important solders used by the electronics industry. In these solders, the eutectic mixture, which solidifies last, is the important microstructural consituent. The orientation relation (OR) between the eutectic phases has previously been determined for directionally solidified (DS) eutectic alloys using x-ray diffraction or electron chanelling techniques. In the present investigation the microstructure of a conventionally cast, hyper-eutectic Pb-Sn alloy was examined by transmission electron microscopy (TEM) and the OR between the eutectic phases was determined by electron diffraction. Precipitates of Sn in Pb were also observed and the OR determined. The same OR was found in both the eutectic and precipitation reacted materials. While the precipitation of Sn in Pb was previously shown to occur by a discontinuous precipitation reaction,3 the present work confirms a recent finding that volume diffusion controlled precipitation can also occur.Samples that are representative of the solder's cast microstructure are difficult to prepare for TEM because the alloy is multiphase and the phases are soft.

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14

Aleksandrova, V. V., M. V. Kuzmin, A. O. Patianova, V. L. Semenov, and R. I. Alexandrov. "Determination of optimal parameters technological process of polling of copper wire with alloy POS-61." Chimica Techno Acta 9 (June 21, 2022): 202292S7. http://dx.doi.org/10.15826/chimtech.2022.9.2.s7.

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The development of the technique for the manufacture of round copper wire coated with "tin-lead" alloy is considered. The optimal parameters such as the temperature of the "tin-lead" alloy melt, the linear speed for tinning of the wire with a round copper alloy and the diameter of the diamond die were determined. The test results of the experimental wire samples are presented.

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15

Wędrychowicz, Maciej, Andrzej Piotrowicz, Tomasz Skrzekut, Piotr Noga, and Adam Bydalek. "Recovery of Non-Ferrous Metals from PCBs Scrap by Liquation from Lead." Materials 15, no. 6 (March 11, 2022): 2089. http://dx.doi.org/10.3390/ma15062089.

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This article presents the results of research on the recycling of non-ferrous metals from PCB scrap using melting in metallic lead. The idea of this process is to dissolve (transfer) metals from PCB scrap in lead, and then liquation them by cooling the lead-metals alloy. PCB scrap was crushed and then melted into liquid lead. The lead after process was then poured into the casting mold and its chemical composition was examined. Among the various metals in the PCB scrap, copper and tin in particular are dissolved in lead. The more scrap dissolved in lead, the higher the concentration of copper and tin in the alloy. The highest obtained concentration of copper in lead were about 2.2 wt.%, and for tin about 0.8 wt.%.

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16

Fomichev, V. T., A. V. Savchenko, and G. P. Gubarevich. "ELECTRIC DEPOSITION OF TIN-LEAD ALLOY BY PULSE CURRENT." IZVESTIA VOLGOGRAD STATE TECHNICAL UNIVERSITY, no. 4(251) (April 23, 2021): 86–89. http://dx.doi.org/10.35211/1990-5297-2021-4-251-86-89.

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The process of electrodeposition of a tin-lead alloy from hydrofluoride electrolytes by pulsating currents has been investigated. The influence of the electric mode on the alloy composition and properties of the resulting precipitates was studied: current efficiency, microhardness, specific electrolytic resistance, and internal stresses of the precipitates.

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17

SENDA, Atsuo, Yoshihiko TAKANO, and Kazuhiro MORITA. "Formation of Tin-Lead Alloy Film by Electroless Plating." Journal of the Surface Finishing Society of Japan 45, no. 3 (1994): 283–89. http://dx.doi.org/10.4139/sfj.45.283.

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18

Ho, C. T. "Nickel-coated carbon fiber-reinforced tin-lead alloy composites." Journal of Materials Research 10, no. 7 (July 1995): 1730–35. http://dx.doi.org/10.1557/jmr.1995.1730.

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Nickel is deposited over pristine, surface-treated, and brominated P-100 carbon fibers using cementation and electroplating techniques. The fibers are brominated by bromine vapor for 48 h and then desorbed at 200 °C in air for 12 h. The anodic oxidation treatment is performed by etching fibers electrochemically in a dilute sodium electrolyte for 3 min or by immersing fibers in nitric acid for 72 h. Electroplated-coated fibers show better tensile properties than cementation-coated fibers. Tin-lead alloy composites reinforced by nickel-coated fibers (which are pristine, anodically oxidized, and brominated) are fabricated by squeeze casting. The composites containing coated carbon fibers with bromination or surface treatment have higher tensile and shear strength than the ones containing coated pristine carbon fibers. In addition, the composite containing coated carbon fibers with brominalion shows the best performance in the tensile properties.

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19

Barakatt, M. A., and K. KOIKE. "Acid Leaching of Indium-Lead-Tin Alloy Wire Scrap." Journal of Society of Materials Engineering for Resources of Japan 10, no. 1 (1997): 36–44. http://dx.doi.org/10.5188/jsmerj.10.36.

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20

Vahdat, S. E. "Tin-Copper-Lead Alloy Produced by Horizontal Centrifugal Casting." Archives of Foundry Engineering 16, no. 1 (March 1, 2016): 131–37. http://dx.doi.org/10.1515/afe-2016-0016.

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Abstract Horizontal centrifugal casting is an effective method for the production of hollow metal with good mechanical properties, low defect, cast to size and relatively cheap. The ability of a metal to satisfy the above requirements highly depends on its microstructure. In this study, the relationship between microstructural parameters such as grain size and the amount of phases with bulk hardness of SnCu4Pb3 is concerned in three areas of the product. Consequently, to achieve the desired hardness of the product in a particular area, the interaction of two factors of the microstructure including, grain size and particles amount of the hard intermetallic compositions (Cu6Sn5) should be noted.

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21

Zhou, Yan-Bao, Hou-Tian Liu, Wen-Bin Cai, Ao-Sheng Wang, and Hai-Ying Fan. "A Lead-Tin-Rare Earth Alloy for VRLA Batteries." Journal of The Electrochemical Society 151, no. 7 (2004): A978. http://dx.doi.org/10.1149/1.1751193.

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22

Dietl, Lothar, and Uwe Trinks. "The surface resistance of a superconducting lead-tin alloy." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 284, no. 2-3 (December 1989): 293–95. http://dx.doi.org/10.1016/0168-9002(89)90294-5.

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23

Weinbel, R. C., J. K. Tien, R. A. Pollak, and S. K. Kang. "Creep-fatigue interaction in eutectic lead-tin solder alloy." Journal of Materials Science 22, no. 11 (November 1987): 3901–6. http://dx.doi.org/10.1007/bf01133338.

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24

ISHIJIMA, Akira, Tomohiko MOROHASHI, and Masahiro KUDO. "Ion Induced Alteration at Lead-Tin and Lead-Tin-Silver Alloy Surfaces Investigated by AES and SIMS." Hyomen Kagaku 16, no. 7 (1995): 422–27. http://dx.doi.org/10.1380/jsssj.16.422.

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25

Salmi, K., and G. Sundholm. "The anodic behaviour of tin and a lead-tin alloy in sulfuric acid." Journal of Power Sources 40, no. 1-2 (December 1992): 217–24. http://dx.doi.org/10.1016/0378-7753(92)80054-f.

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26

Chugaev, Andrey V., Stephen W. Merkel, and Irina E. Zaytseva. "Lead Isotopic Characteristics and Metal Sources for the Jewelry in the Medieval Rural Settlements from the Suzdal Region (Kievan Rus’)." METALLA 25, no. 2 (May 7, 2021): 101–25. http://dx.doi.org/10.46586/metalla.v25.2019.i2.101-125.

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The article considers the results of the study of lead isotope composition of 38 non-ferrous artifacts discovered at medieval rural sites of the Suzdal Region (Kievan Rus’). The copper-alloy, silver and pewter artifacts were compared with reference data from geographically and temporally diverse medieval artifacts and ore deposits and revealed differing source regions and supply networks within and between metal types. The identification in some cases was difficult due to the conformity of the lead isotopic composition of deposits of some regions. The copper-alloys, represented mostly by crosses made of high-tin bronze, show close isotopic parallels to contemporary copper alloys from Southern Scandinavia, Westphalia and Lower Saxony. Since the copper alloys contain significant quantities of lead, this lead may have entered the metal by alloying with lead-tin alloys, by smelting mixed copper-lead ore, or through haphazard alloying with lead. The lead isotope ratios for nearly all copper alloys are consistent with deposits in Cornwall and Devon and remobilized ore from the Rhenish Massif. For silver and lead-tin alloy objects, lead isotope analyses point to wide ranging sources. Most silver objects are consistent with mid-to-late 10th century silver stocks circulating in the Baltic area and 10th century Volga-Bulgar silver dirham imitations probably representing mixtures of 9th-10th century Islamic silver. The silver shows a heavy reliance on 10th century mixed stocks and there are little indications of Central and Western European silver, which was common in the 11th century Baltic region. The pewter and lead, however, indicate other sources. Lead isotope ratios are consistent with sources connected to Mediterranean and Baltic networks, some being consistent with sources in England, but it is possible that the lead found in some pewter objects could come from the Olkusz lead district in southern Poland.

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27

S, Jayesh, Jacob Elias, and Manoj Guru. "Factorial design and design of experiments for developing novel lead free solder alloy with Sn, Cu and Ni." International Journal for Simulation and Multidisciplinary Design Optimization 11 (2020): 18. http://dx.doi.org/10.1051/smdo/2020013.

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Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers. As a result of the ban on lead, electronics package industries were looking for novel lead free alloys which can substitute the conventional Sn-Pb alloy. Many alloys were discovered by the scientists. None of them were able to substitute the Sn-Pb alloy and become the market leader. In this paper a new composition with Sn, Cu and Ni is made to analyze which can potentially replace the lead containing solder alloy. Using the design of experiments method, the optimized composition of Cu and Ni is predicted. The full factorial design of experiments with two replications is used to find the optimized composition. Melting temperature, contact angle and hardness were taken as the critical output parameters. Results obtained shows that the optimum composition of Cu and Ni are 1 and 1% by wt.

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28

De Keersmaecker, Michel, Kim Verbeken, and Annemie Adriaens. "Lead dodecanoate coatings for the protection of lead and lead–tin alloy artifacts: Two examples." Applied Surface Science 292 (February 2014): 149–60. http://dx.doi.org/10.1016/j.apsusc.2013.11.103.

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29

Lyubimov, Andrey V., Alexandr G. Borisov, Egor P. Korchagin, Alexey I. Kozlitin, and Natalia G. Osipenkova. "Study of the Process of Cathodic Electrodeposition of High-Lead Tin-Lead Alloy." Proceedings of Universities. Electronics 24, no. 5 (October 2019): 459–68. http://dx.doi.org/10.24151/1561-5405-2019-24-5-459-468.

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30

Eastham, D. R. "Electroplated Overlays for Crankshaft Bearings." Journal of Engineering for Gas Turbines and Power 115, no. 4 (October 1, 1993): 706–10. http://dx.doi.org/10.1115/1.2906763.

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Overlays of either lead-indium or lead-tin-copper are electroplated onto both lead-bronze and aluminum alloy crankshaft bearings to improve seizure resistance and conformability during the initial running-in period. In addition, both the corrosion resistance, particularly of lead-bronze, and the effective fatigue strength of the composite bearing are improved by this layer. The life of the overlay is largely dependent upon the diffusion rate of the low melting point species to the substrate. Thus, migration of either the indium or the tin will determine both the corrosion and wear rates of the overlay. Owing to the processing requirements, aluminum bearings require a nickel or copper interlayer prior to final overlaying with either of the lead alloys. For diffusion control reasons, when depositing lead-tin-copper onto lead-bronze it is usual to have a thin nickel dam to retard the formation of copper-tin intermetallics, which under given conditions may reduce the overall strength and adhesion; lead-indium does not require such a dam on lead-bronze. The principal differences between the two overlays lie in their respective fatigue and wear properties. Thus, lead-indium has a higher fatigue strength but lower wear resistance than lead-tin-copper. This paper compares these two major overlays and considers the selection criteria for the overlay employed.

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31

Zhang, Rui-qian, Yan Li, and Xiao-min Wang. "Compatibility of Austenitic Steel With Molten Lead-Bismuth-Tin Alloy." Journal of Iron and Steel Research International 18, no. 7 (July 2011): 69–72. http://dx.doi.org/10.1016/s1006-706x(11)60093-9.

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32

Yim, P. "Production and characterization of mono-sized lead-tin alloy balls." Metal Powder Report 51, no. 1 (January 1997): 34. http://dx.doi.org/10.1016/s0026-0657(97)80079-3.

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33

Abell, K. C. R., and Y. L. Shen. "Deformation induced phase rearrangement in near eutectic tin–lead alloy." Acta Materialia 50, no. 12 (July 2002): 3193–204. http://dx.doi.org/10.1016/s1359-6454(02)00135-0.

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Barakat, M. A. "Recovery of lead, tin and indium from alloy wire scrap." Hydrometallurgy 49, no. 1-2 (June 1998): 63–73. http://dx.doi.org/10.1016/s0304-386x(98)00003-6.

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35

Hachani, Lakhdar, Kader Zaidat, and Yves Fautrelle. "Multiscale statistical analysis of the tin-lead alloy solidification process." International Journal of Thermal Sciences 110 (December 2016): 186–205. http://dx.doi.org/10.1016/j.ijthermalsci.2016.07.001.

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36

Richter, H., K. Ruess, A. Gemmler, and W. Leonhard. "Precision Tin/Lead Alloy Plating for Flip‐Chip Mounting Technology." Microelectronics International 14, no. 1 (April 1997): 9–13. http://dx.doi.org/10.1108/13565369710800420.

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37

Trebukhov, S. A., V. N. Volodin, O. V. Ulanova, A. V. Nitsenko, and N. M. Burabaeva. "Thermodynamics of formation and evaporation of lead-tin alloys." Kompleksnoe ispolʹzovanie mineralʹnogo syrʹâ/Complex Use of Mineral Resources/Mineraldik shikisattardy Keshendi Paidalanu 316, no. 1 (March 15, 2021): 82–90. http://dx.doi.org/10.31643/2021/6445.10.

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Only a few works have been devoted to thermodynamic studies of the lead-tin system by methods including the volatile components evaporation process. When the binary system is separated into metals by distillation, the volatile component is removed from the alloy and the low-volatile component accumulates in the bottom products, that is, there are alloy composition changes over the entire concentration range. It is necessary to know the boundaries position of the melt and vapor coexistence fields on the state diagram, especially for solutions beneficiated with non-volatile metal to assess the quality of the vapor phase by the content of the low-volatile component. In this regard, the study has been completed with the purpose to clarify the values of the thermodynamic functions of the formation and evaporation of lead-tin melts required to calculate the boundaries of the liquid and vapor coexistence fields on the state diagram that enables us to judge the amount of a low-volatile component in the vapor phase under equilibrium conditions. The thermodynamic activity of lead was calculated, as well as the numerical integration of the Gibbs-Duhem equation using the substitution proposed by Darken is the thermodynamic activity and pressure of saturated tin vapor Based on the values of the saturated lead vapor pressure, determined by the boiling point method (isothermal version) for alloys predominantly of the lead edge of the phase diagram. The thermodynamic constants thus obtained will add to the base of physicochemical data and will be used to calculate the boundaries of the vapor-liquid equilibrium fields on the phase diagram, allowing to determine the possibility and completeness of the distillation separation of metals.

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38

Wu, Min, and Bailin Lv. "Prediction of viscosity of ternary tin-based lead-free solder melt using BP neural network." Soldering & Surface Mount Technology 32, no. 3 (January 27, 2020): 173–80. http://dx.doi.org/10.1108/ssmt-02-2019-0005.

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Purpose Viscosity is an important basic physical property of liquid solders. However, because of the very complex nonlinear relationship between the viscosity of the liquid ternary Sn-based lead-free solder and its determinants, a theoretical model for the viscosity of the liquid Sn-based solder alloy has not been proposed. This paper aims to address the viscosity issues that must be considered when developing new lead-free solders. Design/methodology/approach A BP neural network model was established to predict the viscosity of the liquid alloy and the predicted values were compared with the corresponding experimental data in the literature data. At the same time, the BP neural network model is compared with the existing theoretical model. In addition, a mathematical model for estimating the melt viscosity of ternary tin-based lead-free solders was constructed using a polynomial fitting method. Findings A reasonable BP neural network model was established to predict the melt viscosity of ternary tin-based lead-free solders. The viscosity prediction of the BP neural network agrees well with the experimental results. Compared to the Seetharaman and the Moelwyn–Hughes models, the BP neural network model can predict the viscosity of liquid alloys without the need to calculate the relevant thermodynamic parameters. In addition, a simple equation for estimating the melt viscosity of a ternary tin-based lead-free solder has been proposed. Originality/value The study identified nine factors that affect the melt viscosity of ternary tin-based lead-free solders and used these factors as input parameters for BP neural network models. The BP neural network model is more convenient because it does not require the calculation of relevant thermodynamic parameters. In addition, a mathematical model for estimating the viscosity of a ternary Sn-based lead-free solder alloy has been proposed. The overall research shows that the BP neural network model can be well applied to the theoretical study of the viscosity of liquid solder alloys. Using a constructed BP neural network to predict the viscosity of a lead-free solder melt helps to study the liquid physical properties of lead-free solders that are widely used in electronic information.

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39

Shepelevich, V. G., O. N. Belaya, and E. Yu Neumerzhytskaya. "Influence of decomposition of oversatured liquid solutions on the structure and microhardness of quickly curing alloys of the Pb–Sn system." Proceedings of the National Academy of Sciences of Belarus, Physical-Technical Series 64, no. 4 (January 11, 2020): 391–97. http://dx.doi.org/10.29235/1561-8358-2019-64-4-391-397.

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The results of studies of the structure and microhardness of foil alloys of the lead–tin system obtained by high-speed cooling from the liquid phase are presented. The foil sample had the following dimensions: length – up to 10 cm, width – up to 1 cm, and thickness – 30–80 microns. Melt cooling rate was not less than 105 K/s. A rapidly cooled foil is chara cterized by a dispersed structure. The size of the discharge of tin and lead does not exceed 5 μm. The specific surface of the interfacial boundaries achieve 1.7 μm–1. Due to supercooling, a microcrystalline structure forms in the foil. The average lengths of chords of random secants on lead and tin grain sections in the Pb–73 at.% Sn alloy foil are 0.8 and 1.8 μm respectively. The texture of (111) lead and (100) tin is formed in the foil of alloys of the lead – tin system under certain conditions. The formation of the structure of lead alloys containing from 20 to 95 at.% tin is due to the occurrence of spinodal decomposition of a supersaturated liquid solution, and, in other alloys, due to decay by the mechanism of formation and growth of nuclei of crystalline phases. The stratification of the liquid solution leads to the formation of areas enriched in lead and tin, which contribute to the formation of crystallization centers that are equally distributed in the volume of the foil. The microhardness of the foil alloys, whose compositions are close to eutectic, is less than the microhardness of massive alloys of the same composition, which is associated with the softening effect of grain boundaries and interphase boundaries. Exposure of these alloys at room temperature causes an increase in microhardness due to a decrease in slippage at the boundaries. The decomposition of supersaturated solid solutions of Pb–5 at.% Sn and Sn–1 at.% Pb alloys leads to a decrease in microhardness due to the weakening of the effect of the solid solution hardening mechanism. The results of the study can be used to create fusible solders, bearing alloys, alloys for cable sheaths with improved physicochemical properties.

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Ren, Xiaoyan, Guowei Zhang, Hong Xu, Zhaojie Wang, Yijun Liu, Fenger Sun, Yuanyuan Kang, Mingjie Wang, Weize Lv, and Zhi Yin. "Effects of B on the Structure and Properties of Lead-Tin Bronze Alloy and the Mechanism of Strengthening and Toughening." Materials 14, no. 24 (December 16, 2021): 7806. http://dx.doi.org/10.3390/ma14247806.

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High lead–tin bronze is widely used in the selection of wear-resistant parts such as bearings, bearing bushes, aerospace pump rotors, turbines, and guide plates because of its excellent wear resistance, thermal conductivity, fatigue resistance, and strong load-bearing capacity. At present, high lead–tin bronze is used as a material for bimetal cylinders, which cannot meet the requirements of high-strength, anti-wear in actual working conditions under high temperature, high speed, and heavy load conditions, and is prone to de-cylinder, cylinder holding, copper sticking, etc. The reason for the failure of cylinder body parts is that the strength of copper alloy materials is insufficient, the proportion of lead in the structure is serious, and the wear resistance of the material is reduced. Therefore, it has important theoretical significance and application value to carry out research on the comprehensive properties of high-performance lead–tin bronze materials and reveal the strengthening and toughening mechanism. In this paper, The ZCuPb20Sn5 alloy is taken as the main research object, and the particle size, microstructure, mechanical properties, and friction of lead particles in ZCuPb20Sn5 alloy are systematically studied after single addition of B in ZCuPb20Sn5 alloy liquid. This paper takes ZCuPb20Sn5 alloy as the research object to study the effect of adding B on the morphology, microstructure, mechanical properties, and friction and wear properties of ZCuPb20Sn5 alloy lead particles, and discusses the strengthening and toughening mechanism of ZCuPb20Sn5 alloy under the action of B, and prepares a double high-performance lead–tin bronze alloy for metal cylinders. The main research results are as follows: The addition of B elements has an obvious refining effect on the α (Cu) equiaxed grains and lead particles in ZCuPb20Sn5 alloy. The average size of lead particles decreases from 30.0 µm to 24.8 µm as the B content increases from 0 wt.% to 0.1 wt.%. The reason for grain refinement is that B is easily concentrated at the grain boundary during the ZCuPb20Sn5 alloy solidification process, which affects the diffusion of solute atoms at the solidification interface, inhibits the grain growth, refines the grain, and hinders the sinking and homogenizes distribution between dendrites of lead; the tensile strength of the ZCuPb20Sn5 alloy improves. Relatively without B, when the addition of P is 0.1 wt.%, the tensile strength is the largest at 244.04 MPa, which enhances 13%; the maximum hardness gets 75.0 HB, which enhances 13.6%, as well as elongation get the maximum value at 17.2%. The main mechanism is that the addition of B forms a high melting point submicron Ni4B3 phase in the lead–tin bronze alloy. The Ni4B3 phase is dispersed in the matrix and strengthens the matrix. With the increase in B content (more than 0.1 wt.%), the Ni4B3 phase changes from sub-micron degree granular to micron degree block-like, and some defects such as shrinkage and porosity appear in the structure, resulting in a decrease in mechanical properties.

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Kumar, A., G. Chandra, and O. P. Katyal. "The effect of grain boundary scattering on the electrical resistivity of polycrystalline lead, tin, and tin–lead alloy films." Physica Status Solidi (a) 100, no. 1 (March 16, 1987): 169–75. http://dx.doi.org/10.1002/pssa.2211000119.

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Kang, Sung K., and Thomas G. Ference. "Nickel-alloyed tin-lead eutectic solder for surface mount technology." Journal of Materials Research 8, no. 5 (May 1993): 1033–40. http://dx.doi.org/10.1557/jmr.1993.1033.

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A new ternary solder alloy of tin-lead-nickel was developed for solder joints. It has an optimum composition range of (60–65)% Sn, (35–40)% Pb, (0.5–1.0)% Ni by weight. The alloy exhibits a higher strength and longer fatigue life than the pure 63% Sn−37% Pb eutectic. Melting point, wettability, and fatigue life were the key properties used to determine this composition. In particular, the melting point of the alloyed eutectic solder did not change for rapidly solidified samples when up to 2 wt. % Ni was added. Instead of modifying the solution melting temperature, the majority of the Ni precipitated out as a fine dispersion of Ni3Sn4. These Ni3Sn4 particles help to strengthen the solder matrix. Reflow experiments on rapidly solidified material showed minimal coarsening and agglomeration of the Ni3Sn4 particles for up to 5 min of reflow cycles. The wettability of the solder, however, decreased significantly for contents of Ni above 1.5%. Low cycle fatigue tests show that for a solder with 0.5% Ni, the fatigue life was about twice as long as that of standard eutectic solder. Suggested processing for the alloy is rapid solidification to form the alloy powder which is incorporated into a reflowable paste.

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Xu, Junjie, Jingbao Gao, Lingxin Kong, Baoqiang Xu, Bin Yang, and Dachun Liu. "Isobaric vapor-liquid equilibria of ternary lead-tin-antimony alloy system at 2 Pa." Journal of Mining and Metallurgy, Section B: Metallurgy, no. 00 (2020): 26. http://dx.doi.org/10.2298/jmmb190529026x.

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In this study, experimental vapor-liquid equilibria data of the ternary Pb-Sn-Sb alloy system are determined using a new experimental method. The experimental VLE data passed the thermodynamic consistency test(Van Ness test), suggesting that the experimental results are reliable. The activities of the components of Pb-Sn-Sb ternary alloy and those of the corresponding three constituent binaries were calculated using the Wilson equation. The predicted values are in good agreement with the data determined from experiments, and the average relative deviation and average standard deviation were smaller than ? 4.00%and ? 0.03for all constituent binaries, respectively, which indicates that the Wilson equation is reliable for calculating the activity of the components of the Pb-Sn-Sb ternary alloy. The VLE data of the Pb-Sn and Sb-Sn binary alloys and Pb-Sn-Sb ternary alloy were calculated based on the VLE theory and Wilson equation. The calculated VLE data were in good agreement with the data determined from experiments, indicating that this method is reliable for calculating the VLE of alloy systems. The proposed study offers a valid method for analyzing the composition of products that are dependent on the distillation temperature and system pressure during vacuum distillation, which is of great significance to the experimental design of this process.

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Couble, E. C., O. B. Dutkewych, S. M. Florio, M. V. Marsh, and R. F. Staniunas. "Immersion, Non‐electrolytic Tin/lead Plating Process." Circuit World 19, no. 1 (April 1, 1992): 63–70. http://dx.doi.org/10.1108/eb046192.

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The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levelling, electrodeposition/selective stripping, or inhibitor coatings for maintaining solderability of printed wiring boards. A flat, uniform solderable tin/lead coating on all feature surfaces and edges is achieved. A number of important benefits are derived. The ability to coat any copper surface uniformly, including fine pitch features, is substantially enhanced. Solderability is improved because of a thick, flat, co‐planar and uniform tin/lead deposit on all copper surfaces. Typical thickness and composition of the fused alloy are 150 to 300 microinches (4 to 8 microns) and 65 to 75% tin.

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Kovaleva, Kseniya. "Materials for the Study of Items from Non-Ferrous and Precious Metals of Selitrennoe Settlement: Chemical Composition." Vestnik Volgogradskogo gosudarstvennogo universiteta. Serija 4. Istorija. Regionovedenie. Mezhdunarodnye otnoshenija, no. 4 (October 2020): 328–47. http://dx.doi.org/10.15688/jvolsu4.2020.4.22.

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Introduction. This paper presents the results of the study of the chemical composition of nonferrous and precious metal items from the excavations of the Selitrennoe settlement by the Volga Region Archaeological Expedition in 1986–1989 stored in the State Historical Museum. Methods and materials. XRF was used as a method of determining the elemental composition; the main technological operations were determined using the trasology method. A total of 63 subjects were analyzed, including domestic items, jewelry and items related to production. Analysis and Results. The alloys have been distinguished depending on the presence and concentration of alloying elements: brass (two-component, tin, lead, multicomponent), bronzes (tin, lead, leadarsenic, tin-lead, tin-zinc, and multicomponent) and silver alloys (multicomponent high silver bronzes and goldsilver alloy). Inclusions of soldering with silver in the solder and gilding according to the amalgamation have been also recorded. The results of the analysis show the prevalence of two-component brass and multicomponent alloys, a small amount of tin bronzes and the complete absence of items from “pure” metals – copper, tin and lead. The common practice of using recycled metal can be judged by the relatively low content of zinc in brass and a large proportion of multicomponent alloys. Despite the presence of distinguishable stable groups, a wide range of concentrations suggests the absence of clear recipes, including for certain categories of objects. The dependence of the applied technology on the composition of metal is also revealed. The sample of the Selitrennoe settlement is significantly different from other large series of analyses of the Golden Horde time (Bolgar Region, Uvek and its neighborhood).

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Xing, Jiandong, Tetsuichi Motegi, and Atsumi Ohno. "Direct Observation of the Solidification Phenomenon of a Tin-Lead Alloy." Transactions of the Japan Institute of Metals 26, no. 2 (1985): 144–51. http://dx.doi.org/10.2320/matertrans1960.26.144.

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Danilov, F. I., E. A. Vasil’eva, T. E. Butyrina, and V. S. Protsenko. "Electrodeposition of lead–tin alloy from methanesulphonate bath containing organic surfactants." Protection of Metals and Physical Chemistry of Surfaces 46, no. 6 (November 2010): 697–703. http://dx.doi.org/10.1134/s2070205110060122.

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Kamal, M., B. M. Moharram, H. Farag, A. El-Bediwi, and H. F. Abosheiasha. "Microstructure and physical properties of bismuth–lead–tin ternary eutectic alloy." Radiation Effects and Defects in Solids 161, no. 7 (July 2006): 421–25. http://dx.doi.org/10.1080/10420150600764199.

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Lee, C. F., and T. J. Shieh. "Theory of Endochronic Cyclic Viscoplasticity of Eutectic Tin/Lead Solder Alloy." Journal of Mechanics 22, no. 3 (September 2006): 181–91. http://dx.doi.org/10.1017/s1727719100000824.

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AbstractIn this paper, a theory of Endochronic cyclic viscoplasticity of eutectic Tin/Lead (60Sn/40Pb) solder alloy under cyclically thermomechanical strain histories had been established. Under the conditions of isotropic and inelastically incompressible small deformation, the constitutive equation of deviatoric behavior was expressed as:here and the strain rate dependent intrinsic time scale and . Employing the experimental cyclic shear stress-strain curves of various testing temperature and frequency, all temp. dependent material parameters and ; and the temp.-freq. dependent material function were determined for temp. between 213K and 423K and freq. between 0.3Hz and 0.01Hz. Predicative capability of the theory were then challenged by a set of experiments with complicate strain history such as (i) Fast in tension/Slow in compression constant strain amplitude cyclic tests (ii) Slow-Fast-Slow constant amplitude cyclic tests. Through the excellent computational results, the present theory demonstrated that it can, not only play a vital role in the area of electronic solder mechanics, but also meet the needs of reliability analysis and life assessment in the electronic/photoelectronic packagings.

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Robert, M. P., A. Zubelewicz, and L. M. Keer. "Micromechanism approach to model creep Fatigue Interaction in Lead‐Tin Alloy." Journal of Engineering Mechanics 117, no. 3 (March 1991): 707–11. http://dx.doi.org/10.1061/(asce)0733-9399(1991)117:3(707).

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Journal articles on the topic 'Tin-lead alloy'

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