Relevant bibliographies by topics / Tin-lead alloy

Academic literature on the topic 'Tin-lead alloy'

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Published: 30 May 2022
Last updated: 28 January 2023

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Journal articles on the topic "Tin-lead alloy"

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Jordan, Manfred. "Lead-free Tin Alloys as Substitutes for Tin-lead Alloy Plating." Transactions of the IMF 75, no. 4 (January 1997): 149–53. http://dx.doi.org/10.1080/00202967.1997.11871162.

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Roelandts, Iwan. "Lead and tin alloy reference materials." Spectrochimica Acta Part B: Atomic Spectroscopy 49, no. 11 (September 1994): 1103–9. http://dx.doi.org/10.1016/0584-8547(94)80095-2.

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Wang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.

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Abstract Tin-lead alloys have historically been popular in the electronics industry for use in solder-attach applications. Despite recent restrictions related to lead content, some industries continue to use lead based alloys in solder applications. Tin-lead based alloys, in particular, have proven to have excellent solderability to tin, nickel, copper, gold, and silver metallization surfaces. They have also performed better in reliability than most of the lead free solders. As a result of this, they are still widely used in the aerospace and military electronics industry. Hybrid microelectronics built for space applications use both Tin-Lead-Silver Alloy Sn62 and Lead Free Soldering Alloy Sn96; these solders are used both for wire and component attach as well as substrate to header attach. This article discusses the differences of these two solders, using both literature and experimental study. Experimental testing involving pull tests further supports this conclusion.
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Ho, C. T. "Carbon fiber-reinforced tin-lead alloy composites." Journal of Materials Research 9, no. 8 (August 1994): 2144–47. http://dx.doi.org/10.1557/jmr.1994.2144.

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Brominated, anodically oxidized, and pristine p-100 carbon fiber reinforced tin-lead alloy composites were fabricated by squeeze casting. The fibers were brominated by bromine vapor for 48 h and then desorbed at 200 °C in air for 12 h. The anodic oxidation treatment of fibers involved electrochemical etching in a dilute sodium hydroxide electrolyte for 3 min, or immersing in nitric acid for 72 h. The composites containing surface-treated carbon fibers had higher tensile and interlaminar shear strength than the ones containing pristine carbon fibers. The composite containing brominated carbon fibers had better tensile strength than the other two surface treatments.
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Burashnikova, M. M., I. V. Zotova, and I. A. Kazarinov. "Anodic passivation mechanism of lead-tin alloys in sulfuric acid solution." Electrochemical Energetics 13, no. 4 (2013): 205–12. http://dx.doi.org/10.18500/1608-4039-2013-13-4-205-212.

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The process of formation of a passivating sulphatic film on electrodes made of lead-tin alloys was studied by voltammetry. This process was established to proceed under diffusive control and to be limited to mass transfer in the anode film. At anodic dissolution of lead-tin alloys, there proceeds active dissolution of tin which collects inside the anode film and passes to solution. Owing to the formation of a more porous sulphatic film on the surface of a tin-containing alloy, the constant of diffusive process increases.
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Aamir, Muhammad, Riaz Muhammad, Majid Tolouei-Rad, Khaled Giasin, and Vadim V. Silberschmidt. "A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics." Soldering & Surface Mount Technology 32, no. 2 (October 14, 2019): 115–26. http://dx.doi.org/10.1108/ssmt-11-2018-0046.

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.
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Takateru, Umeda. "Development Of Lead Free Copper Alloy Casting; Mechanical Properties, Castability and Machinability." Metal Indonesia 26 (January 31, 2018): 34. http://dx.doi.org/10.32423/jmi.2004.v26.34-40.

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The regulation for the lead discharge in the environment was strengthened, in Japan, the standards 0.01 mg/I or less has been in force from April 2003. In order to meet the new standard, two technologies for reduction of lead dissolution into the drinking water have been developed in Japan; substitution of lead free copper alloys for lead bearing bronze (JIS-CAC406) and introduction of surface treatment technology. This technological trend was shortly reviewed. For development of lead free copper alloy casting, mechanical properties, castability and machinability of various lead free alloy castings were examined. Trial alloys used were commercially available ones such as the lead free bronze containing Bi, the lead free bronze containing Bi-Se, the lead free bronze containing Bi-Sb and the lead free brass containing Si. Mechanical properties of alloys were dependent on the pouring temperature and castings thickness and were generally less than those of tin bronze castings (JIS-CAC406, Cu-5 wt% Sn-5 wt% Zn-5 wt% Pb). The machinability of the lead free bronze containing Bi and Se was better than that of the lead free bronze castings containing Bi and Bi-Sb. But was still 10 to 15 % less than that of JIS-CAC406. In a lead free alloy substituted by Bi, adjustment of tin, zinc and bismuth contents was attempted and in the Bi-Se system, the adequate adjustment, for bismuth and selenium contents and also for tin, zinc and bismuth contents, was attempted. New alloy in which the mechanical properties sufficiently satisfy the standard for JIS-CAC406 is developed.
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Czerwiński, Andrzej, Agata Skwarek, Mariusz Płuska, Jacek Ratajczak, and Krzysztof Witek. "Tin Pest and Tin Oxidation on Tin-Rich Lead-Free Alloys Investigated by Electron Microscopy Methods." Solid State Phenomena 186 (March 2012): 275–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.186.275.

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Soldering of joints in electronic circuits is performed in all branches of electronic industry. At temperatures below 13.2°C, an allotropic transformation of white β-tin into gray α-tin called tin pest may occur, leading to the degradation of mechanical properties or even a total disintegration of the alloy. Presence of some chemical elements in the alloy can inhibit the transformation, while other can promote it, e.g. a significant Pb addition prevents the transformation. However, the Restriction of Hazardous Substances Directive adopted by the European Union since 2006, limits Pb amount to 0.1 wt.%, leading to tin pest phenomenon in tin rich materials. The energy dispersive X-ray spectroscopy (EDXS) in scanning electron microscope was performed on samples of tin-rich lead-free alloys subjected to accelerated low temperature stress and after months of storage at -18 °C showed the tin pest occurrence. Much higher oxygen content in EDXS spectrum was revealed at old regions of transformed α-tin than at new α-tin and non-transformed β-tin regions. The tin pest oxidation is much accelerated in comparison to β-tin and can finally lead to the consuming of the whole tin in deteriorated places by the tin oxide.
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SONODA, Tsukasa, Mamoru SUGIMOTO, Masayoshi NISHIRA, Hidemi NAWAFUNE, and Shozo MIZUMOTO. "Bright tin-lead alloy plating from pyrophosphate baths." Journal of the Surface Finishing Society of Japan 40, no. 6 (1989): 771–76. http://dx.doi.org/10.4139/sfj.40.771.

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SONODA, Tsukasa, Mamoru SUGIMOTO, Masayoshi NISHIRA, Hidemi NAWAFUNE, and Shozo MIZUMOTO. "Bright tin-lead alloy plating from gluconate baths." Journal of the Surface Finishing Society of Japan 41, no. 9 (1990): 922–26. http://dx.doi.org/10.4139/sfj.41.922.

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Dissertations / Theses on the topic "Tin-lead alloy"

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Lee, Richard. "The Production, Use and Disposal of Romano-British Tin and Tin and Lead Alloy Tableware." Thesis, University of Reading, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.486350.

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There remains a wide variety of evidence for the production and co~sumption of tin and lead alloy tableware in Roman Britain. In this thesis it is the categorisation of RomanoBritish tin and lead alloy tableware, as well as vessel production moulds, manufacturing debris and compositional data for pewter vessels that forms the study's foundation. Yet it is the main purpose of this thesis to place this data in a wider social, economic' and chronological context. In particular two powerful theoretical perspectives - that social identities could be constructed through the consumption of 'objects', and that such identities can be recorded in an object's depositional context - have informed this research. The main result of this study is that pewter tableware, although a 'Romanized' material, could create and maintain a range of different social identities. Functionally different vessels, for example, can be taken as indicators of different 'lifestyle' choices, the comparative values of which shifted over time. However, these identities could also be renegotiated over time to suit a number of 'atypical' personal choices, such as the reuse of high status vessels in ritual or low status roles. Another key result is that pewter consumption was also constrained by a comparative absence of tin in Britain before the 3'1 century. Limited pre-3rt! century pewter production can be suggested as occurring predominandy where there was easy access to imported tin. However, post 3rt! century production, although most prolific in regions that had direct access to Cornish tin, could also exist in central and eastern England where they were fuelled by recycled tin, the extent of which is starting to be addressed through compositional analysis of Romano-British pewter. These findings, and the data they are built on, should both contribute to research on Romano-British pewter, and more generally provide new approaches to understand Roman material culture in Britain.
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Jiang, Hongjin. "Synthesis of tin, silver and their alloy nanoparticles for lead-free interconnect applications." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/22636.

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Thesis (Ph. D.)--Chemistry and Biochemistry, Georgia Institute of Technology, 2008.
Committee Chair: Dr. C. P. Wong; Committee Member: Dr. Boris Mizaikoff; Committee Member: Dr. Rigoberto Hernandez; Committee Member: Dr. Z. John Zhang; Committee Member: Dr. Z.L. Wang.
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Nibhanupudi, Syam S. "Affect of pressurised solidification on the secondary dentritic arm spacing in lead-tin alloy." abstract and full text PDF (free order & download UNR users only), 2008. http://0-gateway.proquest.com.innopac.library.unr.edu/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:1453603.

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Mabiala, Floyd Lionel. "Photo-physical properties of lead-tin binary Perovskite thin films." University of Western Cape, 2021. http://hdl.handle.net/11394/8002.

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>Magister Scientiae - MSc
Organic-inorganic lead-based perovskite has exhibited great performance in the past few years. However, the lead (Pb) embedded in those compounds is a significant drawback to further progress, due to its environmental toxicity. As an alternative, tin (Sn) based-perovskites have demonstrated promising results in terms of electrical and optical properties for photovoltaic devices, but the oxidation of tin ion- from stannous ion (Sn2+) to stannic ion (Sn4+) presents a problem in terms of performance and stability when exposed to ambient conditions. A more feasible approach may be in a Pb-Sn binary metal perovskite in pursuit of efficient, stable perovskite solar cells (PSCs) with reduced Pb-content, as compared to pure Pb- or Sn-based PSCs. Here, we report on the deposition of a Pb-Sn binary perovskite by sequential chemical vapor deposition.
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Koegel, David Eric. "SPECIFIC PERMEABILITIES OF METALLIC COLUMNAR STRUCTURES AT LOW LIQUID-VOLUME FRACTIONS (MACROSEGREGATION, LEAD-TIN ALLOY, DENDRITIC)." Thesis, The University of Arizona, 1985. http://hdl.handle.net/10150/275455.

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Zhang, Yi. "The electrodeposition and characterisation of compositionally modulated tin-cobalt alloy coatings as lead-free plain bearing material." Thesis, Loughborough University, 2008. https://dspace.lboro.ac.uk/2134/15138.

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Traditionally, lead-based bearing overlays dominate the commercial automotive market and it has been proven that an excellent combination of properties can be attained through their use. However, lead is a toxic metal and a cumulative poison in humans. According to the European Union End-of-Life Vehicle (ELV) Directive proposed in 1997, vehicles that registered in'all the member states after 1st July 2003 should contain no lead, mercury, cadmium and hexavalent chromium. In this study, a new sulphate-gluconate electrolyte was used to produce multilayer SnCo coatings, aimed at a lead-free overlay for future market use. Tin-cobalt compositionally modulated alloy (CMA) coatings produced from sulphategluconate electrolytes have been previously examined as a potential replacement for lead-free bearing overlays [1]. However, some obstacles may exist which limit their potential use on an industrial scale. For example, long electroplating times are required to produce a thick coating which is very undesirable from an industrial viewpoint, and also the possible elemental interdiffusion occurring in the coating system under engine operating temperatures could rapidly deteriorate the coating properties. In addition, there is an increasing demand from automotive industry to further improve bearing overlay properties, for example for high performance and high compression ratio engines.
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Gao, Yang 1966. "Solderability Study of Tin/Lead Alloy Under Steam-Aging Treatment by Electrochemical Reduction Analysis and Wetting Balance Tests." Thesis, University of North Texas, 1993. https://digital.library.unt.edu/ark:/67531/metadc501051/.

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Two types of solder samples, pins and through-holes were tested by SERA™ (Sequential Electrochemical Reduction Analysis) and Wetting Balance after various length of steamaging treatment. It was shown that after steam-aging, both types of specimen gave a similar electrochemical reduction curve, and solderabilty predictions made from SERA™ test agree with results obtained from Wetting Balance test on a qualitative base. Wetting balance test of pin samples after SERA™ test confirmed that SERA™ is a non-destructive testing method -- it even restored solderability. Comparison of electrochemical reduction behavior of samples under different treatment indicates that steam-aging can not reproduce exactly the effect of naturally atmospheric aging, and may not be the best artificial accelerating environment adopted.
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Дячок, Дарія Романівна. "Оптимізація технологічного процесу відтворення художніх виробів у металі." Bachelor's thesis, КПІ ім. Ігоря Сікорського, 2021. https://ela.kpi.ua/handle/123456789/43657.

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Дипломна робота: 86 с., 20 рис., 30 табл., 16 посилань. Мета роботи – оптимізація технологічних процесів відтворення у металі копій двох художніх виробів за наявними неметалевими оригіналами. Методика дослідження – виготовлення силіконових та гіпсових прес-форм із різними варіантами ливникової системи; виготовлення гіпсо кремнеземистих ливарних форм, їх прожарювання та заливання при різних температурах; контроль параметрів якості виливків (шорсткість поверхонь та наявність ливарних дефектів). Результати та їх новизна – теоретично і практично установлено придатність силіконових прес-форм для виготовлення якісних виливків із легкоплавких (олов’яно-свинцевих) сплавів; досліджено параметри технологічних процесів відтворення у металі копій художніх виробів; виготовлено серію якісних художніх виливків із олов’яно-свинцевого і мідного сплаву. Основні показники – в результаті виконання роботи визначено оптимальні параметри технологічних процесів виготовлення художніх виробів. Відлито статуетку «Вікінг» масою 0,099 кг із олов’яно-свинцевого сплаву та масою 0,073 к із латуні Л63, а також статуетку «Кельт» масою 0,468 кг із латуні Л63. Вироби не мають ливарних дефектів, шорсткість поверхонь виливка «Кельт» не перевищує 12,5 мкм, а «Вікінг» - 6,3 мкм. Область застосування – Художнє та ювелірне литво унікальних виробів. Економічна ефективність – 214 137,4 грн. Прогнозні припущення щодо розвитку об’єкта дослідження – за аналогією із дослідженими технологічними процесами, розроблення схем виготовлення схожих за розмірами та складністю литих художніх виробів в умовах дрібносерійного виробництва.
Bachelor’s dissertation: 86 pages, 20 figures, 30 tables, 16 references. The purpose of the work – optimize the technological processes of reproduction in metal copies, two works of art, according to the available non metallic originals. Research methodology – production of silicone and plaster molds with different variants of the foundry system; production of plaster-silica molds, their calcination and pouring at different temperatures; control of quality parameters of castings (surface roughness and the presence of casting defects). Results of the work and their novelty – theoretically and practically established the suitability of silicone molds for the manufacture of high-quality castings from low-melting (tin-lead) alloys; the parameters of technological processes of reproduction in metal copies of art products are investigated; made a series of high-quality art castings from tin-lead and copper alloy. The main indicators – as a result of work the optimum parameters of technological processes of manufacturing of art products are defined. A 0.099 kg Viking figure made of tin-lead alloy and 0.073 kg L63 brass was cast, as well as a 0.468 kg Celt statue made of L63 brass. The products do not have casting defects, the surface roughness does not exceed 12,5 microns and 6,3 microns, Areas of application – art and jewelry casting of unique products. Economic efficiency – UAH 214,137.4. Predictive assumptions about the development of the object of study – by analogy with the studied technological processes, the development of plans for the manufacture of similar size and complexity of cast art products in small scale production.
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Mahapatra, Rama Ballav. "Columnar to equiaxed transition in tin-lead alloys." Thesis, University of British Columbia, 1985. http://hdl.handle.net/2429/26313.

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The columnar to equiaxed transition has been examined experimentally in lead-tin alloys. The effect of thermal conditions during solidification, melt superheat, and alloy composition on the transition have been considered. In directionally solidified alloys, the position at which the transition occured was dependent on the temperature distribution in the system, occuring when a specific low temperature gradient was reached at the advancing interface. Melt superheat did not influence the transition position. The alloy content affected the transition position, the transition occuring earlier at higher alloy contents. Adding particles to the melt did not change the position of the transition.
Applied Science, Faculty of
Materials Engineering, Department of
Graduate
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Wang, Xiangjun. "Sliding behavior of lead and tin based alloys /." The Ohio State University, 1994. http://rave.ohiolink.edu/etdc/view?acc_num=osu148785607641229.

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Books on the topic "Tin-lead alloy"

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Tan, A. C. Tin and solder plating in the semiconductor industry: A technical guide. London: Chapman & Hall, 1993.

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Zhang, Zaihui. Electrodeposition and X-ray structure of gold-nickel and lead-tin alloys and pulse deposition of gold-nickle alloys. Sudbury, Ont: Laurentian University of Sudbury, 1987.

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Birte, Anspach, and Dobat Andres Siegfried, eds. Studien zu Haithabu und Füsing. Neumünster: Wachholtz, 2010.

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Parker, Philip M. The 2007-2012 World Outlook for Secondary Lead-And Tin-Base Alloy Solder. ICON Group International, Inc., 2006.

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Parker, Philip M. The 2007-2012 World Outlook for Secondary Lead-And Tin-Base Alloy Antimonial Lead and Babbitt Metal Refining. ICON Group International, Inc., 2006.

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United States. National Aeronautics and Space Administration., ed. Macrosegregation in directionally solidified Pb-Sn alloys: Project closing report. [Washington, DC: National Aeronautics and Space Administration, 1998.

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Tin and Solder Plating in the Semiconductor Industry. Springer Netherlands, 1992.

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Sarathy, T. P. Characterization of superplastic deformation. 1992.

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The 2006-2011 World Outlook for Secondary Antimonial Lead-And Tin-Base Alloys. Icon Group International, Inc., 2005.

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Parker, Philip M. The 2007-2012 World Outlook for Secondary Antimonial Lead-And Tin-Base Alloys Refining. ICON Group International, Inc., 2006.

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Book chapters on the topic "Tin-lead alloy"

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Unertl, W. N., M. Grunze, and J. J. Weimer. "Surface Properites of a Lead-Tin Alloy." In Diffusion at Interfaces: Microscopic Concepts, 132–41. Berlin, Heidelberg: Springer Berlin Heidelberg, 1988. http://dx.doi.org/10.1007/978-3-642-73632-2_14.

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Hyde, T. H., and H. Fessler. "Static strength testing of a plane frame using the tin-lead alloy technique." In Tubular Structures VI, 85–91. London: Routledge, 2021. http://dx.doi.org/10.1201/9780203735015-14.

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Jordan, Manfred. "Electrodeposition of Tin-Lead Alloys." In Modern Electroplating, 265–84. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470602638.ch9.

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Zhang, Yun. "Tin and Tin Alloys for Lead-Free Solder." In Modern Electroplating, 139–204. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2011. http://dx.doi.org/10.1002/9780470602638.ch6.

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Predel, F. "Phase diagram of Pb-Sn (lead-tin) system." In Phase Equilibria, Crystallographic and Thermodynamic Data of Binary Alloys, 156. Berlin, Heidelberg: Springer Berlin Heidelberg, 2016. http://dx.doi.org/10.1007/978-3-642-24977-8_92.

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Jones, W. Kinzy, Y. Q. Liu, Marc A. Zampino, and Gerardo L. Gonzalez. "The At-Temperature Mechanical Properties of Lead-Tin Based Alloys." In Microelectronic Interconnections and Assembly, 53–58. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-011-5135-1_7.

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Schroer, Carsten. "Fundamental Interactions of Steels and Nickel‐based Alloys with Lead‐based Liquid Alloys or Liquid Tin." In TMS 2021 150th Annual Meeting & Exhibition Supplemental Proceedings, 642–56. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-65261-6_58.

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Vaynman, Semyon, and Moris E. Fine. "Effects of Strain Range, Ramp Time, Hold Time, and Temperature on Isothermal Fatigue Life of Tin-Lead Solder Alloys." In Solder Joint Reliability, 333–60. Boston, MA: Springer US, 1991. http://dx.doi.org/10.1007/978-1-4615-3910-0_11.

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Sauer, Günther. "Extruded Products." In Extrusion, 9–58. 2nd ed. ASM International, 2006. http://dx.doi.org/10.31399/asm.tb.ex2.t69980009.

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Abstract The hot-working process extrusion is used to produce semifinished products in the form of bar, strip, and solid sections, as well as tubes and hollow sections. The first part of this chapter describes the composition, properties, and applications of tin and lead extruded products with a deformation temperature range of 0 to 300 deg C and magnesium and aluminum extruded products with a working temperature range of 300 to 600 deg C. The second part focuses on copper alloy extruded products, extruded titanium alloy products, and extruded products in iron alloys with a working temperature range of 600 to 1300 deg C.
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Biborski, Marcin, and Mateusz Biborski. "Badania składu chemicznego oraz technologia wykonania wybranych zabytków ze stopu miedzi." In Ocalone Dziedzictwo Archeologiczne, 121–34. Wydawnictwo Profil-Archeo; Muzeum im. Jacka Malczewskiego w Radomiu, 2020. http://dx.doi.org/10.33547/oda-sah.10.zn.11.

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41 artefacts recovered from the Przeworsk culture cemetery in Żelazna Nowa were originally selected for archaeometric examination. Of that number, 24 brooches and 13 various objects made from copper alloy were analysed. The choice was dictated by their good state of preservation, allowing for reliable results. The method applied was non-destructive energy dispersive X-ray fluorescence analysis (ED-XRF), using an X-ray spectrometer operating at 45kV. In addition, selected artefacts were examined using a scanning electron microscope. The results of chemical analyses are presented in Tables 11.1 and 11.2, with weight percent values given, while the raw material and technical data are shown in Tables 11.3 and 11.4. The results indicate that among the 24 brooches and their fragments analysed, 16 were made of brass, including eight made of multi-component tin brass, one made of tinlead brass, and one made of tin-silver brass. Among the remaining eight brooches one was made of iron and seven were bronze pieces, including two made of multi-component zinc bronze, one of lead bronze, and one of silver bronze (inv. no. CCXXIII/15). The addition of lead had significant technological impact on the alloys used for creating the brooches. Even in small quantities, even far below 1%, this element improves the castability and workability of the metal. Zinc, in turn, is added to bronzes as a reducing agent, making the alloy self-reducible. This also makes it possible to reduce the contents of phosphorus. Moreover, the addition of zinc to bronze significantly lowers its melting temperature. The remaining alloying additions (apart from elements recorded in trace amounts, like Ag, Sb, and Fe, which naturally occurred in copper alloys) have had no significant impact on the quality of the raw material used for manufacturing the artefacts under discussion. The presence of silver (a few percent) recorded in two brooches (inv. nos XXXIII/15 and CCXXIII/15) indicates they may have originally been silver-plated. Two brooches (inv. nos XCIX/15 and 21/08) were inlaid with silver wire. The first one was cast from tin bronze and adorned with a filigree wire (Fig. 11.1) in the type of a simple braid, made of highquality (92.99%) silver (Fig. 11.2). The silver wire with a diameter of merely 338.38 μm (Fig. 11.3) was produced by drawing through a die, and it was later braided and hammered into grooves previously prepared on the two crests of the brooch. The second brooch, made of iron (inv. no. 21/08), was adorned with silver of a similarly high quality (91.85%). In this case, however, the exposure to fire resulted in complete destruction of the decoration: its traces only remained in a few places in the form of tiny melt-down droplets. It is worth noting the similar standard of silver used as inlays in both brooches. This seems to corroborate the assumption that the standards of silver used in trade were generally similar over larger areas. It is worth noting two brooches which, despite representing different types, are made of chemically very similar alloys (Tables 11.1–3). One (inv. no. CCIX/15) belongs to type A.III.58, while another represents group A.IV (inv. no. CIX/17). This may indicate that both were manufactured in the same workshop. Except for one brooch forged from iron, all the remaining brooches were cast using the lost wax technique (Table 11.3). Cast pieces also prevail among other artefacts, especially those having profiled surfaces (Table 11.4). Examples include a fragment of a J.7 shield grip (inv. no. XVI/15), a belt finial of type “O” (inv. no. CCXLIX/15), and fragments of bracelets with round terminals (inv. nos XIII/15 and LXXXVI/17). The performed raw material analysis of copper alloy artefacts from Żelazna Nowa produced interesting findings. The results confirm that during the Older Roman Period brass artefacts prevailed among small metal dress items in the Przeworsk culture. Among the 37 copper alloy artefacts analysed, as many as 27 (75%) are brass objects. A similar picture was observed in other sites, with a prevalence of brass artefacts recorded in cemeteries such as those in Karczyn/Witowy, Sadłów, and Szarbia.
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Conference papers on the topic "Tin-lead alloy"

1

Hongjin Jiang, Kyoung-sik Moon, Fay Hua, and C. P. Wong. "Tin/silver alloy nanoparticles for low temperature lead-free interconnect applications." In 2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. IEEE, 2007. http://dx.doi.org/10.1109/isapm.2007.4419947.

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STRACHOTOVÁ, Kristýna Charlotte, Milan KOUŘIL, and Šárka MSALLAMOVÁ. "LONG-TERM STABILITY OF PROTECTIVE COATINGS ON LEAD AND LEAD-TIN ALLOY UNDER STORAGE CONDITIONS." In METAL 2022. TANGER Ltd., 2022. http://dx.doi.org/10.37904/metal.2022.4490.

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3

Bruno, Felix, Purushothaman Damodaran, Krishnaswami Srihari, and Guhan Subbarayan. "An Experimental Study on Voids in Mixed Alloy Assemblies." In ASME 2006 International Mechanical Engineering Congress and Exposition. ASMEDC, 2006. http://dx.doi.org/10.1115/imece2006-13556.

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The electronics manufacturing industry is gradually migrating towards to a lead-free environment. During this transition, there will be a period where lead-free materials will need to coexist with those containing lead on the same assembly. The use of tin-lead solder with lead-free parts and lead-free solder with components containing lead can hardly be avoided. If it can be shown that lead-free Ball Grid Arrays (BGAs) can be successfully assembled with tin-lead solder while concurrently obtaining more than adequate solder joint reliability, then the Original Equipment Manufacturers (OEMs) will accept lead-free components regardless of the attachment process or material used. Consequently, the Electronics Manufacturing Service (EMS) providers need not carry both the leaded and the unleaded version of a component. Solder voids are the holes and recesses that occur in the joints. Some say the presence of voids is expected to affect the mechanical properties of a joint and reduce strength, ductility, creep, and fatigue life. Some believe that it may slow down crack propagation by forcing a re-initiation of the crack. Consequently, it has the ability to stop a crack. The primary objective of this research effort is to develop a robust process for mixed alloy assemblies such that the occurrence of voids is minimized. Since there is no recipe currently available for mixed alloy assemblies, this research will study and 'optimize' each assembly process step. The difference between the melting points of lead-free (217°C) and tin-lead (183°C) solder alloys is the most important constraint in a mixed alloy assembly. The effect of voids on solder joint reliability in tin-lead assembly is well documented. However, its effect on lead-free and mixed alloy assemblies has not received due attention. The secondary objective of this endeavor is to determine the percentage of voids observed in mixed alloy assemblies and compare the results to both tin-lead and lead-free assemblies. The effect of surface finish, solder volume, reflow profile parameters, and component pitch on the formation of voids is studied across different assemblies. A designed experiments approach is followed to develop a robust process window for mixed alloy assemblies. Reliability studies are also conducted to understand the effect of voids on solder joint failures when subjected to accelerated testing conditions.
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4

Liu, Ting, Dongyan Ding, Yiqing Wang, Yu Hu, Yihua Gong, and Klaus-Peter Galuschki. "Tin whisker growth on bright Sn films supported by lead-frame alloy substrates." In 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). IEEE, 2012. http://dx.doi.org/10.1109/icept-hdp.2012.6474810.

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5

Ezaham, N. A., N. R. A. Razak, and M. A. A. M. Salleh. "Influence of bismuth on the solidification of tin copper lead-free solder alloy." In 4TH ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2018 (EGM 2018). Author(s), 2018. http://dx.doi.org/10.1063/1.5080917.

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6

Hongjin Jiang, Kyoung-sik Moon, and C. P. Wong. "Tin/silver/copper alloy nanoparticle pastes for low temperature lead-free interconnect applications." In 2008 58th Electronic Components and Technology Conference (ECTC 2008). IEEE, 2008. http://dx.doi.org/10.1109/ectc.2008.4550160.

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Sosiati, H., N. Kuwano, S. Hata, Y. Iwane, Y. Morizono, and Y. Ohno. "Tin whisker formation on a lead-free solder alloy studied by transmission electron microscopy." In 2006 8th Electronics Packaging Technology Conference. IEEE, 2006. http://dx.doi.org/10.1109/eptc.2006.342749.

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8

Jiang, Hongjin, Kyoung-sik Moon, Fay Hua, and C. P. Wong. "Thermal Properties of Tin/Silver Alloy Nanoparticles for Low Temperature Lead-free Interconnect Technology." In 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.373776.

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9

Shen, Y. L., K. C. R. Abell, and S. E. Garrett. "Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-32885.

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Experiments on the eutectic tin-lead alloy were conducted to study the effects of grain boundary sliding on the deformation and damage processes at the microscopic level. The primary objective is to gain mechanistic understandings of solder joint reliability in microelectronic packaging. Bulk specimens were subject to relatively fast deformations of tension, compression and bending, for the purposes of examining the pure mechanical effect without the influence of diffusion related phenomena. Grain realignment and phase redistribution were characterized by microscopy and microhardness indentation. A micromechanical model is proposed to elucidate the observed microstructural changes and progressive damage. This study illustrates the significance of damage in the form of microscopic heterogeneity caused by grain boundary sliding. It also illustrates the possibility of mechanically induced phase coarsening in actual solder joints. High-frequency cyclic shear tests on tin-lead solder joints showed damage along the coarsened band after only a short time, in accord with the proposed effects. Boundary sliding without the influence of atomic diffusion plays an essential role in fatigue damage in solder.
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10

Yiqing Wang, Dongyan Ding, Ting Liu, Klaus-Peter Galuschki, Yu Hu, Angela Gong, Ming Shen, et al. "Effect of Ni barrier on the tin whisker formation of electroplating Sn on lead-frame alloy." In High Density Packaging (ICEPT-HDP). IEEE, 2010. http://dx.doi.org/10.1109/icept.2010.5582636.

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