Journal articles: 'Tin industry'

1

Carlsson, Jerker. "The Nigerian tin industry." Minerals & Energy - Raw Materials Report 3, no. 2 (January 1985): 60–65. http://dx.doi.org/10.1080/14041048509408493.

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Thoburn, John T. "The tin industry since the collapse of the International Tin Agreement." Resources Policy 20, no. 2 (June 1994): 125–33. http://dx.doi.org/10.1016/0301-4207(94)90025-6.

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Larsson, Ralf, and Patrik Söderholm. "International tin agreements & the rise of Brazilian tin mining industry." Minerals & Energy - Raw Materials Report 12, no. 2 (January 1996): 12–16. http://dx.doi.org/10.1080/14041049609409433.

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4

Hillman, David, Timothy Pearson, Ross Wilcoxon, Grace Cooke, Sue Margheim, Elena Gladen, Terry Munson, and Dennis Fritz. "Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth." Journal of Surface Mount Technology 36, no. 1 (March 20, 2023): 2–11. http://dx.doi.org/10.37665/smt.v36i1.28.

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The implementation of the Restriction of Hazardous Substances (RoHS) European Union (EU) Directive in 2005 resulted in the introduction of pure tin as an acceptable surface finish for printed circuit boards and component terminations. A drawback of pure tin surface finishes is the potential to form tin whiskers. Tin whiskers are a metallurgical phenomenon that is associated with tin rich/pure tin materials and has been a topic of intense industry interest. The acceptance and usage of pure tin by the electronics industry component fabricators is understandable as the pure tin surface finishes are inexpensive, are simple plating systems to operate and have reasonable solderability characteristics. However, high performance/harsh environment electronics typically have product life cycles that are measured in decades and therefore are much more susceptible to the potential long term threat of tin whiskers. The GEIA-STD-0005-2 “Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems” established the definition of the term “Pb-free tin” as : “Pb-free Tin is defined to be pure tin or any tin alloy with <3% lead (Pb) content by weight. A functional definition of “pure tin” was necessary so that the electronics industry could establish tin whisker risk protocols against a known acceptable target value in terms of soldering materials and processes. An investigation was conducted to determine the influence of 1% - 5% elemental lead (Pb) content in tin plating on tin whisker initiation and growth. The investigation results were used in the revision of the GEIA-STD-0005-2 “Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems” specification technical discussions.

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Sapinov, R. V., N. A. Kulenova, M. A. Sadenova, P. S. Varbanov, and J. J. Klemeš. "State and prospects of processing tin-containing raw materials in Kazakhstan." Kompleksnoe Ispolʹzovanie Mineralʹnogo syrʹâ/Complex Use of Mineral Resources/Mineraldik Shikisattardy Keshendi Paidalanu 317, no. 2 (June 15, 2021): 37–45. http://dx.doi.org/10.31643/2021/6445.16.

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The article discusses the current state-of-the-art in the tin industry and the prospects of the Republic of Kazakhstan. The evaluation is performed in terms of the development of domestic tin production for the growing global demand and the development of the domestic high-tech industry. The study includes the main domestic sources of the raw material base of the tin, which includes mineral raw materials, anthropogenic and secondary waste. Since the most important for the contemporary tin industry are mineral raw materials, the possibility of complex processing of ore from the Syrymbet deposit was studied. Based on the results of the studies performed, it was found that the mineral tin-containing raw materials of the Syrymbet deposit, in addition to cassiterite, also contain acid-soluble tin-containing minerals (stannin, etc.). At the stage of gravity concentration, the most efficient extraction performance of tin into concentrate was found for the gravity separator – amounting to 34.2%. At the leaching stage, the most efficient extraction of tin (1,543 μg/L) showed an aqueous solution of sulfuric acid with a concentration of 100 g/L, at a temperature of 45 °C.

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Huang, Chien-Ming, Daniel Nunez, James Coburn, and Michael Pecht. "Risk of tin whiskers in the nuclear industry." Microelectronics Reliability 81 (February 2018): 22–30. http://dx.doi.org/10.1016/j.microrel.2017.12.019.

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Rose, Arthur W. "Application of geophysics in the tin mining industry." Journal of Geochemical Exploration 48, no. 3 (August 1993): 372. http://dx.doi.org/10.1016/0375-6742(93)90020-m.

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Palanimally, Yamuna Rani, Zam Zuriyati Mohamad, and Meenah Ramasamy. "THE RESILIENCE OF TIN INDUSTRY ON THE ECONOMIC, ENVIRONMENT AND SOCIETY IN MALAYSIA." International Journal of Accounting, Finance and Business 7, no. 39 (March 30, 2022): 1–9. http://dx.doi.org/10.55573/ijafb.073901.

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The past decades have seen that the tin industry has to face a challenging scenario for its operation especially in decreasing ore grades, deeper deposits, and harder rock mass (Sánchez & Hartlieb, 2020). Notwithstanding to that, the mining activity that decrease the environmental stability, causes pollution, reduced water quality and change of biodiversity (Nurtjahya, Franklin, & Agustina, 2017) has urged the industry to be more environmentally friendly in their operation. In addition, the global economic crisis due to COVID-19 pandemic has added the tougher situation for tin industries. Like it or not, the tin industry needs to combat the challenges in order to remain in the business. In other word, we need a resilient tin industry that can recover from the adverse experience and move forward not only for success but also to contribute for a better nation. A possible solution to become a resilient industry is by adoption of digital technology to increase the operation efficiency, adoption of green technology to reduce the negative environmental impact, managing adequate financial resources to overcome the economic crisis and encouraging product innovation to enhance customer satisfaction.

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Nandito, Joseph Bona, Calvin Santo Arnoldus, Bachtiar Zuhdi Alfarizi, Bismo Aditiya Prakoso, and Adhitya Trenggono. "Effect of Milling Time and Addition of Graphite on the Morphological Structure of Tin Phosphate Powder Using the Graphine Oxide Template Method for Electrolyte Applications." Journal of Social Research 2, no. 12 (November 27, 2023): 5094–111. http://dx.doi.org/10.55324/josr.v2i12.1611.

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Tin phosphate can be used for electrolyte applications. The solid electrolyte industry has experienced significant growth in recent years. In 2020, the market size of the solid electrolyte industry was estimated at $17.8 million and is expected to reach $56.6 million by 2030 at a CAGR of 12.1% from 2021 to 2030. The growth of the solid electrolyte industry is driven by the increasing demand for batteries. Solid-state batteries are becoming a promising alternative to conventional lithium-ion batteries. This research produces tin phosphate nanoparticles through the synthesis of tin phosphate/GO with a modification of the Hummers reaction, using the GO template method which is used to control the morphology and crystal structure of the synthesized material, and calcined to remove GO and produce tin phosphate powder. The research results show that graphite milling time influences the size of the tin phosphate powder produced, and the size of the Graphene Oxide (GO) template also influences the size of the tin phosphate powder. Grinding time also affects the weight of the powder before and after calcination, as well as the amount of GO and tin phosphate produced. The graphite addition ratio also had a significant effect on the weight of the tin phosphate/GO samples before and after calcination. The ratio of adding 2 grams of graphite to 1 gram of tin produces an optimal weight of tin phosphate after calcination, indicating the effectiveness of using GO as a tin growth template. In addition, XRD analysis showed the identification of three dominant compound phases in the resulting powder, namely potassium ditin (IV) tris(phosphate(V)) (KO12P3Sn2), tin phosphate (SnP2O7), and potassium ferrate (FeKO2).

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Dang, Nhat Minh, Wen-Yen Lin, Zhao-Ying Wang, Sima Ahmad Alidokht, Richard R. Chromik, Terry Yuan-Fang Chen, and Ming-Tzer Lin. "Mechanical Properties and Residual Stress Measurement of TiN/Ti Duplex Coating Using HiPIMS TiN on Cold Spray Ti." Coatings 12, no. 6 (June 1, 2022): 759. http://dx.doi.org/10.3390/coatings12060759.

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This study investigated the mechanical properties and the residual stress of high-power impulse magnetron sputtering (HiPIMS) titanium nitride (TiN) thin film capping on cold spray titanium (Ti) coating. This TiN/Ti duplex coating was deposited on the Ti substrate, and the cold spray titanium (Ti) coating was prepared in three cases with different numbers of layers. The study determined Young’s modulus, hardness, and roughness of TiN thin film and cold spray Ti coatings by nano-indentation and AFM. The residual stress measurement of TiN/Ti duplex coating was conducted using the ring-core drilling method. A focused ion beam (FIB) drilled the TiN/Ti duplex coating with various milling depth steps. The corresponding images were obtained with a scanning electron microscope (SEM). The relationship between surface deformations and relaxation stress after each milling depth step was obtained using the digital image correlation (DIC) method. The results showed TiN/Ti duplex coating exhibited excellent mechanical properties, and the residual stresses were not significantly changing with different Ti cold spray substrates, showing the feasibility of coating technology for the future applications in the aerospace industry.

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Pham Thi Ngoc, Quynh, Phung Luong Minh, and Anh Nguyen Ngoc. "UNDERSTANDING THE IMPACTS ON COMMUNITY FROM TIN ORE MINING: A CASE STUDY IN CHAU HONG COMMUNE, QUY HOP DISTRICT, NGHE AN PROVINCE." Journal of Science Educational Science 68, no. 2A (March 2023): 157–70. http://dx.doi.org/10.18173/2354-1075.2023-0029.

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After the introduction of Doi moi, Vietnam has strengthened the exploitation of mineral resources to serve domestic demand and export, making a great contribution to the national economy. Due to the acceleration of industrialization and under the guidance of China’s Belt and Road initiative, tin ore mining, as a foundation for the steel industry, has achieved a significant growth rate and production output. Despite of the macroeconomic achievements, tin ore mining industry has caused adverse impacts to local. This paper seeks to understand how local community experienced the whole range of impacts from the exploitation of tin ores. The study applies the qualitative research method through 19 semi-structured in-depth interviews, participant and field observation in Na Hieng village, Chau Hong commune, Quy Hop district, Nghe An. The finding reveals that although mining industry might play a significant role in local economic growth, this activity has increasingly caused property damage, social instability and environmental degradation. The authors endeavor to provide timely empirical research to advance knowledge on mining industry with a special focus on the different consequences of tin ore mining in the affected community.

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Ningsih, Safitri Indri. "IMPLIKASI SURAT KEPUTUSAN MENPERINDAG NOMOR 144/MPP/KEP/4/1999 TERHADAP PERTAMBANGAN TIMAH ILEGAL DI KEPULAUANA BANGKA." At-Tanwir Law Review 3, no. 1 (April 19, 2023): 47. http://dx.doi.org/10.31314/atlarev.v3i1.2062.

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Illegal tin mining has become increasingly widespread since the issuance of the Decree of the Minister of Industry and Trade number 144/MPP/Kep/4/1999 dated 22 April 1999 that tin is categorized as free goods (unsupervised) and the revocation of tin's status as a strategic commodity, so that it is no longer monopolized by one BUMN and can be freely exported by anyone. With the Minister of Industry and Trade Decree, of course, this has led to rampant illegal tin mining activities, so it is felt that the Government needs to create several laws and regulations as an effort to anticipate violations and criminal acts in the mining sector, tin mining in particular. The regulation that has been made by the Provincial Government of the Bangka Belitung Islands in the context of tackling illegal tin mining is Regional Regulation No. 7 of 2014 concerning Management of Mineral Mining

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Lima, Débora Resende de Souza, Filipe Soares Quirino da Silva, Renato Marçullo borges, Rejane Correa Marques, and Maria de Fátima Ramos Moreira. "Tin speciation in the blood plasma of workers occupationally exposed in a cassiterite ore processing industry." Saúde em Debate 46, no. 133 (April 2022): 459–72. http://dx.doi.org/10.1590/0103-1104202213315.

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ABSTRACT Mining is a high-risk activity due to its dangerous processes. Tin (Sn) is obtained from cassiterite ore and mining activities expose workers to the metal. Chronic exposure to Sn may cause pneumoconiosis, gastrointestinal and hematological effects, among others. This work aimed to assess the exposure of workers to tin in a cassiterite ore processing industry, using the speciation analysis in blood plasma. Twelve subjects donated the blood samples; six were occupationally exposed to Sn. Size exclusion chromatography separated proteins in blood plasma; a graphite furnace atomic absorption spectrometer determined total tin in the plasma and eluted fractions, while SDS-PAGE determined molecular masses of proteins. Tin levels in the workers’ plasma were four times higher than in the reference individuals. After fractionation, the metal only appeared in the total inclusion volume, not being possible to confirm the binding of tin to proteins, which certainly modifies their functions and impair workers’ health. Despite that, the work process needs to change since Sn levels in the workers’ plasma pointed to metal exposure. Further works are necessary to clarify whether the metal is free or bound to small proteins in blood plasma and understand the true impact of tin on workers’ health.

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14

Kim, Hyungwoo, Alireza Kashir, Hojung Jang, Seungyeol Oh, Manoj Yadav, Seungwoo Lee, and Hyunsang Hwang. "Two-step deposition of TiN capping electrodes to prevent degradation of ferroelectric properties in an in-situ crystallized TiN/Hf_0.5Zr_0.5O₂/TiN device." Nano Express 3, no. 1 (March 1, 2022): 015004. http://dx.doi.org/10.1088/2632-959x/ac5be5.

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Abstract Hf0.5Zr0.5O2 (HZO) is an appropriate material for the back-end-of-line (BEOL) process in fabricating ferroelectric TiN/HZO/TiN devices because of its excellent conformality on 3D nanostructures and a suitable crystallization temperature (≥ 350 °C–400 °C). However, in the semiconductor industry, the deposition temperature of TiN is usually higher than 400 °C. Therefore, it is necessary to study the ferroelectric properties of TiN/HZO/TiN devices when the deposition temperature of the TiN top electrode is higher than the HZO film crystallization temperature. In this study, 10-nm-thick TiN top electrodes were deposited at various temperatures on the HZO thin film to investigate the impact of the TiN deposition temperature on the structural features and ferroelectric properties of TiN/HZO/TiN capacitors. Only the sample capped with a TiN top electrode deposited at 400 °C showed ferroelectric properties without subsequent annealing (in situ crystallization). However, this sample exhibited an approximately 40% reduction in the polarization value compared with the other samples that were crystallized after the annealing process. This behavior can be ascribed to the formation of a monoclinic nonpolar phase. To prevent the degradation of the polarization value and suppress the formation of the m-phase in the in situ crystallized HZO thin film, a two-step TiN deposition method was carried out. The sample was fabricated by depositing a 5-nm-thick TiN top electrode at room temperature followed by the deposition of a 5-nm-thick TiN layer at 400 °C, which resulted in strong ferroelectric properties comparable to those of the samples capped with TiN grown at relatively low temperatures (room temperature, 200 °C, and 300 °C). These findings can adequately explain the role of the capping layer in achieving the ferroelectric phase, which is closely related not only during the cooling step of any thermal process but also during the heating and crystallization steps.

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Hardiatama, Intan, Norman Audi Erlangga Pradipta Yudah, Robertus Sidartawan, Hari Arbiantara Basuki, and Franciscus Xaverius Kristianta. "Analisis Perawatan Cutter Section Dredger Dengan Metode FMEA dan OEE." Jurnal Mekanova: Mekanikal, Inovasi dan Teknologi 8, no. 1 (May 19, 2022): 62. http://dx.doi.org/10.35308/jmkn.v8i1.5454.

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The development of technology and industry is currently being followed by increasing demand from the industry for mining or mineral materials, one of which is tin. Indonesia as the second largest tin producing country in the world plays a very important role in the development of technology and industry in the world. In Indonesia, tin mining is carried out by several companies, one of which is PT Timah (Persero) Tbk. This study aims to determine the effectiveness of the KIP 17 dredger system is 77% and the critical components obtained are the shaft and joint on the pump. The results of the analysis using Fishbone diagrams show that the quality of bolts and nuts and sealsused is not good. With the results of the study, it is recommended to increase personnel, especially in maintenance activities, and to improve the quality of nuts, bolts, and seals so as not to cause water to enter which can damage core components. Keywords—Mining, FMEA, Dredger

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Wang, Frank Fan, William McKeague, and Christina Polwarth. "Comparisons of Soldering Alloys in Large Ceramic Substrate to Metal Heatsink Attachment Application." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000596–601. http://dx.doi.org/10.4071/2380-4505-2018.1.000596.

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Abstract Tin-lead alloys have historically been popular in the electronics industry for use in solder-attach applications. Despite recent restrictions related to lead content, some industries continue to use lead based alloys in solder applications. Tin-lead based alloys, in particular, have proven to have excellent solderability to tin, nickel, copper, gold, and silver metallization surfaces. They have also performed better in reliability than most of the lead free solders. As a result of this, they are still widely used in the aerospace and military electronics industry. Hybrid microelectronics built for space applications use both Tin-Lead-Silver Alloy Sn62 and Lead Free Soldering Alloy Sn96; these solders are used both for wire and component attach as well as substrate to header attach. This article discusses the differences of these two solders, using both literature and experimental study. Experimental testing involving pull tests further supports this conclusion.

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Baraz, Vladislav R., S. S. Gerasimov, and I. A. Gruzdeva. "Cu-Ni-Zn 15-20 Alloy - Particular Qualities of Alloying and Crystallization Parameters." Solid State Phenomena 265 (September 2017): 767–71. http://dx.doi.org/10.4028/www.scientific.net/ssp.265.767.

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The article is devoted to the study of Cu-Ni-Zn ternary alloy properties. German silver is applied in the instrument making industry, shipbuilding industry, and medical tool production. Furthermore, German silver is extensively used for domestic goods and costume jewelry. It is known that the aluminum and tin additions improve the Cu-Ni-Zn alloy flowing and casting mold fillability. It is a matter for the figurine and thin section casting production. That is why, using the experiment planning method we have studied the effect of Al and Sn alloyage and crystallization temperature on structure, casting characteristics and the casting characteristics of German silver. The study was realized by casting samples which were produced with lost wax method. Aluminum microadditives (0.4 %) have a positive impact on the casting mold fillability and improve markedly surface quality of casting samples. Tin leading into melt (about 4 %) ensure the marked growth of yield strength (by 65...70 %), while the elongation is maintained. The role of the mold temperature has a lesser impact on the yield strength. The mold temperature reduction from 550 °C to 450 °C leads to the grain size decrease and the little yield strength increase. Moreover, the surface condition measurement shows that aluminum and tin additions greatly reduce the castings surface roughness.

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Arhipov, G. I. "Tin resources of the far eastern federal district - the basis of the tin industry in Russia." Mine Surveying and Subsurface Use, no. 1 (2023): 4–13. http://dx.doi.org/10.56195/20793332_2023_1_4_13.

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Hillman, John. "Capitalism and the Development of the Tin Industry in Burma." Journal of Burma Studies 15, no. 1 (2011): 119–51. http://dx.doi.org/10.1353/jbs.2011.0001.

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Delhaise, André, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, and Zohreh Bagheri. "Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 2: Statistical Analysis." Journal of Surface Mount Technology 33, no. 1 (July 14, 2020): 7–19. http://dx.doi.org/10.37665/smt.v33i1.14.

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With the introduction of environmental legislation such as the Restriction of Hazardous Substances (RoHS), lead (Pb)-free materials have made their way into the electronics manufacturing industry. One issue that has emerged is that Pb-free solder alloys can initiate and grow tin whiskers under specific conditions. These whiskers are thin, highly conductive filaments which have the potential to grow and can cause field failures in many applications. Most concerning with respect to tin whiskering are high reliability applications such as aerospace, automotive, and medical. Bismuth (Bi) is being considered for inclusion in solder alloys to replace the current industry standard (SAC 305) and provide improved thermomechanical and vibration reliability. In this paper, we discuss whisker formation of several Bi-bearing alloys after long-term (12,000 hours), ambient high humidity (25°C/85% RH) storage. Three alloys containing Bi, in addition to SAC 305 (Sn-3.0Ag-0.5Cu), were considered. These alloys were Violet (Sn-2.25Ag-0.5Cu-6.0Bi), Sunflower (Sn-0.7Cu-7.0Bi), and Senju (Sn-2.0Ag-0.7Cu-3.0Bi). The boards were fabricated with electroless nickel immersion gold (ENIG) and immersion tin (ImmSn) finishes and populated with parts having Cu and Fe42Ni alloy leads and chip parts, with half of assemblies cleaned and half cleaned and contaminated with low levels of NaCl. This paper is the second in a series of three in which we share quantitative statistical analysis from the whisker inspection of the small outline transistor (SOT) components. It was found that on ImmSn surface finishes, the longest whiskers were found on SAC, however the longest whiskers were found on Bi-bearing alloys for ENIG. In addition, whiskers were found to generally grow in regions where the tin coverage is thin, and, on ENIG-finished assemblies, near the PCB, likely due to galvanic corrosion between the solder and the finish chemistry.

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Czerwiński, Andrzej, Agata Skwarek, Mariusz Płuska, Jacek Ratajczak, and Krzysztof Witek. "Tin Pest and Tin Oxidation on Tin-Rich Lead-Free Alloys Investigated by Electron Microscopy Methods." Solid State Phenomena 186 (March 2012): 275–78. http://dx.doi.org/10.4028/www.scientific.net/ssp.186.275.

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Soldering of joints in electronic circuits is performed in all branches of electronic industry. At temperatures below 13.2°C, an allotropic transformation of white β-tin into gray α-tin called tin pest may occur, leading to the degradation of mechanical properties or even a total disintegration of the alloy. Presence of some chemical elements in the alloy can inhibit the transformation, while other can promote it, e.g. a significant Pb addition prevents the transformation. However, the Restriction of Hazardous Substances Directive adopted by the European Union since 2006, limits Pb amount to 0.1 wt.%, leading to tin pest phenomenon in tin rich materials. The energy dispersive X-ray spectroscopy (EDXS) in scanning electron microscope was performed on samples of tin-rich lead-free alloys subjected to accelerated low temperature stress and after months of storage at -18 °C showed the tin pest occurrence. Much higher oxygen content in EDXS spectrum was revealed at old regions of transformed α-tin than at new α-tin and non-transformed β-tin regions. The tin pest oxidation is much accelerated in comparison to β-tin and can finally lead to the consuming of the whole tin in deteriorated places by the tin oxide.

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Hering, Benjamin, Anne-Kathrin Wolfrum, Tim Gestrich, and Mathias Herrmann. "Thermal Stability of TiN Coated Cubic Boron Nitride Powder." Materials 14, no. 7 (March 27, 2021): 1642. http://dx.doi.org/10.3390/ma14071642.

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Wear-resistant, super hard ceramic composites based on cubic boron nitride (cBN) are of great interest to industry. However, cBN is metastable under sintering conditions at normal pressure and converts into the soft hexagonal BN (hBN). Therefore, efforts are being made to avoid this process. Besides short sintering times, the use of coated cBN-particles is a way to minimize this process. Therefore, the thermal stability of TiN coated cBN powders in high purity argon and nitrogen atmospheres up to temperatures of 1600 °C was investigated by thermogravimetry, X-ray phase analysis, scanning electron microscopy and Raman spectroscopy. The TiN coating was prepared by the atomic layer deposition (ALD)-method. The investigations showed that the TiN layer reacts in Ar at T ≥ 1200 °C with the cBN and forms a porous TiB2 layer. No reaction takes place in nitrogen up to temperatures of 1600 °C. Nevertheless, the 20 and 50 nm thin coatings also undergo a recrystallization process during heat treatment up to temperatures of 1600 °C.

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Kobayashi, Akira. "Performance of Thick TiN Composite Coating as High Heat Resistant TBC." Materials Science Forum 502 (December 2005): 511–16. http://dx.doi.org/10.4028/www.scientific.net/msf.502.511.

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Titanium nitride (TiN) coating has excellent properties and has been already used in the various field of industry. But TiN film has problems in the formation process: i.e., low deposition rate and poor thickness of the film. TiN thick coatings can be formed by means of the gas tunnel type plasma reactive spraying in a short time operation. In this study, the fundamental characteristics of this method were investigated by measuring the properties of the titanium nitride (TiN) coatings formed on the traversed stainless steel substrate. Consequently, TiN coatings of 200µm thickness were obtained at P=27kW, within t=5s, and some coating characteristics which depend on the spraying distance, the environmental gas, traverse number etc. were clarified. And the performance of TiN thick composite coating was discussed as a heat resistant TBC.

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IBRAHIM, IBRAHIM, DWI HARYADI, and NANANG WAHYUDIN. "THE NEW POLITICAL GOVERNANCE OF TIN MANAGEMENT IN BANGKA BELITUNG ISLANDS, INDONESIA: LOCAL ELITES’ PERSPECTIVE." JOURNAL OF SUSTAINABILITY SCIENCE AND MANAGEMENT 18, no. 9 (September 30, 2023): 123–42. http://dx.doi.org/10.46754/jssm.2023.09.009.

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The management of tin mining in the Bangka Belitung Islands, which is the world’s second largest producer of the mineral, is a complex issue, and has divided the community into two factions. One side is concerned about the ecological impact and other social implications of tin mining, while the other side is concerned with the island’s economic dependence on tin, overlapping policies and law sub-optimal enforcement. This study discussed how local elites view ideal tin mining governance. The researchers found that the elite in Bangka Belitung wanted a change in governance by changing national tin mining policies and proportional distribution of authority between the central and regional governments. This showed that there is a gap between the desire for change in the tin mining industry, and to remain passive in an established order.

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Melcioiu, Georgiana, Viorel Aurel Şerban, Mark Ashworth, Cosmin Codrean, Marin Liţă, and Geoffrey D. Wilcox. "An Evaluation of Sn-Cu-Ga and Sn-Cu-Ag Solder Alloys for Applications within the Electronics Industry." Solid State Phenomena 216 (August 2014): 91–96. http://dx.doi.org/10.4028/www.scientific.net/ssp.216.91.

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Components soldered with Sn-based alloys are susceptible to the growth of whiskers. Tin whiskers have been proven to be responsible for equipment failures in a wide range of industries. In order to reduce defects in electronic components a new solder alloy is proposed based on the Sn-Cu alloys. The Sn-Cu-Ga alloy utilised in this study was fabricated as a ribbons using melt-spinning method. These ribbons were then soldered onto electroplated tin layers. Preliminary characterization of the solder alloy is presented in this paper, including scanning electron microscopy, EDX mapping and X-ray diffraction. Key words: tin whiskers, PCB, printed circuit boards, melt spinning, solder, ribbons

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Dewa, J. J. P. K., I. Y. Aisharya, and H. Fitriansyah. "Sustainability analysis of ex-tin mining pond using multi-dimensional scaling." IOP Conference Series: Earth and Environmental Science 1108, no. 1 (November 1, 2022): 012058. http://dx.doi.org/10.1088/1755-1315/1108/1/012058.

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Abstract Ex-Tin mining is nowadays utilized as leisure industry area in order to reduce externality ex-mining area that resulted a gaping hole filled with rain water that eventually becomes a pond named Kulong. This utilization has resulted economic benefits for local people, together with the degradation of environmental conditions. This study aims to measure the sustainability of Kulong as leisure industry Area by using multidimensional scaling analysis which is assessed through four dimensional approaches, such as environmental, economic, leisure industry, social and institution dimensions. The sustainability is measured by using sustainability index. The result shows that the only dimension that is scored more than 50 for sustainability index is economic dimension while environmental, leisure area, and social and institution dimensions are scored below 50 which are considered as less sustainable. Therefore, the recommendations for the improvement of kulong as leisure area are restriction and encouragement of leisure industry based on age of kulong, making layout design for leisure destination, and establishing cross-sector program for kulong.

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Zarsav, N. "High Frequency Ultrasonic Measurements." Measurement and Control 21, no. 5 (June 1988): 133–36. http://dx.doi.org/10.1177/002029408802100501.

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The use of high frequency ultrasonic Lamb waves to measure the thickness of thin plates and foils, is discussed and the feasibility of their application to the determination of the degree of cure of polymer coating on coated tin plated steel sheet (as used by the food can industry) is evaluated. The paper also discusses briefly the design features of the purpose built precision double probe ultrasonic goniometer used to carry out these measurements.

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Hillman, John. "Promise and Performance in the Bolivian Tin Mining Industry, 1923–1929." Canadian Journal of Latin American and Caribbean Studies 23, no. 45 (January 1998): 5–26. http://dx.doi.org/10.1080/08263663.1998.10816760.

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Pattar, Manohar V., Vinayak N. Kulkarni, and V. N. Gaitonde. "Simulation study and analysis of plant layout in tin container industry." IOP Conference Series: Materials Science and Engineering 561 (November 12, 2019): 012034. http://dx.doi.org/10.1088/1757-899x/561/1/012034.

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Aviandharie, S. A., N. N. Aidha, B. N. Jati, R. Ermawati, and A. A. Cahyaningtyas. "Tio2 Purification From Ilmenite The Tin Industry By-Product For Pigment." Journal of Physics: Conference Series 1503 (July 2020): 012030. http://dx.doi.org/10.1088/1742-6596/1503/1/012030.

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李, 昂. "High-Quality Development Measurement and Evolution Stage Identification of Tin Industry." Sustainable Development 13, no. 02 (2023): 531–43. http://dx.doi.org/10.12677/sd.2023.132057.

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Xiang, Xiong Zhi, Miao Cheng, and Wen Ya Gong. "Effect of Tin Additions on the Anti-Tarnish Properties of Sterling Silver Alloy." Key Engineering Materials 727 (January 2017): 67–71. http://dx.doi.org/10.4028/www.scientific.net/kem.727.67.

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Sterling alloy is widely used in the jewelry industry. Its anti-tarnish property is one of its most important characteristics. In this study, the effect of tin on the corrosion resistance, and tarnish resistance properties of sterling silver alloy were investigated quantized. The difference between anti-corrosion and anti-tarnish properties was investigated in this paper. The tarnish and corrosion resistance of sterling silver improved as tin content increased. However, there was a point at which increasing tin content further led to poor anti-tarnish properties, even though the alloy retained considerable anti-corrosive properties.

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Czerwiński, A., A. Skwarek, M. Płuska, J. Ratajczak, and K. Witek. "Whisker Growth in Tin Alloys on Glass-Epoxy Laminate Studied by Scanning Ion Microscopy and Energy-Dispersive X-Ray Spectroscopy." Archives of Metallurgy and Materials 58, no. 2 (June 1, 2013): 413–17. http://dx.doi.org/10.2478/amm-2013-0009.

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Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn. In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth.

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Shats, M. M., and V. N. Makarov. "GEOECOLOGICAL CONDITIONS IN THE AREA OF THE DEPUTATSKOYE TIN ORE DEPOSIT (NORTH-EASTERN YAKUTIA)." Geology and mineral resources of Siberia, no. 4 (December 2022): 55–63. http://dx.doi.org/10.20403/2078-0575-2022-4-55-63.

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The article highlights the state of the tin mining industry in Yakutia and in the largest tin deposit – Deputatskoye, characterizes natural conditions of the development territory, their extremity in climatic, geological, geomorphological and geocryological relations. The scale and specificity of consequences of mine development, nature, originality of the impact on individual components of the natural environment are shown. The opinion is expressed about the inexpediency of restrictions in further mine development provided that a system of nature protection and remedial measures is created and implemented to maintain an effective tin mining with minimal damage for northern geosystems. This will contribute to the revival of the tin mining industry of the republic.

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Swain, Basudev, Chinmayee Mishra, Hyun Seon Hong, Sung-Soo Cho, and Sung kyu Lee. "Commercial process for the recovery of metals from ITO etching industry wastewater by liquid–liquid extraction: simulation, analysis of mechanism, and mathematical model to predict optimum operational conditions." Green Chemistry 17, no. 7 (2015): 3979–91. http://dx.doi.org/10.1039/c5gc00473j.

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DALE, ROBERT. "Industry Watch." Natural Language Engineering 13, no. 3 (August 8, 2007): 283–86. http://dx.doi.org/10.1017/s1351324907004603.

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I've just come back from the 45th Annual Meeting of the Association for Computational Linguistics (ACL) in Prague; this was the biggest ever ACL conference, with more than 1,000 people attending for the first time. Attendance at ACL conferences has been growing year on year, and that is a sign of a healthy field. Another sign of health is industry sponsorship. For this year's conference, the Gold Sponsor was Google, and Microsoft and Yahoo! were Silver Sponsors, along with a few companies we have not seen as ACL sponsors before: −textkernel, News Tin, and – a name that seems now to pop up regularly in this column – Powerset. There are all sorts of reasons why companies sponsor conferences like this, but clearly a major purpose is to make themselves visible to potential employees. And, if companies are hiring, that's good news across the board: it gives us a way of attracting more students into the field, and more generally, it speaks to the industrial and commercial relevance of what we do. There is nothing like external validation – especially commercial validation – to wash away those niggling self-doubts about the utility of your research endeavours. I remember attending MT Summit VII in Singapore in 1999, when Jo Lernout, then of Lernout & Hauspie, gave an invited talk in which (I'm sure I'm remembering this correctly) he said his ambition was to hire everyone in the hall. There were around 250 attendees – big for an NLP conference at the time – so that created quite a buzz. Jo wanted to hire everyone, not just cherry pick those with the near-to-product big ideas; in his vision of the future, every teensy-weensy tightly-focused research contribution had a role to play. For just a moment, everybody felt wanted.

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Kucharska, Beata, Jerzy Robert Sobiecki, Pawel Czarniak, Karol Szymanowski, Konrad Cymerman, Dorota Moszczyńska, and Peter Panjan. "Influence of Different Types of Cemented Carbide Blades and Coating Thickness on Structure and Properties of TiN/AlTiN and TiAlN/a-C:N Coatings Deposited by PVD Techniques for Machining of Wood-Based Materials." Materials 14, no. 11 (May 22, 2021): 2740. http://dx.doi.org/10.3390/ma14112740.

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The influence of different types of cemented carbide blades and thickness of TiAlN/a-C:N and TiN/AlTiN protective coatings used in the wood industry on cutting performance has been studied. Three types of WC-Co cemented carbide blades with different cobalt content were used in the study. The thicknesses of both types of coatings were ~2 and ~5 µm. The structure, chemical and phase composition were studied using transmission and scanning electron microscopy (TEM, SEM), X-ray dispersion spectroscopy (EDX) and X-ray diffraction (XRD), respectively. The adhesion was evaluated by scratch test. Nanohardness and durability tests of uncoated and coated blades were performed. We found that the blades covered with 5 µm TiN/AlTiN coatings exhibited the best durability characteristic. The cutting distances were within the range ~6700-~7080 depending on the substrates in comparison with pure substrates (~4300–~4900) and 2 µm TiN/AlTiN coatings (~5400–~6600). The presence of a thin and soft outer a-C:N layer aggravates the nanohardness and durability of the coated blades.

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William, M. A., A. W. Azhari, N. S. B. N. Hassan, N. Hasan, D. S. C. Halin, and A. K. Thottoli. "Absorption study on the effect of mixed cation on tin and germanium-based perovskite solar cells." IOP Conference Series: Earth and Environmental Science 920, no. 1 (November 1, 2021): 012032. http://dx.doi.org/10.1088/1755-1315/920/1/012032.

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Abstract The thin film industry has been introduced with an invention of lead-based perovskite solar cells which eventually has gained a huge attention throughout the years. As the concern arises, this lead-based perovskite solar cells contributed towards both the environmental and human health issues due to the high level of toxicity. This then carve the paths into the research in finding suitable alternative for lead-free perovskite where tin and germanium are proposed as possible substitute, but the long-term durability and stability of both perovskites are still a challenge to be improved and maintained. In this study, tin and germanium-based solutions are fabricated individually with mixed cations of FA-MA; FAxMA1–xSnI3 and FAxMA1–xGeI3 in variations (1⩽ x ⩽0). The UV-Vis spectroscopy was analyzed in 400-1100nm range to measure the light intensity absorption of full encapsulated fabricated perovskite solar cells after 30 days of exposure to surrounding conditions and recorded highest peak of absorption at the wavelength of 400 nm and 550 nm for tin based and germanium-based perovskite respectively.

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Fadil, Nor Akmal, Siti Zahira Yusof, Tuty Asma Abu Bakar, Habibah Ghazali, Muhamad Azizi Mat Yajid, Saliza Azlina Osman, and Ali Ourdjini. "Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish." Materials 14, no. 22 (November 11, 2021): 6817. http://dx.doi.org/10.3390/ma14226817.

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Since the use of the most stable Pb-based materials in the electronic industry has been banned due to human health concerns, numerous research studies have focused on Pb-free materials such as pure tin and its alloys for electronic applications. Pure tin, however, suffers from tin whiskers’ formation, which tends to endanger the efficiency of electronic circuits, and even worse, may cause short circuits to the electronic components. This research aims to investigate the effects of stress on tin whiskers’ formation and growth and the mitigation method for the immersion of the tin surface’s finish deposited on a copper substrate. The coated surface was subjected to external stress by micro-hardness indenters with a 2N load in order to simulate external stress applied to the coating layer, prior to storage in the humidity chamber with environmental conditions of 30 °C/60% RH up to 52 weeks. A nickel underlayer was deposited between the tin surface finish and copper substrate to mitigate the formation and growth of tin whiskers. FESEM was used to observe the whiskers and EDX was used for measuring the chemical composition of the surface finish, tin whiskers, and oxides formed after a certain period of storage. An image analyzer was used to measure the whiskers’ length using the JEDEC Standard (JESD22-A121A). The results showed that the tin whiskers increased directly proportional to the storage time, and they formed and grew longer on the thicker tin coating (2.3 μm) than the thin coating (1.5 μm). This is due to greater internal stress being generated by the thicker intermetallic compounds identified as the Cu5Sn6 phase, formed on a thicker tin coating. In addition, the formation and growth of CuO flowers on the 1.5 μm-thick tin coating suppressed the growth of tin whiskers. However, the addition of external stress by an indentation on the tin coating surface showed that the tin whiskers’ growth discontinued after week 4 in the indented area. Instead, the whiskers that formed were greater and longer at a distance farther from the indented area due to Sn atom migration from a high stress concentration to a lower stress concentration. Nonetheless, the length of the whisker for the indented surface was shorter than the non-indented surface because the whiskers’ growth was suppressed by the formation of CuO flowers. On the other hand, a nickel underlayer successfully mitigated the formation of tin whiskers upon the immersion of a tin surface finish.

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Grabarczyk, Malgorzata, Edyta Wlazlowska, and Marzena Fialek. "Electrochemical Methods for the Analysis of Trace Tin Concentrations—Review." Materials 16, no. 24 (December 7, 2023): 7545. http://dx.doi.org/10.3390/ma16247545.

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Tin determination allows for the monitoring of pollution and assessment of the impact of human activities on the environment. The determination of tin in the environment is crucial for the protection of human health and ecosystems, and for maintaining sustainability. Tin can be released into the environment from various sources, such as industry, transportation, and electronic waste. The concentration of tin in the environment can be determined by different analytical methods, depending on the form of tin present and the purpose of the analysis. The choice of an appropriate method depends on the type of sample, concentration levels, and the available instrumentation. In this paper, we have carried out a literature review of electrochemical methods for the determination of tin. Electrochemical methods of analysis such as polarography, voltammetry, and potentiometry can be used for the determination of tin in various environmental samples, as well as in metal alloys. The detection limits and linearity ranges obtained for the determination of tin by different electrochemical techniques are collected and presented. The influence of the choice of base electrolyte and working electrode on signals is also presented. Practical applications of the developed tin determination methods in analyzing real samples are also summarized.

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Jeon, Il, Kyusun Kim, Efat Jokar, Minjoon Park, Hyung-Woo Lee, and Eric Wei-Guang Diau. "Environmentally Compatible Lead-Free Perovskite Solar Cells and Their Potential as Light Harvesters in Energy Storage Systems." Nanomaterials 11, no. 8 (August 15, 2021): 2066. http://dx.doi.org/10.3390/nano11082066.

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Next-generation renewable energy sources and perovskite solar cells have revolutionised photovoltaics research and the photovoltaic industry. However, the presence of toxic lead in perovskite solar cells hampers their commercialisation. Lead-free tin-based perovskite solar cells are a potential alternative solution to this problem; however, numerous technological issues must be addressed before the efficiency and stability of tin-based perovskite solar cells can match those of lead-based perovskite solar cells. This report summarizes the development of lead-free tin-based perovskite solar cells from their conception to the most recent improvements. Further, the methods by which the issue of the oxidation of tin perovskites has been resolved, thereby enhancing the device performance and stability, are discussed in chronological order. In addition, the potential of lead-free tin-based perovskite solar cells in energy storage systems, that is, when they are integrated with batteries, is examined. Finally, we propose a research direction for tin-based perovskite solar cells in the context of battery applications.

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Lungu, Magdalena Valentina. "An Insight into TiN, TiAlN and AlTiN Hard Coatings for Cutting Tools." Material Science Research India 17, no. 2 (August 30, 2020): 87–89. http://dx.doi.org/10.13005/msri/170202.

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The evolution of the metalworking industry over the centuries was greatly influenced by the development of a large range of cutting tools. Tool surface quality improvement with hard coatings generated considerable progress in the metal cutting industry. Hard coatings were composed mainly of nitrides, carbides, borides, and oxides of transition metals (typically Ti, Cr, Zr).1-5

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Yong, Yen Nie. "From craft to industry and back: transnational efforts in reconstructing tin’s social meaning to the retail consumer (1950s–1960s)." Journal of Historical Research in Marketing 15, no. 2 (August 11, 2023): 121–43. http://dx.doi.org/10.1108/jhrm-11-2022-0033.

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Purpose Commodity histories generally posit colonies’ roles as mere producers but have overlooked their roles in shaping global consumption. This study aims to investigate how Malayan tin producers and British colonial institutions used public relations and advertising strategies as entrepreneurial tools to fend off competition from substitutes amid global economic and geopolitical transitions during the height of the Cold War crisis and post-war boom in the 1950s and 1960s. Design/methodology/approach This study draws on archival research of newspaper reports written in Singapore, the USA and Britain from the inter-war years until the 1960s. It also consults advertisements placed by the Malayan Tin Bureau on Time and Scientific American, data and views on tin scarcity by US congressional reports and commodity trends data published by the US Department of Commerce and the US Department of the Interior. Findings This paper demonstrates how the value of tin is recreated by manipulating its symbolic meanings and embedding them within the national and political contexts of the targeted consumer markets. This creative resistance against tin substitution was enacted through a transnational collaboration among colonial institutions, entrepreneurs in colonies and marketing strategists across geographies and territories. Research implications This paper provokes further reflections on the importance of socially constructed meanings in shaping the market value of a product and the understanding of embedded political value systems in marketing generic commodities. Future research may adopt this perspective to reassess the framing of meanings of commodities in the contemporary setting, especially against rising concerns on the sustainability of mining natural resources, including minerals. Originality This study integrates the perspectives of Malayan tin producers in reframing the meaning of a commodity and so, widens the scope of historical analyses of commodities beyond the industrialized global North. It reassesses how a commodity’s marketing value evolves and interacts with colonial politics. It also highlights the collaborative nature of colonial governments and local producers in developing new uses and representations of a generic commodity to create new markets for its consumption.

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Delhaise, André, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, and Zohreh Bagheri. "Tin Whisker Formation on Small Outline Transistors Assembled Using Bismuth-Containing Lead-Free Solder Alloys After Long-Term Ambient Temperature, High Humidity Storage Part 3: In-Depth Characterization and Mechanisms." Journal of Surface Mount Technology 34, no. 1 (April 5, 2021): 11–23. http://dx.doi.org/10.37665/smt.v34i1.23.

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With the introduction of environmental legislation such as the Restriction of Hazardous Substances (RoHS), lead (Pb)-free materials have made their way into the electronics manufacturing industry. One issue that has emerged is that Pb-free solder alloys can initiate and grow tin whiskers under specific conditions. These whiskers are thin, highly conductive filaments which have the potential to grow and can cause field failures in many applications. Most concerning with respect to tin whiskering are high reliability applications such as aerospace, automotive, and medical. Bismuth (Bi) is being considered for inclusion in solder alloys to replace the current industry standard (SAC 305) and provide improved thermomechanical and vibration reliability. In this paper, we discuss whisker formation of several Bi-bearing alloys after long-term (12,000 hours), ambient high humidity (25°C/85% RH) storage. Three alloys containing Bi, in addition to SAC 305 (Sn-3.0Ag-0.5Cu), were considered. These alloys were Violet (Sn-2.25Ag-0.5Cu-6.0Bi), Sunflower (Sn-0.7Cu-7.0Bi), and Senju (Sn-2.0Ag-0.7Cu-3.0Bi). The boards were fabricated with electroless nickel immersion gold (ENIG) and immersion tin (ImmSn) finishes and populated with parts having Cu and Fe42Ni alloy leads and chip parts, with half of assemblies cleaned and half cleaned and contaminated with low levels of NaCl. This paper is the third in a series of three in which we share more in-depth characterization of features of interest from the small outline transistor (SOT) inspection. Discussion regarding the role of Bi in the overall stress state of the joint will also be provided.

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Gunder, Calbi, Fernando Maia de Oliveira, Emmanuel Wangila, Hryhorii Stanchu, Mohammad Zamani-Alavijeh, Solomon Ojo, Sudip Acharya, et al. "The growth of Ge and direct bandgap Ge_1−xSn_x on GaAs (001) by molecular beam epitaxy." RSC Advances 14, no. 2 (2024): 1250–57. http://dx.doi.org/10.1039/d3ra06774b.

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Germanium tin (GeSn) is a tuneable narrow bandgap material, which has shown remarkable promise for the industry of near- and mid-infrared technologies for high efficiency photodetectors and laser devices.

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Volkov, A. V., and A. L. Galyamov. "Prospects for the development of major tin ore deposits in Chukotka." Arctic: Ecology and Economy 12, no. 2 (June 2022): 224–34. http://dx.doi.org/10.25283/2223-4594-2022-2-224-234.

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Tin is not mined in the Russian Arctic, despite the huge reserves and resources. In the Soviet period, the Arctic provided more than half of the USSR’s production. Currently, almost all tin mining is concentrated in China and other countries of the Asia-Pacific region, which deposits are gradually being depleted. Russia imports most of the tin products needed by the economy. The Arctic tin resources are the largest reserve not only of the domestic, but also of the world economy. Chukotka has significant proven reserves and resources of tin, until the 90s of the last century, tin and tungsten mining occupied leading positions in the region’s economy. Several major tin deposits have been discovered within the district, but have not yet been developed: Pyrkakayskoe, Ekugskoe, Lunnoe and Kukeney. The authors give a brief geological and economic characteristic of the deposits. In addition to tin, from the complex ores of the Chukchi deposits it is possible to mine tungsten, silver, gold, as well as indium, a valuable metal for the high-tech industry. The restoration of tin mining in Chukotka is among the most important tasks in the socioeconomic development of the Arctic, the solution of which will provide Russian consumers with domestic products and completely abandon imports.

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Hashim, Aimi Noorliyana, and Mohd Arif Anuar Mohd Salleh. "Spontaneous Tin (Sn) Whisker Growth from Electroplated Tin and Lead-Free Tin Alloys Coatings: A Short Review." Solid State Phenomena 280 (August 2018): 151–56. http://dx.doi.org/10.4028/www.scientific.net/ssp.280.151.

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Since the environmental regulations of Reduction of Hazardous Substances (RoHS) directive came into effect in Europe and Asia on July 1, 2006, requiring the removal of any lead (Pb) content from the electronics industry, the issue of tin (Sn) whisker growth from pure Sn and SnPb-free alloys has become one of the most imperative issues that need to be resolved. Moreover, with the increasing demand for electronics miniaturization, Sn whisker growth is a severe threat to the reliability of microelectronic devices. Sn whiskers grow spontaneously from an electrodeposited tin coating on a copper substrate at room temperature, which can lead to well-documented system failures in electronics industries. The Sn whisker phenomenon unavoidably gives rise to troubles. This paper briefly reviews to better understand the fundamental properties of Sn whisker growth and at the same time discover the effective mitigation practices for whisker growth in green electronic devices. It is generally accepted that compressive stress generated from the growth of Cu6Sn5 intermetallic compound (IMC) is the primary driving force for Sn whisker growth during room temperature storage. It is, therefore, important to determine that the relationship between IMC growth and Sn whisker growth. Reduction of stress in the IMC layer can therefore reduce the driving force for whisker formation and be used as a means for whisker mitigation. To date, there are no successful methods that can suppress the growth of Sn whisker as efficient as Pb addition. It is hoped that the Sn whisker growth mechanisms are understood better in the future, with better measuring and monitoring methodologies and systems being developed, the real solutions may be eventually developed to eliminate or mitigate the Sn whisker problems of green reliability lead-free electronic assemblies.

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Nugraha, Agung, and Semiarto A. Purwanto. "Neo-Esktraktivisme Tambang Timah di Pulau Bangka." Indonesian Journal of Religion and Society 2, no. 1 (June 6, 2020): 12–22. http://dx.doi.org/10.36256/ijrs.v2i1.95.

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Tin mining on Bangka Island was monopolized by large companies since the colonial period until twenty years ago. Furthermore, illegal tin miners or unconventional mines (tambang inkonvensional or TI) are the main actors in tin exploitation. We conducted research on the network of tin mining actors to explain the social relations, capital, and business of tin miners. Through the case study method, we observed and interviewed our informants during the March-October 2018 period. Within the neo-extractivism framework, we examined that TI players were connected to the mining business supported by global investment through a network of sub-collectors, collectors, and the smelting industry. This network serves to legalize the tin obtained by TI while ensuring the supply of industrial raw materials to support exports. We conclude that there has been a shift from production to distribution sectors. When emphasis on production processes, various institutional decays occur which involve state actors in it. Next, as attention is paid to the distribution chain, a shadow network that hides behind official companies emerges.

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Drown, J. L., S. M. Merchant, M. E. Gross, D. Eaglesham, L. A. Giannuzzi, and R. B. Irwin. "Comparison of Sputtered Titanium Nitride on Silicon Dioxide and Aluminum-Alloy Thin Films." Microscopy and Microanalysis 3, S2 (August 1997): 469–70. http://dx.doi.org/10.1017/s1431927600009235.

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Titanium nitride (TiN) films are used as anti-reflection coatings (ARC) on aluminum (Al) films to facilitate lithography processes during multilevel metallization for the manufacture of integrated circuits on silicon-based (Si) semiconductor devices. It is generally accepted in the literature that the microstructure of multilevel metal stacks is influenced by the texture of the substrate. For the case of interconnect materials used in the semiconductor industry, a typical metal stack is as follows: Titanium/Titanium Nitride/Al-alloy/ARC-Titanium Nitride. The Ti/TiN layer underneath the Al-alloy film is used as a barrier stack to prevent junction spiking. The Ti/TiN underlayer also determines the growth conditions (crystallography and orientation relationships) of the subsequent Al-alloy film.This study focuses on the microstructural characterization of the ARC-TiN layer on Si-oxide and Ti/TiN/Al-alloy substrates that are fabricated under similar conditions using conventional physical vapor deposition (PVD - sputtering) techniques. The ARC-TiN microstructure was investigated by transmission electron microscopy (TEM) using a Philips EM430 operating at 300 kV.

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Anggraini, Zeni, Budi Setiawan, Nazhira Shadrina, and Dadong Iskandar. "Radiological Impact Assessment of Class 3 Landfill of TENORM Waste from Tin Industry in Bangka Island." Environment and Natural Resources Journal 19, no. 5 (June 29, 2021): 337–47. http://dx.doi.org/10.32526/ennrj/19/2021020.

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This study assessed the potential radiological impact of a class 3 landfill as a disposal facility of the final tin slag from the tin industry in Bangka Island. Tin slag that contains TENORM (Technically Enhanced Naturally Occurring Radioactive Material) with activity concentrations above exemption level limits should be stored safely and securely. The radiological impact analysis of storing TENORM waste was carried out before and after the construction of a landfill facility. RESRAD OFFSITE version 3.2 software was used to simulate dose and cancer risk, and analyze the contribution of exposure pathways. Radionuclide concentration, landfill facility specifications, hydrogeological data, climatological data, and food and water consumption data were used as input parameters of RESRAD. The receptor was a resident farmer who lives 100 meters from the facility, grows his own food, and consumes water from his land. The total dose before and after the construction of the landfill were 3.13 mSv/year and 1.84×10-2 mSv/year while cancer risks were 5.69×10-3 and 6.50×10-5, respectively. The exposure pathways from inhalation of radon become a major contributor to dose acceptance and cancer risk. Based on these results, the landfill facility is effective in reducing the potential impact of radiological hazards from dose acceptance and cancer risk.

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Journal articles on the topic 'Tin industry'

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