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Journal articles on the topic 'Thick Copper level'

Author: Grafiati

Published: 4 May 2024

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1

Li, Yi Nan, Z. L. Peng, and J. C. Yan. "GTA Welding of Copper Thick Plates by Using ERCuTi Welding Materials." Materials Science Forum 697-698 (September 2011): 409–13. http://dx.doi.org/10.4028/www.scientific.net/msf.697-698.409.

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The new welding material – ERCuTi alloys filler metals were developed specially for gas tungsten arc welding (GTAW) of copper. The hot cracking in welding copper is inhibited completely as the addition of de-oxidant element Ti in copper welding material. The degree of addition of Ti (2-4wt%) is critical when the susceptibility of cracking is to be suppressed. If the level is allowed to exceed 4wt%, more low-melting point eutectics (β-TiCu4and TiCu2) will be formed in the welds, and cracking susceptibility will be increased again. Results of mechanical properties tests show that although adding

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2

Hosseini, Vahid A., Kristina Lindgren, Mattias Thuvander, Daniel Gonzalez, James Oliver, and Leif Karlsson. "Nanoscale phase separations in as-fabricated thick super duplex stainless steels." Journal of Materials Science 56, no. 21 (2021): 12475–85. http://dx.doi.org/10.1007/s10853-021-06056-0.

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AbstractNanoscale phase separations, and effects of these, were studied for thick super duplex stainless steel products by atom probe tomography and mechanical testing. Although nanoscale phase separations typically occur during long-time service at intermediate temperatures (300–500° C, our results show that slowly cooled products start to develop Fe and Cr separation and/or precipitation of Cu-rich particles already during fabrication. Copper significantly slowed down the kinetics at the expense of Cu-rich particle precipitation, where the high-copper material subjected to hot isostatic pres

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Loquet, Yannick, Cedric Perrot, Pierre Bouillon, and Blaise Iteprat. "Chemical-Mechanical Planarization Compatible for Both Copper/Low k Level in a 90 nm Technology and Thick Copper Level in an RF Technology." ECS Transactions 3, no. 41 (2019): 1–8. http://dx.doi.org/10.1149/1.2819476.

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4

Richard, Claire Therese, M. M. Frank, Pascal Besson, et al. "Barrier and Copper Seedlayer Wet Etching." Solid State Phenomena 103-104 (April 2005): 361–64. http://dx.doi.org/10.4028/www.scientific.net/ssp.103-104.361.

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This paper summarizes the process development of TiN barrier etching in presence of copper, for a thick copper level in BICMOS technology. In an industrial context, we have chosen to use a SC1 chemistry in a spin etch single wafer tool. The SC1 composition and therefore the pH level allows - the barrier to be etched with no metallic residues, ( if not clear this can be a source for shorts) - control of the selectivity between copper and TiN - control of lateral etching under copper lines, the possible source of open chains by W attack during TiN etch. The electrical results show a robust proce

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Lee, Suhyun, Chien Wern, and Sung Yi. "Novel Fabrication of Silver-Coated Copper Nanowires with Organic Compound Solution." Materials 15, no. 3 (2022): 1135. http://dx.doi.org/10.3390/ma15031135.

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Copper nanowires and Cu-Ag nanowires have various potential applications, such as transparent conductive film, flexible electronics, and conductive filler. In this study, we developed a new green fabrication method for silver-coated copper nanowires using methylsulfonylmethane (DMSO2), which is an environmentally friendly chemical at the food-grade level, to replace toxic chemicals, including ammonia, in the silver coating process. Copper nanowires were synthesized under various reaction temperatures and concentrations of hydrazine (N2H4), ethylenediamine (EDA), sodium hydroxide (NaOH), and co

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Aoh, Jong Ning, Chih Wei Huang, and Wei Ju Cheng. "Fabrication of Al6061-AMC by Adding Copper-Coated SiC Reinforcement by Friction Stir Processing (FSP)." Materials Science Forum 783-786 (May 2014): 1721–28. http://dx.doi.org/10.4028/www.scientific.net/msf.783-786.1721.

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Friction stir processing (FSP) has successfully evolved as a technique in fabricating surface composite. An alternative technique on fabrication of a SiC-reinforced Al6061 aluminum matrix composite (AMC) by stirring copper-coated SiC particles into matrix to form a reinforced zone was developed. Copper film was deposited onto the SiC particles by electroless plating and by photodeposition processes. The copper coating serves as an adhesion and diffusion layer to enhance the cohesion between the particles and the matrix. It is to expect that the strength of the AMC could be improved. The unifor

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7

Gorbatyuk, S. M., A. A. Gerasimova, and N. N. Belkina. "Applying Thermal Coatings to Narrow Walls of the Continuous-Casting Molds." Materials Science Forum 870 (September 2016): 564–67. http://dx.doi.org/10.4028/www.scientific.net/msf.870.564.

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Studies on enhancing the service life of continuous casting moulds at their narrow walls of copper M1 before the last repair by means of a heat spraying wear-resistant layer of the chrome-nickel coating have been carried out. Preliminary, the coating`s structure, phase composition, skin hardness and microhardness of chromium-nickel coating were studied. It is established that to obtain the required cleanliness level of the wall surface by making use of their mechanical operation, it is necessary to conduct thickness of the chromium-nickel coating operations. 0.5 – 0.6 mm chrome-nickel thermal

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Mantatova, N. V., Chuluunbatyn Oyuuntsetseg, and S. Ye Sanzhiyeva. "TRACE ELEMENT CONTENT IN BLOOD OF CATTLE WITH ALIMENTARY ANEMIA AND HYPOCUPROSIS, AND IN SOIL SAMPLES OF THE TÖV AIMAG OF MONGOLIAAND THE KYAKHTINSKY DISTRICT OF THE REPUBLIC OF BURYATIA." Vestnik Altajskogo gosudarstvennogo agrarnogo universiteta, no. 8 (2021): 61–66. http://dx.doi.org/10.53083/1996-4277-2021-202-08-61-66.

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This paper discusses the results of laboratory tests of biochemical indices of blood serum (copper, iron, protein, albumin, urea, glucose, and alkaline reserve) of cattle of Mongolian and Kalmyk breeds with alimentary anemia and hypocuprosis; the paper also discusses the findings of the comparative study of trace element composition (copper, zinc, cobalt, nickel, molybdenum, strontium, iron, and man-ganese) of the soils of the Töv Aimag of Mongolia and the Kyakhtinsky District of the Republic of Buryatia. The disor-ders of mineral metabolism in animals of Mongolian and Kalmyk breeds with clini

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Prem Kumar, T., V. Muthupriya, A. Antony Christian Rajaa, R. Sasirekab, and R. Sumanc. "World Best Level Efficiency from An Engineered Novel SLG/Mo/p-Cu2ZnSn(Al)Se4/n-CdS/i-ZnO/Al:ZnO/Al Compound Semiconductor Hetero-Junction Thin Film Solar Cells." Shanlax International Journal of Arts, Science and Humanities 9, S1-May (2022): 41–46. http://dx.doi.org/10.34293/sijash.v9is1-may.5942.

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Molybdenum (Mo) metal seed layer deposited on soda lime glass (SLG) substrate and then Mo thick metal layer deposited on Mo seed layer. Then the Copper zinc tin aluminum selenide p-Cu2ZnSn(Al)Se4 (CZTAS) thin film was fabricated on molybdenum (Mo) thin film layer. For making p-n junction a n-CdS thin films fabricated on p-CZTAS layer using chemical bath deposition method. The surface morphology of total device structure was investigated by Scanning electron microscopy (SEM). The observed world best level efficiency and its note worthy results are presented and discussed in this research work.

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Schmidt, Ralf, Jens Palm, and Jan M. Knaup. "The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging." International Symposium on Microelectronics 2021, no. 1 (2021): 000142–48. http://dx.doi.org/10.4071/1085-8024-2021.1.000142.

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Abstract Heterogeneous integration is considered as the key technology to create large, complex System in Package (SiP) assemblies of separately manufactured, smaller components. Proper control of the uniformity of each process step constitutes one of the main challenges during integration of the different components into a higher-level assembly. In this context, processes that create thick layers by electrochemical deposition are especially susceptible to variations across the substrate. Such processes include copper pillar and bump as well as tin-silver applications. Insufficient coplanarity

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11

Vityaz, S. N. "Phytoremediation Potential of Flowering Plants in Relation to Copper." Bioscience Biotechnology Research Communications 14, no. 4 (2021): 1786–92. http://dx.doi.org/10.21786/bbrc/14.4.60.

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Heavy metals such as cadmium, chromium, nickel, mercury, lead, copper, zinc and others are among the priority environmental pollutants. Determination of their content in its main subsystems is an obligatory component in environmental monitoring and certification of agricultural products. On the other hand, all metals are natural components of soil-forming rocks, and some metals are classified as biogenic microelements, and their absence provokes functional disorders in living organisms. This article describes the results of studying the phytoremediation potential of flowering plants in relatio

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Rydosz, Artur, Katarzyna Dyndał, Wojciech Andrysiewicz, Dominik Grochala, and Konstanty Marszałek. "GLAD Magnetron Sputtered Ultra-Thin Copper Oxide Films for Gas-Sensing Application." Coatings 10, no. 4 (2020): 378. http://dx.doi.org/10.3390/coatings10040378.

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Copper oxide (CuO) ultra-thin films were obtained using magnetron sputtering technology with glancing angle deposition technique (GLAD) in a reactive mode by sputtering copper target in pure argon. The substrate tilt angle varied from 45 to 85° and 0°, and the sample rotation at a speed of 20 rpm was stabilized by the GLAD manipulator. After deposition, the films were annealed at 400 °C/4 h in air. The CuO ultra-thin film structure, morphology, and optical properties were assessed by X-ray diffraction (XRD), energy-dispersive X-ray spectroscopy (EDX), X-ray reflectivity (XRR), and optical spec

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13

Mironovs, Viktors, Alexey Tatarinov, Ervins Blumbergs, and Irina Boiko. "Investigation of Properties of Coated Hollow Mini-Spheres." Key Engineering Materials 799 (April 2019): 26–30. http://dx.doi.org/10.4028/www.scientific.net/kem.799.26.

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Metal hollow mini-spheres (MHMS) present a basis for the creation of new structured materials due to their low weight and energy adsorption capacity. Typically, MHMS are made of steel with a high level porosity in the sphere’s wall 80-110 microns thick. Modification of the outer surface by copper coating of 20-30 microns imposed by vacuum sputtering provides several times higher electrical conductivity, lower porosity of the outer layer and smoother surface, preserving light weight and flotation properties. This modification will provide better possibilities for spheres’ consolidation by means

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14

Lee, Seong Hee, Seung Zeon Han, and Cha Yong Lim. "Nano-Structured High Purity Copper Processed by Accumulative Roll-Bonding." Key Engineering Materials 317-318 (August 2006): 239–42. http://dx.doi.org/10.4028/www.scientific.net/kem.317-318.239.

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Accumulative roll-bonding (ARB) process was applied to an oxygen free copper for improvement of the mechanical properties via ultra grain refinement to nanometer order level. Two copper sheets 1mm thick, 30mm wide and 300mm long are degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and cold-roll-bonded by 50% reduction rolling. The sheet is then cut to the two pieces of same length and the same procedure was repeated to the sheets. The ARB process up to eight cycles (an equivalent thickness strain of 6.4) is successfully performed at ambient temperature.

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15

Vanstreels, K., S. H. Brongersma, Zs Tokei, et al. "Increasing the mean grain size in copper films and features." Journal of Materials Research 23, no. 3 (2008): 642–62. http://dx.doi.org/10.1557/jmr.2008.0080.

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A new grain-growth mode is observed in thick sputtered copper films. This new grain-growth mode, also referred to in this work as super secondary grain growth (SSGG) leads to highly concentric grain growth with grain diameters of many tens of micrometers, and drives the system toward a {100} texture. The appearance, growth dynamics, final grain size, and self-annealing time of this new grain-growth mode strongly depends on the applied bias voltage during deposition of these sputtered films, the film thickness, the post-deposition annealing temperature, and the properties of the copper diffusio

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16

Tivol, W. F., and J. R. Fryer. "Electron diffraction of copper perfluorophthalocyanine on the HVEM." Proceedings, annual meeting, Electron Microscopy Society of America 53 (August 13, 1995): 158–59. http://dx.doi.org/10.1017/s0424820100137161.

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The use of high-energy (1200 kV) electrons has been shown to be advantageous in the ab initio structure analysis from electron diffraction of organic compounds. Previous studies showed that ab initio analysis of copper perchlorophthalocyanine could be accomplished at accelerating voltages at or above 1000 kV, but not at 400 kV for crystals which are about 10 nm thick. Copper perbromophthalocyanine could also be analyzed ab initio at 1200 kV, but the presence of severe dynamical scattering precluded such analysis at lower voltages.Copper perfluorophthalocyanine (Cu FPC) was grown epitaxially fr

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17

Song, Jian, Songsong Yao, Quan Li, et al. "Reorientation Mechanisms of Graphene Coated Copper {001} Surfaces." Metals 13, no. 5 (2023): 910. http://dx.doi.org/10.3390/met13050910.

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Engineering the surface orientation of face-centered cubic (fcc) metals to the close-packed {111} plane can significantly enhance their oxidation resistance. However, owing to the synergetic effect of surface energy density (γ˙) and strain energy density (ω), such close-packed surface orientation can currently only be achieved by atomic-level thin film epitaxy or monocrystallization of polycrystalline metals. In this study, we characterized the microstructures of pure copper (Cu) foil and two types of graphene-coated Cu (Gr/Cu) foils and observed a 12~14 nm thick reconstructed surface layer wi

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18

Skrynnikov, Alexander A., Anastasia I. Fedoseeva, Natalia B. Morozova, Alexey I. Dontsov, Aleksander V. Vvedenskii, and Oleg A. Kozaderov. "Pd–Pb nanoscale films as surface modifiers of Pd,Cu alloy membranes used for hydrogen ultrapurification." Kondensirovannye sredy i mezhfaznye granitsy = Condensed Matter and Interphases 23, no. 4 (2021): 561–69. http://dx.doi.org/10.17308/kcmf.2021.23/3675.

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The purpose of the article is to reveal the role of the thickness of the layer of the lead-palladium alloy deposited on a copper-palladium membrane in the processes of cathodic injection and the anodic extraction of atomic hydrogen.The objects of the study were ~ 4 μm thick copper-palladium film electrodes obtained by magnetron sputtering of a target with a composition of 56 at. % Cu and 44 at. % Pd. The studies were carried out by cyclic voltammetry and double step anodic-cathodic chronoamperometry in a deaerated 0.1 М H2SO4 aqueous solution. The calculation of the parameters of hydrogen perm

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19

Anderson, Ron, John Benedict, and Stanley J. Klepeis. "TEM microstructure of laser-trimmed Si-Cr devices." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 470–71. http://dx.doi.org/10.1017/s0424820100154329.

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Laser ablation adjustment of resistance values of resistors Incorporated within integrated circuits is common practice. We analyzed cross-section and plan-view Si-Cr laser ablated resistors in actual devices. Resistors were prepared as follows: nominally 500Å Si-Cr films were deposited on 2nd level quartz, patterned and then covered with 3rd level quartz. Oxygen was bled into the sputtering chamber during the Si-Cr deposition. No special heat-treatment was given to the Si-Cr resistors, but they did see 5-hours at 450C during the 3rd level quartz sputter. The resistors were contacted by 2-micro

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20

Lakhera, Nishant, Emmanuel Labroye, Catherine Pronga, Florence Molinie, and Samuel Lesnakowski. "Reliability of Heavy Gage Aluminum Wire-bonds under High Temperature Aging." International Symposium on Microelectronics 2016, no. 1 (2016): 000234–39. http://dx.doi.org/10.4071/isom-2016-wa54.

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Abstract Thick aluminum (Al) wedge bonds have been widely used in analog microelectronic packages due their lower cost, ease of use and excellent thermal and electrical performance. Reliability of thick Al wedge bonds on bare copper (Cu) leadframes under high temperature aging conditions has not been studied at a fundamental level in the past. This study investigates the reliability performance of Al wedge bonds on bare Cu surfaces under isothermal aging conditions specified by the automotive grade product qualification requirements. Results obtained show that Al/Cu intermetallic formed at the

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Gernhardt, Robert, Friedrich Müller, Markus Woehrmann та ін. "Ultra-fine Line Multi-Redistribution Layers with 10 μm Pitch Micro-Vias for Wafer Level and Panel Level Packaging realized by an innovative Excimer Laser Dual Damascene Process". International Symposium on Microelectronics 2017, № 1 (2017): 000120–25. http://dx.doi.org/10.4071/isom-2017-tp45_130.

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Abstract Multi-chip integrated Fan-Out packages and high I/O CSPs demands for higher routing density on wafer level. Due to that, the classical mask aligner lithography and photosensitive thin-film polymers used for BEOL reach its limits and new technologies and materials are necessary to generate lines and space down to two μm. These multi-metal layers set also higher demands on the mechanical properties of the materials. This paper presents a new excimer laser dual damascene process for ultra-fine routing for BEOL. Various materials like low cure temperature polyimide, BCB and 15-μm thick dr

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22

Fukunaka, Yasuhiro. "(Invited) Gravitational Level Effects on Electrochemical Interfacial Phenomena." ECS Meeting Abstracts MA2023-02, no. 66 (2023): 3196. http://dx.doi.org/10.1149/ma2023-02663196mtgabs.

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Electrochemical copper refining technology invented in Niagara area made a great progress over more than 100 years through better understanding of natural convection phenomena. Ionic mass-transfer rate enhanced by natural convection developing along 1m high vertical electrode surfaces has been unconsciously utilized by trial-and-error method. As the local electrolyte composition is partly stratified in an electrolytic cell (roughly 5m long x 1.3m wide x 1.3m depth). The industrial electrolytic tank house is composed of about 1000 cells through which the electrolyte is continuously supplied. Th

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Boettcher, Lars, D. Manessis, S. Karaszkiewicz, A. Ostmann, and H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies." Journal of Microelectronics and Electronic Packaging 7, no. 3 (2010): 131–37. http://dx.doi.org/10.4071/imaps.261.

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The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and thereby the third dimension will be available for further layers or assemblies. This paper will briefly discuss the necessary process steps of the embedded chip technology and more importantly it will focus on new efforts to actually use chip embedding concepts for the realization of standard-type industrial quad flat packages with embedded chips (embe

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24

Levson, Victor M. "Quaternary geology of the Babine porphyry copper district: implications for geochemical exploration." Canadian Journal of Earth Sciences 38, no. 4 (2001): 733–49. http://dx.doi.org/10.1139/e00-102.

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The Quaternary stratigraphy of the Babine Lake region is characterized by a Late Wisconsinan succession of advance-phase glaciolacustrine sediments, glaciofluvial deposits, and till. Pollen data from a rare new interglacial site suggest a colder than present Middle Wisconsinan climate. Ice flow during the last glaciation was dominantly southeasterly, but in the Babine Range a regional, westerly ice-flow event occurred. Evidence for westerly flow diminishes eastward of Babine Lake, suggesting that the valley was near the eastward limit of an interior ice divide. Deglacial sediments include ice-

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25

Lee, Chang-Chun, and Jing-Yan He. "Interactive Field Effect of Atomic Bonding Forces on the Equivalent Elastic Modulus Estimation of Micro-Level Single-Crystal Copper by Utilizing Atomistic-Continuum Finite Element Simulation." Molecules 25, no. 21 (2020): 5107. http://dx.doi.org/10.3390/molecules25215107.

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This study uses the finite element analysis (FEA)-based atomistic-continuum method (ACM) combined with the Morse potential of metals to determine the effects of the elastic modulus (E) of a given example on atomic-level single-crystal copper (Cu). This work aims to overcome the estimated drawback of a molecular dynamic calculation applied to the mechanical response of macro in-plane-sized and atomic-level-thick metal-based surface coatings. The interactive energy of two Cu atoms within a face-centered metal lattice was described by a mechanical response of spring stiffness. Compared with the t

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Boettcher, Lars, S. Karaszkiewicz, D. Manessis, and A. Ostmann. "Development of Embedded High Power Electronics Modules for Automotive Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001717–43. http://dx.doi.org/10.4071/2013dpc-wp35.

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The automotive industry has a strong demand for highly reliable and cost-efficient electronics. Especially the upcoming generations of hybrid cars and fully electrical vehicles need compact and efficient 400 V power modules. Within the engine compartment installation space is of major concern. Therefore small size and high integration level of the modules are needed. Conventionally IGBTs and diodes are soldered to DCB (Direct Copper Bond) ceramics substrates and their top contacts are connected by heavy Al wire bonds. These ceramic modules are vacuum soldered to water-cooled base plates. Embed

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Sergeev, N. N., A. N. Sergeev, S. N. Kutepov, A. E. Gvozdev, E. V. Ageev, and D. S. Klement'yev. "APPLICATION OF TECHNOLOGY IN THE PRODUCTION OF «CORTICAL» METHOD OF FORMING INSERTS FOR DIE CASTING COPPER ALLOYS." Proceedings of the Southwest State University 22, no. 3 (2018): 67–83. http://dx.doi.org/10.21869/2223-1560-2018-22-3-67-83.

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In the present work for the creation of manufacturing technology forming statok higher heat resistance used the "cortical" method with the use of thermal spraying (TS). The essence of the method is as follows: on the model, which is a mirror copy of the forming surface of the insert, a working layer up to 3 mm thick of wear-resistant powder materials is applied by plasma spraying, and then a structural layer 10...20 mm thick of more plastic and cheap materials. The dusty "crust" process from which it will be established in a form holder, and separate from model. Working surface FV after separa

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Boettcher, Lars, A. Ostmann, D. Manessis, S. Karaszkiewicz, and H. Reichl. "Next Generation System in a Package Manufacturing by Embedded Chip Technologies." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (2010): 002075–103. http://dx.doi.org/10.4071/2010dpc-tha13.

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The embedding of active and passive components offers a wide range of benefits and potentials. With the use of laminate based technology concepts, components can be moved from surface mount into the build-up layers of substrates by embedding and by that, the third dimension will be available for further layers or assemblies. This paper will briefly discuss the necessary process steps of the embedded chip technology and more importantly it will focus on new efforts to actually use chip embedding concepts for the realization of standard-type industrial Quad Flat Packages with embedded chips (emb

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Zhai, Yu, Ding Xu, and Yan Zhang. "Ka-Band Lightweight High-Efficiency Wideband 3D Printed Reflector Antenna." International Journal of Antennas and Propagation 2017 (2017): 1–7. http://dx.doi.org/10.1155/2017/7360329.

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This paper presents a lightweight, cost-efficient, wideband, and high-gain 3D printed parabolic reflector antenna in the Ka-band. A 10 λ reflector is printed with polylactic acid- (PLA-) based material that is a biodegradable type of plastic, preferred in 3D printing. The reflecting surface is made up of multiple stacked layers of copper tape, thick enough to function as a reflecting surface (which is found 4 mm). A conical horn is used for the incident field. A center-fed method has been used to converge the energy in the broadside direction. The proposed antenna results measured a gain of 27

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Kotliarenko, Alisa, Oscar Azzolini, Giorgio Keppel, Cristian Pira, and Juan Esposito. "Investigation of a Possible Material-Saving Approach of Sputtering Techniques for Radiopharmaceutical Target Production." Applied Sciences 11, no. 19 (2021): 9219. http://dx.doi.org/10.3390/app11199219.

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Magnetron sputtering (MS) is a relatively new deposition technique, which is being considered among the cyclotron solid target (CST) manufacturing options now available, aiming at the medical radioisotopes yield for radiopharmaceutical production. However, the intrinsic high material losses during the deposition process do not permit its use with extremely expensive target materials, such as isotopically enriched metals/oxides. In this study, R&D technology for a new recovering shield is instead proposed to assess the dissipation of target material during the sputtering processes and, thus

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Emon, Sharmin Zaman, Anowara Begum, Md Latiful Bari, and K. Siddique e. Rabbani. "In-vitro inactivation of Escherichia coli of surface water using metals." Bangladesh Journal of Microbiology 39, no. 2 (2023): 54–59. http://dx.doi.org/10.3329/bjm.v39i2.66265.

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Technology for providing clean drinking water to remote areas of low-resource nations remains a significant challenge for human life The study aimed to develop a simple technology for rural households that might be adopted to utilize the bactericidal properties of metals. Three thick metal sheets made of copper, zinc, and brass (an alloy of copper and zinc) were used in this study work. These metallic sheets were placed in three plastic (polythene) containers with base areas 11cm x 7cm each so that the metallic sheets covered the entire base areas of the respective containers. Fifty ml, one hu

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Welker, T., S. Günschmann, N. Gutzeit, and J. Müller. "Integration of Silver Heat Spreaders in LTCC utilizing Thick Silver Tape in the Co-fire Process." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, CICMT (2015): 000062–66. http://dx.doi.org/10.4071/cicmt-tp13.

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The integration density in semiconductor devices is significantly increased in the last years. This trend is already described by Moore's law what forecasts a doubling of the integration density every two years. This evolution makes greater demands on the substrate technology which is used for the first level interconnect between the semiconductor and the device package. Higher pattern resolution is required to connect more functions on a smaller chip. Also the thermal performance of the substrate is a crucial issue. The increased integration density leads to an increased power density, what m

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MOURIER, Thierry, Stephane Minoret, Sabrina Fadloun, et al. "Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (2013): 001322–42. http://dx.doi.org/10.4071/2013dpc-wp12.

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In recent years, 3D integration has become an alternative solution to the “More Moore” concept for providing circuits with higher performance or increased functionality. Via-Middle TSV is considered a reference integration scheme and requires void-free copper fill of very high aspect ratio TSVs. Metallization of such structures, in particular barrier and seed layer deposition, becomes a critical process step as barrier material to copper diffusion must provide good efficiency to copper diffusion for further integration and especially on TSV sidewalls, requiring sufficient step coverage. Ionize

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Hofmann, Christian, Maulik Satwara, Martin Kroll, et al. "Localized Induction Heating of Cu-Sn Layers for Rapid Solid-Liquid Interdiffusion Bonding Based on Miniaturized Coils." Micromachines 13, no. 8 (2022): 1307. http://dx.doi.org/10.3390/mi13081307.

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Considering the demand for low temperature bonding in 3D integration and packaging of microelectronic or micromechanical components, this paper presents the development and application of an innovative inductive heating system using micro coils for rapid Cu-Sn solid-liquid interdiffusion (SLID) bonding at chip-level. The design and optimization of the micro coil as well as the analysis of the heating process were carried out by means of finite element method (FEM). The micro coil is a composite material of an aluminum nitride (AlN) carrier substrate and embedded metallic coil conductors. The c

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Birsan, D. C., and G. Simion. "Numerical Modelling of Thermo-Mechanical Effects Developed in Resistance Spot Welding of E304 Steel with Copper Interlayer." Annals of Dunarea de Jos University of Galati. Fascicle XII, Welding Equipment and Technology 33 (December 15, 2022): 89–94. http://dx.doi.org/10.35219/awet.2022.07.

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Resistance spot welding is a technique applied to join two or more similar or dissimilar metals, by applying pressure and electric current to the spot-weld area. Based on the electrical resistance property of metals, a great amount of heat is generated and used to carry out materials joints, by creating a molten metal nucleus between the components to be welded. The influence of an interlayer material, positioned between the parent materials, on the strength of similar or dissimilar welded joints was studied by researchers worldwide. In most cases, by optimising the process parameters, an incr

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Wentlent, Luke A., James Wilcox, and Mohammed Genanu. "Applicability of Selective Laser Reflow for Thin Die Stacking." International Symposium on Microelectronics 2018, no. 1 (2018): 000741–47. http://dx.doi.org/10.4071/2380-4505-2018.1.000741.

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Abstract A 3-D packaging approach such as die stacking is an attractive way to package greater functionality and performance into a smaller footprint, often at a reduced overall product cost. Achieving such 3-D integration can however place significant demands on the manufacturing process, often requiring substantial production expense to bond multiple die in a sequential manner. One alternative, potentially offering significant throughput, is the use of selective laser reflow to bond stacked die. This process produces a localized heating of the stacked die sufficient to produce soldered inter

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Chen, Scott, Simon Wang, Coltrane Lee, and John Hunt. "Low Cost Chip Last Fanout Package using Coreless Substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, DPC (2015): 000272–300. http://dx.doi.org/10.4071/2015dpc-ta24.

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Smart phones & other portable devices have dominated Semiconductor growth, and drive IC packages smaller, lighter & thinner, but at the same time they continue to integrate more functions in that smaller volume. Besides SOC solutions driven by design houses or system companies, we have seen more packages of Quad Flat Non-lead (QFN), wafer level CSP (WLCSP), fan out WLCSP (FOWLP) and system in package (SIP) being widely used in these smart phones & mobile devices. Two factors have driven a new package technology within the last 10 years. One is the advancing technology nodes which a

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Chang, Y. J., and D. Kuhlmann-Wilsdorf. "Effects of Ambient Gases on Friction and Interfacial Resistance." Journal of Tribology 110, no. 3 (1988): 508–15. http://dx.doi.org/10.1115/1.3261660.

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As is well known, ambient atmospheres can greatly affect the friction and wear behavior of metals sliding on each other, as well as the electric contact resistance between the metals. In order to better understand the mechanisms of those effects of ambient atmospheres, the coefficient of friction and the electric contact resistance have been studied for bundles of 50 micrometer thick copper wires, sliding on a polished copper surface in a specialized apparatus, called the hoop apparatus. The ambient gas was cycled between laboratory air and carbon dioxide, and between laboratory air and argon,

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Pollard, Kimberly D., Nichelle Gilbert, Don Pfettscher, and Spencer Hochstetler. "Proven Cleaning Technology Solutions for Lead-Free Micro-Bumping Processes." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (2012): 002399–427. http://dx.doi.org/10.4071/2012dpc-tha24.

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Opportunities for developing new and enabling packaging schemes are being pursued as part of device improvement strategies for electronic products. Processes such as embedded technologies in wafer level packaging and 3-D chip architecture schemes open up opportunities for realization of a variety of package configurations. As a result, there are many opportunities to impact both device performance and the processes used to create them. In the area of electroplated solder application, one area of growing interest is cleaning technology. There is a need for an integrated process to fabricate def

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40

Popov, Petko, Tudor Berza, Alexander Grubic, and Dumitru Ioane. "Late Cretaceous Apuseni-Banat-Timok-Srednogorie (ABTS) magmatic and metallogenic belt in the Carpathian-Balkan orogen." Geologica Balcanica 32, no. 2-4 (2002): 145–63. http://dx.doi.org/10.52321/geolbalc.32.2-4.145.

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The Apuseni-Banat-Timok-Srednogorie (ABTS) Magmatic and Metallogenic Belt can be traced from the Apuseni Mountains in the north, through the western part of the South Carpathians (Banat) in Romania, the Timok region in East Serbia, the Srednogorie zone (Bulgaria) and continues in Turkey through the Black Sea. The basement belongs to the southern margin of the European continent. The ABTS Belt is unconformly superimposed on older structures, including the Early Cretaceous ones. Furthermore, it crosses the Vardar ophiolite suture in the Mures and Voevodina regions. These facts indicate a new sta

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Wojcik, Mariusz, Dariusz Witek, Tomasz Klej, and Edward Ramotowski. "Embedding components in voltage converter PCB for size reduction and heat management." Circuit World 42, no. 1 (2016): 17–22. http://dx.doi.org/10.1108/cw-10-2015-0048.

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Purpose – The purpose of this paper was to show physical limitation of embedding standard packaging components into printed circuit board (PCB) which is more reasonable technology for small series productions which is popular in industrial products. Embedding electronic components inside a PCB FR-4 substrate leads to significant size reduction and better heat management. Embedded chip technology is already known in many consumer electronics applications, but it is focused on high volumes and required to order components ready to be embedded. Design/methodology/approach – Highly integrated DC/D

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Mathew, Varughese, Sheila Chopin, Oliver Chyan, Nick Ross, Alex Lambert, and Muthappan Asokan. "Aluminum bond pad corrosion of wirebond packages." International Symposium on Microelectronics 2016, no. 1 (2016): 000227–33. http://dx.doi.org/10.4071/isom-2016-wa53.

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Abstract Corrosion of aluminum bond pads in wirebonded packages can lead to device reliability issues under the harsh conditions in automotive applications. Corroded Al (aluminum) surface forms a mud-crack type appearance with a relatively very thick aluminum oxide/hydroxide (&gt; 0.1μm) compared to thin protective native aluminum oxide (&lt; 7nm). Various factors contributing to the formation of mud-crack type corrosion are identified. In all cases of mud-crack corrosion observed for packaged devices, Cl (chlorine) was detected on the corroded Al pad. The corrosive impact of high leve

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Willan, Robert C. R. "Structural setting and timing of hydrothermal veins and breccias on Hurd Peninsula, South Shetland Islands: a possible volcanic-related epithermal system in deformed turbidites." Geological Magazine 131, no. 4 (1994): 465–83. http://dx.doi.org/10.1017/s0016756800012103.

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AbstractQuartz veins and vein-breccias in a greywacke-shale sequence of ?Carboniferous-Triassic age were previously regarded as mesothermal silicified fault breccias, and related to an adjacent Eocene granodiorite pluton. New mapping of vein assemblages and textures, and their structural and cross-cutting relationships, demonstrates that the steeply dipping, sheeted, epithermal-textured vein array was hydraulic in origin and possibly Cretaceous in age. The main vein and breccia swarm trends for 14 km NNE along-strike and 2 km across-strike, cutting large irregular areas of silicified and brecc

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Langer, Gregor, Markus Leitgeb, Johann Nicolics, Michael Unger, Hans Hoschopf, and Franz P. Wenzl. "Advanced Thermal Management Solutions on PCBs for High Power Applications." Journal of Microelectronics and Electronic Packaging 11, no. 3 (2014): 104–14. http://dx.doi.org/10.4071/imaps.422.

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With increasing power loss of electrical components, thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to rapid advances in semiconductor technology, particularly in the field of high-power components, the temperature distribution inside of a component is a critical parameter of long-term reliability and must be carefully considered during the design phase. Two main drivers in the electronics industry are miniaturization and reliability. Whereas there is a continuous improvement concerning miniaturization of conductor trac

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Chen, Scott, Simon Wang, Coltrane Lee, Adren Hsieh, John Hunt, and William Chen. "Chip Last Fan Out as an Alternative to Chip First." International Symposium on Microelectronics 2015, no. 1 (2015): 000245–50. http://dx.doi.org/10.4071/isom-2015-wa33.

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Smart phones & other portable devices have dominated Semiconductor growth, and drive IC packages smaller, lighter & thinner, and they continue to integrate more functions in that smaller volume. Besides SOC solutions driven by design houses or system companies, we have seen more packages of Quad Flat Non-lead (QFN), wafer level CSP (WLCSP), and system in package (SIP) being widely used in these smart phones & mobile devices.. Fan out WLCSP (FOWLP) has great potential to be the next new package for the smart phone mobility application. Two factors have driven fan out WLCSP (FOWLP) p

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Panaskar, Nitin, and Ravi Prakash Terkar. "Optimization of friction stir welding process parameters for AA6063-ETP copper using central composite design." World Journal of Engineering 17, no. 4 (2020): 491–507. http://dx.doi.org/10.1108/wje-11-2019-0322.

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Purpose Recently, several studies have been performed on lap welding of aluminum and copper using friction stir welding (FSW). The formation of intermetallic compounds at the weld interface hampers the weld quality. The use of an intermediate layer of a compatible material during welding reduces the formation of intermetallic compounds. The purpose of this paper is to optimize the FSW process parameters for AA6063-ETP copper weld, using a compatible zinc intermediate filler metal. Design/methodology/approach In the present study, a three-level, three-factor central composite design (CCD) has b

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47

Mathew, Varughese, and Sheila Chopin. "Corrosion reliability of copper wirebond (CuWB) packages-Impact of voltage and corrosive ions from packaging materials." International Symposium on Microelectronics 2015, no. 1 (2015): 000286–91. http://dx.doi.org/10.4071/isom-2015-wa51.

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Reliability of electronic devices used in extreme and harsh conditions such as in automotive applications is often associated with prevention of corrosion at the interfaces of dissimilar interconnect metals and of metal (Al or Cu) bonding pads. Packaging materials, especially molding compounds, contain several ionic components and can uptake certain level of moisture to provide electrolytic conditions to initiate corrosion processes. Probability of occurrence of corrosion in devices with high voltage applications is of special interest as many analog devices operates at higher voltages and wit

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48

Burrows, David R., Michael Rennison, David Burt, and Rod Davies. "The Onto Cu-Au Discovery, Eastern Sumbawa, Indonesia: A Large, Middle Pleistocene Lithocap-Hosted High-Sulfidation Covellite-Pyrite Porphyry Deposit." Economic Geology 115, no. 7 (2020): 1385–412. http://dx.doi.org/10.5382/econgeo.4766.

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Abstract In 2013, a diamond drill program tested an extensive advanced argillic alteration lithocap within the Hu’u project on eastern Sumbawa Island, Indonesia. A very large and blind copper-gold deposit (Onto) was discovered, in which copper occurs largely as disseminated covellite with pyrite, and as pyrite-covellite veinlets in a tabular block measuring at least 1.5 × 1 km, with a vertical thickness of ≥1 km. Copper and gold are spatially related with a series of coalesced porphyry stocks that intrude a polymictic diatreme breccia capped by a sequence of intramaar laminated siltstones, vol

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Gupta, Atul, Eric Snyder, Christiane Gottschalke, et al. "First Demonstration of Fine Line RDL Yield Enhancement using an Innovative Ozone Treatment Process for Panel Fan-out and Interposers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (2017): 1–19. http://dx.doi.org/10.4071/2017dpc-tp1_presentation2.

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As front end transistor scaling by Moore's law faces economic and technical challenges, interconnect scaling by advanced packaging technologies has started to add value at system level for a variety of electronics applications including consumer, high performance computing and automotive. The focus on yield improvement at every node that has enabled transistor scaling is now becoming a very critical need for high volume manufacturing of advanced packaging technologies such as 2.5D interposers and high density fanout [1]. This paper describes the first demonstration of a novel atmospheric appro

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Makkonen, Hannu V., and Pekka Tuisku. "Geology and crystallization conditions of the Särkiniemiintrusion and related nickel-copper ore, central Finland – implications for depth of emplacement of 1.88 Ga nickel-bearing intrusions." Bulletin of the Geological Society of Finland 92, no. 2 (2020): 111–30. http://dx.doi.org/10.17741/bgsf/92.2.003.

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Several Ni-Cu deposits occur within the Kotalahti area, central Finland, in proximity to an Archaean gneiss dome surrounded by a Palaeoproterozoic craton-margin supracrustal sequence comprising quartzites, limestones, calc-silicate rocks, black schists and banded diopside amphibolites. The geology of the area and age of the Ni-bearing intrusions (1.88 Ga) are similar to the Thompson Ni belt in the Canadian Trans-Hudson Orogen. The small mafic-ultramafic and Ni-Cu -bearing Särkiniemi intrusion, closely associated with the Archaean basement core of the Kotalahti Dome, is composed of a western pe

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