Journal articles: 'Thermoplastic adhesives'

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Baurova, Natalia, Alexander Anoprienko, and Yulia Romanova. "The performance evaluation for rivet bonded joints in production and machine maintenance." MATEC Web of Conferences 224 (2018): 02003. http://dx.doi.org/10.1051/matecconf/201822402003.

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The paper deals with the studies on the serviceability and performance of rivet bonded joints produced with the use of thermoplastic hot-melt adhesives. Thermoplastic hot-melt adhesives are compared with conventional epoxy adhesives. The performance evaluation of different adhesive materials by dismantling of rivet bonded joints is fulfilled. The time necessary for each operation of the process is considered. The algorithms are provided for finding the design and engineering solution when replacing the conventional process of riveting by rivet bonding in production and machine maintenance.

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Mercedes Pastor-Blas, M. M. "Compatibility Improvement between Chlorinated Thermoplastic Rubber and Polychloroprene Adhesive." Rubber Chemistry and Technology 82, no. 1 (March 1, 2009): 18–36. http://dx.doi.org/10.5254/1.3548238.

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Abstract Traditionally, it has been believed that there is an incompatibility between the chlorinated rubber surface and polychloroprene adhesives resulting in a lack of adhesion. However, in this study it has been shown that a polychloroprene adhesive (PCP30P) produces similar T-peel strength values when using a polyurethane (PU) adhesive in joints produced between a chlorinated thermoplastic SBS rubber and roughened leather. In both cases a cohesive failure mode within the rubber was obtained. This polychloroprene adhesive (PCP30P) contains a thermoreactive phenolic resin in its formulation. The nature of the resin greatly influences the viscoelastic properties of the polychloroprene adhesive. Thus, polychloroprene adhesive with no resin or with resins of a different nature do not produce suitable adhesive joints between the chlorinated rubber and the leather (Terpene phenolic resin (PCP30TP), a glycerol esther colofony resin (PCP30EC) and an aromatic hydrocarbon resin (PCP30AH) were studied). The interactions produced between the chlorinating agent and the adhesive were studied by ATR-IR on solid films of the polychloroprene adhesives and the tackifier resins previously immersed in the chlorinating solution (0.5 and 3 wt% TCI/MEK). All the polychloroprene adhesives were modified by the chlorinating agent, being capable of producing a good interaction with the chlorinated rubber surface at the interface. Therefore, the good performance of the PCP30P adhesive compared with the other polychloroprene adhesives has been ascribed to rheological behavior more similar to the PU adhesive assessed by DMTA. The PCP30P adhesive is the most elastic material among all the considered polychloroprene adhesives. This increased elasticity and better viscoelastic properties are imparted by the thermoreactive phenolic resin in its formulation.

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MATYAŠOVSKÝ, JÁN, JÁN SEDLIAČIK, IGOR NOVÁK, PETER DUCHOVIČ, and PETER JURKOVIČ. "Influence of collagen modifications on qualitative parameters of thermoplastic adhesive mixtures and its microbiological stability." Annals of WULS, Forestry and Wood Technology 105 (June 6, 2019): 54–61. http://dx.doi.org/10.5604/01.3001.0013.7716.

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Influence of collagen modifications on qualitative parameters of thermoplastic adhesive mixtures and its microbiological stability.This work presents the possibility to use the modified biopolymer collagen for preparation of ecologic, biologically degradable thermoplastic adhesives. Collagen prepared from secondary raw materials of the leather and food industry was applied as a starting material for the preparation of thermoplastic, formaldehyde-free adhesives intended for use in woodworking, furniture and paper industries. Glued joint obtained high strength and flexibility after application of modification plasticisation agents based on collagen. Modifications of collagen glue with keratin biopolymer increased its resistance to water and the strength of the glued joint. Prepared samples of hot-melt adhesive had higher bonding strengths than standard commercial adhesives. The highest tensile strengths were achieved by applying of undiluted adhesive with the application of 2.5% keratin hydrolysate into hot-melt adhesive. As collagen is a natural polymer easy biodegradable in the aquatic environment, the research has focused on the possibility of its microbiological stabilization with aqueous solutions of ionic and colloidal silver. The highest microbiological activity was observed in a sample of ionic silver sulphate solution with a concentration of 2000 ppm Ag+. Its 1% concentration was applied for antibacterial thermoplastic stabilization of formaldehyde-free collagen glue.

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Mo, Xianfeng, Xinhao Zhang, Lu Fang, and Yu Zhang. "Research Progress of Wood-Based Panels Made of Thermoplastics as Wood Adhesives." Polymers 14, no. 1 (December 28, 2021): 98. http://dx.doi.org/10.3390/polym14010098.

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When thermoplastic resins such as polyethylene (PE) and polypropylene (PP) are selected as wood adhesives to bond wood particles (fibers, chips, veneers) by using the hot-pressing technique, the formaldehyde emission issue that has long existed in the wood-based panel industry can be effectively solved. In this study, in general, thermoplastic-bonded wood-based panels presented relatively higher mechanical properties and better water resistance and machinability than the conventional urea–formaldehyde resin-bonded wood-based panels. However, the bonding structure of the wood and thermoplastic materials was unstable at high temperatures. Compared with the wood–plastic composites manufactured by the extruding or injection molding methods, thermoplastic-bonded wood-based panels have the advantages of larger size, a wider raw material range and higher production efficiency. The processing technology, bonding mechanism and the performance of thermoplastic-bonded wood-based panels are comprehensively summarized and reviewed in this paper. Meanwhile, the existing problems of this new kind of panel and their future development trends are also highlighted, which can provide the wood industry with foundations and guidelines for using thermoplastics as environmentally friendly adhesives and effectively solving indoor pollution problems.

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Yoon, Tae-Ho, and James E. McGrath. "Enhanced Adhesive Performance of Thermoplastic Poly(imide-siloxane) Segmented Copolymer with PEEK®-Graphite Composites by Gas Plasma Treatment." High Performance Polymers 4, no. 4 (August 1992): 203–14. http://dx.doi.org/10.1088/0954-0083/4/4/001.

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The adhesive bond performance of PEEK®-graphite composites (APC-2/AS4) with melt fabricated films derived from either a novel thermoplastic poly(imide-30 wt% siloxane) segmented copolymer or commercial thermoplastic polyetherimide (Ultem® 1000), has been studied as a function of surface modifications. The latter included grit blasting and gas plasma etching treatments with oxygen, ammonia, nitrogen and argon. Adhesive bond strength was evaluated with single lap shear samples (SLSS) which were prepared from PEEKl-graphite composite adherends and compression molded thermoplastic poly(imide-30 wt% siloxane) segmented copolymer film adhesives. Greatly improved single lap shear strength values were obtained by several gas plasma treatments as well as by grit blasting. For example, SLSS values were increased from less than 1000 psi to approximately 5000 psi. The morphological and chemical changes of PEEKS-graphite composites with surface treatment were investigated by scanning electron microscopy (SEM), contact angle measurement and X-ray photoelectron spectroscopy (XPS). The results suggest that the improved adhesive bond strength produced by the gas plasma treatments was a function of the interaction of derived surface acidic functional group(s) with the 'basic' polyimide adhesives.

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Pastor-Blas, M. Mercedes, José Miguel Martín-Martínez, and F. J. Boerio. "Mechanisms of Adhesion in Surface Chlorinated Thermoplastic Rubber/Thermoplastic Polyurethane Adhesive Joints." Rubber Chemistry and Technology 75, no. 5 (November 1, 2002): 825–38. http://dx.doi.org/10.5254/1.3547686.

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Abstract Chlorination of a thermoplastic styrene-butadiene-styrene rubber (S0) with a solution of 2 wt% trichloroisocyanuric acid (TCI) in ethyl acetate improved its adhesion to polyurethane adhesives. The analysis of the failed surfaces (obtained after T-peel test of S0/PU joints) showed that the locus of failure in the rubber/polyurethane joints progresses from adhesion (in non chlorinated-S0/PU joint) to cohesion in the chlorinated layer (for chlorinated-S0/PU joint). The composition of this chlorinated layer differed from the composition of the non bonded-chlorinated rubber, i.e. the failure of the joint was located in a chlorinated layer with a distinctive chemistry. On the other hand, the analysis of the chlorinated rubber/PU adhesive interface showed that chlorination with TCI produces a crosslinking of the rubber surface as well as strong interactions between the uppermost-chlorinated layer and the PU adhesive.

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Stein, Bland A., William T. Hodges, and James R. Tyeryar. "Rapid adhesive bonding of thermoplastic composites and titanium withthermoplastic adhesives." Journal of Aircraft 23, no. 7 (July 1986): 545–46. http://dx.doi.org/10.2514/3.45341.

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Bekhta, Pavlo, Marcus Müller, and Ilona Hunko. "Properties of Thermoplastic-Bonded Plywood: Effects of the Wood Species and Types of the Thermoplastic Films." Polymers 12, no. 11 (November 3, 2020): 2582. http://dx.doi.org/10.3390/polym12112582.

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There are a lack of proper adhesives that meet the wood industry requirements of being environmentally friendly, low cost, and easy to use; thus, the application of thermoplastic polymers, especially films, is promising. This work expands our knowledge about the possibility of using thermoplastic films for the production of environmentally friendly plywood. The effects of the adhesives type and wood species on the properties of plastic film bonded plywood were studied. Sliced veneers of two hardwoods (birch and beech) and one softwood (spruce) were used in the experiments. Three types of thermoplastic films—low-density polyethylene (LDPE), co-polyamide (CoPA), and co-polyester (CoPE)—were used as an adhesive for bonding plywood samples. Melamine–urea–formaldehyde (MUF) resin was used as a reference. The influence of the type of adhesive and wood species as well as their interaction on the properties of plywood was significant. The lowest bonding strength demonstrated plywood samples bonded by LDPE, and the highest bonding strength in the samples was shown in those bonded by CoPA. A significant difference was found between softwoods and hardwoods in terms of their influence on the physical and mechanical properties of plywood samples. From the obtained data, it follows that softwoods provide much lower values of bending strength (MOR), modulus of elasticity (MOE), and bonding strength than hardwoods. The obtained bonding strength values of plastic-bonded plywood panels ranged from 1.18 to 2.51 MPa and met the European standard EN 314-2 for Class 1 (dry conditions) plywood.

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Sikdar, Soumya, Md Hafizur Rahman, Arpith Siddaiah, and Pradeep L. Menezes. "Gecko-Inspired Adhesive Mechanisms and Adhesives for Robots—A Review." Robotics 11, no. 6 (December 4, 2022): 143. http://dx.doi.org/10.3390/robotics11060143.

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Small living organisms such as lizards possess naturally built functional surface textures that enable them to walk or climb on versatile surface topographies. Bio-mimicking the surface characteristics of these geckos has enormous potential to improve the accessibility of modern robotics. Therefore, gecko-inspired adhesives have significant industrial applications, including robotic endoscopy, bio-medical cleaning, medical bandage tapes, rock climbing adhesives, tissue adhesives, etc. As a result, synthetic adhesives have been developed by researchers, in addition to dry fibrillary adhesives, elastomeric adhesives, electrostatic adhesives, and thermoplastic adhesives. All these adhesives represent significant contributions towards robotic grippers and gloves, depending on the nature of the application. However, these adhesives often exhibit limitations in the form of fouling, wear, and tear, which restrict their functionalities and load-carrying capabilities in the natural environment. Therefore, it is essential to summarize the state of the art attributes of contemporary studies to extend the ongoing work in this field. This review summarizes different adhesion mechanisms involving gecko-inspired adhesives and attempts to explain the parameters and limitations which have impacts on adhesion. Additionally, different novel adhesive fabrication techniques such as replica molding, 3D direct laser writing, dip transfer processing, fused deposition modeling, and digital light processing are encapsulated.

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Bekhta, Pavlo, and Ján Sedliačik. "Environmentally-Friendly High-Density Polyethylene-Bonded Plywood Panels." Polymers 11, no. 7 (July 8, 2019): 1166. http://dx.doi.org/10.3390/polym11071166.

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Thermoplastic films exhibit good potential to be used as adhesives for the production of veneer-based composites. This work presents the first effort to develop and evaluate composites based on alder veneers and high-density polyethylene (HDPE) film. The effects of hot-pressing temperature (140, 160, and 180 °C), hot-pressing pressure (0.8, 1.2, and 1.6 MPa), hot-pressing time (1, 2, 3, and 5 min), and type of adhesives on the physical and mechanical properties of alder plywood panels were investigated. The effects of these variables on the core-layer temperature during the hot pressing of multiplywood panels using various adhesives were also studied. Three types of adhesives were used: urea–formaldehyde (UF), phenol–formaldehyde (PF), and HDPE film. UF and PF adhesives were used for the comparison. The findings of this work indicate that formaldehyde-free HDPE film adhesive gave values of mechanical properties of alder plywood panels that are comparable to those obtained with traditional UF and PF adhesives, even though the adhesive dosage and pressing pressure were lower than when UF and PF adhesives were used. The obtained bonding strength values of HDPE-bonded alder plywood panels ranged from 0.74 to 2.38 MPa and met the European Standard EN 314-2 for Class 1 plywood. The optimum conditions for the bonding of HDPE plywood were 160 °C, 0.8 MPa, and 3 min.

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Dunky, Manfred. "Wood Adhesives Based on Natural Resources: A Critical Review: Part IV. Special Topics." Reviews of Adhesion and Adhesives 9, no. 2 (June 2, 2021): 189–268. http://dx.doi.org/10.7569/raa.2021.097307.

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Various naturally-based chemicals can be used directly as wood adhesives or are precursors for the synthesis of adhesive resins. Liquefaction and pyrolysis of wood yield various smaller chemicals derived from the different wood components, which then are used in the preparation of adhesives by replacing mainly phenol as raw material. The possible replacement of formaldehyde in aminoplastic and phenolic resins would solve the question of the subsequent formaldehyde emission.<br/> The multiple unsaturations of the triglycerides in vegetable oils enable polymerization for the direct synthesis of thermosets, as well as bases for polyfunctionalization and crosslinking.<br/> Natural polymers, such as poly(lactic acid)s (PLAs), natural rubber, or poly(hyhydroxyalkanoate)s (PHAs) are thermoplastics and can be used for various special applications in wood bonding, in case they can also be crosslinked. For other thermoplastic wood adhesives, such as PUR or PA, chemicals based on natural resources can at least replace a part or even all synthetic raw materials (monomers); these monomers derive from targeted decomposition of the wood material in biorefineries.<br/> Cellulose nanofibrils (CNFs) can be used as as sole adhesives or as components of adhesives. Hydrogen bonding has a key function in binder applications related to adhesion between cellulose nanoparticles and other materials. CNFs are able to establish strong bonding between wood particles/fibres through flexible and strong films by a simple drying process.<br/> Cashew nut shell liquid (CNSL) is a by-product of the cashew nut processing with cardanol (CD) as main component. CD-formaldehyde resins show improved flexibility compared to phenol-formaldehyde (PF) resins; CD can replace up to 40% of the phenol.

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Matsumura, Katsumasa. "Fully Polymerized Thermoplastic Adhesives for Micro Electronics." Journal of SHM 9, no. 5 (1993): 36–40. http://dx.doi.org/10.5104/jiep1993.9.5_36.

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McCutcheon, Jeremy, and Dongshun Bai. "Advanced Thin Wafer Support Processes for Temporary Wafer Bonding." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000361–63. http://dx.doi.org/10.4071/isom-2010-wa1-paper2.

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The ZoneBOND™ process has been developed to allow temporary wafer bonding at acceptable temperatures (usually less than 200°C), survival through higher-temperature processes, and then demounting at room temperature. The technology utilizes standard silicon or glass carriers and current thermoplastic adhesives developed by Brewer Science, Inc. The separation process consists of three components: removal of the adhesive in the outer zone, lamination of the device side of the pair, and separation of the carrier wafer from the adhesive. Developments of these key areas are the focus of this paper.

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Latko-Durałek, Paulina, Michał Misiak, and Anna Boczkowska. "Electrically Conductive Adhesive Based on Thermoplastic Hot Melt Copolyamide and Multi-Walled Carbon Nanotubes." Polymers 14, no. 20 (October 17, 2022): 4371. http://dx.doi.org/10.3390/polym14204371.

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For the bonding of the lightweight composite parts, it is desired to apply electrically conductive adhesive to maintain the ability to shield electromagnetic interference. Among various solvent-based adhesives, there is a new group of thermoplastic hot melt adhesives that are easy to use, solidify quickly, and are environment-friendly. To make them electrically conductive, a copolyamide-based hot melt adhesive was mixed with 5 and 10 wt% of carbon nanotubes using a melt-blending process. Well-dispersed nanotubes, observed by a high-resolution scanning microscope, led to the formation of a percolated network at both concentrations. It resulted in the electrical conductivity of 3.38 S/m achieved for 10 wt% with a bonding strength of 4.8 MPa examined by a lap shear test. Compared to neat copolyamide, Young’s modulus increased up to 0.6 GPa and tensile strength up to 30.4 MPa. The carbon nanotubes improved the thermal stability of 20 °C and shifted the glass transition of 10 °C to a higher value. The very low viscosity of the neat adhesive increased about 5–6 orders of magnitude at both concentrations, even at elevated temperatures. With a simultaneous growth in storage and loss modulus this indicates the strong interactions between polymer and carbon nanotubes.

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Novosel, Andrija, Tomislav Sedlar, Josip Miklečić, Hrvoje Turkulin, Luka Lučić, Goran Mihulja, and Vjekoslav Živković. "Analysis of Bonding Mechanisms of Various Implants and Adhesives in Laminated Oak-Wood Elements." Polymers 14, no. 24 (December 8, 2022): 5373. http://dx.doi.org/10.3390/polym14245373.

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This study analysed the bonding mechanisms and strength between wood and non-wood implants in producing laminated oak-wood beams. The suitability of different types of adhesives, namely for load-bearing and general purpose, was also analysed. Three different types of non-wood implants—carbon fibres, glass fibres, and aluminium were glued with epoxy resin (ER), thermoplastic 1-k polyurethane adhesives (PUR), structural polyurethane adhesives (PUR 2 and PUR 3), and polyvinyl acetate (PVAc) adhesives and bonds were tested for shear strength (SS) according to ISO 6238:2018. Results of the bond quality expressed as the ultimate load to failure and displacement were recorded using the universal mechanical testing machine in combination with the digital image correlation (DIC) method. Before the shear test, all the samples were conditioned in dry and wet climatic conditions. Test results indicated that the application of PUR adhesives for bonding carbon and glass fibres with oak wood could sufficiently replace two-component ER, which is generally recommended for such purposes but is very challenging to utilise in industrial conditions. PVAc adhesives proved efficient only for combination with AL implants and in dry conditions. Aluminium sheets were shown to require surface pre-treatment, such as sanding and degreasing or a different type of adhesive to achieve sufficient adhesion.

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Dal Conte, Umberto F., Irene F Villegas, and Julien Tachon. "Ultrasonic plastic welding of CF/PA6 composites to aluminium: Process and mechanical performance of welded joints." Journal of Composite Materials 53, no. 18 (March 12, 2019): 2607–21. http://dx.doi.org/10.1177/0021998319836022.

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Due to environmental challenges and need for action with regard to CO2 emission, reducing the weight of vehicles has become one of the most important goals of car manufacturers in Europe. Materials like fibre-reinforced plastics and aluminium are the core of the research for lightweight design. However, efficiently joining these materials together is still a challenge. When thermoplastic composites are used, direct joining (i.e. without adhesives or fasteners) with the metal substrate can be obtained using welding technologies which melt the thermoplastic at the interface. In this study, ultrasonic plastic welding was investigated as a candidate technology for joining aluminium and carbon fibre-reinforced thermoplastics. The goal was to understand the main mechanisms involved in the welding process and how they affect the performance of the joint. Initially, the technique proved to be successful, but moderate strengths were obtained. Therefore, several surface pre-treatments of aluminium were analysed to improve the performance in terms of lap shear strength; mechanical, chemical and physical treatments were also carried out. With laser structuring, strengths comparable to adhesive bonded joints were obtained, but in a much shorter process time. Other treatments led to considerable improvements as well. The encouraging results achieved represent an important step in the development of ultrasonic plastic welding for multi-material joining in the automotive industry.

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Ibraheem, Eman Mostafa Ahmed, and Hoda Gaafar Hassan Hammad. "Effect of Commercially Available Denture Adhesives on Microhardness of a Flexible Denture Base Material." Open Access Macedonian Journal of Medical Sciences 7, no. 5 (March 15, 2019): 862–68. http://dx.doi.org/10.3889/oamjms.2019.193.

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BACKGROUND: Various clinical cases of thermopress denture base materials necessitate the use of denture adhesives to achieve proper retention and stability of the removable prosthesis. Therefore; the microhardness of these flexible materials as surface property and its’ alterations due to the application of various denture adhesives are still crucial issues to be discussed. AIM: This study aimed to investigate the impact of two commercially available denture adhesives (DAs) on microhardness of a flexible denture base material. METHODS: A total of 30 duplicate disc specimens (DS) were fabricated from a thermoplastic injection moulded resin (TR). The obtained 30-disc specimens (DS) were stored in distilled water for seven days, and then their microhardness was measured using Knoop Hardness Test (KHN) under a 10 g load for 10 seconds. The denture adhesives were prepared, and 15 DS were immersed in Corega Super Cream, while the other 15 DS were soaked in Fitty Dent Cream. All DS were stored in distilled water at 37°C. After 30 days of immersion in DAs, microhardness of DS was again measured. T-test for paired observation was used to investigate any alterations in microhardness between the baseline and after 30 days of immersion in the DAs. Statistical analysis was performed with SPSS 20®, Graph Pad Prism® and Microsoft Excel 2016 with a significant level set at P ≤ 0.05. RESULTS: Student`s t-test had revealed a significant difference between both groups after application of denture adhesive as a P value < 0.05. The obtained results showed that DA material type, flexible denture base material and their surface interaction provoke a statistically significant outcome on the mean microhardness. CONCLUSIONS: DAs were found to affect the microhardness of thermoplastic injection moulded resin (TR); which may jeopardise the durability and serviceability of complete denture and patients’ acceptance and comfortability.

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Sánchez-Adsuar, María Salvadora, and José Miguel Martín-Martínez. "Structure, composition, and adhesion properties of thermoplastic polyurethane adhesives." Journal of Adhesion Science and Technology 14, no. 8 (January 2000): 1035–55. http://dx.doi.org/10.1163/156856100743068.

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Ku, H. S., E. Siores, J. A. R. Ball, A. Taube, and F. Siu. "Lap shear strength comparison between different random glass fibre reinforced thermoplastic matrix composites bonded by adhesives using variable-frequency microwave irradiation." Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications 217, no. 1 (January 1, 2003): 65–75. http://dx.doi.org/10.1177/146442070321700108.

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This paper compares the lap shear strengths of three types of random glass fibre reinforced thermoplastic matrix composite joined by adhesives using microwave energy. Variable-frequency microwave (VFM) (2-18 GHz) facilities are used to join 33 wt % random glass fibre reinforced low-density polyethylene composite [LDPE/GF (33%)], 33 wt % random glass fibre reinforced polystyrene composite [PS/GF (33%)] and 33 wt % random glass fibre reinforced nylon 66 composite [nylon 66/GF (33%)]. With a given power level, the composites were exposed for various times to microwave irradiation. The primer or coupling agent used was a 5 min two-part adhesive.

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Xu, Yecheng, Yantao Xu, Wenjie Zhu, Wei Zhang, Qiang Gao, and Jianzhang Li. "Improve the Performance of Soy Protein-Based Adhesives by a Polyurethane Elastomer." Polymers 10, no. 9 (September 13, 2018): 1016. http://dx.doi.org/10.3390/polym10091016.

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The purpose of this study was to improve the performance of soy protein isolate (SPI) adhesives using a polyurethane elastomer. Triglycidylamine (TGA), SPI, thermoplastic polyurethane elastomer (TPU), and γ-(2,3-epoxypropoxy) propyltrimethoxysilane (KH-560) were used to develop a novel SPI-based adhesive. The residual rate, functional groups, thermal stability, and fracture surface micrographs of the cured adhesives were characterized. Three-ply plywood was fabricated, and the dry/wet shear strength was determined. The experimental results suggested that introducing 2% TGA improved the residual rate of the SPI/TGA adhesive by 4.1% because of the chemical cross-linking reaction between epoxy groups and protein molecules. Incorporating 7% TPU into the SPI/TGA adhesive, the residual rate of the adhesive increased by 5.2% and the dry/wet shear strength of plywood bonded by SPI/TGA/TPU adhesive increased by 10.7%/67.7%, respectively, compared with that of SPI/TGA adhesive. When using KH-560 and TPU together, the residual rate of the adhesive improved by 0.9% compared with that of SPI/TGA/TPU adhesive. The dry and wet shear strength of the plywood bonded by the SPI/TGA/TPU/KG-560 adhesive further increased by 23.2% and 23.6% respectively when compared with that of SPI/TGA/TPU adhesive. TPU physically combined with the SPI/TGA adhesive to form a interpenetration network and KH-560 acted as a bridge to connect TPU and SPI/TGA to form a joined crosslinking network, which improved the thermo stability/toughness of the adhesive and created a uniform ductile fracture section of the adhesive.

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Das, S., L. M. Matuana, and P. Heiden. "Thermoplastic polymers as modifiers for urea–formaldehyde wood adhesives. III.In situ thermoplastic-modified wood composites." Journal of Applied Polymer Science 107, no. 5 (2007): 3200–3211. http://dx.doi.org/10.1002/app.25526.

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Kaboorani, Alireza, and Bernard Riedl. "Nano-aluminum oxide as a reinforcing material for thermoplastic adhesives." Journal of Industrial and Engineering Chemistry 18, no. 3 (May 2012): 1076–81. http://dx.doi.org/10.1016/j.jiec.2011.12.001.

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Donate-Robles, Jessica, and José Miguel Martín-Martínez. "Addition of precipitated calcium carbonate filler to thermoplastic polyurethane adhesives." International Journal of Adhesion and Adhesives 31, no. 8 (December 2011): 795–804. http://dx.doi.org/10.1016/j.ijadhadh.2011.07.008.

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Birkar, Smita, Joey Mead, and Carol Barry. "INJECTION MOLDING OF THERMOPLASTIC ELASTOMERS FOR MICROSTRUCTURED SUBSTRATES." Rubber Chemistry and Technology 87, no. 4 (December 1, 2014): 629–46. http://dx.doi.org/10.5254/rct.14.86924.

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ABSTRACT Microstructured surfaces injection molded from thermoplastic elastomers have emerging applications as superhydrobic surfaces and patterned adhesives, but there is a limited understanding of the factors affecting replication with these materials. This work investigates the interactions of the tooling aspect ratio and feature orientation (negative and positive tooling) and thermoplastic elastomer hard segment content on microfeature replication. Electroformed nickel tooling having positive and negative features with different geometries and aspect ratios of 0.02:1 to 2:1 were molded from three copolyester thermoplastic elastomers with similar chemistry and different hardness values. The tooling and part features were characterized for feature depth and height as well as feature definition using scanning electron microscopy and optical profilometry. Results were correlated with elastomer properties.

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Latko-Durałek, Paulina, Rafał Kozera, Jan Macutkevič, Kamil Dydek, and Anna Boczkowska. "Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes." Materials 13, no. 20 (October 9, 2020): 4469. http://dx.doi.org/10.3390/ma13204469.

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The polymeric adhesive used for the bonding of thermoplastic and thermoset composites forms an insulating layer which causes a real problem for lightning strike protection. In order to make that interlayer electrically conductive, we studied a new group of electrically conductive adhesives based on hot melt copolyamides and multi-walled carbon nanotubes fabricated by the extrusion method. The purpose of this work was to test four types of hot melts to determine the effect of their viscosity on the dispersion of 7 wt % multi-walled carbon nanotubes and electrical conductivity. It was found that the dispersion of multi-walled carbon nanotubes, understood as the amount of the agglomerates in the copolyamide matrix, is not dependent on the level of the viscosity of the polymer. However, the electrical conductivity, analyzed by four-probe method and dielectric spectroscopy, increases when the number of carbon nanotube agglomerates decreases, with the highest value achieved being 0.67 S/m. The inclusion of 7 wt % multi-walled carbon nanotubes into each copolyamide improved their thermal stability and changed their melting points by only a few degrees. The addition of carbon nanotubes makes the adhesive’s surface more hydrophilic or hydrophobic depending on the type of copolyamide used.

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Nadaraja, Shri Kumaran, and Boon Kar Yap. "In depth study of lead frame tape residuein quad flat non-leaded package." Microelectronics International 36, no. 4 (October 7, 2019): 129–36. http://dx.doi.org/10.1108/mi-12-2018-0077.

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Purpose Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it. Design/methodology/approach An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength. Findings Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape’s thermoplastic adhesive properties. Originality/value This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution.

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McCutcheon, Jeremy, Robert Brown, and JoElle Dachsteiner. "ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications." Journal of Microelectronics and Electronic Packaging 7, no. 3 (July 1, 2010): 138–42. http://dx.doi.org/10.4071/imaps.269.

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The ZoneBOND process has been developed as an alternative temporary bonding process that bonds at an acceptable temperature (usually less than 200°C), survives through higher-temperature processes, and then debonds at room temperature. The technology utilizes standard silicon or glass carriers and current thermoplastic adhesives developed by Brewer Science, Inc.

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Raj, Indu, Femitha Syed, and Tony Joy. "CUSTOMIZED THERMOPLAST RETENTIVE AID FOR PARTIAL AURICULAR PROSTHESIS-A CASE REPORT." International Journal of Advanced Research 11, no. 02 (February 28, 2023): 212–20. http://dx.doi.org/10.21474/ijar01/16242.

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Auricular prostheses were traditionally retained using chemical adhesives ,mechanical retentive aids or natural undercuts at retention sites.These methods have the limitation of frequent loss of retention, skin reactions to adhesives, or unnatural movements of the prosthesis. Osseo integrated implants which has superior advantages over others have disadvantages for patients with financial constraints and/or who are apprehensive of surgery.Also, extraoral implants require adequate thickness of bone, which may be deficient in certain cases. In this case report,we have described about a new technique of fabricating and incoporating a customized thermoplastic auricular retentive aid thus utilizing both anatomic and mechanical retention.

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Woitun, Dominic, Michael Roderus, Thilo Bein, and Elmar Kroner. "Metal Polymer Connections: Laser-Induced Surface Enlargement Increases Joint Strength." Key Engineering Materials 809 (June 2019): 190–96. http://dx.doi.org/10.4028/www.scientific.net/kem.809.190.

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The trend towards hybrid materials consisting of metals and polymers is strongly driven by requirements such as weight reduction and improved functionality. A crucial step towards new hybrid materials is the advancement of joining technology. While metals and polymers are currently often joined using adhesives, this technology has major drawbacks such as long process cycle time, low robustness with regard to changes of the material composition, and are almost impossible to recycle, a point which is becoming increasingly important. A promising joining method is thermal direct joining of metals and thermoplastic polymers due to its fast cycle time, its robustness of the process and the absence of duroplastic adhesives. Direct joining requires surface treatment of the metallic joining partner prior to the thermal joining process to achieve a sufficiently high contact strength. It is known that laser-induced topologies on the metal surface are beneficial with regard to contact strength of the joints. Designing a joint based on laser structured metals requires a fundamental understanding of the interface interactions. The present paper focuses on the influence of surface enlargement on the joint strength. Laser pretreatment was utilized to generate surface structures with specific surface enlargement on the metallic joining partner. The pretreated metallic parts were subsequently joined with a thermoplastic polymer by injection molding. The joint strength was investigated in single lap shear tests. The key finding is that the contact strength increases almost linearly with the surface area within the tested parameter range, while the structure geometry parameters have only a minor influence. This may help as a design guideline for future adhesive-free hybrid material joining technologies.

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Moon, K., C. Rockett, C. Kretz, W. F. Burgoyne, and C. P. Wong. "Improvement of adhesion and electrical properties of reworkable thermoplastic conductive adhesives." Journal of Adhesion Science and Technology 17, no. 13 (January 2003): 1785–99. http://dx.doi.org/10.1163/156856103322538688.

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Kim, Jae-Woo, Karana Carlborn, Laurent M. Matuana, and Patricia A. Heiden. "Thermoplastic modification of urea–formaldehyde wood adhesives to improve moisture resistance." Journal of Applied Polymer Science 101, no. 6 (2006): 4222–29. http://dx.doi.org/10.1002/app.23654.

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Vega-Baudrit, José, Virtudes Navarro-Bañón, Patricia Vázquez, and José Miguel Martín-Martínez. "Addition of nanosilicas with different silanol content to thermoplastic polyurethane adhesives." International Journal of Adhesion and Adhesives 26, no. 5 (August 2006): 378–87. http://dx.doi.org/10.1016/j.ijadhadh.2005.06.004.

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Kumar, Devendra, and Alka D. Gupta. "Novel processable aromatic thermoplastic polyimides: Films, adhesives, moldings, and graphite composites." Polymers for Advanced Technologies 3, no. 1 (February 1992): 1–7. http://dx.doi.org/10.1002/pat.1992.220030101.

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Fuensanta, Vallino-Moyano, and Martín-Martínez. "Balanced Viscoelastic Properties of Pressure Sensitive Adhesives Made with Thermoplastic Polyurethanes Blends." Polymers 11, no. 10 (October 3, 2019): 1608. http://dx.doi.org/10.3390/polym11101608.

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Pressure sensitive adhesives made with blends of thermoplastic polyurethanes (TPUs PSAs) with satisfactory tack, cohesion, and adhesion have been developed. A simple procedure consisting of the physical blending of methyl ethyl ketone (MEK) solutions of two thermoplastic polyurethanes (TPUs) with very different properties—TPU1 and TPU2—was used, and two different blending procedures have been employed. The TPUs were characterized by infra-red spectroscopy in attenuated total reflectance mode (ATR-IR spectroscopy), differential scanning calorimetry, thermal gravimetric analysis, and plate-plate rheology (temperature and frequency sweeps). The TPUs PSAs were characterized by tack measurement, creep test, and the 180° peel test at 25 °C. The procedure for preparing the blends of the TPUs determined differently their viscoelastic properties, and the properties of the TPUs PSAs as well, the blending of separate MEK solutions of the two TPUs imparted higher tack and 180° peel strength than the blending of the two TPUs in MEK. TPU1 + TPU2 blends showed somewhat similar contributions of the free and hydrogen-bonded urethane groups and they had an almost similar degree of phase separation, irrespective of the composition of the blend. Two main thermal decompositions at 308–317 °C due to the urethane hard domains and another at 363–373 °C due to the soft domains could be distinguished in the TPU1 + TPU2 blends, the weight loss of the hard domains increased and the one of the soft domains decreased by increasing the amount of TPU2 in the blends. The storage moduli of the TPU1 + TPU2 blends were similar for temperatures lower than 20 °C and the moduli at the cross over of the moduli were lower than in the parent TPUs. The improved properties of the TPU1 + TPU2 blends derived from the creation of a higher number of hydrogen bonds upon removal of the MEK solvent, which lead to a lower degree of phase separation between the soft and the hard domains than in the parent TPUs. As a consequence, the properties of the TPU1 + TPU2 PSAs were improved because good tack, high 180° peel strength, and sufficient cohesion were obtained, particularly in 70 wt% TPU1 + 30 wt% TPU2 PSA.

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Vattathurvalappil, Suhail Hyder, and Mahmoodul Haq. "Thermomechanical characterization of Nano-Fe3O4 reinforced thermoplastic adhesives and single lap-joints." Composites Part B: Engineering 175 (October 2019): 107162. http://dx.doi.org/10.1016/j.compositesb.2019.107162.

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Liu, Yinan, Xuemin Li, Weihong Wang, Yanan Sun, and Haigang Wang. "Decorated wood fiber/high density polyethylene composites with thermoplastic film as adhesives." International Journal of Adhesion and Adhesives 95 (December 2019): 102391. http://dx.doi.org/10.1016/j.ijadhadh.2019.05.008.

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Pettit, Jared, and John Moore. "Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure, and Low-Stress 3D-Processing." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000215–22. http://dx.doi.org/10.4071/isom-2011-tp1-paper6.

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Although several materials are commercially available as temporary adhesives in 3-D packaging, few candidates satisfy processes of elevated temperature and extreme vacuum. Whether these include thermoplastic or thermosetting polymers, success is met by their being processed in a manner that meets the customer’s low vacuum conditions. This paper presents data on several products and methods of modeling a customer’s process. Low-cost alternatives will be presented which may be easily integrated, provided that a customer’s process can be tuned to accept such materials. Low-cost temporary support materials allow grinding and polishing to <20um while also protecting front side devices from backside processing to include through silicon vias (TSVs) and the associated cleans and metallization steps. Temporary adhesives must sustain thermal resistance to 250C, vacuum conditions of 10-6 Torr, and shear forces of grinding processes. These properties are required for via etch, CVD processing (e.g. oxide deposition), and chemical use during cleaning. These efforts are aimed at simplifying the overall process, aligning chemistry, and many times, eliminating the need for complicated cleans. By tailoring a customer’s process to accept a lower-cost adhesive, new ways of simple and rapid cleaning or even detergent washable systems may be integrated. Using these approaches, a safer working environment, or green factory, may be achieved while reducing the use of organic solvents and eliminating waste. Several options will be presented for using low-cost adhesives in thinning and backside processing towards increasing throughput and reducing cost. Examples will include semiconductor wafer and die thinning and at least one non-semiconductor thin substrate practice.

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Khan, Tayyab, Farrukh Hafeez, and Rehan Umer. "Repair of Aerospace Composite Structures Using Liquid Thermoplastic Resin." Polymers 15, no. 6 (March 10, 2023): 1377. http://dx.doi.org/10.3390/polym15061377.

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In this study, two types of carbon-fiber-reinforced plastic (CFRP) composite scarf geometries were created using two scarf angles, i.e., 1.43° and 5.71°. The scarf joints were adhesively bonded using a novel liquid thermoplastic resin at two different temperatures. The performance of the repaired laminates was compared with pristine samples in terms of residual flexural strength using four-point bending tests. The repair quality of the laminates was examined by optical micrographs, and the failure modes after flexural tests were analyzed using a scanning electron microscope. The thermal stability of the resin was evaluated by thermogravimetric analysis (TGA), whereas the stiffness of the pristine samples was determined using dynamic mechanical analysis (DMA). The results showed that the laminates were not fully repaired under ambient conditions, and the highest recovery strength at room temperature was only 57% of the total strength exhibited by pristine laminates. Increasing the bonding temperature to an optimal repair temperature of 210 °C resulted in a significant improvement in the recovery strength. The best results were achieved for laminates with a higher scarf angle (5.71°). The highest residual flexural strength was recorded as 97% that of the pristine sample repaired at 210 °C with a scarf angle of 5.71°. The SEM micrographs showed that all the repaired samples exhibited delamination as the dominant failure mode, whereas the pristine samples exhibited dominant fiber fracture and fiber pullout failure modes. The residual strength recovered using liquid thermoplastic resin was found to be much higher than that reported for conventional epoxy adhesives.

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Paeglis, A. U., and F. X. O'Shea. "Thermoplastic Elastomer Compounds from Sulfonated EPDM Ionomers." Rubber Chemistry and Technology 61, no. 2 (May 1, 1988): 223–37. http://dx.doi.org/10.5254/1.3536184.

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Abstract The zinc sulfonate of EPDM, an ionic elastomer polymer, can be readily formulated into useful thermoplastic elastomer compounds having beneficial properties and processing characteristics. The thermoplastic processing characteristics of these ionic elastomers are uniquely controlled by “ionolyzers,” preferential ionic plasticizers. These additives induce thermal reversibility in the ionic crosslink and control the response of the ionic associations to temperature. Ionic elastomer compounds maintain many of the performance features characteristic of vulcanized EPDM, such as low-temperature flexibility, thermal stability, and weatherability, while providing the added advantages of heat weldability and elimination of vulcanization. We have developed a cost-effective ionic elastomer formulation that meets or exceeds the RMA recommendations for black EPDM in a demanding, high performance application, single-ply roofing membrane. High-strength lap seams can be rapidly fabricated using portable hot air welders, a technique unavailable to conventional vulcanized EPDM sheet. Other applications have been investigated for these polymers, such as hose, footwear, mechanical goods, adhesives, impact modifiers, and asphalt modifiers both as thermoplastic elastomers and as modifiers for other materials. These applications have taken advantage of the unique rheological and solubility properties of these polymers. In addition, a new polymer grade offers an advance in the ability to formulate higher strength and more highly filled and extended ionic elastomer compositions.

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Tang, Jie Fang, Li Jun Wang, Feng Yuan Zou, and Hong Yi Sou. "Study on the Heat-Press Bonding Optimum Technics of Stitchless Apparel." Advanced Materials Research 418-420 (December 2011): 22–25. http://dx.doi.org/10.4028/www.scientific.net/amr.418-420.22.

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The heat-press bonding technology of water proof and breathable fabrics with thermoplastic adhesives will play an important role in the processing of stitchless apparels, they will influence not only the stiffness and the processability, but also influence the function and the quality of stitchless apparels. This study will analyze the influence factor about the processability through the test index of the breaking strength. The results showed that pressing time was one of most easily controlled technology in stitchless apparels production.

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Kerr, S. R. "Radiation Cured, Thermoplastic Elastomer Films Based on "Macromolecular Monomers" for Heat Activated Adhesives." Journal of Plastic Film & Sheeting 2, no. 2 (April 1986): 127–43. http://dx.doi.org/10.1177/875608798600200206.

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Legon’kova, O. A., and M. S. Fedotova. "Biodeterioration of adhesives based on thermoplastic polyurethanes under the action of soil microorganisms." Polymer Science Series D 5, no. 1 (January 2012): 30–32. http://dx.doi.org/10.1134/s1995421212010091.

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Gilleo, Ken, and Peter Ongley. "Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications." Microelectronics International 16, no. 2 (August 1999): 34–38. http://dx.doi.org/10.1108/13565369910268259.

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Kadiyala, Ajay Kumar, and Jayashree Bijwe. "Investigations on performance and failure mechanisms of high temperature thermoplastic polymers as adhesives." International Journal of Adhesion and Adhesives 70 (October 2016): 90–101. http://dx.doi.org/10.1016/j.ijadhadh.2016.05.011.

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Kim, Tae K., Byung K. Kim, Yong S. Kim, Yang L. Cho, Sang Y. Lee, Youn B. Cho, Joe H. Kim, and Han M. Jeong. "The properties of reactive hot melt polyurethane adhesives modified with novel thermoplastic polyurethanes." Journal of Applied Polymer Science 114, no. 2 (October 15, 2009): 1169–75. http://dx.doi.org/10.1002/app.30730.

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Park, Soo-Jeong, Kyo-Moon Lee, Seong-Jae Park, and Yun-Hae Kim. "Overlapped repair performance for carbon–PPS composites in vacuum-assisted thermal bonding." Modern Physics Letters B 34, no. 07n09 (March 16, 2020): 2040027. http://dx.doi.org/10.1142/s0217984920400278.

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An overlapped repair with a continuous bonding area, was applied to carbon–PPS thermoplastic composites, and their strength recovery rate and failure behavior under mechanical loading were analyzed. This overlapped model has been designed to prevent the common and fundamental failures in conventional repair technologies through utilization of the volume fraction properties of continuous fibers. The same material was used for the parent and repair, and adhesion occurred via reversible thermal properties of the thermoplastic PPS polymer, without using additional adhesives. Under tensile and flexural loading, thickness ratios of 30% and 50% (damaged depth to the total thickness of the laminate) resulted in high strength recovery rates of 96% and 94%, respectively. The overlapped, bonded area on the surface of the parent material is the path of external load transfer between the parent and repair materials, maintaining uniform stress dispersion and increasing the fracture resistance.

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Li, Hui, and Karl Englund. "Recycling of carbon fiber-reinforced thermoplastic composite wastes from the aerospace industry." Journal of Composite Materials 51, no. 9 (September 26, 2016): 1265–73. http://dx.doi.org/10.1177/0021998316671796.

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Post-industrial trimmings and off-cuts of carbon fiber/polyether ether ketone composite were successfully recycled into new composite products. The original composites were thermally characterized by dynamic thermomechanical analysis, differential scanning calorimetry, and thermogravimetric analysis. Melt-bonding and thermoset adhesives were used to bond the carbon fiber/polyether ether ketone. Performance of the bond was evaluated through double lap-shear tests. The carbon fiber/polyether ether ketone scraps were mechanically refined to a variety of elemental sizes, subsequently subjected to high-temperature hot pressing to form panel composites. The influences of element size and processing temperature were evaluated through mechanical testing.

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Abdelmoula, Maisa, Hajer Ben Hlima, Frédéric Michalet, Gérard Bourduche, Jean-Yves Chavant, Alexis Gravier, Cédric Delattre, et al. "Chitosan-Based Adhesive: Optimization of Tensile Shear Strength in Dry and Wet Conditions." Polysaccharides 2, no. 1 (February 28, 2021): 110–20. http://dx.doi.org/10.3390/polysaccharides2010008.

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Commercial adhesives present a high bond strength and water resistance, but they are considered non-healthier products. Chitosan can be considered as an interesting biosourced and biodegradable alternative, despite its low water resistance. Here, its wood bonding implementation and its tensile shear strength in dry and wet conditions were investigated depending on its structural characteristics. Firstly, the spread rate, open assembly time, drying pressure, drying temperature, and drying time have been determined for two chitosans of European pine double lap specimens. An adhesive solution spread rate of 1000 g·m−2, an open assembly time of 10 min, and a pressure temperature of 55 °C for 105 min led to a bond strength of 2.82 MPa. Secondly, a comparison between a high molecular weight/low deacetylation degree chitosan and a lower molecular weight/higher deacetylation degree chitosan was conducted. Tests were conducted with beech simple lap specimens in accordance with the implementation conditions and the conditioning treatments in wet and dry environments required for thermoplastic wood adhesive standards used in non-structural applications (EN 204 and EN 205). The results clearly revealed the dependence of adhesive properties and water resistance on the structural features of chitosans (molecular weight and deacetylation degree), explaining the heterogeneity of results published notably in this field.

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Khaled, Walid Bin, and Dan Sameoto. "Fabrication and Characterization of Thermoplastic Elastomer Dry Adhesives with High Strength and Low Contamination." ACS Applied Materials & Interfaces 6, no. 9 (April 22, 2014): 6806–15. http://dx.doi.org/10.1021/am500616a.

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Luo, Jie, Zhijie Cheng, Chaowei Li, Liangjie Wang, Cuiping Yu, Yue Zhao, Minghai Chen, Qingwen Li, and Yagang Yao. "Electrically conductive adhesives based on thermoplastic polyurethane filled with silver flakes and carbon nanotubes." Composites Science and Technology 129 (June 2016): 191–97. http://dx.doi.org/10.1016/j.compscitech.2016.04.026.

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Journal articles on the topic 'Thermoplastic adhesives'

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