Journal articles on the topic 'Thermal management of electronics'
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FAULKNER, DAN, MEHDY KHOTAN, and REZA SHEKARRIZ. "Managing Electronics Thermal Management." Heat Transfer Engineering 25, no. 2 (March 2004): 1–4. http://dx.doi.org/10.1080/01457630490275944.
Full textXing, Wenkui, Yue Xu, Chengyi Song, and Tao Deng. "Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics." Nanomaterials 12, no. 19 (September 27, 2022): 3365. http://dx.doi.org/10.3390/nano12193365.
Full textLi, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. "Recent Advances on Thermal Management of Flexible Inorganic Electronics." Micromachines 11, no. 4 (April 9, 2020): 390. http://dx.doi.org/10.3390/mi11040390.
Full textSong, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (November 26, 2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.
Full textPang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.
Full textEgan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (September 15, 1999): 98–106. http://dx.doi.org/10.1115/1.483140.
Full textShi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.
Full textKosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.
Full textYeh, L. T. "Review of Heat Transfer Technologies in Electronic Equipment." Journal of Electronic Packaging 117, no. 4 (December 1, 1995): 333–39. http://dx.doi.org/10.1115/1.2792113.
Full textAnandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.
Full textBabus'Haq, R. F., H. E. George, P. W. O'Callaghan, and B. A. Constant. "Thermal management of electronics: problems and analytical techniques." Computer-Aided Engineering Journal 7, no. 1 (1990): 23. http://dx.doi.org/10.1049/cae.1990.0006.
Full textHamilton, S. "Developments in Passive Thermal Management Systems for Electronics." Circuit World 14, no. 1 (April 1987): 22–25. http://dx.doi.org/10.1108/eb043933.
Full textKercher, D. S., Jeong-Bong Lee, O. Brand, M. G. Allen, and A. Glezer. "Microjet cooling devices for thermal management of electronics." IEEE Transactions on Components and Packaging Technologies 26, no. 2 (June 2003): 359–66. http://dx.doi.org/10.1109/tcapt.2003.815116.
Full textShang, Bofeng, Yupu Ma, Run Hu, Chao Yuan, Jinyan Hu, and Xiaobing Luo. "Passive thermal management system for downhole electronics in harsh thermal environments." Applied Thermal Engineering 118 (May 2017): 593–99. http://dx.doi.org/10.1016/j.applthermaleng.2017.01.118.
Full textLv, Yi-Gao, Gao-Peng Zhang, Qiu-Wang Wang, and Wen-Xiao Chu. "Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review." Energies 15, no. 21 (November 7, 2022): 8316. http://dx.doi.org/10.3390/en15218316.
Full textLi, Mingli, Na Gong, Jinhui Wang, and Zhibin Lin. "Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000649–53. http://dx.doi.org/10.4071/isom-2015-tha44.
Full textZhang, Hongli, Tiezhu Shi, and Aijie Ma. "Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material." Polymers 13, no. 16 (August 20, 2021): 2797. http://dx.doi.org/10.3390/polym13162797.
Full textSato, Kimiyasu, Yuichi Tominaga, and Yusuke Imai. "Nanocelluloses and Related Materials Applicable in Thermal Management of Electronic Devices: A Review." Nanomaterials 10, no. 3 (March 2, 2020): 448. http://dx.doi.org/10.3390/nano10030448.
Full textBaldwin, D. F., and J. T. Beerensson. "Thermal Management in Direct Chip Attach Assemblies." Journal of Electronic Packaging 121, no. 4 (December 1, 1999): 222–30. http://dx.doi.org/10.1115/1.2793844.
Full textYin, Yafei, Min Li, Wei Yuan, Xiaolian Chen, and Yuhang Li. "A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures." Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 475, no. 2228 (August 2019): 20190402. http://dx.doi.org/10.1098/rspa.2019.0402.
Full textHabib, Numan, Muftooh ur Rehman Siddiqi, and Muhammad Tahir. "Thermal analysis of proposed heat sink design under natural convection for the thermal management of electronics." Thermal Science 26, no. 2 Part B (2022): 1487–501. http://dx.doi.org/10.2298/tsci210402307h.
Full textYang, Tianyu, Thomas Foulkes, Beomjin Kwon, Jin Gu Kang, Paul V. Braun, William P. King, and Nenad Miljkovic. "An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics." IEEE Transactions on Components, Packaging and Manufacturing Technology 9, no. 12 (December 2019): 2341–51. http://dx.doi.org/10.1109/tcpmt.2019.2930089.
Full textHaynes, A. S., and R. Sadangi. "Novel thermal barrier oxides for electronics thermal management: an assessment of WO3." Journal of Materials Science: Materials in Electronics 28, no. 21 (July 12, 2017): 16021–25. http://dx.doi.org/10.1007/s10854-017-7501-6.
Full textMoore, Arden L., and Li Shi. "Emerging challenges and materials for thermal management of electronics." Materials Today 17, no. 4 (May 2014): 163–74. http://dx.doi.org/10.1016/j.mattod.2014.04.003.
Full textAndresen, M., and M. Liserre. "Impact of active thermal management on power electronics design." Microelectronics Reliability 54, no. 9-10 (September 2014): 1935–39. http://dx.doi.org/10.1016/j.microrel.2014.07.069.
Full textSaravanan, V., and G. Kumaraguruparan. "Thermal management of microwave electronics in the radar system." ISSS Journal of Micro and Smart Systems 8, no. 2 (November 2019): 143–53. http://dx.doi.org/10.1007/s41683-019-00043-z.
Full textPanão, Miguel R. O., André M. Correia, and António L. N. Moreira. "High-power electronics thermal management with intermittent multijet sprays." Applied Thermal Engineering 37 (May 2012): 293–301. http://dx.doi.org/10.1016/j.applthermaleng.2011.11.031.
Full textStiubianu, George-Theodor, Adrian Bele, Marian Grigoras, Codrin Tugui, Bianca-Iulia Ciubotaru, Mirela-Fernanda Zaltariov, Firuța Borza, Leandru-Gheorghe Bujoreanu, and Maria Cazacu. "Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics." Batteries 8, no. 8 (August 18, 2022): 95. http://dx.doi.org/10.3390/batteries8080095.
Full textChowdhury, Srabanti. "Integrating Diamond for Cooling Electronics." ECS Meeting Abstracts MA2022-02, no. 32 (October 9, 2022): 1211. http://dx.doi.org/10.1149/ma2022-02321211mtgabs.
Full textPaul, Riya, Amol Deshpande, Fang Luo, and Wei Fan. "Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000259–63. http://dx.doi.org/10.4071/2380-4505-2020.1.000259.
Full textMalik, Faraz Kaiser, and Kristel Fobelets. "A review of thermal rectification in solid-state devices." Journal of Semiconductors 43, no. 10 (October 1, 2022): 103101. http://dx.doi.org/10.1088/1674-4926/43/10/103101.
Full textAbo-Zahhad, Essam M., Ahmed Amine Hachicha, Zafar Said, Chaouki Ghenai, and Shinichi Ookawara. "Thermal management system for high, dense, and compact power electronics." Energy Conversion and Management 268 (September 2022): 115975. http://dx.doi.org/10.1016/j.enconman.2022.115975.
Full textWang, Chien-Ping. "Thermal Management for Portable Electronics Using a Piezoelectric Micro-Blower." IEEE Transactions on Device and Materials Reliability 19, no. 3 (September 2019): 563–67. http://dx.doi.org/10.1109/tdmr.2019.2933021.
Full textPark, Sangyoung, Soohee Han, and Naehyuck Chang. "Control-Theoretic Dynamic Thermal Management of Automotive Electronics Control Units." IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1, no. 2 (June 2011): 102–8. http://dx.doi.org/10.1109/jetcas.2011.2158342.
Full textYUKI, Kazuhisa, Kio TAKAI, Ken-taro ANJU, Risako KIBUSHI, Noriyuki UNNO, Tetsuro OGUSHI, Masaaki MURAKAMI, and Takuya IDE. "Thermal management of electronics by uni-directional porous heat sinks." Proceedings of Mechanical Engineering Congress, Japan 2017 (2017): J0330103. http://dx.doi.org/10.1299/jsmemecj.2017.j0330103.
Full textSuzuki, Osamu. "Thermal management for electronics equipment : problems and perspectives in industry." Reference Collection of Annual Meeting 2004.8 (2004): 334–35. http://dx.doi.org/10.1299/jsmemecjsm.2004.8.0_334.
Full textLu, T. J. "Thermal management of high power electronics with phase change cooling." International Journal of Heat and Mass Transfer 43, no. 13 (July 2000): 2245–56. http://dx.doi.org/10.1016/s0017-9310(99)00318-x.
Full textChrysler, Gregory M., and David T. Vader. "Electronics package with improved thermal management by thermoacoustic heat pumping." Journal of the Acoustical Society of America 96, no. 4 (October 1994): 2617. http://dx.doi.org/10.1121/1.410084.
Full textLan, Wei, Jiawei Zhang, Jiale Peng, Yiming Ma, Shuling Zhou, and Xiaobing Luo. "Distributed thermal management system for downhole electronics at high temperature." Applied Thermal Engineering 180 (November 2020): 115853. http://dx.doi.org/10.1016/j.applthermaleng.2020.115853.
Full textKandasamy, Ravi, Xiang-Qi Wang, and Arun S. Mujumdar. "Application of phase change materials in thermal management of electronics." Applied Thermal Engineering 27, no. 17-18 (December 2007): 2822–32. http://dx.doi.org/10.1016/j.applthermaleng.2006.12.013.
Full textWhitt, Reece, and David Huitink. "THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000398–403. http://dx.doi.org/10.4071/2380-4505-2019.1.000398.
Full textNovikov, A., J. Maxa, M. Nowottnick, M. Heimann, and K. Jarchoff. "Investigation of phase change materials for efficient thermal management of electronic modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000045–51. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000045.
Full textDeng, Yueguang, and Yi Jiang. "High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics." Applied Thermal Engineering 199 (November 2021): 117555. http://dx.doi.org/10.1016/j.applthermaleng.2021.117555.
Full textCui, Ying, Man Li, and Yongjie Hu. "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities." Journal of Materials Chemistry C 8, no. 31 (2020): 10568–86. http://dx.doi.org/10.1039/c9tc05415d.
Full textSang, Mingyu, Jongwoon Shin, Kiho Kim, and Ki Yu. "Electronic and Thermal Properties of Graphene and Recent Advances in Graphene Based Electronics Applications." Nanomaterials 9, no. 3 (March 5, 2019): 374. http://dx.doi.org/10.3390/nano9030374.
Full textShashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.
Full textHegab, Hisham E., Eric B. Zimmerman, and Gene T. Colwell. "Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers." Journal of Electronic Packaging 124, no. 1 (March 1, 2002): 7–11. http://dx.doi.org/10.1115/1.1392320.
Full textHithaish, Doddamani, V. Saravanan, C. K. Umesh, and K. N. Seetharamu. "Thermal management of Electronics: Numerical investigation of triangular finned heat sink." Thermal Science and Engineering Progress 30 (May 2022): 101246. http://dx.doi.org/10.1016/j.tsep.2022.101246.
Full textAnderson, Kevin R., Thomas Gross, Christopher McNamara, and Ariel Gatti. "Venus Lander Electronics Payload Thermal Management Using a Multistage Refrigeration System." Journal of Thermophysics and Heat Transfer 32, no. 3 (July 2018): 659–68. http://dx.doi.org/10.2514/1.t5286.
Full textMoita, Ana, António Moreira, and José Pereira. "Nanofluids for the Next Generation Thermal Management of Electronics: A Review." Symmetry 13, no. 8 (July 27, 2021): 1362. http://dx.doi.org/10.3390/sym13081362.
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