Journal articles: 'Thermal management of electronics'

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FAULKNER, DAN, MEHDY KHOTAN, and REZA SHEKARRIZ. "Managing Electronics Thermal Management." Heat Transfer Engineering 25, no. 2 (March 2004): 1–4. http://dx.doi.org/10.1080/01457630490275944.

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Xing, Wenkui, Yue Xu, Chengyi Song, and Tao Deng. "Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics." Nanomaterials 12, no. 19 (September 27, 2022): 3365. http://dx.doi.org/10.3390/nano12193365.

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With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

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Li, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. "Recent Advances on Thermal Management of Flexible Inorganic Electronics." Micromachines 11, no. 4 (April 9, 2020): 390. http://dx.doi.org/10.3390/mi11040390.

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Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.

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Song, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (November 26, 2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.

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Abstract Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics.

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Pang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.

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The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.

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Egan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (September 15, 1999): 98–106. http://dx.doi.org/10.1115/1.483140.

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Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition Manufacturing has created the opportunity to embed the electronics of wearable computers in a polymer composite substrate. As both a protective outer case and a conductive heat dissipating medium, the substrate satisfies two basic constraints of wearable computer design: ruggedness and cooling efficiency. One such application of embedded electronics is the VuMan3R, a wearable computer designed and manufactured at Carnegie Mellon University for aircraft maintenance. This paper combines finite element numerical simulations, physical experimentation, and analytical models to understand the thermal phenomena of embedded electronic design and to explore the thermal design space. Numerical models ascertain the effect of heat spreaders and polymer composite substrates on the thermal performance, while physical experimentation of an embedded electronic artifact ensures the accuracy of the numerical simulations and the practicality of the thermal design. Analytical models using thermal resistance networks predict the heat flow paths within the embedded electronic artifact as well as the role of conductive fillers used in polymer composites. [S1043-7398(00)00102-X]

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Shi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.

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Abstract As thermal protection substrates for wearable electronics, functional soft composites made of polymer materials embedded with phase change materials and metal layers demonstrate unique capabilities for the thermal protection of human skin. Here, we develop an analytical transient phase change heat transfer model to investigate the thermal performance of a wearable electronic device with a thermal protection substrate. The model is validated by experiments and the finite element analysis (FEA). The effects of the substrate structure size and heat source power input on the temperature management efficiency are investigated systematically and comprehensively. The results show that the objective of thermal management for wearable electronics is achieved by the following thermal protection mechanism. The metal thin film helps to dissipate heat along the in-plane direction by reconfiguring the direction of heat flow, while the phase change material assimilates excessive heat. These results will not only promote the fundamental understanding of the thermal properties of wearable electronics incorporating thermal protection substrates, but also facilitate the rational design of thermal protection substrates for wearable electronics.

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Kosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.

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Modern progress in electronics is associated with increase in computing ability and processing speed, as well as decrease in size. Future applications of electronic devices in aviation, aero space and high performance consumer products? industry demand on very stringent specifications concerning miniaturization, component density, power density and reliability. Excess heat produces stresses on internal components inside the electronic device, thus creating reliability problems. Thus, a problem of heat generation and its efficient removal arises and it has led to the development of advanced thermal control systems. Present research analyses a thermodynamic feasibility of micro capillary heat pumped net works in thermal management of electronic systems, considers basic technological constrains and de sign availability, and identifies perspective directions for the further studies. Computer Fluid Dynamics studies have been per formed on the laminar convective heat transfer and pressure drop of working fluid in silicon micro channels. Surface roughness is simulated via regular constructal, and stochastic models. Three-dimensional numerical solution shows significant effects of surface roughness in terms of the rough element geometry such as height, size, spacing and the channel height on the velocity and pressure fields.

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Yeh, L. T. "Review of Heat Transfer Technologies in Electronic Equipment." Journal of Electronic Packaging 117, no. 4 (December 1, 1995): 333–39. http://dx.doi.org/10.1115/1.2792113.

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Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.

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Anandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.

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Due to rapid growth in semiconductor technology, there is a continuous increase of the system power and the shrinkage of size. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper. .

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Babus'Haq, R. F., H. E. George, P. W. O'Callaghan, and B. A. Constant. "Thermal management of electronics: problems and analytical techniques." Computer-Aided Engineering Journal 7, no. 1 (1990): 23. http://dx.doi.org/10.1049/cae.1990.0006.

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Hamilton, S. "Developments in Passive Thermal Management Systems for Electronics." Circuit World 14, no. 1 (April 1987): 22–25. http://dx.doi.org/10.1108/eb043933.

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Kercher, D. S., Jeong-Bong Lee, O. Brand, M. G. Allen, and A. Glezer. "Microjet cooling devices for thermal management of electronics." IEEE Transactions on Components and Packaging Technologies 26, no. 2 (June 2003): 359–66. http://dx.doi.org/10.1109/tcapt.2003.815116.

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Shang, Bofeng, Yupu Ma, Run Hu, Chao Yuan, Jinyan Hu, and Xiaobing Luo. "Passive thermal management system for downhole electronics in harsh thermal environments." Applied Thermal Engineering 118 (May 2017): 593–99. http://dx.doi.org/10.1016/j.applthermaleng.2017.01.118.

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Lv, Yi-Gao, Gao-Peng Zhang, Qiu-Wang Wang, and Wen-Xiao Chu. "Thermal Management Technologies Used for High Heat Flux Automobiles and Aircraft: A Review." Energies 15, no. 21 (November 7, 2022): 8316. http://dx.doi.org/10.3390/en15218316.

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In recent years, global automotive industries are going through a significant revolution from traditional internal combustion engine vehicles (ICEVs) to electric vehicles (EVs) for CO2 emission reduction. Very similarly, the aviation industry is developing towards more electric aircraft (MEA) in response to the reduction in global CO2 emission. To promote this technology revolution and performance advancement, plenty of electronic devices with high heat flux are implemented on board automobiles and aircraft. To cope with the thermal challenges of electronics, in addition to developing wide bandgap (WBG) semiconductors with satisfactory electric and thermal performance, providing proper thermal management solutions may be a much more cost-effective way at present. This paper provides an overview of the thermal management technologies for electronics used in automobiles and aircraft. Meanwhile, the active methods include forced air cooling, indirect contact cold plate cooling, direct contact baseplate cooling, jet impingement, spray cooling, and so on. The passive methods include the use of various heat pipes and PCMs. The features, thermal performance, and development tendency of these active and passive thermal management technologies are reviewed in detail. Moreover, the environmental influences introduced by vibrations, shock, acceleration, and so on, on the thermal performance and reliability of the TMS are specially emphasized and discussed in detail, which are usually neglected in normal operating conditions. Eventually, the possible future directions are discussed, aiming to serve as a reference guide for engineers and promote the advancement of the next-generation electronics TMS in automobile and aircraft applications.

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Li, Mingli, Na Gong, Jinhui Wang, and Zhibin Lin. "Phase Change Material for Thermal Management in 3D Integrated Circuits Packaging." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000649–53. http://dx.doi.org/10.4071/isom-2015-tha44.

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Effective thermal control and management in three-dimensional electronic packaging are desirable to ensure the heat generated in integrated circuits can be dissipated. Conventional base materials in electronics from substrate to protective layers, due to low coefficient of thermal conductivity, cannot help to cool down the circuits, while such elevated temperature could highly impact the performance of the chips. In this study, phase change material (PCM) is selected for potential applications in thermal management of electronic packaging due to its isothermal nature and high thermal storage capability. PCM based composite is developed through the impregnation technology using highly porous expanded graphite. Heat transfer test results reveal that the PCM based composite displays superior heat storage capacity, while maintaining the favorable feature of thermal and chemical stabilization for electronic applications. Toward the end, the concept of implementation of PCM based composite is proposed in thermal control of 3D integrated circuits. It is expected the proposed composite will improve heat dissipation, and ultimately enhance the performance of the chips.

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Zhang, Hongli, Tiezhu Shi, and Aijie Ma. "Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material." Polymers 13, no. 16 (August 20, 2021): 2797. http://dx.doi.org/10.3390/polym13162797.

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The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

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Sato, Kimiyasu, Yuichi Tominaga, and Yusuke Imai. "Nanocelluloses and Related Materials Applicable in Thermal Management of Electronic Devices: A Review." Nanomaterials 10, no. 3 (March 2, 2020): 448. http://dx.doi.org/10.3390/nano10030448.

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Owing to formidable advances in the electronics industry, efficient heat removal in electronic devices has been an urgent issue. For thermal management, electrically insulating materials that have higher thermal conductivities are desired. Recently, nanocelluloses (NCs) and related materials have been intensely studied because they possess outstanding properties and can be produced from renewable resources. This article gives an overview of NCs and related materials potentially applicable in thermal management. Thermal conduction in dielectric materials arises from phonons propagation. We discuss the behavior of phonons in NCs as well.

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Baldwin, D. F., and J. T. Beerensson. "Thermal Management in Direct Chip Attach Assemblies." Journal of Electronic Packaging 121, no. 4 (December 1, 1999): 222–30. http://dx.doi.org/10.1115/1.2793844.

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Direct chip attach (DCA) packaging technologies are finding increasing application in electronics manufacturing particularly in telecommunications and consumer electronics. In these systems, bare die are interconnected directly to a printed circuit board. The two primary forms of DCA included chip on board (COB) where the die are attached face up and wirebonded to the substrate and flip chip on board (FCOB) where bumped die are interconnected active face down directly to low-cost organic substrates. In the current work, thermal management of four direct chip attach technologies is investigated. Experimental measurements are conducted exploring the junction-to-ambient thermal resistance and thermal dissipation paths for COB interconnection and three FCOB interconnect technologies including solder attach, anisotropic adhesive attach, and isotropic adhesive attach. A first-order chip-scale thermal design model is developed for flip chip assemblies exhibiting good agreement with the experimental measurements.

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Yin, Yafei, Min Li, Wei Yuan, Xiaolian Chen, and Yuhang Li. "A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures." Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences 475, no. 2228 (August 2019): 20190402. http://dx.doi.org/10.1098/rspa.2019.0402.

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Flexible electronics, as a relatively new category of device, exhibit prodigious potential in many applications, especially in bio-integrated fields. It is critical to understand that thermal management of certain kinds of exothermic flexible electronics is a crucial issue, whether to avoid or to take advantage of the excessive temperature. A widely adaptable analytical method, validated by finite-element analysis and experiments, is conducted to investigate the thermal properties of exothermic flexible electronics with a heat source in complex shape or complex array layout. The main theoretical strategy to obtain the thermal field is through an integral along the complex curve source region. The results predicted by the analytical model enable accurate control of temperature and heat flow in the flexible electronics, which may help in the design and fabrication of flexible electronic devices in the future.

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Habib, Numan, Muftooh ur Rehman Siddiqi, and Muhammad Tahir. "Thermal analysis of proposed heat sink design under natural convection for the thermal management of electronics." Thermal Science 26, no. 2 Part B (2022): 1487–501. http://dx.doi.org/10.2298/tsci210402307h.

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The rapid development in the field of electronics has led to high power densities and miniaturization of electronic packages. Because of the compact size of electronic devices, the rate of heat dissipation has increased drastically. Due to this reason, the air-cooling system with a conventional heat sink is insufficient to remove large quantity of heat. A novel macro-channel ?L-shaped heat sink? is pro-posed and analyzed to overcome this problem. The thermal resistance and fluid-flow behavior under natural convection, of the novel and conventional air-cooled heat sink designs, are analyzed. Governing equations are discretized and solved across the computational domain of the heat sink, with 3-D conjugate heat transfer model. Numerical results are validated through experimentation. The effect of parameters i.e., fin height, number of fins and heat sink size, on the thermal resistance and fluid-flow are reported. Examination of these parameters provide a better physical understanding from energy conservation and management view point. Substantial increase in the thermal performance is noted for the novel ?L-shaped heat sink? compared to the conventional design.

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Yang, Tianyu, Thomas Foulkes, Beomjin Kwon, Jin Gu Kang, Paul V. Braun, William P. King, and Nenad Miljkovic. "An Integrated Liquid Metal Thermal Switch for Active Thermal Management of Electronics." IEEE Transactions on Components, Packaging and Manufacturing Technology 9, no. 12 (December 2019): 2341–51. http://dx.doi.org/10.1109/tcpmt.2019.2930089.

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Haynes, A. S., and R. Sadangi. "Novel thermal barrier oxides for electronics thermal management: an assessment of WO3." Journal of Materials Science: Materials in Electronics 28, no. 21 (July 12, 2017): 16021–25. http://dx.doi.org/10.1007/s10854-017-7501-6.

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Moore, Arden L., and Li Shi. "Emerging challenges and materials for thermal management of electronics." Materials Today 17, no. 4 (May 2014): 163–74. http://dx.doi.org/10.1016/j.mattod.2014.04.003.

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Andresen, M., and M. Liserre. "Impact of active thermal management on power electronics design." Microelectronics Reliability 54, no. 9-10 (September 2014): 1935–39. http://dx.doi.org/10.1016/j.microrel.2014.07.069.

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Saravanan, V., and G. Kumaraguruparan. "Thermal management of microwave electronics in the radar system." ISSS Journal of Micro and Smart Systems 8, no. 2 (November 2019): 143–53. http://dx.doi.org/10.1007/s41683-019-00043-z.

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Panão, Miguel R. O., André M. Correia, and António L. N. Moreira. "High-power electronics thermal management with intermittent multijet sprays." Applied Thermal Engineering 37 (May 2012): 293–301. http://dx.doi.org/10.1016/j.applthermaleng.2011.11.031.

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Stiubianu, George-Theodor, Adrian Bele, Marian Grigoras, Codrin Tugui, Bianca-Iulia Ciubotaru, Mirela-Fernanda Zaltariov, Firuța Borza, Leandru-Gheorghe Bujoreanu, and Maria Cazacu. "Scalable Silicone Composites for Thermal Management in Flexible Stretchable Electronics." Batteries 8, no. 8 (August 18, 2022): 95. http://dx.doi.org/10.3390/batteries8080095.

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Hexagonal boron nitride (hBN) has been incorporated, as an active filler, in a customized silicone matrix to obtain high thermal conductivity composites, maintaining high flexibility and low dielectric permittivity, which are of interest for heat dissipation in energy storage systems (e.g., batteries or supercapacitors) and electronics. By the proper processing of the filler (i.e., hydrophobization with octamethylcyclotetrasiloxane and ultrasonic exfoliation) and its optimal loading (i.e., 10 wt%), composites with thermal conductivity up to 3.543 W·m−1·K−1 were obtained. Conductive heat flow (−280.04 W), measured in real heating–cooling conditions, proved to be superior to that of a commercial heatsink paste (−161.92 W), which has a much higher density (2.5 g/cm3 compared to 1.05 g/cm3 of these composites). The mechanical and electrical properties are also affected in a favorable way (increased modulus and elongation, low dielectric losses, and electrical conductivity) for applications as thermal management materials.

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Chowdhury, Srabanti. "Integrating Diamond for Cooling Electronics." ECS Meeting Abstracts MA2022-02, no. 32 (October 9, 2022): 1211. http://dx.doi.org/10.1149/ma2022-02321211mtgabs.

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III-Nitrides promise to offer high-frequency power amplifiers at higher power densities. This is attractive for realizing device platforms for 5G and beyond. It also enables integrating Si-based electronics to complement functionalities. However, to obtain the full potential of III-Nitrides one must operate these transistors at higher power densities, for which thermal management is crucial.Due to the continuous need for higher performance in various applications ranging from DC to W-band frequencies, semiconductor devices are pushed to higher power densities. This results in a higher junction temperature owing to the Joule heating in the channel resulting in device performance degradation and premature failure. Using devices based on wide-bandgap (WBG) semiconductors such as Gallium Nitride (GaN) and Gallium Oxide (GaOx) with a larger critical electric field and high-temperature tolerance, one could increase the power density. However, in order to increase the output power to the levels that is promised by these wide bandgap materials, junction temperature reduction through device-level cooling is critical. We are actively researching thermal management at device, circuit and packaging level using synthetic polycrystalline (PC) diamond. PC-diamond, at an appropriate grain size offers a TC is higher than any competing thermal vias with metals without interfering the electrical performance. Over the past 5 years we have demonstrated the potential of integrating diamond with GaN and recently achieving a record low diamond/GaN thermal boundary resistance (TBR) along with a relatively high diamond thermal conductivity (TC). This remarkable thermal performance was be achieved by maintaining the electrical performance, as demonstrated by the unharmed channel charge and mobility results. There are two key requirements for thermal management using heat spreading from the channel: first, a low thermal boundary resistance (TBR) between the hot spot in the channel and the heat spreader is required (in this study between GaN channel and diamond). Second, a low thermal resistance path to the heat-sink is crucial from the diamond layer which is directly proportional to diamond’s thermal conductivity (TC). In collaboration with Univ of Bristol, we have reported a TBR of ~3 m2K/GW, to date, known to be the lowest reported TBR for GaN HEMT technology. Diamond-GaN TBR depends strongly on the interface smoothness and the thickness of interfacial Si3N4 layer. A thinner Si3N4 resulted in lower TBR and allowed superior phonon coupling from the channel to the spreader. We have also measured a remarkably high TC for a 2 μm-thick diamond layer yielding over 650 W/m.K. The diamond grains are near isotropic in shape that allows excellent in-plane and cross-plane thermal conductivity. Achieving high TC within a thin film of diamond, grown heterogeneously, underscores the importance of our technique, since it reduces the residual stress when integrating with different materials that involves many thin layers like GaN/AlGaN HEMT epi-layers. β-Ga2O3 is an emerging ultra-wide bandgap material showing promises for both power and RF devices. However, the material’s low thermal conductivity poses to be a challenge for efficient power delivery (at any frequencies). PC diamond was successfully grown on (‾¯201)β-Ga2O3 using proper nucleation technique and thermal characterizations were conducted. A thermal conductivity (diamond + nucleation) and thermal boundary resistance at the diamond/β-Ga2O3 interface of 110 ± 33 W/mK and 30.2 ± 1.8 m2K/GW, respectively were measured. Our current results demonstrates a very promising roadmap for wide bandgap semiconductors via diamond integration.

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Paul, Riya, Amol Deshpande, Fang Luo, and Wei Fan. "Thermal Management in High-Density High-Power Electronics Modules Using Thermal Pyrolytic Graphite." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000259–63. http://dx.doi.org/10.4071/2380-4505-2020.1.000259.

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Abstract Tremendous effort is going on towards the packaging of power electronics modules to reduce the parasitic impedances and in turn, the voltage spikes during switching transients of power devices. The heat dissipated in terms of switching losses for high frequency applications need to be eliminated further to have some flexibility regarding the layout and, for the safe functioning of a power module by reducing junction temperature. Thermal pyrolytic graphite (TPG), with its high basal-plane thermal conductivity along the vertical direction helps direct heat towards the module bottom (cooling system), whereas its extremely low through-plane thermal conductivity along the horizontal direction guarantees minimum heat coupling among devices placed on the substrate surface. FEA simulations to verify thermal benefits of TPG and experimental results have been shown in this work which validates the junction temperature drop of up to 17 °C when using TPG as substrate and heat spreader compared with traditional materials.

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Malik, Faraz Kaiser, and Kristel Fobelets. "A review of thermal rectification in solid-state devices." Journal of Semiconductors 43, no. 10 (October 1, 2022): 103101. http://dx.doi.org/10.1088/1674-4926/43/10/103101.

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Abstract Thermal rectification, or the asymmetric transport of heat along a structure, has recently been investigated as a potential solution to the thermal management issues that accompany the miniaturization of electronic devices. Applications of this concept in thermal logic circuits analogous to existing electronics-based processor logic have also been proposed. This review highlights some of the techniques that have been recently investigated for their potential to induce asymmetric thermal conductivity in solid-state structures that are composed of materials of interest to the electronics industry. These rectification approaches are compared in terms of their quantitative performance, as well as the range of practical applications that they would be best suited to. Techniques applicable to a range of length scales, from the continuum regime to quantum dots, are discussed, and where available, experimental findings that build upon numerical simulations or analytical predictions are also highlighted.

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Abo-Zahhad, Essam M., Ahmed Amine Hachicha, Zafar Said, Chaouki Ghenai, and Shinichi Ookawara. "Thermal management system for high, dense, and compact power electronics." Energy Conversion and Management 268 (September 2022): 115975. http://dx.doi.org/10.1016/j.enconman.2022.115975.

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Wang, Chien-Ping. "Thermal Management for Portable Electronics Using a Piezoelectric Micro-Blower." IEEE Transactions on Device and Materials Reliability 19, no. 3 (September 2019): 563–67. http://dx.doi.org/10.1109/tdmr.2019.2933021.

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Park, Sangyoung, Soohee Han, and Naehyuck Chang. "Control-Theoretic Dynamic Thermal Management of Automotive Electronics Control Units." IEEE Journal on Emerging and Selected Topics in Circuits and Systems 1, no. 2 (June 2011): 102–8. http://dx.doi.org/10.1109/jetcas.2011.2158342.

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YUKI, Kazuhisa, Kio TAKAI, Ken-taro ANJU, Risako KIBUSHI, Noriyuki UNNO, Tetsuro OGUSHI, Masaaki MURAKAMI, and Takuya IDE. "Thermal management of electronics by uni-directional porous heat sinks." Proceedings of Mechanical Engineering Congress, Japan 2017 (2017): J0330103. http://dx.doi.org/10.1299/jsmemecj.2017.j0330103.

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Suzuki, Osamu. "Thermal management for electronics equipment : problems and perspectives in industry." Reference Collection of Annual Meeting 2004.8 (2004): 334–35. http://dx.doi.org/10.1299/jsmemecjsm.2004.8.0_334.

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Lu, T. J. "Thermal management of high power electronics with phase change cooling." International Journal of Heat and Mass Transfer 43, no. 13 (July 2000): 2245–56. http://dx.doi.org/10.1016/s0017-9310(99)00318-x.

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Chrysler, Gregory M., and David T. Vader. "Electronics package with improved thermal management by thermoacoustic heat pumping." Journal of the Acoustical Society of America 96, no. 4 (October 1994): 2617. http://dx.doi.org/10.1121/1.410084.

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Lan, Wei, Jiawei Zhang, Jiale Peng, Yiming Ma, Shuling Zhou, and Xiaobing Luo. "Distributed thermal management system for downhole electronics at high temperature." Applied Thermal Engineering 180 (November 2020): 115853. http://dx.doi.org/10.1016/j.applthermaleng.2020.115853.

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Kandasamy, Ravi, Xiang-Qi Wang, and Arun S. Mujumdar. "Application of phase change materials in thermal management of electronics." Applied Thermal Engineering 27, no. 17-18 (December 2007): 2822–32. http://dx.doi.org/10.1016/j.applthermaleng.2006.12.013.

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Whitt, Reece, and David Huitink. "THERMAL VALIDATIONS OF ADDITIVE MANUFACTURED NON-METALLIC HEAT SPREADING DEVICE FOR HOT SPOT MITIGATION IN POWER MODULES." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000398–403. http://dx.doi.org/10.4071/2380-4505-2019.1.000398.

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Abstract As energy demands and power electronics density scale concurrently, reliability of such devices is being challenged. Inadequate thermal management can cause system-wide failures due to thermal run-away, thermal expansion induced stresses, interconnect fractures and many more. Conventional techniques used to cool devices consist of heavy, metallic systems such as cold plates and large heat sinks, which can significantly reduce the overall system power density. Moreover, the manufacturing of such components is expensive and often requires custom-made cold plates for improved integration with the electronic system. Although used as a standard practice, these metallic thermal management systems have the potential to intensify electro-magnetic interference (EMI) when coupling with high frequency switching power electronics, and the material density increases the weight of the system, which is detrimental in mobile applications. Lastly, cold plates and heat sinks can create non-uniform cooling profiles in the electronics due to the insufficient management of hot-spots. To combat these drawbacks, a new heat spreader design has been proposed which reduces weight and EMI effects while eliminating hot-spots through localized fluid impingement. This current study describes the methodology and construction of the experimental test setup to characterize the performance of the heat spreading device compared to an off-the-shelf cold plate. Through infrared imagining, the viability of two heated test sections are evaluated in their ability to replicate power module temperature profiles during operation.

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Novikov, A., J. Maxa, M. Nowottnick, M. Heimann, and K. Jarchoff. "Investigation of phase change materials for efficient thermal management of electronic modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000045–51. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000045.

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Abstract Power electronics is a key technology for the advancement and spreading of electromobility applications and compact power supply devices on the market. The use of new WBG semiconductors (e.g. SiC, GaN) as well as highly integrated silicon-based power electronics enables a significant increase in power density with increasing integration. At the same time, however, this development requires costly thermal management solutions, since the power semiconductors generate considerable heat loss during operation. To ensure the robustness of the systems, the components must be protected from critical temperatures. Nowadays, a considerable effort for active and passive cooling by fans, microfluidic systems or heat pipes is operated. Compared with that, the usage of phase change materials (PCM) is a novel approach for sophisticated thermal management [1], [2]. In this paper some selected results of research project SWE-eT (Heat-retaining coatings for next-generation, efficient, compact power electronics) funded as part of KomroL program (Compact and robust power electronics of the next generation) of German Federal Ministry of Education and Research are presented. Main goal of this project is development, investigation and testing of efficient thermal management solutions based on heat-storing layer systems through phase transition processes. The research project was focused on investigation of sugar alcohols as PCM because of its wide range of melting temperature, high enthalpy of fusion and low cost.

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Deng, Yueguang, and Yi Jiang. "High-performance, safe, and reliable soft-metal thermal pad for thermal management of electronics." Applied Thermal Engineering 199 (November 2021): 117555. http://dx.doi.org/10.1016/j.applthermaleng.2021.117555.

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Cui, Ying, Man Li, and Yongjie Hu. "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities." Journal of Materials Chemistry C 8, no. 31 (2020): 10568–86. http://dx.doi.org/10.1039/c9tc05415d.

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Sang, Mingyu, Jongwoon Shin, Kiho Kim, and Ki Yu. "Electronic and Thermal Properties of Graphene and Recent Advances in Graphene Based Electronics Applications." Nanomaterials 9, no. 3 (March 5, 2019): 374. http://dx.doi.org/10.3390/nano9030374.

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Recently, graphene has been extensively researched in fundamental science and engineering fields and has been developed for various electronic applications in emerging technologies owing to its outstanding material properties, including superior electronic, thermal, optical and mechanical properties. Thus, graphene has enabled substantial progress in the development of the current electronic systems. Here, we introduce the most important electronic and thermal properties of graphene, including its high conductivity, quantum Hall effect, Dirac fermions, high Seebeck coefficient and thermoelectric effects. We also present up-to-date graphene-based applications: optical devices, electronic and thermal sensors, and energy management systems. These applications pave the way for advanced biomedical engineering, reliable human therapy, and environmental protection. In this review, we show that the development of graphene suggests substantial improvements in current electronic technologies and applications in healthcare systems.

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Shashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.

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Abstract Alumina and aluminum nitride substrates are routinely used in micro-electronic packaging where large quantity of heat needs to be dissipated, such as in LED packaging, high power electronics and laser packaging. Heat management in high power electronics or LED's is crucial for their lifespan and reliability. The ever-increasing need for higher power keeps challenging the packaging engineers to become more sophisticated in their packaging. With the availability of a 40 μm thick, high thermal conductivity ribbon alumina from Corning, the options available for packaging engineers has widened. This product has very high dielectric breakdown (~10kV at 40 μm thick), high thermal conductivity (>36 W/mK) and is rugged enough to be handled (with components attached) during packaging. These characteristics make ribbon alumina a cost-effective alternative to incumbent materials such as thick aluminum nitride, for use in high power microelectronics packaging. In this paper, high power LED and IGBT modules are modeled using commercially available code from ANSYS®. A geometry representative of typical LED packaging and IGBT packaging is constructed with Ansys Design Modeler platform and the allied meshing is done employing in-built Meshing tool in ANSYS Workbench®. We show that packaging with ~40 μm ribbon alumina delivers performance on par with or better than packaging with thicker aluminum nitride substrates.

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Hegab, Hisham E., Eric B. Zimmerman, and Gene T. Colwell. "Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers." Journal of Electronic Packaging 124, no. 1 (March 1, 2002): 7–11. http://dx.doi.org/10.1115/1.1392320.

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Telephone companies utilize densely packed electronics in outdoor metal cabinets for routing calls between customers. As a result of the increasing power densities of electronics, companies are looking for innovative methods of providing system level cooling such as using soil heat exchangers. Numerical simulation using a system of lumped thermal capacitances coupled to a soil finite element model is used to predict the transient thermal behavior of a cabinet. The cabinet model has been verified in previous studies by comparison with experimental measurements on a commercial telecommunications cabinet and is shown to predict temperature trends well. The effects of transient heat load, soil properties, and heat exchanger geometry are examined. Results reveal soil heat exchangers have the capability to provide the necessary cooling for relatively low power outdoor cabinets. However, the temperature of the soil surrounding the heat exchanger may increase daily if the number and spacing of pipes is not adequate to handle the desired heat dissipation load.

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Hithaish, Doddamani, V. Saravanan, C. K. Umesh, and K. N. Seetharamu. "Thermal management of Electronics: Numerical investigation of triangular finned heat sink." Thermal Science and Engineering Progress 30 (May 2022): 101246. http://dx.doi.org/10.1016/j.tsep.2022.101246.

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Anderson, Kevin R., Thomas Gross, Christopher McNamara, and Ariel Gatti. "Venus Lander Electronics Payload Thermal Management Using a Multistage Refrigeration System." Journal of Thermophysics and Heat Transfer 32, no. 3 (July 2018): 659–68. http://dx.doi.org/10.2514/1.t5286.

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Moita, Ana, António Moreira, and José Pereira. "Nanofluids for the Next Generation Thermal Management of Electronics: A Review." Symmetry 13, no. 8 (July 27, 2021): 1362. http://dx.doi.org/10.3390/sym13081362.

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Nowadays, the thermal management of electronic components, devices and systems is one of the most important challenges of this technological field. The ever-increasing miniaturization also entails the pressing need for the dissipation of higher power energy under the form of heat per unit of surface area by the cooling systems. The current work briefly describes the use on those cooling systems of the novel heat transfer fluids named nanofluids. Although not intensively applied in our daily use of electronic devices and appliances, the nanofluids have merited an in-depth research and investigative focus, with several recently published papers on the subject. The development of this cooling approach should give a sustained foothold to go on to further studies and developments on continuous miniaturization, together with more energy-efficient cooling systems and devices. Indeed, the superior thermophysical properties of the nanofluids, which are highlighted in this review, make those innovative fluids very promising for the aforementioned purpose. Moreover, the present work intends to contribute to the knowledge of the nanofluids and its most prominent results from the typical nanoparticles/base fluid mixtures used and combined in technical and functional solutions, based on fluid-surface interfacial flows.

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Journal articles on the topic 'Thermal management of electronics'

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