Relevant bibliographies by topics / Thermal management of electronics

Academic literature on the topic 'Thermal management of electronics'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "Thermal management of electronics"

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FAULKNER, DAN, MEHDY KHOTAN, and REZA SHEKARRIZ. "Managing Electronics Thermal Management." Heat Transfer Engineering 25, no. 2 (March 2004): 1–4. http://dx.doi.org/10.1080/01457630490275944.

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Xing, Wenkui, Yue Xu, Chengyi Song, and Tao Deng. "Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics." Nanomaterials 12, no. 19 (September 27, 2022): 3365. http://dx.doi.org/10.3390/nano12193365.

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With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.
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Li, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. "Recent Advances on Thermal Management of Flexible Inorganic Electronics." Micromachines 11, no. 4 (April 9, 2020): 390. http://dx.doi.org/10.3390/mi11040390.

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Flexible inorganic electronic devices (FIEDs) consisting of functional inorganic components on a soft polymer substrate have enabled many novel applications such as epidermal electronics and wearable electronics, which cannot be realized through conventional rigid electronics. The low thermal dissipation capacity of the soft polymer substrate of FIEDs demands proper thermal management to reduce the undesired thermal influences. The biointegrated applications of FIEDs pose even more stringent requirements on thermal management due to the sensitive nature of biological tissues to temperature. In this review, we take microscale inorganic light-emitting diodes (μ-ILEDs) as an example of functional components to summarize the recent advances on thermal management of FIEDs including thermal analysis, thermo-mechanical analysis and thermal designs of FIEDs with and without biological tissues. These results are very helpful to understand the underlying heat transfer mechanism and provide design guidelines to optimize FIEDs in practical applications.
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Song, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (November 26, 2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.

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Abstract Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics.
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Pang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.

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The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.
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Egan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (September 15, 1999): 98–106. http://dx.doi.org/10.1115/1.483140.

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Wearable computers are rugged, portable computers that can be comfortably worn on the body and easily operated for maintenance applications. The recently developed process of Shape Deposition Manufacturing has created the opportunity to embed the electronics of wearable computers in a polymer composite substrate. As both a protective outer case and a conductive heat dissipating medium, the substrate satisfies two basic constraints of wearable computer design: ruggedness and cooling efficiency. One such application of embedded electronics is the VuMan3R, a wearable computer designed and manufactured at Carnegie Mellon University for aircraft maintenance. This paper combines finite element numerical simulations, physical experimentation, and analytical models to understand the thermal phenomena of embedded electronic design and to explore the thermal design space. Numerical models ascertain the effect of heat spreaders and polymer composite substrates on the thermal performance, while physical experimentation of an embedded electronic artifact ensures the accuracy of the numerical simulations and the practicality of the thermal design. Analytical models using thermal resistance networks predict the heat flow paths within the embedded electronic artifact as well as the role of conductive fillers used in polymer composites. [S1043-7398(00)00102-X]
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Shi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.

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Abstract As thermal protection substrates for wearable electronics, functional soft composites made of polymer materials embedded with phase change materials and metal layers demonstrate unique capabilities for the thermal protection of human skin. Here, we develop an analytical transient phase change heat transfer model to investigate the thermal performance of a wearable electronic device with a thermal protection substrate. The model is validated by experiments and the finite element analysis (FEA). The effects of the substrate structure size and heat source power input on the temperature management efficiency are investigated systematically and comprehensively. The results show that the objective of thermal management for wearable electronics is achieved by the following thermal protection mechanism. The metal thin film helps to dissipate heat along the in-plane direction by reconfiguring the direction of heat flow, while the phase change material assimilates excessive heat. These results will not only promote the fundamental understanding of the thermal properties of wearable electronics incorporating thermal protection substrates, but also facilitate the rational design of thermal protection substrates for wearable electronics.
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Kosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.

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Modern progress in electronics is associated with increase in computing ability and processing speed, as well as decrease in size. Future applications of electronic devices in aviation, aero space and high performance consumer products? industry demand on very stringent specifications concerning miniaturization, component density, power density and reliability. Excess heat produces stresses on internal components inside the electronic device, thus creating reliability problems. Thus, a problem of heat generation and its efficient removal arises and it has led to the development of advanced thermal control systems. Present research analyses a thermodynamic feasibility of micro capillary heat pumped net works in thermal management of electronic systems, considers basic technological constrains and de sign availability, and identifies perspective directions for the further studies. Computer Fluid Dynamics studies have been per formed on the laminar convective heat transfer and pressure drop of working fluid in silicon micro channels. Surface roughness is simulated via regular constructal, and stochastic models. Three-dimensional numerical solution shows significant effects of surface roughness in terms of the rough element geometry such as height, size, spacing and the channel height on the velocity and pressure fields.
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Yeh, L. T. "Review of Heat Transfer Technologies in Electronic Equipment." Journal of Electronic Packaging 117, no. 4 (December 1, 1995): 333–39. http://dx.doi.org/10.1115/1.2792113.

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Thermal control has become a critical factor in the design of electronic equipment because of the recent trends in the electronic industry towards increased miniaturization of components and device heat dissipation. A great demand on the system performance and reliability also intensifies the needs for a better thermal management. The further evidence of importance of thermal consideration to an electronic system is due to the survey by the U.S. Air Force indicating that more than fifty percent of all electronics failures are caused by the undesirable temperature control. This paper reviews recent technologies in thermal control and management of electronic equipment.
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Anandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.

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Due to rapid growth in semiconductor technology, there is a continuous increase of the system power and the shrinkage of size. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper. .
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Dissertations / Theses on the topic "Thermal management of electronics"

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Mital, Manu. "Integrated Thermal Management Strategies for Embedded Power Electronic Modules." Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/30269.

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Almost all electronic devices require efficient conversion of electrical power from one form to another. Electrical power is used world wide at the rate of approximately 12 billion kW per hour. The Center for Power Electronics Systems at Virginia Tech was established with a vision to develop an integrated systems approach via integrated power electronic modules (IPEMs) to improve the reliability, cost-effectiveness, and performance of power electronics systems. IPEMs are multi-layered structures based on embedded power technology and offer the advantage of three-dimensional (3D) packaging of electronic components in a small and compact volume, replacing the traditional wire bonding technology. They have the potential to offer reduced time and effort associated with developing and manufacturing power processors. However, placing multiple heat generating chips in a small volume also makes thermal management more challenging. With the steady increase in the heat density of the electronic packages during the last few decades, thermal management is becoming a key enabling technology for the future growth of power electronics. The focus of this work is on using computational analysis tools and experimental techniques to assess fundamental and practical cooling limitations on IPEMs, developing both passive and active integrated thermal management strategies, and creating design guidelines for IPEMs based on both thermal and thermo-mechanical stress considerations. Specifically, a commercially available finite element package is used to create a 3D geometric layout of the electronic module. The baseline finite element numerical model is validated using bench-top wind tunnel experiments. The experimental setup is also employed to characterize the thermal behavior of chips in the multi-chip package and test the applicability of superposition methodology for temperature fields of chips within multi-chip modules. Using numerical models, both passive and active integrated thermal management strategies are investigated. The passive cooling strategies include advanced ceramic materials, copper trace thickness, and structural enhancements. Active cooling strategies include double-sided cooling using traditional heat sinks, and an extension of double-sided cooling concept using microchannels integrated with the module on both sides of embedded chips. The overall result of the work presented here is the better understanding of thermal issues and limitations with IPEM technology, and development of thermal design guidelines for cooling strategies that take into consideration both thermal and thermo-mechanical performance.
Ph. D.
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Wu, Yupeng. "Thermal management of concentrator photovoltaics." Thesis, University of Warwick, 2009. http://wrap.warwick.ac.uk/3218/.

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Photovoltaic Concentrator systems, which increase the solar radiation intensity on the photovoltaic cells, may reduce the system cost, if the cost of the concentrator is less than the photovoltaic material displaced. An Asymmetric Compound Parabolic Photovoltaic Concentrator (ACPPVC) for building façade integration with a solar concentration ratio of 2.0 has been designed, fabricated and experimentally characterised. The truncated ACPPVC has acceptance half angles of 0° and 55° and an absorber width of 125mm. Phase Change Materials (PCM) have been integrated to the rear of the PV panel to moderate the temperature rise of the PV and maintain good solar-electrical conversion efficiency. The thermal behaviour of a Fresnel lens PV Concentrator (FPVC) has also been studied in this work. A two-dimensional ray trace technique has been used to predict the optical performance and the angular acceptance of the ACPPVC system. The predicted highest optical efficiency was 88.67% for the ACPPVC-55 system. Extensive indoor experimental characterisation of a number of PV systems was undertaken for a range of incident solar radiation intensities using a highly collimated solar simulator developed specifically for this project. Experimental results showed that the electrical output from the ACPPVC-55 was approximately 1.8 of that of a non-concentrating PV system with similar solar cells area. The electrical conversion efficiency for the ACPPVC-55 system was further increased, when RT27 PCM was incorporated to its rear.
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Tighe, Christopher James Frederick. "Thermal management of solid state power switches." Thesis, University of Nottingham, 2011. http://eprints.nottingham.ac.uk/12714/.

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The transient temperature of solid state power switches is investigated using thermal resistance network modelling and experimental testing. The ability of a heat sink mounted to the top of the device to reduce the transient temperature is assessed. Transient temperatures for heat pulses of up to 100ms are of most interest. The transient temperature distribution inside a typical stack-up of a solid state power switch is characterised. The thermal effects of adding a heat sink to the top of the device are then assessed. A variety of heat sink thicknesses and materials are evaluated. Components of the device stack-up are varied in order to assess their affect on the effectiveness of the heat sink in reducing the device temperature. Thermal networks are successfully applied to model the transient heat conduction inside the stack-ups. This modelling technique allowed a good understanding of the thermal behaviour inside the stack-up and heat sink during the transient period. The concept of using a heat sink to suppress the transient temperature was validated experimentally on two types of solid state power switch.
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Stinnett, William A. "Thermal Management of Power Electronic Building Blocks." Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31389.

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Development of Power Electronic Building Block (PEBB) modules, initiated through the Office of Naval Research (ONR), is a promising enabling technology which will promote future electrical power systems. Key in this development is the thermal design of a PEBB packaging scheme that will manage the module's high heat dissipation levels. As temperatures in electronics are closely associated with operating efficiency and failure rates, management of thermal loads is necessary to ensure proper and reliable device performance. The current work investigates the thermal design requirements for a preliminary PEBB module developed by the NSF Center for Power Electronics Systems (CPES) at Virginia Tech. This module locates four primary heat-generating devices onto a copper bonded substrate in a multi-chip module format. The thermal impact of several design variables (including heat sink quality, substrate material, device spacing, and substrate and metallization thickness) are modeled within the multi-layer thermal analysis software TAMSä. Model results are in the form of metal layer surface temperatures that closely represent the device junction temperatures. Other design constraints such as electrical and material characteristics are also considered in the thermal design. Design results indicate for the device heat dissipation levels that a low resistance heat sink coupled with a high conductivity substrate, such as aluminum nitride, are required for acceptable device junction temperatures. Substrate performance, in the form of a spreading resistance component, will be negatively affected by a lower quality heat sink. Both forced air and cold plate cooling methods were found acceptable; factors such as environment, cost and integration will determine which solution is most feasible. Maximum surface temperatures can be lowered somewhat through adjustment of device spacing. However, this reduction was small compared to the impact on parasitic capacitance. Additionally, there is some thermal benefit to thicker high-conductivity substrates, whereas lower conductivity substrates will increase the maximum surface temperature. Thicker copper layers will prove beneficial though this benefit is not as great for higher conductivity substrates. Also discussed are the on-going and future development efforts that are expected to require thermal consideration. These consist of a top-level thermal bus for additional heat removal, the use of metal matrix composites and concepts for multi-module integration.
Master of Science
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McGlen, Ryan James. "Advanced thermal management techniques for high power electronics devices." Thesis, University of Newcastle Upon Tyne, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.533697.

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Jakaboski, Juan-Carlos. "Innovative Thermal Management of Electronics Used in Oil Well Logging." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/7255.

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The oil and gas industries use sophisticated logging tools during and after drilling. These logging tools employ internal electronics for sensing viscosity, pressure, temperature, and other important quantities. To protect the sensitive electronics, which typically have a maximum allowable temperature of 100 㬠they are shielded and insulated from the harsh external drilling environment. The insulation reduces the external heat input, but it also makes rejection of the heat generated within the electronics challenging. Electronic component failures promoted by elevated temperatures, and thermal stress, require a time consuming and expensive logging tool replacement process. Better thermal management of the electronics in logging tools promises to save oil and gas companies time and money. This research focuses on this critical thermal management challenge. Specifically, this thesis describes the design, fabrication, and test of an innovative thermal management system capable of cooling commercial-off-the-shelf electronics for extended periods in harsh ambient temperatures exceeding 200 㮠Resistive heaters embedded in quad-flat-packages simulate the electronics used in oil well logging. A custom high temperature oven facilitates the evaluation of a full scale prototype of the thermal management system. We anticipate the prototype device will validate computer modeling efforts on which its design was based, and advance future designs of the thermal management system.
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Mahanta, Nayandeep Kumar. "Characterization and Analysis of Graphite Nanocomposites for Thermal Management of Electronics." Case Western Reserve University School of Graduate Studies / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=case1246546934.

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Raut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.

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Pang, Ying-Feng. "Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/26035.

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With the increase dependency on electricity to provide correct form of electricity for lightning, machines, and home and office appliances, the need for the introduction of high reliability power electronics in converting the raw form of electricity into efficient electricity for these applications is uprising. One of the most common failures in power electronics is temperature related failure such as overheating. To address the issue of overheating, thermal management becomes an important mission in the design of the power electronics to ensure the functional power electronics. Different approaches are taken by academia and industry researchers to provide efficient power electronics. In particular, the Center for Power Electronics System (CPES) at Virginia Tech and four other universities presented the IPEM approach by introducing integrated power electronics modules (IPEM) as standardized units that will enable greater integration within power electronics systems and their end-use application. The IPEM approach increases the integration in the components that make up a power electronics system through novel a packaging technique known as Embedded Power technology. While the thermal behavior of commonly used packages such as pin grid arrays (PGA), ball grid array (BGA), or quad flat pack (QFP) are well-studied, the influence of the Embedded Power packaging architecture on the overall thermal performance of the IPEMs is not well known. This motivates the presentation of this dissertation in developing an in-depth understanding on the thermal behavior of the Embedded Power modules. In addition, this dissertation outlines some general guidelines for the thermal modeling and thermal testing for the Embedded Power modules. Finally, this dissertation summarizes a few thermal design guidelines for the Embedded Power modules. Hence, this dissertation aims to present significant and generalized scientific findings for the Embedded Power packaging from the thermal perspective. Both numerical and experimental approaches were used in the studies. Three-dimensional mathematical modeling and computational fluid dynamics (CFD) thermal analyses were performed using commercial numerical software, I-DEAS. Experiments were conducted to validate the numerical models, characterize the thermal performance of the Embedded Power modules, and investigate various cooling strategies for the Embedded Power modules. Validated thermal models were used for various thermal analyses including identifying potential thermal problems, recognizing critical thermal design parameters, and exploring different integrated cooling strategies. This research quantifies various thermal design parameters such as the geometrical effect and the material properties on the thermal performance of the Embedded Power modules. These parameters include the chip-to-chip distance, the copper trace area, the polyimide thickness, and the ceramic materials. Since the Embedded Power technology utilizes metallization bonding as interconnection, specific design parameters such as the interconnect via holes pattern and size, the metallization thickness, as well as the metallization materials were also explored to achieve best results based on thermal and stress analyses. With identified potential thermal problems and critical thermal design parameters, different integrated cooling strategies were studied. The concept of integrated cooling is to incorporate the cooling mechanisms into the structure of Embedded Power modules. The results showed that simple structural modifications to the current Embedded Power modules can reduce the maximum temperature of the module by as much as 24%. Further improvement can be achieved by employing double-sided cooling to the Embedded Power modules. Based on the findings from the thermal analyses, general design guidelines were developed for future design of such Embedded Power modules. In addition, thermal modeling and testing guidelines for the Embedded Power modules were also outlined in this dissertation.
Ph. D.
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Green, Craig Elkton. "Composite thermal capacitors for transient thermal management of multicore microprocessors." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44772.

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While 3D stacked multi-processor technology offers the potential for significant computing advantages, these architectures also face the significant challenge of small, localized hotspots with very large heat fluxes due to the placement of asymmetric cores, heterogeneous devices and performance driven layouts. In this thesis, a new thermal management solution is introduced that seeks to maximize the performance of microprocessors with dynamically managed power profiles. To mitigate the non-uniformities in chip temperature profiles resulting from the dynamic power maps, solid-liquid phase change materials (PCMs) with an embedded heat spreader network are strategically positioned near localized hotspots, resulting in a large increase in the local thermal capacitance in these problematic areas. Theoretical analysis shows that the increase in local thermal capacitance results in an almost twenty-fold increase in the time that a thermally constrained core can operate before a power gating or core migration event is required. Coupled to the PCMs are solid state coolers (SSCs) that serve as a means for fast regeneration of the PCMs during the cool down periods associated with throttling events. Using this combined PCM/SSC approach allows for devices that operate with the desirable combination of low throttling frequency and large overall core duty cycles, thus maximizing computational throughput. The impact of the thermophysical properties of the PCM on the device operating characteristics has been investigated from first principles in order to better inform the PCM selection or design process. Complementary to the theoretical characterization of the proposed thermal solution, a prototype device called a "Composite Thermal Capacitor (CTC)" that monolithically integrates micro heaters, PCMs and a spreader matrix into a Si test chip was fabricated and tested to validate the efficacy of the concept. A prototype CTC was shown to increase allowable device operating times by over 7X and address heat fluxes of up to ~395 W/cm2. Various methods for regenerating the CTC have been investigated, including air, liquid, and solid state cooling, and operational duty cycles of over 60% have been demonstrated.
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Books on the topic "Thermal management of electronics"

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Heat transfer: Thermal management of electronics. Boca Raton: Taylor & Francis, 2010.

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Jiang, Guosheng. Advanced Thermal Management Materials. New York, NY: Springer New York, 2013.

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Krishnan, Ravi. The market for electronics thermal management technologies. Norwalk, CT: Business Communications Co., 2002.

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Favreau, Marc. Hot markets: Thermal management technology for electronics. Norwalk, CT: Business Communications Co., 1996.

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Dace, Andrea. The market for electronics thermal management technologies. Norwalk, CT: Business Communications Co., 2000.

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Hienonen, Risto. Reliability of materials for the thermal management of electronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.

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Hoogendoorn, C. J., R. A. W. M. Henkes, and C. J. M. Lasance, eds. Thermal Management of Electronic Systems. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2.

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Sergent, Jerry E. Thermal management handbook: For electronic assemblies. New York: McGraw-Hill, 1998.

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Beyne, E., C. J. M. Lasance, and J. Berghmans, eds. Thermal Management of Electronic Systems II. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5506-9.

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Chu, R. C. (Richard C.), 1933-, ed. Thermal management of telecommunications equipment. New York: ASME Press, 2013.

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Book chapters on the topic "Thermal management of electronics"

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Ginsberg, Gerald L. "Thermal Management." In Electronic Equipment Packaging Technology, 215–48. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3542-3_9.

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Tye, R. P., and R. L. Gardner. "Recent innovations in thermal technology instrumentation applied to materials used in electronics applications." In Thermal Management of Electronic Systems, 191–200. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_17.

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Liu, Yong. "Thermal Management, Design, and Cooling for Power Electronics." In Power Electronic Packaging, 167–213. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-1053-9_6.

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Cocks, Rachele, David Clendenen, and Ludovic Chretien. "Design Considerations for Thermal Management of Electronics Enclosures." In Springer Proceedings in Mathematics & Statistics, 141–47. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-12307-3_20.

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Bhattacharya, Anandaroop, Je-young Chang, and Nicholas S. Haehn. "Thermal Management of Electronics Using Sprays and Droplets." In Energy, Environment, and Sustainability, 267–95. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-7233-8_10.

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Lienig, Jens, and Hans Bruemmer. "Thermal Management and Cooling." In Fundamentals of Electronic Systems Design, 75–146. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-55840-0_5.

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Jiang, Guosheng, Liyong Diao, and Ken Kuang. "Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications." In Advanced Thermal Management Materials, 89–98. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_6.

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Lasance, C. J. M. "Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research." In Thermal Management of Electronic Systems, 3–24. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_1.

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Manca, O., S. Nardini, and V. Naso. "Effect of radiation on natural convection in tilted channels." In Thermal Management of Electronic Systems, 117–26. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_10.

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Ottavy, N., M. Bourhrara, J. P. Le Jannou, and P. Paris. "Thermal Study of a Laser Diode Using a Finite Element Method Associated with a Meshing Superimposition Method." In Thermal Management of Electronic Systems, 129–38. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_11.

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Conference papers on the topic "Thermal management of electronics"

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Mahalingam, Raghav, Andrew Poynot, and Jeffrey Helsel. "Ultrathin synthetic jets for thermal management of consumer electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892225.

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Chow, Louis C., Maninder S. Sehmbey, and Tom Mahefkey. "Thermal management of low temperature electronics." In Proceedings of the 12th symposium on space nuclear power and propulsion: Conference on alternative power from space; Conference on accelerator-driven transmutation technologies and applications. AIP, 1995. http://dx.doi.org/10.1063/1.47085.

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Moreno, Gilberto, Jana R. Jeffers, Sreekant Narumanchi, and Kevin Bennion. "Passive two-phase cooling for automotive power electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892216.

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Shioga, Takeshi, and Yoshihiro Mizuno. "Micro loop heat pipe for mobile electronics applications." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100139.

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Dede, Ercan M. "Single-phase microchannel cold plate for hybrid vehicle electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892227.

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Hu, Xiao, Sivasubramani Krishnaswamy, Saeed Asgari, and Scott Stanton. "An efficient transient thermal model for electronics thermal management based on singular value decomposition." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100173.

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Boswell, Joe, Corey Wilson, Daniel Pounds, and Bruce Drolen. "Recent advances in oscillating heat pipes for passive electronics thermal management." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357350.

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Szel, Attila, Zoltan Sarkany, Marton Bein, Robin Bornoff, Andras Vass-Varnai, and Marta Rencz. "Lifetime estimation of power electronics modules considering the target application." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100183.

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Bloschock, Kristen P., and Avram Bar-Cohen. "Advanced thermal management technologies for defense electronics." In SPIE Defense, Security, and Sensing, edited by Raja Suresh. SPIE, 2012. http://dx.doi.org/10.1117/12.924349.

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Sahoo, Pranati. "A Review on Immersion Cooling for Power Electronics." In SAENIS TTTMS Thermal Management Systems Conference-2022. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2022. http://dx.doi.org/10.4271/2022-28-0446.

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Reports on the topic "Thermal management of electronics"

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Moreno, Gilberto. Power Electronics Thermal Management Research: Annual Progress Report. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1404874.

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Miljkovic, Nenad, Thomas Foulkes, Junho Oh, Patrick Birbarah, Robert Pilawa-Podgurski, and Jason C. Neely. Advanced Thermal Management for High Power Density Electronics. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1510616.

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Moreno, Gilbert. Power Electronics Thermal Management R&D: Annual Report. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1247463.

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Thomas, Scott K., and Andrew J. Fleming. Thermal Management of Next-Generation Power Electronics for the More-Electric Aircraft Initiative. Fort Belvoir, VA: Defense Technical Information Center, July 2005. http://dx.doi.org/10.21236/ada452622.

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Lin, Lanchao. Thermal Management Research for Power Generation. Delivery Order 0002 - Volume 1: Plain Fin Array Cooler for Electronics Cooling. Fort Belvoir, VA: Defense Technical Information Center, December 2002. http://dx.doi.org/10.21236/ada413410.

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Avis, William. Drivers, Barriers and Opportunities of E-waste Management in Africa. Institute of Development Studies (IDS), December 2021. http://dx.doi.org/10.19088/k4d.2022.016.

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Abstract:
Population growth, increasing prosperity and changing consumer habits globally are increasing demand for consumer electronics. Further to this, rapid changes in technology, falling prices and consumer appetite for better products have exacerbated e-waste management challenges and seen millions of tons of electronic devices become obsolete. This rapid literature review collates evidence from academic, policy focussed and grey literature on e-waste management in Africa. This report provides an overview of constitutes e-waste, the environmental and health impacts of e-waste, of the barriers to effective e-waste management, the opportunities associated with effective e-waste management and of the limited literature available that estimate future volumes of e-waste. Africa generated a total of 2.9 million Mt of e-waste, or 2.5 kg per capita, the lowest regional rate in the world. Africa’s e-waste is the product of Local and imported Sources of Used Electronic and Electrical Equipment (UEEE). Challenges in e-waste management in Africa are exacerbated by a lack of awareness, environmental legislation and limited financial resources. Proper disposal of e-waste requires training and investment in recycling and management technology as improper processing can have severe environmental and health effects. In Africa, thirteen countries have been identified as having a national e-waste legislation/policy.. The main barriers to effective e-waste management include: Insufficient legislative frameworks and government agencies’ lack of capacity to enforce regulations, Infrastructure, Operating standards and transparency, illegal imports, Security, Data gaps, Trust, Informality and Costs. Aspirations associated with energy transition and net zero are laudable, products associated with these goals can become major contributors to the e-waste challenge. The necessary wind turbines, solar panels, electric car batteries, and other "green" technologies require vast amounts of resources. Further to this, at the end of their lifetime, they can pose environmental hazards. An example of e-waste associated with energy transitions can be gleaned from the solar power sector. Different types of solar power cells need to undergo different treatments (mechanical, thermal, chemical) depending on type to recover the valuable metals contained. Similar issues apply to waste associated with other energy transition technologies. Although e-waste contains toxic and hazardous metals such as barium and mercury among others, it also contains non-ferrous metals such as copper, aluminium and precious metals such as gold and copper, which if recycled could have a value exceeding 55 billion euros. There thus exists an opportunity to convert existing e-waste challenges into an economic opportunity.
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Spahr, Sydney, Ephraim Maltz, and Nelson Buck. Automation and Electronics for Dairy Herd Management. United States Department of Agriculture, January 1987. http://dx.doi.org/10.32747/1987.7695595.bard.

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Bayba, Andrew J., and Derwin F. Washington. Initial Experiments on Thermal Interface Materials for Electronics Packaging. Fort Belvoir, VA: Defense Technical Information Center, December 2012. http://dx.doi.org/10.21236/ada571796.

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Savrun, E., C. Toy, and M. Sarikaya. High Thermal Conductivity AlN Packages for High-Temperature Electronics. Fort Belvoir, VA: Defense Technical Information Center, September 1998. http://dx.doi.org/10.21236/ada359647.

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DEFENSE ELECTRONICS SUPPLY CENTER DAYTON OH. DESC (Defense Electronics Supply Center) Total Quality Management Plan. Fort Belvoir, VA: Defense Technical Information Center, April 1989. http://dx.doi.org/10.21236/ada212900.

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