Academic literature on the topic 'Thermal management of electronics'
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Journal articles on the topic "Thermal management of electronics"
FAULKNER, DAN, MEHDY KHOTAN, and REZA SHEKARRIZ. "Managing Electronics Thermal Management." Heat Transfer Engineering 25, no. 2 (March 2004): 1–4. http://dx.doi.org/10.1080/01457630490275944.
Full textXing, Wenkui, Yue Xu, Chengyi Song, and Tao Deng. "Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics." Nanomaterials 12, no. 19 (September 27, 2022): 3365. http://dx.doi.org/10.3390/nano12193365.
Full textLi, Yuhang, Jiayun Chen, Shuang Zhao, and Jizhou Song. "Recent Advances on Thermal Management of Flexible Inorganic Electronics." Micromachines 11, no. 4 (April 9, 2020): 390. http://dx.doi.org/10.3390/mi11040390.
Full textSong, Jizhou, Xue Feng, and Yonggang Huang. "Mechanics and thermal management of stretchable inorganic electronics." National Science Review 3, no. 1 (November 26, 2015): 128–43. http://dx.doi.org/10.1093/nsr/nwv078.
Full textPang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.
Full textEgan, Eric, and Cristina H. Amon. "Thermal Management Strategies for Embedded Electronic Components of Wearable Computers." Journal of Electronic Packaging 122, no. 2 (September 15, 1999): 98–106. http://dx.doi.org/10.1115/1.483140.
Full textShi, Yingli, Junyun Ji, Yafei Yin, Yuhang Li, and Yufeng Xing. "Analytical transient phase change heat transfer model of wearable electronics with a thermal protection substrate." Applied Mathematics and Mechanics 41, no. 11 (October 19, 2020): 1599–610. http://dx.doi.org/10.1007/s10483-020-2671-7.
Full textKosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.
Full textYeh, L. T. "Review of Heat Transfer Technologies in Electronic Equipment." Journal of Electronic Packaging 117, no. 4 (December 1, 1995): 333–39. http://dx.doi.org/10.1115/1.2792113.
Full textAnandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.
Full textDissertations / Theses on the topic "Thermal management of electronics"
Mital, Manu. "Integrated Thermal Management Strategies for Embedded Power Electronic Modules." Diss., Virginia Tech, 2006. http://hdl.handle.net/10919/30269.
Full textPh. D.
Wu, Yupeng. "Thermal management of concentrator photovoltaics." Thesis, University of Warwick, 2009. http://wrap.warwick.ac.uk/3218/.
Full textTighe, Christopher James Frederick. "Thermal management of solid state power switches." Thesis, University of Nottingham, 2011. http://eprints.nottingham.ac.uk/12714/.
Full textStinnett, William A. "Thermal Management of Power Electronic Building Blocks." Thesis, Virginia Tech, 1999. http://hdl.handle.net/10919/31389.
Full textMaster of Science
McGlen, Ryan James. "Advanced thermal management techniques for high power electronics devices." Thesis, University of Newcastle Upon Tyne, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.533697.
Full textJakaboski, Juan-Carlos. "Innovative Thermal Management of Electronics Used in Oil Well Logging." Thesis, Georgia Institute of Technology, 2004. http://hdl.handle.net/1853/7255.
Full textMahanta, Nayandeep Kumar. "Characterization and Analysis of Graphite Nanocomposites for Thermal Management of Electronics." Case Western Reserve University School of Graduate Studies / OhioLINK, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=case1246546934.
Full textRaut, Rahul. "Thermal management of heat sensitive components in Pb-free assembly." Diss., Online access via UMI:, 2005.
Find full textPang, Ying-Feng. "Assessment of Thermal Behavior and Development of Thermal Design Guidelines for Integrated Power Electronics Modules." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/26035.
Full textPh. D.
Green, Craig Elkton. "Composite thermal capacitors for transient thermal management of multicore microprocessors." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/44772.
Full textBooks on the topic "Thermal management of electronics"
Heat transfer: Thermal management of electronics. Boca Raton: Taylor & Francis, 2010.
Find full textJiang, Guosheng. Advanced Thermal Management Materials. New York, NY: Springer New York, 2013.
Find full textKrishnan, Ravi. The market for electronics thermal management technologies. Norwalk, CT: Business Communications Co., 2002.
Find full textFavreau, Marc. Hot markets: Thermal management technology for electronics. Norwalk, CT: Business Communications Co., 1996.
Find full textDace, Andrea. The market for electronics thermal management technologies. Norwalk, CT: Business Communications Co., 2000.
Find full textHienonen, Risto. Reliability of materials for the thermal management of electronics. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2006.
Find full textHoogendoorn, C. J., R. A. W. M. Henkes, and C. J. M. Lasance, eds. Thermal Management of Electronic Systems. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2.
Full textSergent, Jerry E. Thermal management handbook: For electronic assemblies. New York: McGraw-Hill, 1998.
Find full textBeyne, E., C. J. M. Lasance, and J. Berghmans, eds. Thermal Management of Electronic Systems II. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5506-9.
Full textChu, R. C. (Richard C.), 1933-, ed. Thermal management of telecommunications equipment. New York: ASME Press, 2013.
Find full textBook chapters on the topic "Thermal management of electronics"
Ginsberg, Gerald L. "Thermal Management." In Electronic Equipment Packaging Technology, 215–48. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3542-3_9.
Full textTye, R. P., and R. L. Gardner. "Recent innovations in thermal technology instrumentation applied to materials used in electronics applications." In Thermal Management of Electronic Systems, 191–200. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_17.
Full textLiu, Yong. "Thermal Management, Design, and Cooling for Power Electronics." In Power Electronic Packaging, 167–213. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4614-1053-9_6.
Full textCocks, Rachele, David Clendenen, and Ludovic Chretien. "Design Considerations for Thermal Management of Electronics Enclosures." In Springer Proceedings in Mathematics & Statistics, 141–47. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-12307-3_20.
Full textBhattacharya, Anandaroop, Je-young Chang, and Nicholas S. Haehn. "Thermal Management of Electronics Using Sprays and Droplets." In Energy, Environment, and Sustainability, 267–95. Singapore: Springer Singapore, 2017. http://dx.doi.org/10.1007/978-981-10-7233-8_10.
Full textLienig, Jens, and Hans Bruemmer. "Thermal Management and Cooling." In Fundamentals of Electronic Systems Design, 75–146. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-55840-0_5.
Full textJiang, Guosheng, Liyong Diao, and Ken Kuang. "Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications." In Advanced Thermal Management Materials, 89–98. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_6.
Full textLasance, C. J. M. "Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research." In Thermal Management of Electronic Systems, 3–24. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_1.
Full textManca, O., S. Nardini, and V. Naso. "Effect of radiation on natural convection in tilted channels." In Thermal Management of Electronic Systems, 117–26. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_10.
Full textOttavy, N., M. Bourhrara, J. P. Le Jannou, and P. Paris. "Thermal Study of a Laser Diode Using a Finite Element Method Associated with a Meshing Superimposition Method." In Thermal Management of Electronic Systems, 129–38. Dordrecht: Springer Netherlands, 1994. http://dx.doi.org/10.1007/978-94-011-1082-2_11.
Full textConference papers on the topic "Thermal management of electronics"
Mahalingam, Raghav, Andrew Poynot, and Jeffrey Helsel. "Ultrathin synthetic jets for thermal management of consumer electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892225.
Full textChow, Louis C., Maninder S. Sehmbey, and Tom Mahefkey. "Thermal management of low temperature electronics." In Proceedings of the 12th symposium on space nuclear power and propulsion: Conference on alternative power from space; Conference on accelerator-driven transmutation technologies and applications. AIP, 1995. http://dx.doi.org/10.1063/1.47085.
Full textMoreno, Gilberto, Jana R. Jeffers, Sreekant Narumanchi, and Kevin Bennion. "Passive two-phase cooling for automotive power electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892216.
Full textShioga, Takeshi, and Yoshihiro Mizuno. "Micro loop heat pipe for mobile electronics applications." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100139.
Full textDede, Ercan M. "Single-phase microchannel cold plate for hybrid vehicle electronics." In 2014 30th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM). IEEE, 2014. http://dx.doi.org/10.1109/semi-therm.2014.6892227.
Full textHu, Xiao, Sivasubramani Krishnaswamy, Saeed Asgari, and Scott Stanton. "An efficient transient thermal model for electronics thermal management based on singular value decomposition." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100173.
Full textBoswell, Joe, Corey Wilson, Daniel Pounds, and Bruce Drolen. "Recent advances in oscillating heat pipes for passive electronics thermal management." In 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2018. http://dx.doi.org/10.1109/semi-therm.2018.8357350.
Full textSzel, Attila, Zoltan Sarkany, Marton Bein, Robin Bornoff, Andras Vass-Varnai, and Marta Rencz. "Lifetime estimation of power electronics modules considering the target application." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100183.
Full textBloschock, Kristen P., and Avram Bar-Cohen. "Advanced thermal management technologies for defense electronics." In SPIE Defense, Security, and Sensing, edited by Raja Suresh. SPIE, 2012. http://dx.doi.org/10.1117/12.924349.
Full textSahoo, Pranati. "A Review on Immersion Cooling for Power Electronics." In SAENIS TTTMS Thermal Management Systems Conference-2022. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2022. http://dx.doi.org/10.4271/2022-28-0446.
Full textReports on the topic "Thermal management of electronics"
Moreno, Gilberto. Power Electronics Thermal Management Research: Annual Progress Report. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1404874.
Full textMiljkovic, Nenad, Thomas Foulkes, Junho Oh, Patrick Birbarah, Robert Pilawa-Podgurski, and Jason C. Neely. Advanced Thermal Management for High Power Density Electronics. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1510616.
Full textMoreno, Gilbert. Power Electronics Thermal Management R&D: Annual Report. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1247463.
Full textThomas, Scott K., and Andrew J. Fleming. Thermal Management of Next-Generation Power Electronics for the More-Electric Aircraft Initiative. Fort Belvoir, VA: Defense Technical Information Center, July 2005. http://dx.doi.org/10.21236/ada452622.
Full textLin, Lanchao. Thermal Management Research for Power Generation. Delivery Order 0002 - Volume 1: Plain Fin Array Cooler for Electronics Cooling. Fort Belvoir, VA: Defense Technical Information Center, December 2002. http://dx.doi.org/10.21236/ada413410.
Full textAvis, William. Drivers, Barriers and Opportunities of E-waste Management in Africa. Institute of Development Studies (IDS), December 2021. http://dx.doi.org/10.19088/k4d.2022.016.
Full textSpahr, Sydney, Ephraim Maltz, and Nelson Buck. Automation and Electronics for Dairy Herd Management. United States Department of Agriculture, January 1987. http://dx.doi.org/10.32747/1987.7695595.bard.
Full textBayba, Andrew J., and Derwin F. Washington. Initial Experiments on Thermal Interface Materials for Electronics Packaging. Fort Belvoir, VA: Defense Technical Information Center, December 2012. http://dx.doi.org/10.21236/ada571796.
Full textSavrun, E., C. Toy, and M. Sarikaya. High Thermal Conductivity AlN Packages for High-Temperature Electronics. Fort Belvoir, VA: Defense Technical Information Center, September 1998. http://dx.doi.org/10.21236/ada359647.
Full textDEFENSE ELECTRONICS SUPPLY CENTER DAYTON OH. DESC (Defense Electronics Supply Center) Total Quality Management Plan. Fort Belvoir, VA: Defense Technical Information Center, April 1989. http://dx.doi.org/10.21236/ada212900.
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