Journal articles: 'Thermal management challenges'

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Baxendale, Anthony. "Design Challenges in Underbonnet Thermal Management." ATZautotechnology 4, no. 1 (January 2004): 52–55. http://dx.doi.org/10.1007/bf03246807.

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Schmidt, R. R., E. E. Cruz, and M. Iyengar. "Challenges of data center thermal management." IBM Journal of Research and Development 49, no. 4.5 (July 2005): 709–23. http://dx.doi.org/10.1147/rd.494.0709.

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Affonso, Walter, Ricardo Gandolfi, Ricardo Jose Nunes dos Reis, Carlos Roberto Ilário da Silva, Nicolas Rodio, Timoleon Kipouros, Panagiotis Laskaridis, et al. "Thermal Management challenges for HEA – FUTPRINT 50." IOP Conference Series: Materials Science and Engineering 1024, no. 1 (January 1, 2021): 012075. http://dx.doi.org/10.1088/1757-899x/1024/1/012075.

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Singh, Tanuj, Roland Nolte, Antonella Calamiello, and Cedric Rouaud. "Holistic Thermal Management for Future CO2 Challenges." ATZ worldwide 117, no. 7-8 (June 30, 2015): 20–25. http://dx.doi.org/10.1007/s38311-015-0042-9.

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Narasimhan, Susheela, Herman Chu, Mudasir Ahmad, and Li Li. "Thermal Challenges in 3D Stacks." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001354–72. http://dx.doi.org/10.4071/2012dpc-wa11.

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Thermal Management of high performance 3D SiP Modules is gaining momentum in telecommunication and networking applications. With increasing need for bandwidth and reduced real estate on boards, there is an acute need for 3D SiP modules. At the same time, the stacked modules come with a host of new challenges in terms of thermal management, packaging, thermo-mechanical stresses etc. This study looks at one such module with stacked dies for memories along with another high performance silicon all under a single lid. The study focuses on the effect of underfill materials on thermal performance, effect of through silicon vias, effect of non-uniform heat source on hot spots on the die etc. It will also focus on thermal management of a single module as well as a series of modules in a networking application. The effect of thermo-mechanical stresses will also be investigated and conclusions drawn on the effect of each of these parameters.

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Freeman, Jeffrey, Philip Osterkamp, Michael Green, Andrew Gibson, and Benjamin Schiltgen. "Challenges and opportunities for electric aircraft thermal management." Aircraft Engineering and Aerospace Technology 86, no. 6 (September 30, 2014): 519–24. http://dx.doi.org/10.1108/aeat-04-2014-0042.

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Wang, Evelyn N. "INTRODUCTION: CHALLENGES AND OPPORTUNITIES IN THERMAL MANAGEMENT TECHNOLOGIES." Annual Review of Heat Transfer 18 (2015): 1–6. http://dx.doi.org/10.1615/annualrevheattransfer.2015012604.

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Nienaber, J. A., and G. L. Hahn. "Livestock production system management responses to thermal challenges." International Journal of Biometeorology 52, no. 2 (May 25, 2007): 149–57. http://dx.doi.org/10.1007/s00484-007-0103-x.

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Garimella, Suresh V., Lian-Tuu Yeh, and Tim Persoons. "Thermal Management Challenges in Telecommunication Systems and Data Centers." IEEE Transactions on Components, Packaging and Manufacturing Technology 2, no. 8 (August 2012): 1307–16. http://dx.doi.org/10.1109/tcpmt.2012.2185797.

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Moore, Arden L., and Li Shi. "Emerging challenges and materials for thermal management of electronics." Materials Today 17, no. 4 (May 2014): 163–74. http://dx.doi.org/10.1016/j.mattod.2014.04.003.

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Pischinger, Stefan, Peter Genender, Stefan Klopstein, and David Hemkemeyer. "Challenges in Thermal Management of Hybrid and Electric Vehicles." ATZ worldwide 116, no. 4 (March 12, 2014): 36–41. http://dx.doi.org/10.1007/s38311-014-0164-5.

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Balasingam, Balakumar, Mostafa Ahmed, and Krishna Pattipati. "Battery Management Systems—Challenges and Some Solutions." Energies 13, no. 11 (June 2, 2020): 2825. http://dx.doi.org/10.3390/en13112825.

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Electric vehicles are set to be the dominant form of transportation in the near future and Lithium-based rechargeable battery packs have been widely adopted in them. Battery packs need to be constantly monitored and managed in order to maintain the safety, efficiency and reliability of the overall electric vehicle system. A battery management system consists of a battery fuel gauge, optimal charging algorithm, and cell/thermal balancing circuitry. It uses three non-invasive measurements from the battery, voltage, current and temperature, in order to estimate crucial states and parameters of the battery system, such as battery impedance, battery capacity, state of charge, state of health, power fade, and remaining useful life. These estimates are important for the proper functioning of optimal charging algorithms, charge and thermal balancing strategies, and battery safety mechanisms. Approach to robust battery management consists of accurate characterization, robust estimation of battery states and parameters, and optimal battery control strategies. This paper describes some recent approaches developed by the authors towards developing a robust battery management system.

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Friedrichs, Peter, and Reinhold Bayerer. "SiC High Power Devices – Challenges for Assembly and Thermal Management." Materials Science Forum 740-742 (January 2013): 869–72. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.869.

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Silicon carbide power devices are intended and to enter new application regimes in power electronics, in fact, they are enabling components mainly if higher switching frequencies in power electronics are considered. This trend can be clearly observed since power density can be increased and efforts towards passive components and other mechanical contributions to the system can be reduced. However, this trend imposes new challenges towards the surrounding of the chips in form of the package itself and the whole system around. Stray components like inductances and impedance elements become crucial elements in the whole circuit what results in the fact that a simple exchange of silicon chips by silicon carbide in a given package can be ruled out. In addition different considerations regarding the thermal design especially in power modules arise when SiC chips are considered, triggered by the fact that the cost balance between assembly and chip is shifted compared to silicon based solutions. Thus, different optimization criteria can be used, leading to new design approaches for power modules. The following paper will give a first inside how those boundary conditions can be implemented in innovative solutions using SiC components.

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Cheramy, Severine. "Thermal & mechanical challenges for 3DIC integration." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001622–45. http://dx.doi.org/10.4071/2013dpc-wp32.

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3DIC integration is considered as one of the biggest revolutions coming in the next few years in microelectronics and assembly: revolution for the integration & process - from front end to 3D final assembly; revolution for supply chain, design tools, test and characterization...Impact of 3D process and stacking on Cmos and associated design rules that this integration will generate is a key point to ensure the real interest of 3D stacking. Many recent results tend to prove that some of those challenges are undertaken and on the good way to be solved: 2,5D integration, a step toward 3DIC, is already under production, and thus proposes some embryos of solutions. We can assume that when 2,5D will come with relevant yields and throughputs, the step toward 3DIC will be easier to climb. Nevertheless, 3DIC will come with specific challenges: thermal impact, coupling effect, stress impact...This paper is an overview of past and current work at Cea-Léti on those thematic. Among others, thermal modeling and characterization is given. Technological solutions at device level are proposed to reduce areas & impacts of hot points. Secondly, mechanical management of an interposer is detailed: especially with a large interposer, included high density of interconnections, warp management is a key point during 3D process steps, but also during 3D assembly. For this thematic also, some characterizations are given with some proposed solutions. Finally, a review of major 3D technological steps with associated possible impacts on performances is given. It gives both the already done work, and some of the challenges still to address.

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van Heerden, A. S. J., D. M. Judt, S. Jafari, C. P. Lawson, T. Nikolaidis, and D. Bosak. "Aircraft thermal management: Practices, technology, system architectures, future challenges, and opportunities." Progress in Aerospace Sciences 128 (January 2022): 100767. http://dx.doi.org/10.1016/j.paerosci.2021.100767.

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Previati, Giorgio, Giampiero Mastinu, and Massimiliano Gobbi. "Thermal Management of Electrified Vehicles—A Review." Energies 15, no. 4 (February 11, 2022): 1326. http://dx.doi.org/10.3390/en15041326.

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Vehicle electrification demands a deep analysis of the thermal problems in order to increase vehicle efficiency and battery life and performance. An efficient thermal management of an electrified vehicle has to involve every system of the vehicle. However, it is not sufficient to optimize the thermal behavior of each subsystem, but thermal management has to be considered at system level to optimize the global performance of the vehicle. The present paper provides an organic review of the current aspects of thermal management from a system engineering perspective. Starting from the definition of the requirements and targets of the thermal management system, each vehicle subsystem is analyzed and related to the whole system. In this framework, problems referring to modeling, simulation and optimization are considered and discussed. The current technological challenges and developments in thermal management are highlighted at vehicle and component levels.

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Otiaba, K. C., N. N. Ekere, E. H. Amalu, R. S. Bhatti, and S. Mallik. "Thermal Management Materials for Electronic Control Unit: Trends, Processing Technology and R and D Challenges." Advanced Materials Research 367 (October 2011): 301–7. http://dx.doi.org/10.4028/www.scientific.net/amr.367.301.

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The development of advanced thermal management materials for Electronic Control Unit (ECU) is the key to achieving high reliability and thus safety critical operations in areas of ECU applications such as automotives and power systems. Thermal management issues associated with the operation of ECU at elevated temperature have accounted for some of the recent reliability concerns which have culminated in current systems failures in some automobiles. As the functions of ECU in systems have increased in recent times, the number of components per unit area on its board has also risen. High board density boosts internal heat generated per unit time in ECU ambient. The generated heat induces stress and strain at the chip interconnects due to variation in the Coefficient of Thermal Expansion (CTE) and thermal conductivity of different bonded materials in the assembly. Thermal degradation could become critical and impacts device’s efficiency. The life expectancy of electronic components reduces exponentially as the operating temperature rises thus making thermal management pivotal in electronic system reliability. Since materials’ properties vary with operating condition, material performance has become a major consideration in the design of heat dissipation mechanism in ECU. The development of advanced thermal management materials and hence improving the performance of ECU requires an in-depth understanding of the complex relationship between materials’ properties and their behaviours at elevated temperatures. The paper presents an overview of thermal management materials, review trends in material and processing technology. In addition, the paper outlines the crucial challenges in materials, cost and composite formulations and the outstanding R & D issues.

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Dahham, Rami Y., Haiqiao Wei, and Jiaying Pan. "Improving Thermal Efficiency of Internal Combustion Engines: Recent Progress and Remaining Challenges." Energies 15, no. 17 (August 26, 2022): 6222. http://dx.doi.org/10.3390/en15176222.

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Improving thermal efficiency and reducing carbon emissions are the permanent themes for internal combustion (IC) engines. In the past decades, various advanced strategies have been proposed to achieve higher efficiency and cleaner combustion with the increasingly stringent fuel economy and emission regulations. This article reviews the recent progress in the improvement of thermal efficiency of IC engines and provides a comprehensive summary of the latest research on thermal efficiency from aspects of thermodynamic cycles, gas exchange systems, advanced combustion strategies, and thermal and energy management. Meanwhile, the remaining challenges in different modules are also discussed. It shows that with the development of advanced technologies, it is highly positive to achieve 55% and even over 60% in effective thermal efficiency for IC engines. However, different technologies such as hybrid thermal cycles, variable intake systems, extreme condition combustion (manifesting low temperature, high pressure, and lean burning), and effective thermal and energy management are suggested to be closely integrated into the whole powertrains with highly developed electrification and intelligence.

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Zakaria, Irnie Azlin, Zeno Michael, and Wan Ahmad Najmi Wan Mohamed. "Nanofluid as Cooling Medium in Polymer Electrolyte Membrane (PEM) Fuel Cell: A Study on Potentials and Possibilities." Advanced Materials Research 1109 (June 2015): 319–23. http://dx.doi.org/10.4028/www.scientific.net/amr.1109.319.

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Keywords:Thermal management; PEM fuel cell;NanofluidAbstract. Tremendous need for an optimum conversion efficiency of a Polymer Exchange Membrane Fuel Cell (PEMFC) operation has triggered varieties of advancements namely on the thermal management engineering scope. Excellent heat dissipation is correlated to higher performance of a fuel cell thus increasing its conversion efficiency. This study reveals the potential advancement in thermal engineering of a fuel cell stack related to nanofluid technology. Nanofluids are seen as a potential evolution of nanotechnology hybridisation with fuel cell serving as a cooling medium. The thermophysical characteristics have been reviewed and challenges with regards to fuel cell application is discussed. Nanofluid has been successfully tested on many thermal management systems isolated from thermoelectrical environments such as fuel cell. The main challenge is formulating a nanofluid coolant with high thermal conductivity but with strict limit on electrical conductivity of less than 5 μS/cm. Lack of electrical conductivity data for various nanofluids in open literature is another challenge in nanofluid application in fuel cell.

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Ogunmodimu, Olumide, and Edmund C. Okoroigwe. "Solar thermal electricity in Nigeria: Prospects and challenges." Energy Policy 128 (May 2019): 440–48. http://dx.doi.org/10.1016/j.enpol.2019.01.013.

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Shah, A. K., M. H. Thaker, and K. B. Vyas. "Challenges in Characterization and Acceptance of Metal Matrix Composite “Carrier Plate” Material for Space Applications." Materials Science Forum 710 (January 2012): 412–17. http://dx.doi.org/10.4028/www.scientific.net/msf.710.412.

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In space applications, day by day, the electronic devices are becoming compact with increase in operating frequencies and high power requirements posing challenges in design and selection of materials for high thermal dissipation requirements. In order to achieve optimum performance from thermal management material, engineers have to focus on high reliable, cost effective alternatives. Such materials need to demonstrate excellent thermal conduction to minimize thermo-mechanical stress and fatigue due to operations like soldering, thermal cycling and severe operating conditions. The paper describes a new family of thermal management composite material called “SILVAR”.

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Patel, Prachi, and Subhash L. Shinde. "Materials opportunities and challenges for low-energy computing: Thermal management and interconnects." MRS Bulletin 45, no. 6 (June 2020): 422–23. http://dx.doi.org/10.1557/mrs.2020.156.

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Liang, Kunfeng, Moran Wang, Chunyan Gao, Bin Dong, Changzhen Feng, Xun Zhou, and Jing Liu. "Advances and challenges of integrated thermal management technologies for pure electric vehicles." Sustainable Energy Technologies and Assessments 46 (August 2021): 101319. http://dx.doi.org/10.1016/j.seta.2021.101319.

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Garimella, Suresh V., Tim Persoons, Justin A. Weibel, and Vadim Gektin. "Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions." IEEE Transactions on Components, Packaging and Manufacturing Technology 7, no. 8 (August 2017): 1191–205. http://dx.doi.org/10.1109/tcpmt.2016.2603600.

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Iqbal, Md Arif, Naveen Kumar Macha, Wafi Danesh, Sehtab Hossain, and Mostafizur Rahman. "Thermal management challenges and mitigation techniques for transistor-level 3-D integration." Microelectronics Journal 91 (September 2019): 61–69. http://dx.doi.org/10.1016/j.mejo.2019.07.004.

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Zhong, Jianfeng, Zihao Yang, Liangchen Tan, and Shouli Jiang. "Research on Structure Integration and Thermal Control Technology of RF Microsystem." Journal of Physics: Conference Series 2083, no. 2 (November 1, 2021): 022096. http://dx.doi.org/10.1088/1742-6596/2083/2/022096.

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Abstract The urgent demand for small volume and light weight of APAR brings new challenges to the integration of radio frequency (referred to as RF) structure. This paper reveals the importance and characteristics of RF microsystem structure integration. Then the new challenges and key technologies in the process of microsystem integration are studied, such as system level thermal management and application of high thermal conductivity, multiphysics simulation and so on. In the end the further thinking of the integration and thermal management technology is illustrated.

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Anandan, Sundaram, and Velraj Ramalingam. "Thermal management of electronics: A review of literature." Thermal Science 12, no. 2 (2008): 5–26. http://dx.doi.org/10.2298/tsci0802005a.

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Due to rapid growth in semiconductor technology, there is a continuous increase of the system power and the shrinkage of size. This resulted in inevitable challenges in the field of thermal management of electronics to maintain the desirable operating temperature. The present paper reviews the literature dealing with various aspects of cooling methods. Included are papers on experimental work on analyzing cooling technique and its stability, numerical modeling, natural convection, and advanced cooling methods. The issues of thermal management of electronics, development of new effective cooling schemes by using advanced materials and manufacturing methods are also enumerated in this paper. .

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Li, Bo, Huang Kuo, Xuehui Wang, Yiyi Chen, Yangang Wang, David Gerada, Sean Worall, Ian Stone, and Yuying Yan. "Thermal Management of Electrified Propulsion System for Low-Carbon Vehicles." Automotive Innovation 3, no. 4 (December 2020): 299–316. http://dx.doi.org/10.1007/s42154-020-00124-y.

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AbstractAn overview of current thermal challenges in transport electrification is introduced in order to underpin the research developments and trends of recent thermal management techniques. Currently, explorations of intelligent thermal management and control strategies prevail among car manufacturers in the context of climate change and global warming impacts. Therefore, major cutting-edge systematic approaches in electrified powertrain are summarized in the first place. In particular, the important role of heating, ventilation and air-condition system (HVAC) is emphasised. The trends in developing efficient HVAC system for future electrified powertrain are analysed. Then electric machine efficiency is under spotlight which could be improved by introducing new thermal management techniques and strengthening the efforts of driveline integrations. The demanded integration efforts are expected to provide better value per volume, or more power output/torque per unit with smaller form factor. Driven by demands, major thermal issues of high-power density machines are raised including the comprehensive understanding of thermal path, and multiphysics challenges are addressed whilst embedding power electronic semiconductors, non-isotropic electromagnetic materials and thermal insulation materials. Last but not least, the present review has listed several typical cooling techniques such as liquid cooling jacket, impingement/spray cooling and immersion cooling that could be applied to facilitate the development of integrated electric machine, and a mechanic-electric-thermal holistic approach is suggested at early design phase. Conclusively, a brief summary of the emerging new cooling techniques is presented and the keys to a successful integration are concluded.

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Pratt, D. M., and D. Moorhouse. "System integration of high intensity energy subsystems – a thermal management challenge." Aeronautical Journal 112, no. 1134 (August 2008): 477–82. http://dx.doi.org/10.1017/s000192400000244x.

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Current and future Air Force weapons systems lack the necessary power and cooling capacity to provide full systems level capability as a result of energy and thermal management limitations. Cooling capacity of fuel is already fully utilised leaving little room for additional cooling needs. Additionally, increasing speed, power, and miniaturisation of future systems continue to stress any thermal management capability that we can now deliver. Thus, the focus of this paper is a conceptual assessment of the key energy and thermal management technologies to meet the future energy challenges. It presents an overview of the current state of the art and also possible future research.

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Cui, Ying, Man Li, and Yongjie Hu. "Emerging interface materials for electronics thermal management: experiments, modeling, and new opportunities." Journal of Materials Chemistry C 8, no. 31 (2020): 10568–86. http://dx.doi.org/10.1039/c9tc05415d.

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Cheng, Zhe. "Thermal science and engineering in third-generation semiconductor materials and devices." Acta Physica Sinica 70, no. 23 (2021): 236502. http://dx.doi.org/10.7498/aps.70.20211662.

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The history of semiconductor materials is briefly reviewed in this work. By taking GaN-based high electron mobility transistor as an example, the heat generation mechanisms and thermal management strategies of wide bandgap semiconductor devices are discussed. Moreover, by taking β-Ga2O3 as an example, the thermal management challenges of emerging ultrawide bandgap semiconductors are briefly discussed. The following discussions focus on the interfacial thermal transport which widely exists in the semiconductor devices mentioned above. The recent advancements in room-temperature wafer bonding for thermal management applications are summarized. Furthermore, some open questions about the physical understanding of interfacial thermal transport are also mentioned. Finally, the theoretical models for calculating thermal boundary conductance are reviewed and the challenges and opportunities are pointed out.

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Zheng, Da Yu, Juan Zheng, Xiang Yi Guan, Jia Zheng, and Yi Ming Zhang. "Review of Materials and Environment Management for Solar Thermal Collectors." Applied Mechanics and Materials 521 (February 2014): 539–42. http://dx.doi.org/10.4028/www.scientific.net/amm.521.539.

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To cover the main contributions and developments in solar thermal collectors through focusing on materials, heat transfer characteristics and manufacturing challenges. A range of published papers and internet research including research work on various solar thermal collectors (flat plate, evacuated tubes, and heat pipe tube) were used. Evaluation of solar collectors performance is critiqued to aid solar technologies make the transition into a specific dominant solar collector. The sources are sorted into sections: finding an academic job, general advice, teaching, research and publishing, tenure and organizations. Provides information about types of solar thermal collectors, indicating what can be added by using evacuated tube collectors instead of flat plate collectors and what can be added by using heat pipe collectors instead of evacuated tubes. Focusing only on three types of solar thermal collectors (flat plate, evacuated tubes, and heat pipe tube). Useful source of information for consultancy and impartial advice for graduate students planning to do research in solar thermal technologies. This paper fulfils identified information about materials and heat transfer properties of materials and manufacturing challenges of these three solar thermal collectors. Describes some changes made to improve the environment which have had unforeseen and adverse effects on safety and the reasons why we need more case histories. Also discusses the reasons why there are no permanent solutions to safety problems and the reasons why senior managers should become more involved in safety problems.

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Wang, Kang-Jia, Hong-Chang Sun, Cui-Ling Li, Guo-Dong Wang, and Hong-Wei Zhu. "Thermal management of the hotspots in 3-D integrated circuits." Thermal Science 22, no. 4 (2018): 1685–90. http://dx.doi.org/10.2298/tsci1804685w.

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Vertical integration for microelectronics possesses significant challenges due to its fast dissipation of heat generated in multiple device planes. This paper focuses on thermal management of a 3-D integrated circuit, and micro-channel cooling is adopted to deal with the 3-D integrated circuitthermal problems. In addition, thermal through-silicon vias are also used to improve the capacity of heat trans-mission. It is found that combination of microchannel cooling and thermal through-silicon vias can remarkably alleviate the hotspots. The results presented in this paper are expected to aid in the development of thermal design guidelines for 3-D integrated circuits.

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Jafari, Soheil, and Theoklis Nikolaidis. "Thermal Management Systems for Civil Aircraft Engines: Review, Challenges and Exploring the Future." Applied Sciences 8, no. 11 (October 24, 2018): 2044. http://dx.doi.org/10.3390/app8112044.

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This paper examines and analytically reviews the thermal management systems proposed over the past six decades for gas turbine civil aero engines. The objective is to establish the evident system shortcomings and to identify the remaining research questions that need to be addressed to enable this important technology to be adopted by next generation of aero engines with complicated designs. Future gas turbine aero engines will be more efficient, compact and will have more electric parts. As a result, more heat will be generated by the different electrical components and avionics. Consequently, alternative methods should be used to dissipate this extra heat as the current thermal management systems are already working on their limits. For this purpose, different structures and ideas in this field are stated in terms of considering engines architecture, the improved engine efficiency, the reduced emission level and the improved fuel economy. This is followed by a historical coverage of the proposed concepts dating back to 1958. Possible thermal management systems development concepts are then classified into four distinct classes: classic, centralized, revolutionary and cost-effective; and critically reviewed from challenges and implementation considerations points of view. Based on this analysis, the potential solutions for dealing with future challenges are proposed including combination of centralized and revolutionary developments and combination of classic and cost-effective developments. The effectiveness of the proposed solutions is also discussed with a complexity-impact correlation analysis.

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Sivageerthi, T., Bathrinath Sankaranarayanan, Syed Mithun Ali, Ali AlArjani, and Koppiahraj Karuppiah. "Modeling Challenges for Improving the Heat Rate Performance in a Thermal Power Plant: Implications for SDGs in Energy Supply Chains." Sustainability 14, no. 8 (April 10, 2022): 4510. http://dx.doi.org/10.3390/su14084510.

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Rapid industrialization and the increased use of consumer electronic goods have increased the demand for energy. To meet the increasing energy demand, global nations are looking for energy from renewable sources rather than non-renewable sources, to adhere with the sustainability principle. As energy from renewable sources is still in the experimental stage, there is a need to use available energy sources optimally. Considering this, the present study aims to identify, evaluate, and reveal the interrelationship among critical challenge factors in improving the heat rate performance of coal-fired thermal power plants. The study identifies twenty critical challenges through a comprehensive literature review. Then, to evaluate the identified critical challenges, the grey-DEMATEL (Decision Making Trial and Evaluation Laboratory) technique is used. For evaluating the challenges, this study conducts an empirical analysis in a thermal power plant in India. The findings reveal that air preheater leakage, coal flow balancing, and air heater air outlet temperature are the top three critical challenges hampering the thermal power plant’s performance. Additionally, fourteen challenges come under the cause group, while eight challenges come under the effect group. The findings of the study can assist industrial managers in overcoming problems in their thermal power plants. The results can also guide the development of a robust and reliable framework for mitigating these challenges.

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Shahjalal, Mohammad, Tamanna Shams, Md Emtiajul Islam, Wasif Alam, Mrinmoy Modak, Sadat Bin Hossain, Venkatasailanathan Ramadesigan, Md Rishad Ahmed, Hafiz Ahmed, and Atif Iqbal. "A review of thermal management for Li-ion batteries: Prospects, challenges, and issues." Journal of Energy Storage 39 (July 2021): 102518. http://dx.doi.org/10.1016/j.est.2021.102518.

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Satapathy, Suchismita. "An Investigation on sustainable supply chain management challenges for Indian thermal power plants." International Journal of Logistics Systems and Management 1, no. 1 (2020): 1. http://dx.doi.org/10.1504/ijlsm.2020.10020884.

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Satapathy, Suchismita. "An investigation on sustainable supply chain management challenges for Indian thermal power plants." International Journal of Logistics Systems and Management 37, no. 2 (2020): 173. http://dx.doi.org/10.1504/ijlsm.2020.110582.

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Lin, Jiayuan, Xinhua Liu, Shen Li, Cheng Zhang, and Shichun Yang. "A review on recent progress, challenges and perspective of battery thermal management system." International Journal of Heat and Mass Transfer 167 (March 2021): 120834. http://dx.doi.org/10.1016/j.ijheatmasstransfer.2020.120834.

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Zhang, Hongli, Tiezhu Shi, and Aijie Ma. "Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material." Polymers 13, no. 16 (August 20, 2021): 2797. http://dx.doi.org/10.3390/polym13162797.

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The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

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El-Azab, Rasha. "Smart homes: potentials and challenges." Clean Energy 5, no. 2 (June 1, 2021): 302–15. http://dx.doi.org/10.1093/ce/zkab010.

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Abstract Decentralized distributed clean-energy sources have become an essential need for smart grids to reduce the harmful effects of conventional power plants. Smart homes with a suitable sizing process and proper energy-management schemes can share in reducing the whole grid demand and even sell clean energy to the utility. Smart homes have been introduced recently as an alternative solution to classical power-system problems, such as the emissions of thermal plants and blackout hazards due to bulk plants/transmission outages. The appliances, sources and energy storage of smart homes should be coordinated with the requirements of homeowners via a suitable energy-management scheme. Energy-management systems are the main key to optimizing both home sources and the operation of loads to maximize home-economic benefits while keeping a comfortable lifestyle. The intermittent uncertain nature of smart homes may badly affect the whole grid performance. The prospective high penetration of smart homes on a smart power grid will introduce new, unusual scenarios in both generation and loading. In this paper, the main features and requirements of smart homes are defined. This review aims also to address recent proposed smart-home energy-management schemes. Moreover, smart-grid challenges with a high penetration of smart-home power are discussed.

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Hsu, Yih-Yun. "Some challenges to the thermal-hydraulic codes." Nuclear Engineering and Design 151, no. 1 (November 1994): 103–11. http://dx.doi.org/10.1016/0029-5493(94)90036-1.

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Yin, Jing, Shangming Wang, Xuehao Sang, Zhifu Zhou, Bin Chen, Panidis Thrassos, Alexandros Romeos, and Athanasios Giannadakis. "Spray Cooling as a High-Efficient Thermal Management Solution: A Review." Energies 15, no. 22 (November 15, 2022): 8547. http://dx.doi.org/10.3390/en15228547.

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As one of the most promising thermal management solutions, spray cooling has the advantages of high heat-transfer coefficient and maintaining a low temperature of the cooling surface. By summarizing the influential factors and practical applications of spray cooling, the current challenges and bottlenecks were indicated so as to prompt its potential applications in the future. Firstly, this paper reviewed the heat-transfer mechanism of spray cooling and found that spray cooling is more advantageous for heat dissipation in high-power electronic devices by comparing it with other cooling techniques. Secondly, the latest experimental studies on spray cooling were reviewed in detail, especially the effects of spray parameters, types of working fluid, surface modification, and environmental parameters on the performance of cooling system. Afterwards, the configuration and design of the spray cooling system, as well as its applications in the actual industry (data centers, hybrid electric vehicles, and so on) were enumerated and summarized. Finally, the scientific challenges and technical bottlenecks encountered in the theoretical research and industrial application of spray cooling technology were discussed, and the direction of future efforts were reasonably speculated.

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Chiriac, Victor. "Optimal Thermal Management of Microelectronic Packages." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001617–34. http://dx.doi.org/10.4071/2010dpc-poster8.

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The increasing trend in power levels and associated densities leads to the need of design thermal optimization, at module and at system (module-board stack-up) levels. The microelectronics industry is facing multiple challenges as it tries to promote smaller, faster and cost-effective packages, yet trying to cope with potential thermal bottlenecks. The present study investigates a family of packages, whose thermal and electrical performances are far superior to the classic (standard) packages. A 3-D conjugate numerical study was conducted to evaluate the thermal performance of Gallium Arsenic (GaAs) die packaged in Quad Flat No Lead (QFN) packages for various wireless and networking applications. Two different QFN packages are investigated: a standard package and a Power package (PQFN) with thicker leadframe and solder die attach. The thermal impact of die attach material, leadframe thickness, die pad size, and board structure is evaluated and provides valuable information for product designers. Two powering scenarios are investigated: 1) one for standard operating parameters and 2) an alternative for extreme operating powering scenarios. Results indicate that the peak temperature reached on the die for 3x3 mm QFN under normal powering conditions is ~138.5°C (or 119°C/W junction-to-air thermal resistance), while for the extreme scenario, the junction temperature is ~186°C (or 125°C/W junction-to-air thermal resistance). The top Au metal layer has limited impact on lateral heat spreading. Under extreme powering conditions, the PQFN package reaches a peak temperature of ~126°C (66°C/W thermal resistance). A ~32% reduction in peak temperature is achieved with the 5x5 PQFN package. The improvement is mainly due to the larger package size, high conductivity die attach material, thicker leadframe and more board thermal vias. A parametric study shows that the increase in leadframe thickness from 0.2 mm (8 mils) to 0.5 mm (20 mils) in the QFN package leads to only 3% reduction in peak temperature. By comparison, the die attach material (conductive epoxy vs. solder) has significant impact on overall reduction in peak temperature (~12%). Experimental measurements using Infrared (IR) Microscope are performed to validate the numerical results.

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Kumar, Sunil, Stephen R. Smith, Geoff Fowler, Costas Velis, S. Jyoti Kumar, Shashi Arya, Rena, Rakesh Kumar, and Christopher Cheeseman. "Challenges and opportunities associated with waste management in India." Royal Society Open Science 4, no. 3 (March 2017): 160764. http://dx.doi.org/10.1098/rsos.160764.

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India faces major environmental challenges associated with waste generation and inadequate waste collection, transport, treatment and disposal. Current systems in India cannot cope with the volumes of waste generated by an increasing urban population, and this impacts on the environment and public health. The challenges and barriers are significant, but so are the opportunities. This paper reports on an international seminar on ‘Sustainable solid waste management for cities: opportunities in South Asian Association for Regional Cooperation (SAARC) countries’ organized by the Council of Scientific and Industrial Research-National Environmental Engineering Research Institute and the Royal Society. A priority is to move from reliance on waste dumps that offer no environmental protection, to waste management systems that retain useful resources within the economy. Waste segregation at source and use of specialized waste processing facilities to separate recyclable materials has a key role. Disposal of residual waste after extraction of material resources needs engineered landfill sites and/or investment in waste-to-energy facilities. The potential for energy generation from landfill via methane extraction or thermal treatment is a major opportunity, but a key barrier is the shortage of qualified engineers and environmental professionals with the experience to deliver improved waste management systems in India.

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Liu, Jian, Mengyao Xu, Rongdi Zhang, Xirui Zhang, and Wenxiong Xi. "Progress of Porous/Lattice Structures Applied in Thermal Management Technology of Aerospace Applications." Aerospace 9, no. 12 (December 15, 2022): 827. http://dx.doi.org/10.3390/aerospace9120827.

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With lightweight, multifunctional, and designable characteristics, porous/lattice structures have started to be used in aerospace applications. Porous/lattice structures applied in the thermal management technology of aerospace vehicles have attracted much attention. In the past few years, many related numerical and experimental investigations on flow, heat transfer, modelling methodology, and manufacturing technology of porous/lattice structures applied in thermal management systems have been widely conducted. This paper lists the investigations and applications of porous/lattice structures applied in thermal management technology from two aspects, i.e., heat transfer enhancement by porous/lattice structures and transpiration cooling. In addition, future developments and challenges based on the previous investigations are analyzed and summarized. With the higher requirements of thermal protection for aerospace applications in the future, thermal management technology based on porous/lattice structures shows good prospects.

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Appert, Jonathan. "Examining Whether to GEL or PAD." New Electronics 54, no. 11 (June 22, 2021): 20–21. http://dx.doi.org/10.12968/s0047-9624(22)60301-8.

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Grosu, Vicentiu, Chris Lindgren, Tamas Vejsz, Ya-Chi Chen, and Avijit Bhunia. "Thermal Management Solutions for Network File Server Used in Avionics Applications." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000419–27. http://dx.doi.org/10.4071/isom-wa24.

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In the modern era of commercial aviation there is an increasing need for establishing on-aircraft networks that interconnect legacy avionics systems for the purpose of data collection, health monitoring, and software management. At the heart of these networks are flightworthy file servers that perform similar functions to servers used in ground-based IT infrastructures. However, the size, weight, and power constraints for airborne servers are significantly more challenging than the constraints placed on groundbased equipment. As a result, the critical goals in the development of aircraft network systems are reducing the size and weight, maximizing the performance and reliability, and reducing cost. One of the main challenges includes dissipating high power in small packages within a confined space. This makes thermal management a critical component of the overall LRU (Line-Replaceable Unit) design. In addition, passive cooling systems are often required in place of internal fans in order to improve long-term reliability of the system. This presents another set of challenges, such as optimizing the airflow provided by the aircraft in the electronics compartment. This paper will present some of the critical elements of thermal management such as heat sinking, component placement, thermal interface materials, thermal vias, thermal links, heat spreader, packaging approaches and cooling strategies. The design and optimization of this system are based on analytical solutions, conjugated heat transfer and experimental results. Thermal management solutions must enable reliable operation under various environmental conditions: ground operation, flight operation, high operating temperature and loss of cooling air. Each environmental condition has different parameters for coolant airflow rate, effect of the surroundings, and ambient and coolant air temperature. Cooling airflow analyses were performed using CFD (Computational Fluid Dynamics). We have identified multiple approaches to remove heat from the critical components through optimization of the components and subsystems. These same approaches also serve to increase the system's performance and reliability.

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Xie, John Y., Hong Shi, Yuan Li, Zhe Li, Arif Rahman, Karthik Chandrasekar, Deepa Ratakonda, et al. "Enabling the 2.5D Integration." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000254–67. http://dx.doi.org/10.4071/isom-2012-tp15.

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3D IC is the viable revolutionary technology that will enable system-level integration, miniaturization, optimal power management, increased data bandwidth, and eventually reduced system cost. Like any breakthrough technologies, it faces many challenges. Design methodology, integration technology, manufacturing process and new industrial ecosystem are the areas of focus. This paper will discuss these challenges and Altera's 3D integration development effort. 2.5D is an intermediate path to true 3D IC using silicon interposer and TSV (Through-Si-Via) stacking. The 2.5D stacking configuration offers different form factor, interconnect path, and thermal management options than monolithic packages, which could help to reduce system level power and thermal management pressure. It offers silicon level interconnect density, low inductive path and wide IO application. However, it's power delivery system (PDN) could be the bottleneck for the system to perform at the intended bandwidth and speed. Thus, the whole system, IC-Interposer-Package-PCB, must be considered holistically, and trade off study and compensation mechanism development are needed in such complex system level integration. There are many different 2.5D integration manufacturing flows currently under development. They can be categorized into two major flow options: Attaching interposer to substrate first, which can be called CoCoS (Chip on Chip on Substrate); or attaching device silicon to interposer first, which is also called CoWoS (Chip on Wafer on Substrate). The major challenges are in the areas of manufacturing process window and yield, thin wafer handling, testability and overall cost of the integration process. ,). This paper will discuss design consideration, manufacturability analysis, Logic/memory devices and silicon interposer interaction, and thermal management to enable the 2.5D integration. System level characterization and correlation with simulations are performed. The challenge of new supply-customer model and industrial ecosystem development associated with 2.5D integration will also be discussed.

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Ghahfarokhi, Payam Shams, Andrejs Podgornovs, Ants Kallaste, Antonio J. Marques Cardoso, Anouar Belahcen, Toomas Vaimann, Hans Tiismus, and Bilal Asad. "Opportunities and Challenges of Utilizing Additive Manufacturing Approaches in Thermal Management of Electrical Machines." IEEE Access 9 (2021): 36368–81. http://dx.doi.org/10.1109/access.2021.3062618.

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Journal articles on the topic 'Thermal management challenges'

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