Dissertations / Theses on the topic 'Thermal conductivities'
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Yao, Yulong. "THERMAL CONDUCTIVITIES OF ORGANIC SEMICONDUCTORS." UKnowledge, 2017. http://uknowledge.uky.edu/physastron_etds/48.
Full textAgab, Ali Faisal. "Hydraulic and thermal conductivities of soils." Thesis, University of Newcastle Upon Tyne, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.417418.
Full textTang, Xiaoli Dong Jianjun. "Theoretical study of thermal properties and thermal conductivities of crystals." Auburn, Ala, 2008. http://repo.lib.auburn.edu/EtdRoot/2008/SUMMER/Physics/Dissertation/Tang_Xiaoli_9.pdf.
Full textRowan, Linda. "The measurement of the thermal conductivity of gaseous mixture using the transient hot wire technique." Thesis, University of Leeds, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.252676.
Full textZhang, Hantao S. M. Massachusetts Institute of Technology. "Computational investigation of the thermal conductivities and phonon properties of strontium cobalt oxides." Thesis, Massachusetts Institute of Technology, 2019. https://hdl.handle.net/1721.1/123356.
Full textThesis: S.M., Massachusetts Institute of Technology, Department of Nuclear Science and Engineering, 2019
Cataloged from student-submitted PDF version of thesis.
Includes bibliographical references (pages 87-91).
The thermal conductivities of electrochemically tuned strontium cobalt oxides (SCO) are significantly different among the perovskite SrCoO3 (P-SCO), the brownmillerite SrCoO2.5 (BM-SCO) and the hydrogenated HSrCoO2.5 (H-SCO)1. The underlying mechanism causing this large difference is still unclear. And phonon properties in SCO have not been investigated thoroughly or have some contradictive predictions. In this work, we have calculated the thermal conductivities in P-SCO and BM-SCO by applying molecular and lattice dynamics, and successfully reconstructed the large difference of the thermal conductivities, consistent with measurements. Furthermore, several phonon properties including heat capacities, group velocities, lifetimes and mean free paths have been calculated, and the key roles of local atomic environment and crystal symmetry in determining the thermal conductivities have been identified. We have also analyzed the impact of interfaces, isotropic strains and defects on thermal conductivities, predicted the neutron scattering intensity in P-SCO, and tested the accuracy and performance of molecular dynamics based on deep learning. Additionally, even though the calculations about the phonon properties in H-SCO are not complete, it still offers some inspirations about its thermal conductivity. The thorough investigations about the phonon properties and the mechanisms determining the thermal conductivities in SCO may benefit future research about tunable thermal conductivities in complex oxides.
by Hantao Zhang.
S.M.
S.M. Massachusetts Institute of Technology, Department of Nuclear Science and Engineering
Zuo, Yanjia. "Preparation of silica aerogels with improved mechanical properties and extremely low thermal conductivities through modified sol-gel process." Thesis, Massachusetts Institute of Technology, 2010. http://hdl.handle.net/1721.1/64600.
Full textCataloged from PDF version of thesis.
Includes bibliographical references (p. 90-96).
Reported silica aerogels have a thermal conductivity as low as 15 mW/mK. The fragility of silica aerogels, however, makes them impractical for structural applications. The purpose of the study is to improve the ductility of aerogels while retain the low thermal conductivity of silica aerogels. We have established a new synthesis route, a 3-step sol-gel processing method. The method provides better control of the formation of aerogel structures. The produced silica aerogels show much improved ductility compared to conventional methods in literatures. Furthermore, the synthesized silica aerogels have thermal conductivities as low as about 9 mW/mK, which is the lowest in all reported solids. The ultra low thermal conductivity can be explained with nano-scale structures for the silica aerogels, which have been characterized using advanced techniques including BET and SEM. We have further investigated and demonstrated the ability of enhancing mechanical properties of silica aerogels through structure modification using the proposed 3-step sol-gel processing method. The molecular-level synergism between silica particles/clusters and the doped functional materials inverts the relative host-guest roles in the produced aerogel composite, leading to new stronger and more robust low-density materials.
by Yanjia Zuo.
S.M.
Jäger, Tino [Verfasser]. "Thermoelectric properties of TiNiSn and Zr 0.5 Hf 0.5 NiSn thin films and superlattices with reduced thermal conductivities / Tino Jäger." Mainz : Universitätsbibliothek Mainz, 2014. http://d-nb.info/1046354167/34.
Full textGelaye, Ababu A. "UPSCALING OF A THERMAL EVOLUTION EXPERIMENT ON SHREDDED-TIRE MONOFILLS." University of Akron / OhioLINK, 2017. http://rave.ohiolink.edu/etdc/view?acc_num=akron1512762530668535.
Full textKasali, Suraju Olawale. "Thermal diodes based on phase-change materials." Thesis, Poitiers, 2021. http://www.theses.fr/2021POIT2254.
Full textThe thermal rectification of conductive and radiative thermal diodes based on phase-change materials, whose thermal conductivities and effective emissivities significant change within a narrow range of temperatures, is theoretically studied and optimized in different geometries. This thesis is divided into three parts. In the first part, we comparatively model the performance of a spherical and cylindrical conductive thermal diodes operating with vanadium dioxide (VO2) and non-phase-change materials, and derive analytical expressions for the heat flows, temperature profiles and optimal rectification factors for both diodes. Our results show that different diode geometries have a significant impact on the temperature profiles and heat flows, but less one on the rectification factors. We obtain maximum rectification factors of up to 20.8% and 20.7%, which are higher than the one predicted for a plane diode based on VO2. In addition, it is shown that higher rectification factors could be generated by using materials whose thermal conductivity contrast is higher than that of VO2. In the second part, on the other hand, we theoretically study the thermal rectification of a conductive thermal diode based on the combined effect of two phase-change materials. Herein, the idea is to generate rectification factors higher than that of a conductive thermal diode operating with a single phase-change material. This is achieved by deriving explicit expressions for the temperature profiles, heat fluxes and rectification factor. We obtain an optimal rectification factor of 60% with a temperature variation of 250 K spanning the metal-insulator transitions of VO2 and polyethylene. This enhancement of the rectification factor leads us to the third part of our work, where we model and optimize the thermal rectification of a plane, cylindrical and spherical radiative thermal diodes based on the utilization of two phase-change materials. We analyze the rectification factors of these three diodes and obtain the following optimal rectification factors of 82%, 86% and 90.5%, respectively. The spherical geometry is thus the best shape to optimize the rectification of radiative heat currents. In addition, potential rectification factors greater than the one predicted here can be realized by utilizing two phase-change materials with higher emissivities contrasts than the one proposed here. Our analytical and graphical results provide a useful guide for optimizing the rectification factors of conductive and radiative thermal diodes based on phase-change materials with different geometries
Bamford, Erik, Gustav Ek, Daniel Hedbom, Johan Nyman, Victor Petterson, Josefin Sjöberg, Ida Styffe, and Olivier Vizuete. "Quartzene – A promising thermal insulator : Studies of thermal conductivity’s dependence of density and compression of Quartzene® in the form of powder." Thesis, Uppsala universitet, Institutionen för teknikvetenskaper, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-228087.
Full textLenain, Alexis. "Conductivité thermique des alliages métalliques amorphes en conditions cryogéniques et applications." Thesis, Université Grenoble Alpes (ComUE), 2017. http://www.theses.fr/2017GREAI100.
Full textBulk metallic glasses possess an amorphous structure without any atomic longrange ordering unlike their crystalline counterparts. They exhibit particularproperties due to this amorphous structure, which is very promising for futureindustrial applications. In particular, their thermal conductivity is very low compared to other metallic materials due to the absence of crystalline lattice. Thus, these alloys show some insulating properties, leading to low heat losses. This PhD work focuses on understanding the mechanisms that occur in thermal conductivity of bulk metallic glasses in order to identify suitable compositions. Several optimization methods have been carried out to minimize the thermal properties and resulted in the development of an optimized composition showing low thermal conductivity. Secondly, their joining ability has been studied with the aim to implement these alloys in an industrial device. Two different joining techniques have been faced to provide a short and a long term solution. Eventually, two patents which protect the use of beneficial compositions developed in this work have been filed. Besides, prototypes have been produced using the two processes studied in this work and show enhanced performances compared to the current solution
Fortin, Guy. "Détermination du coéfficient transitoire de transfert de chaleur à l'interface moule/métal lors de la solidification de l'aluminium pur commercial /." Thèse, Chicoutimi : Université du Québec à Chicoutimi, 1992. http://theses.uqac.ca.
Full textRésumé disponible sur Internet. CaQCU Bibliogr.: f. 158-160, 220-221. Document électronique également accessible en format PDF. CaQCU
Chaliche, Majed. "Contribution a l'etude de la conductivite thermique des fluides complexes en presence d'une vitesse de cisaillement : realisation d'un appareillage specifique." Nantes, 1988. http://www.theses.fr/1988NANT2013.
Full textBeziat, Alain. "Etude experimentale de la conductivite thermique de materiaux argileux hautement compactes : contribution a l'etude du stockage de dechets radioactifs." Orléans, 1987. http://www.theses.fr/1987ORLE2026.
Full textTavman, Ismail H. "Contribution a l'etude de l'anisotropie thermique des polymeres en fonction de leur orientation moleculaire." Paris, ENSAM, 1987. http://www.theses.fr/1987ENAM0014.
Full textRAHELIARILALAO-RANAIVO, RABEHAJA BIENVENUE. "Etude des caracteristiques thermiques et mecaniques de betons de pouzzolane." Paris 7, 1986. http://www.theses.fr/1986PA077220.
Full textTroadec, Carole. "Composite à matrice métallique Al-AlN : de la poudre au matériau." Grenoble INPG, 1996. http://www.theses.fr/1996INPG4205.
Full textOUAJJI, HASSAN. "Etude de proprietes de transport d'un plasma de melange air-cuivre : modelisation de la colonne d'arc." Clermont-Ferrand 2, 1986. http://www.theses.fr/1986CLF21034.
Full textTraoré, Jean. "Dispositif numérique de conditionnement thermique en vue de l'étude des propriétés ohmiques et thermo-électriques d'alliage binaire en couche mince." Rouen, 1992. http://www.theses.fr/1992ROUES052.
Full textAdel, Norelhayate. "Influence d'un adjuvant proteique sur la texture poreuse et les proprietes mecaniques et thermiques d'un beton cellulaire autoclave." Toulouse 3, 1987. http://www.theses.fr/1987TOU30219.
Full textArgento, Claudio. "Modélisation du comportement thermique et mécanique des poudres métalliques : application à la compaction isostatique à chaud." Université Joseph Fourier (Grenoble), 1994. http://www.theses.fr/1994GRE10084.
Full textAbada, Fella. "Transport d'humidité en matériaux poreux en présence d'un gradient de température : caractérisation expérimentale." Université Joseph Fourier (Grenoble), 1994. http://www.theses.fr/1994GRE10135.
Full textZemirli, Saliha. "Etude sous haute pression de quelques fermions lourds : effets de cohérence et ordre magnétique." Grenoble 1, 1986. http://www.theses.fr/1986GRE10148.
Full textPeysson, Yves. "Propriétés thermiques de quelques composés du Cérium, en particulier CeB6." Grenoble 1, 1986. http://www.theses.fr/1986GRE10108.
Full textAKA, BOKO. "Photodecomposition sensibilisee au mercure du monosilane (hg-photo-cvd) : application au depot en couches minces de silicium amorphe hydrogene (a-si : h)." Université Louis Pasteur (Strasbourg) (1971-2008), 1989. http://www.theses.fr/1989STR13026.
Full textPastol, Yvon. "Etude de la cristallisation en phase solide de couches minces de silicium implantees." Paris 7, 1987. http://www.theses.fr/1987PA077142.
Full textSUDERON, HERMANN. "Conduction thermique des phases supraconductrices de UPt3." Université Joseph Fourier (Grenoble), 1997. http://www.theses.fr/1997GRE10266.
Full textBoumaraf, Latra. "Etude des réactions chimiques dans les ammoniacates solides : application du système BaCl2/NH3 à la réfrigération solaire." Grenoble INPG, 1989. http://www.theses.fr/1989INPG0026.
Full textAlquier-Villepelet, Cécile. "Syntheses et proprietes des gels d'oxyde de niobium." Paris 6, 1988. http://www.theses.fr/1988PA066019.
Full textLahiouel, Rachid. "Evolution du réseau Kondo en fonction de l'hybridation : les systèmes CeIn(Ag,Cu)2 et Ce(Ge,Si)2." Grenoble 1, 1987. http://www.theses.fr/1987GRE10054.
Full textGoy, Laurent. "Mesure et modélisation des températures dans les massifs rocheux : application au projet de tunnel profond Maurienne-Ambin." Phd thesis, Université Joseph Fourier (Grenoble), 1996. http://tel.archives-ouvertes.fr/tel-00642650.
Full textPo-Wei, Tang. "Thermal Conductivities of MWCNT-Reinforced Epoxy Composites." 2007. http://www.cetd.com.tw/ec/thesisdetail.aspx?etdun=U0009-2501200717475900.
Full textJean, Chung-Tzong, and 簡城宗. "Research on Thermal Conductivities of Composite Soil." Thesis, 1996. http://ndltd.ncl.edu.tw/handle/66401125774746623766.
Full text國立中央大學
土木工程學系
84
The thermal problem civil engineering always faces is how to control the situation of heat dissipating or insulation between structures and surroundingenvironment. The thermal properties like coefficient of thermal conductivity design or determination of buffer materials around some special underground structures would be the important key. To obtain a desired thermal conductivi-ty, mixing two kinds of soil material possessing different thermal properties at various volumetric fractions was usually economical and probable. A heat-flow-meter method was used to measure the thermal conductivities of mixtures of two dry porous materials. Also we observed the relationship between thermal conductivities and volumetric fractions of composites. Mix- tures that owned two kinds of particles and porous could be regarded as a three- phases system coming from two kinds of two-phases materials that owned only one kind particle and porous. A constituent volumetric fraction model was conducted to distinguish the very respective fractions and thermal con- ductivities of the two composites. Both they''re two-phases materials. Results indicated that the high-thermal-conductivity materials had a pronounced influ-ence on the heat-conduction process in the composite mixtures. Evaluations andcomparisons with some theories also indicated that prediction value all well agreed with experiment value.
Tang, Po-Wei, and 唐伯偉. "Thermal Conductivities of MWCNT-Reinforced Epoxy Composites." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/03230303573395807098.
Full text元智大學
機械工程學系
95
Due to its excellent thermal conductivity, carbon nanotubes (CNTs) are considered as candidates for heat management materials. In the present works, the epoxy resin is used as the matrix, and the multi-walled carbon nanotubes (MWCNTs) with different diameters are as the reinforcement. The objectives of this study are to understand the effects of MWCNT weight percent (0.1 – 5 wt. %), MWCNT diameter (20 – 40 or 40 – 60 nm), and the thickness of the specimens (1 or 3 mm) on the effective thermal conductivities of the composite. The results show that under 50 and the specimen with thickness = 1 mm, the thermal conductivity of the pure epoxy is 0.204 W/m K. The thermal conductivity of the composite increases with the increase in the MWCNTs weight percent. By adding of the MWCNTs under 0.9 wt. %, the thermal conductivity of the MWCNT/epoxy composite increases linearly, but the increasing rate decreases once the MWCNTs weight percent is over 0.9 wt. %. The thermal conductivities of 0.9 wt. % MWCNT/epoxy composites with a MWCNT diameter D = 20 - 40 nm or D = 40 - 60 nm are 0.289 or 0.281 W/m K, respectively. Compare with the pure epoxy, the thermal conductivities increase 42 or 38 %, respectively. The thermal conductivities of 5 wt. % MWCNT/epoxy composites with a MWCNT diameter D = 20 - 40 nm or D = 40 - 60 nm are 0.404 or 0.423 W/m K, respectively, with the increments of 98 or 107 %. The experimental results of the composite specimens with thickness = 3 mm is lower than that with thickness = 1 mm. This is attributed to the fact that there is a larger lateral area exposing to the external environment in the specimens with thickness = 3 mm, which results in a large heat loss. The micromechanics model, Eshelby, is developed to predict the thermal conductivity of MWCNT-reinforced composites. Compared with the experimental data, the predictions are fitted well with the experimental data of the composite specimens with thickness = 1 mm by adding MWCNTs under 0.9 wt. %, no matter the diameters of the MWCNTs are between 20 - 40 nm or 40 - 60 nm. However, at high wt. % of MWCNTs (> 0.9 wt. %), there are large discrepancies between the predictions and the experimental data because the trend of the increase by adding high wt. % MWCNTs are nonlinear.
Kao, Song-Shun, and 高頌舜. "Analysis of the Effective Thermal Conductivities and Thermal Stresses of Composites." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/82674522534880862786.
Full text逢甲大學
航空工程所
93
ABSTRACT The aim of this study is to analyze the effective thermal conductivities of composites containing randomly distributed spherical inclusions or cylindrical fibers. Theoretical studies have shown that the effective thermal conductivity of composites is strongly dependent on the volume fraction, the distribution, inclusion size and the thermal conductivities of constituents. Interfacial thermal contact resistance between matrix and inclusion is known to have a significant influence on the effective thermal conductivity of the composite. A generalized self-consistent model (GSCM) is developed to predict the effective thermal conductivity of composites reinforced with multi-layered spherical inclusion and multi-layered cylindrical orthotropic fibers. The interfacial thermal contact resistances between different constituent phases are considered in the formulation. This approach provides explicit expressions of the effective thermal conductivity of composites in terms of components of thermal conductivity, interfacial contact resistance and volume fraction of each layer of the inhomogeneous inclusion and orthotropic fibers. The proposed approach recovers the existing theoretical results for some simple special cases. The predicted results are compared with finite element analysis in published reference. The results show that the present model gives good prediction of the effective thermal conductivities for composites with multilayered interphases and interfacial thermal resistance. The local temperature and thermal stress fields of such composites subjected to uniform heat flux are estimated using present micromechanics model.
WU, SHI-YI, and 吳昌賢. "Studies on effective thermal conductivities of powder beds." Thesis, 1992. http://ndltd.ncl.edu.tw/handle/02856557868991536448.
Full textChen, Fu-Ren, and 陳附任. "Thermal and Electrical Conductivities of a Single Copper Nanowire." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/zth25w.
Full text國立交通大學
機械工程系所
107
This study aims to investigate the thermal and electrical conductivities of a single copper nanowire. With the advance in semiconductor technology, the integrated circuits become smaller while the power densities of the circuits increase. This results in the severe adverse effect of Joule heating on the integrated circuits. Therefore, dissipating the heat efficiently is one of the main goals in the electrical industry. Thermal and electrical conductivities of the nanoscale copper thin film were investigated before. Based on the Wiedemann-Franz law, the Lorenz number of the copper thin film was also obtained. Nevertheless, although a lot of researchers had studied the electrical resistivity of copper nanowires, there is no complete investigation of the thermal conductivity on a single copper nanowire. Therefore, this work attends to measure the thermal and electrical conductivities of a single copper nanowire. In this study, the electrical resistivity and thermal conductivity of single copper nanowires with different diameters were measured. The measured temperature ranged from 20 K to 300 K. And the diameters of the measured copper nanowires are 119.4 nm (Sample A), 172.6 nm (Sample B), 201.7 nm (Sample C), respectively. At room temperature, the experimental result showed that the electrical resistivity of the sample A was about 6 times that of bulk copper. The phonon-electron coupling parameter of sample A was larger than that of bulk copper. This indicates that the phonon-electron scattering in the copper nanowire is more severe than that in the bulk copper, resulting in the larger electrical resistivity of the nanowire. This is presumably due to the size reduction and polycrystalline structure of the nanowire. In addition, at room temperature, the thermal conductivity was reduced by 71% from that of bulk copper. The thermal conductivity of sample A decreased with decreasing temperature, whereas the bulk copper thermal conductivity increased with temperature. To explain the opposite trends of thermal conductivity of the copper nanowire and the bulk copper, a unified thermal resistivity was introduced. A large residual unified thermal resistivity was observed for the copper nanowire while that of bulk copper was almost zero. Besides, a more significant temperature dependence of unified thermal resistivity was observed for the nanowire. This also proposed that the copper nanowire had a larger phonon-electron scattering than that in the bulk copper. Moreover, the Lorenz number of sample A was larger than the theoretical value. The difference was larger at a lower temperature. The electrons in the nanowire can transfer both the thermal energy and electrical current. The grain boundaries in the polycrystalline nanowire might exert different scattering mechanism on the thermal electrons which are responsible for carrying thermal energy and on the elections which are responsible for carrying electrical current. This can be evidenced from the smaller mean free path of the thermal electron than that of the electron at a low temperature. The grain boundary scattered thermal electrons more severely than the electrons and resulted in the deviation of the obtained Lorenz number for the nanowire. Besides, literature showed that the reduction of nanowire size increased the chance of electron scattering, resulting in the smaller electrical and thermal conductivity of the thinner nanowires. However, the copper nanowire with three different diameters in our study did not meet the description in the literature. As the diameter increased, the copper nanowire showed a lower electrical and thermal conductivity. According to the Transmission Electron Microscope images, sample C which had the lowest electrical and thermal conductivities possessed the largest numbers of the irregular grains in the nanowire. The number of grains in sample B was less than that sample C but more than that in the sample A. Thus, sample A had the highest electrical and thermal conductivities. The polycrystalline structure in the nanowires dominated the electron scattering, resulting in the lower electrical and thermal conductivities for the thicker wires. In the future, the electrical resistivity and thermal conductivity of copper nanowire with single crystalline structure and different diameters will be measured to study the diameter effect on the transport properties of the nanowires. In addition, the nanowire size effect on the Lorenz number will be evaluated.
GUO, BO-WEN, and 郭博文. "Studies on the thermal conductivities of wood-based materials." Thesis, 1989. http://ndltd.ncl.edu.tw/handle/37307082419251971245.
Full textPeng, Mingfeng, and 彭明烽. "Application of Modified Plasma-melted Slags in Thermal Conductivities of Thermal Interface Materials." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/23052325545457338774.
Full text國立聯合大學
環境與安全衛生工程學系碩士班
100
The present work includes the studies of modulation of plasma-melted slags by single/bi-metal nanoparticle fillers and application of the novel thermal interface materials (TIMs) on electric devices. Thus, TIMs with high thermal conductivity is developed when plasma-melted slags are modified by single/bi-metal nanoparticle fillers, e.g. Ag, Cu, and ZnO because their high thermal conductivities. The main objective of this work is to study the speciation of copper and zinc nano particles on plasma-melted slags dispersed grease (Y-500) by X-ray absorption fine structure (EXAFS) and X-ray absorption near edge structure (XANES) spectoscopies, Brunauer-Emmett-Teller (BET), X-ray diffraction (XRD), and dummy heater. Due to low leach of toxic materials from plasma-melted slags, stable slags are safe to be reused. Combining XRD and XANES data, grain size of Cu nanoparticles coated on the plasma-melted slags with 0.210 and 0.088 mm are 24-60 nm with electroless coating. By EXAFS, the structural perturbation of Cu is observed. Bond distances of Cu-Cu are 2.53 and 2.52 Å on the plasma-melted slags. Due to the decreased the Cu/Ag mole ratio, bond distance of Cu-Cu is confined. Thermal conductivity of Cu-Ag coated on the plasma-melted slags with 0.088 mm dispersed Y-500 is 1.354 W/m-K. Because of small size of fillers, a lot of amount of particles should be added into Y-500, which can increase the pathways of heat conduction by Cu-Ag coated plasma-melted slags. About 0.1 and 3.5% of silver and copper were coated on surfaces of plasma-melted slags by electroless coating. By XRD, copper nanoparticles with ~30 nm are observed. Even the plasma-melted slags are not het conductors. The thermal conductivity of Cu-Ag coated slags dispersed Y-500 is also enhanced to 1.432 W/m-K. Moreover, about 1 and 5% of Cu with 0.1% of Ag are coated on plasma-melted slags for TIMs by electroless coating, respectively. Thermal conductivities of 1 and 5% of Cu with 0.1% of Ag coated plasma-melted slags dispersed Y-500 are 1.295 and 1.356 W/m-K. However, metal concentration and thermal conductivity are linear but not in direct ratio. The least-square fitted XANES spectra show that main zinc and copper species on the plasma-melted slags in Y-500 is ZnO, Cu (74%), and Cu(EDTA)2 (26%). Because zinc coated plasma-melted slags immersed in an acidic solution of PdCl2 before coating Cu processes, the pores on ZnO thin film was formed. Cu(EDTA)2 should migrate into the pores. It is also observed that enhanced thermal conductivity of Cu-ZnO coated on the plasma-melted slags dispersed Y-500 is increased by 15.3%.
Wang, Tai-Yuan, and 王泰元. "Characterizing Mechanical Properties and Thermal Conductivities of Graphene/Epoxy Nanocomposites." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/65086099886363224843.
Full text國立交通大學
機械工程系所
105
The aim of this study is to characterize the mechanical properties and thermal conductivities of graphene/epoxy nanocomposites. The elastic constants and thermal conductivity were investigated for the pristine graphene and functionalized graphene through molecular dynamics (MD) simulations. The results indicated that implanting functional groups would reduce the in-plane Young’s modulus and thermal conductivity. Subsequently, the influences of functional groups grafted on the graphene surface on the properties of nanocomposites were explored by examining the interfacial thermal conductance (ITC), phonon mismatch, and normalized interaction energy. It was shown that functional groups could increase the interactions and decrease the phonon mismatch at the interface so that the ITC and thermal transport in the interfacial epoxy could be enhanced significantly. Afterward, the atomistic simulation together with micromechanical analysis was employed to characterize the Young’s modulus and thermal conductivity of graphene/epoxy nanocomposites. The atomistic interaction between graphene and the surrounding epoxy was considered in the molecular dynamic simulation and then used to derive the effective properties of graphene. Subsequently, the Young’s moduli and thermal conductivities of nanocomposites with randomly oriented graphene were modeled from the Mori–Tanaka micromechanical model. The nanocomposites containing pristine graphene, carboxyl (COOH)-functionalized graphene, and COOH- and amine (NH2)-functionalized graphene were considered in the simulation. The results indicated that the COOH- and NH2-functionalized graphene nanocomposite exhibited superior mechanical and thermal properties to those of the other two material systems. Moreover, the model predictions were in good agreement with the experimental data.
Chao, Wen-Hsun, and 趙文汛. "Effects of Microstructure on the Thermal Conductivities of Carbon Nanotubes." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/26908199508514869147.
Full text元智大學
機械工程學系
95
The thermal conductivities of carbon nanotubes (CNTs) are estimated by using the double-inclusion model (Nemat-Nasser and Hori, 1999), where one inclusion (the inner void) is embedded in the other (the outer single-crystal graphite shell). The concept of homogenization is utilized and vital microstructural variables such as CNT diameter, length and aspect ratio are included in the present model. The interaction between the microstructure and the thermal conductivities of CNTs are quantitatively characterized. To check the validity of the developed analytic model, the thermal conductivity experiments are performed and benchmarked with the present model. Our results show that the thermal conductivities of CNT are 1241~1974 W/m-K. The thermal conductivity is found to be strongly dependent of the diameter of CNT with little dependence on the length of CNT. The thermal conductivities of CNTs increase with an increase in CNT aspect ratio. In addition, the experimental results obtained agree well with theoretical predictions.
Rahimi, Somayyeh Jay. "Thermal and charge conductivities of superconducting skutterudite compounds, PrRu4Sb12 and PrOs4Sb12." Thesis, 2007. http://hdl.handle.net/10012/2733.
Full textRostro, Betty Catalina. "Novel fibrillar carbon nanotube heat transfer gels with enhanced thermal conductivities." Thesis, 2007. http://hdl.handle.net/1911/20534.
Full textHuang, Chieh, and 黃杰. "Effects of CNT Diameter on the Thermal Conductivities of MWCNT/Epoxy Composites." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/89443360833870804336.
Full text元智大學
機械工程學系
96
Carbon nanotubes (CNTs) exhibit excellent thermal as well as mechanical properties. In the present work, multi-walled carbon nanotubes (MWCNTs) are used as reinforcements to increase the thermal conductivity of epoxy resin. Two groups of MWCNTs are used – one with diameters being less then 10 nm and the other with diameters ranging between 40 to 60 nm. Epoxy and MWCNTs are well mixed and MWCNT/epoxy composites are cured at room temperatures. The thermal conductivities of MWCNT/epoxy specimens are experimentally determined using a thermal conductivity apparatus, LW-9021 developed by Longwin Company. The average thermal conductivity of pure epoxy is 0.23 W/mK and the percentage in increase in average thermal conductivities of 1 wt.%-, 3 wt.%- and 5 wt.%-MWCNT/epoxy composites where the diameter of MWCNT is 40 – 60 nm is 4.3 %, 11.7 % and 27.8%, respectively, higher than that of pure epoxy. For the case of MWCNTs with smaller diameters D < 10 nm, the percentage increase in the average thermal conductivities of 1 wt.%-, 3 wt.%-, and 5 wt.%- MWCNT/epoxy composites is 16.1%, 37.8% and 62.3%, respectively, in comparison with that of pure epoxy. The micromechanics model developed by Eshelby is employed to estimate the thermal conductivities of MWCNT/epoxy. The predicted results agree well with the experimental data of MWCNT/epoxy where the diameters of MWCNT range between 40 and 60 nm. The discrepancy between the experimental data and the predicted results for MWCNT/epoxy where the diameters of MWCNT are less than 10 nm, however, is significant using the microstructural parameters provided by the vendor.
YU, XIAN-GUAN, and 余鑑泉. "Numerical determination of effective thermal conductivities of composite material with spherical inclusions." Thesis, 1987. http://ndltd.ncl.edu.tw/handle/45899343856375764168.
Full textHsiao, Wei-Che, and 蕭偉哲. "Enhancements of Thermal Conductivities in Polymeric Nano-Composites by Doping Boron Nitride." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/81741399417558051600.
Full text國立交通大學
平面顯示技術碩士學位學程
104
The rapid development of semiconductor technology, electronic components towards the light、thin、short、small and high-density evolution of the product in recent years. The waste heat generated in the electronic components during operation ,if we can’t remove these waste heat . These waste heat will effect electronic signals and cause distortion lower reliability, or worse still will lead to component damage. So everyone actively involved in various research institutions to reduce power or heating elements to enhance heat dissipation mechanism. Boron nitride material for electronic applications very popular material, which comes from its potential to be applied with good electrical insulation properties, low dielectric constant and dielectric loss. This paper is for thermal mechanism of BN and Al2O3 .We would like to modify on the surface of BN to improve dispersibility in Silicon, and sprate this composite on electronic component to improve better thermal conductivity.
Chu, Chao-Hung, and 朱昭宏. "The Effect of Zr &; Ti Addition on Thermal Conductivities and Thermal Fatigues of Diamond/Silver Composites." Thesis, 2014. http://ndltd.ncl.edu.tw/handle/5dumxd.
Full textChen, Ting-Gang, and 陳亭綱. "Theoretical and Experimental Study of Reduced Thermal Conductivities for Vertically-Aligned Silicon Nanowires." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/09363777577726458910.
Full text國立交通大學
顯示科技研究所
97
Since silicon is widely used in the integrated circuit (IC) industry, the ability to tailor the thermoelectric properties of bulk silicon using its nanostructures can enable a variety of exciting applications, such as efficient thermo-photovoltaic devices, and monolithically- integrated electronic and optoelectronic device cooling. In late 2007, scientists have reported that a single silicon nanowire (Si NW) with a diameter less than 52nm exhibits a low thermal conductivity ~1.6 Wm-1k-1 and ZT ~1 at room temperature, suggesting the potential of using Si NWs for efficient thermoelectric energy conversion. In order to realize a practical thermoelectric device based on Si NWs, it is essential to fabricate large-area and highly-oriented Si NW arrays on silicon substrates. In this paper, we demonstrate the preparation of vertically-aligned Si NWs with diameters of tens of nanometers, heights ranging from tens of micrometers to over 100 μm, and most importantly, an area over 5x5 cm2. Characterizations using a hot-disk slab-module system show the thermal conductivity reduced for the fabricated Si NW samples, compared to that of bulk silicon. Two-dimensional microscale heat-transfer analyses of Si NWs based on the equation of phonon radiative transfer are presented. The high-aspect-ratio and vertically-aligned Si NW arrays were fabricated using a silver-induced wet deposition and wet chemical etching method. The surface morphology and the etching length depend on the concentration of both AgNO3 and HF solution, the etching temperature, and etching time. The concentration of AgNO3 affects the structure of the nanowire arrays because the porosity is determined by the density of deposited Ag particles. A Hot Disk 2500 slab-module system was then employed to measure the thermal conductivity of the fabricated NWs. During the measurement, the sensor was sandwiched between two samples, while the other side of samples was insulated by a material with a low thermal conductivity in order to reduce the heat losses to the surroundings. The thermal conductivities obtained from Si NW samples were lower than bare Si substrates for all six individual experiments. Then we use equation of phonon radiative transfer to simulate our structure. Compare to thermal resistance model, the equation of phonon radiative transfer consider size effect when the boundary is comparable to phonon mean free path. In summary, we have successfully fabricated large-area, high-aspect-ratio Si NW arrays, and measured their thermal properties using a Hot Disk system. The Si NW samples exhibit a reduced thermal conductivity, compared to that of bulk Si, showing great potential for next-generation thermoelectric devices.
Chang, Wei-Ting, and 張偉庭. "Thermal Conductivities of Si and Ge at Different Index Planes by Molecular Dynamics Simulation." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/21559590516816301527.
Full text國立臺灣大學
應用力學研究所
96
In recent years, many researches on nanotube, nanowire, and superlattices have been carried out. In this thesis, we study the thermal conductivities of silicon and germanium at different index planes in the nanoscale. The simulation method used molecular dynamics simulation, and the governing equation is Hamiltonian equations of motion in classical Newtonian mechanics. The molecular initial position of a diamond unit cell structure is used for periodic boundary condition and expresses the infinite boundary crystal lattice arrangement by the limited bulk material. The molecular initial velocity is determined by Maxwell-Boltzmann distribution. Because silicon and germanium mainly belongs to three body potential for the covalent bonding and also the needs to consider the intermolecular bonding angle, we choose Tersoff potential to calculate covalent bonding intermolecular force and molecular acceleration. We obtain each molecular new position and the new velocity by the Velocity-Verlet integration method, and obtain the heat flux under the state of equilibrium. Through the different time evolution, we calculate the autocorrelation function from heat flux. Finally, we calculate the thermal conductivity by Green-Kubo formalism. We compare the thermal conductivities of silicon and germanium at different index planes.
Chiu, Jui-Ting, and 邱瑞霆. "Enhancements of Thermal Conductivities in Polymeric Composites by Blending Boron Nitride(BN) and Aluminum Nitride (AlN)." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/40757901158237724735.
Full text國立交通大學
平面顯示技術碩士學位學程
104
Boron nitride (BN) has good thermal conductive capacities and cheap price, so BN becomes common filler inorganic materials for heat dissipation in the industrial applications. We got some good results from our present project in the past half an year, i.e., “Enhancements of Thermal Conductivities in Polymeric Nano-Composites by Doping Boron Nitride (BN)”. The thermal conductivities of the polymeric composites were enhanced gradually (up to 0.8 W / mK) as BN was added gradually in the polymers (RTV). In addition, the crystallinity of BN in the polymers was increased as the additive (1,8-diiodooctane) was introduced in the polymeric composites, and the XRD patterns prove the crystallinity of BN is proportional to the amounts of 1,8-diiodooctane. Thus, the thermal conductivities of the polymeric composites were improved due to the higher crystallinity of BN induced by the additive (1,8-diiodooctane). In this proposal, we focus on two different inorganic materials (boron nitride BN and aluminum nitride AlN with excellent thermal conductivities) blended with three different kinds of monomers containing various functional groups (including acrylic group, and C=C combined with Si-H groups). Different types and ratios of inoganic materials (boron nitride and aluminum nitride with various sizes) and polymers (containing acrylic group, and C=C, Si-H) were blended to produce various polymeric composites. Therefore, according to the adjustment of previous parameters, polymeric composites can be optimized to possess many different requested merits, such as packaging, thermal conductivity, thermal stress, and transparency, via the following characterization techniques: Thermal conductive equipments. Finally, we expect to obtain polymeric composites with the optimized thermal conductivities, thermal stress, transparency, and mechanical properties. Key Words: Polymer Composites, Hexagonal Boron Nitride, Aluminum Nitride, Heat Dissipation.