Relevant bibliographies by topics / Test temperature

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Test temperature'

Author: Grafiati
Published: 4 June 2021
Last updated: 2 February 2022

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Journal articles on the topic "Test temperature"

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Lesser, Larry. "Taking the temperature of scale type." Teaching Statistics 37, no. 1 (July 7, 2014): 6. http://dx.doi.org/10.1111/test.12061.

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Park, Donghyun, and Tae Sung Oh. "Reliability Characteristics of a Package-on-Package with Temperature/Humidity Test, Temperature Cycling Test, and High Temperature Storage Test." Journal of the Microelectronics and Packaging Society 23, no. 3 (September 30, 2016): 43–49. http://dx.doi.org/10.6117/kmeps.2016.23.3.043.

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TOMINAGA, Toshibumi. "High temperature hardness test." Journal of the Japan Society for Precision Engineering 55, no. 8 (1989): 1337–41. http://dx.doi.org/10.2493/jjspe.55.1337.

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Takamatsu, Kuniyoshi, Shohei Ueta, and Kazuhiro Sawa. "ICONE19-43224 ANALYSIS OF A LOSS OF FORCED COOLING TEST USING THE HIGH TEMPERATURE ENGINEERING TEST REACTOR (HTTR)." Proceedings of the International Conference on Nuclear Engineering (ICONE) 2011.19 (2011): _ICONE1943. http://dx.doi.org/10.1299/jsmeicone.2011.19._icone1943_92.

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Meister, Michael, and Marco Reinhard. "A modular application specific active test environment for high-temperature wafer test up to 300 °C." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000122–25. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000122.

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Abstract Applications in harsh environment such as high temperatures require electronic devices for signal amplification, calculations and digital interfaces. These devices often contain ASICs (application specific integrated circuits) which are suitable for high temperatures above 125 °C. For functionality verification of these high-temperature ASICs a high-temperature wafer test environment is necessary. This article describes a high-temperature wafer test setup which can be used up to 300 °C. It is based on a modular concept for a maximum of 48 test channels. The combination of three modular components (contact needle system, thermal insulation chamber and active probe card) allows adapting the setup to different ASICs and pad layouts. The active probe card operates at temperatures below 65 °C during 300 °C wafer test temperature. It is mounted on the thermal insulation chamber for signal amplification, defined loads or generation of precise input signals. This modular concept significantly shortens the development time for the high-temperature wafer test and thus saves time and reduce the costs of ASIC development.
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Kerr, R. A. "Shock Test Squeezes Core Temperature." Science 267, no. 5204 (March 17, 1995): 1597–98. http://dx.doi.org/10.1126/science.267.5204.1597.

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Shin, Soon Gi. "Deformation Behavior of TiC-Mo Composites at High Temperature by Compression Test." Korean Journal Metals and Materials 51, no. 12 (December 5, 2013): 921–28. http://dx.doi.org/10.3365/kjmm.2013.51.12.921.

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Le, Quang X., Vinh TN Dao, Jose L. Torero, Cristian Maluk, and Luke Bisby. "Effects of temperature and temperature gradient on concrete performance at elevated temperatures." Advances in Structural Engineering 21, no. 8 (December 8, 2017): 1223–33. http://dx.doi.org/10.1177/1369433217746347.

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To assure adequate fire performance of concrete structures, appropriate knowledge of and models for performance of concrete at elevated temperatures are crucial yet currently lacking, prompting further research. This article first highlights the limitations of inconsistent thermal boundary conditions in conventional fire testing and of using constitutive models developed based on empirical data obtained through testing concrete under minimised temperature gradients in modelling of concrete structures with significant temperature gradients. On that basis, this article outlines key features of a new test setup using radiant panels to ensure well-defined and reproducible thermal and mechanical loadings on concrete specimens. The good repeatability, consistency and uniformity of the thermal boundary conditions are demonstrated using measurements of heat flux and in-depth temperature of test specimens. The initial collected data appear to indicate that the compressive strength and failure mode of test specimens are influenced by both temperature and temperature gradient. More research is thus required to further quantify such effect and also to effectively account for it in rational performance-based fire design and analysis of concrete structures. The new test setup reported in this article, which enables reliable thermal/mechanical loadings and deformation capturing of concrete surface at elevated temperatures using digital image correlation, would be highly beneficial for such further research.
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TANAKA, Toshiyuki, Minoru OHKUBO, Tatsuo IYOKU, Kazuhiko KUNITOMI, Takeshi TAKEDA, Nariaki SAKABA, and Kenji SAITO. "Performance Test of the HTTR (High Temperature Engineering Test Reactor)." Journal of the Atomic Energy Society of Japan / Atomic Energy Society of Japan 41, no. 6 (1999): 686–98. http://dx.doi.org/10.3327/jaesj.41.686.

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Drehmer, Timothy J. "Crossover test can detect temperature differences." Postgraduate Medicine 113, no. 6 (June 2003): 16. http://dx.doi.org/10.3810/pgm.2003.06.1442.

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Dissertations / Theses on the topic "Test temperature"

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Holm, Perbie. "Temperature monitoring during transport of test samples." Thesis, Uppsala University, Department of Medical Biochemistry and Microbiology, 2006. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-6993.

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Quality is the main focus in management of all laboratories. Accurate results of the analyses are not only determined by the analytical procedure but also by preanalytical factors. In the total analytical process of clinical specimens, there are many possible preanalytical sources of error. Monetoring of temperature on test samples of the transport boxes is one way to reduce the mistakes in the preanalytical phase.

In this study, four laboratories from primary health care were invited to participate. The temperature has been measured on test samples of the transport boxes being delivered to the laboratory.

In three cases the temperature remained within the limits, but in the fourth case the temperature varied more than the allowed interval. Mistakes found in the preanalytical phase, especially in the handling and processing in the process before complete distribution of test samples to laboratory. This suggests that good communication and cooperation among the personnel is the key to improvement of the laboratory quality.

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Bonthron, Björn, and Christian Jonsson. "Geogrids in cold climate : Temperature controlled tensile tests & Half-scale installation tests at different temperatures." Thesis, Luleå tekniska universitet, Institutionen för samhällsbyggnad och naturresurser, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-63204.

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Due to the findings of extensive damage on geogrids used in a road embankment in northern Sweden, the Swedish Transport Administration (TRV) started to investigate the reason of these damages. Since the geogrids were installed at low temperature, below 0°C, it was suspected that the damages were connected the low temperature. To analyse whether low temperatures have an influence on the extent of installation damages, both a half-scale setup and temperature controlled tensile tests have been carried out on geogrids. In total five different types of geogrids have been tested; 3 extruded polypropylene geogrids, 1 woven PET geogrid, and 1 welded PET geogrid. All geogrids had an aperture size of approximately 35 mm and specified tensile strength of approximately 40 kN/m. The Half-scale tests was conducted by building a small road embankment inside a freeze container, at the Luleå University of Technology (LTU). The embankment contained crushed aggregate, type 0-70 mm, and geogrids. The purpose of the half-scale test was to simulate installation of geogrids at different temperatures and thereby investigate whether low temperatures have an influence on the rate of installation damages. The half-scale test was done for each type of geogrid at the temperatures: +20°C, -20°C and -30°C. First, the geogrid was covered by 150 mm of crushed aggregate. Then a vibratory plate (160 kg) was used to compact the crushed aggregate. After each installation, the crushed aggregate was removed carefully by vacuum suction. The geogrid was removed and then analysed by visual control and tensile tests conducted according to ISO 10319:2008 (wide width tensile test). Results from the half-scale tests indicate that 2 out of 5 of the tested geogrids were affected by the testing procedure. The results indicate that: -        one of the geogrids of polyprophylene (here referred to as G2) was more damaged at lower temperatures compared to installation at +20° C. -        the geogrid of woven PET (here referred to as G5) was less damaged at lower temperatures compared to installation at +20° C. Results for the other geogrids are either inconsistent or shows no significant variation of the measured parameters as function of temperature. Hence, these results cannot be interpreted as damage during installation. Temperature controlled tensile tests were done by tensile testing single strands from the geogrids to failure, inside a temperature controlled chamber. The purpose of these tests was to investigate how the strength properties of the geogrids are affected by low temperature. The test was repeated 5 times for each geogrid and temperature (+20°C, 0°C, -10°C and -20°C). Force and strain was measured during the tests. The results from the temperature controlled tensile tests show that the maximum strain decreases with lower temperature for all tested geogrids. The maximum strain decreased by 16% - 49% when the temperature dropped from +20°C to -20°C. The results show that the tensile strength increases with lower temperature for all tested geogrids except for the welded PET geogrid (here referred to as G1). For G1 the tensile strength decreased by approximately 7% at a temperature drop from +20°C to -20°C. For the woven PET geogrid (G5) and the polypropylene geogrids (G2-G3) the tensile strength increased between 13%-45% at a temperature drop from +20°C to -20°C. The E-modulus increased at lower temperature for all tested geogrids. The secant E-modulus at 2% strain increased by 13%-71% at a temperature drop from +20°C to -20°C. Summarized conclusions from the tests: Strength properties changed for all tested geogrids as the temperature decreased. All tested geogrids got stiffer at lower temperatures. The magnitude of the effects is different for different geogrids. The tensile strength increased with lower temperature for all tested geogrids except for the welded PET geogrid, which got lower tensile strength at lower temperature. The half-scale test indicates that the amount of installation damages at geogrids can be dependent of the temperature at installation. However, these indications can only be seen at two out of five tested geogrids. The effect cannot be connected to a specific step in the installation procedure and cannot be explained by the results from the temperature controlled tensile tests. The results from the half-scale test have a statistically low reliability since only one installation for each temperature and geogrid type was done. The compaction equipment used during the test was small, and had low compaction energy compared to a vibratory roller compactor commonly used in construction work. With respect to the discussion above, further studies should be focusing on developing the half-scale test. It is suggested that the test is scaled up to a full-scale test in order to simulate a real installation as close as possible. The test should also be conducted several times for each geogrid at each temperature in order to enable statistical analyses.
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Narri, Vandana. "Performance and Improvement Investigation of Accelerated Temperature Change Test." Thesis, Blekinge Tekniska Högskola, Institutionen för tillämpad signalbehandling, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:bth-16604.

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This thesis is focused on Accelerated Temperature Change Test (ATCT). This test is performed in order to deteriorate and age a product in a faster than natural way. The ATCTs are primarily controlled with four parameters: the temperature range (∆T), ramp rate (RR), dwell time (DT) and number of cycles in test ( . A comprehensive investigation was carried out to analyze the performance and functionality of the cabinet, used for performing ATCT. This was achieved by performing repeated measurements in the empty cabinet with different combinations of temperature range (∆T) and dwell time (DT). The test parameters are normally adjusted according to values given in the standards common in automotive environmental testing and also according to the thermal properties and size of the tested components. In this investigation, four different standards for accelerated testing were taken into consider. They are TB1900, ISO 16750-4:2010 (International Organization for Standardization), IEC 60068-2-14 (International Electrotechnical Commission) and The GMW3172: User Guide. From each standard, each parameter definitions are illustrated. Practical tests were executed on three different types of components and with different test conditions. A suitable experimental-setup was prepared to record the temperature measurements on/in the DUT (Device Under Test). This experimental-setup was designed using thermocouples (Type - K) and DEWESoft. The results from the test were used to analyze the deviation between the standards and practical testing. This comparison helps in understanding the required improvements in the test parameters values i.e. the cabinet parameter settings or the test conditions. The values assigned for each parameter before the test are called Cabinet Parameter Settings (CPS). The temperature readings from the DUT are recorded and plotted after ATCT. Based on these ATCT measurements, optimal values of the test parameter are estimated. These are called Estimated Parameter Values (EPV). A significant deviation is observed between CPS and EPV. From these EPV, an acceleration factor (AF) for each test is calculated using two different life prediction models i.e. (i) Coffin-Manson and (ii) Norris Landzberg. And using this AF, an evaluation of the “number of cycles in the field (Nf)” with certain “number of cycles in the test (Nt)” is made. This evaluation helps in understanding the effect of parameter values during the test on the acceleration conditions. A simple aluminum box (one of the test component) is replicated into a simple structure, to implement in COMSOL Multiphysics Simulations. When the simulation results show good agreement with practical results, then simulations are recommended to be used to find the proper test conditions and test parameter values. Further, the simulations are used to find the sensitive point in/on the component. These simulations take some reasonable efforts. Index Terms— Acceleration factor, Dwell time, Fatigue failure, Accelerated temperature change test, Stress level, Temperature range, Coefficient of Thermal Expansion.
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Lin, Muh-Ren. "Experimental Investigation of Temperature Effect on Uniaxial Tensile Test." The Ohio State University, 1986. http://rave.ohiolink.edu/etdc/view?acc_num=osu1392371542.

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Lin, Muh-ren. "Experimental investigation of temperature effect on uniaxial tensile test /." The Ohio State University, 1986. http://rave.ohiolink.edu/etdc/view?acc_num=osu1487266011224679.

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Aghaee, Ghaleshahi Nima. "Thermal Issues in Testing of Advanced Systems on Chip." Doctoral thesis, Linköpings universitet, Institutionen för datavetenskap, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-120798.

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Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled by a core-based design paradigm as well as deep-submicron and 3D-stacked-IC technologies. These technologies are susceptible to reliability and testing complications caused by thermal issues. Three crucial thermal issues related to temperature variations, temperature gradients, and temperature cycling are addressed in this thesis. Existing test scheduling techniques rely on temperature simulations to generate schedules that meet thermal constraints such as overheating prevention. The difference between the simulated temperatures and the actual temperatures is called temperature error. This error, for past technologies, is negligible. However, advanced SoCs experience large errors due to large process variations. Such large errors have costly consequences, such as overheating, and must be taken care of. This thesis presents an adaptive approach to generate test schedules that handle such temperature errors. Advanced SoCs manufactured as 3D stacked ICs experience large temperature gradients. Temperature gradients accelerate certain early-life defect mechanisms. These mechanisms can be artificially accelerated using gradient-based, burn-in like, operations so that the defects are detected before shipping. Moreover, temperature gradients exacerbate some delay-related defects. In order to detect such defects, testing must be performed when appropriate temperature-gradients are enforced. A schedule-based technique that enforces the temperature-gradients for burn-in like operations is proposed in this thesis. This technique is further developed to support testing for delay-related defects while appropriate gradients are enforced. The last thermal issue addressed by this thesis is related to temperature cycling. Temperature cycling test procedures are usually applied to safety-critical applications to detect cycling-related early-life failures. Such failures affect advanced SoCs, particularly through-silicon-via structures in 3D-stacked-ICs. An efficient schedule-based cycling-test technique that combines cycling acceleration with testing is proposed in this thesis. The proposed technique fits into existing 3D testing procedures and does not require temperature chambers. Therefore, the overall cycling acceleration and testing cost can be drastically reduced. All the proposed techniques have been implemented and evaluated with extensive experiments based on ITC’02 benchmarks as well as a number of 3D stacked ICs. Experiments show that the proposed techniques work effectively and reduce the costs, in particular the costs related to addressing thermal issues and early-life failures. We have also developed a fast temperature simulation technique based on a closed-form solution for the temperature equations. Experiments demonstrate that the proposed simulation technique reduces the schedule generation time by more than half.
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Chausse, Eric. "Test et modélisation de détecteurs infrarouges microbolométriques à température ambiante." Grenoble INPG, 2000. http://www.theses.fr/2000INPG0021.

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Cette etude montre la faisabilite de detecteurs infrarouges non refroidis pouvant etre produits a faible cout. L'emploi d'une filiere silicium et d'une technologie monolithique sont des conditions sine qua non pour atteindre l'objectif de faible cout de fabrication. Une large diffusion peut ainsi etre envisagee, en particulier, pour la surveillance industrielle et l'aide a la conduite automobile. Le principe du bolometre consiste a mesurer l'echauffement du rayonnement infrarouge. La variation de conductivite d'un thermometre en silicium amorphe place sur un micro-pont pour renforcer l'isolation thermique permet ensuite de transcrire le signal sous forme electrique. L'emploi d'une cavite quart d'onde et l'utilisation des electrodes de lecture du thermometre comme absorbeur d'onde ameliorer l'efficacite des dispositifs. Le silicium amorphe est choisi comme thermometre pour satisfaire la contrainte ab initio de faible cout. Le silicium est obtenu par lpcvd dope bore afin de garder une temperature de depot basse et aussi un faible niveau de bruit electrique. L'etude du silicium amorphe permet d'obtenir des dispositifs optimises en conciliant une forte activation thermique de la conductivite et une forte conductivite avec un faible bruit. Un fort dopage bore (2%) abaisse la temperature de croissance de la couche et incorpore peu d'hydrogene. La presence de polluants tels que oxygene, azote et carbone est aussi prise en compte. Ce materiau montre de la metastabilite comme decrit dans la litterature mais aussi de l'originalite par des effets irreversibles induits par les traitements thermiques. La derive irreversible sous recuit est etudiee a travers des caracterisations physiques et electriques. En particulier, le role de l'hydrogene est pris en consideration. Les detecteurs obtenus ont actuellement des performances de niveau mondial. Le netd est de 100 mk, ce qui permet d'envisager de l'imagerie infrarouge au moyen des composants actuellement produits.
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Brown, Stephen Wayne. "Time- and Temperature-Dependence of Fracture Energies Attributed to Copper/Epoxy Bonds." Thesis, Virginia Tech, 2004. http://hdl.handle.net/10919/9675.

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When bonds between copper and printed circuit board laminates are subjected to impulsive forces, the need arises to characterize fracture energies corresponding to related, high-speed failure events. Work (or energy) is required to create new surface area—with associated dissipation events—during fracture, and this energy (for a given material system) is dependent on the speed of crack propagation, the locus of failure, and the temperature of the bond when it is broken. Since the 90° peel test has been widely employed in quasi-static fracture testing of film adhesion for printed circuit board applications, this test was first used as a basis to which other test results could be compared. A test fixture was designed and built for quasi-static peel testing that accommodated peeling at different angles and temperatures. A similar test was then desirable for the direct comparison of dynamic fracture events to those quasi-static results. The “loop peel test” was thus developed to mimic the common 90° peel test and to quantify the time- and temperature-dependent fracture energies of peel specimens during low-velocity impact. This test has been successfully used to determine the apparent critical strain energy release rate of copper/epoxy bonds for low-velocity impact conditions (1-10 m/s), for a case of near-interfacial failure. The falling wedge test has also been adapted to estimate the apparent critical strain energy release rate at similar fracture conditions. Four types of printed circuit boards have been analyzed with the above impact test methods as well as with their corresponding quasi-static tests, and the fracture energies measured with the impact tests have been compared to those obtained using quasi-static tests. Fracture energies of the material systems considered were dependent on time (speed of fracture), temperature, and the amount of moisture migration, as determined via humidity conditioning parameters.
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Prakash, del Valle Carlos. "Thermal modelling of an FZG test gearbox." Thesis, KTH, Maskinkonstruktion (Inst.), 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-157256.

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Gearboxes are always subject of study in order to increase their efficiency. Energy losses in gear contacts are transformed into heat which is distributed among the gearbox components increasing their temperature. A thermal model of the gearbox brings the opportunity of a deeper understanding of the heat dissipated related to the power losses in the gear contact. A MATLAB program based on ordinary differential equations was developed in order to make a thermal model of an FZG test gearbox. The model is based on a thermal network where each node represents a machine element. The thermal network is composed by thermal resistances due to deformation in the gear contact, conduction, convection and radiation. With thermal resistances, power losses and thermal inertia of each element, the temperature evolution was obtained by applying the First Principle of Thermodynamics. Due to the temperature evolution, heat transfer between different elements was estimated. Additionally, experimental results from an FZG test rig were implemented in the model and also used to verify its accuracy. Furthermore, additional features to the model such as a cooling system and spray lubrication were also studied. Results show a wide capability and handling of the program in terms of thermal analysis: heat flux direction and magnitude, visual tools such as thermal network of the test gearbox, as well as the analysis of different operating conditions. With these tools, an approach to the minimum amount of lubricant necessary and other ways to quench overheating could then be reached. Keywords: Thermal network, FZG gear test rig, heat flow, temperature, MATLAB, ODE.
Växellådor är ständigt ett forskningsområde för att förbättra deras verkningsgrad. Energiförluster i kuggkontakter omvandlas till värme som sprids i växellådan som sedan värmer upp komponenterna. En termisk modell av växellådan gör det möjligt för djupare förståelse hur värmen sprids i förhållande till energiförlusterna i kuggkontakten. Ett MATLAB-program baserat på ordinära differential-ekvationer utvecklades för att göra en termisk modell av en växellåda i en kuggrigg från FZG. Modellen är baserad på ett termiskt nätverk där varje nod representerar en maskinkomponent. Det termiska nätverket består av resistanser som uppstår på grund av deformation i kuggkontakten, ledning, konvektion och strålning. Med termiska resistanser, energiförluster, termisk tröghet från komponenterna och genom att applicera termodynamikens första grundsats kunde temperatur-genereringen bestämmas. Från temperatur-genereringen kunde värme-ledningen mellan komponenter uppskattas. Testresultat från en FZG-kuggrigg användes för att verifiera modellens noggrannhet. Andra egenskaper till modellen, som ett annat kylsystem och spraysmörjning studerades för att undersöka möjligheteten att adderas till modellen. Resultat visar på en bred användning av modellen i avseende på termisk analys: värmeflödets storlek och riktning, ett visuellt redskap för växellådans temperatur och hur växellådans temperatur varierar under olika driftförhållanden. Med de här redskapen kan den minsta oljemängden som behövs för att smörja kuggkontakten undersökas och hur kylning av kugghjulen kan förbättras. Nyckelord: Termiskt nätverk, FZG kugghjuls-rigg, värmeflöde, temperatur, MATLAB, ODE
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He, Zhiyuan. "System-on-Chip test scheduling with defect-probability and temperature considerations." Licentiate thesis, Linköping University, Linköping University, ESLAB - Embedded Systems Laboratory, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-38257.

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Electronic systems have become highly complex, which results in a dramatic increase of both design and production cost. Recently a core-based system-on-chip (SoC) design methodology has been employed in order to reduce these costs. However, testing of SoCs has been facing challenges such as long test application time and high temperature during test. In this thesis, we address the problem of minimizing test application time for SoCs and propose three techniques to generate efficient test schedules.

First, a defect-probability driven test scheduling technique is presented for production test, in which an abort-on-first-fail (AOFF) test approach is employed and a hybrid built-in self-test architecture is assumed. Using an AOFF test approach, the test process can be aborted as soon as the first fault is detected. Given the defect probabilities of individual cores, a method is proposed to calculate the expected test application time (ETAT). A heuristic is then proposed to generate test schedules with minimized ETATs.

Second, a power-constrained test scheduling approach using test set partitioning is proposed. It assumes that, during the test, the total amount of power consumed by the cores being tested in parallel has to be lower than a given limit. A heuristic is proposed to minimize the test application time, in which a test set partitioning technique is employed to generate more efficient test schedules.

Third, a thermal-aware test scheduling approach is presented, in which test set partitioning and interleaving are employed. A constraint logic programming (CLP) approach is deployed to find the optimal solution. Moreover, a heuristic is also developed to generate near-optimal test schedules especially for large designs to which the CLP-based algorithm is inapplicable.

Experiments based on benchmark designs have been carried out to demonstrate the applicability and efficiency of the proposed techniques.


2007
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Books on the topic "Test temperature"

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Knoll, Richard H. Design, development, and test of shuttle/Centaur G-prime cryogenic tankage thermal protection systems. [Washington, DC: National Aeronautics and Space Administration, 1987.

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Lachenbruch, Arthur H. Thermal measurements in Oak Springs Formation at the Nevada Test Site, southern Nevada. [Menlo Park, CA]: U.S. Geological Survey, 1987.

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Gillespie, David. Temperature profiles and hydrologic implications from the Nevada Test Site Area. Las Vegas, NV: Desert Research Institute, 2005.

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Kehoe, M. W. Thermoelastic vibration test techniques. Edwards, Calif: National Aeronautics and Space Administration, Ames Resarch Center, Dryden Flight Research Facility, 1991.

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Kehoe, M. W. Thermoelastic vibration test techniques. Edwards, Calif: National Aeronautics and Space Administration, Ames Resarch Center, Dryden Flight Research Facility, 1991.

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Anderson, Ken. Low temperature pavement performance: An evaluation using C-SHRP test road data. Ottawa: Transportation Association of Canada, 1999.

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C, Moore Thomas. Recommended strain gage application procedures for various Langley Research Center balances and test articles. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1997.

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Bigl, Susan R. Testing of materials from the Minnesota Cold Regions Pavement Research Test Facility. Hanover, NH: US Army Corps of Engineers, Cold Regions Research & Engineering Laboratory, 1996.

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Christensen, Donald W. Evaluation of indirect tensile test (IDT) procedures for low-temperature performance of hot mix asphalt. Washington, D.C: Transportation Research Board, 2004.

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Könnecke, R. EC static high-temperature leach test: Summary report of a European Community interlaboratory round robin. Luxembourg: Commission of the European Communities, 1985.

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Book chapters on the topic "Test temperature"

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Brown, Roger. "Effect of Temperature." In Physical Test Methods for Elastomers, 305–31. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-66727-0_21.

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Gilford, W. E., and A. Acharya. "Low-Temperature Regenerator Test Apparatus." In Advances in Cryogenic Engineering, 436–42. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4757-0513-3_54.

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Tylka, Jonathan M., and Timothy D. Gallus. "Auto Ignition Temperature Test Chamber Fire Investigation." In Flammability and Sensitivity of Materials in Oxygen-Enriched Atmospheres: 14th Volume, 234–45. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 2016. http://dx.doi.org/10.1520/stp159620150075.

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Carmona, Ricardo. "Temperature Regulation." In The IEA/SSPS Solar Thermal Power Plants — Facts and Figures— Final Report of the International Test and Evaluation Team (ITET), 104. Berlin, Heidelberg: Springer Berlin Heidelberg, 1986. http://dx.doi.org/10.1007/978-3-642-82684-9_44.

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Zhao, Qiang, and Jilai Xue. "Sintering Test Research of High Proportion Limonite." In 10th International Symposium on High-Temperature Metallurgical Processing, 189–98. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-05955-2_18.

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Altet, Josep, and Antonio Rubio. "Temperature as a test observable variable in ICs." In Thermal Testing of Integrated Circuits, 97–138. Boston, MA: Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3635-9_4.

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Yongyan, Li, Zhao Weimin, Xue Haitao, and Ding Jian. "Study on Magnesium Alloys Ignition Temperature Test System." In Advances in Intelligent and Soft Computing, 415–21. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-25349-2_55.

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Wang, Lijuan, Yanfeng Liu, Jiaping Liu, Yuhui Di, and Hao Zhou. "Effects of Test Methods on Human Axillary Temperature." In Lecture Notes in Electrical Engineering, 373–79. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-39584-0_42.

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Sinnamon, K., G. Ojard, B. Flandermeyer, and R. Miller. "Intermediate Temperature Oxidation: Review and Test Method Refinement." In Ceramic Transactions Series, 287–97. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2010. http://dx.doi.org/10.1002/9780470930953.ch27.

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Seitz, Mark T., Jason D. Hamilton, Richard K. Voltenburg, Limin Luo, Zhigang Wei, and Robert G. Rebandt. "Practical and Technical Challenges of the Exhaust System Fatigue Life Assessment Process at Elevated Temperature." In Fatigue and Fracture Test Planning, Test Data Acquisitions and Analysis, 371–409. 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959: ASTM International, 2017. http://dx.doi.org/10.1520/stp159820160084.

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Conference papers on the topic "Test temperature"

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Eick, Thomas, Andre Magi, Olaf Sausemuth, Steffen Biermann, and Patrick Sachse. "I4.2 - High Temperature NDIR Gas Measurement Module." In SENSOR+TEST Conferences 2009. AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, Germany, 2009. http://dx.doi.org/10.5162/irs09/i4.2.

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Pfahni, A. C., J. H. Lienhard, and A. H. Slocum. "Temperature control of a handler test interface." In Proceedings International Test Conference 1998. IEEE, 1998. http://dx.doi.org/10.1109/test.1998.743144.

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Ishisaki, Y., H. Akamatsu, A. Hoshino, T. Numazawa, K. Kamiya, R. Fujimoto, Y. Kojima, et al. "Performance test of Ti∕Au bilayer TES microcalorimeter in combination with continuous ADR." In THE THIRTEENTH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS—LTD13. AIP, 2009. http://dx.doi.org/10.1063/1.3292373.

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Hamon, Dominique M., Bernard Y. Damin, and Philippe N. China. "New Diesel Low Temperature Operability Test - Agelfi Filtration Test." In 1994 Subzero Engineering Conditions Conference and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1994. http://dx.doi.org/10.4271/940081.

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Kühnel, M., F. Hilbrunner, T. Fröhlich, and K. Lieberherr. "P2.4 - Climate Chamber for a High Temperature Stability." In SENSOR+TEST Conferences 2011. AMA Service GmbH, Von-Münchhausen-Str. 49, 31515 Wunstorf, Germany, 2011. http://dx.doi.org/10.5162/sensor11/sp2.4.

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Amrouch, Hussam, Behnam Khaleghi, and Jorg Henkel. "Optimizing temperature guardbands." In 2017 Design, Automation & Test in Europe Conference & Exhibition (DATE). IEEE, 2017. http://dx.doi.org/10.23919/date.2017.7926978.

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Yoneda, Tomokazu, Makoto Nakao, Michiko Inoue, Yasuo Sato, and Hideo Fujiwara. "Temperature-Variation-Aware Test Pattern Optimization." In 2011 16th IEEE European Test Symposium (ETS). IEEE, 2011. http://dx.doi.org/10.1109/ets.2011.45.

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Titov, D. E., N. Yu Shevschenko, and V. S. Galushak. "Test module temperature measurements were made." In 2014 International Conference on Actual Problems of Electron Devices Engineering (APEDE). IEEE, 2014. http://dx.doi.org/10.1109/apede.2014.6958232.

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Doroudian, Mark, Michael Kolich, Gabriella Almasi, Michael Medoro, Ramesh Dwarampudi, Mohsen battoei, and Swapnil Salokhe. "Virtual Temperature Controlled Seat Performance Test." In WCX World Congress Experience. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2018. http://dx.doi.org/10.4271/2018-01-1317.

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Jagan, Lavanya, Camelia Hora, Bram Kruseman, Stefan Eichenberger, Ananta K. Majhi, and V. Kamakoti. "Impact of Temperature on Test Quality." In 2010 23rd International Conference on VLSI Design: concurrently with the 9th International Conference on Embedded Systems Design (VLSID). IEEE, 2010. http://dx.doi.org/10.1109/vlsi.design.2010.49.

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Reports on the topic "Test temperature"

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Aaron, Adam M., Richard Burns Cunningham, David L. Fugate, David Eugene Holcomb, Roger A. Kisner, Fred J. Peretz, Kevin R. Robb, Dane F. Wilson, and Graydon L. Yoder, Jr. High Temperature Fluoride Salt Test Loop. Office of Scientific and Technical Information (OSTI), December 2015. http://dx.doi.org/10.2172/1237612.

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J. L. Rempe, K. G. Condie, D. L. Knudson, and L. L. Snead. Silicon Carbide Temperature Monitor Measurements at the High Temperature Test Laboratory. Office of Scientific and Technical Information (OSTI), January 2010. http://dx.doi.org/10.2172/974782.

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Bayless, Paul D. RELAP5-3D Pre-test Prediction for High Temperature Test Facility Test PG-26. Office of Scientific and Technical Information (OSTI), June 2018. http://dx.doi.org/10.2172/1467561.

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Bayless, Paul D., and J. Hope Forsmann. RELAP5-3D Assessment Using High Temperature Test Facility Test PG-22. Office of Scientific and Technical Information (OSTI), September 2017. http://dx.doi.org/10.2172/1408761.

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Epiney, Aaron. RELAP5-3D Modeling of High Temperature Test Facility (HTTF) Test PG-26. Office of Scientific and Technical Information (OSTI), September 2020. http://dx.doi.org/10.2172/1676420.

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Richard N. WRight. Controlled Chemistry Helium High Temperature Materials Test Loop. Office of Scientific and Technical Information (OSTI), August 2005. http://dx.doi.org/10.2172/911785.

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Ortensi, J., J. J. Cogliati, M. A. Pope, R. M. Ferrer, and A. M. Ougouag. Deterministic Modeling of the High Temperature Test Reactor. Office of Scientific and Technical Information (OSTI), June 2010. http://dx.doi.org/10.2172/989875.

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Glanville, P., P. Rowley, D. Schroeder, and L. Brand. Field Test of Boiler Primary Loop Temperature Controller. Office of Scientific and Technical Information (OSTI), September 2014. http://dx.doi.org/10.2172/1220341.

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Sterbentz, James William, Paul David Bayless, Lee Orville Nelson, Hans David Gougar, James Carl Kinsey, Gerhard Strydom, and Akansha Kumar. High-Temperature Gas-Cooled Test Reactor Point Design. Office of Scientific and Technical Information (OSTI), April 2016. http://dx.doi.org/10.2172/1261012.

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Glanville, P., P. Rowley, D. Schroeder, and L. Brand. Field Test of Boiler Primary Loop Temperature Controller. Office of Scientific and Technical Information (OSTI), September 2014. http://dx.doi.org/10.2172/1159356.

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