Relevant bibliographies by topics / Surface Technology

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Surface Technology'

Author: Grafiati
Published: 4 June 2021
Last updated: 10 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Surface Technology.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Surface Technology"

1

Hadfield, Prof M. "Manufacturing surface technology." Tribology International 35, no. 12 (December 2002): 871. http://dx.doi.org/10.1016/s0301-679x(02)00061-0.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

SHINANO, Toru. "Surface Finishing Technology." Journal of the Society of Mechanical Engineers 113, no. 1102 (2010): 710–11. http://dx.doi.org/10.1299/jsmemag.113.1102_710.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Vorobets, M. O., and V. V. Strebezhev. "The possibility of using filamentous fungus in the technology of the formation of highly porous surfaces on biocompatible substances." Surface 10(25) (December 30, 2018): 137–41. http://dx.doi.org/10.15407/surface.2018.10.137.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Yata, Tomohiko, Hiroyuki Sasahara, Toshiaki Segawa, and Masaomi Tsutsumi. "Surface Enhancement by Friction Stir Burnishing(Advanced machining technology (continued))." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.2 (2005): 547–52. http://dx.doi.org/10.1299/jsmelem.2005.2.547.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

SERIZAWA, Koji. "Trend of soldering technology - Surface mount technology." Circuit Technology 4, no. 6 (1989): 304–10. http://dx.doi.org/10.5104/jiep1986.4.304.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Masui, Shohei. "Plastics Surface Decoration Technology." Seikei-Kakou 31, no. 1 (December 20, 2018): 6–11. http://dx.doi.org/10.4325/seikeikakou.31.6.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

HIGUCHI, Toshitaka, Hideshi YOKOTA, and Teiji UCHIDA. "Optical Surface Mount Technology." Journal of Advanced Science 5, no. 1 (1993): c2. http://dx.doi.org/10.2978/jsas.5.c2.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

HATADA, Hajime, Hideyuki HARA, Hideshi YOKOTA, and Teiji UCHIDA. "Optical surface mount technology." Journal of Advanced Science 9, no. 1-2 (1997): 110. http://dx.doi.org/10.2978/jsas.9.110.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Yang, Yirong, Xiaodong Wang, Congxin Ren, Jianfang Xie, Pingfang Lu, and Weiyuan Wang. "Diamond surface micromachining technology." Diamond and Related Materials 8, no. 10 (October 1999): 1834–37. http://dx.doi.org/10.1016/s0925-9635(99)00117-x.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Uchida, Teiji, Yoshinori Masuda, and Masaru Akazawa. "Optical Surface Mount Technology." Japanese Journal of Applied Physics 31, Part 1, No. 5B (May 30, 1992): 1652–55. http://dx.doi.org/10.1143/jjap.31.1652.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Surface Technology"

1

Johansson, Lars. "SURFACE DRAG MODELING FOR MILLED SURFACES." Thesis, KTH, Mekanik, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-204017.

Full text
Abstract:
One of the governing sources of energy loss in a modern day jet engine is attributed to surfacedrag. This energy loss can be divided into friction loss and to surface geometry loss. Thefriction loss is the shear stress the fluid experience due to a no slip condition at the wall, whilethe surface geometry loss is due to pressure drop when the fuel passes an obstacle.The objective of this work is to study the drag coefficient of a plate for different types ofmilled tracks and for different kinds of flow conditions. The theories used to calculate thedrag coefficient are based on the momentum thickness theory including shear stress- andpressure integration. The computations were carried out with ANSYS CFX assuming a ShearStress Transport 𝑘 − 𝜔 turbulence model. The steady state flow conditions tested are varyingboundary layer thicknesses, milled track heights, milled track widths, Reynolds numbers overthe milled track height, Reynolds numbers over the plate length and free-stream angle ofattack. By knowing what affects the drag coefficient for different types of milled tracks, morepractical models can be developed making the prediction of surface drag inside the jet enginemore accurate.This report has resulted in a formula that predicts the drag coefficient for different types ofmilled surfaces. The formula is derived from the assumption that the CFD results on ANSYSCFX are correct. A physical test has not been made to verify those results, however this has tobe done to prove that this formula is valid.
APA, Harvard, Vancouver, ISO, and other styles
2

Andrews, Marilyn Mockus 1958. "Characterization of the surface acidity of passivated iron particles by flow microcalorimetry." Thesis, The University of Arizona, 1987. http://hdl.handle.net/10150/276614.

Full text
Abstract:
The characteristics of passivated iron particles have been examined with flow microcalorimetry to determine the acidic nature of the surface sites. The molar heat of adsorption of pyridine from hexane was measured with a FMC and a differential refractive index detector, at 23 and 40°C. The adsorption data were found to obey the assumptions of the Freundlich isotherm. The adsorption densities at different temperatures were used to calculate the isosteric heat of adsorption. The molar heat of adsorption of triethylamine from hexane was also measured and combined with the data for pyridine in order to calculate the Drago constants for the iron particles. A static adsorption method was used for the adsorption of pyridine from hexane onto the iron particles, for comparison with the dynamic method. The heat of wetting for the iron particles, with hexane, has also been measured. The iron particles were examined with X-ray diffraction. Mossbauer spectroscopy, XPS, SEM, TEM, and electrophoresis to characterize the surface layer. These techniques have revealed that the iron particles are coated with ferric oxide and this surface is amphoteric in aqueous solutions.
APA, Harvard, Vancouver, ISO, and other styles
3

Yazicioglu, Refet Firat. "Surface Micromachined Capacitive Accelerometers Using Mems Technology." Master's thesis, METU, 2003. http://etd.lib.metu.edu.tr/upload/1093475/index.pdf.

Full text
Abstract:
Micromachined accelerometers have found large attention in recent years due to their low-cost and small size. There are extensive studies with different approaches to implement accelerometers with increased performance for a number of military and industrial applications, such as guidance control of missiles, active suspension control in automobiles, and various consumer electronics devices. This thesis reports the development of various capacitive micromachined accelerometers and various integrated CMOS readout circuits that can be hybrid-connected to accelerometers to implement low-cost accelerometer systems. Various micromachined accelerometer prototypes are designed and optimized with the finite element (FEM) simulation program, COVENTORWARE, considering a simple 3-mask surface micromachining process, where electroplated nickel is used as the structural layer. There are 8 different accelerometer prototypes with a total of 65 different structures that are fabricated and tested. These accelerometer structures occupy areas ranging from 0.2 mm2 to 0.9 mm2 and provide sensitivities in the range of 1-69 fF/g. Various capacitive readout circuits for micromachined accelerometers are designed and fabricated using the AMS 0.8 µ
m n-well CMOS process, including a single-ended and a fully-differential switched-capacitor readout circuits that can operate in both open-loop and close-loop. Using the same process, a buffer circuit with 2.26fF input capacitance is also implemented to be used with micromachined gyroscopes. A single-ended readout circuit is hybrid connected to a fabricated accelerometer to implement an open-loop accelerometer system, which occupies an area less than 1 cm2 and weighs less than 5 gr. The system operation is verified with various tests, which show that the system has a voltage sensitivity of 15.7 mV/g, a nonlinearity of 0.29 %, a noise floor of 487 Hz µ
g , and a bias instability of 13.9 mg, while dissipating less than 20 mW power from a 5 V supply. The system presented in this research is the first accelerometer system developed in Turkey, and this research is a part of the study to implement a national inertial measurement unit composed of low-cost micromachined accelerometers and gyroscopes.
APA, Harvard, Vancouver, ISO, and other styles
4

Hossain, Mohammad Mokbul. "Plasma technology for deposition and surface modification." Berlin Logos, 2008. http://d-nb.info/993574106/04.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Gunnarsson, Sarius Niklas. "Surface Technology for Optical and Electrical Connectors." Doctoral thesis, Linköpings universitet, Tunnfilmsfysik, 2010. http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-63626.

Full text
Abstract:
This thesis treats surface engineering with the purpose of improved quality of optical and electricalconnectors with a focus on electroplated and magnetron sputtered materials. In electroforming of tools formanufacturing optical connectors, the influence of ultrasonic agitation on intrinsic stresses and fillingproperties of electroplated Ni has been studied. It is established that the ultrasonic agitation at the substratesurface during deposition impacts the intrinsic stresses making it possible to increase deposition rate viacurrent density, with stress-free or low-stress levels in the Ni layers. Reduced variations of the intrinsicstress over the surface with the current density is a further important result. Filling of grooves byelectroplating of Ni using ultrasonic agitation is demonstrated. This is due to increasing mass transport ofspecies into the grooves compared to conventional pumped agitation. The enhanced filling propertiesmakes it possible to electroplate Ni in the bottom of high-aspect-ratio grooves. In order to industriallyimplement new nanocomposite coatings on electronic connectors, studies have been performed regardingthe thermal diffusion barrier properties against Cu for Ti-Si-C and Ti-Si-C-Ag nanocomposites, depositeddirectly onto Cu substrates or with sputtered Ni, Ti or electroplated Ni as an intermediate coating. Theapplication of an electroplated Ni diffusion barrier coating, hinders Cu from reaching the surface of thenanocomposites. Also, Ti-Si-C-Ag nanocomposite deposited on magnetron sputtered Ni or Ti on Cusubstrates hinder Cu from diffusing to the surface after annealing. The contact resistance of Ag-Pdtopcoated Ti-Si-C-Ag-Pd and Ti-Si-C-Ag nanocomposite coatings in contact with hard gold is shown tocompete with hard gold in contact with itself, as electrical contact coatings at contact forces around 5 N.Ag-Pd topcoated Ti-Si-C-Ag-Pd in contact with hard gold is shown to have approximately the same contactresistance as hard gold in contact with hard gold at contact forces around 0.1 N, which here is in the 10 mΩrange, while Ti-Si-C-Ag nanocomposite coatings in contact with hard gold has a contact resistance that isup to 10 times higher. The overall contribution of this thesis can be summarised as a deeper knowledge andunderstanding of techniques and coatings, that help reduce cost and increase reliability of electronics.
APA, Harvard, Vancouver, ISO, and other styles
6

Doherty, Kyle George. "Microplasma technology for influencing cell-surface interactions." Thesis, University of Liverpool, 2014. http://livrepository.liverpool.ac.uk/18213/.

Full text
Abstract:
Cataracts are the most common cause of preventable blindness worldwide. During cataract surgery a polymeric intraocular lens (IOL) is used to replace the cloudy natural lens. The most common post-operative complication is posterior capsule opacification (PCO). PCO is a wound healing response related to scarring, in which cellular changes disrupt the light path to the back of the eye through various processes, requiring a costly surgery to restore vision. The material of the IOL has been shown to affect PCO and it is hypothesised that the surface modification of IOL materials may be able to reduce the incidence of PCO. The use of plasmas established in the field of biomaterials modification and atmospheric pressure processes have significant benefits over the previous low pressure systems. In this work investigates the use of an atmospheric pressure plasma jet to modify the surface properties of polymeric materials, with the aim of developing a surface treatment method for use on IOLs. Materials and Methods The centre of polystyrene (PS) and poly(methyl methacrylate)(PMMA) surfaces were treated with an atmospheric pressure microplasma jet. The modification of surfaces was characterised by spatially resolved water contact angle, x-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). LECs were seeded onto surfaces and grown for 1-7 days. Cell attachment, growth and morphology were examined microscopically. The concentrations of some cytokines implicated in PCO (transforming growth factor-β2, basic fibroblast growth factor, interleukin-1, interleukin-6, and tumour necrosis factor-α) in culture medium were examined at specific time points. Tissue culture polystyrene and untreated materials served as controls. Atmospheric pressure plasma polymerisation of amine containing monomers using a plasma jet was also investigated. Results and Discussions The size of surface treatment could be tailored by altering flow rate and sample-nozzle distance. Surface treatment was due to an increase in surface oxygen content and plasma treatment did not cause a significant change in surface roughness. Plasma treatment increased the LEC adhesion to substrates. LECs were densely populated in the centre of treated materials and cells lacked the cobblestone morphology typical of epithelial cells. The secretion of inflammatory cytokines by LECs grown on plasma treated surfaces did not appear to be up-regulated in comparison to tissue culture polystyrene, however these results are preliminary. This work demonstrated that atmospheric pressure plasma polymerisation can be achieved using the plasma jet system to incorporate nitrogen functionalisation onto PS surfaces; however oxygen was also incorporated onto surfaces. Conclusions This work demonstrates that an atmospheric pressure microplasma jet can be used to modify surfaces in a spatially defined manner, without damaging the polymer surfaces. The increase in surface oxygen promotes cell adhesion which can be confined to an area <3mm. This treatment size is too large to be used to create different spatially defined treatments on IOL optics as the typical optic diameter is only 6mm. The large treatment size is possibly due to gas convection spreading reactive species across the surface of samples when the plasma jet reaches the surface. Plasma polymerisation could possibly be used to incorporate functional groups which promote LEC growth which maintains an epithelial morphology.
APA, Harvard, Vancouver, ISO, and other styles
7

Hui, Ip Kee. "Analysis of surface mount technology solder joints." Thesis, Brunel University, 1996. http://bura.brunel.ac.uk/handle/2438/5380.

Full text
Abstract:
The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex. The exploration of these factors, and how they may affect the reliability and quality of the joints can only be achieved through continuous research. In this project, essential areas of SMT joints were selected for study and analysis, with the intention of providing additional design and process guidelines for the production of quality SMT joints. In the infrared reflow process, one of the common defect phenomena is the occurrence of tombstoning; that is after soldering only one end of the component is soldered while the other is lifted up, assuming a position like a tombstone. The initiation of tombstoning during reflow was analysed based on the forces acting on the component. A model was developed to predict the initiation of this phenomenon. The model shows that, under vibration-free conditions, the surface tension of the molten solder is the source of the force causing the initiation of tombstoning. The contact angle, which varies with the length of the printed circuit board solder land, has a significant effect on the value of the surface tension acting as a force pulling upward on the component. The model further shows that tombstoning initiation is due to the combined effects of the surface tension; the weight of the component; the dimensions of the component; the length of the solder underneath the component; and the length of the solder protruding from the end of the component. Selected components were used as examples for predicting the conditions of initiation, and these conditions were further substantiated by a series of experiments. Another area of study was a method which directly pulled the components off printed circuit boards and this was used as a means for testing the bond quality of surface mount technology leadless chip solder joints. Components D7243, CC1206, RC1206, RC121O, and CC1 812 were selected for this study. It was found that the ultimate tensile force which breaks a component off the printed circuit board has the potential to be used as a parameter for measuring the quality of the solder joint. The effect of solder thickness on the strength of a joint has also been investigated. The shape of joints soldered by two methods, wave soldering and infrared reflow, were compared. Joints at the two ends of a component produced by infrared reflow were found more uniform than the ones produced by wave soldering. A recommendation is made here for the wave soldering approach in achieving uniform solder joints. The effects of solder shape on the joint strength were further investigated by finite element analysis. A convex joint was found marginally more robust than a concave joint. Two aspects of the internal structure of SMT solder joints were investigated, void content and copper/tin intermetallic compounds. The voiding conditions of wave-soldered and infrared reflow joints were compared. No voids were found in all specimens that were produced by wave soldering. However, there were always voids inside joints produced by infrared reflow. Microhardness tests indicated that the hardness of compounds at the copper/solder interface of infrared reflowed joints is lower than that in the wave-soldered joints. It is considered that the lower hardness of the interfacial region of the infrared reflowed joints is due to the presence of voids. Scanning electron microscopy was used to study the formation of copper/tin intermetallic compounds for joints produced by infrared reflow. The results show that Cu 6 Sn5 was the only compound with a detectable thickness. Other compounds such as Cu3 Sn, were virtually not found at all. Aging of the joints at 100°C, shows that both the Cu 6Sn5 and the overall interfacial thickness grew with time. One of the important areas which had been overlooked previously and was studied in some details was the effects of solder paste exposure on the quality of solder paste. The characteristic changes of solder paste due to exposure were investigated in three areas, weight loss, tackiness, and rheology. The evaporation of low boiling point solvents was considered as the main contribution to the loss in the weight of the solder paste. The weight loss against exposure time was found to follow an exponential behaviour. A method was designed to evaluate the tackiness changes of solder paste due to exposure. It was found that the decay of tackiness against exposure time can be expressed by a power law. It is recommended that solder paste manufacturers should provide the necessary characteristic constants so as to enable the characteristics to be calculated after a specific exposure. The rheological changes of the solder paste as a result of exposure were also investigated. The implication on the printability of the solder paste due to these changes was studied and discussed.
APA, Harvard, Vancouver, ISO, and other styles
8

Golding, Randy Dale. "Synthesis and application of alkyl dihydrochlorosilanes: A new approach to the surface modification of porous silica." Diss., The University of Arizona, 1988. http://hdl.handle.net/10150/184427.

Full text
Abstract:
Three alkyldihydrochlorosilanes were synthesized; ethyldihydrochlorosilane, octyldihydrochlorosilane and octadecyldihydrosilane. Ethyldihydrochlorosilane was produced by the reaction of ethylsilane with mercuric chloride and the other two chlorosilanes were produced by the reaction of the alkyl Grignard reagent with dichlorosilane. Each alkyldihydrochlorosilane was reacted with porous silica in an attempt to discover the extent of reaction or the highest surface concentration of bonded groups attainable. The reaction between these alkydihydrochlorosilanes and porous silica was compared to the reaction between silica and the analogous alkyldimethylchlorosilane. The rate of reaction of both type of chlorosilane was found to be essentially the same. The maximum surface concentration of bonded surface groups attainable by alkyldihydrochlorosilanes was found to be approximately 1.3 #moles/m² greater than that attainable by alkyldimethylchlorosilanes. This increased surface coverage seemed to depend very little on the chain length of the alkyl group and was attributed to the decrease in steric hindrance of the bonding silicon atom of the silane. Surface bound silyl hydrides could be oxidized selectively and sequentially to form silane silanols. Surface silanes also appeared to reduce chloroplatinic acid, but were not observed to add efficiently to olefins. The chromatographic properties of silica modified with alkyldihydrochlorosilanes were compared to those of equivalent silicas modified with alkyldimethylchlorosilanes and alkyltrichlorosilanes before and after the surface silanes were oxidized. Both normal and reversed-phase liquid chromatographic studies were conducted. In general, it was found that alkyldihydrochlorosilanes yielded the most polar modified silicas. This greater surface polarity was attributed to an increase in the activity of water in the near surface region of the bonded phase.
APA, Harvard, Vancouver, ISO, and other styles
9

Lee, Chee-kwan. "Modelling of flexible surfaces using a point mass system /." [Hong Kong : University of Hong Kong], 1992. http://sunzi.lib.hku.hk/hkuto/record.jsp?B13204889.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Burton, Zachary Travis. "Surface characterization, adhesion, and friction properties of hydrophobic leaf surfaces and nanopatterned polymers for superhydrophobic surfaces." Connect to resource, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1160489659.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Surface Technology"

1

Surface analytical techniques. Oxford [England]: Clarendon Press, 1990.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

Surfactant science and technology. 2nd ed. New York: VCH, 1992.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

Myers, Drew. Surfactant science and technology. Weinheim: VCH, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Surfactant science and technology. 2nd ed. New York: VCH, 1992.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Surfactant science and technology. New York, N.Y: VCH, 1988.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Myers, Drew. Surfactant Science and Technology. New York: John Wiley & Sons, Ltd., 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Surfactant science and technology. 3rd ed. Hoboken, N.J: J. Wiley, 2006.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Surface mount technology. Oxford: Butterworth-Heinemann, 1994.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Prasad, Ray P. Surface Mount Technology. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-4084-7.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Prasad, Ray P. Surface Mount Technology. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-011-6532-7.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Surface Technology"

1

Peißker, Peter. "Surface-Preparation Technology." In Handbook of Hot-Dip Galvanization, 29–90. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2011. http://dx.doi.org/10.1002/9783527636884.ch3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Naito, Makio, and Hidehiro Kamiya. "Surface Modification." In Powder Technology Handbook, 311–16. Fourth edition. | Boca Raton, FL : Taylor & Francis Group, LLC, 2020.: CRC Press, 2019. http://dx.doi.org/10.1201/b22268-42.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Prasad, Ray P. "Implementing Surface Mount Technology." In Surface Mount Technology, 41–61. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6532-7_2.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Smart, R. St C. "Materials Technology." In Springer Series in Surface Sciences, 319–36. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-662-02767-7_16.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Prasad, Ray P. "Introduction to Surface Mount Technology." In Surface Mount Technology, 3–39. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6532-7_1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Prasad, Ray P. "Introduction to Surface Mount Technology." In Surface Mount Technology, 3–50. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-4084-7_1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Nicolaus, M., and M. Schäpers. "Fundamentals of Thin-film Technology." In Modern Surface Technology, 31–50. Weinheim, FRG: Wiley-VCH Verlag GmbH & Co. KGaA, 2006. http://dx.doi.org/10.1002/3527608818.ch3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Prasad, Ray P. "Surface Mount Components." In Surface Mount Technology, 65–112. Dordrecht: Springer Netherlands, 1989. http://dx.doi.org/10.1007/978-94-011-6532-7_3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Prasad, Ray P. "Surface Mount Components." In Surface Mount Technology, 85–148. Boston, MA: Springer US, 1997. http://dx.doi.org/10.1007/978-1-4615-4084-7_3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Ali Elbeblawi, Mostafa Mohamed, Hassan Ali Abdelhak Elsaghier, Mostafa Tantawy Mohamed Amin, and Wael Rashad Elrawy Abdellah. "Surface Mining Equipments." In Surface Mining Technology, 201–51. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-3568-7_6.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Surface Technology"

1

Berezin, A. A. "Isotopic engineering in surface science and technology." In CONTACT AND SURFACE 2011. Southampton, UK: WIT Press, 2011. http://dx.doi.org/10.2495/secm110171.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Brown, D. K. "The Advanced Technology Frigate." In Warship 90 - The Future for Surface Warships. RINA, 1990. http://dx.doi.org/10.3940/rina.warship.1990.13.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Zetková, I., and M. Zetek. "Using cermet inserts in HSC technology when machining hard-to-machine tool steel." In CONTACT AND SURFACE 2015. Southampton, UK: WIT Press, 2015. http://dx.doi.org/10.2495/secm150081.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Hirasawa, Takamichi, and Michihiro Yamamoto. "Burrless Surface Processing Technology." In SAE 2016 World Congress and Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2016. http://dx.doi.org/10.4271/2016-01-1074.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Munnecke, D. M., and W. P. Weaver. "Microbial Surface Geochemical Exploration Technology." In Technical Meeting / Petroleum Conference of The South Saskatchewan Section. Petroleum Society of Canada, 1999. http://dx.doi.org/10.2118/99-100.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Tuck, Matt, Beth Wray, and Mark Musgrave. "Surface and Subsurface Decontamination Technology." In ASME 2013 15th International Conference on Environmental Remediation and Radioactive Waste Management. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/icem2013-96230.

Full text
Abstract:
A number of proven technologies applicable to the chemical and physical decontamination of radioactive and non-radioactive contaminants within the environmental remediation and radiological waste management sectors exist. Previous work generally acknowledges that these methods have limitations such as production of large volumes of waste, destruction of the substrate, complex safety considerations [1a] and application of special precautions to meet disposal acceptance criteria [2]. A method that removes a variety of contaminants from the surface and subsurface of porous materials, with minimal contaminated waste arisings, is highly desirable. TechXtract® is a patented, sequential chemical extraction process developed to remove radionuclides, PCBs, and other hazardous organic and inorganic substances from solid materials such as concrete, brick, steel, and exotic metals [3]. The technology uses multifarious task-specific chemical formulations and engineered applications to achieve surface penetration and removal of the contaminants from the atomic voids of metals and other substrates, or the capillaries and gel pores of concretes. TechXtract® is proven to remove a variety of contaminants from various substrates, allowing free release of the substrate as waste for disposal, or re-use, whilst producing minimal secondary waste. Data from testing of TechXtract’s capabilities and evidencing the technology’s efficacy during site based applied research and development is presented here.
APA, Harvard, Vancouver, ISO, and other styles
7

Hesselbarth, Jan. "Surface-mount cavity filter technology." In 2007 European Microwave Conference. IEEE, 2007. http://dx.doi.org/10.1109/eumc.2007.4405222.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Crice, Doug, Paul Flood, Erik Walthinsen, Mark D. Prouty, Mikhail Tchernychev, and Rahul R. Mhaskar. "Near Surface Geophysical Sensor Technology." In Symposium on the Application of Geophysics to Engineering and Environmental Problems 2015. Society of Exploration Geophysicists and Environment and Engineering Geophysical Society, 2015. http://dx.doi.org/10.4133/sageep.28-065.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Erokhin, G. N., V. D. Baranov, A. N. Kremlev, and S. V. Rodin. "Compact Surface Microseismic Monitoring Technology." In EAGE and SPE Joint Workshop: Geoscience Monitoring of the Field Development Process. Netherlands: EAGE Publications BV, 2013. http://dx.doi.org/10.3997/2214-4609.201701918.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Yabumoto and Sinha. "Surface Control for ULSIs (Atomic Order Planarization of Si Surfaces)." In Symposium on VLSI Technology. IEEE, 1993. http://dx.doi.org/10.1109/vlsit.1993.760275.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Surface Technology"

1

Cheng, Chung H. Novel Laser Ablation Technology for Surface Decontamination. Office of Scientific and Technical Information (OSTI), June 2004. http://dx.doi.org/10.2172/839149.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Chen, Winston C. H. Innovative Laser Ablation Technology for Surface Decontamination. Office of Scientific and Technical Information (OSTI), June 2002. http://dx.doi.org/10.2172/835397.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Chen, Winston C. H. Innovative Laser Ablation Technology for Surface Decontamination. Office of Scientific and Technical Information (OSTI), June 2003. http://dx.doi.org/10.2172/835399.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Atanasov, I. Surface Decontamination Technology of Metallic Radioactive Waste. Prof. Marin Drinov Publishing House of Bulgarian Academy of Sciences, March 2018. http://dx.doi.org/10.7546/engsci.lv.18.01.06.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Johnson, Ramsey D. FY89 Technology Transfer Summary Naval Surface Warfare Center. Fort Belvoir, VA: Defense Technical Information Center, August 1990. http://dx.doi.org/10.21236/ada229745.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Johnson, Ramsey D. Naval Surface Warfare Center Technology Transfer Report (FY88). Fort Belvoir, VA: Defense Technical Information Center, October 1988. http://dx.doi.org/10.21236/ada219633.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Johnson, Ramsey D. Technology Transfer Summary Report (FY91) Naval Surface Warfare Center. Fort Belvoir, VA: Defense Technical Information Center, June 1992. http://dx.doi.org/10.21236/ada254637.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Johnson, Ramsey D. Technology Transfer Summary Report (FY90) Naval Surface Warfare Center. Fort Belvoir, VA: Defense Technical Information Center, March 1991. http://dx.doi.org/10.21236/ada242353.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Kelley, J. B., and R. D. Skocypec. Control technology for surface treatment of materials using induction hardening. Office of Scientific and Technical Information (OSTI), April 1997. http://dx.doi.org/10.2172/494129.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Rubloff, G. W., and M. Liehr. Growth and Surface Chemistry of Passivating Insulators for Silicon Technology. Fort Belvoir, VA: Defense Technical Information Center, February 1992. http://dx.doi.org/10.21236/ada247243.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Surface Technology' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography