Academic literature on the topic 'Substrate transfert'
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Journal articles on the topic "Substrate transfert":
Liu, Shuzhen, Bingwen Liu, Yin Zhu, Yong Qiu, and Bing Li. "The Spatial–Temporal Effects of Bacterial Growth Substrates on Antibiotic Resistance Gene Spread in the Biofilm." Antibiotics 12, no. 7 (July 6, 2023): 1154. http://dx.doi.org/10.3390/antibiotics12071154.
Liao, Michael Evan, Kenny Huynh, Brandon Carson, Lezli Matto, Kaicheng Pan, James Spencer Lundh, Marko Tadjer, Karl D. Hobart, and Mark S. Goorsky. "Towards Controlled Transfer of (001) β-Ga2O3 to (0001) 4H-SiC Substrates." ECS Transactions 112, no. 3 (September 29, 2023): 269–78. http://dx.doi.org/10.1149/11203.0269ecst.
Girasek, Tomas, Alena Pietrikova, Tilo Welker, and Jens Muller. "Simulation of Heat Transfer by Cooling Channels in LTCC Substrate." Acta Electrotechnica et Informatica 17, no. 2 (June 1, 2017): 11–15. http://dx.doi.org/10.15546/aeei-2017-0010.
Jakubowski, Simon J., Eric Cascales, Vidhya Krishnamoorthy, and Peter J. Christie. "Agrobacterium tumefaciens VirB9, an Outer-Membrane-Associated Component of a Type IV Secretion System, Regulates Substrate Selection and T-Pilus Biogenesis." Journal of Bacteriology 187, no. 10 (May 15, 2005): 3486–95. http://dx.doi.org/10.1128/jb.187.10.3486-3495.2005.
Butzerin, Andre, Sascha Weikert, and Konrad Wegener. "Growth Substrate Geometry Optimization for the Productive Mechanical Dry Transfer of Carbon Nanotubes." Processes 12, no. 5 (May 1, 2024): 928. http://dx.doi.org/10.3390/pr12050928.
Liu, Yang, Keying Long, Hanbing Mi, Ruitao Cha, and Xingyu Jiang. "High-efficiency transfer of fingerprints from various surfaces using nanofibrillated cellulose." Nanoscale Horizons 4, no. 4 (2019): 953–59. http://dx.doi.org/10.1039/c8nh00494c.
Whitaker, Neal, Yuqing Chen, Simon J. Jakubowski, Mayukh K. Sarkar, Feng Li, and Peter J. Christie. "The All-Alpha Domains of Coupling Proteins from the Agrobacterium tumefaciens VirB/VirD4 and Enterococcus faecalis pCF10-Encoded Type IV Secretion Systems Confer Specificity to Binding of Cognate DNA Substrates." Journal of Bacteriology 197, no. 14 (May 4, 2015): 2335–49. http://dx.doi.org/10.1128/jb.00189-15.
Whitaker, Neal, Trista M. Berry, Nathan Rosenthal, Jay E. Gordon, Christian Gonzalez-Rivera, Kathy B. Sheehan, Hilary K. Truchan, et al. "Chimeric Coupling Proteins Mediate Transfer of Heterologous Type IV Effectors through the Escherichia coli pKM101-Encoded Conjugation Machine." Journal of Bacteriology 198, no. 19 (July 18, 2016): 2701–18. http://dx.doi.org/10.1128/jb.00378-16.
Jansson, Elina, Johanna Lyytikäinen, Panu Tanninen, Kim Eiroma, Ville Leminen, Kirsi Immonen, and Liisa Hakola. "Suitability of Paper-Based Substrates for Printed Electronics." Materials 15, no. 3 (January 26, 2022): 957. http://dx.doi.org/10.3390/ma15030957.
Lim, Jaemook, Youngchan Kim, Jaeho Shin, Younggeun Lee, Wooseop Shin, Weihao Qu, Eunseung Hwang, Seongje Park, and Sukjoon Hong. "Continuous-Wave Laser-Induced Transfer of Metal Nanoparticles to Arbitrary Polymer Substrates." Nanomaterials 10, no. 4 (April 7, 2020): 701. http://dx.doi.org/10.3390/nano10040701.
Dissertations / Theses on the topic "Substrate transfert":
Argoud, Maxime. "Mécanismes de collage et de transfert de films monocristallins dans des structures à couches de polymères." Phd thesis, Université de Grenoble, 2012. http://tel.archives-ouvertes.fr/tel-00848111.
Gorantla, Sandeep, Alicja Bachmatiuk, Jeonghyun Hwang, Hussain A. Alsalman, Kwak Joon Young, Thomas Seyller, Jürgen Eckert, Michael G. Spencer, and Mark H. Rümmeli. "A universal transfer route for graphene." Royal Society of Chemistry, 2014. https://tud.qucosa.de/id/qucosa%3A36288.
Zhang, Shuangfeng. "Wide Bandgap Semiconductor Components Integration in a PCB Substrate for the Development of a High Density Power Electronics Converter." Thesis, Université Paris-Saclay (ComUE), 2018. http://www.theses.fr/2018SACLS398/document.
The emerging wide bandgap (WBG) semiconductor devices have been developed for power conversion applications instead of silicon devices due to higher switching frequencies (from few 100 kHz to several MHz) and lower on-state losses resulting in a better efficiency. In order to take full advantage of the WBG components, PCB technology is attractive for high power density integration thanks to its flexibility and low cost. However, due to poor thermal conductivity of the commonly used material Flame Retardant-4 (FR4), efficient thermal solutions are becoming a challenging issue in integrated power boards based on PCB substrates. So it is of the first importance to seek technological means in order to improve the thermal performances. In this thesis, three main thermal management solutions for PCB structures have been investigated including thermal vias, thick copper thickness on the PCB substrate as well as thermoelectric cooling (TEC) devices. Our studies are based on the electro-thermal modeling and 3D finite element (FE) methods. Firstly, optimization of the thermal via parameters (via diameter, via plating thickness, via-cluster surface, via pattern, pitch distance between vias etc.) has been realized to improve their cooing performances. We presented and evaluated thermal performances of the PCB structures by analyzing the thermal resistance of the PCB substrate with different thermal vias. Secondly, it is found that thermal performances of the PCB structures can be enhanced by using thick copper thickness on top of the PCB substrate, which increases the lateral heat flux along the copper layer. Influences of the copper thickness (35 µm to 500 µm) has been discussed. This solution is easy to realize and can be combined with other cooling solutions. Thirdly, thermoelectric cooler like Peltier device is a solid-state cooling technology that can meet the local cooling requirements. Influences of Peltier parameters (Thermoelectric material properties, number of Peltier elements, distance between the heating source and the Peltier devices etc.) have been identified. All these analyses demonstrate the potential application of Peltier devices placed beside the heating source for PCB structures, which is a benefit for developing the embedding technology in such structures
Kambhampati, Patanjali. "Adsorbate-substrate charge transfer excited states /." Digital version accessible at:, 1998. http://wwwlib.umi.com/cr/utexas/main.
Danyal, Karamatullah. "Electron Transfer and Substrate Reduction in Nitrogenase." DigitalCommons@USU, 2014. https://digitalcommons.usu.edu/etd/2181.
Bouillaud, Hugo. "Fabrication et optimisation des caractéristiques thermiques de diodes Schottky de la filière GaAs et reportées sur SiHR pour des applications de multiplication de fréquences." Electronic Thesis or Diss., Université de Lille (2022-....), 2023. http://www.theses.fr/2023ULILN043.
The exponential needs associated with applications exploiting the THz domain require to expand the range of available sources and optimize their fabrication processes. In this thesis, we focused on schottky diodes for its use as frequency multipliers. Our experimental research involved optimizing the characteristics of GaAs schottky diodes through the development and implementation of an innovative fabrication process. First, we fabricated GaAs schottky diodes on GaAs substrate with several aspect ratios in order to make a reference in terms of device. Then we fabricated a flip-chip device for a 150 GHz frequency multiplication application in a waveguide block. Finally, in order to enhance the power handling of the diodes, we optimized their thermal dissipation by transferring their epitaxial structure onto a substrate with higher thermal conductivity : SiHR (high resistivity silicon). The complete technological processes for these fabrications are detailed, and the last part of the study is dedicated to their characterization. On one hand, we assessed any variations in the characteristics of GaAs diodes on GaAs induced by the different aspect ratios. On the other hand, we compared the two technologies on SiHR and GaAs substrates. This work demonstrates the potential of this type of transferred technology, where a significant reduction of thermal resistance is observed and is associated with a notable improvement of the series resistance
Thiam, Ndèye Arame. "Etude et développement de transistors bipolaires à hétérojonctions InP/GaAsSb reportés sur Si en vue de l’amélioration de la dissipation thermique." Thesis, Lille 1, 2012. http://www.theses.fr/2012LIL10168/document.
The InP heterojonctions bipolar transistors (HBT) offer today cut-off frequencies larger than 400GHz for the InP / GaAsSb system. Thanks to these performances, these transistors are used for the realization of successful circuits in millimeter-wave applications such as the optical communications. So, to reach these remarkable performances, the HBT are subject to a notorious self-heating phenomenon due to high current density of collector. This thesis thus has for object the study and the development of InP / GaAsSb HBT transferred on a host substrate of silicon with the aim of the improvement of the thermal behavior. We report first of all the principles of the bipolar transistor as well as the state of the art of the various materials used for fast transistors. A transfer technique of epitaxial layers was then presented. We study bounding problems resulting from the chosen technique and transfer parameters for valid thermo-compression at low temperature were optimized. The development of InP / GaAsSb transferred technology on silicon was then made. In particular, the collector contact realization has needed particular attention. Active layers thickness reduction as well as device fabrication process technology allowed reaching transition frequency Ft higher than 400GHz. The study of HBT thermal behavior was finally presented with thermal resistance extraction. Very low values were obtained on the transferred technology, from 800 to1300 W/K.m according to transistors size; these values are very close to those obtained by TCAD simulation for such a technology. It is the first measurement on InP / GaAsSb transferred-HBT on high thermal conductivity silicon substrate. This transfer technology has so allowed thermal resistance improvement of 70 % compared with that of standard HBT technology. This work leads to the influence of transferred-substrate for the severe reduction of self-heating in bipolar transistors technology
De, vecchy Jon. "Réalisation de substrats innovants à partir de diamant." Thesis, Université Grenoble Alpes, 2020. http://www.theses.fr/2020GRALT022.
Within a global aim of reducing energy consumption, microelectronics components must be more efficient and less energy-consuming. Power electronics, which converts electric power, is particularly concerned because its component must operate at high intensity, voltage and temperature. Silicon, the base material of these components, is reaching its limits and the conception of components made with other materials is currently being studied. Among the candidate materials, diamond and its outstanding properties is of great interest. Its excellent thermal conductivity (2200 W/m/K) combined with high breakdown field (10 MV/cm) and high hole mobility (2000 cm²/V/s) are attractive for making smaller and more efficient components.However, monocrystalline diamond synthesis methods are limiting substrate size to about 15 x 15 mm², thus preventing its industrialization. The approach developed in this thesis is the diamond layer transfer to another substrate by adapting the Smart Cut^TM process. This process is based on a combination of ion implantation and bonding of the implanted substrate to a receiving substrate. Annealing then causes the fracture of the implanted substrate and the detachment of a film (with controlled thickness) which is transferred to the receiving substrate. This approach would make it possible to reduce component cost by decreasing diamond consumption and to open the way to industrialization thanks to successive transfers on a large substrate.Smart Cut^TM must be fully adapted to the diamond case, studies of each step will thus be presented. Blistering observation on the implanted substrate surface after annealing is the very first step of ion implantation parameters adaptation. A blistering process using combinations of hydrogen ion implantation and annealing will be presented.Diamond transformations occurring during the process will be characterized. Full layer transfer studies using substrate bonding will then be presented. Finally, prospects for optimization and realization will be given
Carlmark, Anna. "Atom transfer radical polymerization from multifunctional substrates." Licentiate thesis, KTH, Polymer Technology, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-1447.
Atom transfer radical polymerization (ATRP) has proven to be a powerful technique to obtain polymers with narrow polydispersities and controlled molecular weight. It also offers control over chain-ends. The technique is the most studied and utilized of thecontrolled/”living” radical polymerization techniques since a large number of monomerscan be polymerized under simple conditions. ATRP can be used to obtain polymer graftsfrom multifunctional substrates. The substrates can be either soluble (i. e. based ondendritic molecules) or insoluble (such as gold or silicon surfaces). The large number ofgrowing chains from the multifunctional substrates increases the probability of inter-and intramolecular reactions. In order to control these kinds of polymerizing systems, andsuppress side-reactions such as termination, the concentration of propagating radicalsmust be kept low. To elaborate such a system a soluble multifunctional substrate, based on 3-ethyl-3-(hydroxymethyl)oxetane, was synthesized. It was used as a macroinitiatorfor the atom transfer radical polymerisation of methyl acrylate (MA) mediated byCu(I)Br and tris(2-(dimethylamino)ethyl)amine (Me6-TREN) in ethyl acetate at room temperature. This yielded a co-polymer with a dendritic-linear architecture. Since mostsolid substrates are sensitive to the temperatures at which most ATRP polymerisations are performed, lowering the polymerization temperatures are preferred. ATRP at ambienttemperature is always more desirable since it also suppresses the formation of thermally formed polymer. The macroinitiator contained approximately 25 initiating sites, which well mimicked the conditions on a solid substrate. The polymers had low polydispersity and conversions as high as 65% were reached without loss of control. The solid substrateof choice was cellulose fibers that prior to this study not had been grafted through ATRP.As cellulose fibers a filter paper, Whatman 1, was used due to its high cellulose content.The hydroxyl groups on the surface was first reacted with 2-bromoisobutyryl bromidefollowed by grafting of MA. Essentially the same reaction conditions were used that hadbeen elaborated from the soluble substrate. The grafting yielded fibers that were very hydrophobic (contact angles>100°). By altering the sacrificial initiator-to-monomer ratiothe amount of polymer that was attached to the surface could be tailor. PMA with degreesof polymerization (DP’s) of 100, 200 and 300 were aimed. In order to control that thepolymerizations from the surface was indeed “living” a second layer of a hydrophilicmonomer, 2-hydroxymethyl methacrylate (HEMA), was grafted onto the surface. Thisdramatically changed the hydrophobic behavior of the fibers.
QC 20100524
Voisin, Jérémy. "Influence des pratiques de recharge des aquifères par des eaux pluviales sur les communautés microbiennes des nappes phréatiques." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSE1113/document.
In urban area, managed aquifer recharge (MAR) systems raises hydrological connectivity between surface and groundwater. These infiltration practices are the cause of many disturbances in groundwaters (e.g. increase of thermal variations, decrease of dissolved oxygen or enrichment in organic matter) but associated consequences on microbial compartment remains unclear. The main aim of the thesis is to determine the effects of stormwater runoff infiltration on microbial communities of groundwater, in terms of abundance, activities and bacterial diversity. Based on environmental changes associated to MAR practices and bacterial community analyses, a fundamental question is to assess the importance of dispersal (e.g. transfers) and selection by abiotic factors (e.g. nutrients availability) on groundwater communities assemblage. This study is based on field experiments with two complementary strategies of sampling: an active one (i.e. groundwater sampling) and a passive one (incubation of artificial substrate). Communities’ description was made by next-generation sequencing (i.e. Illumina MiSeq) of rrs gene. The results showed a significant influence of MAR practices on microbial communities. Growth, activities and diversity of groundwater micro-organisms were mainly stimulated by biodegradable dissolved organic carbon enrichment associated to MAR practices. Nonetheless, this impact was reduced in systems where the vadose zone is thick (> 10 m) and acts as a physical, chemical and biological filter between the infiltration basin and the aquifer. Low similarities between bacterial communities of infiltration waters and bacterial communities of groundwaters reveal that vadose zone is effective on the retention of bacteria in studied systems. To conclude, this thesis constitutes the first major study that aimed to quantify microbial compartment response to disturbances caused by MAR practices in urban area. It also opens new perspectives on assessment tool for groundwater quality
Books on the topic "Substrate transfert":
Hammer, Ronald E. Charge-transfer photodissociation of HCI and HI on a Ag(111) substrate. Ottawa: National Library of Canada, 1990.
Forneiro, Reyes Estévez. Substratum transfer in hiberno-english and code-switching in galaico-spanish. Dublin: University College Dublin, 1996.
Zhiming, Bao. The Systemic Nature of Substratum Transfer. Edited by Markku Filppula, Juhani Klemola, and Devyani Sharma. Oxford University Press, 2014. http://dx.doi.org/10.1093/oxfordhb/9780199777716.013.024.
Chanon, Michel, and Marye Anne Fox. Photoinduced Electron Transfer: Part C Photoinduced Electron Transfer Reactions : Organic Substrates (Photoinduced Electron Transfer). Elsevier Science Publishing Company, 1988.
Fox, Marye Anne. Photoinduced Electron Transfer Part D: Photoinduced Electron Transfer Reactions : Inorganic Substrates and Applications. Elsevier Science Ltd, 1988.
Uffmann, Christian. World Englishes and Phonological Theory. Edited by Markku Filppula, Juhani Klemola, and Devyani Sharma. Oxford University Press, 2015. http://dx.doi.org/10.1093/oxfordhb/9780199777716.013.32.
Wiltshire, Caroline R. Emergence of the Unmarked in Indian Englishes with Different Substrates. Edited by Markku Filppula, Juhani Klemola, and Devyani Sharma. Oxford University Press, 2014. http://dx.doi.org/10.1093/oxfordhb/9780199777716.013.007.
Book chapters on the topic "Substrate transfert":
Zhang, Q., C. Zheng, K. Sagoe-Crentsil, and W. Duan. "Transfer and Substrate Effects on 2D Materials for Their Sensing and Energy Applications in Civil Engineering." In Lecture Notes in Civil Engineering, 409–19. Singapore: Springer Nature Singapore, 2023. http://dx.doi.org/10.1007/978-981-99-3330-3_42.
Liu, Ai Qun. "Substrate Transfer Process." In RF MEMS Switches and Integrated Switching Circuits, 207–27. Boston, MA: Springer US, 2010. http://dx.doi.org/10.1007/978-0-387-46262-2_9.
Hussain, Aftab M. "Substrates, Transfer, and Bonding." In Introduction to Flexible Electronics, 134–52. Boca Raton: CRC Press, 2021. http://dx.doi.org/10.1201/9781003010715-12.
Kubyshkina, Veronika, Khellil Sefiane, Daniel Orejon, and Coinneach Mackenzie Dover. "Droplet Interplay on Microdecorated Substrates." In Advances in Heat Transfer and Thermal Engineering, 79–82. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_14.
Manokruang, Supasit, Frederic Vignat, Matthieu Museau, and Maxime Limousin. "Process Parameters Effect on Weld Beads Geometry Deposited by Wire and Arc Additive Manufacturing (WAAM)." In Lecture Notes in Mechanical Engineering, 9–14. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-70566-4_3.
Alvarez-Gonzalez, Rafael, Joel Moss, Claude Niedergang, and Felix R. Althaus. "In Vitro ADP-Ribosylation Utilizing 2′Deoxy-NAD+ as a Substrate." In ADP-Ribose Transfer Reactions, 53–56. New York, NY: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4615-8507-7_9.
Wang, Xin, Zeyu Liu, Li Wang, and Yuying Yan. "Investigation of Droplet Evaporation on Copper Substrate with Different Roughness." In Advances in Heat Transfer and Thermal Engineering, 225–28. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-33-4765-6_41.
Ui, Michio. "GTP-binding Proteins, Substrates of Pertussis Toxin-Catalyzed ADP-Ribosylation, as Mediators of Receptor-Coupled Signal Transduction." In ADP-Ribose Transfer Reactions, 414–21. New York, NY: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4615-8507-7_79.
Knoll, Wolfgang, Natascha Bunjes, Morgan Denyer, Claudia Heibel, Mieko Matsuzawa, Renate Naumann, Andreas Offenhäusser, et al. "Preparation, Structural Characterization and Functional Coupling of Tethered Membranes to Solid Substrates." In Biophysics of Electron Transfer and Molecular Bioelectronics, 67–89. Boston, MA: Springer US, 1998. http://dx.doi.org/10.1007/978-1-4757-9516-5_4.
Poulter, C. Dale. "Mechanistic Studies of the Prenyl Transfer Reaction with Fluorinated Substrate Analogs." In ACS Symposium Series, 158–68. Washington, DC: American Chemical Society, 1996. http://dx.doi.org/10.1021/bk-1996-0639.ch012.
Conference papers on the topic "Substrate transfert":
Wei, G., H. Zhang, L. Li, and X. Y. Wang. "Numerical and Experimental Studies of Substrate Melting During Thermal Spraying." In ASME 2003 Heat Transfer Summer Conference. ASMEDC, 2003. http://dx.doi.org/10.1115/ht2003-47154.
Kwok, King Hong, and Wilson K. S. Chiu. "Laser-Induced Chemical Vapor Deposition on Moving Glass Rods." In ASME 2003 Heat Transfer Summer Conference. ASMEDC, 2003. http://dx.doi.org/10.1115/ht2003-47446.
Dhiman, Rajeev, and Sanjeev Chandra. "Effect of Substrate Temperature on Splashing of Molten Metal Droplets." In ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/ht-fed2004-56096.
Chung, Jaewon, Seunghwan Ko, Costas P. Grigoropoulos, Nicole R. Bieri, Cedric Dockendorf, and Dimos Poulikakos. "Microconductors on Polymer by Nanoink Printing and Pulsed Laser Curing." In ASME 2004 Heat Transfer/Fluids Engineering Summer Conference. ASMEDC, 2004. http://dx.doi.org/10.1115/ht-fed2004-56702.
Rao, P. Sharath C., and Muhammad M. Rahman. "Analysis of Steady State Conjugate Heat Transfer in a Circular Microtube Inside a Substrate." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-59921.
Li, De-Jun, Murat U. Guruz, and Yip-Wah Chung. "Ultrathin CNx Overcoats for 1 Tb/in2 Hard Disk Drive Systems." In STLE/ASME 2001 International Joint Tribology Conference. American Society of Mechanical Engineers, 2001. http://dx.doi.org/10.1115/trib-nano2001-108.
Yi-Yan, A., W. K. Chan, T. J. Gmitter, and M. Seto. "Semiconductor-grafted integrated optics." In Integrated Photonics Research. Washington, D.C.: Optica Publishing Group, 1990. http://dx.doi.org/10.1364/ipr.1990.mi1.
Al-okaily, Ala’a, and Placid Ferreira. "Characterization of Delamination in Laser Micro Transfer Printing." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-64668.
Jiang, X. Y., Y. P. Wan, X. Y. Wang, H. Zhang, R. Goswami, H. Herman, and S. Sampath. "Investigation of Splat/Substrate Contact During Molybdenum Thermal Spraying." In ITSC 2000, edited by Christopher C. Berndt. ASM International, 2000. http://dx.doi.org/10.31399/asm.cp.itsc2000p0729.
Lu, Gui, Yuan-Yuan Duan, and Xiao-Dong Wang. "Effects of Free Surface Evaporation on Water Nano-Droplet Wetting Kinetics: A Molecular Dynamics Study." In ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/mnhmt2013-22108.
Reports on the topic "Substrate transfert":
Elbaum, Michael, and Peter J. Christie. Type IV Secretion System of Agrobacterium tumefaciens: Components and Structures. United States Department of Agriculture, March 2013. http://dx.doi.org/10.32747/2013.7699848.bard.
Alexandrov, Boian. PR-650-174516-R01 Corrosion Resistant Weld Overlays for Pipeline Installations. Chantilly, Virginia: Pipeline Research Council International, Inc. (PRCI), June 2021. http://dx.doi.org/10.55274/r0012108.
Prasad, Kuldeep R., and Dale P. Bentz. Thermal performance of fire resistive materials II. A multi-layer one-dimensional heat transfer model for fire resistive materials protecting a substrate. Gaithersburg, MD: National Institute of Standards and Technology, 2008. http://dx.doi.org/10.6028/nist.ir.7482.
Glass, R., and L. Hendler. Defect Recognition In Regularly Patterned Substrates Using Optical Fourier Transform Techniques Final Report CRADA No. TSB-1164-95. Office of Scientific and Technical Information (OSTI), March 2018. http://dx.doi.org/10.2172/1430944.
Glass, R. Defect Recognition In Regularly Patterned Substrates Using Optical Fourier Transform Techniques Final Report CRADA No. TSB-1164-95. Office of Scientific and Technical Information (OSTI), December 1996. http://dx.doi.org/10.2172/759917.
Kurek, Harry, and John Wagner. Development and Demonstration of a High Efficiency, Rapid Heating, Low NOx Alternative to Conventional Heating of Round Steel Shapes, Steel Substrate (Strip) and Coil Box Transfer Bars. Office of Scientific and Technical Information (OSTI), January 2010. http://dx.doi.org/10.2172/970839.
Sessa, Guido, and Gregory Martin. MAP kinase cascades activated by SlMAPKKKε and their involvement in tomato resistance to bacterial pathogens. United States Department of Agriculture, January 2012. http://dx.doi.org/10.32747/2012.7699834.bard.
Irudayaraj, Joseph, Ze'ev Schmilovitch, Amos Mizrach, Giora Kritzman, and Chitrita DebRoy. Rapid detection of food borne pathogens and non-pathogens in fresh produce using FT-IRS and raman spectroscopy. United States Department of Agriculture, October 2004. http://dx.doi.org/10.32747/2004.7587221.bard.
Dick, Warren, Yona Chen, and Maurice Watson. Improving nutrient availability in alkaline coal combustion by-products amended with composted animal manures. United States Department of Agriculture, 2002. http://dx.doi.org/10.32747/2002.7587240.bard.
Dick, Warren, Yona Chen, and Maurice Watson. Improving nutrient availability in alkaline coal combustion by-products amended with composted animal manures. United States Department of Agriculture, December 2006. http://dx.doi.org/10.32747/2006.7695883.bard.