Relevant bibliographies by topics / Submicron grain

Academic literature on the topic 'Submicron grain'

Author: Grafiati
Published: 4 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Submicron grain"

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Jain, M., and T. Christman. "Processing of submicron grain 304 stainless steel." Journal of Materials Research 11, no. 11 (November 1996): 2677–80. http://dx.doi.org/10.1557/jmr.1996.0336.

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A novel thermomechanical processing technique for the synthesis of bulk submicron grain (grain size ≈200 nm) 304 stainless steel is reported. This ingot-metallurgical technique requires a total deformation of only 95%, and the key steps to this processing technique involve (i) formation of ultrafine dislocation cell structure, and (ii) the conversion of dislocation cells into grains with medium to high misorientation by grain boundary sliding.
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Asabe, Takuma, Muhammad Rifai, Motohiro Yuasa, and Hiroyuki Miyamoto. "Effect of Grain Size on the Stress Corrosion Cracking of Ultrafine Grained Cu-10 wt% Zn Alloy in Ammonia." International Journal of Corrosion 2017 (2017): 1–8. http://dx.doi.org/10.1155/2017/2893276.

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The effect of grain size in the micron to submicron range on the stress corrosion cracking (SCC) of Cu-10 wt% Zn alloys was investigated using constant-load tests in ammonia vapor. The grain size was systematically varied from 4 μm to 0.12 μm by either cold-rolling or equal-channel angular pressing (ECAP), followed by annealing. The time to fracture increased with decreasing grain size above 1 μm but then began to decrease with decreasing grain size into the submicron range. This inverse trend in the submicron range is discussed in terms of a severe plastic deformation- (SPD-) induced ultrafine grain microstructure.
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Sima, M., L. Ion, S. Antohe, and E. Vasile. "Submicron wires with nanosized grain structure." Superlattices and Microstructures 46, no. 6 (December 2009): 833–39. http://dx.doi.org/10.1016/j.spmi.2009.09.010.

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Samajdar, I., L. Rabet, B. Verlinden, and P. Van Houtte. "An Investigation on Grain Growth in a Commercial Al–Mg Alloy." Textures and Microstructures 30, no. 3-4 (January 1, 1998): 191–206. http://dx.doi.org/10.1155/tsm.30.191.

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Alloy AA5182 contains coarse constituent particles and submicron dispersoids. While the former may cause particle stimulated nucleation (PSN) during primary recrystallization, the fine dispersoids may ‘arrest’ grain growth during subsequent annealing. Abnormal grain growth was observed after dissolution/coarsening of the dispersoids. Mainly S [{123}〈634〉] grains, but also some Brass [{011}〈112〉] and Cu [{112}〈111〉] grains, were observed to grow abnormally. Both the grain size and the grain boundary character distribution (GBCD) possibly played a role in the selection of the grains for abnormal grain growth. A dramatic increase in the number fraction of extremely low angle (1−5°) boundaries was observed with annealing, the increase being more at 470°C (when dispersoids were stable and grain growth was arrested more effectively) than at 500°C/530°C (when inhibition to grain growth was less). The nature of the CSL boundaries did not change significantly with annealing time/temperature.
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Alateyah, A. I., Mohamed M. Z. Ahmed, Yasser Zedan, H. Abd El-Hafez, Majed O. Alawad, and W. H. El-Garaihy. "Experimental and Numerical Investigation of the ECAP Processed Copper: Microstructural Evolution, Crystallographic Texture and Hardness Homogeneity." Metals 11, no. 4 (April 9, 2021): 607. http://dx.doi.org/10.3390/met11040607.

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The current study presents a detailed investigation for the equal channel angular pressing of pure copper through two regimes. The first was equal channel angular pressing (ECAP) processing at room temperature and the second was ECAP processing at 200 °C for up to 4-passes of route Bc. The grain structure and texture was investigated using electron back scattering diffraction (EBSD) across the whole sample cross-section and also the hardness and the tensile properties. The microstructure obtained after 1-pass at room temperature revealed finer equiaxed grains of about 3.89 µm down to submicrons with a high density of twin compared to the starting material. Additionally, a notable increase in the low angle grain boundaries (LAGBs) density was observed. This microstructure was found to be homogenous through the sample cross section. Further straining up to 2-passes showed a significant reduction of the average grain size to 2.97 µm with observable heterogeneous distribution of grains size. On the other hand, increasing the strain up to 4-passes enhanced the homogeneity of grain size distribution. The texture after 4-passes resembled the simple shear texture with about 7 times random. Conducting the ECAP processing at 200 °C resulted in a severely deformed microstructure with the highest fraction of submicron grains and high density of substructures was also observed. ECAP processing through 4-passes at room temperature experienced a significant increase in both hardness and tensile strength up to 180% and 124%, respectively.
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Mayes, C. D., G. J. Tatlock, and D. G. McCartney. "Characterization of submicron particles in Al5Ti1B grain refining master alloys." Proceedings, annual meeting, Electron Microscopy Society of America 48, no. 4 (August 1990): 962–63. http://dx.doi.org/10.1017/s0424820100177945.

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Al5%Ti1%B master alloys are frequently used in the grain refinement of aluminium alloys to induce heterogeneous nucleation during solidification and to promote an equiaxed grain structure. Boride particles are often observed in these alloys and could act as nucleation sites. However there are many more particles than nucleated grains in the samples and hence the precise role of the borides and other particles is not clear. We have therefore been undertaking a systematic TEM study of submicron particles extracted from master alloys using carbon extraction replication of fractured samples, with a view to investigating the nucleation mechanisms.Many of the particles analysed adopted a well defined hexagonal prism morphology (Fig.1) and varied in size from 5μm to 100 nm across the hexagonal face. A combination of EDX and EELS analysis plus electron diffraction was used to identify isolated particles as TiB2 containing little if any aluminium or potassium. These other elements are often detected in agglomerations of particles.
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Zhao, Zhong Min, Long Zhang, Yi Gang Song, and Wei Guo Wang. "Microstructures, Properties and In Situ Toughening of Rapidly Solidified Al2O3/YSZ Composite Ceramics Prepared by Combustion Synthesis." Key Engineering Materials 368-372 (February 2008): 771–74. http://dx.doi.org/10.4028/www.scientific.net/kem.368-372.771.

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The large-scale Al2O3/YSZ ceramic plates were prepared by combustion synthesis under high gravity, the ceramics were mainly composed of random-oriented rod-shaped grains, and within the rod-shaped grain aligned nano-submicron YSZ fibers were embedded. Compared to the high-performance directionally solidified ceramics, the hardness, flexural strength and fracture toughness of the eutectic ceramics obtained in the experiment increased by 40.7~55.1%, 9.6~26.0% and 172.0~240.0%, respectively. The increase in hardness and strength of the ceramics could be attributed to nano-submicron YSZ fibers and inter-phase spacing and the refinement of the eutectic grains; meanwhile, high-energy, large-angle boundaries between rod-shaped grains could introduce strong toughening mechanisms involving crack-bridging and pull-out of rod-shaped eutectics.
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Ferry, Michael. "Uniformity of Grain Coarsening in Submicron Grained Al-Sc Alloy Containing Local Variations in Texture." Materials Science Forum 495-497 (September 2005): 609–14. http://dx.doi.org/10.4028/www.scientific.net/msf.495-497.609.

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The effect of fine particles on the uniformity of grain coarsening in a submicron grained Al-Sc alloy containing significant local variations in texture has been investigated using high resolution EBSD. The alloy was processed by severe plastic deformation and low temperature ageing to generate a fine-grained (0.8 µm diameter) microstructure containing either a dispersion of nanosized Al3Sc particles or a particle-free matrix. The initial processing generated a uniform grain size distribution, but the distribution of grain orientations was inhomogeneous with the microstructure containing colonies of grains consisting predominantly of either HAGBs or LAGBs with the latter possessing orientation gradients of up to 10 o/µm. Despite the marked differences in boundary character between these regions, the alloy undergoes slow and uniform grain coarsening during annealing at temperatures up to 500 oC with no marked change in the grain size distribution, boundary distribution and texture. A model of grain coarsening that takes into account the influence of fine particles on the kinetics of grain growth within an orientation gradient is outlined. The model predicts that a large volume fraction of fine particles (large f/r-value) tends to homogenize the overall rate of grain coarsening despite the presence of orientation gradients in the microstructure.
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Bohn, R., G. Fanta, T. Klassen, and R. Bormann. "Submicron-grained multiphase TiAlSi alloys: Processing, characterization, and microstructural design." Journal of Materials Research 16, no. 6 (June 2001): 1850–61. http://dx.doi.org/10.1557/jmr.2001.0254.

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Prealloyed powders of the intermetallic γ–TiAl phase and the ceramic Ξ–Ti5Si3 phase were high-energy milled and hot-isostatically pressed (HIP) to produce silicide dispersed composite materials with grain sizes in the submicron and nanometer range. The amorphous state of the as-milled powders crystallizes via a multistep decomposition reaction during degassing at 440 °C and HIP. At a pressure of 200 Mpa HIP-temperatures as low as 750 °C are sufficient for a complete densification of the milled powder. The microstructure of the compacts is very homogeneous and consists of equiaxed γ–TiAl crystals and Ξ–Ti5(Si,Al)3 particles. Depending on the silicon content, these particles are interspersed within the grain boundary network of the γ–TiAl phase or dispersed inside the γ grains. With respect to technical applications, submicron-grained composites are regarded as promising precursor materials that should allow for easy hot working in the as-prepared state as well as for high-temperature structural applications after a suitable transformation of the microstructure.
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PIRGAZI, HADI, and ABBAS AKBARZADEH. "CHARACTERIZATION OF NANOSTRUCTURED ALUMINUM SHEETS PROCESSED BY ACCUMULATIVE ROLL BONDING." International Journal of Modern Physics B 22, no. 18n19 (July 30, 2008): 2840–47. http://dx.doi.org/10.1142/s0217979208047663.

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An ultrafine grained (UFG) aluminum sheet was produced using severe plastic deformation (SPD) by a process known as accumulative roll bonding (ARB). Electron Back Scattered Diffraction (EBSD) method and Transmission Electron Microscopy (TEM) were utilized for characterization of the subgrain and grain structures of the processed sheets. The results indicate that different mechanisms at different levels of strain lead to the gradual evolution of ultrafine or nanocrystalline grains. Grain fragmentation as well as the development of subgrains are the major mechanisms at the early stages of ARB. Strain induced transformation of low angle to high angle grain boundaries and formation of a thin lamellar structure occur at the medium level of strain. Finally, the progressive fragmentation of these thin lamellar structures into more equi-axed grains is the dominant mechanism at relatively high strains which results in grain size reduction to submicron scale.
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Dissertations / Theses on the topic "Submicron grain"

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Bommareddy, Aravinda Reddy Materials Science &amp Engineering Faculty of Science UNSW. "Thermal stability of submicron grain structure in an Al-Sc alloy." Publisher:University of New South Wales. Materials Science & Engineering, 2008. http://handle.unsw.edu.au/1959.4/41492.

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Severe plastic deformation (SPD) has been used over the past few decades for producing submicron grain (SMG) structures in range of metals and alloys. Equal channel angular pressing (ECAP) is a useful process for producing these types of structures whereby the material is deformed to very high plastic strains by passing a billet several times through the ECAP die. This process has an added advantage maintaining the initial dimensions of the billet. SMG materials produced by ECAP and related routes are useful as they usually exhibit excellent properties including high strength and hardness, and excellent superplastic formability: these and other properties make SMG materials useful for industrial and aerospace applications. In this thesis, a binary aluminium alloy containing a very low concentration of scandium (0.1 wt. %) Sc alloy was investigated and compared with higher Sc-containing alloys. The material was deformed by ECAP in the solution treated condition to an equivalent von Mises strain of 9.2 then pre-aged at 250 0C to generate a submicron grained material containing a relatively uniform dispersion of nanosized Al3Sc dispersiods. The thermal stability of this pre-aged microstructure was investigated by annealing at temperatures up to 450 0C resulted in continuous grain coarsening by the process of continuous recrystallization whereby the initial microstructure evolves gradually with no marked change in the grain size distribution, texture and grain boundary character. However, extended annealing (> 1h) at 4500 C resulted in discontinuous grain coarsening (often termed recrystallization) whereby a few grains grow rapidly to eventually produce a coarse-grained final microstructure. Throughout annealing, there was a good correlation between the dispersion parameter, (f/d) where f and d is the volume fraction and the mean diameter of Al3Sc particles in the alloy, respectively, and both the mean grain size (D ) and D /D max where max D is the maximum grain diameter observed in the microstructure. The grain structure was found to undergo moderate coarsening at the high f/d-values but converted to a coarsegrained structure for f/d ~<0.5/μm, and this change occurred when the mean grain diameter was ~ 3-4μm. Hence, the critical value of the dispersion parameter for the transition from continuous to discontinuous coarsening falls between the theoretical value for submicron grain size alloys (f/d ~ 1.5/μm) and the value found for conventionally-deformed alloys (f/d ~ 0.1/μm). This behaviour is the result of the alloy no longer being ultra-fine grained at the onset of discontinuous coarsening.
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Walker, Philip Martin. "Discrete grain boundary effects in submicron polysilicon thin film transistors." Thesis, University of Cambridge, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.615309.

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Book chapters on the topic "Submicron grain"

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Prangnell, P. B., and J. R. Bowen. "Mechanisms of Formation of Submicron Grain Structures During Severe Deformation." In Ultrafine Grained Materials II, 89–98. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2013. http://dx.doi.org/10.1002/9781118804537.ch11.

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Prangnell, Philip B., Yan Huang, M. Berta, and P. J. Apps. "Mechanisms of Formation of Submicron Grain Structures by Severe Deformation." In Materials Science Forum, 159–68. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-434-0.159.

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Ferry, M. "Uniformity of Grain Coarsening in Submicron Grained Al-Sc Alloy Containing Local Variations in Texture." In Materials Science Forum, 609–14. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-975-x.609.

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Sarnelli, E., G. Testa, A. Monaco, M. Adamo, and D. Perez de Lara. "Employment of Submicron YBA2CU3O7-x Grain Boundary Junctions for the Fabrication of “ Quiet” Superconducting Flux-Qubits." In Decoherence, Entanglement and Information Protection in Complex Quantum Systems, 623–33. Dordrecht: Springer Netherlands, 2005. http://dx.doi.org/10.1007/1-4020-3283-8_45.

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Ferry, M. "Spatial Uniformity of the Rate of Grain Coarsening in a Submicron Al-Sc Alloy Produced by Severe Plastic Deformation." In Materials Science Forum, 251–58. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-985-7.251.

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Conference papers on the topic "Submicron grain"

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MARX, A., T. KEMEN, L. ALFF, R. GROSS, and F. HERBSTRITT. "DYNAMICS OF INDIVIDUAL TRAPS IN SUBMICRON HIGH-TEMPERATURE SUPERCONDUCTOR GRAIN BOUNDARY JUNCTIONS." In Proceedings of the 16th International Conference. WORLD SCIENTIFIC, 2001. http://dx.doi.org/10.1142/9789812811165_0010.

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Bouchey, Stephanie N. Q., and Jeromy T. Hollenshead. "Mesoscale modeling and debris generation in hypervelocity impacts." In 2019 15th Hypervelocity Impact Symposium. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/hvis2019-017.

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Abstract Material fragmentation after a hypervelocity impact is of interest to predictive electro-optical and infrared (EO/IR) modeling. Successful comparisons with data require that submicron fragments are generated in such impacts; however, experimental data has so far been unable to produce fragments of this scale [e.g., 1-3]. This effort investigated the generation of predicted debris from hypervelocity impact of a sphere on a flat, semi-infinite plate. It is hypothesized that explicit modeling of grains, especially in the presence of void and varying grain properties, may lead to differences in predicted strain rates (locally higher) associated with the grain boundaries. Such an effect may lead to smaller predicted fragments sizes than when using the traditional bulk modeling approach and may provide improved understanding of fragmentation modeling in hypervelocity impacts. Comparisons of predicted strain rates at failure (a proxy for fragment size) and material temperature were made between simulations run using a bulk modeling approach and a mesoscale grain modeling approach.
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Chan, Mansun, Hongmei Wang, and Singh Jagar. "Performance of Submicron Large-Grain Polysilicon-on-Insulator (LPSOI) MOSFETs Formed by Crystallization of Amorphous Silicon." In 2000 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2000. http://dx.doi.org/10.7567/ssdm.2000.le-2-2.

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Ammouri, A. H., A. H. Kheireddine, G. T. Kridli, and R. F. Hamade. "FEM Optimization of Process Parameters and In-Process Cooling in the Friction Stir Processing of Magnesium Alloy AZ31b." In ASME 2013 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/imece2013-62468.

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Controlling the temperature in friction stir processing (FSP) of Magnesium alloy AZ31b is crucial given its low melting point and surface deformability. A numerical FEM study is presented in this paper where a thermo-mechanical-based model is used for optimizing the process parameters, including active in-process cooling, in FSP. This model is simulated using a solid mechanics FEM solver capable of analyzing the three dimensional flow and of estimating the state variables associated with materials processing. Such processing (input) parameters of the FSP as spindle rotational speed, travel speed, and cooling rate are optimized to minimize the heat affected zone, while maintaining reasonable travel speeds and producing uniformity of the desired grain size distribution of the microstructure in the stirred zone. The simulation results predict that such optimized parameters will result in submicron grain sized structure in the stirred zone and at the corresponding stirred surface. These simulation predictions were verified using published experimental data.
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Tsukrov, I., W. M. Grich, and T. S. Gross. "Analysis of diffusional stress relaxation in submicron Cu interconnect structures using the model with enhanced vacancy diffusivity in grain boundary region." In HIGH PERFORMANCE STRUCTURES AND MATERIALS 2006. Southampton, UK: WIT Press, 2006. http://dx.doi.org/10.2495/hpsm06067.

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Tamura, N., B. C. Valek, A. A. MacDowell, R. S. Celestre, H. A. Padmore, R. Spolenak, and J. R. Patel. "Scanning X-Ray Microdiffraction for Materials Science at the Advanced Light Source." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-62456.

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With the advent of high brilliance synchrotron sources and outstanding progress made in X-ray focusing optics, intense sub-micron X-ray beams are now routinely produced at several synchrotron facilities around the world. At the Advances Light Source, a dedicated Scanning X-ray Microdiffraction beamline using either white or monochromatic X-ray focused beam has been developed and is used for mapping grain orientation, strain/stress or crystalline species distribution in various samples with micron to submicron spatial resolution. It also allows for the study of local plasticity as well as for the characterization or identification of new crystalline structures. The facility and its capabilities are described through the study of the electromigration phenomenon in Al(Cu) and Cu interconnect test structures.
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Zaharia, Luchian, Radu Comaneci, Constantin Baciu, and Nicanor Cimpoesu. "The Evaluation of Strain, Microstructural Aspects and Some Mechanical Properties of Nano-Grained Aluminum Processed by Accumulative Roll Bonding Using 2, 3 and 4 Initial Strips." In ASME 2008 9th Biennial Conference on Engineering Systems Design and Analysis. ASMEDC, 2008. http://dx.doi.org/10.1115/esda2008-59234.

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The main objective of the paper is to present the refinement of grains when aluminum strips are exposed to Severe Plastic Deformation (SPD) by Accumulative Roll-Bonding (ARB). Also, the relationship between nano-grain size and the increase of some mechanical characteristics (yield stress, tensile strength) is investigated. The work presents a theoretical analysis of ARB process taking into account the effect of the initial number of strips stacked before rolling on the strain evolution. We proposed the ARB process analysis when the number of strips initially stacked is 2, 3 and 4 and the initial thickness of each strip before rolling is equal with the thickness of the laminated strip, so the thickness of initial strip is a multiple of thickness resulting from rolling. It is obvious that in the case of rolling with a multilayer initial stacked, each layer will be deformed with a bigger strain, so the bond will be realised easier, at lower working temperature and the grain refinement will be achieved by a smaller number of passes. For each case (2, 3 and 4 initial layers) the engineer and equivalent (von Mises) strain are calculated. From this analysis results that increasing the number of strips initially stacked increases the total strain and the grain size from the laminated strip achieve submicronic values after a smaller pass number. The micro-structural investigations, made with Atomic Force Microscope (AFM), show that nanometric grain appear at 5–6 equivalent strain for 2 initial stacked strips and at 3–4 equivalent strain for 4 initial stacked strips. The stress – strain curves for each case and evolution of yield stress, tensile strength and micro-hardness with the number of passes are presented.
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Reports on the topic "Submicron grain"

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Patel, Jamshed R. High Spatial Resolution Grain Orientation and Strain Mapping in Thin Films using Polychromatic Submicron X-ray Diffraction. Office of Scientific and Technical Information (OSTI), June 2002. http://dx.doi.org/10.2172/799101.

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