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Journal articles on the topic 'STED lithography'

To see the other types of publications on this topic, follow the link: STED lithography.

Author: Grafiati

Published: 10 December 2022

Last updated: 29 January 2023

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1

Lee, Won-Sup, Hyunmin Cho, and Won-Seok Chang. "Analytical Description of Digital Mask Based STED Lithography." Journal of the Korean Society for Precision Engineering 39, no. 11 (November 30, 2022): 863–68. http://dx.doi.org/10.7736/jkspe.022.072.

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2

Klar, Thomas A., Richard Wollhofen, and Jaroslaw Jacak. "Sub-Abbe resolution: from STED microscopy to STED lithography." Physica Scripta T162 (September 1, 2014): 014049. http://dx.doi.org/10.1088/0031-8949/2014/t162/014049.

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3

Klar, Thomas A., Richard Wollhofen, Johannes Kreutzer, Bianca Buchegger, Christine Eder, and Jaroslaw Jacak. "Sub-Diffraction STED Lithography using Orthogonally Functionalized Resins." Biophysical Journal 112, no. 3 (February 2017): 157a. http://dx.doi.org/10.1016/j.bpj.2016.11.864.

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4

Puthukodan, Sujitha, Eljesa Murtezi, Jaroslaw Jacak, and Thomas A. Klar. "Localization STED (LocSTED) microscopy with 15 nm resolution." Nanophotonics 9, no. 4 (February 28, 2020): 783–92. http://dx.doi.org/10.1515/nanoph-2019-0398.

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AbstractWe present localization with stimulated emission depletion (LocSTED) microscopy, a combination of STED and single-molecule localization microscopy (SMLM). We use the simplest form of a STED microscope that is cost effective and synchronization free, comprising continuous wave (CW) lasers for both excitation and depletion. By utilizing the reversible blinking of fluorophores, single molecules of Alexa 555 are localized down to ~5 nm. Imaging fluorescently labeled proteins attached to nanoanchors structured by STED lithography shows that LocSTED microscopy can resolve molecules with a resolution of at least 15 nm, substantially improving the classical resolution of a CW STED microscope of about 60 nm. LocSTED microscopy also allows estimating the total number of proteins attached on a single nanoanchor.

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5

Müller, Patrick, Rouven Müller, Larissa Hammer, Christopher Barner-Kowollik, Martin Wegener, and Eva Blasco. "STED-Inspired Laser Lithography Based on Photoswitchable Spirothiopyran Moieties." Chemistry of Materials 31, no. 6 (January 15, 2019): 1966–72. http://dx.doi.org/10.1021/acs.chemmater.8b04696.

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6

Glubokov, D. A., V. V. Sychev, Alexey G. Vitukhnovsky, and A. E. Korol'kov. "Photonic crystal fibre-based light source for STED lithography." Quantum Electronics 43, no. 6 (June 30, 2013): 588–90. http://dx.doi.org/10.1070/qe2013v043n06abeh015059.

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7

Wiesbauer, Moritz, Richard Wollhofen, Borislav Vasic, Kurt Schilcher, Jaroslaw Jacak, and Thomas A. Klar. "Nano-Anchors with Single Protein Capacity Produced with STED Lithography." Nano Letters 13, no. 11 (October 16, 2013): 5672–78. http://dx.doi.org/10.1021/nl4033523.

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8

Wollhofen, Richard, Julia Katzmann, Calin Hrelescu, Jaroslaw Jacak, and Thomas A. Klar. "120 nm resolution and 55 nm structure size in STED-lithography." Optics Express 21, no. 9 (April 25, 2013): 10831. http://dx.doi.org/10.1364/oe.21.010831.

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9

Kaschke, Johannes, and Martin Wegener. "Gold triple-helix mid-infrared metamaterial by STED-inspired laser lithography." Optics Letters 40, no. 17 (August 20, 2015): 3986. http://dx.doi.org/10.1364/ol.40.003986.

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10

Витухновский, А. Г., Р. Д. Звагельский, Д. А. Колымагин, А. В. Писаренко, and Д. А. Чубич. "Двухволновая лазерная стереолитография для создания ИК сенсоров для поверхностно-усиленной спектроскопии-=SUP=-*-=/SUP=-." Журнал технической физики 126, no. 1 (2019): 63. http://dx.doi.org/10.21883/os.2019.01.47055.271-18.

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AbstractThe results of applying two-photon femtosecond laser photopolymerization for fabrication of structures for sensitive IR sensors are reported. Two methods of sensor fabrication, a two-wave laser stereolithography and an electron-beam lithography, are compared. The possibility of applying the obtained structures for investigation of the effect of surface-enhanced IR absorption (SEIRA) with a STED-compatible oligomer pentaerythritol tetraacrylate (PETTA) as an analytical layer is demonstrated.

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11

Elmeranta, Marjukka, Giuseppe Vicidomini, Martí Duocastella, Alberto Diaspro, and Gustavo de Miguel. "Characterization of nanostructures fabricated with two-beam DLW lithography using STED microscopy." Optical Materials Express 6, no. 10 (September 19, 2016): 3169. http://dx.doi.org/10.1364/ome.6.003169.

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12

Yuan, Chenyu, Jukun Liu, Tianqing Jia, Kan Zhou, Hongxin Zhang, Jia Pan, Donghai Feng, and Zhenrong Sun. "Super resolution direct laser writing in ITX resist inspired by STED microscopy." Journal of Nonlinear Optical Physics & Materials 23, no. 02 (June 2014): 1450015. http://dx.doi.org/10.1142/s0218863514500155.

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Direct laser writing (DLW) has become a routine tool for fabricating microstructures through two photon polymerization. Due to the diffraction limit, the resolution is usually larger than a quarter of a wavelength. In this article, by using stimulated emission depletion (STED) inspired lithography, we fabricate nanodot of 81 nm in diameter and nanoline of 93 nm in width in resist with initiator of isopropyl thioxanthone (ITX). An 800 nm, 75-MHz fs laser works as the polymerization light and a 532 nm donut mode continuous wave (CW) laser as the depletion light. This technology is potentially useful for fabrication of super resolution nanostructures.

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13

Liu, Fan, Guo Dong Gu, Chun Hong Zeng, Hai Jun Li, Wei Wang, Bao Shun Zhang, and Jin She Yuan. "Fabrication of 50nm T-Gate on GaN Substrate." Advanced Materials Research 482-484 (February 2012): 2341–44. http://dx.doi.org/10.4028/www.scientific.net/amr.482-484.2341.

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This paper reports New advances in e-beam lithography which have made possible the fabrication of high electron mobility transistors (HEMT) on GaN substrate with gate length well in the nanometer regime. Using PMMA/PMMA-MMA Pseudo-bilayer resists technology with electron beam lithography preparation 50nm gate length T-gate. A method of in a single lithographic step and a development step, which can be applied to simplify the process and get a more narrow gate. The ratio of head to footprint of the T gate is controllable. The way meets the need of the device fabrication.

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14

Fang, Bin, Jiafeng Feng, Hongxiang Wei, Xiufeng Han, Baoshun Zhang, and Zhongming Zeng. "Fabrication of Spin-Transfer Nano-Oscillator by Colloidal Lithography." Journal of Nanomaterials 2015 (2015): 1–6. http://dx.doi.org/10.1155/2015/973957.

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We fabricate nanoscale spin-transfer oscillators (STOs) by utilizing colloidal nanoparticles as a lithographic mask. By this approach, high quality STO devices can be fabricated, and as an example the fabricated STO devices using MgO magnetic tunnel junction as the basic cell exhibit current-induced microwave emission with a large frequency tunability of 0.22 GHz/mA. Compared to the conventional approaches that involve a step of defining nanoscale elements by means of electron beam lithography, which is not readily available for many groups, our strategy for STO fabrication does not require the sophisticated equipment (~ million dollars per unit) and expensive lithography resist, while being cost-effective and easy to use in laboratory level. This will accelerate efforts to implement STO into on-chip integrated high-radio frequency applications.

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15

Shamsuddin, Liyana, Khairudin Mohamed, and Alsadat Rad Maryam. "The Investigation of Microstructures Fabrication on Quartz Substrate Employing Electron Beam Lithography (EBL) and ICP-RIE Process." Advanced Materials Research 980 (June 2014): 69–73. http://dx.doi.org/10.4028/www.scientific.net/amr.980.69.

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The fabrication of micro or nano-structures on quartz substrate has attracted researchers' attention and interests in recent years due to a wide range of potential applications such as NEMS/MEMS, sensors and biomedical engineering. Various types of next generation lithographic methods have been explored since optical lithography physical limitations has hindered the fabrication of high aspects ratio (HAR) structure on quartz substrates. In this research, the top-down fabrication approach was employed to fabricate microstructures on quartz substrate using Electron Beam Lithography (EBL) system, followed by the pattern transfer process using Inductively Coupled Plasma-Reactive Ion Etching (ICP-RIE) technique. The factors that influenced pattern definition include the type of electron beam (e-beam) photoresist, e-beam exposure parameter such as spot size, working distance, write field, step size, e-beam current, dosage as well as the type of developer and its developing time. The optimum conditions were investigated in achieving micro or nano-structures. Field emission scanning electron microscopy (FESEM) with energy-dispersive X-ray (EDX) and atomic force microscope (AFM) were utilized to characterize the structures profiles.

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16

Liu Jiahong, 刘佳红, 张方 Zhang Fang, and 黄惠杰 Huang Huijie. "步进扫描投影光刻机照明系统技术研究进展." Laser & Optoelectronics Progress 59, no. 9 (2022): 0922011. http://dx.doi.org/10.3788/lop202259.0922011.

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17

Fan, Xi Qiu. "Nanoimprint Lithography: A Promising Candidate for Next-Generation Lithography." Advanced Materials Research 139-141 (October 2010): 1558–61. http://dx.doi.org/10.4028/www.scientific.net/amr.139-141.1558.

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Due to its inherent simplicity and low cost, the popularity of nanoimprint lithography is rising, and is positioned to succeed EUV as the most popular choice for next-generation lithography. This paper presents a homemade nanoimprint lithography prototype tool with a high precision alignment system, which adopts both macro and micro actuators to achieve coarse and fine alignment. Linear motors with 300 mm travel range and 0.1 µm step resolution, and piezoelectric translators with 50 µm travel range and 0.1 nm step resolution are used as macro and micro actuators, respectively. Imprint of 80nm width gratings with a 250 nm pitch is taken as an example to depict the process of NIL. High resolution and fine fidelity of the imprinted results demonstrate NIL’s promising candidate for next-generation lithography, and potential applications in manufacturing integrated circuits, optical, chemical, and biological nanostructures or micro-devices.

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18

Lee, Jae Jong, Seung Woo Lee, Hyun Taek Cho, Gee Hong Kim, and Kee Bong Choi. "Single-Step UV Nanoimprinting Lithography with Multi-Head Imprinting System and Its Applications." Key Engineering Materials 326-328 (December 2006): 441–44. http://dx.doi.org/10.4028/www.scientific.net/kem.326-328.441.

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The contact-based nanoimprinting lithography (NIL), such as thermal and/or UV nano-imprint, has been well known as one of the next generation lithography alternatives. Especially, the UV nanoimprinting lithography technology has the advantages in terms of process simplicity, low cost, high replication fidelity, and relatively high throughput. The UV nanoimprinting lithography tool is built with the characteristic functions like a self-alignment wafer stage, a nanoimprinting head unit, an alignment system for multi-layer process, stamp/wafer chucking units, releasing unit, and anti-vibration unit, etc. This UV-NIL tool is comprised of UV light source using mercury lamp, ultra-fine XY stage with nano-level positioning accuracy, and self-adjusting flexure stage. The self-adjusting stage has the capability to control 6- axes positions of wafer-holder. The UV-NIL tool can be used for fabrication of some functional nanostructure-patterns i.e. nanosensor electrodes, optical grating patterns and 70nm rectangle patterns.

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19

Resnick, Douglas J., S. V. Sreenivasan, and C. Grant Willson. "Step & flash imprint lithography." Materials Today 8, no. 2 (February 2005): 34–42. http://dx.doi.org/10.1016/s1369-7021(05)00700-5.

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20

Acevedo, Diego F., Evelina Frontera, Martín F. Broglia, Frank Mücklich, María C. Miras, and César A. Barbero. "One Step Lithography of Polypyrrole." Advanced Engineering Materials 13, no. 5 (January 20, 2011): 405–10. http://dx.doi.org/10.1002/adem.201000295.

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21

Jiang, Youwei, Bingqing Luo, and Xing Cheng. "Enhanced Thermal Stability of Thermoplastic Polymer Nanostructures for Nanoimprint Lithography." Materials 12, no. 3 (February 12, 2019): 545. http://dx.doi.org/10.3390/ma12030545.

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Thermoplastic polymer micro- and nanostructures suffer pattern decay when heated to a temperature close to or above the polymer’s glass transition temperature. In this work, we report enhanced thermal stability of polycarbonate nanostructures at temperatures well above their glass transition temperatures. Based on this observation, we develop a unique technique for high-resolution polymer patterning by polymer reflows. This technique is characterized as the precise control of polymer reflows regardless of the annealing time, which avoids the time-domain nonlinear reflow of the polymer melt. We also implement thermal nanoimprinting in a step-and-repeat fashion, which dramatically increases the throughput of the thermal nanoimprint. The enhanced pattern stability against thermal reflow also allows for multiple imprinting at the same location to generate complex resist patterns from a simple mold structure. Since modern lithography often uses thin resist films (sub-100 nm) due to the restraint from the pattern aspect ratio, the unusual annealing behavior of thin polymer films is highly relevant in sub-100 nm lithographic processing.

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22

KIGAMI, Hiroshi, Noriyuki UNNO, Yuta SHINONAGA, Tatsuya HAYASHI, and Jun TANIGUCHI. "1305 Fabrication of Silicon Mold for Eight-step Diffractive Optical Element using Liquid Transfer Imprint Lithography." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2015.8 (2015): _1305–1_—_1305–4_. http://dx.doi.org/10.1299/jsmelem.2015.8._1305-1_.

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23

Leong, Eunice Sok Ping, Jie Deng, Eng Huat Khoo, Siji Wu, Wee Kee Phua, and Yan Jun Liu. "Fabrication of suspended, three-dimensional chiral plasmonic nanostructures with single-step electron-beam lithography." RSC Advances 5, no. 117 (2015): 96366–71. http://dx.doi.org/10.1039/c5ra17705g.

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24

SEWELL, HARRY. "250nm Lithography with Step and Scan." Journal of Photopolymer Science and Technology 6, no. 1 (1993): 161–70. http://dx.doi.org/10.2494/photopolymer.6.161.

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25

Edwards, C., and J. Sawicki. "Step out of the light [lithography]." Engineering & Technology 5, no. 17 (November 13, 2010): 34–35. http://dx.doi.org/10.1049/et.2010.1720.

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26

Jiang, Nan, Gary Hembree, and John C. H. Spence. "Electron Lithography In Glasses by STEM." Microscopy and Microanalysis 9, S02 (July 19, 2003): 300–301. http://dx.doi.org/10.1017/s1431927603441500.

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27

Li, Chunyu, Xixian Wang, Jian Xu, and Bo Ma. "One-step liquid molding based modular microfluidic circuits." Analyst 145, no. 21 (2020): 6813–20. http://dx.doi.org/10.1039/d0an01134g.

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28

Jun Cheng, Jun Cheng, and Nan Yan Nan Yan. "Three-step lithography to the fabrication of vertically coupled micro-ring resonators in amorphous silicon-on-insulator." Chinese Optics Letters 13, no. 8 (2015): 082201–82205. http://dx.doi.org/10.3788/col201513.082201.

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29

Laun, Joachim, Yana De Smet, Emma Van de Reydt, Alexander Krivcov, Vanessa Trouillet, Alexander Welle, Hildegard Möbius, Christopher Barner-Kowollik, and Tanja Junkers. "2D laser lithography on silicon substrates via photoinduced copper-mediated radical polymerization." Chemical Communications 54, no. 7 (2018): 751–54. http://dx.doi.org/10.1039/c7cc08444g.

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30

Yesilkoy, F., V. Flauraud, M. Rüegg, B. J. Kim, and J. Brugger. "3D nanostructures fabricated by advanced stencil lithography." Nanoscale 8, no. 9 (2016): 4945–50. http://dx.doi.org/10.1039/c5nr08444j.

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31

Zhang, W., M. P. Tullier, K. Patel, A. Carranza, J. A. Pojman, and A. D. Radadia. "Microfluidics using a thiol–acrylate resin for fluorescence-based pathogen detection assays." Lab on a Chip 15, no. 21 (2015): 4227–31. http://dx.doi.org/10.1039/c5lc00971e.

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32

Xin, Zheng Hang, Chong Wang, Feng Qiu, Rong Fei Wang, Chen Li, and Yu Yang. "Advance in the Fabrication of Ordered Ge/Si Nanostructure Array on Si Patterned Substrate by Nanosphere Lithography." Materials Science Forum 852 (April 2016): 283–92. http://dx.doi.org/10.4028/www.scientific.net/msf.852.283.

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The recent process in the fabrication of the ordered Ge/Si quantum dots (QDs) is reviewed. The fabrication step generally started on the preparation of patterned substrate prepared in advance by using several interesting methods, such as photo lithography, focus ion beam (FIB), reactive ion etching (RIE), and extreme ultraviolet lithography (EUV-IL) et al, which are introduced briefly in this article. Here, we’d like to focus on the detailed process of nanosphere lithography (NSL) which has the advantages of less cost and higher product compared with the referred methods. The ordered Ge nanostructures always show as Hexagonal close-packed array on the patterned Si substrate and have the advantages of potential applications in electronic and optoelectronic devices.

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33

Zhang, Kui, Zhimin Chen, Jingsong Wei, Tao Wei, Youyong Geng, Yang Wang, and Yiqun Wu. "A study on one-step laser nanopatterning onto copper–hydrazone-complex thin films and its mechanism." Physical Chemistry Chemical Physics 19, no. 20 (2017): 13272–80. http://dx.doi.org/10.1039/c7cp00477j.

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34

Jiang, Zheng, Hao Zhu, Qingqing Sun, and Davidwei Zhang. "Step Coverage and Dry Etching Process Improvement of Amorphous Carbon Hard Mask." Electronics 10, no. 20 (October 15, 2021): 2512. http://dx.doi.org/10.3390/electronics10202512.

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Amorphous carbon hard mask (ACHM) films have been widely applied as protective components and hard etching masks in lithography and dry etching processes. The capability of lithography is directly dependent on the step coverage (SC) of the ACHM. Poor SC may impact the protection of device patterns during the etching process and lead to overlay marks occurring in lithography. In this work, the ACHM film processing process is engineered and optimized towards better SC through the comparative study of the C2H2 and C3H6 precursors at different temperatures. Furthermore, a process parameter design of experiment (DOE), with C2H2 as a precursor to optimize the dry etching rate, is proposed. The results of the experiment show that the dry etching performance is enhanced by higher power, temperature and C2H2 flow, and a smaller gap, lower pressure and lower carrier gas flow. A selective etching ratio of SiO2 and SiN, with an improved process window, is obtained. ACHM film elimination process is also validated by characterizing the surface roughness. The demonstrated results can be instructive in terms of the optimization of etching process in future semiconductor manufacturing.

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35

Dai, Jian Feng, Qing Wang, Wei Xue Li, Yong Fu Cui, Feng Zhang, and Henry I. Smith. "The Fabrication of 2-D Global Fiducial Grid with High Resolution for Spatial Phase Locked e-Beam Lithography." Materials Science Forum 575-578 (April 2008): 1252–57. http://dx.doi.org/10.4028/www.scientific.net/msf.575-578.1252.

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The spatial phase locked scanning electron beam lithography systems (SPLEBL) is a new lithography technique with a pattern placement precision of about 1 nm. The SPLEBL technique can solve the major problem of poor placement accuracy existed in the conventional scanning electron beam lithography for that it uses a Fourier technique to detect the beam position in real time during exposure. The fiducial grid plays a key role in SPLEBL. The two-dimensional global fiducial grid with a grid period of 250 nm placed on top of the e-beam resist used in SPLEBL with high contrast, high brightness, long-range spatial-phase coherence, large area and a pattern placement precision of about 1 nm is fabricated using optical interference lithography in this article. The detail fabrication process is described and the SEM images of the fabricated grid are also presented in this paper. Only one evaporation step and several spin-coating steps are required in the fabrication process, so it is simple and user friendly.

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36

Lai, Chung-Jui, Hui-Ping Tsai, Ju-Yu Chen, Mei-Xuan Wu, You-Jie Chen, Kun-Yi Lin, and Hong-Ta Yang. "Single-Step Fabrication of Longtail Glasswing Butterfly-Inspired Omnidirectional Antireflective Structures." Nanomaterials 12, no. 11 (May 29, 2022): 1856. http://dx.doi.org/10.3390/nano12111856.

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Most bio-inspired antireflective nanostructures are extremely vulnerable and suffer from complicated lithography-based fabrication procedures. To address the issues, we report a scalable and simple non-lithography-based approach to engineer robust antireflective structures, inspired by the longtail glasswing butterfly, in a single step. The resulting two-dimensional randomly arranged 80/130/180 nm silica colloids, partially embedded in a polymeric matrix, generate a gradual refractive index transition at the air/substrate interface to suppress light reflection. Importantly, the randomly arranged subwavelength silica colloids display even better antireflection performance for large incident angles than that of two-dimensional non-close-packed silica colloidal crystals. The biomimetic coating is of considerable technological importance in numerous practical applications.

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37

Jun Cheng, Jun Cheng, and Duk-Yong Choi Duk-Yong Choi. "Three-step lithography to the fabrication of vertically coupled micro-ring resonators in amorphous silicon-on-insulator-corrigendum." Chinese Optics Letters 14, no. 4 (2016): 043501–43501. http://dx.doi.org/10.3788/col201614.043501.

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38

Dell'Anna, Rossana, Cecilia Masciullo, Erica Iacob, Mario Barozzi, Damiano Giubertoni, Roman Böttger, Marco Cecchini, and Giancarlo Pepponi. "Multiscale structured germanium nanoripples as templates for bioactive surfaces." RSC Advances 7, no. 15 (2017): 9024–30. http://dx.doi.org/10.1039/c6ra28531g.

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39

Hamidovic, Medina, and Ferenc Ender. "A Novel Method for Fabricating Microfluidic Devices Containing Immobilized Biological Specimens." Periodica Polytechnica Electrical Engineering and Computer Science 63, no. 2 (March 28, 2019): 85–93. http://dx.doi.org/10.3311/ppee.13523.

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Microfluidic devices are dominantly fabricated using the soft lithography microfabrication techniques and polydimethylsiloxane (PDMS) as a structural material. Although the technique is applicable for the majority of microfluidic devices, it has limited use for the fabrication of microfluidic devices with immobilized biological specimen due to the low biocompatibility- a consequence of the plasma-assisted bonding step during the assembly of the final device. In this step, biological specimens within the microfluidic device are affected by strong plasma exposure which ultimately can degrade their biochemical activity and stability. To the best of our knowledge, this paper presents for the first time a method for increasing the biocompatibility of a conventional PDMS soft lithography process and enables fabrication of the microfluidic devices containing immobilized biological specimens. Protection of the biological specimen during the plasma bonding step is ensured by placing a protective Polyvinyl Alcohol (PVA) nanofiber layer over the biological specimens. The method is verified against the conventional soft lithography method by fabricating microfluidic devices containing enzyme-filled microreactors and following enzymatic reactions. It was shown that inadvantageous impact of the plasma is reduced by utilizing a protective PVA layer which ultimately preserves the specific activity and biochemical stability of the immobilized enzymes.

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40

Colson, Pierre, Catherine Henrist, and Rudi Cloots. "Nanosphere Lithography: A Powerful Method for the Controlled Manufacturing of Nanomaterials." Journal of Nanomaterials 2013 (2013): 1–19. http://dx.doi.org/10.1155/2013/948510.

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The never-ending race towards miniaturization of devices induced an intense research in the manufacturing processes of the components of those devices. However, the complexity of the process combined with high equipment costs makes the conventional lithographic techniques unfavorable for many researchers. Through years, nanosphere lithography (NSL) attracted growing interest due to its compatibility with wafer-scale processes as well as its potential to manufacture a wide variety of homogeneous one-, two-, or three-dimensional nanostructures. This method combines the advantages of both top-down and bottom-up approaches and is based on a two-step process: (1) the preparation of a colloidal crystal mask (CCM) made of nanospheres and (2) the deposition of the desired material through the mask. The mask is then removed and the layer keeps the ordered patterning of the mask interstices. Many groups have been working to improve the quality of the CCMs. Throughout this review, we compare the major deposition techniques to manufacture the CCMs (focusing on 2D polystyrene nanospheres lattices), with respect to their advantages and drawbacks. In traditional NSL, the pattern is usually limited to triangular structures. However, new strategies have been developed to build up more complex architectures and will also be discussed.

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41

Niepel, Marcus S., Bhavya K. Ekambaram, Christian E. H. Schmelzer, and Thomas Groth. "Polyelectrolyte multilayers of poly (l-lysine) and hyaluronic acid on nanostructured surfaces affect stem cell response." Nanoscale 11, no. 6 (2019): 2878–91. http://dx.doi.org/10.1039/c8nr05529g.

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42

Hermosa, Javier, Aurelio Hierro-Rodríguez, Carlos Quirós, María Vélez, Andrea Sorrentino, Lucía Aballe, Eva Pereiro, Salvador Ferrer, and José I. Martín. "Two-Step Resist Deposition of E-Beam Patterned Thick Py Nanostructures for X-ray Microscopy." Micromachines 13, no. 2 (January 28, 2022): 204. http://dx.doi.org/10.3390/mi13020204.

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Patterned elements of permalloy (Py) with a thickness as large as 300 nm have been defined by electron beam lithography on X-ray-transparent 50 nm thick membranes in order to characterize their magnetic structure via Magnetic Transmission X-ray Microscopy (MTXM). To avoid the situation where the fragility of the membranes causes them to break during the lithography process, it has been found that the spin coating of the resist must be applied in two steps. The MTXM results show that our samples have a central domain wall, as well as other types of domain walls, if the nanostructures are wide enough.

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43

Montero-Pancera, Sabrina, Vanessa Trouillet, Andre Petershans, Dagmar Fichtner, Andrey Lyapin, Michael Bruns, Thomas Schimmel, et al. "Design of Chemically Activated Polymer Microwells by One-Step UV-Lithography for Stem Cell Adhesion." Langmuir 26, no. 3 (February 2, 2010): 2050–56. http://dx.doi.org/10.1021/la902563d.

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Johnson, Stephen C. "Nanofabrication with step and flash imprint lithography." Journal of Micro/Nanolithography, MEMS, and MOEMS 4, no. 1 (January 1, 2005): 011002. http://dx.doi.org/10.1117/1.1862650.

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Liu, H. Z., Bing Heng Lu, Y. C. Ding, D. C. Li, Yi Ping Tang, and T. Jin. "A Measurement System for Step Imprint Lithography." Key Engineering Materials 295-296 (October 2005): 107–12. http://dx.doi.org/10.4028/www.scientific.net/kem.295-296.107.

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A precision 6-degree-of-freedom measurement system has been developed for simultaneous on-line measurements of imprint lithography stage. To successfully accomplish nanometer-scale pattern transfer from mold to resist film on the wafer, two types of positioning methods, static and dynamic, are used in this system. Two laser interferometers, two optical reflection mirrors and special structure on the stage with 3 elastic tracks are employed in this system to detect the positions and rotations of the stage. Through an algorithm, measurements of pitch, yaw and roll motions can be achieved. This system can realize on-line position detecting. Based on adjusting of PZTs, the detecting precision can reach 10nm and ±3 milli-arcsec, respectively. The measuring range can reach 100mm and ±10 arcsec, respectively.

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Buckley, Jere D. "Step-and-scan lithography using reduction optics." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 7, no. 6 (November 1989): 1607. http://dx.doi.org/10.1116/1.584499.

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Spence, J. C. H., and U. Weierstall. "Tomographic Diffractive Imaging. STEM Lithography for Nanorings." Microscopy and Microanalysis 9, S02 (August 2003): 6–7. http://dx.doi.org/10.1017/s1431927603440671.

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Bailey, T., B. Smith, B. J. Choi, M. Colburn, M. Meissl, S. V. Sreenivasan, J. G. Ekerdt, and C. G. Willson. "Step and flash imprint lithography: Defect analysis." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 19, no. 6 (2001): 2806. http://dx.doi.org/10.1116/1.1420203.

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Huang, XuHai, Karina Torres-Castro, Walter Varhue, Armita Salahi, Ahmed Rasin, Carlos Honrado, Audrey Brown, Jennifer Guler, and Nathan S. Swami. "Self-aligned sequential lateral field non-uniformities over channel depth for high throughput dielectrophoretic cell deflection." Lab on a Chip 21, no. 5 (2021): 835–43. http://dx.doi.org/10.1039/d0lc01211d.

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Self-aligned sequential lateral field non-uniformities extending uniformly over the sample channel depth are fabricated using a single lithography step for enabling phenotype-specific dielectrophoretic separation of cells.

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Shahin Shahidan, Muhammad Faris, Jingchao Song, Timothy D. James, and Ann Roberts. "Multilevel nanoimprint lithography with a binary mould for plasmonic colour printing." Nanoscale Advances 2, no. 5 (2020): 2177–84. http://dx.doi.org/10.1039/d0na00038h.

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Printing of multilevel (3-dimensional) plasmonic colour using UV-assisted nanoimprint lithography (NIL) with a simple 2-dimensional binary (two-step) mold in a single print by harnessing nanofluidics of the polymer resist through strategic mold design.

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