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Journal articles on the topic 'Sputter Magnetron'

Author: Grafiati

Published: 4 June 2021

Last updated: 1 February 2022

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1

Wolke, Joop G. C., E. Vandenbulcke, B. van Oirschot, and John A. Jansen. "A Study to the Surface Characteristics of RF Magnetron Sputtered Bioglass - and Calcium Phosphate Coatings." Key Engineering Materials 284-286 (April 2005): 187–90. http://dx.doi.org/10.4028/www.scientific.net/kem.284-286.187.

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The RF magnetron sputter technique was used to deposit Bioglass (BG) and hydroxyapatite (HA) coatings onto titanium substrates. In the current study, the physico-chemical and dissolution properties of various deposited coatings were investigated. X-ray diffraction demonstrated that the as-sputtered coatings had an amorphous structure, a heattreatment for 2 hours at 600°C changed only the HA coating into a crystalline apatite structure. Dissolution experiments demonstrated that all the amorphous coatings dissolved during the incubation for 4 weeks in simulated body fluid, while all the heattreated sputter coatings were still maintained. In contrast with the HA heattreated sputter coatings all the bioglass containing sputter coatings showed the formation of a crystalline apatite phase. Scanning electron microscopical examination of the sputtered coatings demonstrated that on all the heattreated BG/HG sputter coating a thick CaP precipitate was formed, while on the BG sputter coating occasionally a globular precipitate was observed.

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2

Rossnagel, S. M., D. Mikalsen, H. Kinoshita, and J. J. Cuomo. "Collimated magnetron sputter deposition." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 9, no. 2 (March 1991): 261–65. http://dx.doi.org/10.1116/1.577531.

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3

Johnson, Mark, and Paul Cote. "Modeling Magnetron Sputter Deposition." Materials and Manufacturing Processes 21, no. 6 (September 2006): 628–33. http://dx.doi.org/10.1080/10426910600611045.

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4

Schiller, S., K. Goedicke, J. Reschke, V. Kirchhoff, S. Schneider, and F. Milde. "Pulsed magnetron sputter technology." Surface and Coatings Technology 61, no. 1-3 (December 1993): 331–37. http://dx.doi.org/10.1016/0257-8972(93)90248-m.

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5

Na, Dong-Myong, Young-Bok Kim, and Jin-Seong Park. "The characteristics of Pt thin films prepared by DC magnetron sputter." Journal of Sensor Science and Technology 16, no. 2 (March 31, 2007): 159–64. http://dx.doi.org/10.5369/jsst.2007.16.2.159.

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6

Wolke, Joop G. C., Jeroen J. J. P. van den Beucken, and John A. Jansen. "Growth Behavior of Rat Bone Marrow Cells on RF Magnetron Sputtered Bioglass- and Calcium Phosphate Coatings." Key Engineering Materials 361-363 (November 2007): 253–56. http://dx.doi.org/10.4028/www.scientific.net/kem.361-363.253.

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The RF magnetron sputter technique was used to deposit Bioglass (BG) and hydroxyapatite (HA) coatings onto titanium substrates. The aim of this study was evaluated the growth behavior of rat bone marrow cells of various deposited coatings. The EDS measurements demonstrated that the composition BG coating was changed during magnetron sputtering. The rat bone marrow derived osteoblast-like cells showed improved osteogenic response on crystalline magnetron sputtered HA coatings compared BG coatings. Scanning electron microscopical examination showed an extensive mineralization after 16 days of culture, while on the surface of the BG coating only a multilayer without mineralization could be observed.

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7

De Bosscher, Wilmert, and Hugo Lievens. "Advances in magnetron sputter sources." Thin Solid Films 351, no. 1-2 (August 1999): 15–20. http://dx.doi.org/10.1016/s0040-6090(99)00149-2.

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8

Ling, S. H., and H. K. Wong. "High pressure magnetron sputter gun." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 10, no. 3 (May 1992): 573–75. http://dx.doi.org/10.1116/1.578190.

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9

Shon, C. H., J. K. Lee, H. J. Lee, Y. Yang, and T. H. Chung. "Velocity distributions in magnetron sputter." IEEE Transactions on Plasma Science 26, no. 6 (1998): 1635–44. http://dx.doi.org/10.1109/27.747881.

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10

Sutter, P., E. Müller, S. Tao, C. Schwarz, M. Filzmoser, M. Lenz, and H. von Känel. "Magnetron sputter epitaxy of heterostructures." Journal of Crystal Growth 157, no. 1-4 (December 1995): 172–76. http://dx.doi.org/10.1016/0022-0248(95)00384-3.

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11

Gledhill, Steyer, Weiss, and Hildebrandt. "HiPIMS and DC Magnetron Sputter-Coated Silver Films for High-Temperature Durable Reflectors." Coatings 9, no. 10 (September 20, 2019): 593. http://dx.doi.org/10.3390/coatings9100593.

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High-temperature durable mirrors based on a protected silver sputter coating are attractive for secondary reflector applications in concentrated solar thermal power plants. In this paper, silver films are deposited by high-power impulse magnetron sputtering (HiPIMS) and standard direct current (DC) magnetron sputtering, either as exposed discretely deposited films or in-sequence-deposited thin film systems, where the silver is protected and embedded between adhesion and barrier layers. The unprotected silver films and equivalent protected silver thin film systems are compared and characterized as deposited and after 400 °C oven temperature exposure. The reflectance is measured and grazing incident X-ray diffraction (GIXRD) and scanning electron microscopy (SEM) pictures were taken. The HiPIMS silver film, sputtered with a peak current of 200 A and an approximately equivalent average power density to the DC magnetron sputtered silver, exhibits higher reflectance (and conductivity). Increasing the power density further, yields silver films with lower reflectance, correlating to a reduced grain size. In the protected silver film system, the reflectance does not improve, due to the presence of a less reflective top adhesion layer. The protected film system, with the 200 A HiPIMS, is, however, more durable at 400 °C than the DC magnetron sputtered equivalent.

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12

Depla, D. "On the effective sputter yield during magnetron sputter deposition." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 328 (June 2014): 65–69. http://dx.doi.org/10.1016/j.nimb.2014.03.001.

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13

Zhang, Yuan Ming. "Research on Preparation and Properties of Textile Materials Deposited with Nanostructured Titanium Oxide." Advanced Materials Research 998-999 (July 2014): 136–39. http://dx.doi.org/10.4028/www.scientific.net/amr.998-999.136.

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In the 21st century, environmental pollution has become increasingly serious. Pollution control and management has been the major issue and must be resolved. In this paper, TiO2 as a representative oxide semiconductor photo catalytic material, which is an ideal environmental pollution cleaning product due to its unique properties. The low temperature magnetron sputter coating was employed to deposit Nanostructured TiO2 films on the surface of nonwovens and polymer fibers to functionalize the textile materials. The use of magnetron sputter coating not only overcame the problems of Nanoparticle aggregation as filling particles, but also shortened the production processes and eliminated the water pollution. The use of magnetron sputter coating, on the other hand, could cut the processing cost. This research explored the formation principle, preparation techniques, properties and reliability of the Nanostructured TiO2 deposited on the surface of textile substrates to meet the demands of the markets for functional textiles.

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14

Takaya, Y., Y. Tanioka, H. Yoshino, and A. Osawa. "Low Inductance Antenna (LIA) plasma source and plasma-enhanced dual rotatable magnetron sputter assisted with LIA." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000757–60. http://dx.doi.org/10.4071/isom-2015-poster9.

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In recent years, both low plasma damage and low temperature deposition technic for polymer substrates (e.g. PCB, films and etc.) are often required. We have developed a plasma enhanced dual rotatable magnetron sputter source assisted with inductively coupled plasma (ICP) using low inductance antenna (LIA). LIA has same unique characteristics, a)low voltage high density plasma, b)well controllability of plasma profile to ensure uniformity over large area, c)ionization of sputtered particle and etc. when in being used as a plasma assistant, and besides, LIA can be used as a ICP source for polymer surface modification. We introduce a variety of the possibilities of whether this sputter source is usable for the process of the fabrication of PCB.

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15

Poelman, H., K. Eufinger, D. Depla, D. Poelman, R. De Gryse, B. F. Sels, and G. B. Marin. "Magnetron sputter deposition for catalyst synthesis." Applied Catalysis A: General 325, no. 2 (June 2007): 213–19. http://dx.doi.org/10.1016/j.apcata.2007.02.028.

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16

Teer, D. G. "A magnetron sputter ion plating system." Surface and Coatings Technology 36, no. 3-4 (December 1988): 901–7. http://dx.doi.org/10.1016/0257-8972(88)90030-8.

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17

Westwood, W. D. "Sputter Deposition Processes." MRS Bulletin 13, no. 12 (December 1988): 46–51. http://dx.doi.org/10.1557/s0883769400063697.

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Deposition of films by sputtering was observed first in 1852 by Grove. The technique was in general use through the 1920s for preparing reflective coatings and other thin film samples. Western Electric deposited gold on wax masters for phonograph recordings. The improvement in diffusion pump technology at that time caused thermal evaporation deposition to replace sputtering.Not till the 1950s did sputter deposition reappear… Bell Laboratories developed tantalum hybrid circuit technology using sputter deposition. Besides depositing Ta, they created a new material, Ta2N, by reactively sputtering tantalum in gas mixtures of argon and N2. Since then, these two methods, sputtering of metals and alloys and reactive sputtering of compounds, have been investigated for many applications of thin film materials.Although the general aspects of the methods have changed little in the past 30 years, the implementations have changed significantly, particularly since the introduction of magnetron systems in the 1970s. This review will concentrate mainly on these flexible, high rate magnetron deposition systems.The term sputtering actually applies to the physical processes by which atoms are removed from a material. Momentum is transferred from an incident, energetic particle, usually in the form of an ion, to atoms of the target material. A large number of these atoms are displaced from their normal sites in the crystal lattice, producing a disordered structure that also contains some of the incident particles, which are implanted. Some of the target atoms are displaced from the surface; if they have enough energy, they escape from the target as sputtered atoms.

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18

Bartsch, Heike, Rolf Grieseler, Jose Mánuel, Jörg Pezoldt, and Jens Müller. "Magnetron Sputtered AlN Layers on LTCC Multilayer and Silicon Substrates." Coatings 8, no. 8 (August 18, 2018): 289. http://dx.doi.org/10.3390/coatings8080289.

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This work compares the deposition of aluminum nitride by magnetron sputtering on silicon to multilayer ceramic substrates. The variation of sputter parameters in a wide range following a fractional factorial experimental design generates diverse crystallographic properties of the layers. Crystal growth, composition, and stress are distinguished because of substrate morphology and thermal conditions. The best c-axis orientation of aluminum nitride emerges on ceramic substrates at a heater temperature of 150 °C and sputter power of 400 W. Layers deposited on ceramic show stronger c-axis texture than those deposited on silicon due to higher surface temperature. The nucleation differs significantly dependent on the substrate. It is demonstrated that a ceramic substrate material with an adapted coefficient of thermal expansion to aluminum nitride allows reducing the layer stress considerably, independent on process temperature. Layers sputtered on silicon partly peeled off, while they adhere well on ceramic without crack formation. Direct deposition on ceramic enables thus the development of optimized layers, avoiding restrictions by stress compensating needs affecting functional properties.

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19

Fox, G. R., and P. A. Danai. "ZnO microtubes." Journal of Materials Research 9, no. 11 (November 1994): 2737–40. http://dx.doi.org/10.1557/jmr.1994.2737.

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Microtubes of ZnO have been produced using sputter coating and a fugitive phase technique. ZnO was sputtered onto polyester fibers by dc magnetron sputtering, and the polyester fiber fugitive phase was subsequently burned out by annealing in air or oxygen. Tubes with an inside diameter of 23 μm and a length of 3 cm were obtained. The 3 to 6 μm thick walls of the tubes exhibited a [002] radial texture.

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20

Ogura, K., S. Adachi, T. Satoh, T. Watabe, and M. M. Kersker. "Magnetron sputter coating for ultra high resolution Scanning Electron Microscopy (Simultaneous coating of platinum and tungsten using a magnetron sputter coater)." Proceedings, annual meeting, Electron Microscopy Society of America 47 (August 6, 1989): 80–81. http://dx.doi.org/10.1017/s0424820100152379.

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The resolution of the SEM has been remarkably improved by means of the in-lens SEM with a field emission gun. Consequently, the thin metal coating on the specimen surface for ultra high resolution imaging has become very important. In the age of imaging with 2-3nm resolution at 100,000x magnification, a very thin platinum (Pt) coating on the specimen surface using the magnetron sputter coater has yielded successful results. However, in an ultra high resolution scanning electron microscope with better than 1nm resolution at higher than 200,000: magnification, the fine granularity of magnetron sputter coating of Inra thick Pt will be observed on the specimen surface. Therefore, a thinner metal coating with smaller grain size than that of Pt is strongly required. Recently, we tried tungsten (W) coating on many variety of specimens in argon (Ar) gas atmosphere by using a magnetron sputter coater. Using a W coated carbon film, the granularity of W was examined by both an UHR-SEM and a TEM at a minimum magnification of 250,000x.

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21

Bai, Tao, and Qing Lian Zhang. "The Effects of the Sputter-Etching Parameters on the Formation of Conical Protrusions on the Surface of SUS304 Stainless Steel." Advanced Materials Research 535-537 (June 2012): 764–67. http://dx.doi.org/10.4028/www.scientific.net/amr.535-537.764.

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SUS304 stainless steel samples were sputter-etched by a radio frequency (RF) magnetron sputtering apparatus. Correlations between the formation of conical protrusions on the steel surface and sputter parameters, such as sputter power, anode-to-substrate distance, argon gas flow ratio and sputter-etching time were discussed. The results show that the conical protrusion precipitates both uniformly and densely on the surface with the power being 600W, the anode-to-substrate distance being 50mm, the argon gas flow ratio being 50sccm and the sputter-etching time being 6h.

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22

Bai, Tao, and Qing Lian Zhang. "The Effects of the Sputter-Etching Power on the Formation of Conical Protrusions on the Surface of SUS304 Stainless Steel." Applied Mechanics and Materials 164 (April 2012): 276–79. http://dx.doi.org/10.4028/www.scientific.net/amm.164.276.

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SUS304 stainless steel samples were sputter-etched by a radio frequency (RF) magnetron sputtering apparatus. Correlation between the formation of conical protrusions on the steel surface and sputter power was discussed. The results show that the conical protrusion precipitates both uniformly and densely on the surface with the power being 600W, the anode-to-substrate distance being 50mm, the argon gas flow ratio being 50sccm and the sputter-etching time being 6h. The roughness of the samples sputter-etched at various sputtering powers for 6h was analyzed. According to the results, sputter-etching brings about the development of surface roughness, which in turn may affect the sputter-etching process

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23

Šimůrka, Lukáš, Selen Erkan, and Tuncay Turutoglu. "Characterization of Silicon Nitride Thin Films on Glass." Defect and Diffusion Forum 368 (July 2016): 86–90. http://dx.doi.org/10.4028/www.scientific.net/ddf.368.86.

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The influence of process parameters on amorphous reactively sputtered silicon nitride thin films is reported in this study. The films were prepared with various argon and nitrogen flows, and sputter power in in-line horizontal coater by DC magnetron reactive sputtering from Si (10% Al) target. Refractive index and mechanical properties like residual stress, hardness and elastic modulus were studied. We show that process pressure has an important influence on mechanical properties of the sputtered film. On the other hand, the nitrogen content is the key factor for the optical properties of the films.

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24

Monaghan, John, D. C. Cameron, and M. S. J. Hashmi. "Magnetic Field in a Commercial Sputter Magnetron." Key Engineering Materials 118-119 (March 1996): 287–94. http://dx.doi.org/10.4028/www.scientific.net/kem.118-119.287.

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25

Dahm, K. L., L. R. Jordan, J. Haase, and P. A. Dearnley. "Magnetron sputter deposition of chromium diboride coatings." Surface and Coatings Technology 108-109 (October 1998): 413–18. http://dx.doi.org/10.1016/s0257-8972(98)00568-4.

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26

Baechle, Daniel M., John D. Demaree, James K. Hirvonen, and Eric D. Wetzel. "Magnetron sputter deposition onto fluidized particle beds." Surface and Coatings Technology 221 (April 2013): 94–103. http://dx.doi.org/10.1016/j.surfcoat.2013.01.032.

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27

Hagedorn, D., F. Löffler, and R. Meeß. "Magnetron sputter process for inner cylinder coatings." Surface and Coatings Technology 203, no. 5-7 (December 2008): 632–37. http://dx.doi.org/10.1016/j.surfcoat.2008.06.166.

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28

Helmer, J. C., and C. E. Wickersham. "Pressure effects in planar magnetron sputter deposition." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 4, no. 3 (May 1986): 408–12. http://dx.doi.org/10.1116/1.573892.

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29

Vickery, Anette, Carsten P. Jensen, Finn E. Christensen, Mads Peter Steenstrup, and Troels Schønfeldt. "Collimated Magnetron Sputter Deposition for Mirror Coatings." X-Ray Optics and Instrumentation 2008 (June 15, 2008): 1–9. http://dx.doi.org/10.1155/2008/792540.

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At the Danish National Space Center (DNSC), a planar magnetron sputtering chamber has been established as a research and production coating facility for curved X-ray mirrors for hard X-ray optics for astronomical X-ray telescopes. In the following, we present experimental evidence that a collimation of the sputtered particles is an efficient way to suppress the interfacial roughness of the produced multilayer. We present two different types of collimation optimized for the production of low roughness curved mirrors and flat mirrors, respectively.

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30

Joo, Junghoon. "Ionization enhancement in ionized magnetron sputter deposition." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 18, no. 1 (January 2000): 23–29. http://dx.doi.org/10.1116/1.582153.

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31

Scherer, Michael. "Magnetron sputter-deposition on atom layer scale." Vakuum in Forschung und Praxis 21, no. 4 (August 2009): 24–30. http://dx.doi.org/10.1002/vipr.200900391.

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32

Gaines, J. R. "Enhanced High Power Impulse Magnetron Sputter Processes." Vakuum in Forschung und Praxis 31, no. 1 (February 2019): 20–25. http://dx.doi.org/10.1002/vipr.201900704.

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33

Yakushiji, Yuji, Yuichiro Kuroki, Tomoichiro Okamoto, and Masasuke Takata. "Durability Improvement of Optical H₂ Gas Sensor Using Pd Thin Film on Sputter-Etched Glass Substrate." Key Engineering Materials 421-422 (December 2009): 307–10. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.307.

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A glass substrate was sputter-etched by R. F. magnetron sputtering at the powers of 100 or 200 W for 60 min in Ar gas. Pd thin film as a sensing agent of hydrogen (H2) was deposited on the glass substrate. The durability of the sensor was evaluated during hydrogen absorption-desorption cycles. The Pd thin film on the glass substrate without sputter etching peeled off after dozens of the cycles. However, the Pd thin film on sputter-etched glass substrate didn’t peel off. The contact angle of water on the glass substrate with sputter etching was smaller than that without sputter etching, suggesting that the surface energy of the substrate was increased by employing the sputter etching process. The improvement of durability for the optical hydrogen sensor using sputter etched substrate was related to the increase of surface energy induced by the sputter etching.

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34

Klenov, D. O., W. Donner, L. Chen, A. J. Jacobson, and S. Stemmer. "Composition control of radio-frequency magnetron sputter-deposited La0.5Sr0.5CoO3−∂ thin films." Journal of Materials Research 18, no. 1 (January 2003): 188–94. http://dx.doi.org/10.1557/jmr.2003.0026.

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For this paper, we used radio-frequency (rf) sputter deposition to synthesize epitaxial La0.5Sr0.5CoO3−∂ (LSCO) films. We investigated the influence of sputter deposition parameters, in particular, oxygen partial pressure, plasma power, total sputter pressure, and post-deposition cooling atmosphere on film composition, microstructure, and electrical resistivity. We show that rf sputtering from a single target can produce LSCO films with La/Sr and (La + Sr)/Co ratios of unity and with low electrical resistivities of about 1 mΩ cm. Film microstructures were characterized by high-resolution transmission electron microscopy and x-ray diffraction. Formation of an ordered film superlattice, most likely due to oxygen vacancy ordering, was observed. In this paper, we discuss the relationship between the film microstructure and the electrical resistivity.

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35

Liu, Cheng-Tsung, Ming-Chih Lai, and Chang-Chou Hwang. "Design Assessments of a Refined DC Magnetron Sputter With Multiple Magnetron Arrangements." IEEE Transactions on Magnetics 46, no. 6 (June 2010): 1614–17. http://dx.doi.org/10.1109/tmag.2009.2037976.

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36

Sreedhar, A., M. Hari Prasad Reddy, S. Uthanna, and J. F. Pierson. "Sputter Power Influenced Structural, Electrical, and Optical Behaviour of Nanocrystalline CuNiO2 Films Formed by RF Magnetron Sputtering." ISRN Condensed Matter Physics 2013 (August 25, 2013): 1–9. http://dx.doi.org/10.1155/2013/527341.

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Copper nickel oxide (CuNiO2) films were deposited on glass and silicon substrates using RF magnetron sputtering of equimolar Cu50Ni50 alloy target at different sputter powers in the range of 3.1–6.1 W/cm2. The effect of sputter power on the chemical composition, crystallographic structure, chemical binding configuration, surface morphology, and electrical and optical properties of CuNiO2 films was investigated. The films formed at sputter power of 5.1 W/cm2 were of nearly stoichiometric CuNiO2. Fourier transform infrared spectroscopic studies indicated the presence of the characteristic vibrational bands of copper nickel oxide. The nanocrystalline CuNiO2 films were formed with the increase in grain size from 75 to 120 nm as the sputter power increased from 3.1 to 5.1 W/cm2. The stoichiometric CuNiO2 films formed at sputter power of 5.1 W/cm2 exhibited electrical resistivity of 27 Ωcm, Hall mobility of 21 cm2/Vsec, and optical bandgap of 1.93 eV.

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37

Simmonds, M. C., A. Savan, H. Van Swygenhoven, and E. Pflüger. "Characterisation of magnetron sputter deposited MoSx/metal multilayers." Thin Solid Films 354, no. 1-2 (October 1999): 59–65. http://dx.doi.org/10.1016/s0040-6090(99)00565-9.

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38

Teer, D. G. "Technical note: A magnetron sputter ion-plating system." Surface and Coatings Technology 39-40 (December 1989): 565–72. http://dx.doi.org/10.1016/s0257-8972(89)80017-9.

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39

Thomann, A. L., A. Caillard, M. Raza, M. El Mokh, P. A. Cormier, and S. Konstantinidis. "Energy flux measurements during magnetron sputter deposition processes." Surface and Coatings Technology 377 (November 2019): 124887. http://dx.doi.org/10.1016/j.surfcoat.2019.08.016.

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40

Wang, S. Z., G. Shao, P. Tsakiropoulos, and F. Wang. "Phase selection in magnetron sputter-deposited TiAl alloy." Materials Science and Engineering: A 329-331 (June 2002): 141–46. http://dx.doi.org/10.1016/s0921-5093(01)01548-9.

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41

Davies, K. E., M. Gross, and C. M. Horwitz. "Radio‐frequency reactive sputter etching in magnetron fields." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11, no. 5 (September 1993): 2752–57. http://dx.doi.org/10.1116/1.578637.

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42

Wong, M. S., W. D. Sproul, X. Chu, and S. A. Barnett. "Reactive magnetron sputter deposition of niobium nitride films." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11, no. 4 (July 1993): 1528–33. http://dx.doi.org/10.1116/1.578696.

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43

Cook, J. G., and S. R. Das. "Emission spectroscopy diagnostics of a magnetron sputter discharge." Journal of Applied Physics 65, no. 5 (March 1989): 1846–51. http://dx.doi.org/10.1063/1.342918.

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44

Dudney, N. J. "Radio frequency magnetron sputter deposition of CaF2 films." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 16, no. 2 (March 1998): 615–23. http://dx.doi.org/10.1116/1.581092.

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45

Singh, K., A. K. Grover, and A. K. Suri. "Reactive Magnetron Sputter Deposition of Chromium Nitride Coatings." Transactions of the IMF 81, no. 4 (January 2003): 131–35. http://dx.doi.org/10.1080/00202967.2003.11871517.

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46

Kolev, I., and A. Bogaerts. "Detailed numerical investigation of a DC sputter magnetron." IEEE Transactions on Plasma Science 34, no. 3 (June 2006): 886–94. http://dx.doi.org/10.1109/tps.2006.875843.

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47

Wickersham, C. E. "Impurity effects in magnetron sputter deposited tungsten films." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 4, no. 6 (November 1986): 1339. http://dx.doi.org/10.1116/1.583455.

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48

Zheng, Wei-tao, and J. E. Sundgren. "Characterization of Magnetron Sputter CN x Thin Films." Chinese Physics Letters 15, no. 2 (February 1, 1998): 120–22. http://dx.doi.org/10.1088/0256-307x/15/2/016.

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Soshnikov, I. P. "GaAs Nanowhisker Arrays Grown by Magnetron Sputter Deposition." Technical Physics Letters 31, no. 8 (2005): 644. http://dx.doi.org/10.1134/1.2035352.

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Seppänen, T., P. O. Å. Persson, L. Hultman, J. Birch, and G. Z. Radnóczi. "Magnetron sputter epitaxy of wurtzite Al1−xInxN(0.1." Journal of Applied Physics 97, no. 8 (April 15, 2005): 083503. http://dx.doi.org/10.1063/1.1870111.

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