Academic literature on the topic 'Soft bio-pressure sensor'

Dielectric elastomer (DE) sensors have been widely used in a wide variety of applications, such as in robotic hands, wearable sensors, rehabilitation devices, etc. A unique dielectric elastomer-based multimodal capacitive sensor has been developed to quantify the pressure and the location of any touch simultaneously. This multimodal sensor is a soft, flexible, and stretchable dielectric elastomer (DE) capacitive pressure mat that is composed of a multi-layer soft and stretchy DE sensor. The top layer measures the applied pressure, while the underlying sensor array enables location identification. The sensor is placed on a passive elastomeric substrate in order to increase deformation and optimize the sensor’s sensitivity. This DE multimodal capacitive sensor, with pressure and localization capability, paves the way for further development with potential applications in bio-mechatronics technology and other humanoid devices. The sensor design could be useful for robotic and other applications, such as fruit picking or as a bio-instrument for the diabetic insole.

Microelectromechanical Systems (MEMS) are a fast growing technology for sensor and actuator miniaturization finding more and more commercial opportunities by having an important role in the field of Internet of Things (IoT). On the same note, Fan-out Wafer Level Packaging (FOWLP), namely WLFO technology of NANIUM, which is based on Infineon/ Intel eWLB technology, is also finding further applications, not only due to its high performance, low cost, high flexibility, but also due to its versatility to allow the integration of different types of components in the same small form-factor package. Despite its great potential it is still off limits to the more sensitive components as micro-mechanical devices and some type of sensors, which are vulnerable to temperature and pressure. In the interest of increasing FOWLP versatility and enabling the integration of MEMS, new methods of assembling and processing are continuously searched for. Dielectrics currently used for redistribution layer construction need to be cured at temperatures above 200°C, making it one of the major boundary for low temperature processing. In addition, in order to accomplish a wide range of dielectric thicknesses in the same package it is often necessary to stack very different types of dielectrics with impact on bill of materials complexity and cost. In this work, done in cooperation with the International Iberian Nanotechnology Laboratory (INL), we describe the implementation of commercially available SU-8 photoresist as a structural material in FOWLP, allowing lower processing temperature and reduced internal package stress, thus enabling the integration of components such as MEMS/MOEMS, magneto-resistive devices and micro-batteries. While SU-8 photoresist was first designed for the microelectronics industry, it is currently highly used in the fabrication of microfluidics as well as microelectromechanical systems (MEMS) and BIO-MEMS due to its high biocompatibility and wide range of available thicknesses in the same product family. Its good thermal and chemical resistance and also mechanical and rheological properties, make it suitable to be used as a structural material, and moreover it cures at 150°C, which is key for the applications targeted. Unprecedentedly, SU-8 photoresist is tested in this work as a structural dielectric for the redistribution layers on 300mm fan-out wafers. Main concerns during the evaluation of the new WLFO dielectric focused on processability quality; adhesion to multi-material substrate and metals (copper, aluminium, gold, ¦); between layers of very different thicknesses; and overall reliability. During preliminary runs, processability on 300 mm fan-out wafers was evaluated by testing different coating and soft bake conditions, exposure settings, post-exposure parameters, up to developing setup. The outputs are not only on process conditions and results but also on WLFO design rules. For the first time, a set of conditions has been defined that allows processing SU-8 on WLFO, with thickness values ranging from 1 um to 150 um. The introduction of SU-8 in WLFO is a breakthrough in this fast-growing advanced packaging technology platform as it opens vast opportunities for sensor integration in WLP technology.

The past decade has witnessed growing interest in developing soft wearable pressure sensors with the ultimate goal of transforming today's hospital-centered diagnosis to tomorrow's patient-centered bio-diagnosis.

The integration of synthetic biology and soft robotics can fundamentally advance sensory, diagnostic, and therapeutic functionality of bioinspired machines. However, such integration is currently impeded by the lack of soft-matter architectures that interface synthetic cells with electronics and actuators for controlled stimulation and response during robotic operation. Here, we synthesized a soft gripper that uses engineered bacteria for detecting chemicals in the environment, a flexible light-emitting diode (LED) circuit for converting biological to electronic signals, and soft pneu-net actuators for converting the electronic signals to movement of the gripper. We show that the hybrid bio-LED-actuator module enabled the gripper to detect chemical signals by applying pressure and releasing the contents of a chemical-infused hydrogel. The biohybrid gripper used chemical sensing and feedback to make actionable decisions during a pick-and-place operation. This work opens previously unidentified avenues in soft materials, synthetic biology, and integrated interfacial robotic systems.

E-skins consisting of soft pressure sensors are enabling technology for soft robots, bio-integrated devices, and deformable touch panels. A well-known bottleneck of capacitive pressure sensors (CPS) is the drastic decay...

In smart farming, both artificial intelligence and robotic systems are applied in order to improve efficiency. In agriculture, for jobs such as seeding, monitoring, and harvesting, robots are widely used. When using robots to harvest fruit and vegetables, it is essential not to apply excessive force, as it may damage the harvest. In this paper, a soft robotic three-fingered gripper is presented. It was designed and analysed using the finite element method. Each finger is made of silicone rubber. The shape of the finger is designed so that it is capable of handling spherical shaped objects, such as tomatoes or oranges. When holding a tomato, the fingers apply the contact force. The fingers are actuated pneumatically and the force applied is also controlled by a micro controller. The pressure inside the air chamber of the finger is in the range of 0- 95 kPa. Force sensors are attached to the end of each finger to provide force feedback. Then, the holding force is adjusted and applied to the surface of the tomato. The gripper can successfully grasp tomatoes with a force less than the bio-yield of the tomatoes 2.57 N.