Relevant bibliographies by topics / Sn-Zn eutectic alloy

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Academic literature on the topic 'Sn-Zn eutectic alloy'

Author: Grafiati
Published: 6 September 2023

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Journal articles on the topic "Sn-Zn eutectic alloy"

1

Yen, Yee Wen, Yu Pin Hsieh, Wan Ching Chen, and Chien Chung Jao. "Isothermal Section of the Sn-Fe-Zn Ternary System at 270°C." Applied Mechanics and Materials 284-287 (January 2013): 152–57. http://dx.doi.org/10.4028/www.scientific.net/amm.284-287.152.

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With a relatively low liquidus temperature, the eutectic Sn-Zn alloy is suitable replacement for conventional eutectic Sn-Pb solder in the electronic industry. One of the most important materials as a lead-frame is Fe-42Ni alloy (Alloy 42) in the microelectronic packaging. The Sn-Fe-Zn ternary phase diagram is a powerful and useful tool to understand the interfacial reactions between Sn-Zn alloy and Alloy 42 substrate (Fe-rich alloy). The isothermal section of the Sn-Fe-Zn ternary system was experimentally investigated at 270oC in this study. Ternary Sn-Fe-Zn alloys were prepared and annealed at 270 oC to determine the isothermal section of the Sn-Fe-Zn ternary system. The experimental results revealed that no ternary intermetallic compound was formed, and noticeable Zn solubility was observed in the FeSn2 phase. The isothermal section of the Sn-Fe-Zn ternary system consists of nine single-phase areas, thirteen two-phase areas, and seven tie-triangles at 270 oC
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Gerhátová, Žaneta, Paulína Babincová, Marián Drienovský, Matej Pašák, Ivona Černičková, Libor Ďuriška, Róbert Havlík, and Marián Palcut. "Microstructure and Corrosion Behavior of Sn–Zn Alloys." Materials 15, no. 20 (October 16, 2022): 7210. http://dx.doi.org/10.3390/ma15207210.

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In the present work, the microstructure, phase constitution, and corrosion behavior of binary Sn–xZn alloys (x = 5, 9 and 15 wt.%) were investigated. The alloys were prepared by induction melting of Sn and Zn lumps in argon. After melting, the alloys were solidified to form cast cylinders. The Sn–9Zn alloy had a eutectic microstructure. The Sn–5Zn and Sn–15Zn alloys were composed of dendritic (Sn) or (Zn) and eutectic. The corrosion behavior of the Sn–Zn alloys was studied in aqueous HCl (1 wt.%) and NaCl (3.5 wt.%) solutions at room temperature. Corrosion potentials and corrosion rates in HCl were significantly higher compared to NaCl. The corrosion of the binary Sn–Zn alloys was found to take place by a galvanic mechanism. The chemical composition of the corrosion products formed on the Sn–Zn alloys changed with the Zn weight fraction. Alloys with a higher concentration of Zn (Sn–9Zn, Sn–15Zn) formed corrosion products rich in Zn. The Zn-rich corrosion products were prone to spallation. The corrosion rate in the HCl solution decreased with decreasing weight fraction of Zn. The Sn–5Zn alloy had the lowest corrosion rate. The corrosion resistance in HCl could be considerably improved by reducing the proportion of zinc in Sn–Zn alloys.
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Alam, S. N., Prerna Mishra, and Rajnish Kumar. "Effect of Ag on Sn–Cu and Sn–Zn lead free solders." Materials Science-Poland 33, no. 2 (June 1, 2015): 317–30. http://dx.doi.org/10.1515/msp-2015-0048.

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AbstractLead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.
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Figueroa, I. A., O. Novelo-Peralta, M. A. Suárez, and G. A. Lara-Rodríguez. "Analysis of the microstructural evolution and solidification behaviour of Sn-9 wt% Zn alloy with small additions of Mg." Journal of Mining and Metallurgy, Section B: Metallurgy 49, no. 3 (2013): 293–97. http://dx.doi.org/10.2298/jmmb120321031f.

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The microstructure, solidification behaviour and hardness of Sn-9Zn-xMg (where x = 0, 0.5, 2.5 and 5 wt%) alloys were studied. The addition of 0.5 wt% did show a clear effect on the microstructure, producing three distinctive zones: a) fine eutectic structure b) coarse eutectic structure composed by large needles of Zn dispersed into a b-Sn matrix and c) small particles of the intermetallic Mg2Sn. The further additions Mg provoked that the fine eutectic structure disappeared giving place to the formation a coarse eutectic structure, large particles of Mg2Sn and Zn-rich needles. The hardness of the alloys increased with the additions of Mg. Similarly, the additions of Mg steadily drop the eutectic temperature, from 196.5?C for the binary base alloy to 180?C for the alloy with 5 wt% Mg. The low temperature achieved in this alloy is very close to the eutectic Sn-Pb alloy (183?C), thus it could be a plausible substitute of the classical Pb-containing solder alloys.
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5

Lin, Kwang-Lung, and Li-Min Sun. "Electrodeposition of eutectic Sn–Zn alloy by pulse plating." Journal of Materials Research 18, no. 9 (September 2003): 2203–7. http://dx.doi.org/10.1557/jmr.2003.0307.

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A uniform deposition of a Sn–Zn alloy deposit was achieved by pulse plating. Apparently, the relative composition of Sn and Zn in the deposit was affected by the bath compositions and pulse condition. A pulse-plating condition of 99.9 ms on-time and 1.0 ms off-time gave rise to a eutectic Sn–Zn deposit, with a eutectic temperature of 198.8 °C (as analyzed by differential scanning calorimetry) and a uniform composition distribution across the deposit. A mechanism for explaining the pulse-deposition behavior of the Sn–Zn eutectic deposit was proposed. A longer off-time period, 99.9 ms versus 0.1 ms, resulted in a nodular, yet thinner deposit.
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6

Chen, Kang I., Shou Chang Cheng, and Chin Hsiang Cheng. "The Effects of Small Additions Ga and Al on the Microstructure and Tensile Properties of Sn-Zn Based Lead-Free Solders." Advanced Materials Research 800 (September 2013): 265–70. http://dx.doi.org/10.4028/www.scientific.net/amr.800.265.

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The melting temperature, microstructures, and mechanical properties of the Sn-Zn-0.5Ag-0.5Ga, Sn-Zn-0.5Ag-0.45Al and Sn-Zn-0.5Ga-0.45Al lead-free solders were investigated. The results indicate that the addition of 0.5 wt% Ag to the Sn-Zn based alloys destroy the eutectic structure and results in the formation of Ag-Zn compound and hypoeutectic structure. The variation in the microstructure lowers the UTS. By the addition of Al the UTS and elongation of the 0.5Ag-0.45Al alloy can be decreased due to the Al diffused to the interface of the Ag-Zn compound/Sn-Zn eutectic structure to form Al-Zn compound. The 0.5Ga-0.45Al alloy shows a typical eutectic structure with the light contract β-Sn and the darker needle-like phase, as well as a small amount of Al-Zn phase with a near diamond shape. Gallium uniformly distributes in the Sn matrix and Zn rich phases. The 0.5Ga-0.45Al solder had the highest UTS and elongation, while 0.5Ag-0.45Al had the lowest UTS and elongation. The results indicate that Ga and Al exhibits prominent influence on the microstructure as well as the mechanical properties of the solders.
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Chen, Fang, Yun Fei Du, Rong Chang Zeng, Gui Sheng Gan, and Chang Hua Du. "Thermodynamics of Oxidation on Pb-Free Solders at Elevated Temperature." Materials Science Forum 610-613 (January 2009): 526–30. http://dx.doi.org/10.4028/www.scientific.net/msf.610-613.526.

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Based on the available thermodynamic and phase equilibria data, the thermodynamic criteria for oxidation in tin-based lead-free solders under soldering condition was deduced. The dependence of Gibbs free energy on temperature in Pb-free solder oxidation reaction was calculated by applying MATLAB program. The characteristics of oxidation reaction of a varity of solder alloy systems such as Sn-Ag, Sn-Cu, Sn-Sb, Sn-Zn, Sn-Ag-Cu and Sn-Pb eutectic alloys at elevated temperature were analyzed. The results suggested that zinc preferentially oxidized in Sn-Zn solder alloys in the elevated temperature state, while tin preferentially oxidized in the other alloys. The oxidation potential of the Sn-Zn eutectic alloys was higher than that of the pure tin at elevated temperature, whereas the oxidation potentials of Sn-Ag, Sn-Cu, Sn-Sb and Sn-Ag-Cu eutectic alloys were approxiately equal to that of the pure tin. All tin-based Pb-free solder alloys more easily oxidized than the Sn-Pb solder alloys. Oxidizability of these alloys followed in a decreasing order: Sn-Zn＞Sn-Sb＞Sn-Cu＞Sn-Ag＞Sn-Ag-Cu＞Sn-Pb.
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Manasijević, Dragan, Ljubiša Balanović, Vladan Ćosović, Duško Minić, Milena Premović, Milan Gorgievski, Uroš Stamenković, and Nadežda Talijan. "Thermal characterization of the In–Sn–Zn eutectic alloy." Metallurgical and Materials Engineering 25, no. 04 (January 14, 2020): 325–34. http://dx.doi.org/10.30544/456.

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Thermal properties, including melting temperature, latent heat of melting, specific heat capacity and thermal conductivity, of a low-melting In–Sn–Zn eutectic alloy were investigated in this work. The In–Sn–Zn eutectic alloy with nominal composition 52.7In-44.9Sn-2.4Zn (at.%) was prepared by the melting of pure metals under an argon atmosphere. The conducted assessment consisted of both theoretical and experimental approaches. Differential scanning calorimetry (DSC) was used for the measurement of melting temperature and latent heat, and the obtained results were compared with the results of thermodynamic calculations. The measured melting temperature and the latent heat of melting for the In–Sn–Zn eutectic alloy are 106.5±0.1 °C and 28.3±0.1 Jg-1, respectively. Thermal diffusivity and thermal conductivity of the In–Sn–Zn eutectic alloy were studied by the xenon-flash method. The determined thermal conductivity of the investigated eutectic alloy at 25 °C is 42.2±3.4 Wm-1K-1. Apart from providing insight into the possibility for application of the investigated alloy as the metallic phase-change material, the obtained values of thermal properties can also be utilized as input parameters for various simulation processes such as casting and soldering.
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9

Fathy, N. "Interfacial Microstructure and Bonding Area of Sn-based Alloy-GG25 Gray Iron Bimetallic Material Using Flux, Sn, and Sn-Zn Interlayer Compound Casting." Engineering, Technology & Applied Science Research 12, no. 2 (April 9, 2022): 8416–20. http://dx.doi.org/10.48084/etasr.4804.

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A bimetallic casting consisting of GG25 gray iron substrate and Sn-based alloy using the liquid-solid technique has been studied in this paper. Three different pretreatment processes of gray iron surface substrates including flux only, flux and Sn powder, and flux and Sn-8.8% Zn powder eutectic alloy surface treatment were adopted for the aim of improving the quality of tinning, the interfacial structure, and the bonding area of the Sn-based alloy/gray iron bimetallic composite in order to promote the bonding quality of bimetallic castings. Microstructure characterization on the bonding interface was conducted. The novel tinning material for gray cast iron substrate comprising of Sn-8.8% Zn eutectic alloy powder in combination with flux interlayer improved the bonding area, the interfacial bimetal structure, and the shear stress. This improvement is due to the higher interface reaction of Zn with Fe that leads to the formation of a very thin layer of Fe-Zn and Fe-Sn intermetallic phases.
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10

Dobosz, Alexandra, Torben Daeneke, Ali Zavabeti, Bao Yue Zhang, Rebecca Orrell-Trigg, Kourosh Kalantar-Zadeh, Anna Wójcik, Wojciech Maziarz, and Tomasz Gancarz. "Investigation of the surface of Ga–Sn–Zn eutectic alloy by the characterisation of oxide nanofilms obtained by the touch-printing method." Nanomaterials 9, no. 2 (February 9, 2019): 235. http://dx.doi.org/10.3390/nano9020235.

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Ga–Sn–Zn eutectic alloy is a non-toxic liquid metal alloy which could be used in a multitude of applications, including as a heat transfer agent, in gas sensing, and in medicine. Alloys containing gallium readily oxidise in air, forming a thin oxide layer that influences the properties of liquid metals and which has not been studied. In this study, the oxide layer formed on Ga–Sn–Zn alloy was transferred at room temperature onto three substrates—quartz, glass and silicon. The contact angle between the liquid alloy and different substrates was determined. The obtained thin oxide films were characterised using atomic force microscopy, X-ray photon spectroscopy, and optical and transmission electron microscopy. The contact angle does not influence the deposition of the layers. It was determined that it is possible to obtain nanometric oxide layers of a few micrometres in size. The chemical composition was determined by XPS and EDS independently, and showed that the oxide layer contains about 90 atom % of gallium with some additions of tin and zinc. The oxides obtained from the eutectic Ga–Sn–Zn liquid alloys appear to be nanocrystalline.
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Book chapters on the topic "Sn-Zn eutectic alloy"

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Kociubczyk, Alex Iván, Roberto Rozicki, Verónica Liliana Scheiber, and Alicia Esther Ares. "Solidification and Evaluation of Thermal Parameters of Sn-Zn Eutectic Alloys Horizontally Solidified." In EPD Congress 2016, 97–104. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-48111-1_11.

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Kociubczyk, Alex Iv´n, Roberto Rozicki, Verónica Liliana Scheiber, and Alicia Esther Ares. "Solidification and Evaluation of Thermal Parameters of Sn-Zn Eutectic Alloys Horizontally Solidified." In 2016 EPD Congress, 97–104. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2016. http://dx.doi.org/10.1002/9781119274742.ch11.

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Kaneko, Y., A. Vinogradov, K. Kitagawa, and S. Hashimoto. "Cyclic Stress-Strain Response of Pb-Sn and Zn-Al Eutectic Alloys Fine-Grained by Equal Channel Angular Pressing." In Investigations and Applications of Severe Plastic Deformation, 289–95. Dordrecht: Springer Netherlands, 2000. http://dx.doi.org/10.1007/978-94-011-4062-1_37.

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Manilevich, F., Yu Pirskyy, A. Kutsyi, V. Berezovets, and V. Yartys. "Activated aluminum for hydrogen generation from water." In HYDROGEN BASED ENERGY STORAGE: STATUS AND RECENT DEVELOPMENTS, 81–93. Institute for Problems in Materials Science, 2021. http://dx.doi.org/10.15407/materials2021.081.

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Al-based alloys and mechanochemically activated aluminum powders were prepared in this study, and the regularities of their hydrolysis reaction with water were studied. Aluminum alloys were prepared by melting aluminum with additions of Ga–In–Sn eutectic (5 wt.%), bismuth (3 wt.%), antimony (3 wt.%), or zinc (3 wt.%). The temperature-dependent kinetics of their hydrolysis in a temperature range 25–70 °C was studied by using a volumetric technique. The most efficient activation of the hydrolysis process was achieved for the Al–Ga– In–Sn-Zn alloy, particularly at low temperatures (5 and 25° C). The addition of bismuth to the Al–Ga–In–Sn alloy significantly decreases the hydrolysis rate, whereas the addition of antimony has only a weak effect on the process, despite the fact that the standard electrode potentials of bismuth and antimony have rather close values. Commercially available aluminum PA-4 and ASD-1 powders were mechanochemically activated by Ga–In–Sn or Ga–In–Sn–Zn eutectic alloys (5 wt.%) and graphite (1–3 wt.%) in a mixer type ball mill. Subsequently, they were pressed (P = 4 MPa) into the pellets, which were used to generate hydrogen from water via the hydrolysis process. X-ray diffraction study of the milled PA-4 powder revealed the presence of four phases, including aluminum, graphite, and two In–Sn intermetallic compounds (In3Sn and In1–xSnx, were x ≈ 0.04). The quantitative analysis by EDX showed a uniform distribution of the activating additives over the pellet surface, while the graphite was partly aggregated. Studies on the hydrolysis kinetics when utilizing Al-based pellets demonstrated that the process readily proceeds at temperatures ≥ 5° C. At the same time, the efficiency of hydrogen generation depends on the amount of the added graphite, particle size of aluminum powders, duration and medium of their mechanochemical treatment, and the hydrolysis temperature.
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Conference papers on the topic "Sn-Zn eutectic alloy"

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Zhou, Shiqi, Yu-An Shen, Tiffani Uresti, Vasanth Shunmugasamy, Bilal Mansoor, and Hiroshi Nishikawa. "Effects of In and Zn Double Addition on Eutectic Sn-58Bi Alloy." In 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). IEEE, 2019. http://dx.doi.org/10.1109/ectc.2019.00169.

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Maltsev, Dmitry S., Vladimir A. Volkovich, Leonid F. Yamshchikov, and Andrey V. Chukin. "Thermodynamic properties of gadolinium in Ga–Sn and Ga–Zn eutectic based alloys." In PHYSICS, TECHNOLOGIES AND INNOVATION (PTI-2016): Proceedings of the III International Young Researchers’ Conference. Author(s), 2016. http://dx.doi.org/10.1063/1.4962596.

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