Journal articles: 'Sintering of silver powder'

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Li, Wei, Chunxiu Yu, Yunkai Wang, Yuan Yao, Xianglei Yu, Chuan Zuo, and Yang Yu. "Experimental Investigation of Effect of Flake Silver Powder Content on Sintering Structure and Properties of Front Silver Paste of Silicon Solar Cell." Materials 15, no. 20 (October 13, 2022): 7142. http://dx.doi.org/10.3390/ma15207142.

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Optimizing the performance of front silver paste is of great significance in improving the efficiency of the photoelectric conversion of crystalline silicon solar cells. As a conductive functional phase of silver paste, the structure and performance of silver powder have an important influence on the sintering process of silver paste and the conductivity of silver electrodes. Because of their two−dimensional structure, flake silver powders can effectively increase the contact area with other silver powders and silicon cells before sintering. Additionally, flake silver particles have higher surface energy and sintering activity than spherical silver particles of the same particle size. However, recent research has mainly focused on the influence of the particle size of silver powder. This paper fills the research gap regarding the morphology of silver powders and clarifies the influence of flake silver powders on the performance of silver paste. The influence of the ratio of spherical silver powder to flake silver powder in silver paste on the sheet resistance, adhesion, and specific contact resistivity of silver film after sintering at 800 °C was studied, and the optimal ratio was determined according to a cross−sectional contact picture of the silver film. The results showed that with the increase in the mass fraction of the flake silver powder, the sheet resistance of the sintered silver film gradually increased, the adhesion first increased and then decreased, and the specific contact resistance first decreased and then increased. When the flake silver powder content was 0%, the minimum sheet resistance of the silver film was 2.41 m Ω/£. When the flake silver powder content was 30%, the maximum adhesion of the silver film was 6.07 N. When the flake silver powder content was 50%, the minimum specific contact resistivity of the silver film was 0.25 Ω·cm2. In conclusion, when the flake silver powder content was 30%, the comprehensive performance of the silver film was the best.

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Fan, Mao Yan, Guo You Gan, Jian Hong Yi, Ji Kang Yan, Jing Hong Du, Jia Min Zhang, Yi Chun Liu, and Xin Xin He. "Effects of Na-Ca System Glass Powder on Properties of Silver Paste." Advanced Materials Research 833 (November 2013): 295–300. http://dx.doi.org/10.4028/www.scientific.net/amr.833.295.

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The glass powder as a binder phase in the silver paste mainly plays the role of binding. The composition, content and particle size of the glass powder have significant effects on the properties of the silver paste. In this paper, the effects of the sintering temperature, holding time, glass powder content and glass powder size on the adhesion and square resistance of the silver film were studied. The research results showed that when the glass powder content was 6%(in mass) of the total silver paste, the sintering temperature was 680°C, the holding time was 7 minutes and the glass powder size was 2.47μm, the silver paste can get good properties. The adhesion strength and square resistance of the silver film were respectively 2.5 N/mm2 and 14 mΩ /.

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Pathak, L. C., S. K. Mishra (Pathak), and S. Srikanth. "Sintering characteristics of Y–Ba–Cu oxide–Agx superconductors under argon atmosphere." Journal of Materials Research 17, no. 4 (April 2002): 895–900. http://dx.doi.org/10.1557/jmr.2002.0130.

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Sintering studies on Y–Ba–Cu oxide (YBCO)–Agx (x = 0, 0.6, and 1.0 mol) powder were carried out in argon atmosphere to understand the role of silver addition on the densification behavior of these materials. The increase of sintered densities of the compacts with silver addition in argon atmosphere contradicted our earlier observation on sintering of YBCO–Agx powder compacts in air, where the densities decreased for x > 0.6. Thermogravimetric (TG) studies under argon atmosphere indicate a continuous decrease of mass on heating suggesting an enhanced rate of oxygen removal from the YBCO matrix that facilitated the sintering in argon atmosphere. Sintering studies of YBCO–Agx powder compacts in argon in conjunction with earlier observations in air has substantiated our claim that high-temperature oxygen desorption by the silver from the YBCO matrix to the sintering atmosphere controls the rate of densification for these superconducting composites. However, the apparent activation energies for sintering suggest that the sintering process is controlled by yttrium ion diffusion along bulk and grain boundaries.

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Durairaj, Rajkumar, M. Das, E. Morris, and Satesh Namasivayam. "Investigation on the Morphology of Sintered Silver Nanomaterial for Electronic Packaging Application." Advanced Materials Research 832 (November 2013): 21–26. http://dx.doi.org/10.4028/www.scientific.net/amr.832.21.

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Silver nanoparticles are seen as a possible replacement for high temperature solders containing 90-95 wt.% Pb, which is widely used in various applications e.g. automotives. These high temperature solders have been exempted from the Restriction of Hazardous Substances (RoHS) Directive due to very limited drop-in replacement for the high temperature solders. Although the effect of sintering temperature of silver nanoparticles has been studied, the mechanism involved in the changes in the morphology of the particles and interfacial reaction with the substrate as a function of sintering temperature must be understood. In this study the effect of sintering temperature on the morpohology of Ag nanoparticles is discussed. The Scanning Electron Microscopy (SEM) analysis was used to analyze the changes in morphology of silver particles agglomerates with sintering temperatures. Results showed necking of the nanosilver powder, which indicated the occurrence of sintering through grain boundary diffusion process. Meanwhile, the micro-silver powder showed agglomeration of particles but no necking was observed. The study has shown that the Ag agglomerates was observed to undergo various changes to the particle morphology with different sintering temperatures.

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Biguereau, E., D. Bouvard, J. M. Chaix, and S. Roure. "On the swelling of silver powder during sintering." Powder Metallurgy 59, no. 5 (October 19, 2016): 394–400. http://dx.doi.org/10.1080/00325899.2016.1250037.

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Hutsch, Thomas, Thomas Schubert, Thomas Weißgärber, and Bernd Kieback. "Silver/Diamond Composite Material - Powder Metallurgical Route and Thermo-Physical Properties." Key Engineering Materials 742 (July 2017): 151–57. http://dx.doi.org/10.4028/www.scientific.net/kem.742.151.

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To meet the need of high-performance thermal management materials in the field of electronic applications, heat sink materials reinforced with synthetic diamonds have been prepared via powder metallurgy. A matrix of a silver alloy with a silicon content of 0.45 wt.% was chosen out of the prediction of the thickness of a final carbide layer of about 180 nm. The volume content of the diamonds and the diamond size were kept constant. The mixed powders were consolidated by Spark Plasma Sintering (SPS) using different sintering temperatures between 800 and 870 °C with a holding time of 30 min. The maximum thermal conductivity of 680 W/(mK) measured at room temperature and 620 W/(mK) at 275 °C was obtained at 810 °C sintering temperature. The degradation of the most promising sample after one thermal cycle up to 275 °C was determined below 1 percent of the value after sintering.

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Jiao, Ruo Bing, Tao Wu, Bo Ping Zhang, and Liang Liang Li. "Firing and Contact Resistivity of Ag₂O-Aided Pb-Free Silver Paste for Crystalline Silicon Solar Cells." Materials Science Forum 847 (March 2016): 123–30. http://dx.doi.org/10.4028/www.scientific.net/msf.847.123.

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The silver pastes containing Ag2O powder, Ag powder, α-terpineol, ethyl-cellulose and Pb-free glass were synthesized for crystalline silicon (c-Si) solar cells. It was found that α-terpineol assisted the decomposition of Ag2O powder and effectively lowered the decomposition temperature of Ag2O. Ag nanoparticles were produced during the decomposition of Ag2O, which helped to reduce the sintering temperature of the silver pastes. The Ag2O-aided silver pastes were fired on polycrystalline silicon solar cells at various temperatures, and large plate-shaped Ag crystallites appeared at the interfaces between the sintered pastes and the emitter, which ensured a good electrical contact. The contact resistivity of Ag2O-aided silver paste with an optimal ratio of Ag2O to Ag was lower than that of the paste with pure Ag powder. The lowest contact resistivity of Ag2O-aided Pb-free silver pastes sintered at 800°C was 0.029 Ω⋅cm2, which was close to that of commercial silver paste that contained Pb-based glass (0.026 Ω⋅cm2). The experimental data demonstrated that the addition of Ag2O reduced the contact resistance and promoted the sintering of Pb-free silver pastes, and Ag2O-aided Pb-free silver paste could be a promising candidate used for front-contact electrode of c-Si solar cells.

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Dubnika, Arita, Dagnija Loca, Aigars Reinis, Maris Kodols, and Liga Berzina-Cimdina. "Impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite." Pure and Applied Chemistry 85, no. 2 (January 12, 2013): 453–62. http://dx.doi.org/10.1351/pac-con-12-08-12.

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In the present study, the impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite (HAp/Ag) samples was investigated. HAp/Ag containing 0.2 and 1.2 % silver was prepared using a modified wet chemical precipitation method. The surface morphology and inner structure of the sintered samples were discussed. X-ray powder diffraction (XRD) and scanning electron microscopy (SEM) studies showed that, after the sintering process, HAp/Ag contained a silver oxide phase, which was not observed in raw materials. Phase composition changes at different sintering temperatures were studied, and it was found that silver oxide undergoes phase changes during the sintering process. In vitro antibacterial properties approved the excellent antimicrobial activity of HAp/Ag against the bacterial strains Staphylococcus epidermidis and Pseudomonas aeruginosa. The HAp/Ag sample with 1.2 % silver content, sintered at 1150 °C, showed the highest antibacterial activity.

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Okada, Atsuyuki, and Takashi Ogihara. "Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate." Key Engineering Materials 421-422 (December 2009): 289–92. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.289.

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Several types of Ag powder were used as electrode paste for a multilayer ceramic substrate. The shrinkage behavior of the silver powders was investigated during the sintering. Bending and cracking were frequently observed on the substrate when coarse powders that show a broad size distribution and aggregation were used. The shrinkage curve of the Ag paste obtained by spray pyrolysis agreed well with that of the substrate. Furthermore, the electrical properties of the Ag paste were also determined. The resistivity of a silver electrode sintered at 900°C was about 2.00×10-6 Ω･cm.

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Yan, Fang Chun, Yuan Teng, Ji Kang Yan, Jing Hong Du, Jian Hong Yi, Jian Yang, and Guo You Gan. "Effects of Paste Composition and Sintering Process on Performance of Silver Paste for Silicon Solar Cells." Materials Science Forum 849 (March 2016): 852–59. http://dx.doi.org/10.4028/www.scientific.net/msf.849.852.

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In order to study the effects of composition ratio of silver paste and the sintering process on the properties of the silver film after sintering, the effects of different ratios of silver powders, glass powders and organic carrier in silver paste and different sintering temperatures and sintering time on the adhesion force and square resistance of the silver film were studied. The morphology of the sintered silver film was observed by SEM. The results showed that the silver film sintered at 760°C for 6 seconds had better properties after sintering when the ratio of silver powders, glass powders and organic carrier in silver paste was 80:5:15 and the silver powders was composed of spherical silver powders and flake silver powders at the ratio of 94:6. The adhesion force and square resistance of the silver film were 8.25 N and 3.47mΩ /□, respectively.

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Sharipova, A. F., S. G. Psakhie, I. Gotman, M. I. Lerner, A. S. Lozhkomoev, and E. Y. Gutmanas. "Cold sintering of Fe-Ag and Fe-Cu by consolidation in high pressure gradient." Izvestiya Vuzov Tsvetnaya Metallurgiya (Proceedings of Higher Schools Nonferrous Metallurgy, no. 1 (February 22, 2019): 67–74. http://dx.doi.org/10.17073/0021-3438-2019-1-67-74.

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The paper states the results of obtaining Fe—Ag and Fe—Cu dense nanocomposites from composite powders consolidated by cold sintering in the high pressure gradient, as well as from nanosize powders of silver (Ag), iron (Fe) and copper (Cu). The results of mechanical tests conducted on Fe—Ag and Fe—Cu nanocomposites are provided. Nanocomposite powders were obtained by high energy attrition milling of carbonyl iron (Fe) micron scale powder and nanosize silver oxide powder (Ag2O), as well as iron and cuprous oxide (Cu2O) nanopowders. High resolution scanning electron microscopy was used to study the microstructure. Compacts featuring approximately 70 % of full density were annealed in hydrogen atmosphere to reduce silver and cuprous oxides to metals and to remove oxide layers from the surface of iron powder particles. This was followed by cold sintering — consolidation under high pressure at a room temperature. The data on specimen density dependence on pressure in the range of 0,25 —3,0 GPa were obtained. Densities were above 95 % of the full density for all nanocomposites, and close to 100 % of the full density under 3,0 GPa for Ag and Cu powders. High mechanical properties in three-point bending and compression were observed for all nanocomposites. It was found that mechanical properties of nanocomposites are substantially higher as compared with composites obtained from micron scale powders. Higher ductility was observed in Fe—Ag and Fe—Cu nanocomposites as compared with specimens obtained from nanostructured Fe.

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Sarkar, Asok K., I. Maartense, and T. L. Peterson. "Limit of superconductivity in silver/superconductor metal-matrix composites prepared with Bi–Pb–Sr–Ca–Cu–O ceramic powders." Journal of Materials Research 7, no. 7 (July 1992): 1672–78. http://dx.doi.org/10.1557/jmr.1992.1672.

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Superconducting composite samples were prepared by sintering a mixture of metallic silver and Bi(Pb)–Sr–Ca–Cu–O powder in air. For Ag contents between 0 and ∼15 vol. %, the bulk critical temperature was depressed as much as 40 K, and the relative proportion of the 2223 phase with respect to the 2212 phase was decreased, compared to the pure sample. However, as the Ag content was increased to between 19 and 70 vol. %, critical temperatures above 100 K were measured by transport and ac susceptibility techniques, and the relative proportions of the phases were restored to that of the pure sample. The limit of bulk superconductivity was reached at 73 vol. % Ag where the bulk critical temperature was ∼85 K. For higher Ag contents bulk superconductivity was not observed. Our results also show that sintering in air of silver-clad tapes containing Bi(Pb)–Sr–Ca–Cu–O powder, either by itself or with silver powder, need not be detrimental to the final superconductive properties.

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Al-Rawy, Wehad A., and Emad S. Al-Hassani. "Effect of Adding Silver Element and Zirconia Ceramic on Corrosion Behavior and Mechanical Properties of Pure Titanium." Engineering and Technology Journal 39, no. 5A (May 25, 2021): 674–94. http://dx.doi.org/10.30684/etj.v39i5a.1087.

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In this research, all the samples are prepared using the powder metallurgy technique by adding silver element and Zirconia ceramic material to the commercially pure titanium at a different weight percent of (10, 20 and 30) to investigate the effect of adding these materials to the CP-Ti on corrosion behavior and mechanical properties. There are two sets of each type of alloys Ti-Ag and Ti ZrO2. The Preparation process was by Weighing, Mixing and Homogenizing Powders by Ball Mill, compacting at 4 tons for 1 min. and Sintering at 700 and 900 °C for 2 hrs. under a controlled atmosphere. The corrosion results showed a good corrosion resistance increases with increasing the silver content as the corrosion rate would be the best in (30% Ag) content with(0.091 mpy) at sintering temperature of 700 °C. And with a sintering temperature of 900 °C, the best result was with (30% Ag) with (0.059) mpy. In the Ti-ZrO2 alloys, the best result was with the zirconia content of (30%ZrO2) when cooled in the air with (1.347) mpy at sintering temperature of 700 °C, this results obtained in Ringer’s solution. And microstructures analysis stated that at the silver and the Zirconia content of (10-20 wt%) single phase of (α- Ti alloy), as the silver and Zirconia content increased to (30% wt), in addition to (α-phase), (Ti2Ag) intermetallic compound developed in the silver alloy microstructure and (TiZr)3O intermetallic compound developed in the microstructure of Ti- Zirconia composites and the hardness test result best hardness of...

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Jia, Dongming, Junbing Ma, Xueping Gan, Jingmei Tao, Ming Xie, Jianhong Yi, and Yichun Liu. "A Comparison Study of Ag Composites Prepared by Spark Plasma Sintering and Hot Pressing with Silver-Coated CNTs as the Reinforcements." Materials 12, no. 12 (June 17, 2019): 1949. http://dx.doi.org/10.3390/ma12121949.

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In this study, carbon nanotube-reinforced silver composites (CNT/Ag) were prepared by the powder metallurgy process via spark plasma sintering (SPS) and hot pressing sintering (HP) with composite powders through an improved electroless plating method assisted by ultrasonic spray atomization. The dispersion of CNTs was effectively improved by ultrasonic spray atomization, and uniform silver layers were deposited on the surface of CNTs by electroless deposition. The property testing results showed significant improvements of the electrical conductivity, hardness, and tensile strength in the samples prepared by SPS, as compared to their HP sintered counterparts. When the volume fraction of CNTs reached 2.5%, the tensile strength reached a maximum value of 221 MPa, which was more than twice that of the pure silver samples. The structural analysis indicated different degrees of CNT agglomeration and matrix mean grain sizes in the composites prepared by SPS and HP, which are responsible for the differences in properties.

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Zhang, Bao Lin, and Shun Hua Wu. "Low-Temperature Sintering Lead-Free Barium Titanate-Based X7P Ceramics with Bi₂O₃ Dopant and ZnO–B₂O₃ Flux Agent." Advanced Materials Research 560-561 (August 2012): 886–91. http://dx.doi.org/10.4028/www.scientific.net/amr.560-561.886.

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The sintering temperature of BaTiO3 powder was reduced to 870°C due to the H3BO3-ZnO-Bi2O3 addition.Excellent densiﬁcation was achieved after sintering at 870°C for 15h. The low sintering temperature of newly developed capacitor materials allows a co-ﬁring with pure silver electrodes.The dielectric constant and the temperature stability of the dielectric constant satisﬁed the X7P requirements, which dielectric properties of were ε25°C≥ 2800, εr/εr25°C≤±10% (–55~125°C), tanδ≤1.5% (25°C).

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Zhu, Chunli, Xiaofen Fu, Xing Gao, and Haotian Kan. "Preparation of 3D printed silver nanocomposites and their antibacterial properties." E3S Web of Conferences 267 (2021): 02003. http://dx.doi.org/10.1051/e3sconf/202126702003.

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The 3D printed antibacterial polymer products were rapidly sintered to obtain by selective laser sintering with highly dispersed Nano-silver modified Kaolin powder and polyamide/polypropylene composite engineering material. The preparation method of polymer products not only shortens the preparation period, but also guarantees the precision and quality of the product as well as the slow-release function of the Nano-silver.

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Mosialek, M., M. Tatko, M. Dudek, E. Bielańska, and G. Mordarski. "Composite Ag-La0.6Sr0.4Co0.8Fe0.2O3-δ Cathode Material for Solid Oxide Fuel Cells, Preparation and Characteristic." Archives of Metallurgy and Materials 58, no. 4 (December 1, 2013): 1341–45. http://dx.doi.org/10.2478/amm-2013-0171.

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Abstract Composite cathodes Ag-La0.6Sr0.4Co0.2Fe0.8O3-δ were obtained by two different procedures. In the first procedure porous La0.6Sr0.4Co0.2Fe0.8O3-δ (LSCF) matrix was prepared by sintering the LSCF paste, the matrix was then saturated with AgNO3 solution and sintered again. Introduced silver crystalized in the form of 10 nm crystallites in the whole LSCF matrix. In the second procedure the paste of silver powder was deposited on the surface of electrolyte and dried. The layer of silver paste was then covered by a layer of the LSCF paste and sintered at 850°C. The following cells were tested: H2|Ni-Ce0.8Gd0.2O1.9|Ce0.8Sm0.2O1.9 LSCF|O2, H2|Ni-Ce0.8Gd0.2O1.9|Ce0.8Sm0.2O1.9|LSCF-Ag|O2 and H2|Ni-Ce0.8Gd0.2O1.9|Ce0.8Sm-O1.9|Ag|LSCF|O2. Introduction of silver interlayer between cathode and electrolyte increased output power by 18-28% whereas introduction of metallic silver into porous LSCF caused increase in power by 14-18%.

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Leżański, Jan, and Marcin Madej. "The Influence of Production Process Parameters on the Properties W-Ag, Mo-Ag Composites." Materials Science Forum 534-536 (January 2007): 1513–16. http://dx.doi.org/10.4028/www.scientific.net/msf.534-536.1513.

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Attempts have been made to describe the influence of production process parameters on the microstructure and properties of W - Ag and Mo - Ag composites. The compositions of powder mixtures are W + 30% Ag and Mo + 30%Ag. Silver additions assists densification during sintering by a liquid phase sintering process. The main goal of this work is to compare properties and microstructure of as-sintered and as-infiltrated composites.

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Patelka, Maciej, Nicholas Krasco, Sho Ikeda, Toshiyuki Sato, Miguel Goni, Elbara Ziade, and Aaron J. Schmidt. "Conductive Fusion Technology Advanced Die Attach Materials for High Power Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000051–55. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000051.

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Abstract High power semiconductor applications require a die attach material with high thermal conductivity to efficiently release the heat generated from these devices. Current die attach solutions such as eutectic solders and high thermal conductive silver epoxies and sintered silver adhesives have been industry standards, however may fall short in performance for high temperature or high stress applications. This presentation will focus on development of a reinforced, sintered silver die attach solution for high power semiconductor applications with focus on a pressure-less, low temperature sintering technology that offers high reliability for high temperature (250°C) applications. The electronic, optoelectronic, and semiconductor industries have the need for high performance adhesives, in particular, high power devices require low-stress, high thermal conductivity, thermally stable, and moisture resistant adhesives for the manufacture of high reliability devices. This paper introduces a new reinforced sintered silver adhesive based on the “resin-free” Conductive Fusion Technology. The high performance adhesive offers a robust solution for high temperature, high reliability applications. Conductive Fusion Technology consists of a high thermal conductivity silver component blended with a non-conductive, low-modulus powder component. The non-conductive powder component comprises an organically modified inorganic material that exhibits excellent thermal stability at temperatures exceeding 250°C. Properties of the sintered silver adhesive, such as storage modulus, can be modified by varying the content of the non-conductive component.

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Jin, Howard (Hwail), Kewei Xu, Loreto Naungayan, and Jose Quinones. "High Thermal Conductive Die Attach Paste Using Polymer and Micron Size Silver for Power Semiconductor Package." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000326–31. http://dx.doi.org/10.4071/isom-2016-wp41.

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Abstract Power semiconductor package manufactures and electronic device suppliers have been looking for Pb-free alternative to traditional high Pb solder die attach adhesives. Lead solders have high thermal conductivity, 30–50W/mK, and known process with some difficulties in high volume mass production such as void, bond line control, and requiring reducing atmosphere such as forming gas. Lead is now categorized as hazardous substance to human body and environment and its products are scheduled to be banned within a few years. Standard silver epoxy pastes and Electrically Conductive Adhesives (ECSs) are other forms of die attach adhesives but the thermal conductivity is not adequate for Power devices. Eutectic gold-tin solder (80Au20Sn) has 57W/mK but it is high cost material. Currently Silver sintering material has become popular for electronic device because it has high thermal conductivity (150~250W/mK) by using nano silver sintering. But it requires high bonding temperature and pressure. It makes brittle bonding structure and has limitation in die size due to high stress. New silver sintering material in this paper is composed of micron size silver and organic polymer. This technology overcomes all the limitations of conventional silver epoxy, eutectic gold thin solder and silver sintering product by using the unique design of polymer composition. This new silver sintering technology using polymer and micron size silver is a cost effective solution to replace Pb solder for power device and the thermal performance is almost same as nano silver sintering products. The application process is the same as standard silver epoxy and does not require new equipment. It is a cost effective drop in solution.

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Pan, Z. J., L. J. Wei, M. W. Zheng, J. T. Liang, M. G. Zhao, and Y. J. Liu. "A research on silver powder sinters for dilution refrigerator heat exchangers." IOP Conference Series: Materials Science and Engineering 1240, no. 1 (May 1, 2022): 012050. http://dx.doi.org/10.1088/1757-899x/1240/1/012050.

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Abstract Due to the Kapitza resistivity, a sharp deterioration of heat transfer occurs between solid and liquid in the heat exchanger of the dilution refrigerator at extremely low temperature. It is necessary to use silver powder sintered heat exchangers to optimize the interface heat transfer. A theoretical calculation of heat exchangers at extremely low temperature was carried out to analyze the influence of the Kapitza resistivity on heat transfer performance. Silver powder with different particle sizes of 80 nm, 200 nm and 500 nm were selected for the preparation of sinters. Their micro-scale sintering conditions, pore volumes and specific surface area were carefully presented. It can be concluded from the theoretical calculations and the experimental results that the 200 nm silver powder sinters can optimize the performance of dilution refrigerator heat exchanger with a large heat exchange area.

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Mansourirad, Nima, Mohammad Ardestani, and Reza Afshar. "Synthesis and characterization of Ag-8 %wt Cr2O3 composites prepared by different densification processes." Science of Sintering 50, no. 3 (2018): 323–35. http://dx.doi.org/10.2298/sos1803323m.

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A novel Ag-8 %wt Cr2O3 composite prepared via powder metallurgy route. Silver and chromium oxides were used as starting powders. The powder mixtures were mechanically milled by a SPEX high energy mill for 5 h. Based on the thermogravimetric analysis (TGA) and X-Ray Diffraction (XRD) results, the milled powders were calcined in an argon atmosphere at 550?C. During calcination, the silver oxide decomposed into silver. The results showed that the Heckel equation was the preferred one for description the cold compressibility of the powders. The calcined powders were consolidated by Press-Sinter-Repress (PSR), Press-Sinter-Repress-Anneal (PSRA) and Spark Plasma Sintering (SPS) processes. The Field Emission Scanning Electron Microscope (FESEM) investigations showed a nearly dense microstructure of the sintered samples. However, the hardness of the pressed-sintered-repressed samples was 81 Vickers which was the highest among the processed specimen. Furthermore, the flexural strength of the PSR and SPS processed samples were 231 and 255 MPa, respectively which were too higher than that of the annealed specimens. The results confirmed the effect of microstructural parameters such as Cr2O3 particle size and processing route on the mechanical properties of the sintered composites.

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Dudina, Dina, Alexander Matvienko, Anatoly Sidelnikov, Mikhail Legan, Vyacheslav Mali, Maksim Esikov, Alexander Anisimov, Pavel Gribov, and Vladimir Boldyrev. "Electric Current-Assisted Joining of Copper Plates Using Silver Formed by In-Situ Decomposition of Ag2C2O4." Metals 8, no. 7 (July 12, 2018): 538. http://dx.doi.org/10.3390/met8070538.

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Pulsed electric current can be used for the fast sintering of powders as well as joining of macroobjects. In this work, we brazed copper plates using a silver layer that was formed in situ by the decomposition of a silver oxalate Ag2C2O4 powder placed between the plates. Joining was conducted in the chamber of a Spark Plasma Sintering (SPS) facility with and without a graphite die. In the die-assisted tooling configuration, indirect heating of the assembly from the graphite die carrying electric current occurred until the brazing layer transformed into metallic silver. The passage of electric current through a Cu/Ag2C2O4/Cu stack placed between the electrodes without a die was possible because of the formation of Cu/Cu contacts in the areas free from the Ag2C2O4 particles. Joints that were formed in the die-assisted experiments showed a slightly higher shear strength (45 MPa) in comparison with joints formed without a die (41 MPa). The shear strength of the reference sample (obtained without a die), a stack of copper plates joined without any brazing layer, was only 31 MPa, which indicates a key role of the silver in producing strong bonding between the plates. This study shows that both die-assisted tooling configurations and those without a die can be used for the SPS brazing of materials by the oxalate-derived silver interlayer.

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Müller, Jonas, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Görlich, and Takatoshi Nishimura. "Silver Sintering of Packaged GaN-Devices on Printed Circuit Board." Journal of Microelectronics and Electronic Packaging 19, no. 1 (January 1, 2022): 18–24. http://dx.doi.org/10.4071/imaps.1675410.

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Abstract Despite the higher thermal conductivity and the higher lifetime offered by silver sintering technologies, most packaged GaN devices are attached using solders due to technological difficulties in the sintering process. In this work, a silver sintering process for a packaged GaN power transistor on a printed circuit board (PCB) was successfully developed. Different sintering paste types were examined regarding their suitability for this application. Electrical measurements, shear tests, and metallographic cross sections were used for the evaluation. Numerical analyses were used to study the internal stress distribution in the GaN package after sintering depending on the paste structure. In the final sintering process, a shear strength of 20 MPa for sintering at 15 MPa and 240°C, for 300 s with electrical functional devices could be obtained by using nanoscale sintering paste. The authors contribute this to the high initial stiffness of the silver layer, which is obtained much earlier in the sintering process compared with the stiffness of a microscale silver paste. This high initial stiffness counteracts the semiconductor device deflection from the applied sintering pressure and reduces the stresses inside the semiconductor.

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Buttay, Cyril, Amandine Masson, Jianfeng Li, Mark Johnson, Mihai Lazar, Christophe Raynaud, and Hervé Morel. "Die Attach of Power Devices Using Silver Sintering – Bonding Process Optimisation and Characterization." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000084–90. http://dx.doi.org/10.4071/hiten-paper7-cbuttay.

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Silver sintering is becoming an attractive alternative to soldering, especially for high temperature applications. Indeed, the increase in operating temperature requires new soldering alloys with even higher melting points. Silver sintering, on the contrary, is a solution which only require moderate (<300°C) process temperature. In this paper, we present the implementation of a die attach technique based on sintering of some silver paste, with a special focus on the practical considerations. A good quality bond can be achieved by paying attention to the assembly process.

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Yang, Wendong, Felix Hermerschmidt, Florian Mathies, and Emil J. W. List-Kratochvil. "Comparing low-temperature thermal and plasma sintering processes of a tailored silver particle-free ink." Journal of Materials Science: Materials in Electronics 32, no. 5 (February 5, 2021): 6312–22. http://dx.doi.org/10.1007/s10854-021-05347-1.

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AbstractSilver particle-free inks are under rapid development due to their unique properties. Currently, most of the developed silver particle-free inks contain multiple components. In addition to the necessary solvents and silver precursors, these inks also contain complexing agents, reducing agents, and various additives. While such complex compositions assure good stability and printability of the inks, they hamper the sintering process as excess time and energy are often required to remove residues from various compositions to ensure high conductivities of the printed structures. Thus, a simple ink system is expected. On the other hand, plasma sintering shows its sintering potential in treating silver particle-free inks, but is only employed for the sintering of silver nitrate or silver acetate-based inks. Consequently, developing new particle-free ink systems with simple compositions and exploring the potential of plasma sintering is very meaningful. In this work, a clear and transparent silver particle-free ink was formulated, which can be treated both by low-pressure argon plasma sintering and low-temperature thermal sintering (120–160 °C). The roles of 2-amino-2-methyl-1-propanol (AMP) in the ink formulation were investigated in detail, which not only acts as the solvent but also as the complexing agent for silver oxalate to lower the sintering temperature of the ink. The electrical performance of the formulated ink was examined for both sintering processes for different conditions. The thermal sintering resulted in a resistivity value of 24.3 μΩ·cm on glass substrates after treatment at 160 °C for 60 min, while the plasma sintering yielded a resistivity value of 29 μΩ·cm at 500 W for 30 min. Compared to thermal sintering, plasma sintering achieved a similar electrical performance, but with a more nonuniform film structure. The power, sintering time, and the pressure of argon are key factors responsible for the conductivity of the produced films. Nevertheless, both resistivity values do meet the minimal electrical requirements of most electronic applications.

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Lis, M., A. Wrona, J. Mazur, C. Dupont, M. Kamińska, D. Kopyto, and M. Kwarciński. "Fabrication And Properties Of Silver Based Multiwall Carbon Nanotube Composite Prepared By Spark Plasma Sintering Method." Archives of Metallurgy and Materials 60, no. 2 (June 1, 2015): 1351–55. http://dx.doi.org/10.1515/amm-2015-0129.

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Abstract The paper presents results of investigations of the obtained nanocomposite materials based on silver with addition of multiwall carbon nanotubes. The powder of carbon nanotubes content from 0.1 to 3 wt. % was produced by application of powder metallurgy methods, through mixing and high-energetic milling, and also chemical methods. Modification of carbon nanotubes included electroless deposition of silver particles on the carbon nanotube active surfaces and chemical reduction with strong reducing agent – sodium borohydride (NaBH4). The obtained powder mixtures were consolidated by SPS – Spark Plasma Sintering method. The formed composites were subjected to tests of relative density, electrical conductivity and electro-erosion properties. Detailed examinations of the structure with application of X-ray microanalysis, with consideration of carbon nanotubes distribution, were also carried out. The effect of manufacturing methods on properties of the obtained composites was observed.

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Han, Zhaohui, Lei Xu, Shenghui Guo, Qingtian Wu, Libo Zhang, and Jianhua Liu. "Study on the microwave sintering characteristics of spherical tin-silver alloy powder." Materials Research Express 6, no. 12 (March 20, 2020): 1265k7. http://dx.doi.org/10.1088/2053-1591/ab5e58.

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Hascoët, Stanislas, Cyril Buttay, Dominique Planson, Rodica Chiriac, and Amandine Masson. "Pressureless Silver Sintering Die-Attach for SiC Power Devices." Materials Science Forum 740-742 (January 2013): 851–54. http://dx.doi.org/10.4028/www.scientific.net/msf.740-742.851.

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Pressureless silver sintering is an interesting die-attach technique that could overcome the reliability limitations of the power electronic devices caused by their packaging. In this paper, we study the manufacturing parameters that affect the die attach: atmosphere, drying time, heating ramp rate, sintering temperature and duration. It is found that sintering under air gives better results, but causes the substrates to oxidize. Sintering under nitrogen keeps the surfaces oxide-free, at the cost of a weaker attach.

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Heuck, Nicolas, G. Palm, T. Sauerberg, A. Stranz, A. Waag, and Andrey Bakin. "SiC-Die-Attachment for High Temperature Applications." Materials Science Forum 645-648 (April 2010): 741–44. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.741.

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In this paper a die-attachment technology for high temperature applications based on the Low Temperature Joining Technique (LTJT) is presented. The present challenge is to fit the thermal expansion as well as the mechanical properties of the die-attach layer to the characteristics of chip and substrate. While the classic LTJT is based on sintering a sub-micron silver paste at temperatures between 150°C and 300°C to bond an electronic device to a substrate, the modified procedure employs a powder mixture consisting of silver powder and special filling powder material. Type and amount of the filling material is dependent on the application and the used substrates. Considering a low thermal expansion and high electrical as well as thermal conductivity we chose SiC, TiC, and BN as filling materials in this work.

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Eberstein, Markus, Marco Wenzel, Claudia Feller, Thomas Seuthe, and Frieder Gora. "Silver processing in thick film technology for power electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000018–24. http://dx.doi.org/10.4071/cicmt-2012-ta13.

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Processing of Ag-equipped thick film modules is still challenging due to well-known issues of warpage of Ag-containing LTCC substrates or undesired coloring of Ag-surrounding ceramics. To increase the workability of Ag based thick film modules, enhanced control over these effects is necessary. From the experimental background as well as the chemical and thermodynamic nature of the element Ag, conclusions regarding essential properties during Ag-high temperature processing, like initial oxidation, transport via the vapor and glassy phase, and reduction are discussed. Taking into consideration a possible occurrences of this phenomenas as activated/deactivaed dependent on sintering conditions, explanation of unwanted maufacturing results like LTCC staining, warpage, glass thinning and setter memory effects are possible. From a technical standpoint, there are roughly two temperature ranges of relevance for processing silver metalized thick film structures. Between approximately 300 °C and 700 °C fast transport mechanisms of silver through the gaseous phase take place. Control can be achieved via governing the silver manufacturing, oxygen partial pressure, organic composition, powder conditioning and temperature-time schedule. Above approximately 600 °C, slower transport mechanisms of silver through the glassy phase and possible reduction of Ag(I) become evident. These effects originate corresponding impacts on the sintering kinetics. Here, control can be achieved via governing the glass composition, redox potential and, again, temperature-time schedule.

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Shen, Zhenzhen, Aleksey Reiderman, and Casey Anude. "Pressure-less AgNP Sintering for High-power MCM Assembly for Extreme Environment Applications." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000342–48. http://dx.doi.org/10.4071/isom-2015-wp14.

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Silver nano-particle (AgNP) sintering has been a promising bonding material for high-temperature applications. There is an increasing demand for designs implemented as multi-chip module (MCM) in the high-temperature markets, like the oil and gas industry, primarily because of MCM's smaller size, higher-performance capability, and higher overall reliability when compared to traditional high Tg printed circuit boards. In this work, pressure-less AgNP sintering paste was used in the assembly of multi-chip modules. The assemblies included die-mounted on aluminum nitride and alumina substrates that were metallized with various thin and thick films. Sintered silver nano-particle attachments were also attempted for surface-mounted technology (SMT) chip components. Different assembly parameters such as bonding line thickness and sintering profiles were evaluated to discover the optimal assembly process window that would yield acceptable reliability for 250°C and higher ambient temperature applications. The assemblies were subjected to various tests including thermal cycling, high-ramp rate thermal shocks, and high-temperature storage tests. Shear strength measurements and analysis of the cross sections and fracture surfaces were performed to understand failure mechanisms. One of the findings was a certain and unique failure mode associated with bonding of thin-film gold metallized surfaces using pressure-less silver nano-particles sintering. That failure mode begins after a short exposure to temperatures of 200°C and higher. However, silver nano-particle sintering on substrates metallized with thin-film silver and some thick-film formulations yields dramatically better results.

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Rape, A., X. Liu, A. Kulkarni, and J. Singh. "Effect of Liquid Phase Additions on Microstructure and Thermal Properties in Copper and Copper-Diamond Composites." Advances in Materials Science and Engineering 2014 (2014): 1–8. http://dx.doi.org/10.1155/2014/832308.

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This study details a new approach to creating copper-diamond composite materials for thermal management applications by using a two-phase (solid-liquid) approach in powder metallurgy using Field Assisted Sintering Technology (FAST). Silver-copper alloyed powder at eutectic compositions was used as a nonreactive liquid phase while Cu5Si was used as a reactive liquid phase. Microstructure results are reported favorably comparing the additions of a small amount of liquid phase to pure solid state sintering. Additionally, EDX results indicate that the liquid phase material fills gaps at the interface of the matrix and diamond particle resulting in improved microstructure and density. Thermal conductivity results show that liquid phase additions improve the thermal conductivity of composites compared to composites without any liquid phase, but Si additions cause a severe drop in baseline conductivity.

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Lo, Ming, Seyed Amir Paknejad, Harry Borrill, Wan K. Kong, Addo Addo-Kwabena, Mohamed Saidoune, Chris Powley, Naim Kapadia, Yang Zuo, and Samjid H. Mannan. "Comparative study of how additives affect sintered silver microstructure in die-attach applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000061–65. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000061.

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Abstract Die attach materials based on silver nanoparticles which sinter at temperatures in the range 200–300 °C are a comparatively new technology. The properties of the sintered structure can be affected by a wide range of additives which can alter the physical and chemical characteristics of the joints. In this study, a commercially available Ag nanoparticle paste has been used as the base, and a range of additives have been added principally to determine the effect of each additive on the sintered microstructure immediately after sintering, and after long term thermal ageing. The additives trialled include Au, Sn, Cu, and Zn. In each case the additive powder was mixed with the original paste and the microstructure after sintering was compared to the microstructure after ageing at 250 °C for 24 h. Another method of introducing an additive into the system is adding it as a mesh, interposed between die and substrate and immersed in the silver paste. Au was added in both this form, and in the form of a powder additive. The mesh results in a thermodynamically stable microstructure up to at least 500 °C. The design takes advantage of solid–solid interdiffusion bonding which results in a die attach assembly with a continuous, non-porous gold-silver interdiffusion layer running all the way from the die to the substrate.

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Fujino, Masahisa, Hirozumi Narusawa, Yuzuru Kuramochi, Eiji Higurashi, Tadatomo Suga, Toshiyuki Shiratori, and Masataka Mizukoshi. "Transient liquid-phase sintering using silver and tin powder mixture for die bonding." Japanese Journal of Applied Physics 55, no. 4S (March 24, 2016): 04EC14. http://dx.doi.org/10.7567/jjap.55.04ec14.

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Larismaa, Juha, Outi Söderberg, Jesse Syrén, Eero Haimi, and Simo Pekka Hannula. "Processing and Characterization of Porous Silica-Ag-Nanoparticle Composites Produced by Pulsed Electric Current Sintering." Key Engineering Materials 527 (November 2012): 38–43. http://dx.doi.org/10.4028/www.scientific.net/kem.527.38.

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This paper studies influence of the process temperature and time on the properties of the compacts made of Ag-SiO2 powder by the pulsed electric current sintering (PECS). Silica particles doped with Ag nanoparticles were prepared by modified Stöber method, and calcinated at 573 K in air resulting in average silica particle size of ~1.1 µm and agglomerate size up to 32 µm. There was about 7 wt.% of silver in the structure and the diameter of the silver particles on the silica carriers was 30 ±7 nm on average. The composite powder was sintered into porous compacts by PECS at 873, 973, 1073, or 1173 K for 10, 20, or 30 min under pressure of 50 MPa. Samples were characterized by SEM, XRD, UV-vis-spectrometer, and laser diffraction. During PECS compaction grain growth of silver particles was observed and the measured average size of Ag in 873 K and in 1173 K samples were 65 nm and 170 nm, respectively. The porosity of the materials did not show remarkable change, as the relative density ranged from 76 to 79 %. Thus, it is possible to produce porous silica based materials with controlled Ag-nanoparticle size by PECS. These materials may be optimized for, e.g., different kinds of antibacterial filters.

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Hussain, Arif, Hee-Lak Lee, Yoon-Jae Moon, Heuiseok Kang, Seung-Jae Moon, and Jun-Young Hwang. "Temperature Estimation during Pulsed Laser Sintering of Silver Nanoparticles." Applied Sciences 12, no. 7 (March 29, 2022): 3467. http://dx.doi.org/10.3390/app12073467.

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During the thermal sintering of metal nanoparticles (NPs) the process temperature plays the most important role in the outcome of the sintering results and the selection of a suitable substrate. Here, temperature calculation during pulsed laser sintering of silver (Ag) nanoparticles (NPs) inkjet-printed on glass substrates is presented. During the pulsed laser sintering of Ag NPs, a minimum line resistivity less than twice the bulk silver resistivity was obtained within around 52 s under a laser power of 276 mW. The temperature field during the pulsed laser sintering of Ag NPs was estimated via a three-dimensional numerical model in which a temperature-dependent thermal conductivity of Ag NPs was adopted. An algorithm for treating the thermal conductivity of the heated Ag NPs in a region by a previous laser shot was devised for the improvement of the temperature field estimation. A maximum temperature of approximately 204 °C over the Ag NPs line was obtained with a 276 mW laser power and a scanning speed of 135 μm/s.

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Yang, Hui, and Jihui Wu. "Improvement of Sintering Performance of Nanosilver Paste by Tin Doping." Journal of Nanomaterials 2020 (January 22, 2020): 1–6. http://dx.doi.org/10.1155/2020/3925276.

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Nanosilver paste, an interconnect solder, is a common choice in the electronics packaging industry. However, higher sintering temperature and lower sintering strength limit its application. At present, doped nanosilver paste has been studied for use in chip interconnection. In order to improve the sintering properties and shear strength of nanosilver paste, we have developed a new tin-doped nanosilver paste (referred to as silver tin paste), and according to the decomposition temperature of the organic dispersant in the slurry, a corresponding sintering process with a maximum temperature of 300°C was developed. The product after sintering of the silver tin paste is a mixture of a solid solution of Ag and an Ag3Sn phase. Among them, the hard and brittle phase Ag3Sn diffuse distribution in the silver matrix for strengthening, and the solid solution of Ag acts as a replacement solid solution strengthening. As the content of doped Sn increases, the sintering strength increases remarkably. When the Sn content is 5%, the joint shear strength reaches the highest value of 50 MPa. When it exceeds 5%, the sintering strength gradually decreases, which may be caused by the excessive formation of the intermetallic compound IMC as the dopant content increases. This new tin-doped nanosilver technology has the characteristics of low-temperature sintering and high-temperature service, so it is expected to be widely used in semiconductor power devices.

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He, Xinjun, Yong Wang, Haifei Lu, Dan Ouyang, Zhanfeng Huang, and Wallace C. H. Choy. "Realizing the ultimate goal of fully solution-processed organic solar cells: a compatible self-sintering method to achieve silver back electrode." Journal of Materials Chemistry A 8, no. 12 (2020): 6083–91. http://dx.doi.org/10.1039/d0ta00807a.

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Isolated silver nanoparticles are sintered by a compatible self-sintering strategy to form connected silver back electrode. The highest power conversion efficiency of 9.73% among reported evaporation-free organic solar cells is achieved.

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WATANABE, Shizuharu, Takayuki KODERA, and Takashi OGIHARA. "Preparation and sintering of tellurium-doped silver powder for electrodes in silicon solar cells." Journal of the Ceramic Society of Japan 123, no. 1437 (2015): 345–50. http://dx.doi.org/10.2109/jcersj2.123.345.

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Kim, Minha, Hongsub Jee, and Jaehyeong Lee. "Photo-Sintered Silver Thin Films by a High-Power UV-LED Module for Flexible Electronic Applications." Nanomaterials 11, no. 11 (October 25, 2021): 2840. http://dx.doi.org/10.3390/nano11112840.

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In recent printed electronics technology, a photo-sintering technique using intense pulsed light (IPL) source has attracted attention, instead of conventional a thermal sintering process with long time and high temperature. The key principle of the photo-sintering process is the selective heating of a thin film with large light absorption coefficients, while a transparent substrate does not heat by the IPL source. Most research on photo-sintering has used a xenon flash lamp as a light source. However, the xenon flash lamp requires instantaneous high power and is unsuitable for large area applications. In this work, we developed a new photo-sintering system using a high-power ultraviolet light emitting diode (UV-LED) module. A LED light source has many merits such as low power consumption and potential large-scale application. The silver nanoparticles ink was inkjet-printed on a polyethylene terephthalate (PET) and photo-sintered by the UV-LED module with the wavelength of 365 and 385 nm. The electrical resistivity as low as 5.44 × 10−6 Ω·cm (just about three times compared to value of bulk silver) was achieved at optimized photo-sintering conditions (wavelength of 365 nm and light intensity of 300 mW/cm2).

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Yahya, Iziana, Noor Asikin Ab Ghani, Mohd Arif Anuar Mohd Salleh, Hamidi Abd Hamid, Zainal Arifin Ahmad, and Ramani Mayappan. "Characterization of Sn-3.5Ag-1.0Cu Lead-Free Solder Prepared via Powder Metallurgy Method." Advanced Materials Research 501 (April 2012): 160–64. http://dx.doi.org/10.4028/www.scientific.net/amr.501.160.

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The toxicity in the Sn-Pb solder has promoted the development of Pb-free solder in the electronics industries. Among the Pb-solders, the Sn-3.5Ag-1.0Cu solder is considered a potential replacement and being studied by many researchers. In the present study, the characteristics of Sn-3.5Ag-1.0Cu lead-free solder were studied. The raw materials were tin, silver and copper powders in micron size. The solder was prepared using powder metallurgy route which includes blending, compacting and sintering. Four blending times and two compacting pressures were used to investigate for optimum condition. The melting temperature of the samples were studied using differential scanning calorimeter (DSC) and the presence of Sn Ag, Cu were confirmed using x-ray diffraction analysis (XRD). Finally the effect of variables on the hardness of the solders is reported.

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Benabou, Lahouari, Quang Bang Tao, Thien An Nguyen-Van, Xu Dong Wang, and Luc Chassagne. "Mechanical and Microstructural Analysis of an Ultra-Flexible Nano-Silver Paste Sintered Joint." Key Engineering Materials 865 (September 2020): 25–30. http://dx.doi.org/10.4028/www.scientific.net/kem.865.25.

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Soldering using common lead-free solder alloys is still one of the main die attach technology, in particular for applications in power electronics where high temperatures have to be met. However, some newly developed attach technologies promise to offer more interesting features in terms of both mechanical and thermal properties. Among these new methods, sintering of nano-silver particles allows to obtain a high thermal conductivity needed in the assemblies of electronic or optical components, as well as a relatively low elastic modulus for better stress accommodation and enhanced thermo-mechanical reliability. The sintering processing parameters, mainly the bonding pressure, the sintering temperature profile, and the sintering atmosphere, are known to have a critical effect on the properties of the sintered layer, such as its mechanical strength and electrical/thermal performances.In this study, copper substrates are fabricated and assembled by sintering using a nano-silver paste. The objective is to obtain a bonding joint with high mechanical flexbility, capable of addressing the thermomechanical stresses for systems operating under high temperatures. The measured mechanical properties of the sintered material show on the one hand low elastic modulus of the joint which is appropriate for strong difference in thermal expansion between components, and on the other hand sufficient mechanical strength for the assembly. Microstructure analyses reveal a highly porous silver network structure of the joint, with submicrometric silver grains and large micrometric porosities homogeneously distributed.

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Eberstein, Markus, Christel Kretzschmar, Thomas Seuthe, Manja Marcinkowski, Martin Ihle, Steffen Ziesche, Uwe Partsch, and Frieder Gora. "Towards highly conductive silver pastes for LTCC power electronics." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000553–58. http://dx.doi.org/10.4071/isom-2011-wa3-paper5.

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The realization of high current conductors in LTCC multilayer architectures was studied. By mixtures of spherical silver powders, maximum tap densities above 7 g/cm3 could be obtained. On pressed cylinders a good correlation between tap density and total shrinkage was found. Pastes were made of the highly packed silver powders and detailed investigations regarding paste sintering kinetics and interactions between paste ingredients among one another as well as between paste ingredients and LTCC substrates were made. The pastes did not show a pronounced correlation between tap density and total densification. With increasing solid content of the pastes, the shrinkage printed-dry, the shrinkage dry-fired and the specific sheet resistance decreases. These findings can be used to control the filling degree of channels or grooves as well as the properties of the fired conductor. Expansion effects of the pure silver powders during sintering could be correlated to gas pressure effects, whereby there are obviously different kinds of gas formation in fine and coarse powders. Avoiding of camber of freely sintered LTCC should be attained if new LTCC materials are showing different sintering behavior, e. g. strong and early crystallization building of diffusion barriers or the possession of a glass phases which will not incorporate silver oxide. Research on this target should be done. The realization of high current conductors in constrained sintered LTCC was successfully shown. A paste comparable to standard values for direct copper bond (DCB) substrates with a thickness 35 μm of 0,48 mOhm/sq is introduced

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Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, and Gaetano Sequenzia. "Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling." Applied Sciences 11, no. 15 (July 29, 2021): 7012. http://dx.doi.org/10.3390/app11157012.

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The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and thermal capabilities. In order to support the development of these novel semiconductors, packaging technologies are evolving to provide enough reliable products. Silver sintering is one of the most promising technologies for die attach. Due to their superior reliability properties with respect to conventional soft solder compounds, dedicated reliability flow and physical analyses should be designed and employed for sintering process optimization and durability assessment. This paper proposes an experimental methodology to optimize the pressure value applied during the silver sintering manufacturing of a silicon carbide power MOSFET molded package. The evaluation of the best pressure value is based on scanning electron microscopy performed after a liquid-to-liquid thermal shock reliability test. Furthermore, the sintering layer degradation is monitored during durability stress by scanning the acoustic microscopy and electric measurement of a temperature sensitive electric parameter. Moreover, mechanical elastoplastic behavior is characterized by uniaxial tensile test for a bulk sample and finite element analysis is developed to predict the mechanical behavior as a function of void fraction inside sintering layer.

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Zhang, Ping, Rongzhuan Wei, Jianhua Zeng, Miao Cai, Jing Xiao, and Daoguo Yang. "Thermal Properties of Silver Nanoparticle Sintering Bonding Paste for High-Power LED Packaging." Journal of Nanomaterials 2016 (2016): 1–6. http://dx.doi.org/10.1155/2016/8681513.

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This paper describes the preparation of low-temperature sintered nanosilver paste with inverse microemulsion method with Span-80/Triton X-100 as the mixed-surfactant and analyzes the influence of different sintering parameters (temperature, pressure) on the shear properties of low-temperature sintering of nanosilver. Experimental results show that the shear strength of the low-temperature sintering of nanosilver increases as the temperature and pressure increase. But there are many pores and relative fewer cracks on the sintering layer after low-temperature sintered. The test thermal resistance of low-temperature sintered nanosilver paste is 0.795 K/W which is greater than SAC305 weld layer with a T3ster thermal analyzer. The adhesive performance and the heat dispersion of low-temperature sintered nanosilver paste need to be further researched and improved.

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Mosiałek, M., M. Przybyła, M. Tatko, P. Nowak, M. Dudek, and M. Zimowska. "Composite Ag-La0.8Sr0.2MnO3-σ Cathode for Solid Oxide Fuel Cells." Archives of Metallurgy and Materials 58, no. 4 (December 1, 2013): 1337–40. http://dx.doi.org/10.2478/amm-2013-0170.

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Abstract Composite cathodes for solid oxide fuel cells composed of metallic silver dispersed in ceramic (La0:8Sr0:2MnO3-σ) matrix were prepared on the surface of solid electrolyte by two-step procedure. First the matrix of controlled porosity was created by sintering mixture of La0:8Sr0:2MnO3-σ powder with the organic polymer beads then the matrix was saturated with AgNO3 solution and sintered again. Such obtained cathodes showed higher electrical conductivity and lower charge transfer resistance in oxygen reduction reaction in comparison to pure ceramic cathodes

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Osadnik, Małgorzata, Marian Czepelak, and Małgorzata Kamińska. "Production and Properties of AgW50 Composites Designated for Electric Contacts." Key Engineering Materials 641 (April 2015): 93–98. http://dx.doi.org/10.4028/www.scientific.net/kem.641.93.

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The purpose of the studies was to determine production parameters of AgW50 composite contact material. Fabrication of contact tips from this material was carried out by powder metallurgy method including preparation of the powder mixture, pressing, sintering and optional repressing under pressure of not less than 600 MPa. This technology enables production of contact tips with different shape and size without application of machining. The required material structure, i.e. uniform distribution of tungsten particles in the silver matrix, was achieved by milling conducted in the planetary ball mill. The further operations of this technological process, i.e. optimization of consolidation parameters, enabled fabrication of material characterized by high density and functional (electrical) properties.

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Rahimi, Esmaeil, Mohammad Hossein Sheikhi, Zahra Karami Horastani, S. Masoud Sayedi, Sedigheh Zeinali, and Abbas Zarifkar. "Ethanol Sensing Properties of Tin Oxide Doped Using Silver Nanoparticles." Advanced Materials Research 829 (November 2013): 600–604. http://dx.doi.org/10.4028/www.scientific.net/amr.829.600.

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Composite powders of SnO2 with different amounts of Ag nanoparticles (0.3 wt%, 0.5 wt%, 0.8 wt% and 1.5 wt%) were prepared by reducing an aqueous silver nitrate solution with NaBH4 followed by washing and heating treatments. Gas sensors, based on both pure SnO2 and the prepared composite powders were fabricated by simple, reproducible and low cost method of powder pressing followed by sintering in air at 500oC for 2 hours. The morphology of the materials was characterized by XRD and SEM methods. The gas sensing performance of all sensors were examined in an ethanol vapor atmosphere. Both pure SnO2 and Ag/ SnO2 based sensors showed high responses to the ethanol vapor. However, in terms of response time and working temperature the Ag/SnO2 based sensors showed better performances, i.e. they worked at lower temperatures and responded at shorter times. The response time of all sensors was less than 6s; however, optimized performance was observed for the sensor with 1.5% Ag concentration, showing 99% responses at 260oC with a response time of 3s. The results showed that Ag nanoparticles doped in SnO2, effectively can increase sensor performance for ethanol detection.

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Falak, Peyman, and Iman Ebrahimzadeh. "Fabrication of bulk nanostructured silver by spark plasma sintering from nanostructured silver powders." Materials Research Express 6, no. 10 (August 7, 2019): 105009. http://dx.doi.org/10.1088/2053-1591/ab34ed.

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Journal articles on the topic 'Sintering of silver powder'

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