Relevant bibliographies by topics / Sintering of silver powder

Academic literature on the topic 'Sintering of silver powder'

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Published: 14 March 2023

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Journal articles on the topic "Sintering of silver powder"

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Li, Wei, Chunxiu Yu, Yunkai Wang, Yuan Yao, Xianglei Yu, Chuan Zuo, and Yang Yu. "Experimental Investigation of Effect of Flake Silver Powder Content on Sintering Structure and Properties of Front Silver Paste of Silicon Solar Cell." Materials 15, no. 20 (October 13, 2022): 7142. http://dx.doi.org/10.3390/ma15207142.

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Optimizing the performance of front silver paste is of great significance in improving the efficiency of the photoelectric conversion of crystalline silicon solar cells. As a conductive functional phase of silver paste, the structure and performance of silver powder have an important influence on the sintering process of silver paste and the conductivity of silver electrodes. Because of their two−dimensional structure, flake silver powders can effectively increase the contact area with other silver powders and silicon cells before sintering. Additionally, flake silver particles have higher surface energy and sintering activity than spherical silver particles of the same particle size. However, recent research has mainly focused on the influence of the particle size of silver powder. This paper fills the research gap regarding the morphology of silver powders and clarifies the influence of flake silver powders on the performance of silver paste. The influence of the ratio of spherical silver powder to flake silver powder in silver paste on the sheet resistance, adhesion, and specific contact resistivity of silver film after sintering at 800 °C was studied, and the optimal ratio was determined according to a cross−sectional contact picture of the silver film. The results showed that with the increase in the mass fraction of the flake silver powder, the sheet resistance of the sintered silver film gradually increased, the adhesion first increased and then decreased, and the specific contact resistance first decreased and then increased. When the flake silver powder content was 0%, the minimum sheet resistance of the silver film was 2.41 m Ω/£. When the flake silver powder content was 30%, the maximum adhesion of the silver film was 6.07 N. When the flake silver powder content was 50%, the minimum specific contact resistivity of the silver film was 0.25 Ω·cm2. In conclusion, when the flake silver powder content was 30%, the comprehensive performance of the silver film was the best.
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Fan, Mao Yan, Guo You Gan, Jian Hong Yi, Ji Kang Yan, Jing Hong Du, Jia Min Zhang, Yi Chun Liu, and Xin Xin He. "Effects of Na-Ca System Glass Powder on Properties of Silver Paste." Advanced Materials Research 833 (November 2013): 295–300. http://dx.doi.org/10.4028/www.scientific.net/amr.833.295.

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The glass powder as a binder phase in the silver paste mainly plays the role of binding. The composition, content and particle size of the glass powder have significant effects on the properties of the silver paste. In this paper, the effects of the sintering temperature, holding time, glass powder content and glass powder size on the adhesion and square resistance of the silver film were studied. The research results showed that when the glass powder content was 6%(in mass) of the total silver paste, the sintering temperature was 680°C, the holding time was 7 minutes and the glass powder size was 2.47μm, the silver paste can get good properties. The adhesion strength and square resistance of the silver film were respectively 2.5 N/mm2 and 14 mΩ /.
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Pathak, L. C., S. K. Mishra (Pathak), and S. Srikanth. "Sintering characteristics of Y–Ba–Cu oxide–Agx superconductors under argon atmosphere." Journal of Materials Research 17, no. 4 (April 2002): 895–900. http://dx.doi.org/10.1557/jmr.2002.0130.

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Sintering studies on Y–Ba–Cu oxide (YBCO)–Agx (x = 0, 0.6, and 1.0 mol) powder were carried out in argon atmosphere to understand the role of silver addition on the densification behavior of these materials. The increase of sintered densities of the compacts with silver addition in argon atmosphere contradicted our earlier observation on sintering of YBCO–Agx powder compacts in air, where the densities decreased for x > 0.6. Thermogravimetric (TG) studies under argon atmosphere indicate a continuous decrease of mass on heating suggesting an enhanced rate of oxygen removal from the YBCO matrix that facilitated the sintering in argon atmosphere. Sintering studies of YBCO–Agx powder compacts in argon in conjunction with earlier observations in air has substantiated our claim that high-temperature oxygen desorption by the silver from the YBCO matrix to the sintering atmosphere controls the rate of densification for these superconducting composites. However, the apparent activation energies for sintering suggest that the sintering process is controlled by yttrium ion diffusion along bulk and grain boundaries.
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Durairaj, Rajkumar, M. Das, E. Morris, and Satesh Namasivayam. "Investigation on the Morphology of Sintered Silver Nanomaterial for Electronic Packaging Application." Advanced Materials Research 832 (November 2013): 21–26. http://dx.doi.org/10.4028/www.scientific.net/amr.832.21.

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Silver nanoparticles are seen as a possible replacement for high temperature solders containing 90-95 wt.% Pb, which is widely used in various applications e.g. automotives. These high temperature solders have been exempted from the Restriction of Hazardous Substances (RoHS) Directive due to very limited drop-in replacement for the high temperature solders. Although the effect of sintering temperature of silver nanoparticles has been studied, the mechanism involved in the changes in the morphology of the particles and interfacial reaction with the substrate as a function of sintering temperature must be understood. In this study the effect of sintering temperature on the morpohology of Ag nanoparticles is discussed. The Scanning Electron Microscopy (SEM) analysis was used to analyze the changes in morphology of silver particles agglomerates with sintering temperatures. Results showed necking of the nanosilver powder, which indicated the occurrence of sintering through grain boundary diffusion process. Meanwhile, the micro-silver powder showed agglomeration of particles but no necking was observed. The study has shown that the Ag agglomerates was observed to undergo various changes to the particle morphology with different sintering temperatures.
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Biguereau, E., D. Bouvard, J. M. Chaix, and S. Roure. "On the swelling of silver powder during sintering." Powder Metallurgy 59, no. 5 (October 19, 2016): 394–400. http://dx.doi.org/10.1080/00325899.2016.1250037.

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Hutsch, Thomas, Thomas Schubert, Thomas Weißgärber, and Bernd Kieback. "Silver/Diamond Composite Material - Powder Metallurgical Route and Thermo-Physical Properties." Key Engineering Materials 742 (July 2017): 151–57. http://dx.doi.org/10.4028/www.scientific.net/kem.742.151.

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To meet the need of high-performance thermal management materials in the field of electronic applications, heat sink materials reinforced with synthetic diamonds have been prepared via powder metallurgy. A matrix of a silver alloy with a silicon content of 0.45 wt.% was chosen out of the prediction of the thickness of a final carbide layer of about 180 nm. The volume content of the diamonds and the diamond size were kept constant. The mixed powders were consolidated by Spark Plasma Sintering (SPS) using different sintering temperatures between 800 and 870 °C with a holding time of 30 min. The maximum thermal conductivity of 680 W/(mK) measured at room temperature and 620 W/(mK) at 275 °C was obtained at 810 °C sintering temperature. The degradation of the most promising sample after one thermal cycle up to 275 °C was determined below 1 percent of the value after sintering.
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Jiao, Ruo Bing, Tao Wu, Bo Ping Zhang, and Liang Liang Li. "Firing and Contact Resistivity of Ag2O-Aided Pb-Free Silver Paste for Crystalline Silicon Solar Cells." Materials Science Forum 847 (March 2016): 123–30. http://dx.doi.org/10.4028/www.scientific.net/msf.847.123.

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The silver pastes containing Ag2O powder, Ag powder, α-terpineol, ethyl-cellulose and Pb-free glass were synthesized for crystalline silicon (c-Si) solar cells. It was found that α-terpineol assisted the decomposition of Ag2O powder and effectively lowered the decomposition temperature of Ag2O. Ag nanoparticles were produced during the decomposition of Ag2O, which helped to reduce the sintering temperature of the silver pastes. The Ag2O-aided silver pastes were fired on polycrystalline silicon solar cells at various temperatures, and large plate-shaped Ag crystallites appeared at the interfaces between the sintered pastes and the emitter, which ensured a good electrical contact. The contact resistivity of Ag2O-aided silver paste with an optimal ratio of Ag2O to Ag was lower than that of the paste with pure Ag powder. The lowest contact resistivity of Ag2O-aided Pb-free silver pastes sintered at 800°C was 0.029 Ω⋅cm2, which was close to that of commercial silver paste that contained Pb-based glass (0.026 Ω⋅cm2). The experimental data demonstrated that the addition of Ag2O reduced the contact resistance and promoted the sintering of Pb-free silver pastes, and Ag2O-aided Pb-free silver paste could be a promising candidate used for front-contact electrode of c-Si solar cells.
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Dubnika, Arita, Dagnija Loca, Aigars Reinis, Maris Kodols, and Liga Berzina-Cimdina. "Impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite." Pure and Applied Chemistry 85, no. 2 (January 12, 2013): 453–62. http://dx.doi.org/10.1351/pac-con-12-08-12.

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In the present study, the impact of sintering temperature on the phase composition and antibacterial properties of silver-doped hydroxyapatite (HAp/Ag) samples was investigated. HAp/Ag containing 0.2 and 1.2 % silver was prepared using a modified wet chemical precipitation method. The surface morphology and inner structure of the sintered samples were discussed. X-ray powder diffraction (XRD) and scanning electron microscopy (SEM) studies showed that, after the sintering process, HAp/Ag contained a silver oxide phase, which was not observed in raw materials. Phase composition changes at different sintering temperatures were studied, and it was found that silver oxide undergoes phase changes during the sintering process. In vitro antibacterial properties approved the excellent antimicrobial activity of HAp/Ag against the bacterial strains Staphylococcus epidermidis and Pseudomonas aeruginosa. The HAp/Ag sample with 1.2 % silver content, sintered at 1150 °C, showed the highest antibacterial activity.
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Okada, Atsuyuki, and Takashi Ogihara. "Sintering Behavior of Silver Particles in Electrode for Multilayer Ceramic Substrate." Key Engineering Materials 421-422 (December 2009): 289–92. http://dx.doi.org/10.4028/www.scientific.net/kem.421-422.289.

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Several types of Ag powder were used as electrode paste for a multilayer ceramic substrate. The shrinkage behavior of the silver powders was investigated during the sintering. Bending and cracking were frequently observed on the substrate when coarse powders that show a broad size distribution and aggregation were used. The shrinkage curve of the Ag paste obtained by spray pyrolysis agreed well with that of the substrate. Furthermore, the electrical properties of the Ag paste were also determined. The resistivity of a silver electrode sintered at 900°C was about 2.00×10-6 Ω･cm.
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Yan, Fang Chun, Yuan Teng, Ji Kang Yan, Jing Hong Du, Jian Hong Yi, Jian Yang, and Guo You Gan. "Effects of Paste Composition and Sintering Process on Performance of Silver Paste for Silicon Solar Cells." Materials Science Forum 849 (March 2016): 852–59. http://dx.doi.org/10.4028/www.scientific.net/msf.849.852.

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In order to study the effects of composition ratio of silver paste and the sintering process on the properties of the silver film after sintering, the effects of different ratios of silver powders, glass powders and organic carrier in silver paste and different sintering temperatures and sintering time on the adhesion force and square resistance of the silver film were studied. The morphology of the sintered silver film was observed by SEM. The results showed that the silver film sintered at 760°C for 6 seconds had better properties after sintering when the ratio of silver powders, glass powders and organic carrier in silver paste was 80:5:15 and the silver powders was composed of spherical silver powders and flake silver powders at the ratio of 94:6. The adhesion force and square resistance of the silver film were 8.25 N and 3.47mΩ /□, respectively.
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Dissertations / Theses on the topic "Sintering of silver powder"

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Zhang, Zhiye. "Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment." Diss., Virginia Tech, 2005. http://hdl.handle.net/10919/28902.

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Die attachment is one of the most important processes in the packaging of power semiconductor devices. The current die-attach materials/techniques, including conductive adhesives and reflowed solders, can not meet the advance of power conversation application. Silver paste sintering has been widely used in microelectronics and been demonstrated the superior properties. The high processing temperature, however, prevents its application of interconnecting power semiconductor devices. This research focuses processing and characterization of micron-scale and nanoscale silver paste for power semiconductor devices attachment. Lowering the processing temperature is the essential to implement sintering silver paste for power semiconductor devices attachment. Two low-temperature sintering techniques - pressure-assisted sintering micro-scale silver paste and sintering nanoscale silver paste without external pressure - were developed. With the large external pressure, the sintering temperature of micro-scale silver paste can be significantly lowered. The experimental results show that by using external pressure (>40MPa), the commercial micro-scale silver paste can be sintered to have eighty percent relative density at 240oC, which is compatible with the temperature of solder reflowing. The measured properties including electrical conductivity, thermal conductivity, interfacial thermal resistance, and the shear strength of sintered silver joints, are significantly better than those of the reflowed solder layer. Given only twenty percent of small pores in the submicron range, the reliability of the silver joints is also better than that of the solder joints under the thermal cycled environment. The large external pressure, however, makes this technique difficult to automatically implement and also has a potential to damage the brittle power semiconductor devices. Reducing silver particles in the paste from micro-size to nanoscale can increases the sintering driving force and thus lowers the sintering temperature. Several approaches were developed to address sintering challenges of nanoscale silver particles, such as particles aggregation and/or agglomeration, and non-densification diffusion at low temperature. These approaches are : nanoscale silver slurry, instead of dry silver powder, is used to keep silver particles stable and prevent their aggregation. Ultrasonic vibration, instead of conventional ball milling, is applied to disperse nanoscale silver particles in the paste from to avoid from agglomerating. Selected organics in the paste are applied to delay the onset of mass-diffusion and prevent non-densification diffusion at low temperature. The measured results show that with heat-treatment at 300oC within one hour, the sintered nanoscale silver has significantly improved electrical and thermal properties than reflowed solders. The shear strength of sintered silver interconnection is compatible with that of solder. The low-temperature sinterable nanoscale silver paste was applied to attach the bare Silicon carbide (SiC) schottky barrier diode (SBD) for high temperature application. Limited burn-out path for organics in the silver layer challenges the sintering die-attach. This difficulty was lessened by reducing organics ratio in the silver paste. The effects of die-size and heating rate on sintering die-attach were also investigated. The single chip packaging of SiC SBD was fabricated by sintering die-attach and wire-bonding. The tested results demonstrate that the sintering nanoscale silver paste can be applied as a viable die-attach solution for high-temperature application.
Ph. D.
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Riva, Raphaël. "Solution d'interconnexions pour la haute température." Thesis, Lyon, INSA, 2014. http://www.theses.fr/2014ISAL0064/document.

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Le silicium a atteint sa limite d’utilisation dans de nombreux domaines tels que l’aéronautique. Un verrou concerne la conception de composants de puissance pouvant fonctionner en haute température et/ou en haute tension. Le recours à des matériaux à large bande interdite tels que le carbure de Silicium (SiC) apporte en partie une solution pour répondre à ces besoins. Le packaging doit être adapté à ces nouveaux types de composants et nouveaux environnements de fonctionnement. Or, il s’avère que l’intégration planaire (2D), composé de fils de câblage et de report de composants par brasure, ne peut plus répondre à ces attentes. Cette thèse a pour objectif de développer un module de puissance tridimensionnel pour la haute température de type bras d’onduleur destiné à l’aéronautique. Une nouvelle structure 3D originale constituée de deux puces en carbure de silicium, d’attaches par frittage d’argent et d’une encapsulation par du parylène HT a été mise au point. Ses différents éléments constitutifs, les raisons de leur choix, ainsi que la réalisation pratique de la structure sont présentés dans ce manuscrit. Nous nous intéressons ensuite à un mode de défaillance particulier aux attaches d’argent fritté : La migration d’argent. Une étude expérimentale permet de définir les conditions de déclenchement de cette défaillance. Elle est prolongée et analysée par des simulations numériques
Silicon has reached its usage limit in many areas such as aeronautics. One of the challenges is the design of power components operable in high temperature and/or high voltage. The use of wide bandgap materials such as silicon carbide (SiC) provides in part a solution to meet these requirements. The packaging must be adapted to these new types of components and new operating environnement. However, it appears that the planar integration (2D), consisting of wire-bonding and soldered components-attach, can not meet these expectations. This thesis aims to develop a three dimensional power module for the high temperature aeronautics applications. A new original 3D structure made of two silicon carbide dies, silver-sintered die-attaches and an encapsulation by parylene HT has been developed. Its various constituting elements, the reason for their choice, and the pratical realization of the structure are presented in this manuscript. Then, we focus on a failure mode specific to silver-sintered attaches : The silver migration. An experimental study allows to define the triggering conditions of this failure. It is extended and analyzed by numerical simulations
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Blackmore, Katherine Ann 1969. "Sintering of heterogeneous glass powder compacts." Thesis, The University of Arizona, 1995. http://hdl.handle.net/10150/291349.

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A modification of Scherer's Self-Consistent model and a new model, the Interlocking Cell model, have been developed to characterize the sintering behavior of mixtures of two glass powders. The theoretical sintering curves predicted by both these models are compared to each other and to experimental densification behaviors. Viscosities extrapolated from homogeneous sintering curves of sol-gel derived powders are transient and cannot be predicted based on composition alone. These transient viscosities have a significant effect on the sintering kinetics. The Self-Consistent and Interlocking Cell models assume very different microstructural changes during sintering. However, differences between the two models can just be distinguished using experimental densification curves of sol-gel cordierite based glass mixtures.
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Hascoët, Stanislas. "Mise en oeuvre de nouveaux matériaux d’assemblage dans les modules multipuces de puissance (MCM)." Thesis, Lyon, INSA, 2013. http://www.theses.fr/2013ISAL0123/document.

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L’introduction des composants grand gap dans le domaine de l’électronique de puissance requiert une optimisation de son environnement (packaging). En effet, les températures auxquelles peuvent être utilisés ce type de composants sont bien souvent plus grandes que celles supportables par le reste du module. De nouvelles techniques d’assemblage sont à l’étude et notamment certaines à base de frittage d’argent. Ces procédés présentent l’avantage de réaliser l’assemblage à une température modérée (similaire à celle d’une brasure), mais toutefois inférieure à celle de fusion de l’argent. La température de fusion du joint d’attache reste celle du matériau massif (plus de 900°C pour l’argent). Cette technique permet donc de réaliser des attaches pouvant fonctionner à très haute température. Ce travail de thèse a porté sur la mise en oeuvre d’une attache de puce par frittage d’argent. Après une étude des paramètres du procédé permettant d’obtenir la meilleure tenue mécanique (cisaillement), nous avons mis en évidence l’effet prépondérant de la finition des pièces à joindre. Lorsque la finition du substrat est de l’argent, aucun problème d’interface n’est observé et les assemblages sont fiables à t0 et en vieillissement. Généralement, la finition standard pour l’électronique de puissance est constituée d’une couche de nickel et d’or. Pour cette finition, le mécanisme semble différent selon l’épaisseur d’or présente sur le substrat ainsi que l’atmosphère utilisée pour le traitement thermique ou encore la charge appliquée. Globalement, plus l’épaisseur d’or est importante, moindre est l’accroche. Ce comportement semble fortement lié à la diffusion extrêmement rapide de l’argent en surface de l’or (et dans l’or). Cette diffusion a pour conséquence la formation d’une couche de solution solide or-argent. Cette couche a pour source de matière les grains d’argent qui permettent l’adhérence du joint d’argent fritté sur le substrat. Lorsque le volume d’or disponible pour la formation de cette couche est grand, la croissance de celle-ci est favorisée (en termes de surface et d’épaisseur). Cette croissance engendre une consommation des « piliers » d’argent et donc un affaiblissement de l’attache. L’application de pression semble augmenter fortement la concentration de piliers et améliore les résultats, tandis que sous azote, la diffusion de l’argent en surface de l’or semble inhibée, permettant l’obtention de bons résultats (à t0 et après cyclage). Ces résultats ont été mis en pratique pour la réalisation de plusieurs prototypes, dont l’un a été testé électriquement et ce de façon fonctionnelle à plus de 300°C
Use of wide band gap chip in the power electronic industry requires an optimization of the close environment (packaging). Indeed, the can often sustain lower temperature than the die, especially the solder that are used to bond the parts of the module. Consequently, new bonding methods are investigated to enhance the performance of the packages. Silver sintering bonding technique is one the most promising. This method allow to bond parts at moderate temperature and the formed joint to operate at very high temperature (until the melting point of silver). This work is focused on the development of this bonding technique in the case of bonding a dies on a substrate. A study of the influence of the different parameters on the strength of the formed bond has been done. It revealed a major influence of the finishes of the bonded parts. Bonding on silver finished substrate results in good mechanical strength of the bond even after ageing. Furthermore, no interface issues are observed. However, the most used finish for power electronic is not silver but nickel-gold. Regarding this type of finish, the bond quality depends on the gold thickness, sintering profile and also sintering atmosphere. A solid solution of silver and gold seems to develop on the surface of the substrate, decreasing the section of the silver grains in contact with the substrate. Thus the mechanical strength of the assembly is decreased. This effect should be limited by the gold available for the Au-Ag solid solution growth. When sintering under nitrogen, the diffusion of silver on the gold surface is much lower than under air. Good results have been obtained with these configurations and even after ageing. Adding pressure during the thermal treatment seems also to minimize the phenomenon, probably by increasing the number of silver grains in contact with the substrate surface and so reducing the free surface for Au-Ag layer formation. Those results have been used to build prototypes, one of whom has been electrically tested with success at temperatures up to 300°C
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Marsh, P. "Sintering of mixed powders." Thesis, University of Nottingham, 1994. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.282832.

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Dhavale, Tushar. "Low power laser sintering of iron powder." Thesis, University of the West of England, Bristol, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.522529.

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Booysen, Gerrie Jacobus. "Bridge tooling through layered sintering of powder." Thesis, Bloemfontein : Central University of Technology, Free State, 2007. http://hdl.handle.net/11462/72.

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Thesis (M. Tech.) - Central University of Technology, Free State, 2007
Faster mould production methods will undeniably impact positively on the product development community. Rapid Tooling (RT) concepts, in context with the product development process and related product development theories, were analysed. Conventional tooling techniques used such as epoxy plastic tooling and machined injection moulding techniques were used as point of departure for the research work, which focused on Laser Sintering of powder materials. The new generation RT materials that are available at the Central University of Technology, Free State, are a vast improvement on the old materials. RT materials are constantly being developed and the project aims were to stay abreast with the latest developments. The thesis gives a complete overview of all related technologies, and also an in-depth discussion of both the Selective Laser Sintering (SLS) and Laser Sintering (LS) processes. Mould size limitations, as well as general tooling design issues, polishing and finishing techniques were all taken into account. Data has been collected to compare mould inserts grown with RP machines with that of conventionally machined tools. Aspects such as tool life, part quality, lead times and cost were used as parameters to determine the differences and make recommendations. Through analysis of several experiments and industrial case studies, RT through sintered materials was proven as a capable technology, giving the option of an intermediate (bridge tooling) or even a final step of tooling. Recommendations for future use were made in terms of insert size and geometry, accuracy, durability and shrinkages, to ensure the feasibility of the RT process in SA.
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Eane, Radu Bogdan. "Metal powder effects on selective laser sintering." Thesis, University of Leeds, 2002. http://etheses.whiterose.ac.uk/4016/.

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Manufacturing functional prototypes and different tools using conventional methods usually is a time consuming process with multiple steps. The global economic pressure to get products to market faster has resulted in the development of several Rapid Prototyping (RP) techniques. Layer manufacturing technologies are gaining increasing attention in the manufacturing sector. They have the potential to produce tooling either indirectly or directly, and powder metal based layer manufacture systems are considered to be an effective way of producing rapid tooling. Selective Laser Sintering (SLS) is one of several available layer manufacture technologies. SLS is a sintering process in which designed parts are built up layer by layer from the bottom up using different powder materials. A laser beam scans the powder bed, filling in the outline of each layer’s CAD-image by heating the selected powder pattern to fuse it. This work reports on the results of an experimental study examining the potential of the selective laser sintering process to produce metallic parts using stainless steel powder. One material, a stainless steel powder and one sintering station research machine, which was constructed in Leeds, were used during the research. A step-by-step investigation was conducted. The research started with sintered tracks and finished with multiple layer sintering. The purpose was to find successful conditions and to establish the main problems that need to be overcome. The main achievements of this thesis have been to develop laser power and scan speed sintering maps for a stainless steel powder. 1 he maps have established conditions in which multiple layer blocks can be created, have established strategies to enable large areas to be sintered without warping and show that powder particle size has an important influence on sintering and on the position of the boundaries in the sintering maps. Although this investigation answered some questions, it also raised several more which are presented at the end of this thesis for future work.
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Kempen, Daniel. "Thermomechanical modelling of powder compaction and sintering." Doctoral thesis, Università degli studi di Trento, 2019. https://hdl.handle.net/11572/369024.

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An elastic-visco-plastic thermomechanical model for cold forming of ceramic powders and subsequent sintering is introduced and based on micromechanical modelling of the compaction process of granulates. Micromechanics is shown to yield an upper-bound estimate to the compaction curve of a granular material, which compares well with other models and finite element simulations. The parameters of the thermomechanical model are determined on the basis of available data and dilatometer experiments. Finally, after computer implementation, validation of the model is performed with a specially designed ceramic piece showing zones of different density. The mechanical model is found to accurately describe forming and sintering of stoneware ceramics and can therefore be used to analyze and optimize industrial processes involving compaction of powders and subsequent firing of the greens.
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Silver, Kathleen G. "Processing of nano-sized boron carbide powder." Thesis, Atlanta, Ga. : Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/26476.

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Thesis (M. S.)--Materials Science and Engineering, Georgia Institute of Technology, 2008.
Committee Chair: Speyer, Robert; Committee Member: Judson, Elizabeth; Committee Member: Sanders, Thomas. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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Books on the topic "Sintering of silver powder"

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Ceramic processing and sintering. 2nd ed. New York: M. Dekker, 2003.

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Rahaman, M. N. Ceramic processing and sintering. New York: M. Dekker, 1995.

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3

Ivensen, V. A. Fenomenologii͡a︡ spekanii͡a︡ i nekotorye voprosy teorii. Moskva: "Metallurgii͡a︡", 1985.

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Bondarenko, B. I. Vosstanovitelʹno-obezuglerozhivai͡u︡shchiĭ otzhig metallicheskikh poroshkov. Kiev: Nauk. dumka, 1991.

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V, Skorokhod V., Khermelʹ V, and Instytut problem materialoznavstva (Akademii͡a︡ nauk Ukraïnsʹkoï RSR), eds. Prot͡s︡essy massoperenosa pri spekanii. Kiev: Nauk. dumka, 1987.

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Suxing, Wu. Sintering additives for Zirconia ceramics. Carnforth, Lancs: Parthenon Press, 1986.

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German, Randall M. Powder metallurgy and particulate materals processing: The processes, materials, products, properties and applications. Princeton, NJ: Metal Powder Industries Federation, 2005.

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Okoński, Stanisław. Podstawy plastycznego kształtowania materiałów spiekanych z proszków metali. Kraków: Politechnika Krakowska im. Tadeusza Kościuszki, 1993.

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German, Randall M. Powder metallurgy and particulate materials processing: The processes, materials, products, properties and applications. Princeton, New Jersey: Metal Powder Industries Federation, 2005.

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Kubicki, Boguslaw. Sintered machine elements. New York: Ellis Horwood, 1995.

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Book chapters on the topic "Sintering of silver powder"

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Lei, Thomas G., Jesus Calata, Shu Fang Luo, Guo Quan Lu, and Xu Chen. "Low-Temperature Sintering of Nanoscale Silver Paste for Large-Area Joints in Power Electronics Modules." In Key Engineering Materials, 2948–53. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-456-1.2948.

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Seto, Takafumi, and Kikuo Okuyama. "Sintering." In Powder Technology Handbook, 151–54. Fourth edition. | Boca Raton, FL : Taylor & Francis Group, LLC, 2020.: CRC Press, 2019. http://dx.doi.org/10.1201/b22268-21.

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Syed-Khaja, Aarief, and Jörg Franke. "Silver Sintering." In CIRP Encyclopedia of Production Engineering, 1–5. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_16867-1.

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Syed-Khaja, Aarief, and Jörg Franke. "Silver Sintering." In CIRP Encyclopedia of Production Engineering, 1565–70. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_16867.

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Kelly, J. P., and O. A. Graeve. "Effect of Powder Characteristics on Nanosintering." In Sintering, 57–95. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-31009-6_4.

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Sato, Yasuhisa, Seiki Matsui, Ryuzo Watanabe, and Atushi Satori. "Isodynamic Compaction of Titanium Powder." In Sintering ’87, 569–74. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_96.

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Abe, Osami, Syuzo Kanzaki, Masayoshi Ohashi, and Hideyo Tabata. "Characterization of CIP Formed Powder Compacts." In Sintering ’87, 237–42. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_40.

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Evans, James W., and Lutgard C. De Jonghe. "Sintering of Powder Compacts." In The Production and Processing of Inorganic Materials, 402–39. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-48163-0_13.

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Tanno, Koichi, and Masaaki Yagi. "Rapidly Solidified Powder Produced by Counterrotating Process." In Sintering ’87, 182–87. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_31.

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Okimoto, Kunio, and Tomio Satoh. "Superplastic Forming of Zn-Al Pre-Alloy Powder." In Sintering ’87, 611–16. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_103.

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Conference papers on the topic "Sintering of silver powder"

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Pietrikova, Alena, Tomas Girasek, Juraj Durisin, and Karel Saksl. "Pressureless Silver Sintering in Power Application." In 2018 International Conference on Diagnostics in Electrical Engineering (Diagnostika). IEEE, 2018. http://dx.doi.org/10.1109/diagnostika.2018.8526084.

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Buttay, Cyril, Bruno Allard, and Raphael Riva. "Silver sintering for power electronics integration." In 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC). IEEE, 2015. http://dx.doi.org/10.1109/icep-iaac.2015.7111076.

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Bai, John G., Zach Z. Zhang, Jesus N. Calata, and Guo-Quan Lu. "Low-Temperature Sintering of Nanoscale Silver Pastes for High-Performance and Highly-Reliable Device Interconnection." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-79187.

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In this paper, we report our development on making of nanoscale silver pastes and their low-temperature sintering for semiconductor device interconnections. The nanoscale silver pastes were prepared by dispersing 30-nm silver powder under ultrasonic vibration and mechanical agitation in an organic vehicle. Sintering of the silver paste prints at 280°C for 10 minutes resulted in a density of ~80% in the air ambient. Some important properties of the low-temperature sintered silver include ~2.4 W/K-cm for thermal conductivity, ~3.8 × 10−6 Ω-cm for electrical resistivity, and ~9 GPa for the effective elastic modulus. SiC Schottky rectifiers attached to either silver- or gold-coated direct bond copper (DBC) substrates show low forward voltage drops. The silver joints do not contain large voids but rather uniformly distributed microscale pores. Die-shear tests showed that bonding strengths of the silver joints were around 21 MPa on the gold-coated DBC substrates and 38 MPa on the silver-coated DBC substrates, respectively. The latter is comparable to that of reflowed eutectic lead-tin solder joints. Based on the findings in this work, the low-temperature sintering of nanoscale silver pastes is promising to be a high performance and highly-reliable semiconductor device bonding solution for high power packages.
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Dutt, Gyan, Mike Marczi, and Oscar Khaselev. "Silver Sintering Die Attach – Myths & Physics." In 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP). IEEE, 2019. http://dx.doi.org/10.1109/iwipp.2019.8799095.

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Fujino, M., H. Narusawa, Y. Kuramochi, E. Higurashi, T. Suga, T. Shiratori, and M. Mizukoshi. "Transient Liquid-Phase Sintering using Tin and Silver Powder Mixture for Die Bonding." In 2015 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2015. http://dx.doi.org/10.7567/ssdm.2015.ps-2-7.

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Lu, Guo-Quan, Yunhui Mei, Meiyu Wang, and Xin Li. "Low-temperature Silver Sintering for Bonding 3D Power Modules." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735123.

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Gao, Lilan, Xinwei Tian, Chengjin Wu, Yulong Xing, Yansong Tan, Xu Chen, and Guoquan Lu. "Nano-Silver Pressureless Sintering Technology in Power Module Packaging." In 2022 IEEE International Conference on Mechatronics and Automation (ICMA). IEEE, 2022. http://dx.doi.org/10.1109/icma54519.2022.9856054.

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Chi, Wei-Hao, Yu-Wen Huang, Hao-Chih Chen, Ping-Chun Chen, Chia-Hsiang Chang, and Hsueh-Kuo Liao. "Silver sintering die attachment for power chip in power module." In 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). IEEE, 2017. http://dx.doi.org/10.1109/impact.2017.8255944.

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Pribitny, P., A. Chvala, J. Marek, and D. Donoval. "Advanced TCAD Simulation of Silver Sintering for Power Modules Integration." In 2018 12th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM). IEEE, 2018. http://dx.doi.org/10.1109/asdam.2018.8544562.

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Zhao, Yimin, Paul Mumby-Croft, Steve Jones, Andy Dai, Zechun Dou, Yafei Wang, and Feng Qin. "Silver sintering die attach process for IGBT power module production." In 2017 IEEE Applied Power Electronics Conference and Exposition (APEC). IEEE, 2017. http://dx.doi.org/10.1109/apec.2017.7931138.

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Reports on the topic "Sintering of silver powder"

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Chu, May-Ying. Sintering stress and microstructure in ceramic powder compacts. Office of Scientific and Technical Information (OSTI), August 1990. http://dx.doi.org/10.2172/6388375.

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Rios, Orlando, William G. Carter, and Stefan Ulrich. Additive Manufacturing Consolidation of Low-Cost Water Atomized Steel Powder Using Micro-Induction Sintering. Office of Scientific and Technical Information (OSTI), April 2018. http://dx.doi.org/10.2172/1439146.

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Braegelmann, Peter. Developing New Polymeric Powder Feedstocks for Selective Laser Sintering: Emphasizing Particle Size and Shape. Office of Scientific and Technical Information (OSTI), June 2022. http://dx.doi.org/10.2172/1871451.

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Dubois, Diego, Amirali Eskandariyun, Suprabha Das, Andriy Durygin, and Zhe Cheng. Flash Sintering of Commercial Zirconium Nitride Powders. Florida International University, October 2021. http://dx.doi.org/10.25148/mmeurs.009777.

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Flash sintering is an electrical field-assisted densification technique that requires passing a current through a ceramic powder compact. Pressure-assisted flash sintering of commercially available Zirconium Nitride (ZrN) powders has been demonstrated. Near fully dense samples can be obtained within a short period of time. The influences of parameters such as electrical field strength, voltage ramping rate, current limit, external pressure, pre-heating, and holding time on the onset of the flash event were investigated. Some post-flash sintered samples were subjected to the same condition to observe if the material would experience repeated flash. In addition, material properties such as density and hardness were measured and correlated with SEM and XRD. Implications of the observations on underlying flash sintering mechanism will also be discussed.
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Munir, Z. A. An investigation of the mechanisms of solid state powder reaction in the combustion synthesis and sintering of high temperature materials. Office of Scientific and Technical Information (OSTI), August 1989. http://dx.doi.org/10.2172/7258522.

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