Journal articles: 'SILICON CARBIDE ABRASIVES'

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Saito, T., S. Ito, Y. Mizukami, and O. Horiuchi. "Precision Abrasive Jet Finishing of Cemented Carbide." Key Engineering Materials 291-292 (August 2005): 371–76. http://dx.doi.org/10.4028/www.scientific.net/kem.291-292.371.

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Recently a technique has been developed to mold aspheric glass lenses by using cemented carbide dies at elevated temperature. The dies are precisely ground by an ultraprecision grinding machine. However the obtained form accuracy is generally around 100nm and is not enough high. In this study, to investigate a possibility of corrective figuring of the dies, a series of experiments of abrasive jet machining of cemented carbide was conducted and fundamental machining characteristics were examined. The used abrasives were fine grains of silicon carbide and aluminum oxide. The silicon carbide abrasives could accomplish a sufficient material removal. Both the material removal rate and the surface roughness increase as the collision angle increases up to 90 degrees. Therefore, in order to obtain a smooth surface finish, it was necessary to take a smaller collision angle and to slow down the material removal rate.

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Niżankowski, Czesław, and Paweł Kazimierski. "Development trends of silicon carbide abrasives." Mechanik, no. 8-9 (September 2015): 714/237–714/243. http://dx.doi.org/10.17814/mechanik.2015.8-9.377.

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Kido, Takanori, Masatake Nagaya, Kenji Kawata, and Tomohisa Kato. "A Novel Grinding Technique for 4H-SiC Single-Crystal Wafers Using Tribo-Catalytic Abrasives." Materials Science Forum 778-780 (February 2014): 754–58. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.754.

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Diamond abrasives are generally used to machine silicon carbide (SiC) single crystals because of the high hardness of those crystals. Although Chemo-Mechanical Polishing (CMP) employs abrasives softer than the SiC single crystals together with oxidizing agents in order to avoid mechanical damage to the surface of SiC single-crystal wafers, none has reported so far the use of abrasive wheels other than diamond for grinding large SiC single-crystal wafers. The current study revealed that a novel grinding technique using non-diamond abrasives such as ceria (CeO2) can efficiently machine large SiC single-crystal wafers of 100 mm in diameter due hypothetically to the nature of newly named tribo-catalytic abrasives, and is promising to minimize the surface damage prior to the final CMP step.

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Vidigal, R. N. E., Claudinei Rezende Calado, and I. P. Pinheiro. "Evaluation of Agents Abrasives Polishing Porcelain Employing Image Processing." Materials Science Forum 798-799 (June 2014): 564–69. http://dx.doi.org/10.4028/www.scientific.net/msf.798-799.564.

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The waste generated in the process of polishing of ceramic materials represents a challenge for the ceramic industries, because it is necessary conciliate environmental protection to expenses with disposal and proper packaging. The study of the reuse of this material in the production cycle becomes a necessary alternative to solve the industrial problem. The replacement of the abrasive agent is a viable option in order to avoid the presence of silicon carbide and the residue therefore enabling the direct incorporation of the residue in the porcelain production. If the atomized paste contains silicon carbide when the material is burned occurred the formation of porosity and cracks in the piece. This work aims to study new alternatives of abrasive agents and evaluate the efficiency of polishing generated by new tools. To evaluate the performance of the abrasive tests were conducted simulating the polishing step. The study is based on the computational processing of the image generated by optical micrographs. From this, it will be possible find the best abrasives for polishing ceramic material.

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Lukin, Daniil M., Melissa A. Guidry, and Jelena Vučković. "Silicon Carbide: From Abrasives to Quantum Photonics." Optics and Photonics News 32, no. 3 (March 1, 2021): 34. http://dx.doi.org/10.1364/opn.32.3.000034.

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Liao, Yunn Shiuan, Y. P. Yu, and C. W. Huang. "Ultrasonic Vibration Assisted Mechanical Chemical Polishing (MCP) of Silicon Carbide." Advanced Materials Research 565 (September 2012): 255–60. http://dx.doi.org/10.4028/www.scientific.net/amr.565.255.

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The mechanical chemical polishing (MCP) process which uses soft abrasives to polish hard workpiece have been employed recently to polish silicon carbide (SiC) ceramic for various applications. An ultrasonic vibration assisted apparatus is designed to investigate the effects of ultrasonic vibration on the efficiency of MCP of SiC by ferric oxide (Fe2O3) abrasives. Experimental results show that the ultrasonic vibration can effectively improve polishing efficiency; the material removal rate is increased by about 60~70%. But it does not lead to a better final surface finish. The effect is more obvious under a higher working pressure condition. It is also found that the output power of ultrasonic transducer is positively correlated with material removal rate. The rise of polishing efficiency is attributed to the increase of local asperities temperatures which promote chemical reaction of silicon carbide with oxygen to form passivation layers. The layers are removed by ferric oxide abrasives afterward.

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Beaucamp, Anthony. "Modelling the Brittle/Ductile Transition in Super-Fine Finishing of Carbides." Applied Mechanics and Materials 869 (August 2017): 20–28. http://dx.doi.org/10.4028/www.scientific.net/amm.869.20.

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Materials such as binderless tungsten carbide and silicon carbide have become ubiquitous in the fabrication of high-performance tooling and molding inserts. But while conventional grinding of these hard ceramics has been studied in depth, the theory underlying their super-fine finishing has been less extensively explored. In particular, the boundary in process parameters that delineates the brittle/ductile removal transition remains mostly undocumented. In this paper, we review some super-fine finishing methods for carbide materials, based on both bound and kinetic abrasive processes. The focus is then placed on modelling the interaction between material and abrasives under their respective process conditions, and deriving some useful criteria guiding the brittle/ductile transition.

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Duwell, E. J., R. J. Cosmano, G. R. Abrahamson, and J. J. Gagliardi. "Grinding Titanium With Coated Abrasives Under an Aqueous Solution of Inorganic Phosphate Salts." Journal of Engineering for Industry 110, no. 1 (February 1, 1988): 19–24. http://dx.doi.org/10.1115/1.3187836.

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Aqueous solutions of inorganic salts are known to be effective grinding lubricants for titanium. Early work by Professor Shaw at MIT drew particular attention to the use of phosphate salts, and although not commercially available as grinding fluids, some metal fabricators have compounded phosphate-containing fluids for their own use from the raw chemicals. In this paper, the dynamics of grinding Ti(6Al-4V) alloy are described using phosphate salt solutions. The results show that both aluminum oxide and silicon carbide coated abrasive belts have unique advantages in this application, with aluminum oxide exhibiting easy penetration and fast cutting behavior early on, while silicon carbide appears to have longer range durability.

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Tsai, Ming-Yi, Kun-Ying Li, and Sun-Yu Ji. "Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers." Applied Sciences 11, no. 4 (February 17, 2021): 1783. http://dx.doi.org/10.3390/app11041783.

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In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well as self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enhanced the process and reduced the final chemical mechanical planarization (CMP) polishing time. Two different grinding plates with pads impregnated with mixed abrasives were prepared: one with self-modified diamond + SiC and a ceramic binder and one with self-modified diamond + SiO2 + Al2O3 + SiC and a ceramic binder. The surface properties and removal rate of the SiC substrate were investigated and a comparison with the traditional method was conducted. The experimental results showed that the material removal rate (MRR) was higher for the SiC substrate with the mixed abrasive lapping plate than for the traditional method. The grinding wear rate could be reduced by 31.6%. The surface roughness of the samples polished using the diamond-impregnated lapping plate was markedly better than that of the samples polished using the copper plate. However, while the surface finish was better and the grinding efficiency was high, the wear rate of the mixed abrasive-impregnated polishing plates was high. This was a clear indication that this novel method was effective and could be used for SiC grinding and lapping.

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Wang, Yong Guang, and Liang Chi Zhang. "A Review on the CMP of SiC and Sapphire Wafers." Advanced Materials Research 126-128 (August 2010): 429–34. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.429.

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Chemo-mechanical polishing (CMP) has been a useful method to produce superior brittle wafer surfaces. This paper reviews the CMP of silicon carbide and sapphire wafers, focusing on efficiency of the polishing rate. The effects of slurry type, slurry pH value and mixed abrasives will be discussed in detail.

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Singh, Palwinder, and Lakhvir Singh. "Experimental Examination on Finishing Characteristics of Aluminum Pipes in Magnetic Abrasive Machining Using SiC Contained Glued Magnetic Abrasives." Trends in Sciences 19, no. 19 (October 4, 2022): 6182. http://dx.doi.org/10.48048/tis.2022.6182.

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With the rapid development in the industry, applications of finished parts are increasing day by day. However, the surface finish of the parts fabricated by conventional processes could not readily meet the requirements of various applications. Therefore, post-processing is needed to further improve the surface quality. Magnetic abrasive machining uses a flexible magnetic abrasive brush to remove material from the workpiece surface at a controllable rate. This cutting tool sticks to the workpiece during finishing operation and exerts a small force on the surface. In magnetic abrasive machining, the cutting tool neither requires compensation nor dressing. In this paper, the internal finishing of aluminum pipes has been investigated in magnetic abrasive machining tests using silicon carbide-based glued magnetic abrasives. For evaluating the performance of these magnetic abrasives, experimental work according to the central composite design technique was carried out to finish the aluminum pipes. The results so obtained were analyzed to study the influence of process parameters like magnetic field strength, speed of workpiece, abrasive mesh size and quantity of magnetic abrasives on percentage improvement in surface finish and material removal rate. The analysis showed that magnetic field strength was the most effective parameter while finishing the aluminum pipe followed by the quantity of magnetic abrasives. The finishing at optimal condition resulted in a surface finish of 0.07 μm. Further, scanning electron microscopy of the surface before and after magnetic abrasive machining was taken to study the improvement in surface finish. HIGHLIGHTS Magnetic abrasive machining (MAM) of aluminum work specimens have been performed by SiC-based magnetic abrasives The central composite design has been used for planning and execution of experiments The surface finish and material removal rate of the machined work specimens have been analysed as a performance measure of MAM process The high value of improvement in surface finish and material removal rate at optimum machining conditions have been observed Scanning electron microscopy (SEM) has been employed to study the surface topography of machined surfaces GRAPHICAL ABSTRACT

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Okamoto, Yasuhiro, Yasuaki Kimura, Akira Okada, Yoshiyuki Uno, Jun Ohya, and Toshiyuki Yamauchi. "Challenge to Development of Functional Multi-Wire EDM Slicing Method Using Wire Electrode with Track-Shaped Section." Key Engineering Materials 523-524 (November 2012): 287–92. http://dx.doi.org/10.4028/www.scientific.net/kem.523-524.287.

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Brittle materials, such as silicon, silicon carbide and sapphire have been conventionally sliced for wafers by a multi-wire saw method with slurry in industrial fields. Recently, the multi-wire saw method with a fixed diamond abrasive wire has been available as a commercial product at acceptable cost, and the high slicing performance is expected compared with the normal multi-wire saw method with slurry. However, there still remain some problems such as bad working environment with abrasives, cleaning cost of sliced wafers, crack generation on the sliced surface and a large kerf loss against a wafer thickness. On the other hand, the developed multi-wire EDM slicing method would accomplish the high performance slicing of silicon and silicon carbide with a narrow kerf width under a clean process environment. However, the thinner wire is challenging process with a normal round shape wire electrode. Therefore, the new wire electrode with track-shaped section was proposed in order to satisfy both the narrow kerf width and the high wire tension even in the case of thin wire electrode. In this study, the running control of wire electrode with a track-shaped section was experimentally investigated, and the possibility of proposed process was discussed.

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Kovalchenko, A. M., E. O. Pashchenko, and D. O. Savchenko. "Research on suppressing brittle fracture and implementing ductile mode cutting for improving surface quality at silicon wafers manufacturing." Journal of Physics: Conference Series 2045, no. 1 (October 1, 2021): 012005. http://dx.doi.org/10.1088/1742-6596/2045/1/012005.

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Abstract Single crystal silicon is an important basic material used to manufacture electronic and photovoltaic devices. Ductile mode of diamond wire sawing is a promising method for silicon wafering in order to produce wafers with minimal surface damage. To achieve ductile mode, the correct applying of cutting parameters and careful wire design is necessary. This study investigates the scratching of monocrystalline silicon by the abrasive particles of different geometry, which simulates the material removal process in diamond wire sawing. Diamonds, crushed and spherical tungsten carbide (WC) particles served as abrasives. Experiments show that spherical abrasives enhance ductile mode cutting significantly decreasing brittle damage when compared to irregular shape particles. Spherical WC particles permit to increase the critical load and critical cut depth of ductile-to-brittle transition from 5 to 10 times. The depth of the damaged subsurface layer decreased from 5 µm to 0.2 µm due to the absence of brittle cracks. A uniform regular distribution and appropriate suitable density of abrasive particles is obligatory for cracking reduction. For that, the method of diamond particles uniform deposition with the controlled density by a polymer binder combining high modulus and adhesive capacity with good flexibility was elaborated. The method includes preliminary diamond particles fixation on a thin resin layer providing high uniformity and subsequent strong fixation by a thicker resin layer. The research on ovalization of diamond particles was performed for smoothening cutting edges. The method is based on the activation of the graphitization process at sharp edges of particles under the action of metal salts at increased temperatures.

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Behera, Ranjit Kumar, and Sudhansu Ranjan Das. "Modelling and optimization of technological parameters in hot abrasive jet machining of alumina ceramic." Matériaux & Techniques 107, no. 6 (2019): 603. http://dx.doi.org/10.1051/mattech/2020008.

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The present work focuses on the experimental investigation of hot abrasive jet machining (HAJM) and precision drilling operation on flat surfaces of K-60 alumina ceramic material using different grades of silicon carbide abrasives. The machining AJM setup is designed based on fluidized bed mixing chamber along with pressurized powder feed chamber. The experiments are performed as per Box-Behnken design of experiments (BBDOEs) with four process parameters (pressure, stand of distance, abrasive temperature and grain size) for parametric optimization in order to control the two technological response characteristics (material removal rate, flaring diameter) of the precision holes on K-60 alumina. Analysis of variance (ANOVA), response surface methodology (RSM) and genetic algorithm (GA) are subsequently proposed for predictive modelling and process optimization. Result shows that application of hot abrasives in AJM process has excellent performance in terms of improved material removal rate, and minimum dimensional deviation of drilled hole. Multi-response optimization GA technique presented the optimal setting of machining variables in HAJM process at air pressure of 6.682 kgf/cm2, abrasive temperature of 60.6 °C, stand-off-distance of 7.1124 mm, abrasive grain size of 275.755 µm, with estimated maximal material removal rate of 0.005 gm/s and minimal flaring diameter of 6.382 mm. The methodology described here is expected to be highly beneficial to manufacturing industries.

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Lei, Yu Yong, Dai Jun Jiang, Ke Fu Liu, and Pu Hua Tang. "Experiments on Dicing Monocrystalline Silicon Wafer Using Micro Abrasive Water Jet." Advanced Materials Research 287-290 (July 2011): 2863–68. http://dx.doi.org/10.4028/www.scientific.net/amr.287-290.2863.

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The experiments on dicing monocrystalline silicon wafer using micro abrasive water jet turning were performed. A specifically designed water jet machine tool with four axes was developed and a specially designed cutting head has developed, in which the inside diameter of orifice and focusing tube is f125 mm and f500 mm respectively, while the silicon carbide solid abrasives with average diameter of 25-100 mm was used. In order to control the flow rate of micro abrasives precisely, an abrasive feed system with auger mechanism driven by DC motor reducer was used. The diameters of monocrystalline silicon bars are around 50 mm. Two basic turning methods, i.e. turning with stationary jet and turning with moving jet were applied. The preliminary experimental results such as kerf width, wafer thickness, surface quality etc. were analyzed. It was found that micro abrasive water jet can be used to precisely turn brittle materials like monocrystalline silicon. The turned wafer with thickness of 1 mm above could be achieved. A thinner wafer less than 1 mm is difficult to obtain during experiments because of cracking or chipping. Experiments demonstrate that the wafer surface has macro stripping characteristics similar to linear cutting. It was observed that there is less waviness and smooth surface on the turned wafer when with moving jet. And it depends greatly on the water jet pressure, feed rate of the jet, rotation speed of silicon bar, abrasive particle size as well as flow rate of abrasive. The detailed analysis indicates that the surface roughness of turned wafer with moving jet is around Ra 1.5-5.6 μm, while that of turned wafer with stationary jet is around Ra6.3 μm, when other conditions are same. The results show that surface quality turning with moving jet is obviously better than that of stationary jet. Smaller surface roughness of turned wafer could be obtained when finer abrasive is used. The experiment shows also that the wafer is typically tapered with either the stationary jet or moving jet. There is a concave on the turned surface when feed rate of the jet is too low or dwell time is too long. This is attributed to the jet rebound from one face to the other. Therefore there is an optimizing rotational speed during turning. This study indicates that dicing mono crystalline silicon wafer using micro abrasive water jet turning has potential application in semiconductor industry.

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Chiamulera, Catia, Leandro Lima Evangelista, Fernanda Gonçalves Fernandes, Walter Lindolfo Weingaertner, Rolf Bertrand Schroeter, Márcio Celso Fredel, and Orestes Estevam Alarcon. "Characterization of Silicon Carbide Grit for Fickerts Used in Porcelain Tile Honing and Polishing Process." Advanced Materials Research 325 (August 2011): 548–54. http://dx.doi.org/10.4028/www.scientific.net/amr.325.548.

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This paper presents results of morphological and dimensional characterization of silicon carbide (SiC) abrasives used in production of fickerts for the rotary plane honing and polishing process of porcelain tiles. For morphological characterization scanning electron microscopy (SEM) and optical reflection microscopy images were analyzed by software to determine the circularity factor of the particles. In order to analyze the particle size dispersion sieving and laser diffraction were used. Five samples within the same batch of abrasives and with different sizes were characterized. The results show a uniform dispersion with a small variation of the particles size. Regarding the form of particles, the angularity increases in the samples with smaller size. The employed procedure for the analysis of circularity factor is a method frequently used to characterize SiC particles.

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Rudresh, B. M., B. N. Ravikumar, and D. Madhu. "Tribological Response of Polyamide 66 and Polytetrafluroethylene (PA66/PTFE) Blends in Two Body Abrasion Through Multipass Condition." International Journal of Surface Engineering and Interdisciplinary Materials Science 6, no. 1 (January 2018): 1–16. http://dx.doi.org/10.4018/ijseims.2018010101.

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The different weight percentages of 95/5, 90/10, 85/15, 80/20, 75/25 and 70/30 of PA66/PTFE blend composition was investigated as per the ASTM G99 method. The abrasive wear studies were conducted in multipass condition against waterproof silicon carbide (SiC) abrasive paper of 180 and 320 grit at a constant load of 5 N and 10 N with a sliding velocity of 1 m/s for varying abrading distances using pin-on-disc machine. It was found that the wear volume loss of composites increases linearly with increase in applied load and abrading distance. A significant reduction in wear resistance has been observed in terms of wear volume and specific wear rate with increase in addition of PTFE dosage in PA66/PTFE blend. Further, it was observed that the wear volume loss of composites has been decreased with increase in the rank of grit size. Higher wear volumes was due to deep penetration of large sized particles of 180 grit abrasives and less for 320 grit abrasives due to the transition of abrasion wear to sliding. The specific wear rate decreases with an increase in abrading distance for all the tested specimens. Microcutting, microploughing and fatigue loading of abrasive particles are the major failure mechanisms observed during the worn surface analysis using SEM.

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Olenburg, Anatolij, Marcelo Reami Salati, Filipe Sant´Ana, and Fabio Jose Pinhero Sousa. "Polishing Process of Ceramic Tiles - Variation of Contact Pressure." Advanced Materials Research 769 (September 2013): 124–30. http://dx.doi.org/10.4028/www.scientific.net/amr.769.124.

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The contact pressure is one of the most important parameter in the industrial polishing process of ceramic tiles. The contact pressure is asically a function of the elasticity moduli of both tile and abrasive tool, the applied load, and also the curvature of the abrasive tool. Due to the wear, this curvature decreases during the polishing process, causing an increase in the contact pressure. The purpose of this work is to research the influence of contact pressure on the evolution of gloss and roughness of the polished ceramic tiles and to improve the quality of generated surface. The variation of curvature was replaced with the direct increment of three different normal forces onto the abrasive tool. It is known from literature that for fine abrasive grits higher tool loads increase gloss gain and decrease roughness. However, there are not many works that research the whole sequence of abrasives for different loads and compare the quality of the final surface. Polishing tests on a laboratory scale CNC-Tribometer have been used to study the industrial polishing process for unglazed porcelain ceramic tiles. Tests were carried out for three different tool loads with a sequence of progressively smaller silicon carbide abrasive particles embedded in a magnesia cement matrix. Tile surface quality was evaluated by roughness and optical gloss. The removed work piece material and the used abrasive were measured with a coordinate measuring machine. The distribution of gloss and roughness of the tile was measured before and during the experiments until a saturation of gloss and roughness for each grit number was achieved, respectively. The topography of the tile was measured before and after the polishing process with particularly grit number. The used abrasives show a general trend of increasing gloss and decreasing roughness during the process. The coarse abrasives caused the major effect on surface roughness and almost no effect on gloss. In opposite finer abrasives caused the major gloss enhancement and almost no effect on surface roughness. The results show the evolution of roughness and gloss for each load as a function of abrasive grit number and polishing time, as well as the material removal rate for each grit number and load.

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Titov, A., A. Walters, Hirokazu Sasai, and T. Shindo. "Cost-Efficient High-Throughput Polishing of Silicon Carbide Seed Crystals." Materials Science Forum 1004 (July 2020): 193–98. http://dx.doi.org/10.4028/www.scientific.net/msf.1004.193.

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Polishing of Silicon Carbide (SiC) seed crystals and substrates to achieve an extremely smooth, level surface, and an optically clear finish takes many surface finishing steps with very long processing times producing a significant amount of slurry waste and utilizing numerous lapping and polishing machines. This paper presents a newly developed cost-efficient SiC polishing process which reduces these operations to two surface finishing steps for achieving an optically clear finish on monocrystalline SiC material where the same size of diamond abrasives for lapping and polishing steps allows to carry out stock removal lapping and polishing processes on a single platform (machine) without concern of cross-contamination and making it as a very cost-efficient and high-throughput polishing process for SiC seed crystals and substrates.

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Czepułkowska-Pawlak, Weronika, Emilia Wołowiec-Korecka, and Leszek Klimek. "The Surface Condition of Ni-Cr after SiC Abrasive Blasting for Applications in Ceramic Restorations." Materials 13, no. 24 (December 21, 2020): 5824. http://dx.doi.org/10.3390/ma13245824.

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Abrasive blasting is a process widely used in dentistry. One of the uses is the development of metal surfaces for connections with ceramics in fixed prosthetic restorations. The purpose of this paper was to check how the rough surface profile (width, height, and depth on unevenness) impacts the surface’s condition, like its wettability and percentage of stuck abrasives. The Ni-Cr alloy surface was abrasive blasted by silicon carbide with the various pressure parameters (0.2, 0.4, and 0.6 MPa) and abrasive particle sizes (50, 110, and 250 µm). Cleaned surfaces were examined for roughness, wettability, and percentage of stuck abrasive particles on the surface. The surface after abrasive blasting using 110 µm of abrasive size and 0.4 MPa pressure has the best wettability results. The width of unevenness may cause it. When the unevenness has too small or too large width and depth, the fluids may not cover the entire cavities because of locking the air. The surface condition of dental alloys directly affects metal–ceramic connection strength. The knowledge about the impact of the abrasive blasting parameters on the bond strength will allow one to create durable dental restorations.

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Tanaka, Hiroshi, Yoshitugu Kawase, and Yoichi Akagami. "Novel Polishing Method of Cutting Edge Using AС Electric Field for Controlling Flank Wear." Key Engineering Materials 767 (April 2018): 268–74. http://dx.doi.org/10.4028/www.scientific.net/kem.767.268.

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Polycrystalline cubic boron nitride (cBN), a super-hard material used for hard turning, has good compatibility with steel. However, because chipping occurs from already existing defects and worn out cutting edges, a cBN insert must be exchanged within a short cycle time. By reducing chipping and flank wear, one can reduce the tool costs related to cutting processes and reduce the number of times the insert has to be exchanged, leading to improved productivity. In this study, the authors hypothesize that chipping and flank wear during cutting reduced by polishing a tool edge finely, uniformly, and smoothly before cutting. An apparatus capable of polishing and smoothing a cutting tool edge uniformly is developed. In the free-abrasive control method, application of an AC electric field during polishing is applied to suppress the scattering of abrasives from the tool cutting edge. Results show that scratches created by grinding are nonexistent. Moreover, a smooth cutting edge is obtained after polishing treatment. The wear width of the polished cBN tool under a cutting speed of 50 m/min is half of that of the non-polished treatment tool. Furthermore, no chipping occurs with the polished cBN tool under any conditions. Additionally, results show that the same effect is obtained even when Silicon carbide (SiC) abrasives are used. The n value calculated using the Taylor tool life equation is almost identical in cases of both diamond and SiC abrasives.

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Kumara, Pavana, and G. K. Purohit. "Improving Surface Roughness of Burnished Components using Abrasive Particles." International Journal of Automotive and Mechanical Engineering 15, no. 3 (October 5, 2018): 5592–606. http://dx.doi.org/10.15282/ijame.15.3.2018.15.0430.

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Roller burnishing process was carried out on free cutting brass materials in the presence of fine silicon carbide abrasives in the form of paste on a pre-machined surface. The results of ‘without-paste’ burnishing (plain burnishing, PB) and ‘with-paste’ burnishing (abrasive assisted burnishing, AAB) processes are compared to examine the effect of abrasive particles in the burnishing process. A 24 full factorial design is adopted to develop the mathematical model for surface roughness regarding four process parameters like burnishing force, burnishing speed, burnishing feed and number of passes for both the cases, i.e. PB and AAB. Analysis of variance (ANOVA) was carried out to find the effect of process parameters and to check the adequacy of the models. The results show that the parameters have a significant effect on the response in PB to improve the surface roughness by 75 % than the turned components. Whereas in AAB, fine abrasive particles as a single entity controlling the response and making other parameter effects as non-significant. Surface roughness further improved by 15 % in AAB process.

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Govindaraju, M., A. Megalingam, Jayaprakash Murugasan, R. Vaira Vignesh, Pavan Kalyan Kota, A. Sumanth Ram, P. Lakshana, and V. Naveen Kumar. "Investigations on the tribological behavior of functionally gradient iron-based brake pad material." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 234, no. 12 (February 18, 2020): 2474–86. http://dx.doi.org/10.1177/0954406220905858.

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In this study, a functionally gradient iron-based brake pad material was developed and the tribological behavior was studied. The functionally gradient specimen had more copper near the base plate and more abrasives towards the top, which provides excellent joint strength and serves the purpose of braking, respectively. The layers had a hybrid composition of metallic materials (Fe, Cu), and abrasives (silicon carbide and aluminum oxide) to improve the strength, wear resistance, and toughness. Graphite was added to stabilize the specimen's thermal and friction characteristics at high temperature. The microstructure, wear rate, and friction coefficient of the functionally gradient specimen and the conventionally sintered specimen were evaluated. The results indicate that the wear resistance of the functionally gradient specimen is higher than the wear resistance of conventional specimen.

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Isohashi, Ai, Yasuhisa Sano, Tomohisa Kato, and Kazuto Yamauchi. "Planarization of 6-Inch 4H-SiC Wafer Using Catalyst-Referred Etching." Materials Science Forum 821-823 (June 2015): 537–40. http://dx.doi.org/10.4028/www.scientific.net/msf.821-823.537.

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Catalyst-referred etching (CARE) is a planarization method based on the chemical etching reaction, which does not need abrasives. In this paper, CARE was applied to the planarization of 6-inch silicon carbide (SiC) wafers, and removal properties were investigated. The etching rate was about 20nm/h, which is almost equal to that of 2-inch SiC wafer (16 nm/h). The rms roughness was reduced along with the removal depth, and step-terrace structure was observed in whole area of the on-axis wafer surface.

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Leite, Sueli Souza, Gessica Mina Kim Jesus, Manoel Cléber de Sampaio Alves, Ivaldo de Domenico Valarelli, Fabio Alexandre Moizes, and Vitor Manoel Salvadeo. "Experimental investigation of parameters impacting the roughness of Pinus elliottii wood." BioResources 14, no. 1 (January 25, 2019): 2051–61. http://dx.doi.org/10.15376/biores.14.1.2051-2061.

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The wood sanding process entails a small reduction in the dimensions of the workpiece in the course of modifying its surface morphology, which affects the aesthetics and the subsequent application of a coating. However, sanding is costly, partly because it is performed empirically without standardization. Therefore, this study analyzed the influence of sandpaper factors on the behavior of wood surface roughness for Pinus elliottii. A complete factorial experiment was performed, varying two types of abrasives, aluminum oxide and silicon carbide, in three grit sizes (80, 100, and 120), and three sandpaper conditions (new, semi-new, and worn). The tests were performed using a flat sander with a pneumatic circuit and monitoring system for data acquisition, which were analyzed through multiple Tukey tests. The results were organized in a consultation table that compared the combination of factors analyzed, informing whether they produced roughness of the wood equal to or distinct from each other. The results showed that new aluminum oxide sandpapers with grit sizes of 80, 100, and 120 produced roughness of the wood different from each other, while the carbide did not. Therefore, there is no need to trade or buy silicon carbide sandpaper in these grit sizes.

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王, 嘉琳. "Preparation and Characterization of Silicon Carbide Abrasives Based on Silica-Alumina Sol-Gel Composite." Open Journal of Natural Science 11, no. 03 (2023): 367–72. http://dx.doi.org/10.12677/ojns.2023.113044.

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Landsberger, Felipe Ortega O., Antônio Augusto Couto, Alexandre R. Zandonadi, and Danieli A. P. Reis. "Study of Abrasive Ceramic Powders on the Fine Polishing of Metallic and Polymeric Surfaces." Materials Science Forum 660-661 (October 2010): 1025–29. http://dx.doi.org/10.4028/www.scientific.net/msf.660-661.1025.

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Nowadays the polishing products for finishing procedures have a high cost in the finishing process, once these products are imported or made by synthetic diamond. This study shows the polishing effects of several of low cost abrasives ceramic powders available on the national market. The material used in this study were silicon carbide and aluminum oxide, the variables of particle diameter and surface roughness were analyzed. The test samples materials used in the experiments were aluminum, carbon steel 1020, stainless steel 304 and polycarbonate. Finally, a comparative evaluation was showed using metallographic polishers already existent on the market.

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Governa, M., M. Valentino, M. Amati, I. Visonà, G. C. Botta, G. Marcer, and C. Gemignani. "Biological effects of contaminated silicon carbide particles from a workstation in a plant producing abrasives." Toxicology in Vitro 11, no. 3 (June 1997): 201–7. http://dx.doi.org/10.1016/s0887-2333(97)00018-0.

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Suzuki, Hirofumi, and Kazuhito Ohashi. "Special Issue on Advanced Abrasive Process Technologies." International Journal of Automation Technology 13, no. 6 (November 5, 2019): 721. http://dx.doi.org/10.20965/ijat.2019.p0721.

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The demand for high-precision and high-efficiency machining of hard ceramics such as silicon carbide (SiC) for semiconductors and hardened steel for molding dies has significantly increased for power devices in automobiles, optical devices, and medical devices. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, or semiconductor materials have to be machined by precision abrasive technologies such as grinding, polishing, and ultrasonic vibration technologies with diamond super abrasives. The machining of high-precision components and their molds/dies by abrasive processes is much more difficult owing to their complex and nondeterministic nature as well as their complex textured surface. Furthermore, high-energy processes with UV lasers and IR lasers, and ultrasonic vibration can be used to assist abrasive technologies for greater precision and efficiency. In this sense, precision grinding and polishing processes are primarily used to generate high-quality and functional components usually made of hard and brittle materials. The surface quality achieved by precision grinding and polishing processes becomes more important to reduce processing time and costs. This special issue features seven research papers on the most recent advances in precision abrasive technologies for hard materials. These papers cover various abrasive machining processes such as grinding, polishing, ultrasonic-assisted grinding, and laser-assisted technologies. We deeply appreciate the careful work of all the authors and thank the reviewers for their incisive efforts. We also hope that this special issue will encourage further research on abrasive technologies.

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Tomono, Kazuaki, Hirotoshi Furuya, Seiji Miyamoto, Yuki Okamura, Michinori Sumimoto, Yoshihisa Sakata, Ryuichi Komatsu, and Masaharu Nakayama. "Investigations on hydrobromination of silicon in the presence of silicon carbide abrasives as a purification route of kerf loss waste." Separation and Purification Technology 103 (January 2013): 109–13. http://dx.doi.org/10.1016/j.seppur.2012.10.031.

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Yamada, Takazo, Kazuhito Ohashi, Hirofumi Suzuki, and Akinori Yui. "Special Issue on High Performance Abrasive Technologies." International Journal of Automation Technology 16, no. 1 (January 5, 2022): 3–4. http://dx.doi.org/10.20965/ijat.2022.p0003.

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Demand for the high-precision and high-efficiency machining of hard ceramics, such as silicon carbide for semiconductors and hardened steel for molding dies, has significantly increased for optical and medical devices as well as for powered devices in automobiles. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, and semiconductor materials have to be machined using precision abrasive technologies, such as grinding, polishing, and ultrasonic vibration technologies that use diamond super abrasives. The machining of high-precision components and their molds/dies using abrasive processes is very difficult due to their complex and nondeterministic natures as well as their complex textured surfaces. Furthermore, the development of new cutting-edge tools or machining methods and the active use of physicochemical phenomena are key to the development of high-precision and high-efficiency machining. This special issue features 11 research papers on the most recent advances in precision abrasive technologies. These papers cover the following topics: - Characteristics of abrasive grains in creep-feed grinding - Quantitative evaluation of the surface profiles of grinding wheels - ELID grinding using elastic wheels - Nano-topographies of ground surfaces - Novel grinding wheels - Grinding characteristics of turbine blade materials - Polishing mechanisms - Polishing technologies using magnetic fluid slurries - Application of ultrasonic vibration machining - Turning and rotary cutting technologies This issue is expected to help its readers to understand recent developments in abrasive technologies and to lead to further research. We deeply appreciate the careful work of all the authors, and we thank the reviewers for their incisive efforts.

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Anasyida, Abu Seman, and Mohd Sharif Nurulakmal. "Wear behaviour of carbon steel cutting wheel thermal flame sprayed with chromium carbide." Industrial Lubrication and Tribology 67, no. 2 (March 9, 2015): 93–98. http://dx.doi.org/10.1108/ilt-04-2013-0042.

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Purpose – This study aims to develop and evaluate an inexpensive and durable metal cutting wheel using thermal spraying and polymer binding to enhance the wheel’s cutting capability by bonding hard particles (abrasives) onto the wheel. Design/methodology/approach – Thermal spraying was used to deposit the coating powder (chromium and silicon carbide) onto high carbon substrate. Wear loss and depth of cut as function of load, time and speed were evaluated on uncoated and coated wheel. Findings – The coated cutting wheel performed better than the uncoated cutting wheel in terms of wear performance. However, the coated cutting wheel experienced coating peel off at higher load and cutting speed, leading to a decrease in wear resistance of the cutting wheel. Thus, optimally cutting should be performed either at low cutting speed and high load or at high cutting speed and low load to prolong the wheel’s lifetime. Originality/value – The outcome of the study will be beneficial for academicians and industrial working on cutting wheel process.

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Zhang, Wei, Tengwei Qiu, and Chunyan Yao. "Preparation and Optimization of High-Purity Silicon Carbide Magnetic Abrasives for the Magnetic Induction-Wire Sawing Process." Fluid Dynamics & Materials Processing 16, no. 4 (2020): 709–21. http://dx.doi.org/10.32604/fdmp.2020.010748.

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Governa, Mario, Matteo Valentino, Monica Amati, Francesca Monaco, Isabella Visoná, Gian Carlo Botta, Guido Marcer, and Carla Gemignani. "Reactive Oxygen Species Measured from Suspensions of Polymorphonuclear Leukocytes after the Addition of Silicon Carbide Particles." Alternatives to Laboratory Animals 24, no. 4 (August 1996): 553–56. http://dx.doi.org/10.1177/026119299602400415.

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A sample of silicon carbide (SiC) dust was collected from a factory manufacturing SiC abrasives, then tested in vitro to find out whether it could produce reactive oxygen species (ROS) after its addition to human polymorphonuclear leukocyte suspensions. We compared the results of milled and unmilled SiC with those obtained from quartz dust and asbestos fibres, which are known causes of severe pulmonary lesions. ROS production was measured with the chemiluminescence (CD technique. CL values obtained with our two forms of SiC (milled and unmilled) were approximately twice those measured in the controls (where no mineral particles were added), approximately 80% of the values found with asbestos fibres, and only 12.5% of the values measured with quartz. Iron traces were found on the surface of a small number of the particles tested, which could be as a result of contamination. These iron traces could help to explain our findings, since, together with the iron traces present in the culture medium, they could have triggered ROS generation in a Fenton-type reaction.

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Görgülü, K., and A. Ceylanoğlu. "Evaluation of continuous grinding tests on some marble and limestone units with silicon carbide and diamond type abrasives." Journal of Materials Processing Technology 204, no. 1-3 (August 2008): 264–68. http://dx.doi.org/10.1016/j.jmatprotec.2007.11.039.

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CONSTANTINESCU, B., V. JOHN KENNEDY, and G. DEMORTIER. "ON RELEVANT PIXE INFORMATION FOR DETERMINING THE COMPOSITIONAL ANALYSIS OF ANCIENT SILVER AND BRONZE COINS." International Journal of PIXE 09, no. 03n04 (January 1999): 487–93. http://dx.doi.org/10.1142/s0129083599000607.

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In this work, external PIXE was applied for the analysis of ancient silver and bronze coins. Turkish and Romanian silver coins, Roman and Byzantine bronze coins were investigated using a 3 MeV proton beam. To evaluate the in-depth distribution of major and minor elements ( Cu , Ag , Au , Pb for silver matrix and Cu , Zn , Ag , Sn , Pb for copper matrix), the coins were polished using silicon carbide abrasives. In order to test the homogeneity of the coins, measurements were carried out at three different impact points. Each position of the samples was carefully controlled in order to avoid differences in geometrical factors from one analysis to another. All the analyses were performed on flat external and bright regions so as to exclude the irradiation of possible inclusions or deposits. The calculations of the elemental concentrations in the coins were made by relative to reference standard alloys ( Ag - Cu , Cu - Sn , Sn - Pb ).

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Shi, Zhi Feng, Zhen Yu Zhang, Si Ling Huang, Bo Ya Yuan, Xiao Guang Guo, Ping Zhou, and Zhu Ji Jin. "Chemical Mechanical Polishing on Extremely Low Expansion Glass Ceramic Wafers." Materials Science Forum 874 (October 2016): 389–94. http://dx.doi.org/10.4028/www.scientific.net/msf.874.389.

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Extremely low expansion glass ceramics are widely used in integrated circuit (IC), liquid crystal display (LCD) lithography, high-precision measurement and astronomy, due to their excellent mechanical properties and chemical stability at higher temperatures. Nevertheless, the extremely low expansion glass ceramics are hard-to-machine materials due to their hard-brittle nature, resulting in cracking, chipping and scratching induced in conventional machining. This leads to higher surface roughness, and is not qualified for high-performance devices. In this study, surface roughness of 0.447 and 4.904 nm are achieved for Ra and peak-to valley (PV), respectively with a measurement area of 70×53 μm2 after chemical mechanical polishing (CMP). Firstly, the glass ceramic wafers are lapped using silicon carbide (SiC) abrasives on a cast-iron plate. After lapping, the wafers are polished by CeO2 slurry in a sequence of 3 μm and 500 nm in diameter, and polyurethane and floss pads are used correspondingly. Finally, CMP is employed on the glass ceramic wafers. Floss pad and silica slurry are used in CMP in an alkaline solution with a pH value of 8.5. After CMP, the wafers are cleaned and dried by deionized wafer and compressed air, respectively.

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Mante, Francis K., Aaron Kim, Kristi N. Truong, Kriti Mittal, Spoorthi Alapati, Sarah Hagan, and Jie Deng. "Effect of Preirradiation Fluoride Treatment on the Physical Properties of Dentin." International Journal of Dentistry 2022 (March 17, 2022): 1–8. http://dx.doi.org/10.1155/2022/3215048.

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Objective. To determine the effects of preirradiation fluoride treatments on the Knoop hardness of dentin. Materials and Methods. Human posterior teeth mounted into acrylic resin molds were polished with silicon carbide (SiC) abrasives and 3-micron diamond paste. The Knoop hardness of dentin was measured with a Leco hardness instrument. The teeth were divided into groups of ten teeth per group as follows: no treatment (control), treatment with silver diamine fluoride (SDF), MI varnish (MI), and cavity shield (CS). The teeth were exposed to 2 Gy of daily radiation for six weeks using an X-Rad 320ix biological irradiator. Hardness was measured weekly, before, during, and after irradiation. The teeth were stored in artificial saliva at 37oC between radiation treatments. Results. In preirradiation dentin, a Knoop hardness value of 58.8 (14.1) KHN was obtained. Treatment with SDF significantly increased KHN before irradiation. Immediately after radiation treatment, hardness was significantly reduced in all experimental groups. Postirradiation fluoride treatments increased the hardness of dentin to varying degrees. Conclusions. Preirradiation fluoride treatment does not provide protection from decreases in the hardness of dentin. Treatment of teeth with fluoride formulations after radiation progressively restores the hardness of dentin to different degrees.

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Dorigo, Wana Favero Gaburo, Leonardo Luiz Lyrio da Silveira, and Phillipe Fernandes de Almeida. "Ecological Fickerts Used in the Dimension Stones Polishing Reinforced with Silica from the Rice Hull Ash." Key Engineering Materials 848 (June 2020): 66–74. http://dx.doi.org/10.4028/www.scientific.net/kem.848.66.

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The processing stages of the dimension stones industry uses inputs mainly from petroleum-derived chemicals that can cause damages to the environment and to the human health. Therefore, there is a need to develop more ecological and sustainable technologies aiming to replace the conventional inputs by less aggressive ones. From this, ecological fickerts made from polyurethane castor oil resin (Ricinus communis L.), silicon carbide (SiC), silica from rice hull ash (RHA) and synthetic diamonds were developed in order to compare them with the epoxy resin fickerts currently used in industry. For such, each half of a Brazilian granite slab was polished using each different type of fickerts and the gloss measures results were compared. It was found that the side of the slab polished using the ecological fickerts presented brightness values about 10 Gloss Units (GU) greater than the other side polished with the conventional abrasives. In addition, the ecological fickerts presented lower wear values, and consequently lower mass loss compared to the conventional ones. These results indicate that the ecological fickerts are a good alternative to the dimension stones polishing, even considering sustainability aspects and more eco-efficiency inputs materials.

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Reddy, Y. Rameswara. "Response Optimization of Machining Parameters using MCDA-Vikor Method for Acrylic Glass with AHAJM." International Journal for Research in Applied Science and Engineering Technology 11, no. 7 (July 31, 2023): 217–25. http://dx.doi.org/10.22214/ijraset.2023.54596.

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Abstract: Abrasive Hot Air Jet Machining (AHJM) is becoming one of the most prominent machining techniques forPolymethyl Methacrylate (PMMA) and other brittle materials. In this attempt has been made to combine abrasive and hot air to form an abrasive hot air jet. Abrasive hot air jet machining can be connected to different tasks, for example, boring, surface scratching, scoring and small scale completing on the glass and its composites. The impact of air temperature onthe material expulsion rate connected to the procedure of glass carving and scoring is talked about in this article. The unpleasantness of the machined surface is additionally investigated. It is discovered that the material removal rate (MRR) increments as the temperature of transporter media (air) is expanded. In the present work to be attempt to investigate machining characteristics of PMMA material on hot air abrasive jet machining. In hot air abrasive jet machining(HAJM) abrasive particles stay on abrasive particle stay molten by compacted air in a closed chamber and are intensive over the objective surface over a nozzle the stream of particles coming out of the nozzle through very high velocity’s (175-300m/s) impacts the objective surface and eliminates the material by destruction. The investigation has to be carried on to study the effect of process parameters as material removal rate(MRR) as surface roughness(SR) with different input parameters like Air Pressure, , Size Of Abrasives , Stand-Off Distance ,Temperature Of Carrier Gas. In this experimental process Tungstencarbide coated nozzles were to be used flow of silicon carbide(sic) particles will be used.The Poly(methyl methacrylate) (PMMA), furthermore saw as acrylic glass, acrylic material, or plexiglass as suitably as by using the change names Plexiglas, Crylux, Lucite, Acrylate. PMMA it is an unquestionable thermoplastic .the creation formula of PMMA is (C5O2H8)n it has incredible properties to, for instance, lightweight, 92% Transparent observable light effect inside 3mm of thick material, extraordinary solidarity to consider another polystyrene. it's for the most part important in these zones, for instance, Because of its direct properties, lightweight and preferable quality took a gander at over glass, It was broadly usedto make aircraft windshields, shades and weapon turrets. After this couple of different business applications were made for PMMA, for instance, glass material, façade arrangement, publicizing, vehicle headlamps, etc.,

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Liu, Hsien-Kuang, Chao-Chang A. Chen, and Chun-Jen Chen. "Effect of graphene additions on polishing of silicon carbide wafer with functional PU/silica particles in CMP slurry." Functional Materials Letters 12, no. 05 (September 17, 2019): 1950066. http://dx.doi.org/10.1142/s1793604719500668.

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In this paper, a functional ternary slurry consisting of polyurethane (PU) microspheres, graphene oxide (GO) nano platelets and silicon oxide (SiO2) abrasives was used to carry out the polishing process on Si face of 4H-SiC wafers. The processing parameters of the slurry include graphene weight fraction in slurry GO1–GO7 (0.1–0.7[Formula: see text]wt.%), pH value (3–5), and sonication time T5–T15 (5–15[Formula: see text]min). Polishing process is conducted with two kinds of polishing pads A and B, PU and PC (polycarbonate). Results show that material removal rate (MRR) increases with increasing GO weight fraction up to GO5; besides, MRR also increases with increasing sonication time up to T10, and with increasing pH value. Using PU pad, the GO5-T10-pH5-A slurry leads to highest MRR 102.220[Formula: see text]nm/h of the polished SiC wafer. On the other hand, surface roughness improvement rate (SRIR) increases with increasing GO weight fraction up to GO5, and increases with increasing sonication time up to T15. But SRIR is not affected by pH value. Regarding effect of pad type, on average the PU pad results in higher MRR and better SRIR compared with the PC pad. Using PC pad, GO5-T10-pH5-B leads to lower MRR of 87.627[Formula: see text]nm/h. The addition of GO as the ternary slurry demonstrates its better effect on polishing SiC wafers by comparing with the counterpart binary slurry without GO. For example, MRR by the counterpart slurry SiO212-pH5-A is 58.411[Formula: see text]nm/h, which is lower than 102.220[Formula: see text]nm/h by the ternary slurry GO5-T10-pH5-A. Both XPS and Raman spectra demonstrate that the wafer polished by the functional ternary slurry can effectively produce the softer SiO2 reactant layer on SiC wafer, and result in better polishing performance.

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Wang, Peizhi, Peiqi Ge, Mengran Ge, Wenbo Bi, and Jianfeng Meng. "Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw." Ceramics International 45, no. 1 (January 2019): 384–93. http://dx.doi.org/10.1016/j.ceramint.2018.09.178.

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Yang, Lu, Ke Hua Zhang, Guang Zhen Zheng, and Hang Guo. "Preparation and Processing Performance of Viscoelastic Abrasive Flow." Key Engineering Materials 546 (March 2013): 55–59. http://dx.doi.org/10.4028/www.scientific.net/kem.546.55.

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Abstract. Abrasive flow machining (AFM) is an advanced technology which can improve the uniform consistency of profiled surface. First, the dielectric characteristics of the abrasive flow (the medium features include medium types, medium viscosity coefficient, the concentration of medium and abrasive, abrasive type, abrasive size) is studied, abrasive flow including different medium is deployed by mixing and mix well of the polymer silicone fluid, silicone oil, wax, and other fats, and adding silicon carbide with different particle size and mixed for processing experiment. Within the limits of the workpiece polishing, the change direction of the surface roughness and the removal rate of workpiece surface are substantially same and approaching the linear relationship, the lowest surface roughness Ra of SiC (abrasive particle size is 200#) reduced from 3.5μm to 0.5μm. The hardness and durability of the silicon carbide abrasive in this study is quite good, and the price is low, the processing characteristics are quite consistent with the economic costs on the demand.

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Gao, Bo, Wenjie Zhai, Quan Zhai, and Mingzhuang Zhang. "Novel polystyrene/CeO2-TiO2 multicomponent core/shell abrasives for high-efficiency and high-quality photocatalytic-assisted chemical mechanical polishing of reaction-bonded silicon carbide." Applied Surface Science 484 (August 2019): 534–41. http://dx.doi.org/10.1016/j.apsusc.2019.04.037.

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Sugozu, Kezban Banu, Behcet Daghan, Ahmet Akdemir, and Necati Ataberk. "Friction and wear properties of friction materials containing nano/micro-sized SiO2 particles." Industrial Lubrication and Tribology 68, no. 2 (March 14, 2016): 259–66. http://dx.doi.org/10.1108/ilt-06-2015-0083.

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Purpose – Among the components used for a car brake lining, the chemical and structural properties of the abrasives, jointly with the morphology and size of the particles influence the friction parameters and stability of the composite. This paper aims to investigate the effect of nano SiO2 particles in brake pads on friction and wear properties. Design/methodology/approach – In this paper, the effects of SiO2 (Silica) particles of varying size on the friction-wear properties of polymeric friction composites are investigated. Four friction composites were prepared containing (5, 10 Wt.%) micro silica (MS) particles and (5, 10 Wt.%) nano silica (NS) particles. The samples were produced by a conventional procedure for a dry formulation following dry-mixing, pre-forming and hot pressing. Friction and wear characteristics of the specimens against to a disk made of cast iron were studied. Friction coefficient, specific wear rate and hardness of specimens were obtained. Detailed examinations on the worn surface were analyzed using a scanning electron microscope. Findings – The results of test showed that the inclusion of nano silicon carbide (SiC) powder improved the wear performance significantly. Friction coefficient (μ) of NS samples was higher than the MS samples. Micro-SiC showed poor performance and μ. High wear performance was exhibited in materials containing 5 Wt.% NS and 10 Wt.% NS. Originality/value – This paper emphasizes the importance of nano-composites in the automotive industry and helps to industrial firms and academicians working on wear of materials.

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Napiórkowski, Jerzy, Klaudia Olejniczak, and Łukasz Konat. "Wear Properties of Nitride-Bonded Silicon Carbide under the Action of an Abrasive Soil Mass." Materials 14, no. 8 (April 19, 2021): 2043. http://dx.doi.org/10.3390/ma14082043.

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Nitride-bonded silicon carbide is an alternative to steels resistant to abrasive wear. This paper presents the results of a nitride-bonded silicon carbide (SiC) wear test in diverse soil conditions. The test was performed on a “spinning bowl” test stand on three soil types: loamy sand, light loam and ordinary loam. The results were referred to the wear test for materials used to make parts working soil mass, i.e., abrasive wear-resistant steel, boron steel and C + Cr + Nb padding weld. The abrasive wear resistance of silicon carbide was shown to depend on the grain size distribution of the soil being worked. Silicon carbide showed the highest resistance in light soil. However, the padding weld showed higher wear resistance in the other soil conditions. Nitride-bonded silicon carbide had higher wear resistance than the steels under study in all of the soils. These findings are supplemented by an analysis of the condition of the worked surfaces after friction tests. The dominant wear methods in all abrasive masses were micro-cutting and furrowing.

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Hynes, N. R. J., A. D. Asirvatham, S. Raja, B. Benita, and J. Atchaya. "Investigation on surface roughness and kerf analysis in abrasive water jet machining of silicon carbide." Archives of Materials Science and Engineering 120, no. 1 (March 1, 2023): 30–35. http://dx.doi.org/10.5604/01.3001.0053.6017.

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Machining silicon carbide (SiC) is challenging due to its brittle and maximum tensile nature. Lapping or laser beam are done with a high cost of manufacturing and low material removal rates. Water abrasive jet cutting is a promising candidate since the machining temperatures and processing force of ceramics are extremely low. Investigation into the abrasive water jet machining of silicon carbide is carried out in the present work.The variations in traverse speed while abrasive water jet cutting of silicon carbide and its effect on the surface roughness and kerf characteristics are studied. Silicon Carbide abrasive material is used as garnet consisting of 80 mesh. The surface roughness was calculated along with the depth of the cut made during the processing.The outcomes demonstrated that the traverse speed is more effective upon the surface roughness and is an important factor that damages the top kerf width and the kerf taper angle.Based on the hardness and thickness of the SiC plate, the taper angle is high, and for a feed rate of 10 mm/min, the surface roughness is low. Less thickness of the SiC plate could have a lower taper angle than with high thickness. The erosive force is provided by abrasive material along with the jet stream.Water abrasive fine jet could effectively machinate silicon carbide ceramic material with a better surface finish accurately. Suitable surface roughness with higher productivity can be attained with medium traverse speed.The effect of process parameters on kerf taper angle and top kerf width in the abrasive water jet machining of silicon carbide is explored, considering surface roughness as an important output parameter.

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Bishutin, Sergey, and Sergey Alehin. "THE INFLUENCE OF ABRASIVE TREATMENT ON THE CRACK RESISTANCE OF SILICON CARBIDE PLATES OF VARIOUS POLYTYPES." Transport engineering 2022, no. 4 (April 18, 2022): 17–22. http://dx.doi.org/10.30987/2782-5957-2022-4-17-22.

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The study is aimed at reducing defects in the manufacture of semiconductors made of silicon carbide, which is achieved by studying the effect of technological modes of machining with loose abrasive (diamond micro-powder in a special paste) on the crack resistance of silicon carbide plates. The results of diamond abrasive treatment of silicon carbide plates of 4H and 6H polytypes are given. The dimensions of surface micro cracks of ceramic substrates after machining with diamond powder pastes of various grit are studied, and the interconnection between the length of the surface micro crack and the material removal rate, depending on the technological modes of diamond abrasive treatment, is established. For the first time, a scientifically based approach to choosing modes of diamond abrasive treatment of silicon carbide plates of various polytypes is proposed, in which appearing micro cracks are not capable of destroying the product at the subsequent technological stages of manufacturing semiconductors.

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Nosenko, Vladimir A., Alexander V. Fetisov, and Nikita D. Serdyukov. "Study of Metal, Silicon Carbide Crystals and Ceramic Bond Transfer to the Surface of Titanium Alloy during Grinding." Solid State Phenomena 316 (April 2021): 515–20. http://dx.doi.org/10.4028/www.scientific.net/ssp.316.515.

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The high adhesive activity of titanium alloys in interaction with abrasive materials is the main cause of poor grinding treatment. The most common abrasive material for grinding titanium alloys is silicon carbide. Silicon carbide wheels operate primarily in self-sharpening mode. Wear of the abrasive tool in the self-sharpening mode occurs as a result of brittle destruction of the fret. The purpose of the study was to determine experimentally the crystalline wear products of an abrasive tool, made of silicon carbide, on the treated surface during grinding of a titanium alloy. Samples of VT9 titanium alloy were processed by flat mortise grinding by a wheel of silicon carbide with the use of VOLTES coolant and the characteristic of the abrasive tool - 64CF80L7V. The treated surface was examined on the electron microscope Versa 3D Dual Beam. The condition of the treated surface testifies to the intensive adhesive interaction of the titanium alloy with the abrasive tool. The thickness of the metal deposits reaches 3 microns. As a result of morphological analysis, objects are identified on the treated surface, the appearance of which allows us to attribute them to crystals. The chemical composition of the selected objects was determined by a microprobe analysis in a microscope camera. On the basis of the conducted researches, a presence on the grinded surface of silicon carbide crystals of various sizes and a ceramic ligament is established.

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Ji, Shi Jun, Lei Lei Liu, Ji Zhao, and Jin Chao Li. "Finite Element Simulation about Abrasive Belt Grinding Silicon Carbide." Key Engineering Materials 679 (February 2016): 27–32. http://dx.doi.org/10.4028/www.scientific.net/kem.679.27.

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Silicon carbide, a high-strength material, has a ductile-brittle transition mechanism. In order to establish a reasonable silicon carbide abrasive belt grinding parameters to obtain high precision silicon carbide free-surface efficiently, a series of finite element simulations were conducted to comprehend the single point diamond grinding of silicon carbide using professional analysis software of nonlinear finite element in this paper. According to the differences of cutting parameter, such as cutting depth, cutting deformation of the chip and the maximum cutting force were studied. For the free-form surface with higher accuracy, the data showed that ductile machining of silicon carbide is more efficient along with the larger rake angle, the higher cutting speed and the smaller cutting depth.

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Journal articles on the topic 'SILICON CARBIDE ABRASIVES'

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