Relevant bibliographies by topics / SILICON CARBIDE ABRASIVES

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'SILICON CARBIDE ABRASIVES'

Author: Grafiati
Published: 11 September 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'SILICON CARBIDE ABRASIVES.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "SILICON CARBIDE ABRASIVES"

1

Saito, T., S. Ito, Y. Mizukami, and O. Horiuchi. "Precision Abrasive Jet Finishing of Cemented Carbide." Key Engineering Materials 291-292 (August 2005): 371–76. http://dx.doi.org/10.4028/www.scientific.net/kem.291-292.371.

Full text
Abstract:
Recently a technique has been developed to mold aspheric glass lenses by using cemented carbide dies at elevated temperature. The dies are precisely ground by an ultraprecision grinding machine. However the obtained form accuracy is generally around 100nm and is not enough high. In this study, to investigate a possibility of corrective figuring of the dies, a series of experiments of abrasive jet machining of cemented carbide was conducted and fundamental machining characteristics were examined. The used abrasives were fine grains of silicon carbide and aluminum oxide. The silicon carbide abrasives could accomplish a sufficient material removal. Both the material removal rate and the surface roughness increase as the collision angle increases up to 90 degrees. Therefore, in order to obtain a smooth surface finish, it was necessary to take a smaller collision angle and to slow down the material removal rate.
APA, Harvard, Vancouver, ISO, and other styles
2

Niżankowski, Czesław, and Paweł Kazimierski. "Development trends of silicon carbide abrasives." Mechanik, no. 8-9 (September 2015): 714/237–714/243. http://dx.doi.org/10.17814/mechanik.2015.8-9.377.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Kido, Takanori, Masatake Nagaya, Kenji Kawata, and Tomohisa Kato. "A Novel Grinding Technique for 4H-SiC Single-Crystal Wafers Using Tribo-Catalytic Abrasives." Materials Science Forum 778-780 (February 2014): 754–58. http://dx.doi.org/10.4028/www.scientific.net/msf.778-780.754.

Full text
Abstract:
Diamond abrasives are generally used to machine silicon carbide (SiC) single crystals because of the high hardness of those crystals. Although Chemo-Mechanical Polishing (CMP) employs abrasives softer than the SiC single crystals together with oxidizing agents in order to avoid mechanical damage to the surface of SiC single-crystal wafers, none has reported so far the use of abrasive wheels other than diamond for grinding large SiC single-crystal wafers. The current study revealed that a novel grinding technique using non-diamond abrasives such as ceria (CeO2) can efficiently machine large SiC single-crystal wafers of 100 mm in diameter due hypothetically to the nature of newly named tribo-catalytic abrasives, and is promising to minimize the surface damage prior to the final CMP step.
APA, Harvard, Vancouver, ISO, and other styles
4

Vidigal, R. N. E., Claudinei Rezende Calado, and I. P. Pinheiro. "Evaluation of Agents Abrasives Polishing Porcelain Employing Image Processing." Materials Science Forum 798-799 (June 2014): 564–69. http://dx.doi.org/10.4028/www.scientific.net/msf.798-799.564.

Full text
Abstract:
The waste generated in the process of polishing of ceramic materials represents a challenge for the ceramic industries, because it is necessary conciliate environmental protection to expenses with disposal and proper packaging. The study of the reuse of this material in the production cycle becomes a necessary alternative to solve the industrial problem. The replacement of the abrasive agent is a viable option in order to avoid the presence of silicon carbide and the residue therefore enabling the direct incorporation of the residue in the porcelain production. If the atomized paste contains silicon carbide when the material is burned occurred the formation of porosity and cracks in the piece. This work aims to study new alternatives of abrasive agents and evaluate the efficiency of polishing generated by new tools. To evaluate the performance of the abrasive tests were conducted simulating the polishing step. The study is based on the computational processing of the image generated by optical micrographs. From this, it will be possible find the best abrasives for polishing ceramic material.
APA, Harvard, Vancouver, ISO, and other styles
5

Lukin, Daniil M., Melissa A. Guidry, and Jelena Vučković. "Silicon Carbide: From Abrasives to Quantum Photonics." Optics and Photonics News 32, no. 3 (March 1, 2021): 34. http://dx.doi.org/10.1364/opn.32.3.000034.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Liao, Yunn Shiuan, Y. P. Yu, and C. W. Huang. "Ultrasonic Vibration Assisted Mechanical Chemical Polishing (MCP) of Silicon Carbide." Advanced Materials Research 565 (September 2012): 255–60. http://dx.doi.org/10.4028/www.scientific.net/amr.565.255.

Full text
Abstract:
The mechanical chemical polishing (MCP) process which uses soft abrasives to polish hard workpiece have been employed recently to polish silicon carbide (SiC) ceramic for various applications. An ultrasonic vibration assisted apparatus is designed to investigate the effects of ultrasonic vibration on the efficiency of MCP of SiC by ferric oxide (Fe2O3) abrasives. Experimental results show that the ultrasonic vibration can effectively improve polishing efficiency; the material removal rate is increased by about 60~70%. But it does not lead to a better final surface finish. The effect is more obvious under a higher working pressure condition. It is also found that the output power of ultrasonic transducer is positively correlated with material removal rate. The rise of polishing efficiency is attributed to the increase of local asperities temperatures which promote chemical reaction of silicon carbide with oxygen to form passivation layers. The layers are removed by ferric oxide abrasives afterward.
APA, Harvard, Vancouver, ISO, and other styles
7

Beaucamp, Anthony. "Modelling the Brittle/Ductile Transition in Super-Fine Finishing of Carbides." Applied Mechanics and Materials 869 (August 2017): 20–28. http://dx.doi.org/10.4028/www.scientific.net/amm.869.20.

Full text
Abstract:
Materials such as binderless tungsten carbide and silicon carbide have become ubiquitous in the fabrication of high-performance tooling and molding inserts. But while conventional grinding of these hard ceramics has been studied in depth, the theory underlying their super-fine finishing has been less extensively explored. In particular, the boundary in process parameters that delineates the brittle/ductile removal transition remains mostly undocumented. In this paper, we review some super-fine finishing methods for carbide materials, based on both bound and kinetic abrasive processes. The focus is then placed on modelling the interaction between material and abrasives under their respective process conditions, and deriving some useful criteria guiding the brittle/ductile transition.
APA, Harvard, Vancouver, ISO, and other styles
8

Duwell, E. J., R. J. Cosmano, G. R. Abrahamson, and J. J. Gagliardi. "Grinding Titanium With Coated Abrasives Under an Aqueous Solution of Inorganic Phosphate Salts." Journal of Engineering for Industry 110, no. 1 (February 1, 1988): 19–24. http://dx.doi.org/10.1115/1.3187836.

Full text
Abstract:
Aqueous solutions of inorganic salts are known to be effective grinding lubricants for titanium. Early work by Professor Shaw at MIT drew particular attention to the use of phosphate salts, and although not commercially available as grinding fluids, some metal fabricators have compounded phosphate-containing fluids for their own use from the raw chemicals. In this paper, the dynamics of grinding Ti(6Al-4V) alloy are described using phosphate salt solutions. The results show that both aluminum oxide and silicon carbide coated abrasive belts have unique advantages in this application, with aluminum oxide exhibiting easy penetration and fast cutting behavior early on, while silicon carbide appears to have longer range durability.
APA, Harvard, Vancouver, ISO, and other styles
9

Tsai, Ming-Yi, Kun-Ying Li, and Sun-Yu Ji. "Novel Abrasive-Impregnated Pads and Diamond Plates for the Grinding and Lapping of Single-Crystal Silicon Carbide Wafers." Applied Sciences 11, no. 4 (February 17, 2021): 1783. http://dx.doi.org/10.3390/app11041783.

Full text
Abstract:
In this study, special ceramic grinding plates impregnated with diamond grit and other abrasives, as well as self-made lapping plates, were used to prepare the surface of single-crystal silicon carbide (SiC) wafers. This novel approach enhanced the process and reduced the final chemical mechanical planarization (CMP) polishing time. Two different grinding plates with pads impregnated with mixed abrasives were prepared: one with self-modified diamond + SiC and a ceramic binder and one with self-modified diamond + SiO2 + Al2O3 + SiC and a ceramic binder. The surface properties and removal rate of the SiC substrate were investigated and a comparison with the traditional method was conducted. The experimental results showed that the material removal rate (MRR) was higher for the SiC substrate with the mixed abrasive lapping plate than for the traditional method. The grinding wear rate could be reduced by 31.6%. The surface roughness of the samples polished using the diamond-impregnated lapping plate was markedly better than that of the samples polished using the copper plate. However, while the surface finish was better and the grinding efficiency was high, the wear rate of the mixed abrasive-impregnated polishing plates was high. This was a clear indication that this novel method was effective and could be used for SiC grinding and lapping.
APA, Harvard, Vancouver, ISO, and other styles
10

Wang, Yong Guang, and Liang Chi Zhang. "A Review on the CMP of SiC and Sapphire Wafers." Advanced Materials Research 126-128 (August 2010): 429–34. http://dx.doi.org/10.4028/www.scientific.net/amr.126-128.429.

Full text
Abstract:
Chemo-mechanical polishing (CMP) has been a useful method to produce superior brittle wafer surfaces. This paper reviews the CMP of silicon carbide and sapphire wafers, focusing on efficiency of the polishing rate. The effects of slurry type, slurry pH value and mixed abrasives will be discussed in detail.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "SILICON CARBIDE ABRASIVES"

1

SETHI, VARUN. "Effect of Aging on Abrasive Wear Resistance of Silicon Carbide Particulate Reinforced Aluminum Matrix Composite." University of Cincinnati / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1191951786.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

VIVEK, AAMERIA. "ABRASIVE JET MACHINING ON TEMPERED GLASS USING SILICON CARBIDE ABRASIVES." Thesis, 2013. http://dspace.dtu.ac.in:8080/jspui/handle/repository/15697.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Books on the topic "SILICON CARBIDE ABRASIVES"

1

United States. Bureau of Mines. Manufactured abrasives. Washington, D.C: U.S. Department of the Interior, Bureau of Mines, 1993.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

Parker, Philip M. The 2007-2012 World Outlook for Non-Metallic Sized Grains, Powders, and Flour Abrasives of Silicon Carbide. ICON Group International, Inc., 2006.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

The 2006-2011 World Outlook for Non-Metallic Sized Grains, Powders, and Flour Abrasives of Silicon Carbide. Icon Group International, Inc., 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "SILICON CARBIDE ABRASIVES"

1

Gooch, Jan W. "Silicon Carbide Abrasive." In Encyclopedic Dictionary of Polymers, 664. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_10648.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Kasuriya, Supawan, and Parjaree Thavorniti. "Preparation of Silicon Nitride-Silicon Carbide Composites from Abrasive SiC Powders." In Progress in Powder Metallurgy, 1073–76. Stafa: Trans Tech Publications Ltd., 2007. http://dx.doi.org/10.4028/0-87849-419-7.1073.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

"Silicon carbide abrasive." In Encyclopedic Dictionary of Polymers, 884. New York, NY: Springer New York, 2007. http://dx.doi.org/10.1007/978-0-387-30160-0_10452.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Uthayakumar, M., Balamurugan Karnan, Adam Slota, Jerzy Zajac, and J. Paulo Davim. "Performance Study of LaPO4-Y2O3 Composite Fabricated by Sol-Gel Process Using Abrasive Waterjet Machining." In Handbook of Research on Green Engineering Techniques for Modern Manufacturing, 143–61. IGI Global, 2019. http://dx.doi.org/10.4018/978-1-5225-5445-5.ch009.

Full text
Abstract:
This chapter presents an effective approach to assess the abrasive water jet machining of lanthanum phosphate reinforced with yttrium composite. A novel composite is prepared with the mixture of lanthanum phosphate sol and yttrium nitrate hexalate with a ratio of 80/20 by aqueous sol-gel process. Silicon carbide of 80 mesh size is used as abrasive. The effects of each input parameter of abrasive water jet machining are studied with an objective to improve the material removal rate with reduced kerf angle and surface roughness. The observations show that the jet pressure contributes by 77.6% and 45.15% in determining material removal rate and kerf angle, respectively. Through analysis of variance, an equal contribution of jet pressure (38.18%) and traverse speed (40.97%) on surface roughness is recorded. Microscopic examination shows the internal stress developed by silicon carbide which tends to get plastic deformation over the cut surface.
APA, Harvard, Vancouver, ISO, and other styles
5

Srinivasu, S., and A. Axinte. "Investigations on Jet Footprint Geometry and its Characteristics for Complex Shape Machining With Abrasive Waterjets in Silicon Carbide Ceramic Material." In Properties and Applications of Silicon Carbide. InTech, 2011. http://dx.doi.org/10.5772/16142.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Ali, Ahsan, and Mohammad Yeakub. "Application of Silicon Carbide in Abrasive Water Jet Machining." In Silicon Carbide - Materials, Processing and Applications in Electronic Devices. InTech, 2011. http://dx.doi.org/10.5772/22671.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "SILICON CARBIDE ABRASIVES"

1

Li, Liming, and Imin Kao. "Modeling and Experimental Study of the Impact on Free Abrasive Machining (FAM) due to Vibration of a Thin Wire Subject to an Oscillating Boundary Condition." In ASME 2019 14th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/msec2019-2754.

Full text
Abstract:
Abstract This paper investigates the impact on free abrasive machining (FAM) process using a vibrating wire with an oscillating boundary condition. The experimental results show that the vibration of wire in slurry with abrasive grits can result in material removal due to FAM on brittle material. We present a theoretical model of a wire moving axially at a constant speed, subject to an oscillating boundary condition with damping, and derive an analytical solution of the partial differential equation of motion. Based on the modeling and analysis, the frequency of vibration of wire corresponds to the frequency at the oscillating boundary at steady state. The damping factor suppresses the lateral movement of wire from the fixed boundary to moving boundary when it is increased. The change of axial wire speed or the oscillating frequency at boundary can counteract the suppression on the vibration response induced by increased damping factor. This study also presents an experimental study using an experimental setup of a slurry-fed wire with a periodic excitation to study the FAM process on silicon. The results of experiments show that vibration of wire can impart the silicon carbide abrasive grits in slurry to generate observable grooves and fractures on the surface of silicon in just a few minutes. The grooves and fractures are generated by the indentation of abrasive grits via loading and unloading on the silicon surface. When the vibrating wire is only fed with water without abrasives or under a dry condition, compressive deformation with shallow grooves on silicon is observed; however, the surface is found to be free of surface features of indentation and scratching. Furthermore, evidence of both wire compression and abrasive machining is more pronounced at the edges of silicon specimen, especially at the edge close to the periodic excitation, which is consistent to our modeling.
APA, Harvard, Vancouver, ISO, and other styles
2

BOGO, Ricardo, and Rodrigo Panosso ZEILMANN. "INFLUENCE OF EDGE TREATMENT BY POLISHING WITH ABRASIVE BRUSH BRUSHES ON THE LIFE OF THE TOOL FOR THE MILLING PROCESS." In SOUTHERN BRAZILIAN JOURNAL OF CHEMISTRY 2021 INTERNATIONAL VIRTUAL CONFERENCE. DR. D. SCIENTIFIC CONSULTING, 2022. http://dx.doi.org/10.48141/sbjchem.21scon.17_abstract_bogo.pdf.

Full text
Abstract:
Machining is a process in constant evolution, the search for greater productivity, reliability, and quality of machined materials is fundamental for the constant evolution of the process. The condition of the tool edge is of great importance for the tool performance in machining, the edge of a tool after the manufacturing or re-sharpening process has defects such as: microcracks, irregularities, and an extremely sharp edge. The cutting edge treatment is used to remove these defects, which originate from the tool manufacturing and re-sharpening processes. In view of these listed points, this work aims to understand and evaluate the effects of cutting edge treatment by abrasive bristle brushes, taking into account the evolution of wear on the edge and tool life in the end milling process. The abrasive brushes covered in this work are technical brushes from the 3M brand, these brushes have different grain sizes and two different abrasives, silicon carbide (SiC) and aluminum oxide (Al2O3), their bristles are made of nylon of two different thicknesses. Based on the literature and to evaluate the performance of these brushes, points such as roughness and edge contour were addressed in this step, and as a result, the fine bristle brush with a SiC particle size of 1 micron had the best performance, these brushes produced a radius of 0.06 mm on the tool edges. The polishing process treated two tools, these tools went through the milling process in AISI P20 steel. As a result, the treated tools had a superior performance by 15,30% compared to untreated tools. In addition to increasing the useful life, the cutting edge treatment provided linear flank wear, delaying the presence of wear such as adhesion, microcracks, and microchips. The polishing edge treatment with abrasive bristle brushes proves to be an effective and reliable process for improving the performance of machining tools.
APA, Harvard, Vancouver, ISO, and other styles
3

Moussa, Tala, Bertrand Garnier, and Hassan Peerhossaini. "Thermal Properties of Sintered Diamond Composites Used in Grinding." In ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/esda2012-82479.

Full text
Abstract:
Sintered diamonds are used in grinding because they offer better mechanical properties than conventional materials (mineral or silicon carbide abrasives) and yield high grinding speed and long life. In addition, because of their thermal performance, they contribute to cooling the workpiece, avoiding excessive temperatures. Thus in order to choose the best material for the worktool, one often must know the thermal conductivity of sintered diamond. In this work, the thermal conductivity of sintered diamond is evaluated as a function of the volume fraction of diamond in the composite and for two types of metallic binders: hard and soft. The measurement technique is based on the flash method that associates heating and measurement devices without sample contact and on parameter estimation using a three-layer thermal model. With a hard metallic binder, the thermal conductivity of sintered diamond was found to increase up to 64% for diamond volume fraction increasing from 0 to 25%. The increase is much smaller for the soft binder: 35% for diamond volume reaching 25%. In addition, experimental data were found far below the value predicted by conventional analytical models for effective thermal conductivity. A possible explanation is that the thermal conductivity of such composites is affected by poor heat transfer at the diamond/binder interface, the thermal contact resistance between matrix and diamond particles being estimated at between 0.75 and 1.25 10−6 m2K.W−1.
APA, Harvard, Vancouver, ISO, and other styles
4

Bishutin, Sergey, and Sergey Alehin. "TRIBOLOGICAL ASPECTS OF DIAMOND-ABRASIVE PROCESSING OF SILICON CARBIDE PLATES." In PROBLEMS OF APPLIED MECHANICS. Bryansk State Technical University, 2020. http://dx.doi.org/10.30987/conferencearticle_5fd1ed047fb069.67714622.

Full text
Abstract:
The article considers diamond-abrasive grinding of silicon carbide plates as a tribological system in order to increase the productivity and quality of this processing, as well as to substantiate the directions of its improvement. The process of removing material from the workpiece is considered as a result of abrasive wear of the silicon carbide plate on the lap with loose abrasive. Based on the hypothesis of F. Preston, a dependence was obtained for calculating the rate of removal of material removed during processing from the surface of the workpiece. The results of experimental studies of the productivity and quality of processing are presented. Attention is paid to the formation of surface layers of silicon carbide plates by introducing abrasive particles into the workpiece, causing the formation of multidirectional microcracks and the removal of material mainly as a result of brittle fracture. The results of experimental studies of the state of surface layers using a digital 3-D microscope VHX-1000E, a scanning electron microscope Jeol JSM 6610 and a profiler-profilometer "Mahr GmbH" Based on the research results, recommendations were formulated to improve the efficiency of diamond-abrasive processing of silicon carbide plates.
APA, Harvard, Vancouver, ISO, and other styles
5

Bishutin, S. G., and S. S. Alekhin. "Tribological aspects of diamond-abrasive machining of silicon carbide plates." In PROCEEDINGS INTERNATIONAL CONFERENCE “PROBLEMS OF APPLIED MECHANICS”. AIP Publishing, 2021. http://dx.doi.org/10.1063/5.0047418.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Ibrahim, A., and S. Sampath. "Effect of Grinding Mechanisms on Surface Finish and Hardness of Thermally Sprayed WC-Co." In ITSC 1996, edited by C. C. Berndt. ASM International, 1996. http://dx.doi.org/10.31399/asm.cp.itsc1996p0493.

Full text
Abstract:
Abstract During grinding of thermally sprayed WC-Co, the grinding ratio G ( ratio of volume of work removed to the volume of wheel consumed) is usually low and the finish produced sometimes is inadequate. Improvement in surface finish accompanies increase in grinding ratio. The objective of this investigation is to study the effect of type of abrasive, table speed, and depth of cut on the surface finish and hardness of WC-Co. Thermally sprayed WC-12 wt % Co and WC-17 wt % Co produced using the high velocity oxygen fuel (HVOF) process, have been ground using silicon carbide and diamond wheels under different operating conditions. The surface profile reveals the significant role played by the above parameters on the surface finish. The grinding ratio, G in case of diamond grinding was found to be larger than silicon carbide grinding however, the quality of the surface finish produced by silicon carbide was better than the diamond. The surface structure of the ground WC-Co was examined by SEM. Surfaces ground using a silicon carbide wheel exhibited extensive plastic flow, while surfaces ground with diamond wheels are highly fractured with localized flow which suggests two different mechanisms of material removal. The surface hardness after grinding, was found to depend on the type of abrasive and table speed. Silicon carbide grinding has shown higher hardness and better surface finish than diamond grinding.
APA, Harvard, Vancouver, ISO, and other styles
7

Fuchs, Baruch A. "Removal Rates, Polishing and Subsurface Damage of Chemical Deposited Silicon Carbide." In Optical Fabrication and Testing. Washington, D.C.: Optica Publishing Group, 1987. http://dx.doi.org/10.1364/oft.1987.tuaa5.

Full text
Abstract:
Chemical vapor deposited silicon carbide (CVD SiC) is an excellent material for use in first mirrors for synchrotron radiation beam lines. We have developed methods to grind and polish flat samples of CVD SiC down to measured surface roughness values of 1 Å RMS. This paper describes the removal rate of CVD SiC during free abrasive grinding and during polishing. The removal rate during grinding with boron carbide was found to be about 29 times slower than that of fused silica and about 58 times slower than that of BK-7 glass. The surface roughness was also measured after each grinding step in order to estimate the amount of material to be removed in subsequent operations. The measured ground surface roughness of CVD SiC was about 4 to 5 times finer than that of BK-7 and Fused Silica, respectively. At the time of the presentation, additional data on polishing rate, as well as subsurface damaged depth, will be provided.
APA, Harvard, Vancouver, ISO, and other styles
8

Gorlach, I. A. "Evaluation of Thermal Stresses in Thermo-abrasive Blasting Nozzles." In ITSC2006, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, R. S. Lima, and J. Voyer. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.itsc2006p1137.

Full text
Abstract:
Abstract Thermo-abrasive blasting is a technique, which combines conventional abrasive blasting and HVAF processes to prepare surfaces prior coating. Thermo-abrasive blasting has a number of advantages over conventional abrasive blasting as the result of a higher nozzle pressure and heat, which helps to remove impurities from the surface. However, practice showed that the short life of blasting nozzles due to thermal stresses and excessive wear is the biggest drawback of this method. Therefore, the correct nozzle geometry and suitable materials are critical for an efficient operation of thermo-abrasive blasting systems. In this study, computational fluid dynamics and finite element analyses were used to obtain the temperature distribution and to evaluate thermal stresses in nozzle materials. The materials investigated include tungsten carbide-cobalt (WC-6wt.% Co), hot pressed dense silicon carbide (SiC) and SiALON (Si3N4-Al2O3-AlN). The analysis and experiments showed that WC-CO nozzles produce the best overall results of thermal shock resistance and wear in thermo-abrasive blasting.
APA, Harvard, Vancouver, ISO, and other styles
9

Paul, Lijo, and J. Babu. "Grey Relation Approach in Abrasive Jet Machining Process." In ASME 2019 14th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2019. http://dx.doi.org/10.1115/msec2019-2852.

Full text
Abstract:
Abstract Micro machining of conducting and non-conducting materials with high accuracy has great demand in industries especially in machining of ceramic, brittle materials. Abrasive Jet Machining (AJM) has shown tremendous application especially in machining of hard and brittle materials. In the present paper drilling of soda lime glass has been carried out to determine the machinability under different controlling parameters. A set of L9 series experiments were carried out by varying process parameters such as Stand Off Distance (SOD), Silicon carbide abrasive particles mesh sizes and jet pressure. Material Removal Rate (MRR) and Radial Over Cut (ROC), were taken as the output responses and are optimised with multi objective optimisation.
APA, Harvard, Vancouver, ISO, and other styles
10

Yuan, Zewei, Kai Cheng, Yan He, and Meng Zhang. "Investigation on Smoothing Silicon Carbide Wafer With a Combined Method of Mechanical Lapping and Photocatalysis Assisted Chemical Mechanical Polishing." In ASME 2018 13th International Manufacturing Science and Engineering Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/msec2018-6615.

Full text
Abstract:
The high quality surface can exhibit the irreplaceable application of single crystal silicon carbide in the fields of optoelectronic devices, integrated circuits and semiconductor. However, high hardness and remarkable chemical inertness lead to great difficulty to the smoothing process of silicon carbide. Therefore, the research presented in this paper attempts to smooth silicon carbide wafer with photocatalysis assisted chemical mechanical polishing (PCMP) by using of the powerful oxidability of UV photo-excited hydroxyl radical on surface of nano-TiO2 particles. Mechanical lapping was using for rough polishing, and a material removal model was proposed for mechanical lapping to optimize the polishing process. Several photocatalysis assisted chemical mechanical polishing slurries were compared to achieve fine surface. The theoretical analysis and experimental results indicate that the material removal rate of lapping process decreases in index form with the decreasing of abrasive size, which corresponds with the model developed. After processed with mechanical lapping for 1.5 hours and subsequent photocatalysis assisted chemical mechanical polishing for 2 hours, the silicon carbide wafer obtains a high quality surface with the surface roughness at Ra 0.528 nm The material removal rate is 0.96 μm/h in fine polishing process, which is significantly influenced by factors such as ultraviolet irradiation, electron capture agent (H2O2) and acidic environment. This combined method can effectively reduce the surface roughness and improve the polishing efficiency on silicon carbide and other hard-inert materials.
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "SILICON CARBIDE ABRASIVES"

1

Andrews, P. R. A. Major abrasives - garnet, industrial diamond, silicon carbide and fused alumina. Natural Resources Canada/CMSS/Information Management, 1991. http://dx.doi.org/10.4095/328634.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'SILICON CARBIDE ABRASIVES' for particular source types:
Journal articles
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography