Books on the topic 'Reliability characterization'
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McCauley, James W., and Volker Weiss, eds. Materials Characterization for Systems Performance and Reliability. Boston, MA: Springer US, 1986. http://dx.doi.org/10.1007/978-1-4613-2119-4.
Full textMaterial Characterization for Systems Performance and Reliability (Conference) (1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York: Plenum, 1986.
Find full textSagamore Army Materials Research Conference (31st 1984 Lake Luzerne, N.Y.). Materials characterization for systems performance and reliability. New York: Plenum Press, 1986.
Find full textMcCauley, James W. Materials Characterization for Systems Performance and Reliability. Boston, MA: Springer US, 1986.
Find full textRajeshuni, Ramesham, Society of Photo-optical Instrumentation Engineers., and Semiconductor Equipment and Materials International., eds. Reliability, testing, and characterization of MEMS/MOEMS: 22-24 October 2001, San Francisco, USA. Bellingham, Wash: SPIE, 2001.
Find full textD, Todd M., U.S. Nuclear Regulatory Commission. Office of Nuclear Regulatory Research. Division of Engineering., and Oak Ridge National Laboratory, eds. A characterization of check valve degradation and failure experience in the nuclear power industry. Washington, DC: Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1993.
Find full textL, Veteran Janice, ed. Silicon materials--processing, characterization and reliability: Symposium held April 1-5, 2002, San Francisco, California, U.S.A. Warrendale, PA: Materials Research Society, 2002.
Find full text1952-, Tanner Danelle Mary, Ramesham Rajeshuni, and Society of Photo-optical Instrumentation Engineers., eds. Reliability, testing, and characterization of MEMS/MOEMS III: 26-28 January, 2004, San Jose, California, USA. Bellingham, Wash: SPIE, 2004.
Find full textHartzell, Allyson L. Reliability, packaging, testing, and characterization of MEMS/MOEMS VII: 21-22 January 2008, San Jose, California, USA. Bellingham, Wash: SPIE, 2008.
Find full text1952-, Tanner Danelle Mary, Ramesham Rajeshuni, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. Reliability, packaging, testing, and characterization of MEMS/MOEMS IV: 24-25 January 2005, San Jose, California, USA. Bellingham, Wash: SPIE, 2005.
Find full textHacke, P. Characterization of multicrystalline silicon modules with system bias voltage applied in damp heat. Golden, CO]: National Renewable Energy Laboratory, 2011.
Find full textWorkshop on Model Uncertainty, Its Characterization and Quantification (1993 Annapolis, Maryland). Proceedings of Workshop on Model Uncertainty, Its Characterization and Quantification: Annapolis, Maryland, USA, October 20-22, 1993. College Park, MD, U.S.A: University Printing Services, University of Maryland, 1995.
Find full textname, No. Reliability, testing, and characterization of MEMS/MOEMS II: 27-29 January 2003, San Jose, California, USA. Bellingham, WA: SPIE, 2003.
Find full textGarcia-Blanco, Sonia. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices X: 24-25 January 2011, San Francisco, California, United States. Edited by SPIE (Society), Institut national d'optique (Canada), DALSA Corporation (Canada), and Smart Equipment Technology (France). Bellingham, Wash: SPIE, 2011.
Find full textKullberg, Richard C., and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices IX: 25-26 January 2010, San Francisco, California, United States. Edited by SPIE (Society). Bellingham, Wash: SPIE, 2010.
Find full textGarcia-Blanco, Sonia, and Rajeshuni Ramesham. Reliability, packaging, testing, and characterization of MEMS/MOEMS and nanodevices XI: 23-24 January 2012, San Francisco, California, United States. Edited by SPIE (Society), Dyoptyka (Firm), Vuzix Corporation, and Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration. Bellingham, Wash: SPIE, 2012.
Find full textKostas, Amberiadis, European Optical Society, Society of Photo-optical Instrumentation Engineers., European Commission. Directorate-General XII, Science, Research, and Development., Scottish Enterprise, Sira Technology Centre (U.K.), and Institution of Electrical Engineers, eds. In-line characterization, yield reliability, and failure analysis in microelectronics manufacturing: 19-21 May, 1999, Edinburgh, Scotland. Bellingham, Wash., USA: SPIE, 1999.
Find full textT, Kundu, Qu Jianmin, American Society of Mechanical Engineers. Applied Mechanics Division., American Society of Mechanical Engineers. NDE Engineering Division., and International Mechanical Engineering Congress and Exposition (2000 : Orlando, Fla.), eds. Nondestructive evaluation and characterization of engineering materials for reliability and durability predictions: Presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida. New York, N.Y: American Society of Mechanical Engineers, 2000.
Find full textUeda, Osamu. Materials and Reliability Handbook for Semiconductor Optical and Electron Devices. New York, NY: Springer New York, 2013.
Find full textGudrun, Kissinger, Weiland Larg H, Society of Photo-optical Instrumentation Engineers., Scottish Enterprise, European Optical Society, and Institution of Electrical Engineers, eds. In-line characterization, yield, reliability, and failure analysis in microelectronic manufacturing II: 31 May-1 June 2001, Edinburgh, UK. Bellingham, Washington: SPIE, 2001.
Find full textA, Mosleh, U.S. Nuclear Regulatory Commission, EG & G Idaho, University of Maryland at College Park, and U.S. Nuclear Regulatory Commission. Division of Safety Issue Resolution, eds. Proceedings of Workshop I in Advanced Topics in Risk and Reliability Analysis: Model uncertainty, its characterization and quantification : held at Governor Calvert House and Conference Center, Annapolis, Maryland, October 20-22, 1993. Washington, DC: Division of Safety Issue Resolution, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1994.
Find full textBorys, Michael. Fundamentals of Mass Determination. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012.
Find full textservice), SpringerLink (Online, ed. Handbook of Technical Diagnostics: Fundamentals and Application to Structures and Systems. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013.
Find full textSabbagh, Harold A. Computational Electromagnetics and Model-Based Inversion: A Modern Paradigm for Eddy-Current Nondestructive Evaluation. New York, NY: Springer New York, 2013.
Find full textHo, Paul S., Janice L. Veteran, David L. O'Meara, and Veena Misra. Silicon Materials: Processing, Characterization and Reliability. University of Cambridge ESOL Examinations, 2014.
Find full textMcCauley, James W., and Volker Weiss. Materials Characterization for Systems Performance and Reliability. Springer, 2013.
Find full textAltenbach, Holm, and Andreas Öchsner. Properties and Characterization of Modern Materials. Ingramcontent, 2016.
Find full textAltenbach, Holm, and Andreas Öchsner. Properties and Characterization of Modern Materials. Springer, 2018.
Find full textAliofkhazraei, Mahmood. Handbook of Functional Nanomaterials Vol. 2: Characterization and Reliability. Nova Science Publishers, Incorporated, 2013.
Find full textEl-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2020.
Find full textStovl Fighter Propulsion Reliability Maintainability and Supportability Characterization/Ada 224221. Natl Technical Information, 1990.
Find full textEl-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.
Find full textAliofkhazraei, Mahmood. Comprehensive Guide for Nanocoatings Technology, Volume 2: Characterization and Reliability. Nova Science Publishers, Incorporated, 2015.
Find full textEl-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer New York, 2016.
Find full textEl-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2019.
Find full textEl-Kareh, Badih, and Lou N. Hutter. Silicon Analog Components: Device Design, Process Integration, Characterization, and Reliability. Springer, 2015.
Find full text(Editor), Volker Weiss, ed. Materials Characterization for Systems Performance and Reliability (Sagamore Army Materials Research Conference//Proceedings). Springer, 1986.
Find full textKim, Young Hee, and Jack C. Lee. Hf-Based High-K Dielectrics: Process Development, Performance Characterization, and Reliability. Springer International Publishing AG, 2007.
Find full textKim, Young Hee, and Jack C. Lee. Hf-Based High-K Dielectrics: Process Development, Performance Characterization, and Reliability. Morgan & Claypool Publishers, 2006.
Find full textVeteran, Janice L. Silicon Materials--Processing, Characterization and Reliability (Materials Research Society Symposia Proceedings, 716.). Materials Research Society, 2002.
Find full text(Editor), Danelle M. Tanner, and Rajeshuni Ramesham (Editor), eds. Reliability, Packaging, Testing and Characterization of Mems / Moems 5 (Proceedings of Spie). SPIE-International Society for Optical Engine, 2006.
Find full textRamesham, Rajeshuni, and Herbert R. Shea. Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII. SPIE, 2014.
Find full textSmolyansky, Dmitry A. Enhanced accuracy time domain reflection and transmission measurements for IC interconnect characterization. 1994.
Find full textReliability, testing, and characterization of MEMS/MOEMS III: 24-28 January 2004, San Jose, California, USA. Bellingham, WA: SPIE, 2004.
Find full textRajeshuni, Ramesham, Tanner Danelle Mary 1952-, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. Reliability, testing, and characterization of MEMS/MOEMS II: 27-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.
Find full textSPIE. Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII: 28-29 January 2009, San Jose, California, United States. SPIE, 2009.
Find full textAmerican Society of Mechanical Engineers. Applied Mechanics Division (Corporate Author), American Society of Mechanical Engineers Nde Engineering Division (Corporate Author), Jianmin Qu (Editor), American Society of Mechanical Engineers (Editor), and T. Kundu (Editor), eds. Nondestructive Evaluation & Characterization of Energy Materials for Reliability & Durability Predictions: Presented at the 2000 Asme International Mechanical ... Orlando, Florida (Amd (Series), Vol. 240.). American Society of Mechanical Engineers, 1998.
Find full textReliability, packaging, testing, and characterization of MEMS/MOEMS VI: 23-24 January, 2007, San Jose, California, USA. Bellingham, Wash: SPIE, 2007.
Find full textPearton, Stephen J., and Osamu Ueda. Materials and Reliability Handbook for Semiconductor Optical and Electron Devices. Springer, 2014.
Find full textKim Young-Hee and Jack C. Lee. Hf-Based High-k Dielectrics: Process Development, Performance Characterization, and Reliability (Synthesis Lectures on Solid State Materials and Devices). Morgan & Claypool Publishers, 2005.
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