Relevant bibliographies by topics / RD53A

Academic literature on the topic 'RD53A'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "RD53A"

1

Senger, T. "Prototyping serial powering for the ATLAS ITk pixel detector." Journal of Instrumentation 18, no. 01 (January 1, 2023): C01026. http://dx.doi.org/10.1088/1748-0221/18/01/c01026.

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Abstract The high luminosity upgrade for the LHC at CERN requires a complete overhaul of the current inner detectors of ATLAS and CMS. A serial powering scheme has been chosen to cope with the constraints of the new pixel detectors. A prototype stave consisting of up to 8 quad modules, based on the new readout chips developed by the RD53 collaboration in 65 nm CMOS technology, RD53A and ITkPixV1, has been set up in Bonn. This contribution covers the results obtained with RD53A modules and presents first measurements with a full ITkPixV1.1 serial powering chain.
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Hinterkeuser, F., M. Hamer, M. Daas, F. Hügging, H. Krüger, U. C. Perry, D.-L. Pohl, and K. Desch. "Prototyping serial powering with RD53A." Journal of Physics: Conference Series 2374, no. 1 (November 1, 2022): 012086. http://dx.doi.org/10.1088/1742-6596/2374/1/012086.

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The ATLAS inner detector will be replaced by an all-silicon detector for the HL-LHC upgrade around 2025. The innermost five layers of the detector system will be pixel detector layers which will be most challenging in terms of radiation hardness, data rate and readout speed. A serial power scheme will be used for the pixel layers to reduce the material budget and power consumption in cables. New elements are required to operate and monitor a serially powered detector including a detector control system, constant current sources and front-end electronics with shunt regulators. Prototypes for all sections of the ITk pixel detector are built to verify the concept and operate multiple serial power chains as a system test. The evaluation of both the readout of multi-modules and mechanical integration are further aims of the prototyping campaign. In the contribution, results will be presented of this prototyping effort. Moreover, details and features of serial powering for full detector systems will be given.
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Jofrehei, A., M. Backhaus, P. Baertschi, F. Canelli, F. Glessgen, W. Jin, B. Kilminster, et al. "Characterization of irradiated RD53A pixel modules with passive CMOS sensors." Journal of Instrumentation 17, no. 09 (September 1, 2022): C09004. http://dx.doi.org/10.1088/1748-0221/17/09/c09004.

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Abstract We are investigating the feasibility of using CMOS foundries to fabricate silicon detectors, both for pixels and for large-area strip sensors. The availability of multi-layer routing will provide the freedom to optimize the sensor geometry and the performance, with biasing structures in poly-silicon layers and MIM-capacitors allowing for AC coupling. A prototyping production of strip test-structures and RD53A compatible pixel sensors was recently completed at LFoundry in a 150 nm CMOS process. This paper will focus on the characterization of irradiated and non-irradiated pixel modules, composed by a CMOS passive sensor interconnected to a RD53A chip. The sensors are designed with a pixel cell of 25 × 100 μm2 in case of DC coupled devices and 50 × 50 μm2 for the AC coupled ones. Their performance in terms of charge collection, position resolution, and hit efficiency was studied with measurements performed in the laboratory and with beam tests. The RD53A modules with LFoundry silicon sensors were irradiated to fluences up to 1.0 × 1 0 16 n eq c m 2 .
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Terzo, S., M. Chmeissani, G. Giannini, S. Grinstein, M. Manna, G. Pellegrini, D. Quirion, and D. Vazquez Furelos. "Performance of Irradiated RD53A 3D Pixel Sensors." Journal of Instrumentation 14, no. 06 (June 5, 2019): P06005. http://dx.doi.org/10.1088/1748-0221/14/06/p06005.

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Glessgen, Franz, Malte Backhaus, Florencia Canelli, Yannick Manuel Dieter, Jochen Christian Dingfelder, Tomasz Hemperek, Fabian Huegging, et al. "Characterization of passive CMOS sensors with RD53A pixel modules." Journal of Physics: Conference Series 2374, no. 1 (November 1, 2022): 012174. http://dx.doi.org/10.1088/1742-6596/2374/1/012174.

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Both the current upgrades to accelerator-based HEP detectors (e.g. ATLAS, CMS) and also future projects (e.g. CEPC, FCC) feature large-area silicon-based tracking detectors. We are investigating the feasibility of using CMOS foundries to fabricate silicon radiation detectors, both for pixels and for large-area strip sensors. A successful proof of concept would open the market potential of CMOS foundries to the HEP community, which would be most beneficial in terms of availability, throughput and cost. In addition, the availability of multi-layer routing of signals will provide the freedom to optimize the sensor geometry and the performance, with biasing structures implemented in poly-silicon layers and MIM-capacitors allowing for AC coupling. A prototyping production of strip test structures and RD53A compatible pixel sensors was recently completed at LFoundry in a 150nm CMOS process. This presentation will focus on the characterization of pixel modules, studying the performance in terms of charge collection, position resolution and hit efficiency with measurements performed in the laboratory and with beam tests. We will report on the investigation of RD53A modules with 25x100 μm2 cell geometry.
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Carlotto, J. I., P. Fernandez-Martinez, S. Terzo, J. T. Gonzalez, and S. Grinstein. "Characterization of the first RD53A triplet modules assembled at IFAE." Journal of Instrumentation 17, no. 10 (October 1, 2022): C10018. http://dx.doi.org/10.1088/1748-0221/17/10/c10018.

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Abstract IFAE is engaged in the production of linear triplet modules for the forthcoming upgrade of the Inner Tracker for the high luminosity phase of the Large Hadron Collider. The pre-production process requires the fabrication of early prototypes (the RD53A chip) to inform the assembly and electrical test methodologies. Module prototypes (also called triplets) include a set of 3 hybrids (sensors connected to readout chips), all of them are mounted in an individual flexible PCB. This document presents the assembly methodologies and main electrical tests results for the first set of 4 modules assembled at IFAE.
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Samy, M. A. A., D. M. S. Sultan, A. Lapertosa, G. Gariano, and G. F. Dalla Betta. "Cold temperature characterization of ring triplets based on RD53A readout chip." Journal of Instrumentation 17, no. 11 (November 1, 2022): C11005. http://dx.doi.org/10.1088/1748-0221/17/11/c11005.

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Abstract This paper reports the Trento test setup and the cold test procedure for three triplets (ID: R4, R5, and R6) assembled with RD53A readout cheap and planar sensors. The trim and tuning of Front Ends (FE), as well as sensor I-V measurements, were made for a cold temperature (−25 °C) for an applied voltage (−30 V for R4, −10 V for R5 and R6). As a part of QC, initially, several test scans: analog, digital, threshold, ToT, noise, etc., were performed to evaluate the module response at −25 °C before applying a necessary tuning script to find a spatially uniform threshold distribution over the pixel matrix. Later, the crosstalk-based disconnected-bump and X-ray scans were made to check modules’ bump bonding quality and hits per pixel. Results reported here show a good agreement to a qualified triplet module, assuring the Trento cold test setup capacity for the ATLAS ITk QA/QC process.
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Dieter, Y., M. Daas, J. Dingfelder, T. Hemperek, F. Hügging, J. Janssen, H. Krüger, et al. "Radiation tolerant, thin, passive CMOS sensors read out with the RD53A chip." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 1015 (November 2021): 165771. http://dx.doi.org/10.1016/j.nima.2021.165771.

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Duarte-Campderros, J., E. Currás, M. Fernández, G. Gómez, A. García, J. González, E. Silva, et al. "Results on proton-irradiated 3D pixel sensors interconnected to RD53A readout ASIC." Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment 944 (November 2019): 162625. http://dx.doi.org/10.1016/j.nima.2019.162625.

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10

Adam, W., T. Bergauer, D. Blöch, M. Dragicevic, R. Frühwirth, V. Hinger, H. Steininger, et al. "Comparative evaluation of analogue front-end designs for the CMS Inner Tracker at the High Luminosity LHC." Journal of Instrumentation 16, no. 12 (December 1, 2021): P12014. http://dx.doi.org/10.1088/1748-0221/16/12/p12014.

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Abstract The CMS Inner Tracker, made of silicon pixel modules, will be entirely replaced prior to the start of the High Luminosity LHC period. One of the crucial components of the new Inner Tracker system is the readout chip, being developed by the RD53 Collaboration, and in particular its analogue front-end, which receives the signal from the sensor and digitizes it. Three different analogue front-ends (Synchronous, Linear, and Differential) were designed and implemented in the RD53A demonstrator chip. A dedicated evaluation program was carried out to select the most suitable design to build a radiation tolerant pixel detector able to sustain high particle rates with high efficiency and a small fraction of spurious pixel hits. The test results showed that all three analogue front-ends presented strong points, but also limitations. The Differential front-end demonstrated very low noise, but the threshold tuning became problematic after irradiation. Moreover, a saturation in the preamplifier feedback loop affected the return of the signal to baseline and thus increased the dead time. The Synchronous front-end showed very good timing performance, but also higher noise. For the Linear front-end all of the parameters were within specification, although this design had the largest time walk. This limitation was addressed and mitigated in an improved design. The analysis of the advantages and disadvantages of the three front-ends in the context of the CMS Inner Tracker operation requirements led to the selection of the improved design Linear front-end for integration in the final CMS readout chip.
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Conference papers on the topic "RD53A"

1

Hinterkeuser, Florian. "Prototyping Serial Powering with RD53A and ITkPixV1." In 41st International Conference on High Energy physics. Trieste, Italy: Sissa Medialab, 2022. http://dx.doi.org/10.22323/1.414.0689.

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Pradas, Alvaro, Fernando Arteche, Cristina Esteban, Francisco Javier Arcega, Esther Jiménez, Dominik Koukola, Stella Orfanelli, and Jorgen Christiansen. "RD53A chip susceptibility to electromagnetic conducted noise." In Topical Workshop on Electronics for Particle Physics. Trieste, Italy: Sissa Medialab, 2020. http://dx.doi.org/10.22323/1.370.0064.

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Pradas, Alvaro, Dominik Koukola, Stella Orfanelli, Jorgen Christiansen, Michael Karagounis, and Fernando Arteche. "System level serial powering studies of RD53A chip." In Topical Workshop on Electronics for Particle Physics. Trieste, Italy: Sissa Medialab, 2019. http://dx.doi.org/10.22323/1.343.0147.

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Emriskova, Natalia. "Analog front-end characterization of the RD53A chip." In Topical Workshop on Electronics for Particle Physics. Trieste, Italy: Sissa Medialab, 2020. http://dx.doi.org/10.22323/1.370.0021.

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Fougeron, Denis. "A study of SEU-tolerant latches for the RD53A chip." In Topical Workshop on Electronics for Particle Physics. Trieste, Italy: Sissa Medialab, 2018. http://dx.doi.org/10.22323/1.313.0095.

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6

Ebrahimi, Aliakbar. "Characteristics and Performance of RD53A Readout Chip with Small-pixel Silicon Sensors." In 2019 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC). IEEE, 2019. http://dx.doi.org/10.1109/nss/mic42101.2019.9059753.

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Vogt, Marco, Hans Krüger, Tomasz Hemperek, Jens Janssen, David Leon Pohl, and Michael Daas. "Characterization and Verification Environment for the RD53A Pixel Readout Chip in 65 nm CMOS." In Topical Workshop on Electronics for Particle Physics. Trieste, Italy: Sissa Medialab, 2018. http://dx.doi.org/10.22323/1.313.0084.

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Monteil, Ennio, M. Barbero, D. Fougeron, S. Godiot, M. Menouni, P. Pangaud, A. Rozanov, et al. "RD53A: a large scale prototype for HL-LHC silicon pixel detector phase 2 upgrades." In Topical Workshop on Electronics for Particle Physics. Trieste, Italy: Sissa Medialab, 2019. http://dx.doi.org/10.22323/1.343.0157.

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Jofrehei, Arash, Florencia Canelli, Ben Kilminster, Stefanos Leontsinis, Anna Macchiolo, Lingxin Meng, and Vinicius Massami Mikuni. "Investigation of crosstalk effects in RD53A modules with 100 and 150 $\mathrm{\mu m}$ thick n-in-p planar sensors." In European Physical Society Conference on High Energy Physics. Trieste, Italy: Sissa Medialab, 2020. http://dx.doi.org/10.22323/1.364.0151.

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Marconi, S., M. B. Barbero, D. Fougeron, S. Godiot, M. Menouni, P. Pangaud, A. Rozanov, et al. "Design implementation and test results of the RD53A, a 65 nm large scale chip for next generation pixel detectors at the HL-LHC." In 2018 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC). IEEE, 2018. http://dx.doi.org/10.1109/nssmic.2018.8824486.

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