Journal articles on the topic 'Printed electronic coating'
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Lu, Taofeng, Gregory Reimonn, Gregory Morose, Evan Yu, and Wan-Ting Chen. "Removing Acrylic Conformal Coating with Safer Solvents for Re-Manufacturing Electronics." Polymers 13, no. 6 (March 18, 2021): 937. http://dx.doi.org/10.3390/polym13060937.
Rajendran, Mohana, and Marto Giftlin. "Novel Development of Corrosion Resistant Paint Using Printed Circuit Board from Modern Electronic Wastes." Trends in Sciences 19, no. 6 (February 25, 2022): 2901. http://dx.doi.org/10.48048/tis.2022.2901.
Szocinski, Michal. "AFM-assisted investigation of conformal coatings in electronics." Anti-Corrosion Methods and Materials 63, no. 4 (June 6, 2016): 289–94. http://dx.doi.org/10.1108/acmm-09-2014-1426.
Lee, Sang, and Sangyoon Lee. "Fabrication and Characterization of Roll-to-Roll Printed Air-Gap Touch Sensors." Polymers 11, no. 2 (February 2, 2019): 245. http://dx.doi.org/10.3390/polym11020245.
Pfeiffenberger, Neal T., and Saeid Biria. "Enhanced UVA LED-Cured Conformal Coatings for Printed Circuit Boards." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000281–85. http://dx.doi.org/10.4071/1085-8024-2021.1.000281.
Tantrairatn, Suradet, Paphakorn Pitayachaval, Sirisak Rangklang, and Jiraphon Srisertpol. "A Comparison of Cover Coat Methods for Electronic Flexible Printed Circuit (E-FPC) Based on Peeling Strength." Advanced Materials Research 421 (December 2011): 489–92. http://dx.doi.org/10.4028/www.scientific.net/amr.421.489.
Kellomäki, Tiiti, Johanna Virkki, Sari Merilampi, and Leena Ukkonen. "Towards Washable Wearable Antennas: A Comparison of Coating Materials for Screen-Printed Textile-Based UHF RFID Tags." International Journal of Antennas and Propagation 2012 (2012): 1–11. http://dx.doi.org/10.1155/2012/476570.
Park, Won-Tae, and Yong-Young Noh. "A self-aligned high resolution patterning process for large area printed electronics." Journal of Materials Chemistry C 5, no. 26 (2017): 6467–70. http://dx.doi.org/10.1039/c7tc01590a.
Senophiyah-Mary, J., R. Loganath, and T. Meenambal. "A novel method for the removal of epoxy coating from waste printed circuit board." Waste Management & Research: The Journal for a Sustainable Circular Economy 36, no. 7 (June 20, 2018): 645–52. http://dx.doi.org/10.1177/0734242x18782392.
Nmadu, D., N. C. Eli-Chukwu, U. U. Uma, O. E. Ogah, A. A. Parshuto, M. I. Eheduru, S. I. Ezichi, and C. N. Ogbonna-Mba. "Using High Voltage Electrochemical Oxidation (HVEO) to obtain protective coatings, surface finishing on electronic materials." Digest Journal of Nanomaterials and Biostructures 17, no. 2 (April 2022): 569–77. http://dx.doi.org/10.15251/djnb.2022.172.569.
Kolesnyk, Kostiantyn, Andrzej Łukaszewicz, Volodymyr Dutka, Dmytro Zahoruiko, and Bohdan Vasylyshyn. "Automated design of printed circuit boards made by electronic computer –aided design (CAD) with the next using in CNC- machine." Computer Design Systems. Theory and Practice 4, no. 1 (2022): 9–16. http://dx.doi.org/10.23939/cds2022.01.009.
Wang, Wan Gang, Yong Peng, and Xiao Ping Wang. "Key Parameter Optimization in Wave Soldering." Advanced Materials Research 323 (August 2011): 84–88. http://dx.doi.org/10.4028/www.scientific.net/amr.323.84.
Dabert, Marine, Dorina T. Papanastasiou, Loïc Vidal, Samar Hajjar-Garreau, Daniel Bellet, Daniel Lougnot, and Lavinia Balan. "Enhancing the Properties of Photo-Generated Metallized Nanocomposite Coatings through Thermal Annealing." Nanomaterials 14, no. 2 (January 15, 2024): 193. http://dx.doi.org/10.3390/nano14020193.
Pappas, Daphne, Sebastian Guist, and Dhia Ben Salem. "Plasma Surface Engineering: An Enabling Technology Designed to Clean and Protect Printed Circuit Boards." International Symposium on Microelectronics 2020, no. 1 (September 1, 2020): 000197–200. http://dx.doi.org/10.4071/2380-4505-2020.1.000197.
Son, Ha Huu, Nguyen Phi Long, Nguyen Van Thanh, Nguyen Thi Hong Ngoc, Dang Minh Thuy, Le Quoc Pham, and Luu Van Tuynh. "Polyalphaolefin Oil/MgO-20 Nanofluids Coating Shows Corrosion Resistance, High Moisture Resistance, and Water Resistance for Electrical and Electronic Equipment." Coatings 13, no. 9 (September 10, 2023): 1576. http://dx.doi.org/10.3390/coatings13091576.
Xu, Jin Qiu, Jian Feng Bai, Jing Wei Wang, Bo Liang, He Cheng, Jie Guan, and Li Jun Wang. "Microbial Leaching of Copper from Waste Electronic Scraps." Advanced Materials Research 508 (April 2012): 228–32. http://dx.doi.org/10.4028/www.scientific.net/amr.508.228.
Li, Wei Wei, Li Xin Mo, Ji Lan Fu, Wen Bo Li, Jun Ran, Xin Ming Fan, Ya Ling Li, and Lu Hai Li. "Preparation of Water-Based Nano-Silver Gravure Conductive Ink Used for Printed Electronics." Applied Mechanics and Materials 262 (December 2012): 523–26. http://dx.doi.org/10.4028/www.scientific.net/amm.262.523.
Xu, Pingye, and Michael C. Hamilton. "Reduced-Loss Ink-Jet Printed Flexible CPW With Copper Coating." IEEE Microwave and Wireless Components Letters 23, no. 4 (April 2013): 178–80. http://dx.doi.org/10.1109/lmwc.2013.2248704.
Carlos, Emanuel, Rita Branquinho, Elina Jansson, Jaakko Leppäniemi, José Menezes, Rita Pereira, Jonas Deuermeier, et al. "Printed zinc tin oxide diodes: from combustion synthesis to large-scale manufacturing." Flexible and Printed Electronics 7, no. 1 (January 31, 2022): 014005. http://dx.doi.org/10.1088/2058-8585/ac4bb1.
Ibrahim Zamkoye, Issoufou, Houda El Gbouri, Remi Antony, Bernard Ratier, Johann Bouclé, Laurent Galmiche, Thierry Trigaud, and Pierre Audebert. "Characterization and Electronic Properties of Heptazine Layers: Towards Promising Interfacial Materials for Organic Optoelectronics." Materials 13, no. 17 (August 29, 2020): 3826. http://dx.doi.org/10.3390/ma13173826.
Yang, Tong, Xinyu Li, Bo Yu, and Cheng Gong. "Design and Print Terahertz Metamaterials Based on Electrohydrodynamic Jet." Micromachines 14, no. 3 (March 15, 2023): 659. http://dx.doi.org/10.3390/mi14030659.
Aziz, Shahid, Junaid Ali, Krishna Singh Bhandari, Wenning Chen, Sijia Li, and Dong Won Jung. "Reverse Offset Printed, Biocompatible Temperature Sensor Based on Dark Muscovado." Sensors 22, no. 22 (November 11, 2022): 8726. http://dx.doi.org/10.3390/s22228726.
Yoo, Young-Ran, Seokyeon Won, and Young-Sik Kim. "Effect of Conformal Coating on Electrochemical Migration Behavior of Multi-Layer Ceramic Capacitor for Automotives Based on Water Drop Test." Coatings 14, no. 3 (March 18, 2024): 359. http://dx.doi.org/10.3390/coatings14030359.
Diatezo, Léopold, Minh-Quyen Le, Christine Tonellato, Lluis Puig, Jean-Fabien Capsal, and Pierre-Jean Cottinet. "Development and Optimization of 3D-Printed Flexible Electronic Coatings: A New Generation of Smart Heating Fabrics for Automobile Applications." Micromachines 14, no. 4 (March 29, 2023): 762. http://dx.doi.org/10.3390/mi14040762.
Baek, Inwoo, Chul-Min Lim, Kyoung Youl Park, and Bong Ki Ryu. "Enhanced Metal Coating Adhesion by Surface Modification of 3D Printed PEKKs." Coatings 12, no. 6 (June 17, 2022): 854. http://dx.doi.org/10.3390/coatings12060854.
Jo, Minho, Seongyong Kim, Gyoujin Cho, Taik-Min Lee, Jongsu Lee, and Changwoo Lee. "Achieving specified geometric quality in a fully printed flexible functional layer using process parameters in roll-to-roll printed electronics." Flexible and Printed Electronics 7, no. 1 (February 14, 2022): 014007. http://dx.doi.org/10.1088/2058-8585/ac509a.
Yang, Xiaofan, Huang Li, Haiyang Lin, Yicong Chen, and Rongjie Ji. "Effect of Substrate Pretreatment Process on the Cutting Performance of Diamond-Coated PCB Micro-Milling Tools." Micromachines 14, no. 1 (December 27, 2022): 73. http://dx.doi.org/10.3390/mi14010073.
Dill, Simone, and Volker Rößiger. "Coating thickness measurement of thin gold and palladium coatings on printed circuit boards using X‐ray fluorescence." Circuit World 37, no. 2 (May 17, 2011): 20–26. http://dx.doi.org/10.1108/03056121111128288.
Nguyen, Van-Cuong, Minh-Quyen Le, Jean-François Mogniotte, Jean-Fabien Capsal, and Pierre-Jean Cottinet. "Extrusion-Based 3D Printing of Stretchable Electronic Coating for Condition Monitoring of Suction Cups." Micromachines 13, no. 10 (September 27, 2022): 1606. http://dx.doi.org/10.3390/mi13101606.
Gholampour, Nadia, Dominikus Brian, and Morteza Eslamian. "Tailoring Characteristics of PEDOT:PSS Coated on Glass and Plastics by Ultrasonic Substrate Vibration Post Treatment." Coatings 8, no. 10 (September 24, 2018): 337. http://dx.doi.org/10.3390/coatings8100337.
NAGASHIMA, Yoshiyuki, Junpei BABA, Katsuhiko SYUTOH, and Eisuke MASADA. "Surge Dielectric Strength between Printed Circuit Board Conductive Foils with Solder Resist Coating." Journal of Japan Institute of Electronics Packaging 5, no. 6 (2002): 609–12. http://dx.doi.org/10.5104/jiep.5.609.
Sloma, Marcin, Daniel Janczak, Grzegorz Wroblewski, Anna Mlozniak, and Malgorzata Jakubowska. "Electroluminescent structures printed on paper and textile elastic substrates." Circuit World 40, no. 1 (January 28, 2014): 13–16. http://dx.doi.org/10.1108/cw-10-2013-0037.
Nguyen, Van-Cuong, Minh-Quyen Le, Sophie Bernadet, Yoann Hebrard, Jean-François Mogniotte, Jean-Fabien Capsal, and Pierre-Jean Cottinet. "Design Rules of Bidirectional Smart Sensor Coating for Condition Monitoring of Bearings." Polymers 15, no. 4 (February 7, 2023): 826. http://dx.doi.org/10.3390/polym15040826.
Scholz, Bernd, Ismir Pekmic, Syed Sajid Ahmad, and Aaron Reinholz. "High via density thin metal-core PCB using electro-coated dielectric." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000615–21. http://dx.doi.org/10.4071/isom-2010-wp3-paper2.
Gogoi, Banashree, Carson Gockley, Sushmitha Venu, Yizhen Zhu, Pranith Alluri, Ayinawu Abdul Malik, Mitesh Suhas Despande, et al. "Ultrafast and Large-Scale Fabrication of PEDOT:PSS Nanofilms Using Electrical-Field-Assisted Direct Ink Deposition." Molecules 28, no. 16 (August 10, 2023): 5989. http://dx.doi.org/10.3390/molecules28165989.
Couble, E. C., O. B. Dutkewych, S. M. Florio, M. V. Marsh, and R. F. Staniunas. "Immersion, Non‐electrolytic Tin/lead Plating Process." Circuit World 19, no. 1 (April 1, 1992): 63–70. http://dx.doi.org/10.1108/eb046192.
Wassmer, Marcel, Waldemar Diel, and Klaus Krueger. "Inkjet Printing of Fine-Line Thick-Film Inductors." Journal of Microelectronics and Electronic Packaging 7, no. 4 (October 1, 2010): 205–13. http://dx.doi.org/10.4071/imaps.258.
Huang, Yunzhong, Chao Yang, Xiang Tan, Zhenhai Zhang, Shouxu Wang, Jiacong Hu, Wei He, et al. "Benzaldehyde derivatives on tin electroplating as corrosion resistance for fabricating copper circuit." Nanotechnology Reviews 11, no. 1 (January 1, 2022): 3125–37. http://dx.doi.org/10.1515/ntrev-2022-0497.
Nguyen, Van-Cuong, Victor Oliva-Torres, Sophie Bernadet, Guilhem Rival, Claude Richard, Jean-Fabien Capsal, Pierre-Jean Cottinet, and Minh-Quyen Le. "Haptic Feedback Device Using 3D-Printed Flexible, Multilayered Piezoelectric Coating for In-Car Touchscreen Interface." Micromachines 14, no. 8 (August 2, 2023): 1553. http://dx.doi.org/10.3390/mi14081553.
Mo, Lixin, Jun Ran, Li Yang, Yi Fang, Qingbin Zhai, and Luhai Li. "Flexible transparent conductive films combining flexographic printed silver grids with CNT coating." Nanotechnology 27, no. 6 (January 13, 2016): 065202. http://dx.doi.org/10.1088/0957-4484/27/6/065202.
Son, Yeonho, Dongho Shin, Minkyu Kang, and Caroline Sunyong Lee. "Coating 1-Octanethiol-Coated Copper Nano-Ink on a Paper Substrate via Multi-Pulse Flash Light Sintering for Application in Disposable Devices." Electronic Materials 1, no. 1 (September 23, 2020): 28–39. http://dx.doi.org/10.3390/electronicmat1010004.
Alam, Maksudul M., Bidyut Biswas, Alexi K. Nedeltchev, Haesook Han, Asanga D. Ranasinghe, Pradip K. Bhowmik, and Kisholoy Goswami. "Phosphine Oxide Containing Poly(pyridinium salt)s as Fire Retardant Materials." Polymers 11, no. 7 (July 3, 2019): 1141. http://dx.doi.org/10.3390/polym11071141.
Dean, Robert N., Michael C. Hamilton, and Michael E. Baginski. "Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology." Journal of Microelectronics and Electronic Packaging 11, no. 3 (July 1, 2014): 122–27. http://dx.doi.org/10.4071/imaps.415.
Janek, Florian, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt, and André Zimmermann. "Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist." Micromachines 12, no. 8 (July 21, 2021): 856. http://dx.doi.org/10.3390/mi12080856.
Petko, Joshua S., Philip A. Lovell, Jeremy D. Clifton, Alexander J. Bersani, and Karl F. Schoch. "RF Test Article Experiment on the Impact of Non-Hexavalent Chromium-Based Conversion Coatings on Electrical Assemblies." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000712–17. http://dx.doi.org/10.4071/2380-4505-2018.1.000712.
Walter, Piotr, Andrzej Pepłowski, Łukasz Górski, Daniel Janczak, and Małgorzata Jakubowska. "Disposable, acetylcholinesterase-coated, screen-printed carbon electrodes for the determination of organophosphorus pesticides." Microelectronics International 36, no. 3 (July 1, 2019): 120–26. http://dx.doi.org/10.1108/mi-12-2018-0084.
Mei, Zequn, and Helen Holder. "A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints." Journal of Electronic Packaging 118, no. 2 (June 1, 1996): 62–66. http://dx.doi.org/10.1115/1.2792133.
Bing Hong, Gui, Yi Hua Luo, Kai Jen Chuang, and Chih Ming Ma. "Preparing and Applying Silver Nanoparticles in Conductive Ink and Inkjet Painting." Journal of Nanoscience and Nanotechnology 21, no. 12 (December 1, 2021): 5979–86. http://dx.doi.org/10.1166/jnn.2021.19518.
Yang, Lilin, Dongzhi Wang, Guoxiang Zhou, Zhidan Lan, and Zhihua Yang. "Glass-Ceramic Coating on Silver Electrode Surface via 3D Printing." Materials 16, no. 8 (April 21, 2023): 3276. http://dx.doi.org/10.3390/ma16083276.
Lyons, Karen Swider, and Benjamin D. Gould. "Lightweight Titanium Metal Bipolar Plates for PEM Fuel Cells." Materials Science Forum 879 (November 2016): 613–18. http://dx.doi.org/10.4028/www.scientific.net/msf.879.613.