Journal articles on the topic 'Power Electronics Reliability'
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Iannuzzo, Francesco, and Mauro Ciappa. "Reliability issues in power electronics." Microelectronics Reliability 58 (March 2016): 1–2. http://dx.doi.org/10.1016/j.microrel.2016.01.012.
Full textWhite, Robert V. "Advancing Power Electronics Reliability [White Hot]." IEEE Power Electronics Magazine 8, no. 2 (June 2021): 100–99. http://dx.doi.org/10.1109/mpel.2021.3075786.
Full textScheuermann, U. "Reliability challenges of automotive power electronics." Microelectronics Reliability 49, no. 9-11 (September 2009): 1319–25. http://dx.doi.org/10.1016/j.microrel.2009.06.045.
Full textPires, Igor Amariz, Rafael Atila Silva, Anderson Vagner Rocha, Matheus Pereira Porto, Thales Alexandre Carvalho Maia, and Braz de Jesus Cardoso Filho. "Oil Immersed Power Electronics and Reliability Enhancement." IEEE Transactions on Industry Applications 55, no. 4 (July 2019): 4407–16. http://dx.doi.org/10.1109/tia.2019.2915276.
Full textLu, Hua, Chris Bailey, and Chunyan Yin. "Design for reliability of power electronics modules." Microelectronics Reliability 49, no. 9-11 (September 2009): 1250–55. http://dx.doi.org/10.1016/j.microrel.2009.07.055.
Full textJiao, Chaoqun, Juan Zhang, Zhibin Zhao, Zuoming Zhang, and Yuanliang Fan. "Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices." Sensors 19, no. 19 (September 26, 2019): 4176. http://dx.doi.org/10.3390/s19194176.
Full textZeng, Jia Si, Yi Bo Gao, Feng Yang, Xi Dong Xu, Peng Qiu, Yi Lu, and Xiao Ming Huang. "Reliability Evaluation of Mid-Voltage DC Distribution Network with Multiple Topologies." Applied Mechanics and Materials 666 (October 2014): 112–18. http://dx.doi.org/10.4028/www.scientific.net/amm.666.112.
Full textZacharias, Peter. "Design and Applications of Controllable Magnetic Devices in Power Electronic Circuits and Power Systems." Journal of Electronics and Advanced Electrical Engineering 1, no. 2 (May 3, 2021): 6–14. http://dx.doi.org/10.47890/jeaee/2020/peterzacharias/11120007.
Full textHozoji, Hiroshi, Fumiki Kato, So Tanaka, Jiro Shinkai, and Hiroshi Sato. "Power Electronics Packaging Materials for High Heat Reliability." Journal of The Japan Institute of Electronics Packaging 24, no. 3 (May 1, 2021): 233–40. http://dx.doi.org/10.5104/jiep.24.233.
Full textGurav, Abhijit, John Bultitude, John McConnell, and Reggie Phillips. "Robust Reliability of Ceramic Capacitors for Power Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2018, HiTEC (May 1, 2018): 000138–42. http://dx.doi.org/10.4071/2380-4491-2018-hiten-000138.
Full textMestha, Soumya Rani, and Pinto Pius A.J. "Investigation of reliability assessement in power electronics circuits using machine learning." International Journal of Power Electronics and Drive Systems (IJPEDS) 12, no. 1 (March 1, 2021): 558. http://dx.doi.org/10.11591/ijpeds.v12.i1.pp558-566.
Full textBrewer, Roger. "High Reliability Electronics for Demanding Aircraft Applications – An Overview." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2016, HiTEC (January 1, 2016): 000011–17. http://dx.doi.org/10.4071/2016-hitec-11.
Full textCalleja, Hugo, and Freddy Chan. "Reliability: A Neglected Topic in the Power Electronics Curricula." Journal of Power Electronics 10, no. 6 (November 20, 2010): 660–66. http://dx.doi.org/10.6113/jpe.2010.10.6.660.
Full textDababneh, Amer B., Ben Goerdt, Timothy Marler, and Ibrahim T. Ozbolat. "A Virtual Prognostic Tool for Nuclear Power Electronics Reliability." Computer-Aided Design and Applications 11, no. 2 (October 30, 2013): 228–38. http://dx.doi.org/10.1080/16864360.2014.846097.
Full textPersons, Ryan, and Paul Gundel. "Print Copper on Ceramic for High Reliability Electronics." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000330–35. http://dx.doi.org/10.4071/isom-2015-wp12.
Full textBlaabjerg, Frede, and Michael M. Pecht. "Special Issue on Robust Design and Reliability of Power Electronics, IEEE Transactions on Power Electronics, May 2015." IEEE Transactions on Power Electronics 30, no. 5 (May 2015): 2373–74. http://dx.doi.org/10.1109/tpel.2014.2376271.
Full textOKABE, Nagatoshi, Mitsuyoshi TSUTSUMI, and Xia ZHU. "Testing Method and Reliability Design of Reliability Estimation in Mounting Power Electronics Semiconductor." Proceedings of the 1992 Annual Meeting of JSME/MMD 2002 (2002): 253–54. http://dx.doi.org/10.1299/jsmezairiki.2002.0_253.
Full textDrobnik, Joe, and Praveen Jain. "Electric and Hybrid Vehicle Power Electronics Efficiency, Testing and Reliability." World Electric Vehicle Journal 6, no. 3 (September 27, 2013): 719–30. http://dx.doi.org/10.3390/wevj6030719.
Full textKhazaka, R., L. Mendizabal, D. Henry, and R. Hanna. "Survey of High-Temperature Reliability of Power Electronics Packaging Components." IEEE Transactions on Power Electronics 30, no. 5 (May 2015): 2456–64. http://dx.doi.org/10.1109/tpel.2014.2357836.
Full textTeixeira, Tiago M. L., and Juan Bevan. "Product Development of High Power Electronics for High Reliability Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, HiTEN (July 1, 2017): 000213–17. http://dx.doi.org/10.4071/2380-4491.2017.hiten.213.
Full textBayerer, Reinhold. "Advanced packaging yields higher performance and reliability in power electronics." Microelectronics Reliability 50, no. 9-11 (September 2010): 1715–19. http://dx.doi.org/10.1016/j.microrel.2010.07.016.
Full textIshizaki, T., A. Kuno, A. Tane, M. Yanase, F. Osawa, T. Satoh, and Y. Yamada. "Reliability of Cu nanoparticle joint for high temperature power electronics." Microelectronics Reliability 54, no. 9-10 (September 2014): 1867–71. http://dx.doi.org/10.1016/j.microrel.2014.07.113.
Full textArifujjaman, Md, M. T. Iqbal, and J. E. Quaicoe. "Reliability analysis of grid connected small wind turbine power electronics." Applied Energy 86, no. 9 (September 2009): 1617–23. http://dx.doi.org/10.1016/j.apenergy.2009.01.009.
Full textPang, Y., E. Scott, J. D. van Wyk, and Z. Liang. "Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module." Journal of Electronic Packaging 129, no. 1 (April 16, 2006): 1–8. http://dx.doi.org/10.1115/1.2429703.
Full textNovak, M., A. Sangwongwanich, and F. Blaabjerg. "Monte Carlo-Based Reliability Estimation Methods for Power Devices in Power Electronics Systems." IEEE Open Journal of Power Electronics 2 (2021): 523–34. http://dx.doi.org/10.1109/ojpel.2021.3116070.
Full textWassick, Thomas A. "Electromigration in Lead – Free Solder: A Power IC Perspective." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000753–57. http://dx.doi.org/10.4071/isom-2013-wp61.
Full textPaul, Arun Kumar. "Experimental exploration of functional integrity, functional reliability and reliability of modern power electronics equipments." International Journal of Power Electronics 3, no. 4 (2011): 374. http://dx.doi.org/10.1504/ijpelec.2011.040803.
Full textTan, Yangyang, Jun Liu, Sichang Xu, Peng Zhong, Qi Zhang, and Lin Hu. "Operational reliability evaluation of PV inverter considering relative humidity and its application on power system." E3S Web of Conferences 185 (2020): 01050. http://dx.doi.org/10.1051/e3sconf/202018501050.
Full textChow, T. Paul. "SiC Bipolar Power Devices." MRS Bulletin 30, no. 4 (April 2005): 299–304. http://dx.doi.org/10.1557/mrs2005.77.
Full textFan, Guangyu, Christine Labarbera, Ning-Cheng Lee, and Colin Clark. "Shear Strength and Thermomechanical Reliability of Sintered Ag Joints Containing low CTE Non-metal Additives for Die Attach." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000167–72. http://dx.doi.org/10.4071/2380-4505-2018.1.000167.
Full textKaessner, Stefan, Markus G. Scheibel, Stefan Behrendt, Bianca Boettge, Christoph Berthold, and Klaus G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." Journal of Microelectronics and Electronic Packaging 15, no. 3 (July 1, 2018): 132–39. http://dx.doi.org/10.4071/imaps.661015.
Full textKaessner, S., M. G. Scheibel, S. Behrendt, B. Boettge, and K. G. Nickel. "Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000425–33. http://dx.doi.org/10.4071/2380-4505-2018.1.000425.
Full textYang, Yongheng, Ariya Sangwongwanich, and Frede Blaabjerg. "Design for Reliability of Power Electronics for Grid-Connected Photovoltaic Systems." CPSS Transactions on Power Electronics and Applications 1, no. 1 (December 28, 2016): 92–103. http://dx.doi.org/10.24295/cpsstpea.2016.00009.
Full textHansen, Sandra, Frederik Hahn, Helge Krueger, Felix Hoffmann, Markus Andresen, Rainer Rainer Adelung, and Marco Liserre. "Reliability of Silicon Battery Technology and Power Electronics Based Energy Conversion." IEEE Power Electronics Magazine 8, no. 2 (June 2021): 60–69. http://dx.doi.org/10.1109/mpel.2021.3075756.
Full textFlicker, Jack, Govindasamy Tamizhmani, Mathan Kumar Moorthy, Ramanathan Thiagarajan, and Raja Ayyanar. "Accelerated Testing of Module-Level Power Electronics for Long-Term Reliability." IEEE Journal of Photovoltaics 7, no. 1 (January 2017): 259–67. http://dx.doi.org/10.1109/jphotov.2016.2621339.
Full textBahman, A. S., F. Iannuzzo, T. Holmgaard, R. Ø. Nielsen, and F. Blaabjerg. "Reliability-oriented environmental thermal stress analysis of fuses in power electronics." Microelectronics Reliability 76-77 (September 2017): 25–30. http://dx.doi.org/10.1016/j.microrel.2017.06.089.
Full textSawan, Mohamad, B. Gosselin, J. Coulombe, A. E. Ayoub, A. Chaudhuri, and F. Leporé. "Implantable Electronics for the Recovery of Neuromuscular Functions." Advances in Science and Technology 57 (September 2008): 204–9. http://dx.doi.org/10.4028/www.scientific.net/ast.57.204.
Full textShohji, Ikuo. "Large area bonding for power devices by pillar-like IMC effective dispersion control." Impact 2020, no. 1 (February 27, 2020): 76–78. http://dx.doi.org/10.21820/23987073.2020.1.76.
Full textYuan, Cadmus, René Kregting, Willem van Driel, Sander Gielen, An Xiao, and G. Q. (Kouchi) Zhang. "Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000418–29. http://dx.doi.org/10.4071/isom-2011-tp6-paper4.
Full textPalmer, David W. "Test Structures as a Way to Evaluate Packaging Reliability." MRS Bulletin 18, no. 12 (December 1993): 55–58. http://dx.doi.org/10.1557/s0883769400039105.
Full textSHENAI, KRISHNA. "THE PERFECT POWER SEMICONDUCTOR SWITCH FOR 21st CENTURY GLOBAL ENERGY ECONOMY." Journal of Circuits, Systems and Computers 22, no. 10 (December 2013): 1340020. http://dx.doi.org/10.1142/s0218126613400203.
Full textFlicker, Jack, Jay Johnson, Peter Hacke, and Ramanathan Thiagarajan. "Automating Component-Level Stress Measurements for Inverter Reliability Estimation." Energies 15, no. 13 (July 1, 2022): 4828. http://dx.doi.org/10.3390/en15134828.
Full textTripathi, Rajesh, Sejin Im, Douglas Devoto, Joshua Major, Sreekant Narumanchi, Paul Paret, and Xuhui Feng. "Power electronics thermal solutions using thermally conductive polyimide films." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, DPC (January 1, 2019): 000616–46. http://dx.doi.org/10.4071/2380-4491-2019-dpc-presentation_tp3_042.
Full textDu, Xiao, Xiong Du, Jun Zhang, and Gaoxian Li. "Numerical junction temperature calculation method for reliability evaluation of power semiconductors in power electronics converters." Journal of Power Electronics 21, no. 1 (September 23, 2020): 184–94. http://dx.doi.org/10.1007/s43236-020-00154-z.
Full textShashidhar, Nagaraja, and Abhijit Rao. "Low thermal resistance packaging for high power electronics." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000131–38. http://dx.doi.org/10.4071/2380-4505-2019.1.000131.
Full textWiewiora, Lee. "Microelectronics/Packagingin the Defense Industry:Importance of SWaP-Cand Other Factors." International Symposium on Microelectronics 2015, S1 (October 1, 2015): S1—S11. http://dx.doi.org/10.4071/isom-2015-slide-1.
Full textFaqir, M., J. W. Pomeroy, T. Batten, T. Mrotzek, S. Knippscheer, O. Vendier, S. Rochette, et al. "Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite." Journal of Microelectronics and Electronic Packaging 10, no. 2 (April 1, 2013): 54–58. http://dx.doi.org/10.4071/imaps.371.
Full textWang, Huai, Marco Liserre, Frede Blaabjerg, Peter de Place Rimmen, John B. Jacobsen, Thorkild Kvisgaard, and Jorn Landkildehus. "Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics." IEEE Journal of Emerging and Selected Topics in Power Electronics 2, no. 1 (March 2014): 97–114. http://dx.doi.org/10.1109/jestpe.2013.2290282.
Full textArifujjaman, Md, M. T. Iqbal, and J. E. Quaicoe. "Power Electronics Reliability Comparison of Grid Connected Small Wind Energy Conversion Systems." Wind Engineering 35, no. 1 (February 2011): 93–110. http://dx.doi.org/10.1260/0309-524x.35.1.93.
Full textSzcześniak, Paweł, Iwona Grobelna, Mateja Novak, and Ulrik Nyman. "Overview of Control Algorithm Verification Methods in Power Electronics Systems." Energies 14, no. 14 (July 19, 2021): 4360. http://dx.doi.org/10.3390/en14144360.
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