Relevant bibliographies by topics / Polyimides

Academic literature on the topic 'Polyimides'

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Published: 4 June 2021
Last updated: 1 August 2024

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Journal articles on the topic "Polyimides"

1

Yamada, Yasuharu. "Siloxane Modified Polyimides for Microelectronics Coating Applications." High Performance Polymers 10, no. 1 (March 1998): 69–80. http://dx.doi.org/10.1088/0954-0083/10/1/009.

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Two types of siloxane modified polyimide were prepared as coating materials for microelectronics applications and their thermal, mechanical, electrical, adhesive and coating properties were characterized. The coatings prepared were classified as polysiloxane block (type A) polyimides and disiloxane modified (type B) polyimides. All of the polyimides showed excellent thermal, mechanical, electrical, adhesive and coating properties suitable for use in microelectronics coating applications. The type A polyimides have lower dielectric constants and good stress relaxation capability as compared with typical aromatic polyimides. The type B polyimides have excellent adhesive properties to silicon wafers. The polyimide prepared from 2, 2-bis[4-aminophenoxyphenyl]hexafluoropropane exhibited the lowest dielectric constant due to the presence of trifluoromethyl groups in the polymer backbone. Model encapsulated semiconductor devices coated with various polyimides were assembled, and the interface adherence between the polyimide and the encapsulant along with the reliability of the semiconductor devices were examined. Superior interface adherence between the polyimide passivant and the encapsulant was exhibited, resulting in improved reliability of integrated circuit chips. With the incorporation of siloxane moieties into the polyimide backbone these siloxane modified polyimides were shown to be good candidate materials for microelectronics coatings.
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Xiao, T. J., S. Q. Gao, A. J. Hu, X. C. Wang, and S. Y. Yang. "Thermosetting Polyimides with Improved Impact Toughness and Excellent Thermal and Thermo-Oxidative Stability." High Performance Polymers 13, no. 4 (December 2001): 287–99. http://dx.doi.org/10.1088/0954-0083/13/4/307.

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Thermoset polyimides were prepared by thermally curing B-staged endcapped polyimide resins that were obtained by thermally baking PMR polyimide matrix resins. The polyimide matrix resins were prepared by incorporating flexible ether-bridged aromatic segments [–Ar–O–Ar–] into PMR polyimide backbone to improve their processability and impact toughness. Experimental results indicated that the B-staged polyimide resins possessed adjustable and easily controllable thermal processability which ensure that thermoset polyimides are produced with improved impact strength and high glass transition temperature compared with PMR-15. Thermal and thermo-oxidative stability as well as hygrothermal resistance of the thermoset polyimides were also systemically investigated.
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Tsuda, Yusuke, Yuki Matsuda, and Takaaki Matsuda. "Soluble Polyimides Bearing Long-Chain Alkyl Groups on Their Side ChainviaPolymer Reaction." International Journal of Polymer Science 2012 (2012): 1–10. http://dx.doi.org/10.1155/2012/972541.

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Novel soluble polyimides having long-chain alkyl groups on their side chain were synthesizedviapolymer reaction with the polyimides having phenolic OH groups and 3,4,5-tris(dodecyloxy)benzoic acid (12GA) using N,N′-dicyclohexylcarbodiimide (DCC) as a dehydration reagent. The polyimides having phenolic OH groups were synthesized from the tetracarboxylic dianhydrides such as 5-(2,5-dioxotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride (cyclohexene-DA), 4,4′-hexafluoroisopropylidendi(phthalic anhydride) (6FDA), and 3,3′,4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA) and aromatic diamines such as 4,4′-diamino-3,3′-dihydroxybiphenyl (HAB). The polymer reactions were carried out in NMP and the progresses of polymer reactions were quantitatively monitored by1H NMR measurements (conversion; 12.2–98.7%). The obtained polyimides bearing long-chain alkyl groups have enough molecular weights, good film-forming ability, good solubility for various organic solvents, and enough thermal stability. The water contact angles of the polyimide films were investigated, and it is noted that the introduction of long-chain alkyl groups increases the hydrophobicity of polyimide surface. These polyimides are expected to be applicable as the functional materials for microelectronics such as the alignment layers of LCDs.
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Chao, Min. "Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages." International Journal of Polymer Science 2018 (August 7, 2018): 1–7. http://dx.doi.org/10.1155/2018/8590567.

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A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique. The results indicated that the glass transition temperature (Tg) of polyimides was affected by flexibility of polymer chain and the intermolecular interactions. ODPA-TPER-based polyimide possesses the lowest Tg, which was 214°C. All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature (Tm) at 316°C. The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.
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Wang, Kun Li, Jian Wei Lee, I. Hao Shih, Yi Liang Liu, and En Tang Kang. "Resistive Polymer Memory Materials Containing Electron Donor and Acceptor Moieties." Advanced Materials Research 488-489 (March 2012): 3–7. http://dx.doi.org/10.4028/www.scientific.net/amr.488-489.3.

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Two series of polymers including polyimides and poly(aryl ether)s were prepared and used as active layers of polymer memories. The poly(aryl ether)-based polymers showed flash behaviors and polyimide-based polymers showed WORM behaviors. The poly(aryl ether)s flash memories can be negatively switched on and positively switched off, and the switching voltages are relative to the chemical structure of bisphenol moiety. On the other hand, the polyimide-based polymer devices can be bidirectionally switched on with comparable positive and negative switching threshold voltages, but cannot be switched off. The polyimides showed write-once-and-read- many-times (WORM) memory behavior. The poly(aryl ether) (AZTA-PAEb) showed very different memory behavior from polyimides (AZTA-PI and AZTA-PEI) although they contain the similar chemical structure (electron-donor triphenylamine and electron-acceptor triazine moieties). The imide structure in the polyimides plays a great role in the memory effects.
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Rosolovsky, J., R. K. Boggess, A. F. Rubira, L. T. Taylor, D. M. Stoakley, and A. K. St. Clair. "Supercritical fluid infusion of silver into polyimide films of varying chemical composition." Journal of Materials Research 12, no. 11 (November 1997): 3127–33. http://dx.doi.org/10.1557/jmr.1997.0408.

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Polyimides can be infused with silver complexes by the use of supercritical fluids. Highly reflective polyimide films were formed by infusing (1,5-cyclooctadiene-1,1,1,5,5,5-hexafluoroacetylacetonato)silver(I) [Ag(COD) (HFA)] into a number of polyimides and then thermally curing those films at 300 °C for time intervals between 30 min and 3 h. Reflectivities of the films exhibited strong dependence on the infusion and cure conditions as well as on the type of polyimide used. The highest reflectivity of 67.1% was achieved with a silvered film prepared from 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (BTDA) and oxydianiline (ODA) infused at 5000 psi, 100 °C, for 30 min and cured for 1 h at 300 °C. Reflectivities of silvered surfaces of other polyimides investigated varied from 39% to 61%. A strong correlation between the presence of a ketonic group in the polyimide structure and the formation of mirror surfaces was detected.
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Chen, Ying, Rumin Huang, Qiuyu Zhang, Wanlu Sun, and Xiaobo Liu. "Synthesis and properties of highly soluble branched polyimide based on 2,4,6-triaminopyrimidine." High Performance Polymers 29, no. 1 (July 28, 2016): 68–76. http://dx.doi.org/10.1177/0954008315627854.

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A series of novel soluble polyimides was synthesized from commercially available 2,4,6-triaminopyrimidine (TAP), 2,2-bis(3,4-dicarboxylphenyl) hexafluoropropane dianhydride (6FDA), α,ω-aminopropylpoly(dimethylsiloxane) and 1,3-bis(3-aminophenoxy)benzene. TAP is the branched monomer, and polymerization process had been improved in three ways by using TAP to prepare soluble polyimides. The polyimides were characterized by Fourier transform infrared spectra, proton nuclear magnetic resonance, ultraviolet–visible spectrometer analysis, wide-angle X-ray diffraction, and size-exclusion chromatography with multiangle laser light-scattering detection. The branched polyimides showed excellent solubility both in strong polar solvents and in common low-boiling point solvents. Differential scanning calorimetric and thermogravimetric analyses showed high glass transition temperatures and excellent thermal stability for branched polyimides with moderate content of TAP. Polyimide membranes were formed at relatively low temperature, and the mechanical properties were tested. These results ensure that soluble polyimides with moderate content of TAP showed outstanding combined features and are desirable candidate materials for advanced applications.
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Ji, Xiaodong, Jingling Yan, Xiuju Liu, Zikun Wang, and Zhen Wang. "Synthesis and properties of polyimides derived from bis(4-aminophenyl)isohexides." High Performance Polymers 29, no. 2 (July 28, 2016): 197–204. http://dx.doi.org/10.1177/0954008316634443.

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Several partially bio-based polyimides have been successfully synthesized by polycondensation between bis(4-aminophenyl)isohexides with various commercial dianhydrides. Flexible and free-standing films were readily obtained from their poly(amic acid) or polyimide solutions. A systematic investigation of the structure–property relationship of polyimides highlights the significant impact of the isohexides moieties on their physical and mechanical properties (glass transition temperature, inherent viscosity, thermal stability, solubility, and mechanical properties). The results revealed that these polyimides exhibited comparable thermal stability and mechanical properties to those of petrochemical-based ones.
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Jung, Cheolsoo, Tetsuya Aoyama, Tatsuo Wada, Hiroyuki Sasabe, Mitsutoshi Jikei, and Masa-Aki Kakimoto. "The Photorefractive Effect in Monolithic Structural Polyimides." High Performance Polymers 12, no. 1 (March 2000): 205–12. http://dx.doi.org/10.1088/0954-0083/12/1/317.

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We report here the photorefractive effect in monolithic structural polyimides containing the triphenylamino-( p-nitrophenyl)-ethylene group as a nonlinear optical (NLO) chromophore and hole transfer. Three types of polyimides were synthesized to control the loading ratio of the NLO chromophore; 50, 30 and 17 mol% for polyimides 1, 2 and 3 respectively. In the two-beam coupling experiment, asymmetric energy transfer was observed in the case of polyimides 1 and 2, providing evidence for a phaseshifted grating after corona-poling treatment, whereas the energy transfer of polyimide 3 was not observed. This result denotes that the NLO chromophore plays an important role in monolithic photorefractive materials, and a greater than 30 mol% concentration of NLO chromophore is required for creating sufficient space charge distribution.
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Hsiao, Sheng-Huei, and Kai-Han Lin. "Synthesis and properties of electroactive aromatic polyimides with methyl- or trifluoromethyl-protecting triphenylamine units." High Performance Polymers 29, no. 5 (June 16, 2016): 544–55. http://dx.doi.org/10.1177/0954008316653456.

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Two series of new redox-active aromatic polyimides with methyl- (–CH3) or trifluoromethyl (–CF3)-protecting triphenylamine moieties were prepared from 4,4′-diamino-4″-methyltriphenylamine and 4,4′-diamino-4″-(trifluoromethyl)triphenylamine with aromatic tetracarboxylic dianhydrides via the conventional two-step polycondensation technique. Flexible and strong polyimide films could be obtained via the thermal curing of their precursor poly(amic acid) films or direct solution cast from some organosoluble polyimides. The polyimides showed high glass-transition temperatures between 269°C and 312°C, and they did not show significant decomposition before 500°C in air or under nitrogen atmosphere. Cyclic voltammograms of the polyimide films on the indium–tin oxide-coated glass substrate exhibited a pair of reversible redox waves with half-wave oxidation potentials of 1.08–1.10 V (for the –CH3 series) and 1.23–1.26 V (vs. silver/silver chloride; for the –CF3 series) in acetonitrile solution. The polyimide films showed anodic electrochromism from pale yellow neutral state to purplish blue (for the –CH3 series) and chrome yellow (for the –CF3 series) when oxidized.
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Dissertations / Theses on the topic "Polyimides"

1

Qi, Yu Carleton University Dissertation Chemistry. "Synthesis and characterization of polyimides with novel structures /." Ottawa, 1997.

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Brink, M. Heather. "The synthesis and characterization of semicrystalline polyimides." Diss., This resource online, 1994. http://scholar.lib.vt.edu/theses/available/etd-06062008-164714/.

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Quenneson, Marie-Eve. "Synthèse et caractérisation de films polyimides pour applications diélectriques." Lyon 1, 1986. http://www.theses.fr/1986LYO19044.

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Synthese de polybenzhydrolimides par polycondensation en solution de l'acide benzhydrol tetracarboxylique avec la methyle dianiline et l'oxydianiline; caracterisation des polymeres par gpc et diffusion de lumiere; fabrication et traitement thermique de films; trandition vitreuse par atd et analyse thermomecanique; tenue en temperature par thermogravimetrie; proprietes dielectriques
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Marasco, Jean-Paul. "Contribution à l'étude de nouveaux précurseurs de polyimides." Lyon 1, 1995. http://www.theses.fr/1995LYO10254.

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L'instabilite des polyamides acides en solution est engendree par l'equilibre de la reaction de polycondensation entre un dianhydride et une diamine qui peut provoquer une chute des proprietes rheologiques des solutions par hydrolyse des fonctions anhydrides terminales ou simple redistribution des masses moleculaires. Cet equilibre est supprime si l'on remplace les groupes acides par des derives esters ou amides, lesquels sont obtenus soit par modification de la structure macromoleculaire, soit par l'utilisation de monomeres actives. Deux voies de synthese relativement douces ont pu se degager pour la preparation de ces nouveaux precurseurs: l'ouverture d'un diisoimide active par une diamine ; la reaction entre un diimidazolide diamide ou diester et une diamine. La premiere voie aboutit a des chaines polyamides aromatiques contenant des fonctions paranitranilides en ortho de chaque fonction amide. Il resulte de cette structure particuliere, une competition lors de la cyclisation en polyimide qui peut provoquer une chute de la masse moleculaire mais que l'on peut orienter favorablement. La deuxieme voie permet de preparer des polyamides esters et des polyamides amides disubstitues ou le probleme de la selectivite a la cyclisation est supprime. Ce type d'approche permet en outre de mettre en uvre des precurseurs de polyimides a enchainements para a partir de monomeres enrichis. L'utilisation de tels systemes peut s'averer efficace dans la mise en uvre de polyimides rigides. Dans les deux cas les solutions obtenues sont stables et ne subissent pas la moindre variation de viscosite au cours du temps
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Cano, Camilo I. "Polyimide Microstructures From Powdered Precursors: Phenomenological and Parametric Studies on Particle Inflation." Akron, OH : University of Akron, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=akron1123710711.

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Dissertation (Ph.D.)--University of Akron, Dept. of Polymer Engineering, 2005.
"August, 2005." Title from electronic dissertation title page (viewed 09/24/2005) Includes bibliographical references.
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Meyer, Gerald W. "Novel high performance thermosetting polyimides." Diss., This resource online, 1995. http://scholar.lib.vt.edu/theses/available/etd-05222007-091420/.

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Dunson, Debra Lynn. "Synthesis and Characterization of Thermosetting Polyimide Oligomers for Microelectronics Packaging." Diss., Virginia Tech, 2000. http://hdl.handle.net/10919/27394.

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A series of reactive phenylethynyl endcapped imide oligomers has been prepared in either fully cyclized or amic acid precursor form. Soluble oligomers have been synthesized with controlled molecular weights ranging from 2- to 12 Kg/mol. Molecular weight characterization was performed using SEC (size exclusion chromatography) and 13C-NMR, revealing good agreement between the theoretical and experimental (Mn) values. Crosslinked polyimides were obtained by solution or melt processing the oligomers into films and gradually heating in a programmed temperature manner up to the appropriate reaction temperature for the phenylethynyl groups, which is approximately 350-400°C. Thermal analysis of the resulting films showed high glass transition temperatures (>300°C) and excellent thermal stability, comparable to those found for thermoplastic control polyimides. The crosslinked films also had exceptional solvent resistance as evidenced by a high gel fraction (greater than or equal to 95%) following extraction in common solvents for several days. This was in contrast to the amorphous thermoplastic controls, which quickly dissolved upon immersion in solvents. The monomers used for synthesizing the polyimide oligomers were varied systematically within the series to study the influence of both molecular structure and molecular weight on the physical and film-forming properties. The incorporation of fluorinated monomers, such as 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), reduced water absorption and lowered the dielectric constant relative to non-fluorinated polyimides in the series. When flexible ether linkages were incorporated in the repeat unit by using 4,4'-oxydianiline (ODA), relatively more ductile solvent-cast films were obtained from oligomers having Mn values as low as 10 Kg/mol. Additionally, oligomer Mn and the relative rigidity/symmetry of the repeat unit structure greatly influenced the solubility of polyimides in NMP. For example, even 6FDA/p-phenylenediamine based oligomers with Mn values targeted below 10 Kg/mol precipitated from NMP at 180°C during solution imidization. The relationship between solution viscosities of polyimide and poly(amic acid) thermosetting oligomers and wetting/spreading ability to form continuous films during spin casting was elucidated. Employing o-dimethoxybenzene (DMB) as a cosolvent with NMP improved the film-forming ability of the fully imidized 6FDA/ODA oligomer series. This was evidenced by a decrease in viscosity (via suppression of physical-type gel formation) and better overall coverage and clarity of the films. Humidity was found to have a detrimental effect, causing the polyimide oligomers to phase separate to form cloudy or porous films. When moisture was reduced, oligomers having Mn greater than or equal to 6 Kg/mol formed spin cast films of <20 micrometer thickness with good qualitative adhesion to several inorganic substrates. Dielectric constants (epsilon) were estimated for several of the polyimides by measuring the refractive indices (n) of the films and using Maxwell's relationship (epsilon at optical frequencies is equal to n raised to the second power). The apparent dielectric constants were low, ranging from 2.47 to 2.75. The novel combination of low dielectric constant, solvent resistance and isotropic physical properties inherent in the thermosetting polyimide oligomers makes these materials excellent candidates for use as thin film insulating layers in microelectronics packaging applications.
Ph. D.
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Zhuang, Hong. "Synthesis and Characterization of Aryl Phosphine Oxide Containing Thermoplastic Polyimides and Thermosetting Polyimides with Controlled Reactivity." Diss., Virginia Tech, 1998. http://hdl.handle.net/10919/30692.

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Phosphorus containing monomers, bis(3-aminophenyl)methyl phosphine oxide (m-DAMPO) and bis(3-aminophenyl)phenyl phosphine oxide (m-DAPPO), were synthesized and incorporated into a thermoplastic poly(arylene ether imide) based upon 2,2'-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride and 1,3-phenylene diamine, in order to study their influence on flame resistance and other properties. DAMPO or DAPPO were quantitatively incorporated in concentrations of 25, 50, 75 and 100 mole percent, using the "one pot" ester-acid method. The number average molecular weights of the prepared materials were controlled to 20,000g/mol by off-setting the stoichiomety and endcapping with phthalic anhydride. This strategy enabled one to distinguish the effects of the phosphine oxide incoporation from the influence of molecular weight. The resulting copolymers demonstrated a significant increase in char yield as a function of the phosphine oxide content, thus suggesting improved fire resistance. Glass transition temperatures similar to the control were determined by DSC analysis. Analysis of the mechanical behavior of the DAMPO system at room temperature showed that tensile strength and elongation at failure values were comparable to the control system, while the DAPPO containing copolymers were surprisingly brittle. The influence of the reactive endgroup on the synthesis, cure behavior and network properties of thermosetting polyetherimides was investigated. Reactive phenylacetylene, acetylene and maleimide terminated poly(ether imide) oligomers were prepared and characterized. Optimal reaction conditions were established to produce fully endcapped oligomers with imidized structures and controlled molecular weight. The phenylacetylene endcapped system was synthesized by a conventional ester-acid method. The acetylene endcapped system was prepared via modified ester-acid method and the maleimide endcapped system was fabricated utilizing an amic-acid route. It was determined that phenylethynyl endcapped polymers could be thermally cured at high temperatures (350-380°C) providing good processibility. The networks exhibited thermal stability, chemical resistance and good adhesion strength, ideal as "primary" bonding adhesives. Acetylene and maleimide endcapped systems were prepared for application as "secondary" bonding materials, meaning that they are cured at a lower temperature than that of the Tg of the primary structure. Lap shear test results indicated good adhesion to titanium when cured at 250°C -280°C. The cured materials showed high glass transition temperatures and good thermal and thermo-oxidative stability as determined by DSC, TGA and DMA. Good chemical resistance was demonstrated via solvent extraction measurements. The influence of molecular weight between crosslinks (Mc) on thermal and mechanical behavior was also investigated. Lower molecular weight oligomers exhibited lower Tg and cure temperatures, whereas the cured networks resulting from lower molecular weight oligomers afforded higher Tg and higher gel fractions, but reduced toughness.
Ph. D.
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9

Dong, Zhenzhen. "Synthesis of two-dimensional scaffolds and metallofoldamers." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 255 p, 2008. http://proquest.umi.com/pqdweb?did=1459908101&sid=13&Fmt=2&clientId=8331&RQT=309&VName=PQD.

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Billon, Laurent. "Matrices organiques à haute stabilité thermique et résistance à l'oxydation." Pau, 1996. http://www.theses.fr/1996PAUU3037.

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L'objectif de cette étude est l'amélioration de la thermostabilité dans une gamme de température supérieure à 250c, de polyimides thermodurcissables thermostables synthétisés à partir de nouveaux monomères, tout en tenant compte du procédé de mise en oeuvre. A cette fin, notre travail a consisté en l'étude de la réactivité de deux systèmes binaires en milieu méthanolique, mono ester de l'anhydride nadique ne/diamine et hexafluoro diméthyl ester HFDE/diamine. Une réactivité supérieure du composé Ne a été mise en evidence, entraînant la formation de bisnadimide Ne - diamine - Ne. L'étude structurale et thermique de ces composés montre une isomérisation endo/exo des fonctions nadimide à l'état solide ainsi qu'une grande stabilité thermique, qui nous obligent à revoir les cycles thermiques de polymérisation. La synthèse de polyimides téléchéliques nadimide, maleimide et styrenique, ainsi que leur caractérisation microstructurale, physicochimique et thermomécanique montrent la très grande complexité de ces oligomères (produits secondaires, polymolécularité, isomérisation endo/exo des fonctions nadimide, transition vitreuse et sous vitreuse). Les résultats obtenus ont été discutés dans le cadre des relations structure/propriétés des polyimides téléchéliques. L'étude des prépolymères fonctionnalises nadimide a montré l'influence de l'isomérisation endo/exo sur la transition vitreuse. Ces résultats jouent un rôle important lors de la réticulation de ces systèmes car la temperature finale du cycle de polymérisation depend de la valeur de la température de transition vitreuse.
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Books on the topic "Polyimides"

1

Bessonov, M. I., M. M. Koton, V. V. Kudryavtsev, and L. A. Laius. Polyimides. Boston, MA: Springer US, 1987. http://dx.doi.org/10.1007/978-1-4615-7634-1.

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Wilson, Doug, Horst D. Stenzenberger, and Paul M. Hergenrother, eds. Polyimides. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4.

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D, Wilson, Stenzenberger H. D, and Hergenrother P. M, eds. Polyimides. Glasgow: Blackie, 1990.

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United States. National Aeronautics and Space Administration., ed. Condensation polyimides. [Washington, D.C.?: National Aeronautics and Space Administration, 1989.

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Gerber, Margaret K. Isomeric oxydiphthalic anhydride polyimides. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1989.

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K, St Clair Anne, and Langley Research Center, eds. Optically transparent/colorless polyimides. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1985.

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K, St Clair Anne, and Langley Research Center, eds. Optically transparent/colorless polyimides. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1985.

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I, Bessonov M., and Wright W. W. 1928-, eds. Polyimides--thermally stable polymers. New York: Consultants Bureau, 1987.

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1941-, Horie Kazuyuki, and Yamashita Takashi, eds. Photosensitive polyimides: Fundamentals and applications. Lancaster, Penn: Technomic Pub. Co., 1995.

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F, Gratz Roy, and United States. National Aeronautics and Space Administration., eds. Thermo-oxidatively stable condensation polyimides containing 1,1,1-triaryl-2,2,2-trifluoroethane dianhydride and diamine monomers. [Washington, DC]: National Aeronautics and Space Administration, 1987.

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Book chapters on the topic "Polyimides"

1

Harris, F. W. "Synthesis of aromatic polyimides from dianhydrides and diamines." In Polyimides, 1–37. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_1.

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Takekoshi, T. "Other synthetic routes to polyimides." In Polyimides, 38–57. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_2.

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Clair, T. L. St. "Structure-property relationships in linear aromatic polyimides." In Polyimides, 58–78. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_3.

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Stenzenberger, H. "Chemistry and properties of addition polyimides." In Polyimides, 79–128. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_4.

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Young, P. R., and R. Escott. "Characterisation of polyimides." In Polyimides, 129–57. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_5.

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Hergenrother, P. M. "Polyimides as adhesives." In Polyimides, 158–86. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_6.

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Wilson, D. "Polyimides as resin matrices for advanced composites." In Polyimides, 187–226. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_7.

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Satou, H., H. Suzuki, and D. Makino. "Polyimides for semiconductor applications." In Polyimides, 227–51. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_8.

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Sroog, C. E. "Films, Mouldings and other Applications." In Polyimides, 252–84. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-010-9661-4_9.

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Bessonov, M. I., M. M. Koton, V. V. Kudryavtsev, and L. A. Laius. "Synthesis and Chemical Structures of Polyimides." In Polyimides, 1–95. Boston, MA: Springer US, 1987. http://dx.doi.org/10.1007/978-1-4615-7634-1_1.

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Conference papers on the topic "Polyimides"

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Beuhler, Allyson J., David A. Wargowski, Kenneth D. Singer, Tony Kowalczyk, Paul A. Cahill, and Carl Seager. "Polyimide Optical Waveguides." In Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/otfa.1993.fa.1.

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Aromatic polyimides are of interest for integrated optics due to a combination of high thermal stability and easy processibility into planar structures. Polyimides can withstand chip attach and package assembly temperatures and are resistant to corrosive etchants and cleaning solvents making them compatible with a variety of substrates and metallization schemes. Waveguides from polyimide can be patterned by photobleaching1 or etching2 using standard semiconductor or printed circuit board technology and equipment. Polyimide properties are easily engineered by co-polymerization with co-diamines or dianhydrides to tailor the refractive indices or incorporate photosensitivity. Electro-optic polyimides have been demonstrated that incorporate non-linear optical chromophores by guest-host doping.3
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Matsuura, Tohru, Shinji Ando, Shinsuke Matsui, Hirooki Hirata, Shigekuni Sasaki, and Fumio Yamamoto. "Single-mode Optical Waveguides using Fluorinated Polyimides." In Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/otfa.1993.fa.3.

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Polymer optical waveguides are attractive for economical and practical optoelectronic devices and interconnections in optical communication systems.1) High thermal stability should have the first priority in optical waveguides used for these purposes so as to provide compatibility with high-performance electronic device fabrication. Sullivan2) has reported thermally-stable ridge waveguides with a loss of 0.3 dB/cm at 0.83 μm fabricated with polyimide. We have synthesized new fluorinated polyimides with high optical transparency at the optical communication wavelengths of 1.3 and 1.5 μm.3) These polyimides are also being applied to low loss and multi-mode optical waveguides. However, single-mode optical waveguides are required for telecommunication systems to allow matching with single-mode optical fibers. This paper describes the first fabrication of single-mode optical waveguides using fluorinated polyimides and an evaluation of the waveguides.
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Maruno, T., T. Sakata, T. Ishii, Y. Y. Maruo, S. Sasaki, and T. Tamamura. "Polyimide Optical Waveguides Fabricated by Direct Electron Beam Writing." In Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1995. http://dx.doi.org/10.1364/otfa.1995.ma.3.

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Polymer optical waveguides are attractive for fabricating economical and practical optoelectronic devices and interconnections in optical communication systems [1,2]. Channel waveguides, therefore, have been produced using several polymers such as poly(methyl methacrylate), polystylene, poly(organosiloxane), and polyimide [3-6]. One of the first priorities for polymer waveguides is high thermal stability so that soldering can be used in conventional device fabrication. Fluorinated polyimides are promising candidates for waveguide materials because they show high thermal stability and low optical loss near the IR wavelength region. We have previously developed novel fluorinated polyimides [7] and manufactured a single-mode optical waveguide for them by using conventional reactive ion etching (RIE) [8]. Moreover, we recently clarified that the refractive index of fluorinated polyimides can be controlled by electron beam irradiation [9], and that optical waveguides can thus be fabricated by direct electron beam writing (DEBW) [10,11]. This method is very useful because the fabrication process becomes simpler than when using RIE. In this paper, we propose a new optical waveguide fabricated by DEBW, which consists of a single material and a simple two-layer structure.
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Schab-Balcerzak, Ewa, Beate Sapich, Roland Hass, and Joachim Stumpe. "New photochromic polyimides." In Integrated Optoelectronic Devices 2005, edited by James G. Grote, Toshikuni Kaino, and Francois Kajzar. SPIE, 2005. http://dx.doi.org/10.1117/12.585015.

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Tameev, Alek R., Aleksey A. Kozlov, Eugene I. Mal'tsev, Dmitry A. Lypenko, Vladimir V. Bobonkin, and Anatoly V. Vannikov. "Charge carrier transport in aromatic polyimides and polyimide/J-aggregate composites." In International Symposium on Optical Science and Technology, edited by Zakya H. Kafafi. SPIE, 2001. http://dx.doi.org/10.1117/12.416926.

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Liu, Wen-Jen, Yi-Tsen Lai, Yin-Chieh Lai, Min-Hang Weng, and Chih-Min Chen. "Rib-type polyimides and polyimide-silica hybrid arrayed waveguide grating simulation and fabrication." In Integrated Optoelectronic Devices 2005, edited by Shibin Jiang and Michel J. Digonnet. SPIE, 2005. http://dx.doi.org/10.1117/12.590073.

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Rusu, Radu-Dan, Mariana-Dana Damaceanu, Maria Bruma, Radu Ionut Tigoianu, and Alexandru Muller. "Aromatic polyimides for optoelectronic applications." In 2008 International Semiconductor Conference. IEEE, 2008. http://dx.doi.org/10.1109/smicnd.2008.4703346.

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Rohde, O., M. Riediker, A. Schaffner, and J. Bateman. "Recent Advances In Photoimagable Polyimides." In 1985 Microlithography Conferences, edited by Larry F. Thompson. SPIE, 1985. http://dx.doi.org/10.1117/12.947831.

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Tomikawa, Masao, Takayuki Kaneki, Yu Shoji, Chika Hibino, and Hitoshi Araki. "Polyimides for Power Device Applications." In 2024 Conference of Science and Technology for Integrated Circuits (CSTIC). IEEE, 2024. http://dx.doi.org/10.1109/cstic61820.2024.10531994.

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Gierow, Paul, and William Clayton. "Inflatable concentrators utilizing NASA LARC polyimides." In Space Programs and Technologies Conference. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1995. http://dx.doi.org/10.2514/6.1995-3797.

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Reports on the topic "Polyimides"

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Hoyt, A. E., and S. J. Huang. Liquid crystalline thermosetting polyimides. Final report. Office of Scientific and Technical Information (OSTI), July 1993. http://dx.doi.org/10.2172/10142411.

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Hoyle, C. E., E. T. Anzures, and P. Subramanian. Photodegradation of Polyimides. 5. An Explanation of the Rapid Photolytic Decomposition of a Selected Polyimide via Anhydride Formation. Fort Belvoir, VA: Defense Technical Information Center, May 1991. http://dx.doi.org/10.21236/ada236247.

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Grunze, M. Properties and Adhesion of Polyimides in Microelectronic Devices. Fort Belvoir, VA: Defense Technical Information Center, May 1991. http://dx.doi.org/10.21236/ada238204.

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Tomczak, Sandra J., Timothy K. Minton, Amy L. Brunsvold, Vandana Vij, MIcheal E. Wright, Brian J. Petteys, Andrew J. Guenthner, Steven A. Svejda, and Joseph M. Mabry. Synthesis and Characterization of Space-Survivable POSS-Kapton (Trademark) Polyimides (Preprint). Fort Belvoir, VA: Defense Technical Information Center, March 2007. http://dx.doi.org/10.21236/ada467920.

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Hoyle, Charles E., D. Creed, R. Nagarajan, P. Subramanian, and Edgardo T. Anzures. Photodegradation of Polyimides. 4. Mechanism for the Photooxidation Process Based on a Model Compound. Fort Belvoir, VA: Defense Technical Information Center, May 1991. http://dx.doi.org/10.21236/ada236198.

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Lee, Andre. Durability Characterization of POSS-Based Polyimides and Carbon-Fiber Composites for Air Force-Related Applications. Fort Belvoir, VA: Defense Technical Information Center, December 2007. http://dx.doi.org/10.21236/ada481814.

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Tsai, W. H., N. G. Cave, and F. J. Boerio. Characterization of Interphases between PMDA/4-BDAF Polyimides and Silver and Graphite Substrates Using X-Ray Photoelectron Spectroscopy. Fort Belvoir, VA: Defense Technical Information Center, May 1991. http://dx.doi.org/10.21236/ada235567.

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Walton, Connie, and Sergey Sarkisov. Synthesis and Characterization of Polyimides to be Used in the Fabrication of a Low Driving Voltage Electro-Optic Modulator. Fort Belvoir, VA: Defense Technical Information Center, April 2004. http://dx.doi.org/10.21236/ada423027.

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Tsai, W. H., and F. J. Boerio. Characterization of Interphases Between PMDA/4-BDAF Polyimides and Silver Substrates Using Surface-Enhanced Raman Scattering and Reflection- Absorption Infrared Spectroscopy. Fort Belvoir, VA: Defense Technical Information Center, March 1990. http://dx.doi.org/10.21236/ada233531.

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Morgan, Roger J. Characterization of the Structure-Processing-Performance Relations of Phenylethynyl Phthalic Anhydride Crosslinked Fluorinated Polyimides (AFR-PEPA-N) and Their Carbon Fiber Composites. Fort Belvoir, VA: Defense Technical Information Center, April 2007. http://dx.doi.org/10.21236/ada468808.

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